JPWO2020241697A1 - - Google Patents
Info
- Publication number
- JPWO2020241697A1 JPWO2020241697A1 JP2021522819A JP2021522819A JPWO2020241697A1 JP WO2020241697 A1 JPWO2020241697 A1 JP WO2020241697A1 JP 2021522819 A JP2021522819 A JP 2021522819A JP 2021522819 A JP2021522819 A JP 2021522819A JP WO2020241697 A1 JPWO2020241697 A1 JP WO2020241697A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019102590 | 2019-05-31 | ||
| PCT/JP2020/020944 WO2020241697A1 (ja) | 2019-05-31 | 2020-05-27 | 複合基板、複合基板の製造方法、回路基板の製造方法、複数の回路基板の集合体の製造方法及び複数の回路基板の製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2020241697A1 true JPWO2020241697A1 (de) | 2020-12-03 |
Family
ID=73552224
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021522819A Pending JPWO2020241697A1 (de) | 2019-05-31 | 2020-05-27 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2020241697A1 (de) |
| WO (1) | WO2020241697A1 (de) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4649027B2 (ja) * | 1999-09-28 | 2011-03-09 | 株式会社東芝 | セラミックス回路基板 |
| JP3669981B2 (ja) * | 2002-09-04 | 2005-07-13 | 電気化学工業株式会社 | モジュール構造体の製造方法 |
| JP2008211159A (ja) * | 2007-01-30 | 2008-09-11 | Kyocera Corp | 配線基板およびそれを用いた電子装置 |
| JP5383541B2 (ja) * | 2010-02-15 | 2014-01-08 | 株式会社 ケミックス | 銅張樹脂複合セラミックス板の製造方法 |
| BE1023850B1 (nl) * | 2016-06-29 | 2017-08-14 | C-Mac Electromag Bvba | Verbeterde elektronische schakeling en substraat met identificatiepatroon voor afzonderlijke elektronische schakelingen en werkwijze voor het produceren daarvan |
| JP6853455B2 (ja) * | 2017-02-23 | 2021-03-31 | 三菱マテリアル株式会社 | パワーモジュール用基板の製造方法 |
-
2020
- 2020-05-27 JP JP2021522819A patent/JPWO2020241697A1/ja active Pending
- 2020-05-27 WO PCT/JP2020/020944 patent/WO2020241697A1/ja active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| WO2020241697A1 (ja) | 2020-12-03 |
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