JPWO2020202942A1 - セラミック基板の製造方法及びセラミック基板 - Google Patents
セラミック基板の製造方法及びセラミック基板 Download PDFInfo
- Publication number
- JPWO2020202942A1 JPWO2020202942A1 JP2021511244A JP2021511244A JPWO2020202942A1 JP WO2020202942 A1 JPWO2020202942 A1 JP WO2020202942A1 JP 2021511244 A JP2021511244 A JP 2021511244A JP 2021511244 A JP2021511244 A JP 2021511244A JP WO2020202942 A1 JPWO2020202942 A1 JP WO2020202942A1
- Authority
- JP
- Japan
- Prior art keywords
- ceramic
- ceramic substrate
- manufacturing
- ceramic green
- green sheets
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 211
- 239000000758 substrate Substances 0.000 title claims abstract description 94
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 46
- 239000000126 substance Substances 0.000 claims abstract description 61
- 238000010304 firing Methods 0.000 claims abstract description 46
- 238000000034 method Methods 0.000 claims abstract description 39
- 238000003825 pressing Methods 0.000 claims abstract description 10
- 238000010030 laminating Methods 0.000 claims description 15
- 239000000945 filler Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 description 29
- 238000010586 diagram Methods 0.000 description 10
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 7
- 238000009826 distribution Methods 0.000 description 6
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000008034 disappearance Effects 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B11/00—Apparatus or processes for treating or working the shaped or preshaped articles
- B28B11/24—Apparatus or processes for treating or working the shaped or preshaped articles for curing, setting or hardening
- B28B11/243—Setting, e.g. drying, dehydrating or firing ceramic articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B1/00—Producing shaped prefabricated articles from the material
- B28B1/002—Producing shaped prefabricated articles from the material assembled from preformed elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B18/00—Layered products essentially comprising ceramics, e.g. refractory products
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/263—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer having non-uniform thickness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/10—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on aluminium oxide
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/459—Temporary coatings or impregnations
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/53—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone involving the removal of at least part of the materials of the treated article, e.g. etching, drying of hardened concrete
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
- C04B41/81—Coating or impregnation
- C04B41/82—Coating or impregnation with organic materials
- C04B41/83—Macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
- C04B41/91—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics involving the removal of part of the materials of the treated articles, e.g. etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
- H01L23/08—Containers; Seals characterised by the material of the container or its electrical properties the material being an electrical insulator, e.g. glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2111/00—Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
- C04B2111/00474—Uses not provided for elsewhere in C04B2111/00
- C04B2111/00844—Uses not provided for elsewhere in C04B2111/00 for electronic applications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/60—Aspects relating to the preparation, properties or mechanical treatment of green bodies or pre-forms
- C04B2235/602—Making the green bodies or pre-forms by moulding
- C04B2235/6025—Tape casting, e.g. with a doctor blade
