JPWO2020189568A1 - - Google Patents

Info

Publication number
JPWO2020189568A1
JPWO2020189568A1 JP2021507314A JP2021507314A JPWO2020189568A1 JP WO2020189568 A1 JPWO2020189568 A1 JP WO2020189568A1 JP 2021507314 A JP2021507314 A JP 2021507314A JP 2021507314 A JP2021507314 A JP 2021507314A JP WO2020189568 A1 JPWO2020189568 A1 JP WO2020189568A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021507314A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2020189568A1 publication Critical patent/JPWO2020189568A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2021507314A 2019-03-15 2020-03-13 Pending JPWO2020189568A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019048674 2019-03-15
PCT/JP2020/011177 WO2020189568A1 (ja) 2019-03-15 2020-03-13 粘着シート及び半導体装置の製造方法

Publications (1)

Publication Number Publication Date
JPWO2020189568A1 true JPWO2020189568A1 (ja) 2020-09-24

Family

ID=72519350

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021507314A Pending JPWO2020189568A1 (ja) 2019-03-15 2020-03-13

Country Status (4)

Country Link
JP (1) JPWO2020189568A1 (ja)
KR (1) KR20210141929A (ja)
CN (1) CN113613893B (ja)
WO (1) WO2020189568A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021117695A1 (ja) * 2019-12-11 2021-06-17 リンテック株式会社 粘着シート及び半導体装置の製造方法
KR20240057380A (ko) * 2021-09-06 2024-05-02 세키스이가가쿠 고교가부시키가이샤 반도체 장치 제조용 점착 테이프
CN114561166A (zh) * 2022-03-31 2022-05-31 杭州福斯特应用材料股份有限公司 一种封装胶膜

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3594853B2 (ja) 1999-11-08 2004-12-02 日東電工株式会社 加熱剥離型粘着シート
JP4877689B2 (ja) * 2001-08-30 2012-02-15 日東電工株式会社 エネルギー線硬化型熱剥離性粘着シート、及びこれを用いた切断片の製造方法
JP2003077940A (ja) * 2001-09-06 2003-03-14 Sony Corp 素子の転写方法及びこれを用いた素子の配列方法、画像表示装置の製造方法
CN100377182C (zh) * 2002-06-03 2008-03-26 株式会社理光 热可逆记录介质、热可逆记录标签、热可逆记录构件、图像处理装置及图像处理方法
US7635516B2 (en) * 2004-03-11 2009-12-22 Nitto Denko Corporation Heat-peelable pressure-sensitive adhesive sheet and method for processing adherend using the heat-peelable pressure-sensitive adhesive sheet
JP2009035635A (ja) * 2007-08-01 2009-02-19 Nitto Denko Corp 非汚染性熱剥離型粘着シート
JP2010053346A (ja) * 2008-07-31 2010-03-11 Nitto Denko Corp 再剥離型粘着剤及び再剥離型粘着シート
WO2013011850A1 (ja) * 2011-07-15 2013-01-24 日東電工株式会社 電子部品の製造方法および該製造方法に用いる粘着シート
JP6000595B2 (ja) * 2012-03-27 2016-09-28 日東電工株式会社 電子部品切断用加熱剥離型粘着シート及び電子部品加工方法
JP6106332B2 (ja) * 2014-03-31 2017-03-29 三井化学東セロ株式会社 保護フィルム、及び、該保護フィルムを用いる半導体装置の製造方法
TW201704395A (zh) * 2015-02-24 2017-02-01 琳得科股份有限公司 薄膜狀接著劑、接著板片以及半導體裝置之製造方法
SG11201707264VA (en) * 2015-03-12 2017-10-30 Lintec Corp Film for forming protection film
US20180244963A1 (en) * 2015-09-01 2018-08-30 Lintec Corporation Adhesive agent composition and adhesive sheet
KR102365799B1 (ko) * 2016-03-03 2022-02-21 린텍 가부시키가이샤 반도체 가공용 점착 테이프, 및 반도체 장치의 제조 방법
JP6764524B2 (ja) * 2017-03-31 2020-09-30 リンテック株式会社 粘着シート
JP6887313B2 (ja) * 2017-05-31 2021-06-16 株式会社ディスコ ウェーハの加工方法
WO2019031533A1 (ja) * 2017-08-09 2019-02-14 リンテック株式会社 加工検査対象物の加熱剥離方法

Also Published As

Publication number Publication date
TW202045657A (zh) 2020-12-16
WO2020189568A1 (ja) 2020-09-24
CN113613893B (zh) 2023-11-21
KR20210141929A (ko) 2021-11-23
CN113613893A (zh) 2021-11-05

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