JPWO2020179899A1 - - Google Patents
Info
- Publication number
- JPWO2020179899A1 JPWO2020179899A1 JP2021503660A JP2021503660A JPWO2020179899A1 JP WO2020179899 A1 JPWO2020179899 A1 JP WO2020179899A1 JP 2021503660 A JP2021503660 A JP 2021503660A JP 2021503660 A JP2021503660 A JP 2021503660A JP WO2020179899 A1 JPWO2020179899 A1 JP WO2020179899A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
- H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Dicing (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Die Bonding (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2022102074A JP7141567B2 (ja) | 2019-03-07 | 2022-06-24 | ダイボンディングシート、及びフィルム状接着剤付き半導体チップの製造方法 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019041885 | 2019-03-07 | ||
JP2019041885 | 2019-03-07 | ||
PCT/JP2020/009596 WO2020179899A1 (ja) | 2019-03-07 | 2020-03-06 | ダイボンディングシート、及びフィルム状接着剤付き半導体チップの製造方法 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022102074A Division JP7141567B2 (ja) | 2019-03-07 | 2022-06-24 | ダイボンディングシート、及びフィルム状接着剤付き半導体チップの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2020179899A1 true JPWO2020179899A1 (zh) | 2020-09-10 |
JP7141516B2 JP7141516B2 (ja) | 2022-09-22 |
Family
ID=72337852
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021503660A Active JP7141516B2 (ja) | 2019-03-07 | 2020-03-06 | ダイボンディングシート、及びフィルム状接着剤付き半導体チップの製造方法 |
JP2022102074A Active JP7141567B2 (ja) | 2019-03-07 | 2022-06-24 | ダイボンディングシート、及びフィルム状接着剤付き半導体チップの製造方法 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022102074A Active JP7141567B2 (ja) | 2019-03-07 | 2022-06-24 | ダイボンディングシート、及びフィルム状接着剤付き半導体チップの製造方法 |
Country Status (5)
Country | Link |
---|---|
JP (2) | JP7141516B2 (zh) |
KR (1) | KR102672961B1 (zh) |
CN (1) | CN113508167B (zh) |
TW (1) | TWI826660B (zh) |
WO (1) | WO2020179899A1 (zh) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014135467A (ja) * | 2012-12-10 | 2014-07-24 | Nitto Denko Corp | ダイシングテープ一体型接着シート、ダイシングテープ一体型接着シートを用いた半導体装置の製造方法、及び、半導体装置 |
JP2016015456A (ja) * | 2014-07-03 | 2016-01-28 | リンテック株式会社 | 保護膜形成用複合シート |
JP2016089138A (ja) * | 2014-11-11 | 2016-05-23 | ダイヤプラスフィルム株式会社 | 半導体製造工程用粘着フィルムに使用する基材フィルム |
JP5946650B2 (ja) * | 2012-02-21 | 2016-07-06 | 積水化学工業株式会社 | ダイシング−ダイボンディングテープ及び粘接着剤層付き半導体チップの製造方法 |
WO2018083982A1 (ja) * | 2016-11-01 | 2018-05-11 | リンテック株式会社 | ダイシングダイボンディングシート、及び半導体チップの製造方法 |
JP2019016634A (ja) * | 2017-07-04 | 2019-01-31 | 日東電工株式会社 | ダイシングテープおよびダイシングダイボンドフィルム |
WO2019181730A1 (ja) * | 2018-03-20 | 2019-09-26 | リンテック株式会社 | 粘着テープおよび半導体装置の製造方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5946650B2 (ja) * | 1976-05-18 | 1984-11-14 | 株式会社サンノ− | 家畜ふん尿固液分離装置 |
JPS5946650U (ja) | 1982-09-20 | 1984-03-28 | 株式会社ダイフク | パレツトフイ−ダ− |
KR100894208B1 (ko) * | 2000-03-31 | 2009-04-22 | 히다치 가세고교 가부시끼가이샤 | 접착제 조성물, 그의 제조 방법, 이것을 사용한 접착 필름,반도체 탑재용 기판 및 반도체 장치 |
JP2010263041A (ja) * | 2009-05-01 | 2010-11-18 | Nitto Denko Corp | ダイアタッチフィルム付きダイシングテープおよび半導体装置の製造方法 |
WO2013015012A1 (ja) * | 2011-07-25 | 2013-01-31 | リンテック株式会社 | 半導体加工シート用基材フィルム、半導体加工シート及び半導体装置の製造方法 |
JP2013197390A (ja) * | 2012-03-21 | 2013-09-30 | Lintec Corp | ダイシングシートおよび半導体チップの製造方法 |
JP6343725B2 (ja) * | 2016-02-29 | 2018-06-13 | リンテック株式会社 | 半導体加工シート用基材フィルムおよび半導体加工シート |
JP6438181B1 (ja) * | 2017-05-17 | 2018-12-12 | リンテック株式会社 | 半導体装置及びその製造方法 |
-
2020
- 2020-03-06 WO PCT/JP2020/009596 patent/WO2020179899A1/ja active Application Filing
- 2020-03-06 TW TW109107377A patent/TWI826660B/zh active
- 2020-03-06 KR KR1020217028310A patent/KR102672961B1/ko active IP Right Grant
- 2020-03-06 CN CN202080018411.7A patent/CN113508167B/zh active Active
- 2020-03-06 JP JP2021503660A patent/JP7141516B2/ja active Active
-
2022
- 2022-06-24 JP JP2022102074A patent/JP7141567B2/ja active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5946650B2 (ja) * | 2012-02-21 | 2016-07-06 | 積水化学工業株式会社 | ダイシング−ダイボンディングテープ及び粘接着剤層付き半導体チップの製造方法 |
JP2014135467A (ja) * | 2012-12-10 | 2014-07-24 | Nitto Denko Corp | ダイシングテープ一体型接着シート、ダイシングテープ一体型接着シートを用いた半導体装置の製造方法、及び、半導体装置 |
JP2016015456A (ja) * | 2014-07-03 | 2016-01-28 | リンテック株式会社 | 保護膜形成用複合シート |
JP2016089138A (ja) * | 2014-11-11 | 2016-05-23 | ダイヤプラスフィルム株式会社 | 半導体製造工程用粘着フィルムに使用する基材フィルム |
WO2018083982A1 (ja) * | 2016-11-01 | 2018-05-11 | リンテック株式会社 | ダイシングダイボンディングシート、及び半導体チップの製造方法 |
JP2019016634A (ja) * | 2017-07-04 | 2019-01-31 | 日東電工株式会社 | ダイシングテープおよびダイシングダイボンドフィルム |
WO2019181730A1 (ja) * | 2018-03-20 | 2019-09-26 | リンテック株式会社 | 粘着テープおよび半導体装置の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
TW202045647A (zh) | 2020-12-16 |
WO2020179899A1 (ja) | 2020-09-10 |
CN113508167B (zh) | 2023-08-18 |
CN113508167A (zh) | 2021-10-15 |
TWI826660B (zh) | 2023-12-21 |
JP2022125112A (ja) | 2022-08-26 |
KR102672961B1 (ko) | 2024-06-05 |
JP7141516B2 (ja) | 2022-09-22 |
KR20210137020A (ko) | 2021-11-17 |
JP7141567B2 (ja) | 2022-09-22 |
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