JPWO2020203437A1 - - Google Patents
Info
- Publication number
- JPWO2020203437A1 JPWO2020203437A1 JP2021511489A JP2021511489A JPWO2020203437A1 JP WO2020203437 A1 JPWO2020203437 A1 JP WO2020203437A1 JP 2021511489 A JP2021511489 A JP 2021511489A JP 2021511489 A JP2021511489 A JP 2021511489A JP WO2020203437 A1 JPWO2020203437 A1 JP WO2020203437A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Adhesive Tapes (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019068690 | 2019-03-29 | ||
PCT/JP2020/012872 WO2020203437A1 (ja) | 2019-03-29 | 2020-03-24 | 半導体加工用保護シートおよび半導体装置の製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2020203437A1 true JPWO2020203437A1 (ja) | 2020-10-08 |
Family
ID=72668861
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021511489A Pending JPWO2020203437A1 (ja) | 2019-03-29 | 2020-03-24 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPWO2020203437A1 (ja) |
KR (1) | KR20210149688A (ja) |
CN (1) | CN113453893A (ja) |
TW (1) | TW202044388A (ja) |
WO (1) | WO2020203437A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023189168A1 (ja) * | 2022-03-28 | 2023-10-05 | リンテック株式会社 | ワークの加工方法 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5117629B2 (ja) * | 1970-11-25 | 1976-06-03 | ||
JP3945565B2 (ja) * | 2001-10-26 | 2007-07-18 | リンテック株式会社 | 半導体ウエハの加工方法 |
JP4493296B2 (ja) * | 2002-07-26 | 2010-06-30 | 日東電工株式会社 | 加工用粘着シートとその製造方法 |
KR101016081B1 (ko) * | 2002-07-26 | 2011-02-17 | 닛토덴코 가부시키가이샤 | 점착 시트와 그의 제조방법, 상기 점착 시트의 사용방법,및 상기 점착 시트에 사용되는 다층 시트와 그의 제조방법 |
JP2005244206A (ja) * | 2004-01-28 | 2005-09-08 | Mitsui Chemicals Inc | 半導体ウエハの保護方法および半導体ウエハ保護用粘着フィルム |
JP4507826B2 (ja) * | 2004-10-27 | 2010-07-21 | 日東電工株式会社 | 半導体ウエハ加工用保護シート及び半導体ウエハの裏面研削方法 |
JP2007070432A (ja) * | 2005-09-06 | 2007-03-22 | Nitto Denko Corp | 粘着シート及びこの粘着シートを用いた製品の加工方法 |
JP5501060B2 (ja) * | 2009-04-02 | 2014-05-21 | 日東電工株式会社 | 半導体ウエハ保護用粘着シートの貼り合わせ方法、及びこの貼り合わせ方法に用いる半導体ウエハ保護用粘着シート |
JP5255525B2 (ja) * | 2009-06-15 | 2013-08-07 | 古河電気工業株式会社 | 半導体ウエハ加工用粘着テープおよびその製造方法 |
JP4851613B2 (ja) * | 2009-12-22 | 2012-01-11 | 古河電気工業株式会社 | 半導体ウエハ表面保護用粘着テープ |
JP5117629B1 (ja) * | 2012-06-28 | 2013-01-16 | 古河電気工業株式会社 | ウェハ加工用粘着テープ |
JP2015084352A (ja) * | 2013-10-25 | 2015-04-30 | 東レ株式会社 | 回路部材接着用積層シートおよび半導体装置の製造方法 |
TWI671193B (zh) | 2014-10-20 | 2019-09-11 | 日商琳得科股份有限公司 | 表面保護薄片用基材及表面保護薄片 |
JP6566365B2 (ja) * | 2015-01-30 | 2019-08-28 | リンテック株式会社 | 半導体加工用粘着シート |
JP7149487B2 (ja) * | 2016-03-03 | 2022-10-07 | リンテック株式会社 | 半導体加工用粘着テープ、及び半導体装置の製造方法 |
-
2020
- 2020-03-24 KR KR1020217025503A patent/KR20210149688A/ko not_active Application Discontinuation
- 2020-03-24 CN CN202080015285.XA patent/CN113453893A/zh active Pending
- 2020-03-24 WO PCT/JP2020/012872 patent/WO2020203437A1/ja active Application Filing
- 2020-03-24 JP JP2021511489A patent/JPWO2020203437A1/ja active Pending
- 2020-03-27 TW TW109110484A patent/TW202044388A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
CN113453893A (zh) | 2021-09-28 |
WO2020203437A1 (ja) | 2020-10-08 |
TW202044388A (zh) | 2020-12-01 |
KR20210149688A (ko) | 2021-12-09 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20230113 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20240319 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240517 |