JPWO2020241136A1 - - Google Patents

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Publication number
JPWO2020241136A1
JPWO2020241136A1 JP2021522716A JP2021522716A JPWO2020241136A1 JP WO2020241136 A1 JPWO2020241136 A1 JP WO2020241136A1 JP 2021522716 A JP2021522716 A JP 2021522716A JP 2021522716 A JP2021522716 A JP 2021522716A JP WO2020241136 A1 JPWO2020241136 A1 JP WO2020241136A1
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2021522716A
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Japanese (ja)
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JP7382552B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Publication of JPWO2020241136A1 publication Critical patent/JPWO2020241136A1/ja
Application granted granted Critical
Publication of JP7382552B2 publication Critical patent/JP7382552B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/384—Removing material by boring or cutting by boring of specially shaped holes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/035—Aligning the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0626—Energy control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/21—Bonding by welding
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0875—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more refracting elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0927—Systems for changing the beam intensity distribution, e.g. Gaussian to top-hat
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0938—Using specific optical elements
    • G02B27/095—Refractive optical elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/35—Optical coupling means having switching means
    • G02B6/351—Optical coupling means having switching means involving stationary waveguides with moving interposed optical elements
    • G02B6/3524—Optical coupling means having switching means involving stationary waveguides with moving interposed optical elements the optical element being refractive
    • G02B6/3528—Optical coupling means having switching means involving stationary waveguides with moving interposed optical elements the optical element being refractive the optical element being a prism
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4206—Optical features
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/005—Optical devices external to the laser cavity, specially adapted for lasers, e.g. for homogenisation of the beam or for manipulating laser pulses, e.g. pulse shaping
    • H01S3/0071—Beam steering, e.g. whereby a mirror outside the cavity is present to change the beam direction

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Laser Beam Processing (AREA)
JP2021522716A 2019-05-29 2020-04-24 レーザ加工装置及びそれを用いたレーザ加工方法 Active JP7382552B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019100181 2019-05-29
JP2019100181 2019-05-29
PCT/JP2020/017618 WO2020241136A1 (ja) 2019-05-29 2020-04-24 レーザ加工装置及びそれを用いたレーザ加工方法

Publications (2)

Publication Number Publication Date
JPWO2020241136A1 true JPWO2020241136A1 (https=) 2020-12-03
JP7382552B2 JP7382552B2 (ja) 2023-11-17

Family

ID=73554049

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021522716A Active JP7382552B2 (ja) 2019-05-29 2020-04-24 レーザ加工装置及びそれを用いたレーザ加工方法

Country Status (4)

Country Link
US (1) US12263540B2 (https=)
EP (1) EP3978181A4 (https=)
JP (1) JP7382552B2 (https=)
WO (1) WO2020241136A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7382552B2 (ja) * 2019-05-29 2023-11-17 パナソニックＩｐマネジメント株式会社 レーザ加工装置及びそれを用いたレーザ加工方法
DE102021115036A1 (de) 2021-06-10 2022-12-15 Precitec Gmbh & Co. Kg Verfahren zur Laserbearbeitung eines Werkstücks und dazugehöriges Laserbearbeitungssystem
CN117047134A (zh) * 2023-08-25 2023-11-14 贵阳职业技术学院 一种用于消除激光增材制造合金内部孔洞的方法及装置

Citations (11)

* Cited by examiner, † Cited by third party
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JPS58159814A (ja) * 1982-03-18 1983-09-22 Mitsubishi Acetate Co Ltd 吸着処理法
JPS5942502A (ja) * 1982-08-31 1984-03-09 Matsushita Electric Ind Co Ltd 赤外光導光路
JPS6116938Y2 (https=) * 1981-10-16 1986-05-24
JPS6384786A (ja) * 1986-09-26 1988-04-15 Toshiba Corp レ−ザマ−キング装置
JPH08150485A (ja) * 1994-11-28 1996-06-11 Komatsu Ltd レーザマーキング装置
JP2777138B2 (ja) * 1988-03-16 1998-07-16 株式会社ニデック 医用レーザ装置３
JP2002224867A (ja) * 2001-02-01 2002-08-13 National Institute For Materials Science レーザ溶接方法
JP2003001464A (ja) * 2001-06-22 2003-01-08 Nippei Toyama Corp レーザ加工装置及びレーザ加工方法
JP2011253866A (ja) * 2010-06-01 2011-12-15 Disco Abrasive Syst Ltd 分割方法
US20150293306A1 (en) * 2010-04-08 2015-10-15 Trumpf Laser- Und Systemtechnik Gmbh Method and Arrangement for the Generation of a Laser Beam With Different Beam Profile Characteristics by Means of a Multi-Clad Fibre
WO2018012379A1 (ja) * 2016-07-14 2018-01-18 三菱電機株式会社 レーザ加工装置