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/60—Aspects relating to the preparation, properties or mechanical treatment of green bodies or pre-forms
- C04B2235/612—Machining
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
- C04B2235/94—Products characterised by their shape
- C04B2235/945—Products containing grooves, cuts, recesses or protusions
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/32—Ceramic
- C04B2237/34—Oxidic
- C04B2237/343—Alumina or aluminates
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/56—Using constraining layers before or during sintering
- C04B2237/562—Using constraining layers before or during sintering made of alumina or aluminates
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/64—Forming laminates or joined articles comprising grooves or cuts
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/68—Forming laminates or joining articles wherein at least one substrate contains at least two different parts of macro-size, e.g. one ceramic substrate layer containing an embedded conductor or electrode
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/091—Locally and permanently deformed areas including dielectric material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Structural Engineering (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
Abstract
Description
図1は、第1実施形態のセラミック基板を有するパッケージの構成を示す平面図である。図2は、図1のII−II’断面図である。なお、図1は、パッケージ100の蓋体2を除いたセラミック基板1の平面図を示す。
図6は、変形例のセラミック基板の製造方法を説明するための説明図である。なお、以下の説明では、上述した実施形態と同じ構成要素には、同じ参照符号を付して、説明を省略する。変形例では、上述した第1実施形態とは異なり、消失物質63が、凹部形成予定領域56の全領域に設けられる構成について説明する。
図7は、第2実施形態のセラミック基板の製造方法を説明するための説明図である。第2実施形態では、上述した第1実施形態及び変形例とは異なり、消失物質63に換えて高収縮率物質64が、凹部形成予定領域56に設けられる構成について説明する。
図8は、第3実施形態のセラミック基板の製造方法を説明するための説明図である。第3実施形態では、上述した実施形態及び変形例とは異なり、マザー積層体5において、穴部61が設けられている構成を説明する。
図10は、第4実施形態のセラミック基板の製造方法を説明するための説明図である。第4実施形態では、上述した実施形態及び変形例とは異なり、マザー積層体5が収縮抑制グリーンシート52を有する構成について説明する。
2 蓋体
3 メタライズ層
5 マザー積層体
8 加圧治具
9 焼成後のマザー積層体
10 基板底部
10a 搭載面
12 壁部
12a 上面
12b 内壁面
14 台座
16 支持部
18 接合部材
20 凹部
22 接続電極
23 ビア
24、25 底面電極
51 セラミックグリーンシート
52 収縮抑制グリーンシート
53、54 分割予定ライン
55 壁部形成予定領域
56 凹部形成予定領域
58 粒界
61 穴部
63 消失物質
64 高収縮率物質
66 板状セラミック充填剤
67 樹脂材料
81 上型
82 下型
83 ベース
84 凸部
91 セラミック層
100 パッケージ
200 電子部品
A 矢印
Claims (10)
- 上面に凹部を有するセラミック基板の製造方法であって、
複数のセラミックグリーンシートを用意し、複数の前記セラミックグリーンシートのうち少なくとも1枚の前記セラミックグリーンシートの、焼成後に前記凹部が形成される凹部形成予定領域に、焼成により消失する消失物質を設け、前記消失物質が設けられた前記セラミックグリーンシートが最上層に位置するように、複数の前記セラミックグリーンシートを積層してマザー積層体を形成する工程と、
前記マザー積層体の前記凹部形成予定領域をプレス加工することで、焼成前の前記マザー積層体に前記凹部を形成する工程と、を有する
セラミック基板の製造方法。 - 請求項1に記載のセラミック基板の製造方法であって、
前記消失物質は、前記凹部形成予定領域の一部の領域に設けられる
セラミック基板の製造方法。 - 請求項1に記載のセラミック基板の製造方法であって、
前記消失物質は、前記凹部形成予定領域の全領域に設けられる
セラミック基板の製造方法。 - 上面に凹部を有するセラミック基板の製造方法であって、
複数のセラミックグリーンシートを用意し、複数の前記セラミックグリーンシートのうち少なくとも1枚の前記セラミックグリーンシートの、焼成後に前記凹部が形成される凹部形成予定領域に、前記セラミックグリーンシートよりも焼成時の収縮率が大きい高収縮率物質を設け、前記高収縮率物質が設けられた前記セラミックグリーンシートが最上層に位置するように、複数の前記セラミックグリーンシートを積層してマザー積層体を形成する工程と、
前記マザー積層体の前記凹部形成予定領域をプレス加工することで、焼成前の前記マザー積層体に前記凹部を形成する工程と、を有する
セラミック基板の製造方法。 - 請求項1から請求項4のいずれか1項に記載のセラミック基板の製造方法であって、
前記マザー積層体を形成する工程において、前記凹部形成予定領域と重ならない位置で、かつ、焼成後に個片の前記セラミック基板に分割される分割予定ラインと重なる位置に、複数の前記セラミックグリーンシートのうち少なくとも1枚以上に穴部を形成する工程を含む
セラミック基板の製造方法。 - 請求項5に記載のセラミック基板の製造方法であって、
前記凹部を形成する工程において、前記穴部は、前記セラミックグリーンシートの流動により内壁が密着して、前記分割予定ラインで前記マザー積層体は一体に形成される
セラミック基板の製造方法。 - 請求項1から請求項6のいずれか1項に記載のセラミック基板の製造方法であって、
前記マザー積層体を形成する工程において、焼成時の平面収縮率が前記セラミックグリーンシートよりも小さい収縮抑制グリーンシートを用意し、前記収縮抑制グリーンシートの上に前記セラミックグリーンシートを積層する
セラミック基板の製造方法。 - 請求項7に記載のセラミック基板の製造方法であって、
前記収縮抑制グリーンシートは、板状セラミック充填剤を含む
セラミック基板の製造方法。 - 請求項8に記載のセラミック基板の製造方法であって、
前記板状セラミック充填剤は、板状アルミナである
セラミック基板の製造方法。 - 複数のセラミック層が積層されたセラミック基板であって、
搭載面を有する基板底部と、
前記基板底部の上に設けられ、前記搭載面を囲む壁部と、を有し、
前記基板底部の前記搭載面と重なる領域において、複数の前記セラミック層の上に、前記セラミック層よりも焼成時の収縮率が大きい高収縮率物質が積層され、
前記セラミック層の層間を示す粒界の配向が、前記搭載面及び前記壁部の内壁に沿って湾曲する
セラミック基板。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019068268 | 2019-03-29 | ||
JP2019068268 | 2019-03-29 | ||
