JPWO2020138360A1 - Imid-amidic acid copolymer and its production method, varnish, and polyimide film - Google Patents
Imid-amidic acid copolymer and its production method, varnish, and polyimide film Download PDFInfo
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- JPWO2020138360A1 JPWO2020138360A1 JP2020562452A JP2020562452A JPWO2020138360A1 JP WO2020138360 A1 JPWO2020138360 A1 JP WO2020138360A1 JP 2020562452 A JP2020562452 A JP 2020562452A JP 2020562452 A JP2020562452 A JP 2020562452A JP WO2020138360 A1 JPWO2020138360 A1 JP WO2020138360A1
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- imide
- derived
- acid copolymer
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- 229920001577 copolymer Polymers 0.000 title claims abstract description 152
- 239000002253 acid Substances 0.000 title claims abstract description 142
- 229920001721 polyimide Polymers 0.000 title claims description 92
- 239000002966 varnish Substances 0.000 title claims description 71
- 238000004519 manufacturing process Methods 0.000 title claims description 33
- 150000003949 imides Chemical group 0.000 claims abstract description 88
- 239000000203 mixture Substances 0.000 claims abstract description 67
- 125000003118 aryl group Chemical group 0.000 claims abstract description 65
- 125000001931 aliphatic group Chemical group 0.000 claims abstract description 57
- 125000002723 alicyclic group Chemical group 0.000 claims abstract description 55
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 47
- 125000005647 linker group Chemical group 0.000 claims abstract description 24
- 150000001875 compounds Chemical class 0.000 claims description 161
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims description 90
- 150000004985 diamines Chemical class 0.000 claims description 84
- 239000000470 constituent Substances 0.000 claims description 76
- 150000000000 tetracarboxylic acids Chemical class 0.000 claims description 52
- 125000006158 tetracarboxylic acid group Chemical group 0.000 claims description 50
- -1 alicyclic tetracarboxylic acid Chemical class 0.000 claims description 40
- 150000004984 aromatic diamines Chemical class 0.000 claims description 20
- 239000009719 polyimide resin Substances 0.000 claims description 16
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 15
- 229910052731 fluorine Inorganic materials 0.000 claims description 12
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 8
- 229910052799 carbon Inorganic materials 0.000 claims description 8
- 239000003960 organic solvent Substances 0.000 claims description 8
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 7
- 239000011737 fluorine Substances 0.000 claims description 7
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 7
- 125000000217 alkyl group Chemical group 0.000 claims description 6
- 125000001153 fluoro group Chemical group F* 0.000 claims description 6
- 125000003277 amino group Chemical group 0.000 claims description 5
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 5
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 5
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 196
- 239000000243 solution Substances 0.000 description 67
- 238000006243 chemical reaction Methods 0.000 description 63
- 239000002904 solvent Substances 0.000 description 47
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 44
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 42
- 239000011521 glass Substances 0.000 description 40
- 239000003054 catalyst Substances 0.000 description 34
- QTBSBXVTEAMEQO-UHFFFAOYSA-N acetic acid Substances CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 29
- 229910052757 nitrogen Inorganic materials 0.000 description 22
- 238000000034 method Methods 0.000 description 21
- 239000012298 atmosphere Substances 0.000 description 19
- 239000004642 Polyimide Substances 0.000 description 18
- 239000012299 nitrogen atmosphere Substances 0.000 description 18
- 239000007787 solid Substances 0.000 description 18
- 238000001816 cooling Methods 0.000 description 17
- 238000004528 spin coating Methods 0.000 description 17
- 229910001220 stainless steel Inorganic materials 0.000 description 16
- 239000010935 stainless steel Substances 0.000 description 16
- 238000003860 storage Methods 0.000 description 16
- 241001272720 Medialuna californiensis Species 0.000 description 14
- 239000011259 mixed solution Substances 0.000 description 13
- 230000000052 comparative effect Effects 0.000 description 12
- 229920005575 poly(amic acid) Polymers 0.000 description 12
- 238000003756 stirring Methods 0.000 description 9
- 238000000465 moulding Methods 0.000 description 8
- BCJIMAHNJOIWKQ-UHFFFAOYSA-N 4-[(1,3-dioxo-2-benzofuran-4-yl)oxy]-2-benzofuran-1,3-dione Chemical compound O=C1OC(=O)C2=C1C=CC=C2OC1=CC=CC2=C1C(=O)OC2=O BCJIMAHNJOIWKQ-UHFFFAOYSA-N 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 7
- 239000002994 raw material Substances 0.000 description 7
- NKYXYJFTTIPZDE-UHFFFAOYSA-N 4-[4-amino-2-(trifluoromethyl)phenoxy]-3-(trifluoromethyl)aniline Chemical compound FC(F)(F)C1=CC(N)=CC=C1OC1=CC=C(N)C=C1C(F)(F)F NKYXYJFTTIPZDE-UHFFFAOYSA-N 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 239000007810 chemical reaction solvent Substances 0.000 description 6
- 239000002243 precursor Substances 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- LJMPOXUWPWEILS-UHFFFAOYSA-N 3a,4,4a,7a,8,8a-hexahydrofuro[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1C2C(=O)OC(=O)C2CC2C(=O)OC(=O)C21 LJMPOXUWPWEILS-UHFFFAOYSA-N 0.000 description 5
- 150000001408 amides Chemical class 0.000 description 5
- UTDAGHZGKXPRQI-UHFFFAOYSA-N 4-[4-[4-(4-aminophenoxy)phenyl]sulfonylphenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=C(S(=O)(=O)C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)C=C1 UTDAGHZGKXPRQI-UHFFFAOYSA-N 0.000 description 4
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 4
- CXISKMDTEFIGTG-UHFFFAOYSA-N [4-(1,3-dioxo-2-benzofuran-5-carbonyl)oxyphenyl] 1,3-dioxo-2-benzofuran-5-carboxylate Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(OC=2C=CC(OC(=O)C=3C=C4C(=O)OC(=O)C4=CC=3)=CC=2)=O)=C1 CXISKMDTEFIGTG-UHFFFAOYSA-N 0.000 description 4
- 125000002947 alkylene group Chemical group 0.000 description 4
- WGQKYBSKWIADBV-UHFFFAOYSA-N benzylamine Chemical compound NCC1=CC=CC=C1 WGQKYBSKWIADBV-UHFFFAOYSA-N 0.000 description 4
- 238000009835 boiling Methods 0.000 description 4
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 239000008393 encapsulating agent Substances 0.000 description 4
- 125000000524 functional group Chemical group 0.000 description 4
- 230000001771 impaired effect Effects 0.000 description 4
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 4
- 230000000704 physical effect Effects 0.000 description 4
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 239000004926 polymethyl methacrylate Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 125000000472 sulfonyl group Chemical group *S(*)(=O)=O 0.000 description 4
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 4
- OISVCGZHLKNMSJ-UHFFFAOYSA-N 2,6-dimethylpyridine Chemical compound CC1=CC=CC(C)=N1 OISVCGZHLKNMSJ-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- BSKHPKMHTQYZBB-UHFFFAOYSA-N 2-methylpyridine Chemical compound CC1=CC=CC=N1 BSKHPKMHTQYZBB-UHFFFAOYSA-N 0.000 description 3
- KIFDSGGWDIVQGN-UHFFFAOYSA-N 4-[9-(4-aminophenyl)fluoren-9-yl]aniline Chemical compound C1=CC(N)=CC=C1C1(C=2C=CC(N)=CC=2)C2=CC=CC=C2C2=CC=CC=C21 KIFDSGGWDIVQGN-UHFFFAOYSA-N 0.000 description 3
- QQGYZOYWNCKGEK-UHFFFAOYSA-N 5-[(1,3-dioxo-2-benzofuran-5-yl)oxy]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(OC=2C=C3C(=O)OC(C3=CC=2)=O)=C1 QQGYZOYWNCKGEK-UHFFFAOYSA-N 0.000 description 3
- WFDIJRYMOXRFFG-UHFFFAOYSA-N Acetic anhydride Chemical compound CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000002585 base Substances 0.000 description 3
- 125000005442 diisocyanate group Chemical group 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 230000009477 glass transition Effects 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- 125000003258 trimethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])[*:1] 0.000 description 3
- 125000001140 1,4-phenylene group Chemical group [H]C1=C([H])C([*:2])=C([H])C([H])=C1[*:1] 0.000 description 2
- QWBBPBRQALCEIZ-UHFFFAOYSA-N 2,3-dimethylphenol Chemical compound CC1=CC=CC(O)=C1C QWBBPBRQALCEIZ-UHFFFAOYSA-N 0.000 description 2
- JYYNAJVZFGKDEQ-UHFFFAOYSA-N 2,4-Dimethylpyridine Chemical compound CC1=CC=NC(C)=C1 JYYNAJVZFGKDEQ-UHFFFAOYSA-N 0.000 description 2
- NKTOLZVEWDHZMU-UHFFFAOYSA-N 2,5-xylenol Chemical compound CC1=CC=C(C)C(O)=C1 NKTOLZVEWDHZMU-UHFFFAOYSA-N 0.000 description 2
- NXXYKOUNUYWIHA-UHFFFAOYSA-N 2,6-Dimethylphenol Chemical compound CC1=CC=CC(C)=C1O NXXYKOUNUYWIHA-UHFFFAOYSA-N 0.000 description 2
- TUAMRELNJMMDMT-UHFFFAOYSA-N 3,5-xylenol Chemical compound CC1=CC(C)=CC(O)=C1 TUAMRELNJMMDMT-UHFFFAOYSA-N 0.000 description 2
- JJYPMNFTHPTTDI-UHFFFAOYSA-N 3-methylaniline Chemical compound CC1=CC=CC(N)=C1 JJYPMNFTHPTTDI-UHFFFAOYSA-N 0.000 description 2
- FYYYKXFEKMGYLZ-UHFFFAOYSA-N 4-(1,3-dioxo-2-benzofuran-5-yl)-2-benzofuran-1,3-dione Chemical compound C=1C=C2C(=O)OC(=O)C2=CC=1C1=CC=CC2=C1C(=O)OC2=O FYYYKXFEKMGYLZ-UHFFFAOYSA-N 0.000 description 2
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 2
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 2
- OPVHOFITDJSMOD-UHFFFAOYSA-N 4-[(1,3-dioxo-2-benzofuran-5-yl)oxy]-2-benzofuran-1,3-dione Chemical compound C=1C=C2C(=O)OC(=O)C2=CC=1OC1=CC=CC2=C1C(=O)OC2=O OPVHOFITDJSMOD-UHFFFAOYSA-N 0.000 description 2
- HESXPOICBNWMPI-UHFFFAOYSA-N 4-[2-[4-[2-(4-aminophenyl)propan-2-yl]phenyl]propan-2-yl]aniline Chemical compound C=1C=C(C(C)(C)C=2C=CC(N)=CC=2)C=CC=1C(C)(C)C1=CC=C(N)C=C1 HESXPOICBNWMPI-UHFFFAOYSA-N 0.000 description 2
- HHLMWQDRYZAENA-UHFFFAOYSA-N 4-[4-[2-[4-(4-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropan-2-yl]phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=C(C(C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)(C(F)(F)F)C(F)(F)F)C=C1 HHLMWQDRYZAENA-UHFFFAOYSA-N 0.000 description 2
- JVERADGGGBYHNP-UHFFFAOYSA-N 5-phenylbenzene-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C(C(=O)O)=CC(C=2C=CC=CC=2)=C1C(O)=O JVERADGGGBYHNP-UHFFFAOYSA-N 0.000 description 2
- 102100031503 Barrier-to-autointegration factor-like protein Human genes 0.000 description 2
- WVOLTBSCXRRQFR-SJORKVTESA-N Cannabidiolic acid Natural products OC1=C(C(O)=O)C(CCCCC)=CC(O)=C1[C@@H]1[C@@H](C(C)=C)CCC(C)=C1 WVOLTBSCXRRQFR-SJORKVTESA-N 0.000 description 2
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 2
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- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
- 101000729827 Homo sapiens Barrier-to-autointegration factor-like protein Proteins 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 description 2
- 241000209094 Oryza Species 0.000 description 2
- 235000007164 Oryza sativa Nutrition 0.000 description 2
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- SMWDFEZZVXVKRB-UHFFFAOYSA-N Quinoline Chemical compound N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- 239000003377 acid catalyst Substances 0.000 description 2
- 125000005907 alkyl ester group Chemical group 0.000 description 2
- 125000005529 alkyleneoxy group Chemical group 0.000 description 2
- 150000008064 anhydrides Chemical class 0.000 description 2
- 125000000732 arylene group Chemical group 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 description 2
- HQABUPZFAYXKJW-UHFFFAOYSA-N butan-1-amine Chemical compound CCCCN HQABUPZFAYXKJW-UHFFFAOYSA-N 0.000 description 2
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 2
- WVOLTBSCXRRQFR-DLBZAZTESA-M cannabidiolate Chemical compound OC1=C(C([O-])=O)C(CCCCC)=CC(O)=C1[C@H]1[C@H](C(C)=C)CCC(C)=C1 WVOLTBSCXRRQFR-DLBZAZTESA-M 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 230000018044 dehydration Effects 0.000 description 2
- 238000006297 dehydration reaction Methods 0.000 description 2
- 150000001991 dicarboxylic acids Chemical class 0.000 description 2
- GGSUCNLOZRCGPQ-UHFFFAOYSA-N diethylaniline Chemical compound CCN(CC)C1=CC=CC=C1 GGSUCNLOZRCGPQ-UHFFFAOYSA-N 0.000 description 2
- 238000007865 diluting Methods 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- JBTWLSYIZRCDFO-UHFFFAOYSA-N ethyl methyl carbonate Chemical compound CCOC(=O)OC JBTWLSYIZRCDFO-UHFFFAOYSA-N 0.000 description 2
- 239000003205 fragrance Substances 0.000 description 2
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 2
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- 238000001641 gel filtration chromatography Methods 0.000 description 2
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 2
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- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
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- 230000003287 optical effect Effects 0.000 description 2
- 150000007530 organic bases Chemical class 0.000 description 2
- 125000004430 oxygen atom Chemical group O* 0.000 description 2
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 2
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- 239000004033 plastic Substances 0.000 description 2
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- 238000006116 polymerization reaction Methods 0.000 description 2
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 2
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical compound CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 2
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 2
- 235000009566 rice Nutrition 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- HHVIBTZHLRERCL-UHFFFAOYSA-N sulfonyldimethane Chemical compound CS(C)(=O)=O HHVIBTZHLRERCL-UHFFFAOYSA-N 0.000 description 2
- QAEDZJGFFMLHHQ-UHFFFAOYSA-N trifluoroacetic anhydride Chemical compound FC(F)(F)C(=O)OC(=O)C(F)(F)F QAEDZJGFFMLHHQ-UHFFFAOYSA-N 0.000 description 2
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
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Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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Abstract
下記式(1)で表される、イミド部分(I)とアミド酸部分(A)とからなる繰り返し単位を含む、イミド−アミド酸共重合体。(式(1)中、X1は炭素数4〜39の4価の脂肪族基、脂環基、芳香族基又はこれらの組み合わせからなる基であって、結合基として−O−、−SO2−、−CO−、−CH2−、−C(CH3)2−、−C2H4O−及び−S−からなる群から選ばれる少なくとも1つを有していてもよい。X2はX1とは異なる炭素数4〜39の4価の脂肪族基、脂環基、芳香族基又はこれらの組み合わせからなる基であって、結合基として−O−、−SO2−、−CO−、−CH2−、−C(CH3)2−、−C2H4O−及び−S−からなる群から選ばれる少なくとも1つを有していてもよい。Y1は炭素数4〜39の2価の脂肪族基、脂環基、芳香族基又はこれらの組み合わせからなる基であって、結合基として−O−、−SO2−、−CO−、−CH2−、−C(CH3)2−、−C2H4O−及び−S−からなる群から選ばれる少なくとも1つを有していてもよく、複数のY1は同一の組成を有する。s及びtは正の整数である。)An imide-amide acid copolymer containing a repeating unit composed of an imide moiety (I) and an amic acid moiety (A) represented by the following formula (1). (In the formula (1), X1 is a group consisting of a tetravalent aliphatic group having 4 to 39 carbon atoms, an alicyclic group, an aromatic group or a combination thereof, and has -O- and -SO2- as a linking group. , -CO-, -CH2-, -C (CH3) 2-, -C2H4O- and -S- may have at least one selected from the group. X2 has 4 carbon atoms different from X1. A group consisting of a tetravalent aliphatic group of ~ 39, an alicyclic group, an aromatic group or a combination thereof, and as a linking group, -O-, -SO2-, -CO-, -CH2-, -C ( CH3) It may have at least one selected from the group consisting of 2-, -C2H4O- and -S-. Y1 is a divalent aliphatic group having 4 to 39 carbon atoms, an alicyclic group, and an aromatic group. A group consisting of a group or a combination thereof, which comprises a group consisting of -O-, -SO2-, -CO-, -CH2-, -C (CH3) 2-, -C2H4O- and -S- as a linking group. It may have at least one selected, and the plurality of Y1s have the same composition. S and t are positive integers.)
Description
本発明はポリイミド樹脂の前駆体であるイミド−アミド酸共重合体及びその製造方法、共重合体を含むワニス、並びにポリイミドフィルムに関する。 The present invention relates to an imide-amide acid copolymer which is a precursor of a polyimide resin, a method for producing the same, a varnish containing the copolymer, and a polyimide film.
ポリイミド樹脂は、電気・電子部品等の分野において様々な利用が検討されている。例えば、液晶ディスプレイやOLEDディスプレイ等の画像表示装置に用いられるガラス基板を、デバイスの軽量化やフレキシブル化を目的として、プラスチック基板へ代替することが望まれており、当該プラスチック基板として適するポリイミドフィルムの研究が進められている。このような用途のポリイミドフィルムには高い透明性が求められる。
また、ガラス支持体やシリコンウェハ上に塗布したワニスを加熱硬化してポリイミドフィルムを形成する場合には、ポリイミドフィルムに残留応力が生じる。ポリイミドフィルムの残留応力が大きいと、ガラス支持体やシリコンウェハが反ってしまうという問題が生じるため、ポリイミドフィルムには残留応力の低減も求められる。
さらに、ポリイミドフィルムの要求特性として複屈折による位相差が小さく、リタデーションが低いことが求められる。Various uses of polyimide resins are being studied in the fields of electrical and electronic components and the like. For example, it is desired to replace a glass substrate used in an image display device such as a liquid crystal display or an OLED display with a plastic substrate for the purpose of reducing the weight and flexibility of the device. Research is underway. High transparency is required for the polyimide film for such applications.
Further, when the varnish coated on the glass support or the silicon wafer is heat-cured to form the polyimide film, residual stress is generated in the polyimide film. If the residual stress of the polyimide film is large, there is a problem that the glass support and the silicon wafer are warped. Therefore, the polyimide film is also required to reduce the residual stress.
Further, the required characteristics of the polyimide film are that the phase difference due to birefringence is small and the retardation is low.
特許文献1には、低残留応力のフィルムを与えるポリイミド樹脂として、ジアミン成分としてα,ω−アミノプロピルポリジメチルシロキサン及び4,4’−ジアミノジフェニルエーテルを用いて合成されたポリイミド樹脂が開示されている。
特許文献2には、低残留応力のポリイミドフィルムとして、ジアミン成分としてビストリフルオロメチルベンジジン、及びケイ素含有ジアミン類を用いて合成されたポリイミド樹脂前駆体をイミド化して形成されるポリイミドフィルムが開示されている。Patent Document 1 discloses a polyimide resin synthesized by using α, ω-aminopropyl polydimethylsiloxane and 4,4′-diaminodiphenyl ether as diamine components as a polyimide resin that gives a film having a low residual stress. ..
Patent Document 2 discloses a polyimide film formed by imidizing a polyimide resin precursor synthesized by using bistrifluoromethylbenzidine as a diamine component and silicon-containing diamines as a polyimide film having a low residual stress. There is.
一方、特許文献3には、溶媒可溶性、貯蔵安定性、耐熱性を向上させるために、ビフェニルテトラカルボン酸二無水物又はジフェニルスルホンテトラカルボン酸二無水物と特定のジアミン又はジイソシアネートが共重合されてなるポリイミド重合体オリゴマーが開示されている。 On the other hand, in Patent Document 3, a specific diamine or diisocyanate is copolymerized with biphenyltetracarboxylic acid dianhydride or diphenylsulfonetetracarboxylic acid dianhydride in order to improve solvent solubility, storage stability and heat resistance. The polyimide polymer oligomer is disclosed.
前記特許文献1及び2ではポリイミドの前駆体としてポリアミド酸を用いて、性能の向上を試みているが、ポリアミド酸は保存安定性が劣るという問題がある。一方、ポリイミド樹脂はポリアミド酸のような分解は生じないが、溶媒への溶解度が低いため、ポリイミドを含むワニスが大気中の水分を吸湿するためか、製膜時にフィルムに白化が生じることがあり、成形加工上、問題となっていた。特許文献3のポリイミドオリゴマーを用いた場合には黄色度(イエローインデックス、YI)やリタデーションが高いという問題があり、成形加工性についても十分とはいえなかった。
このように、保存安定性と成形加工性を両立させることは困難であった。
本発明はこのような状況に鑑みてなされたものであり、本発明の課題は保存安定性と成形加工性を両立することができるポリイミド樹脂の前駆体であるイミド−アミド酸共重合体及びその製造方法、該共重合体を含むワニス、並びにポリイミドフィルムを提供することにある。In Patent Documents 1 and 2, polyamic acid is used as a precursor of polyimide to try to improve its performance, but polyamic acid has a problem of inferior storage stability. On the other hand, the polyimide resin does not decompose like polyamic acid, but its solubility in a solvent is low, so that the varnish containing polyimide absorbs moisture in the atmosphere, and the film may be whitened during film formation. , It was a problem in molding process. When the polyimide oligomer of Patent Document 3 is used, there is a problem that the yellowness (yellow index, YI) and retardation are high, and the molding processability cannot be said to be sufficient.
