JPWO2020196644A1 - - Google Patents

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Publication number
JPWO2020196644A1
JPWO2020196644A1 JP2021509521A JP2021509521A JPWO2020196644A1 JP WO2020196644 A1 JPWO2020196644 A1 JP WO2020196644A1 JP 2021509521 A JP2021509521 A JP 2021509521A JP 2021509521 A JP2021509521 A JP 2021509521A JP WO2020196644 A1 JPWO2020196644 A1 JP WO2020196644A1
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2021509521A
Other versions
JP7101871B2 (ja
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Publication of JPWO2020196644A1 publication Critical patent/JPWO2020196644A1/ja
Application granted granted Critical
Publication of JP7101871B2 publication Critical patent/JP7101871B2/ja
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Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B21/00—Nitrogen; Compounds thereof
    • C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
    • C01B21/064—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with boron
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B21/00—Nitrogen; Compounds thereof
    • C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
    • C01B21/064—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with boron
    • C01B21/0648—After-treatment, e.g. grinding, purification
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5425—Silicon-containing compounds containing oxygen containing at least one C=C bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/50—Agglomerated particles
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/382—Boron-containing compounds and nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/382—Boron-containing compounds and nitrogen
    • C08K2003/385—Binary compounds of nitrogen with boron
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces
    • H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
JP2021509521A 2019-03-27 2020-03-25 塊状窒化ホウ素粒子、熱伝導樹脂組成物及び放熱部材 Active JP7101871B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019060324 2019-03-27
JP2019060324 2019-03-27
PCT/JP2020/013386 WO2020196644A1 (ja) 2019-03-27 2020-03-25 塊状窒化ホウ素粒子、熱伝導樹脂組成物及び放熱部材

Publications (2)

Publication Number Publication Date
JPWO2020196644A1 true JPWO2020196644A1 (ja) 2020-10-01
JP7101871B2 JP7101871B2 (ja) 2022-07-15

Family

ID=72609942

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021509521A Active JP7101871B2 (ja) 2019-03-27 2020-03-25 塊状窒化ホウ素粒子、熱伝導樹脂組成物及び放熱部材

Country Status (6)

Country Link
US (1) US20220153583A1 (ja)
JP (1) JP7101871B2 (ja)
KR (1) KR20210142640A (ja)
CN (1) CN113614033B (ja)
TW (1) TW202102433A (ja)
WO (1) WO2020196644A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3524573B1 (en) * 2016-10-07 2022-05-04 Denka Company Limited Boron nitride aggregated grain, method for producing same, and thermally conductive resin composition using same

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018053009A (ja) * 2016-09-26 2018-04-05 トヨタ自動車株式会社 窒化ホウ素粒子集合体を含む有機無機コンポジット材料の製造方法
WO2018066277A1 (ja) * 2016-10-07 2018-04-12 デンカ株式会社 窒化ホウ素塊状粒子、その製造方法及びそれを用いた熱伝導樹脂組成物

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3461651B2 (ja) 1996-01-24 2003-10-27 電気化学工業株式会社 六方晶窒化ほう素粉末及びその用途
JP3568401B2 (ja) 1998-11-18 2004-09-22 電気化学工業株式会社 高熱伝導性シート
US7494635B2 (en) 2003-08-21 2009-02-24 Saint-Gobain Ceramics & Plastics, Inc. Boron nitride agglomerated powder
CA2774842C (en) 2009-10-09 2015-07-14 Mizushima Ferroalloy Co., Ltd. Hexagonal boron nitride powder and method for producing same
JP5969314B2 (ja) 2012-08-22 2016-08-17 デンカ株式会社 窒化ホウ素粉末及びその用途
CN105026312B (zh) * 2013-03-07 2018-03-20 电化株式会社 氮化硼粉末及含有该氮化硼粉末的树脂组合物
KR102360935B1 (ko) * 2016-10-21 2022-02-09 덴카 주식회사 구형상 질화 붕소 미분말, 그 제조 방법 및 이를 이용한 열전도 수지 조성물

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018053009A (ja) * 2016-09-26 2018-04-05 トヨタ自動車株式会社 窒化ホウ素粒子集合体を含む有機無機コンポジット材料の製造方法
WO2018066277A1 (ja) * 2016-10-07 2018-04-12 デンカ株式会社 窒化ホウ素塊状粒子、その製造方法及びそれを用いた熱伝導樹脂組成物

Also Published As

Publication number Publication date
WO2020196644A1 (ja) 2020-10-01
TW202102433A (zh) 2021-01-16
CN113614033B (zh) 2024-04-30
US20220153583A1 (en) 2022-05-19
CN113614033A (zh) 2021-11-05
KR20210142640A (ko) 2021-11-25
JP7101871B2 (ja) 2022-07-15

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