JPWO2020179729A1 - - Google Patents

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Publication number
JPWO2020179729A1
JPWO2020179729A1 JP2021504075A JP2021504075A JPWO2020179729A1 JP WO2020179729 A1 JPWO2020179729 A1 JP WO2020179729A1 JP 2021504075 A JP2021504075 A JP 2021504075A JP 2021504075 A JP2021504075 A JP 2021504075A JP WO2020179729 A1 JPWO2020179729 A1 JP WO2020179729A1
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JP
Japan
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JP2021504075A
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Japanese (ja)
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JPWO2020179729A5 (https=
JP7504863B2 (ja
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Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N20/00—Machine learning
    • G06N20/20—Ensemble learning
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N20/00—Machine learning
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/52—Controlling or regulating the coating process
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N20/00—Machine learning
    • G06N20/10—Machine learning using kernel methods, e.g. support vector machines [SVM]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/04—Architecture, e.g. interconnection topology
    • G06N3/045—Combinations of networks
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/04—Architecture, e.g. interconnection topology
    • G06N3/0464—Convolutional networks [CNN, ConvNet]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/08—Learning methods
    • G06N3/09—Supervised learning
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F18/00—Pattern recognition
    • G06F18/20—Analysing
    • G06F18/21—Design or setup of recognition systems or techniques; Extraction of features in feature space; Blind source separation
    • G06F18/214—Generating training patterns; Bootstrap methods, e.g. bagging or boosting

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Software Systems (AREA)
  • Artificial Intelligence (AREA)
  • General Physics & Mathematics (AREA)
  • Data Mining & Analysis (AREA)
  • Evolutionary Computation (AREA)
  • Mathematical Physics (AREA)
  • Computing Systems (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Medical Informatics (AREA)
  • Computational Linguistics (AREA)
  • Molecular Biology (AREA)
  • General Health & Medical Sciences (AREA)
  • Biophysics (AREA)
  • Biomedical Technology (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
  • Physical Vapour Deposition (AREA)
JP2021504075A 2019-03-04 2020-03-02 基板処理装置の製造プロセス判定装置、基板処理システム、基板処理装置の製造プロセス判定方法、学習モデル群、学習モデル群の生成方法及びプログラム Active JP7504863B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
PCT/JP2019/008393 WO2020178945A1 (ja) 2019-03-04 2019-03-04 基板処理装置のプロセス判定装置、基板処理システム、基板処理装置のプロセス判定方法及び学習モデル群
JPPCT/JP2019/008393 2019-03-04
PCT/JP2020/008659 WO2020179729A1 (ja) 2019-03-04 2020-03-02 基板処理装置の製造プロセス判定装置、基板処理システム、基板処理装置の製造プロセス判定方法、学習モデル群、学習モデル群の生成方法及びプログラム

Publications (3)

Publication Number Publication Date
JPWO2020179729A1 true JPWO2020179729A1 (https=) 2020-09-10
JPWO2020179729A5 JPWO2020179729A5 (https=) 2022-12-13
JP7504863B2 JP7504863B2 (ja) 2024-06-24

Family

ID=70682424

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2019557650A Active JP6696059B1 (ja) 2019-03-04 2019-03-04 基板処理装置のプロセス判定装置、基板処理システム及び基板処理装置のプロセス判定方法
JP2021504075A Active JP7504863B2 (ja) 2019-03-04 2020-03-02 基板処理装置の製造プロセス判定装置、基板処理システム、基板処理装置の製造プロセス判定方法、学習モデル群、学習モデル群の生成方法及びプログラム

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2019557650A Active JP6696059B1 (ja) 2019-03-04 2019-03-04 基板処理装置のプロセス判定装置、基板処理システム及び基板処理装置のプロセス判定方法

Country Status (6)

Country Link
US (1) US20220114484A1 (https=)
EP (1) EP3819930A4 (https=)
JP (2) JP6696059B1 (https=)
KR (1) KR102820933B1 (https=)
CN (1) CN112655077B (https=)
WO (2) WO2020178945A1 (https=)