As described above, it has been difficult to achieve both storage stability and molding processability.
The present invention has been made in view of such a situation, and the subject of the present invention is an imide-amidoic acid copolymer which is a precursor of a polyimide resin capable of achieving both storage stability and moldability, and an imide-amidoic acid copolymer thereof. It is an object of the present invention to provide a production method, a varnish containing the copolymer, and a polyimide film.
本発明者らは、特定の構成単位の組み合わせを含む共重合体が上記課題を解決できることを見出し、発明を完成させるに至った。 The present inventors have found that a copolymer containing a combination of specific structural units can solve the above-mentioned problems, and have completed the invention.
即ち、本発明は、下記の[1]〜[23]に関する。
[1]
下記式(1)で表される、イミド部分(I)とアミド酸部分(A)とからなる繰り返し単位を含む、イミド−アミド酸共重合体。That is, the present invention relates to the following [1] to [23].
[1]
An imide-amide acid copolymer containing a repeating unit composed of an imide moiety (I) and an amic acid moiety (A) represented by the following formula (1).
(式(1)中、
X1は炭素数4〜39の4価の脂肪族基、脂環基、芳香族基又はこれらの組み合わせからなる基であって、結合基として−O−、−SO2−、−CO−、−CH2−、−C(CH3)2−、−C2H4O−及び−S−からなる群から選ばれる少なくとも1つを有していてもよい。
X2はX1とは異なる炭素数4〜39の4価の脂肪族基、脂環基、芳香族基又はこれらの組み合わせからなる基であって、結合基として−O−、−SO2−、−CO−、−CH2−、−C(CH3)2−、−C2H4O−及び−S−からなる群から選ばれる少なくとも1つを有していてもよい。
Y1は炭素数4〜39の2価の脂肪族基、脂環基、芳香族基又はこれらの組み合わせからなる基であって、結合基として−O−、−SO2−、−CO−、−CH2−、−C(CH3)2−、−C2H4O−及び−S−からなる群から選ばれる少なくとも1つを有していてもよく、複数のY1は同一の組成を有する。
s及びtは正の整数である。)
(In equation (1),
X 1 is a group consisting of a tetravalent aliphatic group having 4 to 39 carbon atoms, an alicyclic group, an aromatic group or a combination thereof, and has -O-, -SO 2- , -CO- as a linking group. -CH 2 -, - C (CH 3) 2 -, - it may have at least one member selected from C 2 H 4 group consisting of O- and -S-.
X 2 is a tetravalent aliphatic group, an alicyclic group, an aromatic group, or combinations of these groups having a carbon number of 4-39, which is different from the X 1, -O a bonding group -, - SO 2 - , -CO-, -CH 2- , -C (CH 3 ) 2- , -C 2 H 4 O- and -S- may have at least one selected from the group.
Y 1 is a group consisting of a divalent aliphatic group having 4 to 39 carbon atoms, an alicyclic group, an aromatic group or a combination thereof, and as a linking group, -O-, -SO 2- , -CO-, -CH 2 -, - C (CH 3) 2 -, - it may have at least one member selected from C 2 H 4 group consisting of O- and -S-, a plurality of Y 1 are the same composition Have.
s and t are positive integers. )
[2]
前記sが1〜20である、前記[1]に記載のイミド−アミド酸共重合体。
[3]
前記tが5〜200である、前記[1]又は[2]に記載のイミド−アミド酸共重合体。
[4]
前記Y1が、炭素数4〜39の2価の芳香族基、ジアミノアルキルシクロヘキサン又はこれらの組み合わせからなる基である、前記[1]〜[3]のいずれか1つに記載のイミド−アミド酸共重合体。
[5]
前記X1が、炭素数4〜39の4価の脂肪族基、脂環基又はこれらの組み合わせからなる基である、前記[1]〜[4]のいずれか1つに記載のイミド−アミド酸共重合体。
[6]
前記X2が、炭素数4〜39の4価の芳香族基である、前記[1]〜[5]のいずれか1つに記載のイミド−アミド酸共重合体。
[7]
前記イミド部分(I)が、テトラカルボン酸二無水物に由来する構成単位IA及びジアミンに由来する構成単位IBを有し、
前記アミド酸部分(A)が、テトラカルボン酸二無水物に由来する構成単位AA及びジアミンに由来する構成単位ABを有し、
構成単位IAが、脂環式テトラカルボン酸二無水物(a−1)に由来する構成単位(A−1)を含み、
構成単位IB及び構成単位ABが、エーテル結合を有する芳香族ジアミンに由来する構成単位を含む、前記[1]〜[6]のいずれか1つに記載のイミド−アミド酸共重合体。
[8]
前記イミド部分(I)が、テトラカルボン酸二無水物に由来する構成単位IA及びジアミンに由来する構成単位IBを有し、
前記アミド酸部分(A)が、テトラカルボン酸二無水物に由来する構成単位AA及びジアミンに由来する構成単位ABを有し、
構成単位IAが、脂環式テトラカルボン酸二無水物(a−1)に由来する構成単位(A−1)を含み、
構成単位IB及び構成単位ABが、含フッ素芳香族ジアミンに由来する構成単位を含む、前記[1]〜[6]のいずれか1つに記載のイミド−アミド酸共重合体。
[9]
構成単位IB及び構成単位ABが、下記式(b−1)で表される化合物に由来する構成単位(B−1)を含む、前記[7]又は[8]に記載のイミド−アミド酸共重合体。[2]
The imide-amide acid copolymer according to the above [1], wherein the s is 1 to 20.
[3]
The imide-amide acid copolymer according to the above [1] or [2], wherein t is 5 to 200.
[4]
The imide-amide according to any one of the above [1] to [3], wherein Y 1 is a group consisting of a divalent aromatic group having 4 to 39 carbon atoms, diaminoalkylcyclohexane or a combination thereof. Acid copolymer.
[5]
The imide-amide according to any one of the above [1] to [4], wherein X 1 is a group consisting of a tetravalent aliphatic group having 4 to 39 carbon atoms, an alicyclic group, or a combination thereof. Acid copolymer.
[6]
The imide-amide acid copolymer according to any one of the above [1] to [5], wherein X 2 is a tetravalent aromatic group having 4 to 39 carbon atoms.
[7]
The imide moiety (I) has a structural unit IA derived from a tetracarboxylic dianhydride and a structural unit IB derived from a diamine.
The amic acid moiety (A) has a structural unit AA derived from tetracarboxylic dianhydride and a structural unit AB derived from diamine.
Constituent unit IA comprises a structural unit (A-1) derived from alicyclic tetracarboxylic dianhydride (a-1).
The imide-amide acid copolymer according to any one of the above [1] to [6], wherein the structural unit IB and the structural unit AB contain a structural unit derived from an aromatic diamine having an ether bond.
[8]
The imide moiety (I) has a structural unit IA derived from a tetracarboxylic dianhydride and a structural unit IB derived from a diamine.
The amic acid moiety (A) has a structural unit AA derived from tetracarboxylic dianhydride and a structural unit AB derived from diamine.
Constituent unit IA comprises a structural unit (A-1) derived from alicyclic tetracarboxylic dianhydride (a-1).
The imide-amide acid copolymer according to any one of the above [1] to [6], wherein the structural unit IB and the structural unit AB contain a structural unit derived from a fluorine-containing aromatic diamine.
[9]
The imide-amide acid according to the above [7] or [8], wherein the structural unit IB and the structural unit AB include a structural unit (B-1) derived from a compound represented by the following formula (b-1). Polymer.
[10]
構成単位AAが、テトラカルボン酸二無水物(a−2)に由来する構成単位(A−2)を含み、
構成単位(A−2)が、下記式(a−2−1)で表される化合物に由来する構成単位(A−2−1)、下記式(a−2−2)で表される化合物に由来する構成単位(A−2−2)、下記式(a−2−3)で表される化合物に由来する構成単位(A−2−3)、及び下記式(a−2−4)で表される化合物に由来する構成単位(A−2−4)からなる群から選ばれる少なくとも1つを含む、前記[7]〜[9]のいずれか1つに記載のイミド−アミド酸共重合体。[10]
Constituent unit AA comprises a structural unit (A-2) derived from tetracarboxylic dianhydride (a-2).
The structural unit (A-2) is derived from the compound represented by the following formula (a-2-1), the structural unit (A-2-1), and the compound represented by the following formula (a-2-2). Constituent unit derived from (A-2-2), structural unit derived from a compound represented by the following formula (a-2-3) (A-2-3), and the following formula (a-2-4). The imide-amide acid according to any one of the above [7] to [9], which comprises at least one selected from the group consisting of structural units (A-2-4) derived from the compound represented by. Polymer.
[11]
更に下記式(b−2)で表される化合物に由来する構成単位(B−2)を含む、前記[7]〜[10]のいずれか1つに記載のイミド−アミド酸共重合体。[11]
The imide-amide acid copolymer according to any one of the above [7] to [10], further containing a structural unit (B-2) derived from a compound represented by the following formula (b-2).
(式(b−2)中、Z1及びZ2はそれぞれ独立に2価の脂肪族基、又は2価の芳香族基を示し、R1及びR2はそれぞれ独立に1価の芳香族基又は1価の脂肪族基を示し、R3及びR4はそれぞれ独立に1価の脂肪族基を示し、R5及びR6は、それぞれ独立に1価の脂肪族基又は1価の芳香族基を示し、m及びnはそれぞれ独立に1以上の整数を示し、mとnとの和は2〜1000の整数を示す。但し、R1及びR2の少なくとも一方は1価の芳香族基を示す。)
(In formula (b-2), Z 1 and Z 2 each independently represent a divalent aliphatic group or a divalent aromatic group, and R 1 and R 2 each independently represent a monovalent aromatic group. Or monovalent aliphatic groups, R 3 and R 4 independently represent monovalent aliphatic groups, and R 5 and R 6 independently represent monovalent aliphatic groups or monovalent aromatic groups, respectively. Indicates a group, m and n each independently represent an integer of 1 or more, and the sum of m and n represents an integer of 2 to 1000, provided that at least one of R 1 and R 2 is a monovalent aromatic group. Shows.)
[12]
前記R1及びR2が、フェニル基であり、R3及びR4が、メチル基である、前記[11]に記載のイミド−アミド酸共重合体。
[13]
イミド−アミド酸共重合体中のポリオルガノシロキサン単位の含有量が5〜45質量%である、前記[11]又は[12]に記載のイミド−アミド酸共重合体。
[14]
構成単位(A−1)が、下記式(a−1−1)で表される化合物に由来する構成単位(A−1−1)、下記式(a−1−2)で表される化合物に由来する構成単位(A−1−2)、及び下記式(a−1−3)で表される化合物に由来する構成単位(A−1−3)からなる群から選ばれる少なくとも1つを含む、前記[7]〜[13]のいずれか1つに記載のイミド−アミド酸共重合体。[12]
The imide-amide acid copolymer according to the above [11], wherein R 1 and R 2 are phenyl groups, and R 3 and R 4 are methyl groups.
[13]
The imide-amide acid copolymer according to the above [11] or [12], wherein the content of the polyorganosiloxane unit in the imide-amide acid copolymer is 5 to 45% by mass.
[14]
The structural unit (A-1) is a structural unit (A-1-1) derived from a compound represented by the following formula (a-1-1), and a compound represented by the following formula (a-1-2). At least one selected from the group consisting of the structural unit (A-1-2) derived from and the structural unit (A-1--3) derived from the compound represented by the following formula (a-1-3). The imide-amide acid copolymer according to any one of the above [7] to [13], which comprises.
[15]
構成単位IB及び構成単位ABが、更に下記式(b−3)で表される化合物に由来する構成単位(B−3)を含む、前記[7]〜[14]のいずれか1つに記載のイミド−アミド酸共重合体。[15]
Described in any one of the above [7] to [14], wherein the structural unit IB and the structural unit AB further include a structural unit (B-3) derived from a compound represented by the following formula (b-3). Imid-amide acid copolymer.
(式(b−3)中、Rはそれぞれ独立して、水素原子、フッ素原子又は炭素数1〜5のアルキル基を表わす。)
(In formula (b-3), R independently represents a hydrogen atom, a fluorine atom, or an alkyl group having 1 to 5 carbon atoms.)
[16]
前記[1]〜[15]のいずれか1つに記載の共重合体が有機溶媒に溶解してなる、ワニス。
[17]
前記[1]〜[15]のいずれか1つに記載の共重合体中のアミド酸部位をイミド化してなるポリイミド樹脂を含む、ポリイミドフィルム。
[18]
前記ポリイミド樹脂の重量平均分子量(Mw)が100,000〜300,000である、前記[17]に記載のポリイミドフィルム。
[19]
下記工程1及び工程2を有する、イミド−アミド酸共重合体の製造方法。
工程1:イミド部分(I)を構成するテトラカルボン酸成分と、ジアミン成分とを反応させ、イミドオリゴマーを得る工程
工程2:工程1で得られたイミドオリゴマーと、アミド酸部分(A)を構成するテトラカルボン酸成分を反応させ、下記式(1)で表される、イミド部分(I)とアミド酸部分(A)とからなる繰り返し単位を含む、イミド−アミド酸共重合体を得る工程[16]
A varnish in which the copolymer according to any one of [1] to [15] is dissolved in an organic solvent.
[17]
A polyimide film containing a polyimide resin obtained by imidizing an amic acid moiety in the copolymer according to any one of [1] to [15].
[18]
The polyimide film according to the above [17], wherein the polyimide resin has a weight average molecular weight (Mw) of 100,000 to 300,000.
[19]
A method for producing an imide-amidoic acid copolymer, which comprises the following steps 1 and 2.
Step 1: The tetracarboxylic acid component constituting the imide moiety (I) is reacted with the diamine component to obtain an imide oligomer. Step 2: The imide oligomer obtained in Step 1 and the amic acid moiety (A) are formed. A step of reacting the tetracarboxylic acid component to obtain an imide-amide acid copolymer containing a repeating unit consisting of an imide moiety (I) and an amic acid moiety (A) represented by the following formula (1).
(式(1)中、
X1は炭素数4〜39の4価の脂肪族基、脂環基、芳香族基又はこれらの組み合わせからなる基であって、結合基として−O−、−SO2−、−CO−、−CH2−、−C(CH3)2−、−C2H4O−及び−S−からなる群から選ばれる少なくとも1つを有していてもよい。
X2はX1とは異なる炭素数4〜39の4価の脂肪族基、脂環基、芳香族基又はこれらの組み合わせからなる基であって、結合基として−O−、−SO2−、−CO−、−CH2−、−C(CH3)2−、−C2H4O−及び−S−からなる群から選ばれる少なくとも1つを有していてもよい。
Y1は炭素数4〜39の2価の脂肪族基、脂環基、芳香族基又はこれらの組み合わせからなる基であって、結合基として−O−、−SO2−、−CO−、−CH2−、−C(CH3)2−、−C2H4O−及び−S−からなる群から選ばれる少なくとも1つを有していてもよく、複数のY1は同一の組成を有する。
s及びtは正の整数である。)
(In equation (1),
X 1 is a group consisting of a tetravalent aliphatic group having 4 to 39 carbon atoms, an alicyclic group, an aromatic group or a combination thereof, and has -O-, -SO 2- , -CO- as a linking group. -CH 2 -, - C (CH 3) 2 -, - it may have at least one member selected from C 2 H 4 group consisting of O- and -S-.
X 2 is a tetravalent aliphatic group, an alicyclic group, an aromatic group, or combinations of these groups having a carbon number of 4-39, which is different from the X 1, -O a bonding group -, - SO 2 - , -CO-, -CH 2- , -C (CH 3 ) 2- , -C 2 H 4 O- and -S- may have at least one selected from the group.
Y 1 is a group consisting of a divalent aliphatic group having 4 to 39 carbon atoms, an alicyclic group, an aromatic group or a combination thereof, and as a linking group, -O-, -SO 2- , -CO-, -CH 2 -, - C (CH 3) 2 -, - it may have at least one member selected from C 2 H 4 group consisting of O- and -S-, a plurality of Y 1 are the same composition Have.
s and t are positive integers. )
[20]
工程1で得られるイミドオリゴマーが分子鎖の主鎖の両末端にアミノ基を有する、前記[19]に記載のイミド−アミド酸共重合体の製造方法。
[21]
工程1において、テトラカルボン酸成分に対するジアミン成分のモル比(ジアミン/テトラカルボン酸)が、1.01〜2である、前記[19]又は[20]に記載のイミド−アミド酸共重合体の製造方法。
[22]
工程1で用いられるイミド部分(I)を構成するテトラカルボン酸成分が、脂環式テトラカルボン酸成分であり、工程2で用いられるアミド酸部分(A)を構成するテトラカルボン酸成分が、芳香族テトラカルボン酸成分である、前記[19]〜[21]のいずれか1つに記載のイミド−アミド酸共重合体の製造方法。
[23]
工程2終了後に、ポリオルガノシロキサン単位を含有するジアミンを反応させる、前記[19]〜[22]のいずれか1つに記載のイミド−アミド酸共重合体の製造方法。[20]
The method for producing an imide-amide acid copolymer according to the above [19], wherein the imide oligomer obtained in step 1 has amino groups at both ends of the main chain of the molecular chain.
[21]
The imide-amide acid copolymer according to the above [19] or [20], wherein in step 1, the molar ratio of the diamine component to the tetracarboxylic acid component (diamine / tetracarboxylic acid) is 1.01 to 2. Production method.
[22]
The tetracarboxylic acid component constituting the imide moiety (I) used in step 1 is an alicyclic tetracarboxylic acid component, and the tetracarboxylic acid component constituting the amic acid moiety (A) used in step 2 is aromatic. The method for producing an imide-amidoic acid copolymer according to any one of the above [19] to [21], which is a group tetracarboxylic acid component.
[23]
The method for producing an imide-amide acid copolymer according to any one of [19] to [22] above, wherein a diamine containing a polyorganosiloxane unit is reacted after the completion of step 2.
本発明によれば、保存安定性と成形加工性を両立することができるポリイミド樹脂の前駆体であるイミド−アミド酸共重合体及びその製造方法、該共重合体を含むワニス、並びにポリイミドフィルムを提供することができる。 According to the present invention, an imide-amidoic acid copolymer which is a precursor of a polyimide resin capable of achieving both storage stability and moldability, a method for producing the same, a varnish containing the copolymer, and a polyimide film are provided. Can be provided.
[イミド−アミド酸共重合体]
本発明のイミド−アミド酸共重合体は、下記式(1)で表される、イミド部分(I)とアミド酸部分(A)とからなる繰り返し単位を含む。[Imid-amide acid copolymer]
The imide-amide acid copolymer of the present invention contains a repeating unit composed of an imide moiety (I) and an amic acid moiety (A) represented by the following formula (1).
(式(1)中、
X1は炭素数4〜39の4価の脂肪族基、脂環基、芳香族基又はこれらの組み合わせからなる基であって、結合基として−O−、−SO2−、−CO−、−CH2−、−C(CH3)2−、−C2H4O−及び−S−からなる群から選ばれる少なくとも1つを有していてもよい。
X2はX1とは異なる炭素数4〜39の4価の脂肪族基、脂環基、芳香族基又はこれらの組み合わせからなる基であって、結合基として−O−、−SO2−、−CO−、−CH2−、−C(CH3)2−、−C2H4O−及び−S−からなる群から選ばれる少なくとも1つを有していてもよい。
Y1は炭素数4〜39の2価の脂肪族基、脂環基、芳香族基又はこれらの組み合わせからなる基であって、結合基として−O−、−SO2−、−CO−、−CH2−、−C(CH3)2−、−C2H4O−及び−S−からなる群から選ばれる少なくとも1つを有していてもよく、複数のY1は同一の組成を有する。
s及びtは正の整数である。)
(In equation (1),
X 1 is a group consisting of a tetravalent aliphatic group having 4 to 39 carbon atoms, an alicyclic group, an aromatic group or a combination thereof, and has -O-, -SO 2- , -CO- as a linking group. -CH 2 -, - C (CH 3) 2 -, - it may have at least one member selected from C 2 H 4 group consisting of O- and -S-.
X 2 is a tetravalent aliphatic group, an alicyclic group, an aromatic group, or combinations of these groups having a carbon number of 4-39, which is different from the X 1, -O a bonding group -, - SO 2 - , -CO-, -CH 2- , -C (CH 3 ) 2- , -C 2 H 4 O- and -S- may have at least one selected from the group.
