JPWO2020217358A1 - - Google Patents

Info

Publication number
JPWO2020217358A1
JPWO2020217358A1 JP2021515388A JP2021515388A JPWO2020217358A1 JP WO2020217358 A1 JPWO2020217358 A1 JP WO2020217358A1 JP 2021515388 A JP2021515388 A JP 2021515388A JP 2021515388 A JP2021515388 A JP 2021515388A JP WO2020217358 A1 JPWO2020217358 A1 JP WO2020217358A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021515388A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2020217358A1 publication Critical patent/JPWO2020217358A1/ja
Priority to JP2023128472A priority Critical patent/JP2023156407A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2021515388A 2019-04-24 2019-04-24 Pending JPWO2020217358A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2023128472A JP2023156407A (ja) 2019-04-24 2023-08-07 導電体充填スルーホール基板の製造方法及び導電体充填スルーホール基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/017505 WO2020217358A1 (ja) 2019-04-24 2019-04-24 導電体充填スルーホール基板の製造方法及び導電体充填スルーホール基板

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2023128472A Division JP2023156407A (ja) 2019-04-24 2023-08-07 導電体充填スルーホール基板の製造方法及び導電体充填スルーホール基板

Publications (1)

Publication Number Publication Date
JPWO2020217358A1 true JPWO2020217358A1 (ja) 2020-10-29

Family

ID=72941114

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2021515388A Pending JPWO2020217358A1 (ja) 2019-04-24 2019-04-24
JP2023128472A Pending JP2023156407A (ja) 2019-04-24 2023-08-07 導電体充填スルーホール基板の製造方法及び導電体充填スルーホール基板

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2023128472A Pending JP2023156407A (ja) 2019-04-24 2023-08-07 導電体充填スルーホール基板の製造方法及び導電体充填スルーホール基板

Country Status (2)

Country Link
JP (2) JPWO2020217358A1 (ja)
WO (1) WO2020217358A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7451455B2 (ja) * 2021-03-19 2024-03-18 株式会社東芝 半導体装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005093105A (ja) * 2003-09-12 2005-04-07 Asahi Glass Co Ltd 導電性構造体およびその製造方法
JP2010065277A (ja) * 2008-09-10 2010-03-25 Nippon Handa Kk 金属製部材接合体の製造方法および金属製部材接合体
JP2011044533A (ja) * 2009-08-20 2011-03-03 Seiko Instruments Inc 電子デバイス及びその製造方法
WO2017154593A1 (ja) * 2016-03-11 2017-09-14 日本碍子株式会社 接続基板
JP2017183715A (ja) * 2016-03-28 2017-10-05 三ツ星ベルト株式会社 貫通電極を有する両面配線基板及びその製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005093105A (ja) * 2003-09-12 2005-04-07 Asahi Glass Co Ltd 導電性構造体およびその製造方法
JP2010065277A (ja) * 2008-09-10 2010-03-25 Nippon Handa Kk 金属製部材接合体の製造方法および金属製部材接合体
JP2011044533A (ja) * 2009-08-20 2011-03-03 Seiko Instruments Inc 電子デバイス及びその製造方法
WO2017154593A1 (ja) * 2016-03-11 2017-09-14 日本碍子株式会社 接続基板
JP2017183715A (ja) * 2016-03-28 2017-10-05 三ツ星ベルト株式会社 貫通電極を有する両面配線基板及びその製造方法

Also Published As

Publication number Publication date
WO2020217358A1 (ja) 2020-10-29
JP2023156407A (ja) 2023-10-24

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