JPWO2020217395A1 - - Google Patents
Info
- Publication number
- JPWO2020217395A1 JPWO2020217395A1 JP2021515416A JP2021515416A JPWO2020217395A1 JP WO2020217395 A1 JPWO2020217395 A1 JP WO2020217395A1 JP 2021515416 A JP2021515416 A JP 2021515416A JP 2021515416 A JP2021515416 A JP 2021515416A JP WO2020217395 A1 JPWO2020217395 A1 JP WO2020217395A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0657—Stacked arrangements of devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2023096869A JP2023115060A (ja) | 2019-04-25 | 2023-06-13 | ドルメン構造を有する半導体装置及びその製造方法、支持片の製造方法、並びに、支持片形成用積層フィルム |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2019/017689 WO2020217395A1 (ja) | 2019-04-25 | 2019-04-25 | ドルメン構造を有する半導体装置及びその製造方法、支持片の製造方法、並びに、支持片形成用積層フィルム |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023096869A Division JP2023115060A (ja) | 2019-04-25 | 2023-06-13 | ドルメン構造を有する半導体装置及びその製造方法、支持片の製造方法、並びに、支持片形成用積層フィルム |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2020217395A1 true JPWO2020217395A1 (ja) | 2020-10-29 |
JP7351335B2 JP7351335B2 (ja) | 2023-09-27 |
Family
ID=72940650
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021515416A Active JP7351335B2 (ja) | 2019-04-25 | 2019-04-25 | ドルメン構造を有する半導体装置及びその製造方法、支持片の製造方法、並びに、支持片形成用積層フィルム |
JP2023096869A Withdrawn JP2023115060A (ja) | 2019-04-25 | 2023-06-13 | ドルメン構造を有する半導体装置及びその製造方法、支持片の製造方法、並びに、支持片形成用積層フィルム |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023096869A Withdrawn JP2023115060A (ja) | 2019-04-25 | 2023-06-13 | ドルメン構造を有する半導体装置及びその製造方法、支持片の製造方法、並びに、支持片形成用積層フィルム |
Country Status (5)
Country | Link |
---|---|
JP (2) | JP7351335B2 (ja) |
KR (1) | KR20210146898A (ja) |
CN (1) | CN113632225A (ja) |
TW (1) | TW202107666A (ja) |
WO (1) | WO2020217395A1 (ja) |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002222889A (ja) * | 2001-01-24 | 2002-08-09 | Nec Kyushu Ltd | 半導体装置及びその製造方法 |
JP2003124433A (ja) * | 2001-08-27 | 2003-04-25 | Samsung Electronics Co Ltd | マルチチップパッケージ |
JP2006005333A (ja) * | 2004-05-20 | 2006-01-05 | Toshiba Corp | 積層型電子部品とその製造方法 |
US20070181990A1 (en) * | 2006-02-03 | 2007-08-09 | Siliconware Precision Industries Co., Ltd. | Stacked semiconductor structure and fabrication method thereof |
US20080029885A1 (en) * | 2006-08-07 | 2008-02-07 | Sandisk Il Ltd. | Inverted Pyramid Multi-Die Package Reducing Wire Sweep And Weakening Torques |
US7859119B1 (en) * | 2003-11-10 | 2010-12-28 | Amkor Technology, Inc. | Stacked flip chip die assembly |
JP2013131557A (ja) * | 2011-12-20 | 2013-07-04 | Toshiba Corp | 半導体装置およびその製造方法 |
US20130270717A1 (en) * | 2012-04-17 | 2013-10-17 | Samsung Electronics Co., Ltd. | Semiconductor package and method of fabricating the same |
JP2015176906A (ja) * | 2014-03-13 | 2015-10-05 | 株式会社東芝 | 半導体装置および半導体装置の製造方法 |
JP2017515306A (ja) * | 2014-04-29 | 2017-06-08 | マイクロン テクノロジー, インク. | 支持部材を有する積層半導体ダイアセンブリと、関連するシステムおよび方法 |
-
2019
- 2019-04-25 CN CN201980094030.4A patent/CN113632225A/zh active Pending
- 2019-04-25 JP JP2021515416A patent/JP7351335B2/ja active Active
- 2019-04-25 KR KR1020217029075A patent/KR20210146898A/ko not_active Application Discontinuation
- 2019-04-25 WO PCT/JP2019/017689 patent/WO2020217395A1/ja active Application Filing
-
2020
- 2020-04-17 TW TW109113059A patent/TW202107666A/zh unknown
-
2023
- 2023-06-13 JP JP2023096869A patent/JP2023115060A/ja not_active Withdrawn
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002222889A (ja) * | 2001-01-24 | 2002-08-09 | Nec Kyushu Ltd | 半導体装置及びその製造方法 |
JP2003124433A (ja) * | 2001-08-27 | 2003-04-25 | Samsung Electronics Co Ltd | マルチチップパッケージ |
US7859119B1 (en) * | 2003-11-10 | 2010-12-28 | Amkor Technology, Inc. | Stacked flip chip die assembly |
JP2006005333A (ja) * | 2004-05-20 | 2006-01-05 | Toshiba Corp | 積層型電子部品とその製造方法 |
US20070181990A1 (en) * | 2006-02-03 | 2007-08-09 | Siliconware Precision Industries Co., Ltd. | Stacked semiconductor structure and fabrication method thereof |
US20080029885A1 (en) * | 2006-08-07 | 2008-02-07 | Sandisk Il Ltd. | Inverted Pyramid Multi-Die Package Reducing Wire Sweep And Weakening Torques |
JP2013131557A (ja) * | 2011-12-20 | 2013-07-04 | Toshiba Corp | 半導体装置およびその製造方法 |
US20130270717A1 (en) * | 2012-04-17 | 2013-10-17 | Samsung Electronics Co., Ltd. | Semiconductor package and method of fabricating the same |
JP2015176906A (ja) * | 2014-03-13 | 2015-10-05 | 株式会社東芝 | 半導体装置および半導体装置の製造方法 |
JP2017515306A (ja) * | 2014-04-29 | 2017-06-08 | マイクロン テクノロジー, インク. | 支持部材を有する積層半導体ダイアセンブリと、関連するシステムおよび方法 |
Also Published As
Publication number | Publication date |
---|---|
CN113632225A (zh) | 2021-11-09 |
WO2020217395A1 (ja) | 2020-10-29 |
JP7351335B2 (ja) | 2023-09-27 |
TW202107666A (zh) | 2021-02-16 |
KR20210146898A (ko) | 2021-12-06 |
JP2023115060A (ja) | 2023-08-18 |
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