Y 1 is a group consisting of a divalent aliphatic group having 4 to 39 carbon atoms, an alicyclic group, an aromatic group or a combination thereof, and as a linking group, -O-, -SO 2- , -CO-, -CH 2 -, - C (CH 3) 2 -, - it may have at least one member selected from C 2 H 4 group consisting of O- and -S-, a plurality of Y 1 are the same composition Have.
s and t are positive integers. )
<イミド部分(I)>
本発明のイミド−アミド酸共重合体を構成するイミド部分(I)は、前記式(1)の(I)で示される部分である。
前記式(1)において、X1は、炭素数4〜39の4価の脂肪族基、脂環基、芳香族基又はこれらの組み合わせからなる基であって、結合基として−O−、−SO2−、−CO−、−CH2−、−C(CH3)2−、−C2H4O−及び−S−からなる群から選ばれる少なくとも1つを有していてもよく、なかでも、炭素数4〜39の4価の脂肪族基、脂環基又はこれらの組み合わせからなる基であることが好ましく、炭素数4〜39の4価の脂環基からなる基であることがより好ましい。
X1が脂肪族基又は脂環基であることによって、ポリイミドの透明性が良好となりリタデーションが低下するため、好ましい。また、ポリイミドフィルムの伸びが向上するため好ましい。
X1は、後述するテトラカルボン酸二無水物に由来する構成単位IAの原料となるテトラカルボン酸二無水物から2つのジカルボン酸無水物部分(4つのカルボキシ基部分)を除いたものであることが好ましい。<Imide portion (I)>
The imide moiety (I) constituting the imide-amide acid copolymer of the present invention is the moiety represented by (I) of the above formula (1).
In the above formula (1), X 1 is a group consisting of a tetravalent aliphatic group having 4 to 39 carbon atoms, an alicyclic group, an aromatic group or a combination thereof, and has −O−, − as a linking group. It may have at least one selected from the group consisting of SO 2- , -CO-, -CH 2- , -C (CH 3 ) 2- , -C 2 H 4 O- and -S-. Among them, a group consisting of a tetravalent aliphatic group having 4 to 39 carbon atoms, an alicyclic group or a combination thereof is preferable, and a group consisting of a tetravalent alicyclic group having 4 to 39 carbon atoms. Is more preferable.
When X 1 is an aliphatic group or an alicyclic group, the transparency of the polyimide is improved and the retardation is lowered, which is preferable. Further, it is preferable because the elongation of the polyimide film is improved.
X 1 is obtained by removing two dicarboxylic acid anhydride portions (four carboxy group portions) from the tetracarboxylic acid dianhydride which is a raw material of the constituent unit IA derived from the tetracarboxylic acid dianhydride described later. Is preferable.
前記式(1)において、Y1は、炭素数4〜39の2価の脂肪族基、脂環基、芳香族基又はこれらの組み合わせからなる基であって、結合基として−O−、−SO2−、−CO−、−CH2−、−C(CH3)2−、−C2H4O−及び−S−からなる群から選ばれる少なくとも1つを有していてもよく、なかでも、炭素数4〜39の2価の芳香族基、ジアミノアルキルシクロヘキサン又はこれらの組み合わせからなる基であることが好ましい。
ここで、複数のY1は同一の組成を有する。「同一の組成」とは、1種類のジアミン由来のY1の構造を有する場合、前記式(1)に示されるY1は全て同じ構造を有することをいい、複数のジアミン由来のY1の構造を有する場合、前記式(1)に示される各Y1には同じ割合でそれぞれのジアミン由来のY1の構造が存在することをいう。すなわち、複数のジアミン由来のY1の構造を有する場合、各分子で見れば、各Y1が異なっていたとしても、全ての分子を見れば、全てのY1の位置には同じ割合でそれぞれのジアミン由来のY1の構造が存在する。
Y1は、後述するジアミンに由来する構成単位IBの原料となるジアミンから
2つのアミノ基部分を除いたものであることが好ましい。In the above formula (1), Y 1 is a group consisting of a divalent aliphatic group having 4 to 39 carbon atoms, an alicyclic group, an aromatic group or a combination thereof, and as a linking group, -O-,-. It may have at least one selected from the group consisting of SO 2- , -CO-, -CH 2- , -C (CH 3 ) 2- , -C 2 H 4 O- and -S-. Among them, a divalent aromatic group having 4 to 39 carbon atoms, a diaminoalkylcyclohexane or a group composed of a combination thereof is preferable.
Here, a plurality of Y 1 have the same composition. The "same composition", 1 if the type having a structure of Y 1 from diamine refers to Y 1 represented by the formula (1) having all the same structure, from multiple diamines of Y 1 if they have structural means that each Y 1 represented by the formula (1) it is present the structure of Y 1 from each diamine in the same proportion. That is, when having a structure of Y 1 derived from a plurality of diamines, even if each Y 1 is different in each molecule, in all the molecules, the positions of all Y 1 are in the same proportion. There is a structure of Y 1 derived from diamine.
It is preferable that Y 1 is obtained by removing the two amino group portions from the diamine which is the raw material of the structural unit IB derived from the diamine described later.
前記式(1)において、sはイミド部分(I)中の繰り返し単位の数であって、正の整数である。
sは、保存安定性と成形加工性の観点から、1〜20であることが好ましく、1〜15であることがより好ましく、1〜10であることが更に好ましく、1〜5であることがより更に好ましい。イミド部分(I)の平均繰り返し数、すなわち、sの平均値は、1〜10であることが好ましく、1.5〜9であることがより好ましく、1.5〜8であることが更に好ましく、1.7〜5であることがより更に好ましい。前記イミド部分(I)の平均繰り返し数は、後述のポリイミドワニスやポリイミドフィルムに含まれる全部のイミド−アミド酸共重合体のイミド部分(I)の繰り返し数の平均値のことをいい、sの平均値は、後述のポリイミドワニスやポリイミドフィルムに含まれる全部のイミド−アミド酸共重合体のsの平均値のことをいう。In the formula (1), s is the number of repeating units in the imide moiety (I) and is a positive integer.
From the viewpoint of storage stability and moldability, s is preferably 1 to 20, more preferably 1 to 15, further preferably 1 to 10, and preferably 1 to 5. Even more preferable. The average number of repetitions of the imide moiety (I), that is, the average value of s is preferably 1 to 10, more preferably 1.5 to 9, and even more preferably 1.5 to 8. It is even more preferably 1.7 to 5. The average number of repetitions of the imide portion (I) refers to the average number of repetitions of the imide portion (I) of all the imide-amide acid copolymers contained in the polyimide varnish and the polyimide film described later, and the average number of repetitions of s. The average value refers to the average value of s of all the imide-amidic acid copolymers contained in the polyimide varnish and the polyimide film described later.
<アミド酸部分(A)>
本発明のイミド−アミド酸共重合体を構成するアミド酸部分(A)は、前記式(1)の(A)で示される部分である。
前記式(1)において、X2は、X1とは異なる炭素数4〜39の4価の脂肪族基、脂環基、芳香族基又はこれらの組み合わせからなる基であって、結合基として−O−、−SO2−、−CO−、−CH2−、−C(CH3)2−、−C2H4O−及び−S−からなる群から選ばれる少なくとも1つを有していてもよく、なかでも、炭素数4〜39の4価の芳香族基であることが好ましい。
X2が芳香族基であることによって、ポリイミドの耐熱性が向上するため、好ましい。
X2は、後述するテトラカルボン酸二無水物に由来する構成単位AAの原料となるテトラカルボン酸二無水物から二つのカルボン酸無水物部分を除いたものであることが好ましい。<Amidic acid moiety (A)>
The amic acid moiety (A) constituting the imide-amidoic acid copolymer of the present invention is the moiety represented by (A) of the above formula (1).
In the formula (1), X 2 is a group composed of a tetravalent aliphatic group having 4 to 39 carbon atoms, an alicyclic group, an aromatic group, or a combination thereof, which is different from X 1, and serves as a bonding group. -O -, - SO 2 -, - CO -, - CH 2 -, - C (CH 3) 2 -, - C 2 H 4 at least one of a member selected from the group consisting of O- and -S- It may be a tetravalent aromatic group having 4 to 39 carbon atoms.
It is preferable that X 2 is an aromatic group because the heat resistance of the polyimide is improved.
It is preferable that X 2 is obtained by removing two carboxylic acid anhydride portions from the tetracarboxylic acid dianhydride which is a raw material of the structural unit AA derived from the tetracarboxylic acid dianhydride which will be described later.
前記式(1)において、Y1はイミド部分(I)で説明したものと同じである。
Y1は、後述するジアミンに由来する構成単位ABの原料となるジアミンから二つのアミノ基部分を除いたものであることが好ましい。In the formula (1), Y 1 is the same as that described for the imide moiety (I).
It is preferable that Y 1 is obtained by removing the two amino group portions from the diamine which is the raw material of the constituent unit AB derived from the diamine described later.
前記式(1)において、tは本発明のイミド−アミド酸共重合体に含まれるイミド部分(I)とアミド酸部分(A)とからなる繰り返し単位の数であって、正の整数である
tは、保存安定性と成形加工性の観点から、5〜200であることが好ましく、6〜150であることがより好ましく、10〜120であることが更に好ましい。イミド部分(I)とアミド酸部分(A)とからなる繰り返し単位の平均繰り返し数、すなわち、tの平均値は、5〜200であることが好ましく、6〜150であることがより好ましく、10〜120であることが更に好ましい。前記イミド部分(I)とアミド酸部分(A)とからなる繰り返し単位の平均繰り返し数は、後述のポリイミドワニスやポリイミドフィルムに含まれる全部のイミド−アミド酸共重合体のイミド部分(I)とアミド酸部分(A)とからなる繰り返し単位の繰り返し数のことをいい、tの平均値は、後述のポリイミドワニスやポリイミドフィルムに含まれる全部のイミド−アミド酸共重合体のtの平均値のことをいう。In the formula (1), t is the number of repeating units consisting of the imide moiety (I) and the amic acid moiety (A) contained in the imide-amidoic acid copolymer of the present invention, and is a positive integer. From the viewpoint of storage stability and moldability, t is preferably 5 to 200, more preferably 6 to 150, and even more preferably 10 to 120. The average number of repetitions of the repeating unit composed of the imide moiety (I) and the amic acid moiety (A), that is, the average value of t is preferably 5 to 200, more preferably 6 to 150, and 10 It is more preferably ~ 120. The average number of repetitions of the repeating unit composed of the imide moiety (I) and the amic acid moiety (A) is the same as the imide moiety (I) of all the imide-amide acid copolymers contained in the polyimide varnish and the polyimide film described later. It refers to the number of repetitions of the repeating unit composed of the amic acid moiety (A), and the average value of t is the average value of t of all the imide-amidic acid copolymers contained in the polyimide varnish and the polyimide film described later. Say that.
従来のイミド−アミド酸共重合体は、イミド部分とアミド酸部分が、ランダムに存在するのに対して、本発明のイミド−アミド酸共重合体は、イミド部分(I)とアミド酸部分(A)が特定の構造を有することで、保存安定性と成形加工性を両立することができるものと考えられる。 In the conventional imide-amide acid copolymer, the imide moiety and the amic acid moiety are randomly present, whereas in the imide-amide acid copolymer of the present invention, the imide moiety (I) and the amic acid moiety ( It is considered that when A) has a specific structure, both storage stability and molding processability can be achieved at the same time.
<イミド−アミド共重合体の実施形態>
本発明のイミド−アミド酸共重合体は、前記式(1)で表される、イミド部分(I)とアミド酸部分(A)とからなる繰り返し単位を含むが、その具体的な実施形態について以下に示す。<Imide-amide copolymer embodiment>
The imide-amide acid copolymer of the present invention contains a repeating unit composed of an imide moiety (I) and an amic acid moiety (A) represented by the above formula (1), and the specific embodiment thereof. It is shown below.
本発明のイミド−アミド酸共重合体の第一の具体的な実施形態として、前記イミド部分(I)が、テトラカルボン酸二無水物に由来する構成単位IA及びジアミンに由来する構成単位IBを有し、前記アミド酸部分(A)が、テトラカルボン酸二無水物に由来する構成単位AA及びジアミンに由来する構成単位ABを有し、構成単位IAが、脂環式テトラカルボン酸二無水物(a−1)に由来する構成単位(A−1)を含み、構成単位IB及び構成単位ABが、エーテル結合を有する芳香族ジアミンに由来する構成単位を含む。 As the first specific embodiment of the imide-amide acid copolymer of the present invention, the imide moiety (I) may be a structural unit IA derived from tetracarboxylic acid dianhydride and a structural unit IB derived from diamine. The amic acid moiety (A) has a structural unit AA derived from tetracarboxylic acid dianhydride and a structural unit AB derived from diamine, and the structural unit IA is an alicyclic tetracarboxylic acid dianhydride. The structural unit (A-1) derived from (a-1) is contained, and the structural unit IB and the structural unit AB include a structural unit derived from an aromatic diamine having an ether bond.
また、本発明のイミド−アミド酸共重合体の第二の具体的な実施形態として、前記イミド部分(I)が、テトラカルボン酸二無水物に由来する構成単位IA及びジアミンに由来する構成単位IBを有し、前記アミド酸部分(A)が、テトラカルボン酸二無水物に由来する構成単位AA及びジアミンに由来する構成単位ABを有し、構成単位IAが、脂環式テトラカルボン酸二無水物(a−1)に由来する構成単位(A−1)を含み、構成単位IB及び構成単位ABが、含フッ素芳香族ジアミンに由来する構成単位を含む。 Further, as a second specific embodiment of the imide-amide acid copolymer of the present invention, the imide moiety (I) is a structural unit derived from tetracarboxylic acid dianhydride and a structural unit derived from diamine. It has an IB, the amic acid moiety (A) has a structural unit AA derived from tetracarboxylic acid dianhydride and a structural unit AB derived from diamine, and the structural unit IA is an alicyclic tetracarboxylic acid dianhydride. It contains a structural unit (A-1) derived from the anhydride (a-1), and the structural unit IB and the structural unit AB include a structural unit derived from a fluoroaromatic diamine.
(構成単位IA)
構成単位IAは、本発明の共重合体のイミド部分(I)に占めるテトラカルボン酸二無水物に由来する構成単位であって、脂環式テトラカルボン酸二無水物に由来する構成単位を含むことが好ましく、脂環式テトラカルボン酸二無水物(a−1)に由来する構成単位(A−1)を含むことがより好ましい。
なお、本明細書において、脂環式テトラカルボン酸二無水物とは4つのカルボキシ基が結合する炭素原子の少なくとも1つが脂環構造を構成しているテトラカルボン酸二無水物を意味し、芳香族テトラカルボン酸二無水物とは4つのカルボキシ基が結合する炭素原子の少なくとも1つが芳香環構造を構成しているテトラカルボン酸二無水物を意味し、脂肪族テトラカルボン酸二無水物とは4つのカルボキシ基が結合する炭素原子の全てが脂肪族炭素であるテトラカルボン酸二無水物を意味する。(Constituent unit IA)
The structural unit IA is a structural unit derived from the tetracarboxylic dianhydride occupying the imide portion (I) of the copolymer of the present invention, and includes a structural unit derived from the alicyclic tetracarboxylic dianhydride. It is preferable, and it is more preferable to contain a structural unit (A-1) derived from the alicyclic tetracarboxylic dianhydride (a-1).
In the present specification, the alicyclic tetracarboxylic dianhydride means a tetracarboxylic dianhydride in which at least one of the carbon atoms to which four carboxy groups are bonded constitutes an alicyclic structure, and is aromatic. The group tetracarboxylic dianhydride means a tetracarboxylic dianhydride in which at least one of the carbon atoms to which four carboxy groups are bonded constitutes an aromatic ring structure, and the aliphatic tetracarboxylic dianhydride is an aliphatic tetracarboxylic dianhydride. It means tetracarboxylic dianhydride in which all of the carbon atoms to which the four carboxy groups are bonded are aliphatic carbons.
構成単位(A−1)は、脂環式テトラカルボン酸二無水物(a−1)に由来する構成単位である。
構成単位(A−1)は、好ましくは下記式(a−1−1)で表される化合物に由来する構成単位(A−1−1)、下記式(a−1−2)で表される化合物に由来する構成単位(A−1−2)、及び下記式(a−1−3)で表される化合物に由来する構成単位(A−1−3)からなる群から選ばれる少なくとも1つを含み、高透明性、高耐熱性及び低残留応力の観点から、より好ましくは下記式(a−1−1)で表される化合物に由来する構成単位(A−1−1)を含む。式(a−1−1)で表される化合物は、ノルボルナン−2−スピロ−α−シクロペンタノン−α’−スピロ−2’’−ノルボルナン−5,5’’,6,6’’−テトラカルボン酸二無水物(CpODA)であり、式(a−1−3)で表される化合物は、5,5’−ビス−2−ノルボルネン−5,5’,6,6’−テトラカルボン酸−5,5’,6,6’−二無水物(BNBDA)である。The structural unit (A-1) is a structural unit derived from the alicyclic tetracarboxylic dianhydride (a-1).
The structural unit (A-1) is preferably a structural unit (A-1-1) derived from a compound represented by the following formula (a-1-1), and is represented by the following formula (a-1-2). At least one selected from the group consisting of a structural unit (A-1-2) derived from a compound and a structural unit (A-1--3) derived from a compound represented by the following formula (a-1-3). From the viewpoint of high transparency, high heat resistance and low residual stress, it more preferably contains a structural unit (A-1-1) derived from a compound represented by the following formula (a-1-1). .. The compound represented by the formula (a-1-1) is norbornane-2-spiro-α-cyclopentanone-α'-spiro-2''-norbornane-5,5'', 6,6''-. The compound represented by the formula (a-1-3), which is a tetracarboxylic dianhydride (CpODA), is 5,5'-bis-2-norbornne-5,5', 6,6'-tetracarboxylic. Acid-5,5', 6,6'-dianhydride (BNBDA).
構成単位(A−1)中における、構成単位(A−1−1)〜(A−1−3)の合計の比率は、好ましくは45モル%以上、より好ましくは70モル%以上、更に好ましくは90モル%以上、特に好ましくは99モル%以上である。その比率の上限値は特に限定されず、即ち、100モル%である。
構成単位(A−1)は、構成単位(A−1−1)〜(A−1−3)から選ばれる少なくとも1種を含んでいればよく、構成単位(A−1−1)〜(A−1−3)から選ばれるいずれか1種のみからなっていてもよい。
特に、構成単位(A−1)中における構成単位(A−1−1)の比率は、好ましくは45モル%以上、より好ましくは70モル%以上、更に好ましくは90モル%以上、特に好ましくは99モル%以上である。その比率の上限値は特に限定されず、即ち、100モル%である。The total ratio of the structural units (A-1-1) to (A-1--3) in the structural unit (A-1) is preferably 45 mol% or more, more preferably 70 mol% or more, still more preferably. Is 90 mol% or more, particularly preferably 99 mol% or more. The upper limit of the ratio is not particularly limited, that is, 100 mol%.
The constituent unit (A-1) may include at least one selected from the constituent units (A-1-1) to (A-1--3), and the constituent units (A-1-1) to (A-1-1). It may consist of only one of A-1-3).
In particular, the ratio of the structural unit (A-1-1) in the structural unit (A-1) is preferably 45 mol% or more, more preferably 70 mol% or more, still more preferably 90 mol% or more, and particularly preferably 90 mol% or more. It is 99 mol% or more. The upper limit of the ratio is not particularly limited, that is, 100 mol%.
構成単位(A−1)は、式(a−1−1)〜(a−1−3)で表される化合物以外の脂環式テトラカルボン酸二無水物に由来する構成単位を有していてもよい。かかる脂環式テトラカルボン酸二無水物としては、1,2,3,4−シクロブタンテトラカルボン酸二無水物、1,2,3,4−シクロペンタンテトラカルボン酸二無水物、1,2,4,5−シクロヘキサンテトラカルボン酸二無水物、ビシクロ[2.2.2]オクタ−7−エン−2,3,5,6−テトラカルボン酸二無水物、及びジシクロヘキシルテトラカルボン酸二無水物等が挙げられる。これらのなかでも構成単位(A−1)中における式(a−1−1)〜(a−1−3)で表される化合物以外の脂環式テトラカルボン酸二無水物に由来する構成単位としては、1,2,4,5−シクロヘキサンテトラカルボン酸二無水物に由来する構成単位が好ましい。
脂環式テトラカルボン酸二無水物(a−1)は1種を単独でも、2種以上を組み合わせてもよい。The structural unit (A-1) has a structural unit derived from an alicyclic tetracarboxylic dianhydride other than the compounds represented by the formulas (a-1-1) to (a-1-3). You may. Examples of such alicyclic tetracarboxylic acid dianhydride include 1,2,3,4-cyclobutanetetracarboxylic acid dianhydride, 1,2,3,4-cyclopentanetetracarboxylic acid dianhydride, 1,2, 4,5-Cyclohexanetetracarboxylic acid dianhydride, bicyclo [2.2.2] octa-7-ene-2,3,5,6-tetracarboxylic acid dianhydride, dicyclohexyltetracarboxylic acid dianhydride, etc. Can be mentioned. Among these, structural units derived from alicyclic tetracarboxylic dianhydrides other than the compounds represented by the formulas (a-1-1) to (a-1--3) in the structural unit (A-1). As, a structural unit derived from 1,2,4,5-cyclohexanetetracarboxylic dianhydride is preferable.
The alicyclic tetracarboxylic dianhydride (a-1) may be used alone or in combination of two or more.
