JPWO2020195843A1 - - Google Patents

Info

Publication number
JPWO2020195843A1
JPWO2020195843A1 JP2021509008A JP2021509008A JPWO2020195843A1 JP WO2020195843 A1 JPWO2020195843 A1 JP WO2020195843A1 JP 2021509008 A JP2021509008 A JP 2021509008A JP 2021509008 A JP2021509008 A JP 2021509008A JP WO2020195843 A1 JPWO2020195843 A1 JP WO2020195843A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021509008A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2020195843A1 publication Critical patent/JPWO2020195843A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2021509008A 2019-03-26 2020-03-11 Pending JPWO2020195843A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019059068 2019-03-26
PCT/JP2020/010575 WO2020195843A1 (ja) 2019-03-26 2020-03-11 ドライフィルム、硬化物、および、電子部品

Publications (1)

Publication Number Publication Date
JPWO2020195843A1 true JPWO2020195843A1 (zh) 2020-10-01

Family

ID=72611373

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021509008A Pending JPWO2020195843A1 (zh) 2019-03-26 2020-03-11

Country Status (5)

Country Link
JP (1) JPWO2020195843A1 (zh)
KR (1) KR20210145772A (zh)
CN (1) CN113614153A (zh)
TW (1) TW202108362A (zh)
WO (1) WO2020195843A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115926576A (zh) * 2022-12-13 2023-04-07 东莞市毅联电子科技有限公司 一种挠性电路板遮光涂料及其制备方法和使用方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005238469A (ja) * 2004-02-24 2005-09-08 Tosoh Corp 積層体
TWI584070B (zh) * 2012-04-23 2017-05-21 日立化成股份有限公司 感光性樹脂組成物、感光性膜、永久遮罩抗蝕劑及永久遮罩抗蝕劑的製造方法
JP5624184B1 (ja) 2013-06-28 2014-11-12 太陽インキ製造株式会社 ドライフィルムおよびプリント配線板
JP6289311B2 (ja) * 2014-08-29 2018-03-07 積水化成品工業株式会社 粘接着剤組成物、粘接着シート、被着体の接着方法及び複合材
JP6665627B2 (ja) * 2016-03-28 2020-03-13 日本ゼオン株式会社 樹脂組成物及び電子部品

Also Published As

Publication number Publication date
WO2020195843A1 (ja) 2020-10-01
CN113614153A (zh) 2021-11-05
KR20210145772A (ko) 2021-12-02
TW202108362A (zh) 2021-03-01

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