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JP7527172B2 (ja) * 2020-02-14 2024-08-02 株式会社フジクラ 判定装置、機械学習装置、判定方法、機械学習方法、プログラム、及び構造体の製造方法
WO2021240572A1 (ja) * 2020-05-25 2021-12-02 株式会社日立ハイテク 半導体装置製造システムおよび半導体装置製造方法
CN111882030B (zh) * 2020-06-29 2023-12-05 武汉钢铁有限公司 一种基于深度强化学习的加锭策略方法
JP7541182B2 (ja) * 2020-08-21 2024-08-27 リアルタイムテック カンパニー，リミテッド ディープラーニングベースのリアルタイム工程監視システム及びその方法
US11860973B2 (en) * 2020-10-27 2024-01-02 Applied Materials, Inc. Method and system for foreline deposition diagnostics and control
US12371791B2 (en) 2021-01-15 2025-07-29 Taiwan Semiconductor Manufacturing Co., Ltd. System and method for dynamically adjusting thin-film deposition parameters
JP7176143B2 (ja) * 2021-03-31 2022-11-21 Ｓｐｐテクノロジーズ株式会社 基板処理装置のプロセス判定装置、基板処理システム、基板処理装置のプロセス判定方法、学習モデル群、学習モデル群の生成方法及びプログラム
JP7041773B1 (ja) 2021-05-26 2022-03-24 Ｓｐｐテクノロジーズ株式会社 基板処理装置のプロセス判定装置、基板処理システム、基板処理装置のプロセス判定方法、学習モデルの生成方法及びプログラム
JP7041776B1 (ja) 2021-06-30 2022-03-24 Ｓｐｐテクノロジーズ株式会社 基板処理装置のプロセス判定装置、基板処理システム、基板処理装置のプロセス判定方法、学習モデルの生成方法及びプログラム
TW202310131A (zh) * 2021-08-24 2023-03-01 日商東京威力科創股份有限公司 基板處理裝置、模型資料產生裝置、基板處理方法、及模型資料產生方法
KR102673673B1 (ko) * 2021-12-09 2024-06-07 한국핵융합에너지연구원 Rf 신호를 이용한 플라즈마 상태 감지 장치 및 이를 이용한 플라즈마 상태 감지 방법
JP7750775B2 (ja) * 2022-03-02 2025-10-07 株式会社Ｓｃｒｅｅｎホールディングス 制御支援装置および制御支援方法
CN117121169A (zh) 2022-03-24 2023-11-24 株式会社日立高新技术 装置诊断系统、装置诊断装置、半导体装置制造系统以及装置诊断方法
US12535799B2 (en) * 2022-07-08 2026-01-27 Applied Materials, Inc. Sustainability monitoring platform with sensor support
KR102742969B1 (ko) * 2022-10-31 2024-12-16 김승민 Rf 플라스마 전력 시스템에서의 고장 진단 장치 및 그 방법
WO2026070462A1 (ja) * 2024-09-26 2026-04-02 東京エレクトロン株式会社 基板処理装置、情報処理方法及びコンピュータプログラム

Citations (5)

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JPH05190457A (ja) * 1992-01-17 1993-07-30 Fuji Electric Co Ltd 学習指示機能付半導体製造装置
JP2001134763A (ja) * 1999-11-09 2001-05-18 Hitachi Ltd 撮像画像に基づく欠陥の分類方法、および、その結果の表示方法
JP2005200730A (ja) * 2004-01-19 2005-07-28 Itagaki Kinzoku Kk レーザー光照射による酸化膜形成方法および装置
JP2016192007A (ja) * 2015-03-31 2016-11-10 日本電気株式会社 機械学習装置、機械学習方法、および機械学習プログラム
JP2018045559A (ja) * 2016-09-16 2018-03-22 富士通株式会社 情報処理装置、情報処理方法およびプログラム

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JP4101280B2 (ja) 2006-07-28 2008-06-18 住友精密工業株式会社 終点検出可能なプラズマエッチング方法及びプラズマエッチング装置
JP5533662B2 (ja) * 2008-10-30 2014-06-25 コニカミノルタ株式会社 情報処理装置
JP2011007553A (ja) * 2009-06-24 2011-01-13 Hitachi High-Technologies Corp 欠陥検出方法及び装置
JP5640774B2 (ja) * 2011-01-28 2014-12-17 富士通株式会社 情報照合装置、情報照合方法および情報照合プログラム
JP2014178229A (ja) * 2013-03-15 2014-09-25 Dainippon Screen Mfg Co Ltd 教師データ作成方法、画像分類方法および画像分類装置
US10032681B2 (en) * 2016-03-02 2018-07-24 Lam Research Corporation Etch metric sensitivity for endpoint detection
JP6921526B2 (ja) * 2016-12-22 2021-08-18 キヤノン株式会社 情報処理装置、情報処理方法及びプログラム
JP6860406B2 (ja) * 2017-04-05 2021-04-14 株式会社荏原製作所 半導体製造装置、半導体製造装置の故障予知方法、および半導体製造装置の故障予知プログラム
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JPH05190457A (ja) * 1992-01-17 1993-07-30 Fuji Electric Co Ltd 学習指示機能付半導体製造装置
JP2001134763A (ja) * 1999-11-09 2001-05-18 Hitachi Ltd 撮像画像に基づく欠陥の分類方法、および、その結果の表示方法
JP2005200730A (ja) * 2004-01-19 2005-07-28 Itagaki Kinzoku Kk レーザー光照射による酸化膜形成方法および装置
JP2016192007A (ja) * 2015-03-31 2016-11-10 日本電気株式会社 機械学習装置、機械学習方法、および機械学習プログラム
JP2018045559A (ja) * 2016-09-16 2018-03-22 富士通株式会社 情報処理装置、情報処理方法およびプログラム

Also Published As

Publication number Publication date
US20220114484A1 (en) 2022-04-14
JP6696059B1 (ja) 2020-05-20
CN112655077A (zh) 2021-04-13
JPWO2020178945A1 (ja) 2021-03-18
KR102820933B1 (ko) 2025-06-16
EP3819930A4 (en) 2021-10-27
KR20210134298A (ko) 2021-11-09
WO2020179729A1 (ja) 2020-09-10
WO2020178945A1 (ja) 2020-09-10
EP3819930A1 (en) 2021-05-12
CN112655077B (zh) 2023-10-20
JP7504863B2 (ja) 2024-06-24

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