(構成単位AA)
構成単位AAは、本発明の共重合体のアミド酸部分(A)に占めるテトラカルボン酸二無水物に由来する構成単位であって、脂環式テトラカルボン酸二無水物(a−1)以外のテトラカルボン酸二無水物(a−2)に由来する構成単位(A−2)を含むことがより好ましい。(Constituent unit AA)
The structural unit AA is a structural unit derived from the tetracarboxylic acid dianhydride occupying the amic acid portion (A) of the copolymer of the present invention, and is other than the alicyclic tetracarboxylic acid dianhydride (a-1). It is more preferable to contain a structural unit (A-2) derived from the tetracarboxylic acid dianhydride (a-2).
構成単位(A−2)は、脂環式テトラカルボン酸二無水物(a−1)以外のテトラカルボン酸二無水物(a−2)に由来する構成単位である。テトラカルボン酸二無水物(a−2)としては、芳香族テトラカルボン酸二無水物、及び脂肪族テトラカルボン酸二無水物からなる群から選ばれる1種以上が挙げられ、芳香族テトラカルボン酸二無水物を含むことが好ましい。即ち、構成単位(A−2)は、芳香族テトラカルボン酸二無水物に由来する構成単位を含むことが好ましい。
すなわち、構成単位AAは、芳香族テトラカルボン酸二無水物に由来する構成単位を含むことが好ましい。
構成単位(A−2)は、高耐熱性、及び低残留応力の観点から、下記式(a−2−1)で表される化合物に由来する構成単位(A−2−1)、下記式(a−2−2)で表される化合物に由来する構成単位(A−2−2)、下記式(a−2−3)で表される化合物に由来する構成単位(A−2−3)、及び下記式(a−2−4)で表される化合物に由来する構成単位(A−2−4)からなる群から選ばれる少なくとも1つを含むことが好ましい。The structural unit (A-2) is a structural unit derived from a tetracarboxylic dianhydride (a-2) other than the alicyclic tetracarboxylic dianhydride (a-1). Examples of the tetracarboxylic acid dianhydride (a-2) include one or more selected from the group consisting of aromatic tetracarboxylic acid dianhydride and aliphatic tetracarboxylic acid dianhydride, and aromatic tetracarboxylic acid. It preferably contains a dianhydride. That is, the structural unit (A-2) preferably contains a structural unit derived from aromatic tetracarboxylic dianhydride.
That is, the structural unit AA preferably contains a structural unit derived from an aromatic tetracarboxylic dianhydride.
The structural unit (A-2) is a structural unit (A-2-1) derived from a compound represented by the following formula (a-2-1) from the viewpoint of high heat resistance and low residual stress, and the following formula. A structural unit (A-2-2) derived from a compound represented by (a-2-2) and a structural unit (A-2-3) derived from a compound represented by the following formula (a-2-3). ), And at least one selected from the group consisting of the structural unit (A-2-4) derived from the compound represented by the following formula (a-2-4).
式(a−2−1)で表される化合物は、ビフェニルテトラカルボン酸二無水物(BPDA)であり、その具体例としては、下記式(a−2−1s)で表される3,3’,4,4’−ビフェニルテトラカルボン酸二無水物(s−BPDA)、下記式(a−2−1a)で表される2,3,3’,4’−ビフェニルテトラカルボン酸二無水物(a−BPDA)、下記式(a−2−1i)で表される2,2’,3,3’−ビフェニルテトラカルボン酸二無水物(i−BPDA)が挙げられる。中でも、下記式(a−2−1s)で表される3,3’,4,4’−ビフェニルテトラカルボン酸二無水物(s−BPDA)が好ましい。 The compound represented by the formula (a-2-1) is biphenyltetracarboxylic dianhydride (BPDA), and specific examples thereof are 3,3 represented by the following formula (a-2-1s). ', 4,4'-biphenyltetracarboxylic dianhydride (s-BPDA), 2,3,3', 4'-biphenyltetracarboxylic dianhydride represented by the following formula (a-2-1a) Examples thereof include (a-BPDA) and 2,2', 3,3'-biphenyltetracarboxylic dianhydride (i-BPDA) represented by the following formula (a-2-1i). Of these, 3,3', 4,4'-biphenyltetracarboxylic dianhydride (s-BPDA) represented by the following formula (a-2-1s) is preferable.
式(a−2−2)で表される化合物は、p−フェニレンビス(トリメリテート)二無水物(TAHQ)である。 The compound represented by the formula (a-2-2) is p-phenylenebis (trimeritate) dianhydride (TAHQ).
式(a−2−3)で表される化合物は、オキシジフタル酸無水物(ODPA)であり、その具体例としては、下記式(a−2−3s)で表される4,4’−オキシジフタル酸無水物(s−ODPA)、下記式(a−2−3a)で表される3,4’−オキシジフタル酸無水物(a−ODPA)、下記式(a−2−3i)で表される3,3’−オキシジフタル酸無水物(i−ODPA)が挙げられる。中でも、下記式(a−2−3s)で表される4,4’−オキシジフタル酸無水物(s−ODPA)が好ましい。 The compound represented by the formula (a-2-3) is oxydiphthalic anhydride (ODPA), and specific examples thereof are 4,4'-oxydiphthal represented by the following formula (a-2-3s). Acid anhydride (s-ODPA), 3,4'-oxydiphthalic anhydride (a-ODPA) represented by the following formula (a-2-3a), represented by the following formula (a-2-3i) Examples include 3,3'-oxydiphthalic anhydride (i-ODPA). Of these, 4,4'-oxydiphthalic anhydride (s-ODPA) represented by the following formula (a-2-3s) is preferable.
式(a−2−4)で表される化合物は、ピロメリット酸二無水物(PMDA)である。 The compound represented by the formula (a-2-4) is pyromellitic acid dianhydride (PMDA).
構成単位(A−2)は、高耐熱性、及び低残留応力の観点から、構成単位(A−2−1)、及び構成単位(A−2−2)からなる群から選ばれる少なくとも1つを含むことが好ましい。
構成単位(A−2−1)はフィルムの耐熱性及び熱安定性が向上し、残留応力をより低下させる観点から好ましく、構成単位(A−2−2)はYIが低下し、無色透明性により優れる観点から好ましい。The structural unit (A-2) is at least one selected from the group consisting of the structural unit (A-2-1) and the structural unit (A-2-2) from the viewpoint of high heat resistance and low residual stress. Is preferably included.
The structural unit (A-2-1) is preferable from the viewpoint of improving the heat resistance and thermal stability of the film and further reducing the residual stress, and the structural unit (A-2-2) has a reduced YI and is colorless and transparent. It is preferable from the viewpoint of being superior.
テトラカルボン酸二無水物(a−2)は、式(a−2−1)〜(a−2−4)で表される化合物以外のテトラカルボン酸二無水物を含んでいてもよい。かかるテトラカルボン酸二無水物としては、4,4’−(ヘキサフルオロイソプロピリデン)ジフタル酸無水物、3,3’,4,4’−ジフェニルスルホンテトラカルボン酸二無水物、3,3’,4,4’−ベンゾフェノンテトラカルボン酸二無水物、2,2’,3,3’−ベンゾフェノンテトラカルボン酸二無水物、及び下記式(a−2−5)で表される化合物等の芳香族テトラカルボン酸二無水物;並びに1,2,3,4−ブタンテトラカルボン酸二無水物等の脂肪族テトラカルボン酸二無水物が挙げられる。これらの中では、芳香族テトラカルボン酸二無水物が好ましい。
テトラカルボン酸二無水物(a−2)は1種を単独でも、2種以上を組み合わせてもよい。The tetracarboxylic dianhydride (a-2) may contain a tetracarboxylic dianhydride other than the compounds represented by the formulas (a-2-1) to (a-2-4). Examples of such tetracarboxylic acid dianhydride include 4,4'-(hexafluoroisopropylidene) diphthalic acid anhydride, 3,3', 4,4'-diphenylsulfone tetracarboxylic acid dianhydride, 3,3',. Fragrances such as 4,4'-benzophenone tetracarboxylic acid dianhydride, 2,2', 3,3'-benzophenone tetracarboxylic acid dianhydride, and compounds represented by the following formula (a-2-5). Tetracarboxylic acid dianhydride; and aliphatic tetracarboxylic acid dianhydrides such as 1,2,3,4-butanetetracarboxylic acid dianhydride. Of these, aromatic tetracarboxylic dianhydrides are preferred.
The tetracarboxylic dianhydride (a-2) may be used alone or in combination of two or more.
構成単位(A−2)中における、構成単位(A−2−1)〜(A−2−4)の合計の比率は、好ましくは45モル%以上、より好ましくは70モル%以上、更に好ましくは90モル%以上、特に好ましくは99モル%以上である。その比率の上限値は特に限定されず、即ち、100モル%である。構成単位(A−2)は、構成単位(A−2−1)〜(A−2−4)から選ばれる少なくとも1種を含んでいればよく、構成単位(A−2−1)〜(A−2−4)から選ばれるいずれか1種のみからなっていてもよい。
構成単位(A−2)が構成単位(A−2−1)〜(A−2−4)から選ばれる2種以上の構成単位を含有する場合、構成単位(A−2)中における各構成単位の比率に特に制限は無く、任意の比率とすることができる。The total ratio of the structural units (A-2-1) to (A-2-4) in the structural unit (A-2) is preferably 45 mol% or more, more preferably 70 mol% or more, still more preferably. Is 90 mol% or more, particularly preferably 99 mol% or more. The upper limit of the ratio is not particularly limited, that is, 100 mol%. The structural unit (A-2) may include at least one selected from the structural units (A-2-1) to (A-2-4), and the structural units (A-2-1) to (A-2-1). It may consist of only one of A-2-4).
When the structural unit (A-2) contains two or more types of structural units selected from the structural units (A-2-1) to (A-2-4), each configuration in the structural unit (A-2) There is no particular limitation on the unit ratio, and any ratio can be used.
構成単位(A−2)中における、芳香族テトラカルボン酸二無水物に由来する構成単位の比率は、好ましくは45モル%以上、より好ましくは60モル%以上、更に好ましくは85モル%以上である。当該合計の含有比率の上限値は特に限定されず、即ち、100モル%である。 The ratio of the structural unit derived from the aromatic tetracarboxylic dianhydride in the structural unit (A-2) is preferably 45 mol% or more, more preferably 60 mol% or more, still more preferably 85 mol% or more. be. The upper limit of the total content ratio is not particularly limited, that is, 100 mol%.
イミド−アミド酸共重合体のテトラカルボン酸二無水物に由来する構成単位中の、構成単位(A−1)と構成単位(A−2)とのモル比〔(A−1)/(A−2)モル比〕は、好ましくは10/90〜90/10であり、より好ましくは30/70〜85/15であり、更に好ましくは50/50〜80/20である。 The molar ratio of the structural unit (A-1) to the structural unit (A-2) in the structural unit derived from the tetracarboxylic dianhydride of the imide-amide acid copolymer [(A-1) / (A). -2) Molar ratio] is preferably 10/90 to 90/10, more preferably 30/70 to 85/15, and even more preferably 50/50 to 80/20.
(構成単位IB及び構成単位AB)
構成単位IB及び構成単位ABは、それぞれ本発明の共重合体のイミド部分(I)及びアミド酸部分(A)に占めるジアミンに由来する構成単位である。(以下、構成単位IB及び構成単位ABを併せて「構成単位B」ともいう。)
構成単位IB及び構成単位ABは、エーテル結合を有する芳香族ジアミンに由来する構成単位又は含フッ素芳香族ジアミンに由来する構成単位を含むことが好ましく、柔軟性の観点からは、エーテル結合を有する芳香族ジアミンに由来する構成単位を含むことがより好ましく、透明性の観点からは、含フッ素芳香族ジアミンに由来する構成単位を含むことがより好ましい。(Constituent unit IB and constituent unit AB)
The structural unit IB and the structural unit AB are structural units derived from diamines in the imide moiety (I) and the amic acid moiety (A) of the copolymer of the present invention, respectively. (Hereinafter, the constituent unit IB and the constituent unit AB are also collectively referred to as "constituent unit B").
The structural unit IB and the structural unit AB preferably include a structural unit derived from an aromatic diamine having an ether bond or a structural unit derived from a fluorine-containing aromatic diamine, and from the viewpoint of flexibility, an aromatic having an ether bond. It is more preferable to include a structural unit derived from a group diamine, and from the viewpoint of transparency, it is more preferable to include a structural unit derived from a fluorine-containing aromatic diamine.
なお、構成単位IB及び構成単位ABは、同一の組成からなる。「同一の組成」とは、1種類のジアミン由来の構成単位からなる場合、構成単位IB及び構成単位ABは全て同一の構成単位からなることをいい、複数のジアミン由来の構成単位からなる場合、構成単位IB及び構成単位ABには同じ割合でそれぞれのジアミン由来の構成単位が存在することをいう。すなわち、複数のジアミン由来の構成単位からなる場合、各分子で見れば、構成単位IBと構成単位ABの構成単位が異なっていたとしても、全ての分子を見れば、同じ割合でそれぞれのジアミン由来の構成単位が存在する。 The constituent unit IB and the constituent unit AB have the same composition. The "same composition" means that when it is composed of one kind of diamine-derived structural unit, the structural unit IB and the structural unit AB are all composed of the same structural unit, and when it is composed of a plurality of diamine-derived structural units. It means that the constituent units IB and the constituent unit AB have the same proportion of each diamine-derived constituent unit. That is, when it is composed of a plurality of diamine-derived constituent units, even if the constituent units of the constituent unit IB and the constituent unit AB are different in each molecule, all the molecules are derived from each diamine in the same proportion. There is a structural unit of.
前記エーテル結合を有する芳香族ジアミンに由来する構成単位を与える前記エーテル結合を有する芳香族ジアミンとしては、2,2’−ビス(トリフルオロメチル)−4,4’−ジアミノジフェニルエーテル(6FODA)、2,2−ビス[4−(4−アミノフェノキシ)フェニル]ヘキサフルオロプロパン(HFBAPP)、ビス[4−(4−アミノフェノキシ)フェニル]スルホン(BAPS)、2,2−ビス[4−(4−アミノフェノキシ)フェニル]プロパン(BAPP)、4,4’−ビス(4−アミノフェノキシ)ビフェニル(BODA)、4,4’−ジアミノジフェニルエーテル(ODA)、3,4’−ジアミノジフェニルエーテル等が挙げられ、2,2’−ビス(トリフルオロメチル)−4,4’−ジアミノジフェニルエーテル(6FODA)が好ましい。 Examples of the aromatic diamine having an ether bond that gives a structural unit derived from the aromatic diamine having an ether bond include 2,2'-bis (trifluoromethyl) -4,4'-diaminodiphenyl ether (6FODA), 2 , 2-bis [4- (4-aminophenoxy) phenyl] hexafluoropropane (HFBAPP), bis [4- (4-aminophenoxy) phenyl] sulfone (BAPS), 2,2-bis [4- (4- (4- (4- (4-)4-) Aminophenoxy) phenyl] propane (BAPP), 4,4'-bis (4-aminophenoxy) biphenyl (BODA), 4,4'-diaminodiphenyl ether (ODA), 3,4'-diaminodiphenyl ether and the like. 2,2'-bis (trifluoromethyl) -4,4'-diaminodiphenyl ether (6FODA) is preferable.
前記含フッ素芳香族ジアミンに由来する構成単位を与える含フッ素芳香族ジアミンとしては、2,2’−ビス(トリフルオロメチル)−4,4’−ジアミノジフェニルエーテル(6FODA)、2,2−ビス[4−(4−アミノフェノキシ)フェニル]ヘキサフルオロプロパン(HFBAPP)等が挙げられ、2,2’−ビス(トリフルオロメチル)−4,4’−ジアミノジフェニルエーテル(6FODA)が好ましい。 Examples of the fluorine-containing aromatic diamine that gives a structural unit derived from the fluorine-containing aromatic diamine include 2,2'-bis (trifluoromethyl) -4,4'-diaminodiphenyl ether (6FODA) and 2,2-bis [ 4- (4-Aminophenoxy) phenyl] hexafluoropropane (HFBAPP) and the like can be mentioned, and 2,2'-bis (trifluoromethyl) -4,4'-diaminodiphenyl ether (6FODA) is preferable.
以上のように、構成単位Bは、下記式(b−1)で表される化合物に由来する構成単位(B−1)を含むことが好ましい。構成単位Bが構成単位(B−1)を含むことによって、透明性に優れ、かつ低残留応力及び低リタデーションの特性を両立させることができる。 As described above, the structural unit B preferably contains the structural unit (B-1) derived from the compound represented by the following formula (b-1). When the structural unit B includes the structural unit (B-1), it is possible to achieve both excellent transparency and low residual stress and low retardation characteristics.
式(b−1)で表される化合物は、2,2’−ビス(トリフルオロメチル)−4,4’−ジアミノジフェニルエーテル(6FODA)である。 The compound represented by the formula (b-1) is 2,2'-bis (trifluoromethyl) -4,4'-diaminodiphenyl ether (6FODA).
構成単位Bは、さらに下記式(b−3)で表される化合物に由来する構成単位(B−3)を含むことが好ましい。 The structural unit B preferably further contains a structural unit (B-3) derived from the compound represented by the following formula (b-3).
上記式(b−3)中において、Rは、それぞれ独立して、水素原子、フッ素原子、及び炭素数1〜5のアルキル基からなる群より選択され、水素原子、フッ素原子、及びメチル基からなる群より選択されることが好ましく、水素原子がより好ましい。
上記式(b−3)で表される化合物としては、9,9−ビス(4−アミノフェニル)フルオレン(BAFL)、9,9−ビス(3−フルオロ−4−アミノフェニル)フルオレン、及び9,9−ビス(3−メチル−4−アミノフェニル)フルオレン等が挙げられ、これら3種の化合物からなる群から選ばれる少なくとも1種が好ましく、9,9−ビス(4−アミノフェニル)フルオレンがより好ましい。
本発明の共重合体は、前記構成単位(B−3)を含むことによって、透明性及び耐熱性が向上する。In the above formula (b-3), R is independently selected from the group consisting of a hydrogen atom, a fluorine atom, and an alkyl group having 1 to 5 carbon atoms, and is selected from the hydrogen atom, the fluorine atom, and the methyl group. It is preferably selected from the above group, and a hydrogen atom is more preferable.
Examples of the compound represented by the above formula (b-3) include 9,9-bis (4-aminophenyl) fluorene (BAFL), 9,9-bis (3-fluoro-4-aminophenyl) fluorene, and 9. , 9-Bis (3-methyl-4-aminophenyl) fluorene and the like, and at least one selected from the group consisting of these three compounds is preferable, and 9,9-bis (4-aminophenyl) fluorene is preferable. More preferred.
The copolymer of the present invention has improved transparency and heat resistance by containing the structural unit (B-3).
構成単位B中における構成単位(B−1)の比率は、好ましくは45モル%以上、より好ましくは48モル%以上、更に好ましくは85モル%以上、より更に好ましくは88モル%以上であり、好ましくは100モル%以下、より好ましくは99.5モル%以下、更に好ましくは99.0モル%以下である。構成単位Bは構成単位(B−1)のみからなっていてもよい。
構成単位Bが構成単位(B−3)を含む場合、構成単位B中における構成単位(B−3)の比率は、低残留応力の観点から、好ましくは5モル%以上、より好ましくは10モル%以上、更に好ましくは25モル%以上であり、そして好ましくは65モル%以下、より好ましくは55モル%以下、更に好ましくは50モル%以下である。
構成単位Bが構成単位(B−3)を含む場合における、構成単位B中の構成単位(B−1)及び(B−3)の合計の比率は、好ましくは85.0〜100モル%、より好ましくは88.0〜99.5モル%、更に好ましくは92.0〜99.0モル%である。構成単位Bが構成単位(B−3)を含まない場合における、構成単位B中の構成単位(B−1)の比率も、上記と同じ範囲であることが好ましい。The ratio of the structural unit (B-1) in the structural unit B is preferably 45 mol% or more, more preferably 48 mol% or more, still more preferably 85 mol% or more, still more preferably 88 mol% or more. It is preferably 100 mol% or less, more preferably 99.5 mol% or less, still more preferably 99.0 mol% or less. The structural unit B may consist of only the structural unit (B-1).
When the constituent unit B includes the constituent unit (B-3), the ratio of the constituent unit (B-3) in the constituent unit B is preferably 5 mol% or more, more preferably 10 mol, from the viewpoint of low residual stress. % Or more, more preferably 25 mol% or more, and preferably 65 mol% or less, more preferably 55 mol% or less, still more preferably 50 mol% or less.
When the constituent unit B includes the constituent unit (B-3), the total ratio of the constituent units (B-1) and (B-3) in the constituent unit B is preferably 85.0 to 100 mol%. It is more preferably 88.0 to 99.5 mol%, still more preferably 92.0 to 99.0 mol%. When the constituent unit B does not include the constituent unit (B-3), the ratio of the constituent units (B-1) in the constituent unit B is also preferably in the same range as described above.
構成単位Bは、柔軟性の観点から、スルホニル基を有する芳香族ジアミンに由来する構成単位を含んでいてもよい。
前記スルホニル基を有する芳香族ジアミンに由来する構成単位を与えるスルホニル基を有する芳香族ジアミンとしては、3,3’−ジアミノジフェニルスルホン(3,3−DDS)、4,4’−ジアミノジフェニルスルホン(4,4−DDS)、ビス[4−(4−アミノフェノキシ)フェニル]スルホン(BAPS)、ビス[4−(3−アミノフェノキシ)フェニル]スルホン(BAPS−M)等が挙げられる。The structural unit B may contain a structural unit derived from an aromatic diamine having a sulfonyl group from the viewpoint of flexibility.