PCT/JP2020/008257 WO2020202942A1 (ja) | 2019-03-29 | 2020-02-28 | セラミック基板の製造方法及びセラミック基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2020202942A1 true JPWO2020202942A1 (ja) | 2021-09-13 |
JP6962501B2 JP6962501B2 (ja) | 2021-11-05 |
Family
ID=72668602
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021511244A Active JP6962501B2 (ja) | 2019-03-29 | 2020-02-28 | セラミック基板の製造方法及びセラミック基板 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20210362372A1 (ja) |
JP (1) | JP6962501B2 (ja) |
WO (1) | WO2020202942A1 (ja) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002151855A (ja) * | 2000-11-16 | 2002-05-24 | Murata Mfg Co Ltd | 多層セラミック基板の製造方法 |
JP2006185989A (ja) * | 2004-12-27 | 2006-07-13 | Murata Mfg Co Ltd | 回路基板およびその製造方法 |
WO2008018227A1 (fr) * | 2006-08-07 | 2008-02-14 | Murata Manufacturing Co., Ltd. | Procédé de production d'un substrat céramique multicouche |
JP2009141368A (ja) * | 2007-12-06 | 2009-06-25 | Samsung Electro-Mechanics Co Ltd | 積層セラミックパッケージ |
JP2010205844A (ja) * | 2009-03-02 | 2010-09-16 | Murata Mfg Co Ltd | 電子部品の製造方法 |
JP2019046966A (ja) * | 2017-09-01 | 2019-03-22 | 日本特殊陶業株式会社 | 基板の製造方法 |
-
2020
- 2020-02-28 WO PCT/JP2020/008257 patent/WO2020202942A1/ja active Application Filing
- 2020-02-28 JP JP2021511244A patent/JP6962501B2/ja active Active
-
2021
- 2021-08-02 US US17/391,810 patent/US20210362372A1/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002151855A (ja) * | 2000-11-16 | 2002-05-24 | Murata Mfg Co Ltd | 多層セラミック基板の製造方法 |
JP2006185989A (ja) * | 2004-12-27 | 2006-07-13 | Murata Mfg Co Ltd | 回路基板およびその製造方法 |
WO2008018227A1 (fr) * | 2006-08-07 | 2008-02-14 | Murata Manufacturing Co., Ltd. | Procédé de production d'un substrat céramique multicouche |
JP2009141368A (ja) * | 2007-12-06 | 2009-06-25 | Samsung Electro-Mechanics Co Ltd | 積層セラミックパッケージ |
JP2010205844A (ja) * | 2009-03-02 | 2010-09-16 | Murata Mfg Co Ltd | 電子部品の製造方法 |
JP2019046966A (ja) * | 2017-09-01 | 2019-03-22 | 日本特殊陶業株式会社 | 基板の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP6962501B2 (ja) | 2021-11-05 |
WO2020202942A1 (ja) | 2020-10-08 |
US20210362372A1 (en) | 2021-11-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2004235323A (ja) | 配線基板の製造方法 | |
JP3709802B2 (ja) | 多層セラミック基板の製造方法 | |
KR20020041305A (ko) | 다층 세라믹 기판 및 그 제조 방법 | |
JP6962501B2 (ja) | セラミック基板の製造方法及びセラミック基板 | |
JP2004047528A (ja) | 半導体基板及びその製造方法 | |
JP2002290038A (ja) | 多層セラミック基板の製造方法 | |
WO2020202943A1 (ja) | セラミック基板の製造方法及びセラミック基板 | |
JP7173298B2 (ja) | セラミック基板の製造方法 | |
JP6147981B2 (ja) | セラミック基板の製造方法 | |
JP3912082B2 (ja) | 積層セラミック電子部品の製造方法 | |
WO2020261707A1 (ja) | セラミック基板の製造方法及びセラミック基板 | |
JP2013239555A (ja) | 電子部品素子収納用パッケージ及びその製造方法 | |
JP6677547B2 (ja) | 電子部品収納用パッケージ、電子装置および電子モジュール | |
JP2007103570A (ja) | 積層コンデンサの製造方法,誘電体層用グラビア版及び内部電極層用グラビア版 | |
JP4200035B2 (ja) | セラミックパッケージの製造方法 | |
JP5682342B2 (ja) | 積層型セラミック電子部品の製造方法 | |
JP2013191600A (ja) | 多数個取り配線基板 | |
JP2004356135A (ja) | ヒートシンクおよびその製造方法 | |
JP4529637B2 (ja) | 多層配線基板の製造方法およびそれに用いる多層配線基板焼成用荷重体 | |
KR102041628B1 (ko) | 세라믹 적층체 압착장치 | |
JP2003100550A (ja) | 積層セラミック電子部品の製造方法 | |
JP2022136061A (ja) | 仮キャリアボード及びその製造方法ならびにパッケージ基板の製造方法 | |
JP2005051053A (ja) | 高周波積層部品の製造方法 | |
JP2008105939A (ja) | 積層セラミック基板焼成用加圧ローダ及びそれを用いた積層セラミック基板の製造方法 | |
JPS6080213A (ja) | 積層セラミツクコンデンサの製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20210416 |
|
A871 | Explanation of circumstances concerning accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A871 Effective date: 20210416 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20210706 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20210901 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20210914 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20210927 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6962501 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |