JPWO2020218595A1 - - Google Patents

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Publication number
JPWO2020218595A1
JPWO2020218595A1 JP2021516316A JP2021516316A JPWO2020218595A1 JP WO2020218595 A1 JPWO2020218595 A1 JP WO2020218595A1 JP 2021516316 A JP2021516316 A JP 2021516316A JP 2021516316 A JP2021516316 A JP 2021516316A JP WO2020218595 A1 JPWO2020218595 A1 JP WO2020218595A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021516316A
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JP7274574B2 (ja
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Publication of JPWO2020218595A1 publication Critical patent/JPWO2020218595A1/ja
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Publication of JP7274574B2 publication Critical patent/JP7274574B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)
JP2021516316A 2019-04-25 2020-04-24 発光素子搭載用基板および発光装置 Active JP7274574B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019084248 2019-04-25
JP2019084248 2019-04-25
PCT/JP2020/017867 WO2020218595A1 (ja) 2019-04-25 2020-04-24 発光素子搭載用基板および発光装置

Publications (2)

Publication Number Publication Date
JPWO2020218595A1 true JPWO2020218595A1 (ja) 2020-10-29
JP7274574B2 JP7274574B2 (ja) 2023-05-16

Family

ID=72942641

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021516316A Active JP7274574B2 (ja) 2019-04-25 2020-04-24 発光素子搭載用基板および発光装置

Country Status (3)

Country Link
JP (1) JP7274574B2 (ja)
CN (1) CN113711349B (ja)
WO (1) WO2020218595A1 (ja)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08116127A (ja) * 1994-10-14 1996-05-07 Mitsubishi Electric Corp 半導体レーザ装置
JP2001217500A (ja) * 1999-11-25 2001-08-10 Matsushita Electric Ind Co Ltd 半導体装置及び光ピックアップ装置
JP2003188454A (ja) * 2001-12-17 2003-07-04 Ricoh Co Ltd 半導体レーザ装置および集積化光ピックアップ
JP2008028391A (ja) * 2006-07-17 2008-02-07 Agere Systems Inc マルチレーザー用途のレーザー・アセンブリ
JP2008198934A (ja) * 2007-02-15 2008-08-28 Sharp Corp 半導体レーザ装置および光ピックアップ装置
JP2014060452A (ja) * 2013-12-18 2014-04-03 Seiko Epson Corp 固体光源装置、プロジェクタ、モニタ装置
DE102015108117A1 (de) * 2015-05-22 2016-11-24 Osram Opto Semiconductors Gmbh Bauelement
WO2017183638A1 (ja) * 2016-04-18 2017-10-26 京セラ株式会社 発光素子収納用部材、アレイ部材および発光装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4132039B2 (ja) * 2003-03-24 2008-08-13 京セラ株式会社 発光素子収納用パッケージおよび発光装置
JP2017117880A (ja) 2015-12-22 2017-06-29 京セラ株式会社 光素子搭載用パッケージ、光素子搭載用母基板および電子装置
CN115274465A (zh) * 2016-06-14 2022-11-01 三菱电机株式会社 电力用半导体装置

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08116127A (ja) * 1994-10-14 1996-05-07 Mitsubishi Electric Corp 半導体レーザ装置
JP2001217500A (ja) * 1999-11-25 2001-08-10 Matsushita Electric Ind Co Ltd 半導体装置及び光ピックアップ装置
JP2003188454A (ja) * 2001-12-17 2003-07-04 Ricoh Co Ltd 半導体レーザ装置および集積化光ピックアップ
JP2008028391A (ja) * 2006-07-17 2008-02-07 Agere Systems Inc マルチレーザー用途のレーザー・アセンブリ
JP2008198934A (ja) * 2007-02-15 2008-08-28 Sharp Corp 半導体レーザ装置および光ピックアップ装置
JP2014060452A (ja) * 2013-12-18 2014-04-03 Seiko Epson Corp 固体光源装置、プロジェクタ、モニタ装置
DE102015108117A1 (de) * 2015-05-22 2016-11-24 Osram Opto Semiconductors Gmbh Bauelement
WO2017183638A1 (ja) * 2016-04-18 2017-10-26 京セラ株式会社 発光素子収納用部材、アレイ部材および発光装置

Also Published As

Publication number Publication date
WO2020218595A1 (ja) 2020-10-29
CN113711349B (zh) 2024-10-18
CN113711349A (zh) 2021-11-26
JP7274574B2 (ja) 2023-05-16

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