Examples of the aromatic diamine having a sulfonyl group that gives a structural unit derived from the aromatic diamine having a sulfonyl group include 3,3'-diaminodiphenyl sulfone (3,3-DDS) and 4,4'-diaminodiphenyl sulfone ( 4,4-DDS), bis [4- (4-aminophenoxy) phenyl] sulfone (BAPS), bis [4- (3-aminophenoxy) phenyl] sulfone (BAPS-M) and the like.
構成単位Bは、前記のエーテル結合を有する芳香族ジアミンに由来する構成単位、含フッ素芳香族ジアミンに由来する構成単位、及びスルホニル基を有する芳香族ジアミンに由来する構成単位に例示したジアミンに由来する構成単位以外、並びに構成単位(B−1)及び(B−3)以外のその他のジアミンに由来する構成単位を含んでもよい。
そのような構成単位を与えるジアミンとしては、特に限定されないが、1,4−フェニレンジアミン、p−キシリレンジアミン、3,5−ジアミノ安息香酸、1,5−ジアミノナフタレン、2,2’−ジメチルビフェニル−4,4’−ジアミン、2,2’−ジメチルビフェニル−4,4’−ジアミン、4,4’−ジアミノジフェニルメタン、1,4−ビス[2−(4−アミノフェニル)−2−プロピル]ベンゼン、2,2−ビス(4−アミノフェニル)ヘキサフルオロプロパン、4,4’−ジアミノベンズアニリド、1−(4−アミノフェニル)−2,3−ジヒドロ−1,3,3−トリメチル−1H−インデン−5−アミン、α,α’−ビス(4−アミノフェニル)−1,4−ジイソプロピルベンゼン、N,N’−ビス(4−アミノフェニル)テレフタルアミド、2,2−ビス(3−アミノ−4−ヒドロキシフェニル)ヘキサフルオロプロパン、及び1,4−ビス(4−アミノフェノキシ)ベンゼン等の芳香族ジアミン;1,3−ビス(アミノメチル)シクロヘキサン、及び1,4−ビス(アミノメチル)シクロヘキサン等の脂環式ジアミン;並びにエチレンジアミン及びヘキサメチレンジアミン等の脂肪族ジアミンが挙げられる。
構成単位Bに任意に含まれるその他のジアミンに由来する構成単位は、1種でもよいし、2種以上であってもよい。
構成単位Bは、特に、低リタデーションを実現する観点から、2,2’−ビス(トリフルオロメチル)ベンジジンに由来する構成単位を含まないことが好ましい。The structural unit B is derived from the diamine exemplified in the above-mentioned structural unit derived from an aromatic diamine having an ether bond, a structural unit derived from a fluorine-containing aromatic diamine, and a structural unit derived from an aromatic diamine having a sulfonyl group. It may contain a structural unit other than the structural unit to be used, and other structural units derived from diamines other than the structural units (B-1) and (B-3).
The diamine giving such a constituent unit is not particularly limited, but is limited to 1,4-phenylenediamine, p-xylylene diamine, 3,5-diaminobenzoic acid, 1,5-diaminonaphthalene, and 2,2'-dimethyl. Biphenyl-4,4'-diamine, 2,2'-dimethylbiphenyl-4,4'-diamine, 4,4'-diaminodiphenylmethane, 1,4-bis [2- (4-aminophenyl) -2-propyl ] Benzene, 2,2-bis (4-aminophenyl) hexafluoropropane, 4,4'-diaminobenzanilide, 1- (4-aminophenyl) -2,3-dihydro-1,3,3-trimethyl- 1H-inden-5-amine, α, α'-bis (4-aminophenyl) -1,4-diisopropylbenzene, N, N'-bis (4-aminophenyl) terephthalamide, 2,2-bis (3) Aromatic amines such as −amino-4-hydroxyphenyl) hexafluoropropane and 1,4-bis (4-aminophenoxy) benzene; 1,3-bis (aminomethyl) cyclohexane, and 1,4-bis (amino). Alicyclic diamines such as methyl) cyclohexane; and aliphatic diamines such as ethylenediamine and hexamethylenediamine can be mentioned.
The other diamine-derived structural units arbitrarily contained in the structural unit B may be one type or two or more types.
The structural unit B preferably does not contain a structural unit derived from 2,2'-bis (trifluoromethyl) benzidine, particularly from the viewpoint of achieving low retardation.
なお、本明細書において、芳香族ジアミンとは芳香環を1つ以上含むジアミンを意味し、脂環式ジアミンとは脂環を1つ以上含み、かつ芳香環を含まないジアミンを意味し、脂肪族ジアミンとは芳香環も脂環も含まないジアミンを意味する。 In the present specification, the aromatic diamine means a diamine containing one or more aromatic rings, and the alicyclic diamine means a diamine containing one or more alicyclic rings and not containing an aromatic ring, and is a fat. The group diamine means a diamine that does not contain an aromatic ring or an alicyclic ring.
(その他の構成単位)
本発明のイミド−アミド酸共重合体には、前記の構成単位IA、構成単位AA、構成単位IB及び構成単位AB以外の構成単位も含んでもよい。
本発明のイミド−アミド酸共重合体は、さらに下記一般式(b−2)で表される化合物に由来する構成単位(B−2)を含むことが好ましい。構成単位(B−2)を含むことによって、残留応力が低下する。(Other building blocks)
The imide-amidoic acid copolymer of the present invention may also contain structural units other than the above-mentioned structural unit IA, structural unit AA, structural unit IB and structural unit AB.
The imide-amidoic acid copolymer of the present invention preferably further contains a structural unit (B-2) derived from a compound represented by the following general formula (b-2). Residual stress is reduced by including the structural unit (B-2).
式(b−2)中、Z1及びZ2はそれぞれ独立に2価の脂肪族基、又は2価の芳香族基を示し、R1及びR2はそれぞれ独立に1価の芳香族基、又は1価の脂肪族基を示し、R3及びR4はそれぞれ独立に1価の脂肪族基を示し、R5及びR6は、それぞれ独立に1価の脂肪族基、又は1価の芳香族基を示し、m及びnはそれぞれ独立に1以上の整数を示し、mとnとの和は2〜1000の整数を示す。但し、R1及びR2の少なくとも一方は1価の芳香族基を示す。
なお、式(b−2)において、[ ]によって並列記載されている2以上の異なる繰り返し単位は、それぞれランダム状、交互状又はブロック状のいずれの形及び順序で繰り返されていてもよい。In formula (b-2), Z 1 and Z 2 independently represent a divalent aliphatic group or a divalent aromatic group, and R 1 and R 2 independently represent a monovalent aromatic group, respectively. Or monovalent aliphatic groups, R 3 and R 4 independently represent monovalent aliphatic groups, and R 5 and R 6 independently represent monovalent aliphatic groups or monovalent fragrances, respectively. Indicates a group group, m and n each independently indicate an integer of 1 or more, and the sum of m and n indicates an integer of 2 to 1000. However, at least one of R 1 and R 2 shows a monovalent aromatic group.
In addition, in the formula (b-2), two or more different repeating units described in parallel by [] may be repeated in any form and order of random, alternating, or block, respectively.
式(b−2)中、Z1及びZ2における2価の脂肪族基又は2価の芳香族基は、フッ素原子で置換されていてもよく、酸素原子を含んでいてもよい。エーテル結合として酸素原子を含んでいる場合、以下に示す炭素数は、脂肪族基又は芳香族基に含まれる全ての炭素数のことをいう。
2価の脂肪族基としては、炭素数1〜20の2価の飽和又は不飽和の脂肪族基が挙げられる。2価の脂肪族基の炭素数は3〜20が好ましい。
2価の飽和脂肪族基としては、炭素数1〜20のアルキレン基、アルキレンオキシ基が挙げられ、アルキレン基としては、例えば、メチレン基、エチレン基、プロピレン基、トリメチレン基、テトラメチレン基、ヘキサメチレン基、オクタメチレン基、デカメチレン基、ドデカメチレン基等が例示でき、アルキレンオキシ基としては、例えば、プロピレンオキシ基、トリメチレンオキシ基等が例示できる。
2価の不飽和脂肪族基としては、炭素数2〜20のアルキレン基が挙げられ、例えば、ビニレン基、プロペニレン基、末端に不飽和二重結合を有するアルキレン基が例示できる。
2価の芳香族基としては炭素数6〜20のアリーレン基、炭素数7〜20のアラルキレン基等が例示できる。Z1及びZ2における炭素数6〜20のアリーレン基の具体例としては、o−フェニレン基、m−フェニレン基、p−フェニレン基、4,4’−ビフェニリレン基、2,6−ナフチレン基等が挙げられる。
Z1及びZ2としては、特に、トリメチレン基、p−フェニレン基が好ましく、トリメチレン基がより好ましい。In formula (b-2), the divalent aliphatic group or divalent aromatic group in Z 1 and Z 2 may be substituted with a fluorine atom or may contain an oxygen atom. When an oxygen atom is contained as an ether bond, the carbon number shown below means all the carbon numbers contained in the aliphatic group or the aromatic group.
Examples of the divalent aliphatic group include a divalent saturated or unsaturated aliphatic group having 1 to 20 carbon atoms. The divalent aliphatic group preferably has 3 to 20 carbon atoms.
Examples of the divalent saturated aliphatic group include an alkylene group having 1 to 20 carbon atoms and an alkyleneoxy group, and examples of the alkylene group include a methylene group, an ethylene group, a propylene group, a trimethylene group, a tetramethylene group and a hexa. Methylene group, octamethylene group, decamethylene group, dodecamethylene group and the like can be exemplified, and examples of the alkyleneoxy group include propyleneoxy group and trimethyleneoxy group.
Examples of the divalent unsaturated aliphatic group include an alkylene group having 2 to 20 carbon atoms, and examples thereof include a vinylene group, a propenylene group, and an alkylene group having an unsaturated double bond at the terminal.
Examples of the divalent aromatic group include an arylene group having 6 to 20 carbon atoms and an aralkylene group having 7 to 20 carbon atoms. Specific examples of the arylene group having 6 to 20 carbon atoms in Z 1 and Z 2 include an o-phenylene group, an m-phenylene group, a p-phenylene group, a 4,4'-biphenylylene group, a 2,6-naphthylene group and the like. Can be mentioned.
As Z 1 and Z 2 , a trimethylene group and a p-phenylene group are particularly preferable, and a trimethylene group is more preferable.
式(b−2)中、R1〜R6における1価の脂肪族基としては、1価の飽和又は不飽和脂肪族基が挙げられる。1価の飽和脂肪族基としては炭素数1〜22のアルキル基が挙げられ、例えば、メチル基、エチル基、プロピル基等が例示できる。1価の不飽和脂肪族基としては炭素数2〜22のアルケニル基が挙げられ、例えば、ビニル基、プロペニル基等が例示できる。これらの基はフッ素原子で置換されていてもよい。
式(b−2)のR1、R2、R5及びR6における1価の芳香族基としては、炭素数6〜20のアリール基、炭素数7〜30であり、かつアルキル基で置換されたアリール基、炭素数7〜30のアラルキル基等が例示できる。1価の芳香族基としては、アリール基が好ましく、フェニル基がより好ましい。
R1及びR2の少なくとも一方は1価の芳香族基を示すが、R1及びR2がともに1価の芳香族基であることが好ましく、R1及びR2がともにフェニル基であることがより好ましい。
R3及びR4としては、炭素数1〜6のアルキル基が好ましく、メチル基がより好ましい。
R5及びR6としては、1価の脂肪族基が好ましく、メチル基がより好ましい。In the formula (b-2), the monovalent aliphatic group in R 1 to R 6 includes a monovalent saturated or unsaturated aliphatic group. Examples of the monovalent saturated aliphatic group include an alkyl group having 1 to 22 carbon atoms, and examples thereof include a methyl group, an ethyl group, and a propyl group. Examples of the monovalent unsaturated aliphatic group include an alkenyl group having 2 to 22 carbon atoms, and examples thereof include a vinyl group and a propenyl group. These groups may be substituted with fluorine atoms.
The monovalent aromatic group in R 1 , R 2 , R 5 and R 6 of the formula (b-2) is an aryl group having 6 to 20 carbon atoms, 7 to 30 carbon atoms, and is substituted with an alkyl group. Examples thereof include the aryl group and the aralkyl group having 7 to 30 carbon atoms. As the monovalent aromatic group, an aryl group is preferable, and a phenyl group is more preferable.
At least one of R 1 and R 2 shows a monovalent aromatic group, but it is preferable that both R 1 and R 2 are monovalent aromatic groups, and both R 1 and R 2 are phenyl groups. Is more preferable.
As R 3 and R 4 , an alkyl group having 1 to 6 carbon atoms is preferable, and a methyl group is more preferable.
As R 5 and R 6 , a monovalent aliphatic group is preferable, and a methyl group is more preferable.
式(b−2)における、mは1価の少なくとも1つの芳香族基が結合するシロキサン単位の繰り返し数を示し、nは1価の脂肪族基が結合するシロキサン単位の繰り返し数を示す。
m及びnはそれぞれ独立に1以上の整数を示し、m及びnの和(m+n)は2〜1000の整数を示す。m及びnの和は、好ましくは3〜500の整数、より好ましくは3〜100、更に好ましくは3〜50の整数を示す。
m/nの比は、好ましくは50/50〜99/1、より好ましくは60/40〜90/10、更に好ましくは70/30〜80/20である。In the formula (b-2), m indicates the number of repetitions of the siloxane unit to which at least one monovalent aromatic group is bonded, and n indicates the number of repetitions of the siloxane unit to which the monovalent aliphatic group is bonded.
m and n each independently represent an integer of 1 or more, and the sum of m and n (m + n) represents an integer of 2 to 1000. The sum of m and n preferably represents an integer of 3 to 500, more preferably 3 to 100, and even more preferably an integer of 3 to 50.
The ratio of m / n is preferably 50/50 to 99/1, more preferably 60/40 to 90/10, and even more preferably 70/30 to 80/20.
式(b−2)で表される化合物の官能基当量は、好ましくは150〜5,000g/mol、より好ましくは400〜4,000g/mol、更に好ましくは500〜3,000g/molである。
なお、官能基当量とは、官能基1モルあたりの式(b−2)で表される化合物の質量を意味する。
なお、前記一般式(b−2)で表される化合物としては、下記一般式(b−21)であってもよい。The functional group equivalent of the compound represented by the formula (b-2) is preferably 150 to 5,000 g / mol, more preferably 400 to 4,000 g / mol, and further preferably 500 to 3,000 g / mol. ..
The functional group equivalent means the mass of the compound represented by the formula (b-2) per mole of the functional group.
The compound represented by the general formula (b-2) may be the following general formula (b-21).
(式(b−21)中、Z1、Z2、R1〜R6、m及びnは式(b−2)で示したものと同じである。)
(In the formula (b-21), Z 1 , Z 2 , R 1 to R 6 , m and n are the same as those shown in the formula (b-2).)
構成単位(B−2)と構成単位Bの合計量に対する構成単位(B−2)の比率は、好ましくは0.01〜15.0モル%、より好ましくは0.5〜12.0モル%、更に好ましくは1.0〜8.0モル%である。 The ratio of the constituent unit (B-2) to the total amount of the constituent unit (B-2) and the constituent unit B is preferably 0.01 to 15.0 mol%, more preferably 0.5 to 12.0 mol%. , More preferably 1.0 to 8.0 mol%.
イミド−アミド酸共重合体を構成する構成単位の合計に対するポリオルガノシロキサン単位の含有量は、好ましくは5〜45質量%、より好ましくは7〜40質量%、更に好ましくは10〜35質量%である。当該ポリオルガノシロキサン単位の含有量が前記範囲内にあると、低リタデーションと低残留応力とをより高度に両立できる。 The content of the polyorganosiloxane unit with respect to the total of the structural units constituting the imide-amidoic acid copolymer is preferably 5 to 45% by mass, more preferably 7 to 40% by mass, still more preferably 10 to 35% by mass. be. When the content of the polyorganosiloxane unit is within the above range, low retardation and low residual stress can be achieved at a higher level.
式(b−2)で表される化合物の市販品として入手できるものとしては、信越化学工業株式会社製の「X−22−9409」、「X−22−1660B−3」等が挙げられる。 Examples of commercially available compounds represented by the formula (b-2) include "X-22-9409" and "X-22-1660B-3" manufactured by Shin-Etsu Chemical Co., Ltd.
(イミド繰り返し構造単位/アミド酸構造単位の好適例)
本発明の共重合体は、構成単位(A−1)を与える化合物と構成単位(B−1)を与える化合物とから形成されるイミド繰り返し構造単位、及び構成単位(A−2)を与える化合物と構成単位(B−1)を与える化合物とから形成されるアミド酸構造単位を有することが好ましい。(Preferable example of imide repeating structural unit / amic acid structural unit)
The copolymer of the present invention is an imide repeating structural unit formed from a compound giving a structural unit (A-1) and a compound giving a structural unit (B-1), and a compound giving a structural unit (A-2). It is preferable to have an amic acid structural unit formed from the compound which gives the structural unit (B-1).
すなわち、本発明の共重合体は、テトラカルボン酸二無水物に由来する構成単位IA及びAA、並びにジアミンに由来する構成単位IB及びABを有する共重合体であって、
構成単位IA及びAAが、脂環式テトラカルボン酸二無水物(a−1)に由来する構成単位(A−1)と、脂環式テトラカルボン酸二無水物(a−1)以外のテトラカルボン酸二無水物(a−2)に由来する構成単位(A−2)からなり、
構成単位IB及びABが、下記式(b−1)で表される化合物に由来する構成単位(B−1)を含み、
構成単位(A−2)が、下記式(a−2−1)で表される化合物に由来する構成単位(A−2−1)、下記式(a−2−2)で表される化合物に由来する構成単位(A−2−2)、下記式(a−2−3)で表される化合物に由来する構成単位(A−2−3)、及び下記式(a−2−4)で表される化合物に由来する構成単位(A−2−4)からなる群から選ばれる少なくとも1つを含み、
該共重合体が、構成単位(A−1)を与える化合物と構成単位(B−1)を与える化合物とから形成されるイミド繰り返し構造単位を有し、構成単位(A−2)を与える化合物と構成単位(B−1)を与える化合物とから形成されるアミド酸構造単位を有することが好ましい。That is, the copolymer of the present invention is a copolymer having structural units IA and AA derived from tetracarboxylic dianhydride and structural units IB and AB derived from diamine.
The constituent units IA and AA are a constituent unit (A-1) derived from the alicyclic tetracarboxylic dianhydride (a-1) and a tetra other than the alicyclic tetracarboxylic dianhydride (a-1). Consists of a structural unit (A-2) derived from the carboxylic dianhydride (a-2)
Constituent units IB and AB include a structural unit (B-1) derived from a compound represented by the following formula (b-1).
The structural unit (A-2) is derived from the compound represented by the following formula (a-2-1), the structural unit (A-2-1), and the compound represented by the following formula (a-2-2). The structural unit (A-2-2) derived from, the structural unit (A-2-3) derived from the compound represented by the following formula (a-2-3), and the following formula (a-2-4). Containing at least one selected from the group consisting of structural units (A-2-4) derived from the compound represented by.
The copolymer has an imide repeating structural unit formed from a compound giving a structural unit (A-1) and a compound giving a structural unit (B-1), and gives a structural unit (A-2). It is preferable to have an amic acid structural unit formed from the compound which gives the structural unit (B-1).
本発明の共重合体は、構成単位(A−1)を与える化合物以外の化合物と構成単位Bを与える化合物とから形成されるイミド繰り返し構造単位、構成単位(A−1)を与える化合物と構成単位(B−1)を与える化合物以外の化合物とから形成されるイミド繰り返し構造単位を有していてもよい。同様に、本発明の共重合体は、構成単位(A−2)を与える化合物以外の化合物と構成単位(B−1)を与える化合物とから形成されるアミド酸構造単位を有していてもよい。 The copolymer of the present invention is composed of an imide repeating structural unit formed from a compound other than the compound giving the structural unit (A-1) and a compound giving the structural unit B, and a compound giving the structural unit (A-1). It may have an imide repeating structural unit formed from a compound other than the compound giving the unit (B-1). Similarly, the copolymer of the present invention may have an amic acid structural unit formed from a compound other than the compound giving the structural unit (A-2) and a compound giving the structural unit (B-1). good.
<ポリイミドフィルム物性値>
本発明のイミド−アミド酸共重合体を用いることで、無色透明性、及び耐熱性に優れ、更に低残留応力、及び低リタデーションであるポリイミドフィルムも形成することができる。当該フィルムの有する好適な物性値は以下の通りである。
全光線透過率は、厚さ10μmのフィルムとした際に、好ましくは87%以上、より好ましくは89%以上、更に好ましくは90%以上である。
イエローインデックス(YI)は、厚さ10μmのフィルムとした際に、好ましくは7.0以下、より好ましくは4.0以下、更に好ましくは3.5以下、より更に好ましくは3.0以下である。
ガラス転移温度(Tg)は、好ましくは220℃以上、より好ましくは250℃以上、更に好ましくは290℃以上である。
厚さ10μmのポリイミドフィルムとした際の厚み位相差(Rth)の絶対値は、好ましくは200nm以下、より好ましくは150nm以下、更に好ましくは110nm以下、特に好ましくは90nm以下である。なお、本明細書において、「低リタデーション」とは、厚み位相差(Rth)が低いことを意味し、低リタデーションであると、複屈折による位相差が小さく、好ましい。
残留応力は、好ましくは26MPa以下、より好ましくは24MPa以下、更に好ましくは20MPa以下である。
なお、本発明における上述の物性値は、具体的には実施例に記載の方法で測定することができる。<Physical properties of polyimide film>
By using the imide-amidoic acid copolymer of the present invention, a polyimide film having excellent colorless transparency and heat resistance, low residual stress, and low retardation can also be formed. Suitable physical property values of the film are as follows.
