JPWO2020250373A1 - - Google Patents

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Publication number
JPWO2020250373A1
JPWO2020250373A1 JP2021525501A JP2021525501A JPWO2020250373A1 JP WO2020250373 A1 JPWO2020250373 A1 JP WO2020250373A1 JP 2021525501 A JP2021525501 A JP 2021525501A JP 2021525501 A JP2021525501 A JP 2021525501A JP WO2020250373 A1 JPWO2020250373 A1 JP WO2020250373A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021525501A
Other versions
JP7162134B2 (ja
JPWO2020250373A5 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2020250373A1 publication Critical patent/JPWO2020250373A1/ja
Publication of JPWO2020250373A5 publication Critical patent/JPWO2020250373A5/ja
Priority to JP2022165935A priority Critical patent/JP7427744B2/ja
Application granted granted Critical
Publication of JP7162134B2 publication Critical patent/JP7162134B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N20/00—Machine learning
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T9/00—Image coding
    • G06T9/005—Statistical coding, e.g. Huffman, run length coding
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10056—Microscopic image
    • G06T2207/10061—Microscopic image from scanning electron microscope
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20081—Training; Learning
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20084—Artificial neural networks [ANN]
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Software Systems (AREA)
  • Quality & Reliability (AREA)
  • Medical Informatics (AREA)
  • Mathematical Physics (AREA)
  • Evolutionary Computation (AREA)
  • Artificial Intelligence (AREA)
  • Multimedia (AREA)
  • Computing Systems (AREA)
  • General Engineering & Computer Science (AREA)
  • Data Mining & Analysis (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Image Analysis (AREA)
  • Image Processing (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Processing Or Creating Images (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Closed-Circuit Television Systems (AREA)
JP2021525501A 2019-06-13 2019-06-13 画像処理プログラム、画像処理装置および画像処理方法 Active JP7162134B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2022165935A JP7427744B2 (ja) 2019-06-13 2022-10-17 画像処理プログラム、画像処理装置、画像処理方法および欠陥検出システム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/023447 WO2020250373A1 (ja) 2019-06-13 2019-06-13 画像処理プログラム、画像処理装置および画像処理方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2022165935A Division JP7427744B2 (ja) 2019-06-13 2022-10-17 画像処理プログラム、画像処理装置、画像処理方法および欠陥検出システム

Publications (3)

Publication Number Publication Date
JPWO2020250373A1 true JPWO2020250373A1 (ja) 2020-12-17
JPWO2020250373A5 JPWO2020250373A5 (ja) 2022-03-30
JP7162134B2 JP7162134B2 (ja) 2022-10-27

Family

ID=73781712

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2021525501A Active JP7162134B2 (ja) 2019-06-13 2019-06-13 画像処理プログラム、画像処理装置および画像処理方法
JP2022165935A Active JP7427744B2 (ja) 2019-06-13 2022-10-17 画像処理プログラム、画像処理装置、画像処理方法および欠陥検出システム

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2022165935A Active JP7427744B2 (ja) 2019-06-13 2022-10-17 画像処理プログラム、画像処理装置、画像処理方法および欠陥検出システム

Country Status (6)

Country Link
US (1) US20220318975A1 (ja)
JP (2) JP7162134B2 (ja)
KR (1) KR20220002572A (ja)
CN (1) CN113994368A (ja)
TW (3) TW202418220A (ja)
WO (1) WO2020250373A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11854184B2 (en) * 2021-01-14 2023-12-26 Applied Materials Israel Ltd. Determination of defects and/or edge roughness in a specimen based on a reference image
JPWO2023127081A1 (ja) * 2021-12-28 2023-07-06
JP2023181587A (ja) 2022-06-13 2023-12-25 株式会社日立ハイテク 欠陥検査装置
CN115454560A (zh) * 2022-10-18 2022-12-09 上海鼎捷移动科技有限公司 界面布局系统以及界面布局方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010151655A (ja) * 2008-12-25 2010-07-08 Hitachi High-Technologies Corp 欠陥検査方法及びその装置
US20170148226A1 (en) * 2015-11-19 2017-05-25 Kla-Tencor Corporation Generating simulated images from design information

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101342203B1 (ko) * 2010-01-05 2013-12-16 가부시키가이샤 히다치 하이테크놀로지즈 Ｓｅｍ을 이용한 결함 검사 방법 및 장치
JP5622398B2 (ja) * 2010-01-05 2014-11-12 株式会社日立ハイテクノロジーズ Ｓｅｍを用いた欠陥検査方法及び装置
US10181185B2 (en) * 2016-01-11 2019-01-15 Kla-Tencor Corp. Image based specimen process control
US11443083B2 (en) * 2016-05-12 2022-09-13 Asml Netherlands B.V. Identification of hot spots or defects by machine learning
US11802763B2 (en) * 2016-09-01 2023-10-31 Hitachi High-Tech Corporation Pattern measurement device and computer program
JP6759034B2 (ja) * 2016-09-29 2020-09-23 株式会社日立ハイテク パターン評価装置及びコンピュータープログラム
US10809635B2 (en) * 2017-11-20 2020-10-20 Taiwan Semiconductor Manufacturing Company, Ltd. Defect inspection method and defect inspection system
US10713769B2 (en) * 2018-06-05 2020-07-14 Kla-Tencor Corp. Active learning for defect classifier training

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010151655A (ja) * 2008-12-25 2010-07-08 Hitachi High-Technologies Corp 欠陥検査方法及びその装置
US20170148226A1 (en) * 2015-11-19 2017-05-25 Kla-Tencor Corporation Generating simulated images from design information

Also Published As

Publication number Publication date
JP2023002652A (ja) 2023-01-10
JP7162134B2 (ja) 2022-10-27
TW202333106A (zh) 2023-08-16
KR20220002572A (ko) 2022-01-06
CN113994368A (zh) 2022-01-28
WO2020250373A1 (ja) 2020-12-17
US20220318975A1 (en) 2022-10-06
JP7427744B2 (ja) 2024-02-05
TWI813871B (zh) 2023-09-01
TW202046246A (zh) 2020-12-16
TW202418220A (zh) 2024-05-01

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