JPWO2021002375A1 - - Google Patents

Info

Publication number
JPWO2021002375A1
JPWO2021002375A1 JP2020545825A JP2020545825A JPWO2021002375A1 JP WO2021002375 A1 JPWO2021002375 A1 JP WO2021002375A1 JP 2020545825 A JP2020545825 A JP 2020545825A JP 2020545825 A JP2020545825 A JP 2020545825A JP WO2021002375 A1 JPWO2021002375 A1 JP WO2021002375A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2020545825A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021002375A1 publication Critical patent/JPWO2021002375A1/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/871Self-supporting sealing arrangements
    • H10K59/8722Peripheral sealing arrangements, e.g. adhesives, sealants
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04Homopolymers or copolymers of esters
    • C08L33/06Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/02Details
    • H05B33/04Sealing arrangements, e.g. against humidity
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/874Passivation; Containers; Encapsulations including getter material or desiccant

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electroluminescent Light Sources (AREA)
JP2020545825A 2019-07-04 2020-07-01 Pending JPWO2021002375A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019125324 2019-07-04
PCT/JP2020/025764 WO2021002375A1 (ja) 2019-07-04 2020-07-01 有機el表示素子用封止剤

Publications (1)

Publication Number Publication Date
JPWO2021002375A1 true JPWO2021002375A1 (zh) 2021-01-07

Family

ID=74100726

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020545825A Pending JPWO2021002375A1 (zh) 2019-07-04 2020-07-01

Country Status (2)

Country Link
JP (1) JPWO2021002375A1 (zh)
WO (1) WO2021002375A1 (zh)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101426827B (zh) * 2006-04-28 2011-01-26 出光兴产株式会社 含有金刚烷基的环氧改性(甲基)丙烯酸酯以及含有该化合物的树脂组合物
DE112007001060T5 (de) * 2006-05-01 2009-03-12 Idemitsu Kosan Co., Ltd. Einkapselndes Material für optische Halbleiter
KR20100095516A (ko) * 2007-11-13 2010-08-31 이데미쓰 고산 가부시키가이샤 아다만탄 유도체, 그 제조 방법 및 아다만탄 유도체를 함유하는 경화성 조성물
TWI626281B (zh) * 2015-03-24 2018-06-11 Lg化學股份有限公司 黏合組成物
JP6527053B2 (ja) * 2015-08-28 2019-06-05 富士フイルム株式会社 ガスバリアフィルムおよびガスバリアフィルムの転写方法
JP7012424B2 (ja) * 2016-03-25 2022-02-14 東京応化工業株式会社 エネルギー感受性組成物、硬化物及び硬化物の製造方法
JP2018104699A (ja) * 2016-12-26 2018-07-05 三菱ケミカル株式会社 封止用重合性組成物及び該封止用重合性組成物の重合物を搭載した有機光デバイス
JP6294522B1 (ja) * 2017-02-14 2018-03-14 積水化学工業株式会社 有機el表示素子用封止剤、及び、有機el表示素子
WO2018181664A1 (ja) * 2017-03-31 2018-10-04 味の素株式会社 封止用の組成物

Also Published As

Publication number Publication date
WO2021002375A1 (ja) 2021-01-07

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