The total light transmittance is preferably 87% or more, more preferably 89% or more, still more preferably 90% or more when the film has a thickness of 10 μm.
The yellow index (YI) is preferably 7.0 or less, more preferably 4.0 or less, still more preferably 3.5 or less, and even more preferably 3.0 or less when the film has a thickness of 10 μm. ..
The glass transition temperature (Tg) is preferably 220 ° C. or higher, more preferably 250 ° C. or higher, still more preferably 290 ° C. or higher.
The absolute value of the thickness phase difference (Rth) when a polyimide film having a thickness of 10 μm is formed is preferably 200 nm or less, more preferably 150 nm or less, still more preferably 110 nm or less, and particularly preferably 90 nm or less. In the present specification, "low retardation" means that the thickness retardation (Rth) is low, and low retardation is preferable because the phase difference due to birefringence is small.
The residual stress is preferably 26 MPa or less, more preferably 24 MPa or less, still more preferably 20 MPa or less.
The above-mentioned physical property values in the present invention can be specifically measured by the method described in Examples.
[イミド−アミド酸共重合体の製造方法]
本発明のイミド−アミド酸共重合体の製造方法は、下記工程1及び工程2を有する。
工程1:イミド部分(I)を構成するテトラカルボン酸成分と、ジアミン成分とを反応させ、イミドオリゴマーを得る工程
工程2:工程1で得られたイミドオリゴマーと、アミド酸部分(A)を構成するテトラカルボン酸成分を反応させ、下記式(1)で表される、イミド部分(I)とアミド酸部分(A)とからなる繰り返し単位を含む、イミド−アミド酸共重合体を得る工程[Method for producing imide-amidoic acid copolymer]
The method for producing an imide-amidoic acid copolymer of the present invention includes the following steps 1 and 2.
Step 1: The tetracarboxylic acid component constituting the imide moiety (I) is reacted with the diamine component to obtain an imide oligomer. Step 2: The imide oligomer obtained in Step 1 and the amic acid moiety (A) are formed. A step of reacting the tetracarboxylic acid component to obtain an imide-amide acid copolymer containing a repeating unit consisting of an imide moiety (I) and an amic acid moiety (A) represented by the following formula (1).
(式(1)中、
X1は炭素数4〜39の4価の脂肪族基、脂環基、芳香族基又はこれらの組み合わせからなる基であって、結合基として−O−、−SO2−、−CO−、−CH2−、−C(CH3)2−、−C2H4O−及び−S−からなる群から選ばれる少なくとも1つを有していてもよい。
X2はX1とは異なる炭素数4〜39の4価の脂肪族基、脂環基、芳香族基又はこれらの組み合わせからなる基であって、結合基として−O−、−SO2−、−CO−、−CH2−、−C(CH3)2−、−C2H4O−及び−S−からなる群から選ばれる少なくとも1つを有していてもよい。
Y1は炭素数4〜39の2価の脂肪族基、脂環基、芳香族基又はこれらの組み合わせからなる基であって、結合基として−O−、−SO2−、−CO−、−CH2−、−C(CH3)2−、−C2H4O−及び−S−からなる群から選ばれる少なくとも1つを有していてもよく、複数のY1は同一の組成を有する。
s及びtは正の整数である。)
(In equation (1),
X 1 is a group consisting of a tetravalent aliphatic group having 4 to 39 carbon atoms, an alicyclic group, an aromatic group or a combination thereof, and has -O-, -SO 2- , -CO- as a linking group. -CH 2 -, - C (CH 3) 2 -, - it may have at least one member selected from C 2 H 4 group consisting of O- and -S-.
X 2 is a tetravalent aliphatic group, an alicyclic group, an aromatic group, or combinations of these groups having a carbon number of 4-39, which is different from the X 1, -O a bonding group -, - SO 2 - , -CO-, -CH 2- , -C (CH 3 ) 2- , -C 2 H 4 O- and -S- may have at least one selected from the group.
Y 1 is a group consisting of a divalent aliphatic group having 4 to 39 carbon atoms, an alicyclic group, an aromatic group or a combination thereof, and as a linking group, -O-, -SO 2- , -CO-, -CH 2 -, - C (CH 3) 2 -, - it may have at least one member selected from C 2 H 4 group consisting of O- and -S-, a plurality of Y 1 are the same composition Have.
s and t are positive integers. )
本発明のイミド−アミド酸共重合体の製造方法によれば、イミド部分とアミド酸部分を特定の構造に制御することが可能となるため、従来のイミド部分とアミド酸部分がランダムに存在するイミド−アミド酸共重合体とは異なり、保存安定性と成形加工性を両立することができるイミド−アミド酸共重合体を得ることができるものと考えられる。 According to the method for producing an imide-amide acid copolymer of the present invention, the imide moiety and the amic acid moiety can be controlled to a specific structure, so that the conventional imide moiety and the amic acid moiety are randomly present. Unlike the imide-amide acid copolymer, it is considered that an imide-amide acid copolymer capable of achieving both storage stability and molding processability can be obtained.
なかでも、本発明の好適な共重合体は、構成単位(A−1)を与える化合物、及び構成単位(A−2)を与える化合物からなるテトラカルボン酸成分と、構成単位(B−1)を含むジアミン成分とを反応させることにより製造することができ、好ましくは、下記工程1及び工程2を有する方法により製造される。
工程1:構成単位(A−1)を与える化合物と、構成単位(B−1)を与える化合物とを反応させ、イミド繰り返し構造単位を有するオリゴマーを得る工程
工程2:工程1で得られたオリゴマーと、構成単位(A−2)を与える化合物を反応させ、イミド繰り返し構造単位及びアミド酸構造単位を有する共重合体を得る工程Among them, the preferred copolymer of the present invention comprises a tetracarboxylic acid component composed of a compound giving a constituent unit (A-1) and a compound giving a constituent unit (A-2), and a constituent unit (B-1). It can be produced by reacting with a diamine component containing, and is preferably produced by a method having the following steps 1 and 2.
Step 1: The compound giving the structural unit (A-1) is reacted with the compound giving the structural unit (B-1) to obtain an oligomer having an imide repeating structural unit. Step 2: The oligomer obtained in step 1. And the compound giving the structural unit (A-2) are reacted to obtain a copolymer having an imide repeating structural unit and an amic acid structural unit.
すなわち、本発明の好適な共重合体の製造方法は、下記工程1及び工程2を有する、共重合体の製造方法であって、
共重合体が、テトラカルボン酸二無水物に由来する構成単位A及びジアミンに由来する構成単位Bを有し、
構成単位Aが、脂環式テトラカルボン酸二無水物(a−1)に由来する構成単位(A−1)と、脂環式テトラカルボン酸二無水物(a−1)以外のテトラカルボン酸二無水物(a−2)に由来する構成単位(A−2)からなり、
構成単位Bが、式(b−1)で表される化合物に由来する構成単位(B−1)を含み、
構成単位(A−2)が、式(a−2−1)で表される化合物に由来する構成単位(A−2−1)、式(a−2−2)で表される化合物に由来する構成単位(A−2−2)、式(a−2−3)で表される化合物に由来する構成単位(A−2−3)、及び式(a−2−4)で表される化合物に由来する構成単位(A−2−4)からなる群から選ばれる少なくとも1つを含む。
工程1:構成単位(A−1)を与える化合物と、構成単位(B−1)を与える化合物とを反応させ、イミド繰り返し構造単位を有するオリゴマーを得る工程
工程2:工程1で得られたオリゴマーと、構成単位(A−2)を与える化合物と、構成単位Bを与える化合物を反応させ、イミド繰り返し構造単位及びアミド酸繰り返し構造単位を有する共重合体を得る工程That is, the preferred method for producing a copolymer of the present invention is a method for producing a copolymer having the following steps 1 and 2.
The copolymer has a structural unit A derived from tetracarboxylic dianhydride and a structural unit B derived from diamine.
The structural unit A is a structural unit (A-1) derived from the alicyclic tetracarboxylic dianhydride (a-1) and a tetracarboxylic acid other than the alicyclic tetracarboxylic dianhydride (a-1). Consists of a structural unit (A-2) derived from the dianhydride (a-2)
The structural unit B includes a structural unit (B-1) derived from the compound represented by the formula (b-1).
The structural unit (A-2) is derived from the compound represented by the formula (a-2-1), the structural unit (A-2-1), and the compound represented by the formula (a-2-2). The structural unit (A-2-2), the structural unit derived from the compound represented by the formula (a-2-3) (A-2-3), and the structural unit represented by the formula (a-2-4). It comprises at least one selected from the group consisting of constituent units (A-2-4) derived from the compound.
Step 1: The compound giving the structural unit (A-1) is reacted with the compound giving the structural unit (B-1) to obtain an oligomer having an imide repeating structural unit. Step 2: The oligomer obtained in step 1. And the compound giving the structural unit (A-2) and the compound giving the structural unit B are reacted to obtain a copolymer having an imide repeating structural unit and an amic acid repeating structural unit.
前記工程1及び工程2を有する製造方法により、保存安定性と成形加工性を両立することができるとともに、無色透明性及び耐熱性に優れ、低リタデーション及び低残留応力にも優れるフィルムが形成可能な共重合体を製造することができる。
以下、本発明の共重合体の製造方法について説明する。By the manufacturing method having the steps 1 and 2, it is possible to form a film having both storage stability and molding processability, excellent colorless transparency and heat resistance, and excellent low retardation and low residual stress. A copolymer can be produced.
Hereinafter, the method for producing the copolymer of the present invention will be described.
<工程1>
工程1は、イミド部分(I)を構成するテトラカルボン酸成分と、ジアミン成分とを反応させ、イミドオリゴマーを得る工程である。
好ましくは、イミド部分(I)を構成するテトラカルボン酸成分が、脂環式テトラカルボン酸成分である。
工程1は、より好ましくは構成単位(A−1)を与える化合物と、構成単位(B−1)を与える化合物とを反応させ、イミド繰り返し構造単位を有するオリゴマーを得る工程である。
工程1で使用するテトラカルボン酸成分としては、構成単位(A−1)を与える化合物を含むことが好ましく、構成単位(A−1)が構成単位(A−1−1)を含む場合には、構成単位(A−1−1)を与える化合物は、その全量を工程1で使用することが好ましい。
工程1で使用するジアミン成分としては、構成単位(B−1)を与える化合物を含むことが好ましく、本発明の効果を損なわない範囲で、構成単位(B−1)を与える化合物以外のジアミン成分を含んでいてもよい。このような化合物としては、構成単位(B−3)を与える化合物が挙げられる。
工程1において、テトラカルボン酸成分に対するジアミン成分は、1.01〜2モルであることが好ましく、1.05〜1.9モルであることがより好ましく、1.1〜1.7モルであることが更に好ましい。<Step 1>
Step 1 is a step of reacting the tetracarboxylic acid component constituting the imide moiety (I) with the diamine component to obtain an imide oligomer.
Preferably, the tetracarboxylic acid component constituting the imide moiety (I) is an alicyclic tetracarboxylic acid component.
Step 1 is a step of reacting a compound giving a structural unit (A-1) with a compound giving a structural unit (B-1) to obtain an oligomer having an imide repeating structural unit.
The tetracarboxylic acid component used in step 1 preferably contains a compound that gives a constituent unit (A-1), and when the constituent unit (A-1) contains a constituent unit (A-1-1), it is preferable. , It is preferable that the entire amount of the compound giving the structural unit (A-1-1) is used in step 1.
The diamine component used in step 1 preferably contains a compound that gives the constituent unit (B-1), and is a diamine component other than the compound that gives the constituent unit (B-1) as long as the effect of the present invention is not impaired. May include. Examples of such a compound include a compound that gives a structural unit (B-3).
In step 1, the diamine component with respect to the tetracarboxylic acid component is preferably 1.01 to 2 mol, more preferably 1.05 to 1.9 mol, and 1.1 to 1.7 mol. Is even more preferable.
工程1でイミドオリゴマーを得るための、テトラカルボン酸成分とジアミン成分とを反応させる方法には特に制限はなく、公知の方法を用いることができる。
具体的な反応方法としては、(1)テトラカルボン酸成分、ジアミン成分、及び反応溶剤を反応器に仕込み、室温(約20℃)〜80℃で0.5〜30時間撹拌し、その後に昇温してイミド化反応を行う方法、(2)ジアミン成分及び反応溶剤を反応器に仕込んで溶解させた後、テトラカルボン酸成分を仕込み、必要に応じて室温(約20℃)〜80℃で0.5〜30時間撹拌し、その後に昇温してイミド化反応を行う方法、(3)テトラカルボン酸成分、ジアミン成分、及び反応溶剤を反応器に仕込み、直ちに昇温してイミド化反応を行う方法等が挙げられる。The method for reacting the tetracarboxylic acid component with the diamine component for obtaining the imide oligomer in step 1 is not particularly limited, and a known method can be used.
Specific reaction methods include (1) charging a tetracarboxylic acid component, a diamine component, and a reaction solvent into a reactor, stirring at room temperature (about 20 ° C.) to 80 ° C. for 0.5 to 30 hours, and then ascending. Method of warming to carry out imidization reaction, (2) After charging the diamine component and reaction solvent into the reactor and dissolving them, the tetracarboxylic acid component is charged and, if necessary, at room temperature (about 20 ° C.) to 80 ° C. A method of stirring for 0.5 to 30 hours and then raising the temperature to carry out the imidization reaction. (3) The tetracarboxylic acid component, the diamine component, and the reaction solvent are charged into the reactor, and the temperature is immediately raised to carry out the imidization reaction. And the like.
イミド化反応では、ディーンスターク装置などを用いて、製造時に生成する水を除去しながら反応を行うことが好ましい。このような操作を行うことで、重合度及びイミド化率をより上昇させることができる。 In the imidization reaction, it is preferable to carry out the reaction while removing water generated during production using a Dean-Stark apparatus or the like. By performing such an operation, the degree of polymerization and the imidization rate can be further increased.
上記のイミド化反応においては、公知のイミド化触媒を用いることができる。イミド化触媒としては、塩基触媒又は酸触媒が挙げられる。
塩基触媒としては、ピリジン、キノリン、イソキノリン、α−ピコリン、β−ピコリン、2,4−ルチジン、2,6−ルチジン、トリメチルアミン、トリエチルアミン、トリプロピルアミン、トリブチルアミン、トリエチレンジアミン、イミダゾール、N,N−ジメチルアニリン、N,N−ジエチルアニリン等の有機塩基触媒、水酸化カリウムや水酸化ナトリウム、炭酸カリウム、炭酸ナトリウム、炭酸水素カリウム、炭酸水素ナトリウム等の無機塩基触媒が挙げられる。
また、酸触媒としては、クロトン酸、アクリル酸、トランス−3−ヘキセノイック酸、桂皮酸、安息香酸、メチル安息香酸、オキシ安息香酸、テレフタル酸、ベンゼンスルホン酸、パラトルエンスルホン酸、ナフタレンスルホン酸等が挙げられる。上記のイミド化触媒は単独で又は2種以上を組み合わせて用いてもよい。
上記のうち、取り扱い性の観点から、塩基触媒が好ましく、有機塩基触媒がより好ましく、トリエチルアミン及びトリエチレンジアミンから選ばれる1種以上が更に好ましく、トリエチルアミンがより更に好ましい。In the above imidization reaction, a known imidization catalyst can be used. Examples of the imidization catalyst include a base catalyst and an acid catalyst.
Base catalysts include pyridine, quinoline, isoquinoline, α-picoline, β-picoline, 2,4-lutidine, 2,6-lutidine, trimethylamine, triethylamine, tripropylamine, tributylamine, triethylenediamine, imidazole, N, N. Examples thereof include organic base catalysts such as -dimethylaniline and N, N-diethylaniline, and inorganic base catalysts such as potassium hydroxide, sodium hydroxide, potassium carbonate, sodium carbonate, potassium hydrogencarbonate and sodium hydrogencarbonate.
Examples of the acid catalyst include crotonic acid, acrylic acid, trans-3-hexenoic acid, cinnamic acid, benzoic acid, methylbenzoic acid, oxybenzoic acid, terephthalic acid, benzenesulfonic acid, paratoluenesulfonic acid, naphthalenesulfonic acid and the like. Can be mentioned. The above-mentioned imidization catalyst may be used alone or in combination of two or more.
Of the above, from the viewpoint of handleability, a base catalyst is preferable, an organic base catalyst is more preferable, one or more selected from triethylamine and triethylenediamine is more preferable, and triethylamine is even more preferable.
イミド化反応の温度は、反応率及びゲル化等の抑制の観点から、好ましくは120〜250℃、より好ましくは160〜200℃である。また、反応時間は、生成水の留出開始後、好ましくは0.5〜10時間である。 The temperature of the imidization reaction is preferably 120 to 250 ° C., more preferably 160 to 200 ° C. from the viewpoint of suppressing the reaction rate and gelation. The reaction time is preferably 0.5 to 10 hours after the start of distillation of the produced water.
工程1で得られたイミドオリゴマーは、構成単位(A−1)を与える化合物と構成単位(B−1)を与える化合物とから形成されるイミド繰り返し構造単位を有することが好ましい。
また、工程1で得られるオリゴマーは、分子鎖の主鎖の両末端にアミノ基を有することが好ましい。
上記方法により、溶剤に溶解したイミドオリゴマーを含む溶液が得られる。工程1で得られたイミドオリゴマーを含む溶液には、本発明の効果を損なわない範囲で、工程1においてテトラカルボン酸成分やジアミン成分として使用した成分の少なくとも一部が未反応モノマーとして含有されていてもよい。The imide oligomer obtained in step 1 preferably has an imide repeating structural unit formed from a compound giving a structural unit (A-1) and a compound giving a structural unit (B-1).
Further, the oligomer obtained in step 1 preferably has amino groups at both ends of the main chain of the molecular chain.
By the above method, a solution containing an imide oligomer dissolved in a solvent can be obtained. The solution containing the imide oligomer obtained in step 1 contains at least a part of the components used as the tetracarboxylic acid component and the diamine component in step 1 as unreacted monomers as long as the effects of the present invention are not impaired. You may.
<工程2>
本発明の製造方法における工程2は、工程1で得られたイミドオリゴマーと、アミド酸部分(A)を構成するテトラカルボン酸成分を反応させ、下記式(1)で表される、イミド部分(I)とアミド酸部分(A)とからなる繰り返し単位を含む、イミド−アミド酸共重合体を得る工程である。
工程2で使用するアミド酸部分(A)を構成するテトラカルボン酸成分は、芳香族テトラカルボン酸成分であることが好ましく、構成単位(A−2)を与える化合物を含むことがより好ましく、構成単位(A−1)を与える化合物を含んでいてもよい。ただし、工程2で使用するテトラカルボン酸成分は、構成単位(A−1−1)を与える化合物を含まないことが好ましい。また、構成単位(A−2)を与える化合物は、その全量を工程2で使用することが好ましい。
工程2終了後に、本発明のイミド−アミド酸共重合体にポリオルガノシロキサン単位を導入するために、ポリオルガノシロキサン単位を含有するジアミン又はテトラカルボン酸二無水物を反応させてもよく、ポリオルガノシロキサン単位を含有するジアミンを反応させることが好ましく、構成単位(B−2)を与える化合物を反応させることがより好ましい。<Process 2>
In step 2 of the production method of the present invention, the imide oligomer obtained in step 1 is reacted with the tetracarboxylic acid component constituting the amic acid moiety (A), and the imide moiety represented by the following formula (1) is used. This is a step of obtaining an imido-amide acid copolymer containing a repeating unit consisting of I) and the amic acid moiety (A).
The tetracarboxylic acid component constituting the amic acid moiety (A) used in step 2 is preferably an aromatic tetracarboxylic acid component, and more preferably contains a compound giving a constituent unit (A-2). It may contain a compound that gives the unit (A-1). However, the tetracarboxylic acid component used in step 2 preferably does not contain a compound that gives a constituent unit (A-1-1). Further, it is preferable that the entire amount of the compound giving the structural unit (A-2) is used in the step 2.
After completion of step 2, in order to introduce the polyorganosiloxane unit into the imide-amide acid copolymer of the present invention, a diamine or tetracarboxylic acid dianhydride containing the polyorganosiloxane unit may be reacted, and the polyorgano may be reacted. It is preferable to react with a diamine containing a siloxane unit, and more preferably to react with a compound giving a constituent unit (B-2).
