JPWO2020241899A1 - - Google Patents

Info

Publication number
JPWO2020241899A1
JPWO2020241899A1 JP2021521922A JP2021521922A JPWO2020241899A1 JP WO2020241899 A1 JPWO2020241899 A1 JP WO2020241899A1 JP 2021521922 A JP2021521922 A JP 2021521922A JP 2021521922 A JP2021521922 A JP 2021521922A JP WO2020241899 A1 JPWO2020241899 A1 JP WO2020241899A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021521922A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2020241899A1 publication Critical patent/JPWO2020241899A1/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/025—Electric or magnetic properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2021521922A 2019-05-31 2020-06-01 Pending JPWO2020241899A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019103000 2019-05-31
PCT/JP2020/021568 WO2020241899A1 (ja) 2019-05-31 2020-06-01 絶縁性樹脂層付き基材、並びに、これを用いた積層体及び積層体の製造方法

Publications (1)

Publication Number Publication Date
JPWO2020241899A1 true JPWO2020241899A1 (ja) 2020-12-03

Family

ID=73553204

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021521922A Pending JPWO2020241899A1 (ja) 2019-05-31 2020-06-01

Country Status (5)

Country Link
JP (1) JPWO2020241899A1 (ja)
KR (1) KR20220016040A (ja)
CN (1) CN113891797A (ja)
TW (1) TW202110617A (ja)
WO (1) WO2020241899A1 (ja)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1222574A (en) 1982-03-04 1987-06-02 Economics Laboratory, Inc. Method and apparatus for manufacturing multi layer printed circuit boards
TW200505994A (en) * 2003-07-10 2005-02-16 Taiyo Ink Mfg Co Ltd Thermosetting resin composition for multilayer printed wiring board, thermosetting adhesive film and multilayer printed board made by using them
JP4709503B2 (ja) * 2004-05-20 2011-06-22 株式会社カネカ フィラー含有樹脂組成物およびその利用
JP2006045388A (ja) * 2004-08-05 2006-02-16 Kaneka Corp 絶縁性接着シートおよびその利用
JP2007245525A (ja) * 2006-03-16 2007-09-27 Nippon Steel Chem Co Ltd フレキシブル積層板
JP4986725B2 (ja) * 2007-06-13 2012-07-25 株式会社Ａｄｅｋａ 複合材料
JP2009007531A (ja) * 2007-06-29 2009-01-15 Kaneka Corp 樹脂／フィラー複合材料とそれを用いたプリント配線板
TW201220977A (en) * 2010-07-01 2012-05-16 Sumitomo Bakelite Co Preppreg, circuit board, and semiconductor device
EP3028851A1 (en) * 2011-09-22 2016-06-08 Hitachi Chemical Company, Ltd. Use of a laminate body, laminate board or multi-layer laminate plate for making a printed wiring board, the printed wiring board and production method for laminate plate
KR102264708B1 (ko) * 2011-09-22 2021-06-11 쇼와덴코머티리얼즈가부시끼가이샤 적층체, 적층판, 다층 적층판, 프린트 배선판 및 적층판의 제조 방법
KR102121182B1 (ko) * 2012-08-16 2020-06-10 미츠비시 가스 가가쿠 가부시키가이샤 수지 시트, 수지층이 부착된 지지체, 적층판 및 금속박 피복 적층판
JP6252658B2 (ja) 2016-11-16 2017-12-27 味の素株式会社 絶縁樹脂シート

Also Published As

Publication number Publication date
TW202110617A (zh) 2021-03-16
WO2020241899A1 (ja) 2020-12-03
CN113891797A (zh) 2022-01-04
KR20220016040A (ko) 2022-02-08

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