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US5245682A (en) * 1992-09-25 1993-09-14 General Electric Company Fiber optic delivered beam quality control system for power lasers
JPH07301724A (ja) 1994-05-09 1995-11-14 Nippon Sheet Glass Co Ltd 入射位置調整機構付き光ビーム入射装置
JPH10314973A (ja) 1997-03-12 1998-12-02 Kawasaki Heavy Ind Ltd 複合レーザビームによるレーザ加工装置および加工法
JP3726676B2 (ja) * 2000-11-28 2005-12-14 日本電気株式会社 外部共振器型モード同期半導体レーザ装置
US6900410B2 (en) * 2001-02-01 2005-05-31 National Institute For Materials Science Laser welding processed
GB2377664A (en) * 2001-06-22 2003-01-22 Nippei Toyama Corp Laser beam machining apparatus and laser beam machining method
FI122404B (fi) * 2009-04-15 2011-12-30 Outokumpu Oy Menetelmä laserhitsauksen suorittamiseksi
US9128259B2 (en) * 2013-08-16 2015-09-08 Coherent, Inc. Fiber-coupled laser with adjustable beam-parameter-product
JP5931141B2 (ja) * 2014-08-26 2016-06-08 ファナック株式会社 ファイバコアを切り替え可能なレーザ加工装置
US10906129B2 (en) * 2015-05-26 2021-02-02 Ipg Photonics Corporation Multibeam laser system and methods for welding
CN108780189B (zh) * 2016-04-06 2021-11-19 特拉迪欧德公司 用于改变激光束轮廓的光纤结构和方法
US10195689B2 (en) * 2016-07-11 2019-02-05 GM Global Technology Operations LLC Laser welding of overlapping metal workpieces assisted by varying laser beam parameters
US10224691B2 (en) * 2016-12-02 2019-03-05 TeraDiode, Inc. Laser systems utilizing fiber bundles for power delivery and beam switching
PL3553575T3 (pl) * 2016-12-12 2022-05-30 Panasonic Intellectual Property Management Co., Ltd. Urządzenie sprzęgające światłowody
JP7382552B2 (ja) * 2019-05-29 2023-11-17 パナソニックＩｐマネジメント株式会社 レーザ加工装置及びそれを用いたレーザ加工方法
EP3978183B1 (en) * 2019-05-29 2024-03-06 Panasonic Intellectual Property Management Co., Ltd. Laser machining device and laser machining method using same
JP7382553B2 (ja) * 2019-05-29 2023-11-17 パナソニックＩｐマネジメント株式会社 レーザ加工装置及びそれを用いたレーザ加工方法

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6116938Y2 (https=) * 1981-10-16 1986-05-24
JPS58159814A (ja) * 1982-03-18 1983-09-22 Mitsubishi Acetate Co Ltd 吸着処理法
JPS5942502A (ja) * 1982-08-31 1984-03-09 Matsushita Electric Ind Co Ltd 赤外光導光路
JPS6384786A (ja) * 1986-09-26 1988-04-15 Toshiba Corp レ−ザマ−キング装置
JP2777138B2 (ja) * 1988-03-16 1998-07-16 株式会社ニデック 医用レーザ装置３
JPH08150485A (ja) * 1994-11-28 1996-06-11 Komatsu Ltd レーザマーキング装置
JP2002224867A (ja) * 2001-02-01 2002-08-13 National Institute For Materials Science レーザ溶接方法
JP2003001464A (ja) * 2001-06-22 2003-01-08 Nippei Toyama Corp レーザ加工装置及びレーザ加工方法
US20150293306A1 (en) * 2010-04-08 2015-10-15 Trumpf Laser- Und Systemtechnik Gmbh Method and Arrangement for the Generation of a Laser Beam With Different Beam Profile Characteristics by Means of a Multi-Clad Fibre
JP2011253866A (ja) * 2010-06-01 2011-12-15 Disco Abrasive Syst Ltd 分割方法
WO2018012379A1 (ja) * 2016-07-14 2018-01-18 三菱電機株式会社 レーザ加工装置

Also Published As

Publication number Publication date
EP3978181A4 (en) 2022-08-03
US12263540B2 (en) 2025-04-01
US20220072661A1 (en) 2022-03-10
EP3978181A1 (en) 2022-04-06
WO2020241136A1 (ja) 2020-12-03
JP7382552B2 (ja) 2023-11-17

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