工程2でイミド−アミド酸共重合体を得るための、テトラカルボン酸成分と工程1で得られたイミドオリゴマーとを反応させる方法には特に制限はなく、公知の方法を用いることができる。
具体的な反応方法としては、(1)工程1で得られたイミドオリゴマー、テトラカルボン酸成分及び溶剤を反応器に仕込み、0〜120℃、好ましくは5〜80℃の範囲で1〜72時間撹拌する方法、(2)工程1で得られたイミドオリゴマー及び溶剤を反応器に仕込んで溶解させた後、テトラカルボン酸成分を仕込み、0〜120℃、好ましくは5〜80℃の範囲で1〜72時間撹拌する方法、等が挙げられる。 80℃以下で反応させる場合には、工程2で得られる共重合体の分子量が重合時の温度履歴に依存して変動することなく、また熱イミド化の進行も抑制できるため、当該共重合体を安定して製造できる。The method for reacting the tetracarboxylic acid component with the imide oligomer obtained in step 1 for obtaining the imide-amide acid copolymer in step 2 is not particularly limited, and a known method can be used.
As a specific reaction method, (1) the imide oligomer, tetracarboxylic acid component and solvent obtained in step 1 are charged into the reactor, and the temperature is 0 to 120 ° C, preferably 5 to 80 ° C for 1 to 72 hours. Method of stirring, (2) The imide oligomer and solvent obtained in step 1 are charged into a reactor to dissolve them, and then a tetracarboxylic acid component is charged, and the temperature is in the range of 0 to 120 ° C, preferably 5 to 80 ° C. Examples thereof include a method of stirring for ~ 72 hours. When the reaction is carried out at 80 ° C. or lower, the molecular weight of the copolymer obtained in step 2 does not fluctuate depending on the temperature history at the time of polymerization, and the progress of thermal imidization can be suppressed. Can be manufactured stably.
本発明の製造方法で得られるイミド−アミド酸共重合体は、工程2におけるテトラカルボン酸成分と、工程2におけるジアミン成分と、工程1で得られるオリゴマーとの重付加反応の生成物である。
本発明のイミド−アミド酸共重合体は、工程1において構成単位(A−1)を与える化合物と構成単位(B−1)を与える化合物とから形成されるイミド繰り返し構造単位を有し、かつ工程2において構成単位(A−2)を与える化合物と前記構成単位(B−1)を与える化合物とから形成されるアミド酸構造単位を有することが好ましい。The imide-amidoic acid copolymer obtained by the production method of the present invention is a product of a polyaddition reaction between the tetracarboxylic acid component in step 2, the diamine component in step 2, and the oligomer obtained in step 1.
The imide-amide acid copolymer of the present invention has an imide repeating structural unit formed from a compound giving a structural unit (A-1) and a compound giving a structural unit (B-1) in step 1, and has an imide repeating structural unit. It is preferable to have an amic acid structural unit formed from the compound giving the structural unit (A-2) and the compound giving the structural unit (B-1) in the step 2.
上記方法により、溶剤に溶解したイミド−アミド酸共重合体を含む共重合体溶液が得られる。
得られる共重合体溶液中の共重合体の濃度は、通常1〜50質量%であり、好ましくは3〜35質量%、より好ましくは10〜30質量%の範囲である。By the above method, a copolymer solution containing an imide-amidoic acid copolymer dissolved in a solvent can be obtained.
The concentration of the copolymer in the obtained copolymer solution is usually 1 to 50% by mass, preferably 3 to 35% by mass, and more preferably 10 to 30% by mass.
本発明の製造方法で得られるイミド−アミド酸共重合体の数平均分子量は、得られるポリイミドフィルムの機械的強度の観点から、好ましくは5,000〜500,000である。また、重量平均分子量(Mw)は、同様の観点から、好ましくは10,000〜800,000であり、より好ましくは100,000〜300,000である。なお、当該共重合体の数平均分子量は、例えば、ゲルろ過クロマトグラフィー測定による標準ポリメチルメタクリレート(PMMA)換算値より求めることができる。
次に本製造方法で用いられる原料等について説明する。The number average molecular weight of the imide-amidoic acid copolymer obtained by the production method of the present invention is preferably 5,000 to 500,000 from the viewpoint of the mechanical strength of the obtained polyimide film. From the same viewpoint, the weight average molecular weight (Mw) is preferably 10,000 to 800,000, more preferably 100,000 to 300,000. The number average molecular weight of the copolymer can be determined from, for example, a standard polymethylmethacrylate (PMMA) conversion value measured by gel filtration chromatography.
Next, the raw materials and the like used in this production method will be described.
<テトラカルボン酸成分>
本製造方法におけるイミド−アミド酸共重合体の原料として用いられるテトラカルボン酸成分は、前記<イミド−アミド酸共重合体の実施形態>の(構成単位IA)及び(構成単位AA)に記載した、それぞれの構成単位を与える化合物を用いることが好ましい。たとえば、構成単位(A−1)を与える化合物としては、脂環式テトラカルボン酸二無水物(a−1)が挙げられるが、それに限られず、同じ構成単位を与える範囲でその誘導体であってもよい。当該誘導体としては、脂環式テトラカルボン酸二無水物(a−1)に対応する脂環式テトラカルボン酸及び当該脂環式テトラカルボン酸のアルキルエステルが挙げられる。構成単位(A−1)を与える化合物としては、脂環式テトラカルボン酸二無水物(a−1)が好ましい。
同様に、構成単位(A−2)を与える化合物としては、テトラカルボン酸二無水物(a−2)が挙げられるが、それに限られず、同じ構成単位を与える範囲でその誘導体であってもよい。当該誘導体としては、テトラカルボン酸二無水物(a−2)に対応するテトラカルボン酸及び当該テトラカルボン酸のアルキルエステルが挙げられる。構成単位(A−2)を与える化合物としては、テトラカルボン酸二無水物(a−2)が好ましい。<Tetracarboxylic acid component>
The tetracarboxylic acid component used as a raw material for the imide-amide acid copolymer in the present production method is described in (Constituent unit IA) and (Constituent unit AA) of the above <Imido-amide acid copolymer embodiment>. , It is preferable to use a compound that gives each constituent unit. For example, the compound that gives the structural unit (A-1) includes, but is not limited to, the alicyclic tetracarboxylic dianhydride (a-1), and is a derivative thereof within the range that gives the same structural unit. May be good. Examples of the derivative include an alicyclic tetracarboxylic acid corresponding to the alicyclic tetracarboxylic dianhydride (a-1) and an alkyl ester of the alicyclic tetracarboxylic acid. As the compound that gives the structural unit (A-1), an alicyclic tetracarboxylic dianhydride (a-1) is preferable.
Similarly, the compound giving the structural unit (A-2) includes, but is not limited to, tetracarboxylic dianhydride (a-2), and may be a derivative thereof as long as the same structural unit is given. .. Examples of the derivative include a tetracarboxylic acid corresponding to the tetracarboxylic dianhydride (a-2) and an alkyl ester of the tetracarboxylic acid. As the compound that gives the structural unit (A-2), tetracarboxylic dianhydride (a-2) is preferable.
本製造方法におけるイミド−アミド酸共重合体の原料として用いられるテトラカルボン酸成分中の、構成単位(A−1)を与える化合物と構成単位(A−2)を与える化合物とのモル比〔(A−1)/(A−2)モル比〕は、好ましくは10/90〜90/10であり、より好ましくは30/70〜85/15であり、更に好ましくは50/50〜80/20である。 The molar ratio of the compound giving the constituent unit (A-1) to the compound giving the constituent unit (A-2) in the tetracarboxylic acid component used as the raw material of the imide-amide acid copolymer in this production method [( A-1) / (A-2) molar ratio] is preferably 10/90 to 90/10, more preferably 30/70 to 85/15, and even more preferably 50/50 to 80/20. Is.
構成単位(A−1)を与える化合物としては、構成単位(A−1−1)を与える化合物、構成単位(A−1−2)を与える化合物、及び構成単位(A−1−3)を与える化合物が好ましく、構成単位(A−1−1)を与える化合物がより好ましい。構成単位(A−1)を与える化合物中の、構成単位(A−1−1)〜(A−1−3)を与える化合物の合計の比率は、好ましくは45モル%以上、より好ましくは70モル%以上、更に好ましくは90モル%以上、特に好ましくは99モル%以上である。その比率の上限値は特に限定されず、即ち、100モル%であり、特に構成単位(A−1)を与える化合物中の、構成単位(A−1−1)を与える化合物の比率は、好ましくは45モル%以上、より好ましくは70モル%以上、更に好ましくは90モル%以上、特に好ましくは99モル%以上である。その比率の上限値は特に限定されず、即ち、100モル%である。
構成単位(A−2)を与える化合物としては、構成単位(A−2−1)を与える化合物、構成単位(A−2−2)を与える化合物、構成単位(A−2−3)を与える化合物、及び構成単位(A−2−4)を与える化合物からなる群から選ばれる1種以上が好ましい。構成単位(A−2)を与える化合物中の、構成単位(A−2−1)〜(A−2−4)を与える化合物の合計の比率は、好ましくは45モル%以上、より好ましくは70モル%以上、更に好ましくは90モル%以上、特に好ましくは99モル%以上である。その比率の上限値は特に限定されず、即ち、100モル%である。
テトラカルボン酸成分には、構成単位(A−1−1)、構成単位(A−1−2)、構成単位(A−1−3)、構成単位(A−2−1)、構成単位(A−2−2)、構成単位(A−2−3)、及び構成単位(A−2−4)を与える化合物以外の化合物を含んでもよく、かかる化合物は、1種でもよいし、2種以上であってもよい。Examples of the compound that gives the structural unit (A-1) include a compound that gives the structural unit (A-1-1), a compound that gives the structural unit (A-1-2), and a structural unit (A-1--3). The compound to be given is preferable, and the compound to give the structural unit (A-1-1) is more preferable. The total ratio of the compounds giving the structural units (A-1-1) to (A-1--3) to the compounds giving the structural unit (A-1) is preferably 45 mol% or more, more preferably 70. It is mol% or more, more preferably 90 mol% or more, and particularly preferably 99 mol% or more. The upper limit of the ratio is not particularly limited, that is, it is 100 mol%, and the ratio of the compound giving the structural unit (A-1-1) to the compound giving the structural unit (A-1) is particularly preferable. Is 45 mol% or more, more preferably 70 mol% or more, still more preferably 90 mol% or more, and particularly preferably 99 mol% or more. The upper limit of the ratio is not particularly limited, that is, 100 mol%.
Examples of the compound that gives the structural unit (A-2) include a compound that gives the structural unit (A-2-1), a compound that gives the structural unit (A-2-2), and a structural unit (A-2-3). One or more selected from the group consisting of a compound and a compound giving a structural unit (A-2-4) is preferable. The total ratio of the compounds giving the structural units (A-2-1) to (A-2-4) to the compounds giving the structural unit (A-2) is preferably 45 mol% or more, more preferably 70. It is mol% or more, more preferably 90 mol% or more, and particularly preferably 99 mol% or more. The upper limit of the ratio is not particularly limited, that is, 100 mol%.
The tetracarboxylic acid component includes a constituent unit (A-1-1), a constituent unit (A-1-2), a constituent unit (A-1--3), a constituent unit (A-2-1), and a constituent unit ( A-2-2), a constituent unit (A-2-3), and a compound other than the compound giving the constituent unit (A-2-4) may be contained, and such a compound may be one kind or two kinds. It may be the above.
<ジアミン成分>
構成単位Bを与える化合物としては、ジアミンが挙げられるが、それに限られず、同じ構成単位を与える範囲でその誘導体であってもよい。当該誘導体としては、ジアミンに対応するジイソシアネートが挙げられる。構成単位Bを与える化合物としては、ジアミンが好ましい。
たとえば、構成単位(B−1)を与える化合物としては、式(b−1)で表される化合物(即ち、ジアミン)が好ましい。同様に、構成単位(B−3)を与える化合物としては、式(b−3)で表される化合物(即ち、ジアミン)が好ましい。<Diamine component>
The compound that gives the structural unit B includes, but is not limited to, a derivative thereof as long as the same structural unit is given. Examples of the derivative include diisocyanates corresponding to diamines. A diamine is preferable as the compound that gives the structural unit B.
For example, as the compound giving the structural unit (B-1), the compound represented by the formula (b-1) (that is, diamine) is preferable. Similarly, as the compound giving the structural unit (B-3), the compound represented by the formula (b-3) (that is, diamine) is preferable.
ジアミン成分は、構成単位(B−1)を与える化合物を、好ましくは45モル%以上、より好ましくは48モル%以上、更に好ましくは85モル%以上、より更に好ましくは88モル%以含み、好ましくは100モル%以下、より好ましくは99.5モル%以下、更に好ましくは99.0モル%以下含む。ジアミン成分は構成単位(B−1)を与える化合物のみからなっていてもよい。
ジアミン成分として構成単位(B−3)を与える化合物を含む場合、構成単位(B−3)を与える化合物を、全ジアミン成分中、好ましくは5〜65モル%、より好ましくは10〜55モル%、更に好ましくは25〜50モル%含む。
ジアミン成分は構成単位(B−1)を与える化合物及び構成単位(B−3)を与える化合物から選ばれる1種以上との組み合わせからなっていてもよい。The diamine component preferably contains a compound that gives the structural unit (B-1) in an amount of 45 mol% or more, more preferably 48 mol% or more, still more preferably 85 mol% or more, still more preferably 88 mol% or more, and preferably 88 mol% or more. Contains 100 mol% or less, more preferably 99.5 mol% or less, still more preferably 99.0 mol% or less. The diamine component may consist only of the compound giving the structural unit (B-1).
When the compound giving the structural unit (B-3) is contained as the diamine component, the compound giving the structural unit (B-3) is preferably 5 to 65 mol%, more preferably 10 to 55 mol% in the total diamine component. , More preferably 25 to 50 mol%.
The diamine component may consist of a combination of one or more selected from the compound giving the structural unit (B-1) and the compound giving the structural unit (B-3).
構成単位(B−1)を与える化合物及び構成単位(B−3)を与える化合物の合計の含有比率は、全ジアミン成分中、好ましくは45モル%以上、より好ましくは60モル%以上、更に好ましくは85モル%以上である。当該合計の含有比率の上限値は特に限定されず、即ち、100モル%である。 The total content ratio of the compound giving the structural unit (B-1) and the compound giving the structural unit (B-3) is preferably 45 mol% or more, more preferably 60 mol% or more, still more preferably 60 mol% or more, based on the total diamine components. Is 85 mol% or more. The upper limit of the total content ratio is not particularly limited, that is, 100 mol%.
ジアミン成分は構成単位(B−1)を与える化合物及び構成単位(B−3)を与える化合物以外の構成単位Bを与える化合物を含んでもよく、そのような化合物としては、上述の芳香族ジアミン、脂環式ジアミン、及び脂肪族ジアミン、並びにそれらの誘導体(ジイソシアネート等)が挙げられる。
ジアミン成分に任意に含まれる構成単位(B−1)及び(B−3)を与える化合物以外の化合物は、1種でもよいし、2種以上であってもよい。The diamine component may include a compound that gives a constituent unit (B-1) and a compound that gives a constituent unit B other than a compound that gives a constituent unit (B-3), and examples of such a compound include the above-mentioned aromatic diamine. Examples thereof include alicyclic diamines, aliphatic diamines, and derivatives thereof (diisocyanate, etc.).
The compound other than the compound that gives the structural units (B-1) and (B-3) arbitrarily contained in the diamine component may be one kind or two or more kinds.
共重合体中に構成単位(B−2)を与える化合物を含む場合、構成単位(B−2)を与える化合物とジアミン成分の合計量に対して、構成単位(B−2)を与える化合物を、好ましくは0.01〜15.0モル%、より好ましくは0.5〜12.0モル%、更に好ましくは1.0〜8.0モル%含む。 When the copolymer contains a compound that gives a structural unit (B-2), a compound that gives the structural unit (B-2) to the total amount of the compound that gives the structural unit (B-2) and the diamine component is used. , Preferably containing 0.01 to 15.0 mol%, more preferably 0.5 to 12.0 mol%, still more preferably 1.0 to 8.0 mol%.
本発明において、工程1、工程2及び工程2終了後の構成単位(B−2)を与える化合物等のその他の成分との反応工程を含めた共重合体の製造の全工程に用いるテトラカルボン酸成分とジアミン成分の仕込み量比は、テトラカルボン酸成分1モルに対してジアミン成分が0.9〜1.1モルであることが好ましい。 In the present invention, a tetracarboxylic acid used in all steps of producing a copolymer including a reaction step with other components such as a compound giving a constituent unit (B-2) after the completion of steps 1, 2 and 2 is completed. The ratio of the amount of the component to the diamine component charged is preferably 0.9 to 1.1 mol of the diamine component with respect to 1 mol of the tetracarboxylic acid component.
<末端封止剤>
また、本発明において、イミド−アミド酸共重合体の製造には、前述のテトラカルボン酸成分及びジアミン成分の他に、末端封止剤を用いてもよい。末端封止剤としてはモノアミン類あるいはジカルボン酸類が好ましい。導入される末端封止剤の仕込み量としては、テトラカルボン酸成分1モルに対して0.0001〜0.1モルが好ましく、特に0.001〜0.06モルが好ましい。モノアミン類末端封止剤としては、例えば、メチルアミン、エチルアミン、プロピルアミン、ブチルアミン、ベンジルアミン、4−メチルベンジルアミン、4−エチルベンジルアミン、4−ドデシルベンジルアミン、3−メチルベンジルアミン、3−エチルベンジルアミン、アニリン、3−メチルアニリン、4−メチルアニリン等が推奨される。これらのうち、ベンジルアミン、アニリンが好適に使用できる。ジカルボン酸類末端封止剤としては、ジカルボン酸類が好ましく、その一部を閉環していてもよい。例えば、フタル酸、無水フタル酸、4−クロロフタル酸、テトラフルオロフタル酸、2,3−ベンゾフェノンジカルボン酸、3,4−ベンゾフェノンジカルボン酸、シクロペンタン−1,2−ジカルボン酸、4−シクロヘキセン−1,2−ジカルボン酸等が推奨される。これらのうち、フタル酸、無水フタル酸が好適に使用できる。<Terminal sealant>
Further, in the present invention, in addition to the above-mentioned tetracarboxylic acid component and diamine component, an end-capping agent may be used for producing the imide-amidoic acid copolymer. As the terminal encapsulant, monoamines or dicarboxylic acids are preferable. The amount of the terminal encapsulant to be introduced is preferably 0.0001 to 0.1 mol, particularly preferably 0.001 to 0.06 mol, based on 1 mol of the tetracarboxylic acid component. Examples of monoamine terminal encapsulants include methylamine, ethylamine, propylamine, butylamine, benzylamine, 4-methylbenzylamine, 4-ethylbenzylamine, 4-dodecylbenzylamine, 3-methylbenzylamine, 3-. Ethylbenzylamine, aniline, 3-methylaniline, 4-methylaniline and the like are recommended. Of these, benzylamine and aniline can be preferably used. As the dicarboxylic acid terminal encapsulant, dicarboxylic acids are preferable, and a part thereof may be ring-closed. For example, phthalic acid, phthalic anhydride, 4-chlorophthalic acid, tetrafluorophthalic acid, 2,3-benzophenonedicarboxylic acid, 3,4-benzophenonedicarboxylic acid, cyclopentane-1,2-dicarboxylic acid, 4-cyclohexene-1. , 2-Dicarboxylic acid, etc. are recommended. Of these, phthalic acid and phthalic anhydride can be preferably used.
<溶剤>
本発明の共重合体の製造方法に用いられる溶剤は、生成するイミド−アミド共重合体を溶解できるものであればよい。例えば、非プロトン性溶剤、フェノール系溶剤、エーテル系溶剤、カーボネート系溶剤等が挙げられる。<Solvent>
The solvent used in the method for producing the copolymer of the present invention may be any solvent that can dissolve the produced imide-amide copolymer. For example, an aprotic solvent, a phenol solvent, an ether solvent, a carbonate solvent and the like can be mentioned.
非プロトン性溶剤の具体例としては、N,N−ジメチルホルムアミド、N,N−ジメチルアセトアミド、N−メチル−2−ピロリドン、N−メチルカプロラクタム、1,3−ジメチルイミダゾリジノン、テトラメチル尿素等のアミド系溶剤、γ−ブチロラクトン、γ−バレロラクトン等のラクトン系溶剤、ヘキサメチルホスホリックアミド、ヘキサメチルホスフィントリアミド等の含リン系アミド系溶剤、ジメチルスルホン、ジメチルスルホキシド、スルホラン等の含硫黄系溶剤、アセトン、メチルエチルケトン、シクロヘキサノン、メチルシクロヘキサノン等のケトン系溶剤、酢酸(2−メトキシ−1−メチルエチル)等のエステル系溶剤等が挙げられる。 Specific examples of the aprotonic solvent include N, N-dimethylformamide, N, N-dimethylacetamide, N-methyl-2-pyrrolidone, N-methylcaprolactam, 1,3-dimethylimidazolidinone, tetramethylurea and the like. Amide solvents, lactone solvents such as γ-butyrolactone and γ-valerolactone, phosphorus-containing amide solvents such as hexamethylphosphoric amide and hexamethylphosphintriamide, and sulfur-containing solvents such as dimethyl sulfone, dimethyl sulfoxide and sulfolane. Examples thereof include a system solvent, a ketone solvent such as acetone, methyl ethyl ketone, cyclohexanone and methylcyclohexanone, and an ester solvent such as acetic acid (2-methoxy-1-methylethyl).
フェノール系溶剤の具体例としては、フェノール、o−クレゾール、m−クレゾール、p−クレゾール、2,3−キシレノール、2,4−キシレノール、2,5−キシレノール、2,6−キシレノール、3,4−キシレノール、3,5−キシレノール等が挙げられる。
エーテル系溶剤の具体例としては、1,2−ジメトキシエタン、ビス(2−メトキシエチル)エーテル、1,2−ビス(2−メトキシエトキシ)エタン、ビス〔2−(2−メトキシエトキシ)エチル〕エーテル、テトラヒドロフラン、1,4−ジオキサン等が挙げられる。
カーボネート系溶剤の具体的な例としては、ジエチルカーボネート、メチルエチルカーボネート、エチレンカーボネート、プロピレンカーボネート等が挙げられる。
上記反応溶剤の中でも、アミド系溶剤又はラクトン系溶剤が好ましく、アミド系溶剤がより好ましく、N−メチル−2−ピロリドンが更に好ましい。上記の反応溶剤は単独で又は2種以上混合して用いてもよい。Specific examples of the phenolic solvent include phenol, o-cresol, m-cresol, p-cresol, 2,3-xylenol, 2,4-xylenol, 2,5-xylenol, 2,6-xylenol, 3,4. -Xylenol, 3,5-xylenol and the like can be mentioned.
Specific examples of the ether solvent include 1,2-dimethoxyethane, bis (2-methoxyethyl) ether, 1,2-bis (2-methoxyethoxy) ethane, and bis [2- (2-methoxyethoxy) ethyl]. Examples include ether, tetrahydrofuran, 1,4-dioxane and the like.
Specific examples of the carbonate solvent include diethyl carbonate, methyl ethyl carbonate, ethylene carbonate, propylene carbonate and the like.
Among the above reaction solvents, an amide solvent or a lactone solvent is preferable, an amide solvent is more preferable, and N-methyl-2-pyrrolidone is further preferable. The above reaction solvent may be used alone or in combination of two or more.
[ワニス]
本発明のワニスは、ポリイミド樹脂の前駆体である本発明のイミド−アミド酸共重合体が有機溶媒に溶解してなるものである。即ち、本発明のワニスは、本発明の共重合体及び有機溶媒を含み、当該共重合体は当該有機溶媒に溶解している。
有機溶媒は本発明の共重合体が溶解するものであればよく、特に限定されないが、本発明の共重合体の製造に用いられる溶剤として上述した化合物を、単独又は2種以上を混合して用いることが好ましい。
本発明のワニスは、上述の共重合体溶液そのものであってもよいし、又は当該共重合体溶液に対して更に希釈溶剤を追加したものであってもよい。[varnish]
The varnish of the present invention is obtained by dissolving the imide-amidoic acid copolymer of the present invention, which is a precursor of a polyimide resin, in an organic solvent. That is, the varnish of the present invention contains the copolymer of the present invention and an organic solvent, and the copolymer is dissolved in the organic solvent.
The organic solvent is not particularly limited as long as it dissolves the copolymer of the present invention, but the above-mentioned compounds are used alone or in combination of two or more as the solvent used for producing the copolymer of the present invention. It is preferable to use it.
The varnish of the present invention may be the above-mentioned copolymer solution itself, or may be obtained by further adding a diluting solvent to the copolymer solution.
本発明のワニスは、本発明の共重合体中のアミド酸部位のイミド化を効率よく進行させる観点から、更にイミド化触媒及び脱水触媒を含有させることができる。イミド化触媒としては、沸点が40℃以上180℃以下であるイミド化触媒であればよく、沸点が180℃以下のアミン化合物が好ましいものとして挙げられる。沸点が180℃以下のイミド化触媒であれば、フィルム形成後、高温での乾燥時に該フィルムが着色し、外観が損なわれるおそれがない。また、沸点が40℃以上のイミド化触媒であれば、十分にイミド化が進行する前に揮発する可能性を回避できる。
イミド化触媒として好適に用いられるアミン化合物としては、ピリジン又はピコリンが挙げられる。上記のイミド化触媒は単独で又は2種以上を組み合わせて用いてもよい。
脱水触媒としては、無水酢酸、プロピオン酸無水物、n−酪酸無水物、安息香酸無水物、トリフルオロ酢酸無水物等の酸無水物;ジシクロヘキシルカルボジイミド等のカルボジイミド化合物;等を挙げることができる。これらは単独で又は2種以上を組み合わせて用いてもよい。The varnish of the present invention may further contain an imidization catalyst and a dehydration catalyst from the viewpoint of efficiently advancing the imidization of the amic acid moiety in the copolymer of the present invention. The imidization catalyst may be any imidization catalyst having a boiling point of 40 ° C. or higher and 180 ° C. or lower, and an amine compound having a boiling point of 180 ° C. or lower is preferable. If the imidization catalyst has a boiling point of 180 ° C. or lower, the film is not colored when dried at a high temperature after the film is formed, and the appearance is not impaired. Further, if the imidization catalyst has a boiling point of 40 ° C. or higher, the possibility of volatilization before the imidization proceeds sufficiently can be avoided.
Examples of the amine compound preferably used as an imidization catalyst include pyridine and picoline. The above-mentioned imidization catalyst may be used alone or in combination of two or more.
Examples of the dehydration catalyst include acid anhydrides such as acetic anhydride, propionic acid anhydride, n-butyric acid anhydride, benzoic acid anhydride, and trifluoroacetic anhydride; and carbodiimide compounds such as dicyclohexylcarbodiimide. These may be used alone or in combination of two or more.
本発明のワニスに含まれる共重合体は溶媒溶解性を有しているため、高濃度のワニスとすることができる。本発明のワニスは、本発明の共重合体を3〜40質量%含む事が好ましく、5〜40質量%含むことがより好ましく、10〜30質量%含むことが更に好ましい。ワニスの粘度は0.1〜100Pa・sが好ましく、0.1〜20Pa・sがより好ましい。ワニスの粘度は、E型粘度計を用いて25℃で測定された値である。
また、本発明のワニスは、ポリイミドフィルムの要求特性を損なわない範囲で、無機フィラー、接着促進剤、剥離剤、難燃剤、紫外線安定剤、界面活性剤、レベリング剤、消泡剤、蛍光増白剤、架橋剤、重合開始剤、感光剤等各種添加剤を含んでもよい。
本発明のワニスの製造方法は特に限定されず、公知の方法を適用することができる。Since the copolymer contained in the varnish of the present invention has solvent solubility, it can be made into a high-concentration varnish. The varnish of the present invention preferably contains the copolymer of the present invention in an amount of 3 to 40% by mass, more preferably 5 to 40% by mass, and even more preferably 10 to 30% by mass. The viscosity of the varnish is preferably 0.1 to 100 Pa · s, more preferably 0.1 to 20 Pa · s. The viscosity of the varnish is a value measured at 25 ° C. using an E-type viscometer.
Further, the varnish of the present invention has an inorganic filler, an adhesion accelerator, a release agent, a flame retardant, an ultraviolet stabilizer, a surfactant, a leveling agent, an antifoaming agent, and an optical brightener as long as the required properties of the polyimide film are not impaired. Various additives such as an agent, a cross-linking agent, a polymerization initiator, and a photosensitizer may be contained.
The method for producing the varnish of the present invention is not particularly limited, and a known method can be applied.
[ポリイミドフィルム]
本発明のポリイミドフィルムは、本発明のイミド−アミド酸共重合体中のアミド酸部位をイミド化してなるポリイミド樹脂を含む。したがって、本発明のポリイミドフィルムは、保存安定性と成形加工性を両立することができ、更に無色透明性及び耐熱性に優れ、低リタデーション及び低残留応力を示す。本発明のポリイミドフィルムが有する好適な物性値は上述の通りである。
本発明のポリイミドフィルムは、前述の共重合体が有機溶媒に溶解してなるワニスを用いて製造することができる。[Polyimide film]
The polyimide film of the present invention contains a polyimide resin obtained by imidizing the amic acid moiety in the imide-amidoic acid copolymer of the present invention. Therefore, the polyimide film of the present invention can achieve both storage stability and molding processability, is also excellent in colorless transparency and heat resistance, and exhibits low retardation and low residual stress. Suitable physical property values of the polyimide film of the present invention are as described above.
The polyimide film of the present invention can be produced by using a varnish in which the above-mentioned copolymer is dissolved in an organic solvent.
本発明のワニスを用いてポリイミドフィルムを製造する方法には特に制限はなく、公知の方法を用いることができる。例えば、ガラス板、金属板、プラスチックなどの平滑な支持体上に本発明のワニスを塗布、又はフィルム状に成形した後、該ワニス中に含まれる反応溶剤や希釈溶剤等の有機溶媒を加熱により除去し、共重合体フィルムを得て、該共重合体フィルム中の共重合体のアミド酸部位を加熱によりイミド化(脱水閉環)し、次いで支持体から剥離することにより、ポリイミドフィルムを製造することができる。
本発明のポリイミドフィルムに含まれるポリイミド樹脂の重量平均分子量(Mw)は、フィルムの機械的強度の観点から、好ましくは10,000〜800,000であり、より好ましくは30,000〜500、000、更に好ましくは50,000〜400,000、100,000〜300,000である。なお、当該共重合体の数平均分子量は、例えば、ゲルろ過クロマトグラフィー測定による標準ポリメチルメタクリレート(PMMA)換算値より求めることができる。The method for producing a polyimide film using the varnish of the present invention is not particularly limited, and a known method can be used. For example, after the varnish of the present invention is applied or formed into a film on a smooth support such as a glass plate, a metal plate, or a plastic, an organic solvent such as a reaction solvent or a diluting solvent contained in the varnish is heated. A polyimide film is produced by removing it to obtain a copolymer film, imidizing (dehydrating and ring-closing) the amic acid moiety of the copolymer in the copolymer film by heating, and then peeling it from the support. be able to.
The weight average molecular weight (Mw) of the polyimide resin contained in the polyimide film of the present invention is preferably 10,000 to 800,000, more preferably 30,000 to 500,000 from the viewpoint of the mechanical strength of the film. , More preferably 50,000-400,000, 100,000-300,000. The number average molecular weight of the copolymer can be determined from, for example, a standard polymethylmethacrylate (PMMA) conversion value measured by gel filtration chromatography.
本発明のワニスを乾燥させて共重合体フィルムを得る際の加熱温度としては、好ましくは50〜150℃である。本発明の共重合体を加熱によりイミド化する際の加熱温度としては、好ましくは200〜500℃、より好ましくは250〜450℃、更に好ましくは300〜400℃の範囲から選択することができる。また、加熱時間は、通常1分〜6時間であり、好ましくは5分〜2時間、より好ましくは15分〜1時間である。
加熱雰囲気は、空気ガス、窒素ガス、酸素ガス、水素ガス、窒素/水素混合ガス等が挙げられるが、得られるポリイミド樹脂の着色を抑えるためには、酸素濃度が100ppm以下の窒素ガス、水素濃度が0.5%以下含む窒素/水素混合ガスが好ましい。
なお、イミド化の方法は熱イミド化に限定されず、化学イミド化を適用することもできる。The heating temperature for drying the varnish of the present invention to obtain a copolymer film is preferably 50 to 150 ° C. The heating temperature for imidizing the copolymer of the present invention by heating can be preferably selected from the range of 200 to 500 ° C., more preferably 250 to 450 ° C., and even more preferably 300 to 400 ° C. The heating time is usually 1 minute to 6 hours, preferably 5 minutes to 2 hours, and more preferably 15 minutes to 1 hour.
Examples of the heating atmosphere include air gas, nitrogen gas, oxygen gas, hydrogen gas, and nitrogen / hydrogen mixed gas. In order to suppress the coloring of the obtained polyimide resin, nitrogen gas and hydrogen concentration having an oxygen concentration of 100 ppm or less are used. A nitrogen / hydrogen mixed gas containing 0.5% or less is preferable.
The imidization method is not limited to thermal imidization, and chemical imidization can also be applied.
本発明のポリイミドフィルムの厚みは用途等に応じて適宜選択することができるが、好ましくは1〜250μm、より好ましくは5〜100μm、更に好ましくは7〜50μmの範囲である。厚みが1〜250μmであることで、自立膜としての実用的な使用が可能となる。
ポリイミドフィルムの厚みは、ワニスの固形分濃度や粘度を調整することにより、容易に制御することができる。The thickness of the polyimide film of the present invention can be appropriately selected depending on the intended use and the like, but is preferably in the range of 1 to 250 μm, more preferably 5 to 100 μm, and further preferably 7 to 50 μm. When the thickness is 1 to 250 μm, it can be practically used as a self-supporting film.
The thickness of the polyimide film can be easily controlled by adjusting the solid content concentration and viscosity of the varnish.
本発明のポリイミドフィルムは、カラーフィルター、フレキシブルディスプレイ、半導体部品、光学部材等の各種部材用のフィルムとして好適に用いられる。本発明のポリイミドフィルムは、液晶ディスプレイやOLEDディスプレイ等の画像表示装置の基板として、特に好適に用いられる。 The polyimide film of the present invention is suitably used as a film for various members such as color filters, flexible displays, semiconductor parts, and optical members. The polyimide film of the present invention is particularly preferably used as a substrate for an image display device such as a liquid crystal display or an OLED display.
以下に、実施例により本発明を具体的に説明する。但し、本発明はこれらの実施例により何ら制限されるものではない。
実施例及び比較例で得たフィルムの各物性は以下に示す方法によって測定した。Hereinafter, the present invention will be specifically described with reference to Examples. However, the present invention is not limited to these examples.
The physical characteristics of the films obtained in Examples and Comparative Examples were measured by the methods shown below.
(1)フィルム厚さ
フィルム厚さは、株式会社ミツトヨ製のマイクロメーターを用いて測定した。
(2)成形加工性
スピンコーターを用いて、実施例及び比較例で得られたワニスを100mm×100mmのガラス基板にワニスの厚さが100μmとなるように塗布し、23℃50%RHの環境下に保持した。目視にてフィルムの白化が確認できるまでの時間を測定した。白化し始めるまでの時間が長いほうが、プロセス上優位であり、成形加工性に優れる。
(3)保存安定性
実施例及び比較例で得られたワニスをガラス瓶に入れ、23℃で1週間保存した。製造直後のワニスの粘度と1週間保存後のワニスの粘度を測定し、1週間保存後のワニスの粘度を製造直後のワニスの粘度で除し、粘度の変化率(保存後粘度/製造直後粘度)を算出した。変化率、すなわち、粘度の増加率又は粘度の低下率が小さいものほど保存安定性に優れる。評価基準は、変化率が10%以下の場合をA、変化率が10%を超えた場合をBとした。なお、粘度はE型粘度計を用いて、23℃で測定した。
(4)全光線透過率、イエローインデックス(YI)
全光線透過率及びYIは、JIS K7105:1981に準拠し、日本電色工業株式会社製の色彩・濁度同時測定器「COH400」を用いて測定した。
(5)ガラス転移温度(Tg)
株式会社日立ハイテクサイエンス製の熱機械的分析装置「TMA/SS6100」を用いて、引張モードで試料サイズ3mm×20mm、荷重0.1N、窒素気流下(流量200mL/分)、昇温速度10℃/分の条件で、残留応力を取り除くのに十分な温度まで昇温して残留応力を取り除き、その後室温まで冷却した。その後、前記残留応力を取り除くための処理と同じ条件で試験片伸びの測定を行い、伸びの変曲点が見られたところをガラス転移温度として求めた。(1) Film thickness The film thickness was measured using a micrometer manufactured by Mitutoyo Co., Ltd.
(2) Moldability Using a spin coater, the varnishes obtained in Examples and Comparative Examples were applied to a glass substrate of 100 mm × 100 mm so that the thickness of the varnish was 100 μm, and the environment was 23 ° C. and 50% RH. Held down. The time until the whitening of the film could be visually confirmed was measured. The longer it takes to start whitening, the better the process and the better the moldability.
(3) Storage stability The varnishes obtained in Examples and Comparative Examples were placed in a glass bottle and stored at 23 ° C. for 1 week. The viscosity of the varnish immediately after production and the viscosity of the varnish after storage for 1 week are measured, and the viscosity of the varnish after storage for 1 week is divided by the viscosity of the varnish immediately after production. ) Was calculated. The smaller the rate of change, that is, the rate of increase in viscosity or the rate of decrease in viscosity, the better the storage stability. The evaluation criteria were A when the rate of change was 10% or less, and B when the rate of change exceeded 10%. The viscosity was measured at 23 ° C. using an E-type viscometer.
(4) Total light transmittance, yellow index (YI)
The total light transmittance and YI were measured in accordance with JIS K7105: 1981 using a color / turbidity simultaneous measuring device "COH400" manufactured by Nippon Denshoku Industries Co., Ltd.
(5) Glass transition temperature (Tg)
Using the thermomechanical analyzer "TMA / SS6100" manufactured by Hitachi High-Tech Science Co., Ltd., the sample size is 3 mm x 20 mm, the load is 0.1 N, under a nitrogen stream (flow rate 200 mL / min), and the temperature rise rate is 10 ° C. in tension mode. Under the condition of / min, the temperature was raised to a temperature sufficient to remove the residual stress to remove the residual stress, and then cooled to room temperature. Then, the elongation of the test piece was measured under the same conditions as the treatment for removing the residual stress, and the place where the inflection point of the elongation was observed was determined as the glass transition temperature.
(6)厚み位相差(Rth)
厚み位相差(Rth)は、日本分光株式会社製のエリプソメーター「M−220」を用いて測定した。測定波長590nmにおける、厚み位相差の値を測定した。なおRthは、ポリイミドフィルムの面内の屈折率のうち最大のものをnx、最小のものをnyとし、厚み方向の屈折率をnzとし、フィルムの厚みをdとしたとき、下記式によって表されるものである。
Rth=[{(nx+ny)/2}−nz]×d(6) Thickness phase difference (Rth)
The thickness phase difference (Rth) was measured using an ellipsometer "M-220" manufactured by JASCO Corporation. The value of the thickness phase difference at the measurement wavelength of 590 nm was measured. Rth is expressed by the following formula when the maximum in-plane refractive index of the polyimide film is nx, the minimum is ny, the refractive index in the thickness direction is nz, and the thickness of the film is d. It is a thing.
Rth = [{(nx + ny) / 2} -nz] × d
(7)残留応力
ケーエルエー・テンコール社製の残留応力測定装置「FLX−2320」を用いて、予め「反り量」を測定しておいた、厚み525μm±25μmの4インチシリコンウェハ上に、実施例及び比較例で得られたワニスを、スピンコーターを用いて塗布し、プリベークした。その後、熱風乾燥器を用いて、窒素雰囲気下、350℃30分(昇温速度5℃/分)の加熱硬化処理を施し、硬化後膜厚6〜20μmのポリイミドフィルムのついたシリコンウェハを作製した。このウェハの反り量を前述の残留応力測定装置を用いて測定し、シリコンウェハとポリイミドフィルムの間に生じた残留応力を評価した。(7) Residual stress Example using a residual stress measuring device "FLX-2320" manufactured by KLA Tencor Co., Ltd., on a 4-inch silicon wafer having a thickness of 525 μm ± 25 μm for which the “warp amount” has been measured in advance. And the varnish obtained in the comparative example was applied using a spin coater and prebaked. Then, using a hot air dryer, heat curing treatment was performed at 350 ° C. for 30 minutes (heating rate 5 ° C./min) in a nitrogen atmosphere to prepare a silicon wafer with a polyimide film having a thickness of 6 to 20 μm after curing. bottom. The amount of warpage of this wafer was measured using the above-mentioned residual stress measuring device, and the residual stress generated between the silicon wafer and the polyimide film was evaluated.
実施例及び比較例にて使用したテトラカルボン酸成分及びジアミン成分、並びにその略号等は下記の通りである。
<テトラカルボン酸成分>
CpODA:ノルボルナン−2−スピロ−α−シクロペンタノン−α’−スピロ−2’’−ノルボルナン−5,5’’,6,6’’−テトラカルボン酸二無水物(JXエネルギー株式会社製;式(a−1−1)で表される化合物)
HPMDA:1,2,4,5−シクロヘキサンテトラカルボン酸二無水物(脂環式テトラカルボン酸二無水物(a−1)に該当する化合物)
s−BPDA:3,3’,4,4’−ビフェニルテトラカルボン酸二無水物(三菱ケミカル株式会社製、式(a−2−1s)で表される化合物)
TAHQ:p−フェニレンビス(トリメリテート)二無水物(マナック株式会社製、式(a−2−2)で表される化合物)
ODPA:4,4’−オキシジフタル酸無水物(式(a−2−3)で表される化合物)
CBDA:1,2,3,4−シクロブタンテトラカルボン酸二無水物
6FDA:4,4’−(ヘキサフルオロイソプロピリデン)ジフタル酸無水物
<ジアミン成分>
6FODA:2,2’−ビス(トリフルオロメチル)−4,4’−ジアミノジフェニルエーテル(ChinaTech (Tianjin) Chemical Co., Ltd.製、式(b−1)で表される化合物)
BAFL:9,9−ビス(4−アミノフェニル)フルオレン(田岡化学工業株式会社製;式(b−3)で表される化合物)
<その他の成分>
X−22−1660B−3:両末端アミノ変性シリコーンオイル(信越化学工業株式会社製、式(b−2)で表される化合物(官能基当量:2200g/mol又は2170g/mol))The tetracarboxylic acid component and diamine component used in Examples and Comparative Examples, and their abbreviations and the like are as follows.
<Tetracarboxylic acid component>
CpODA: Norbornane-2-spiro-α-cyclopentanone-α'-spiro-2''-norbornane-5,5'', 6,6''-tetracarboxylic dianhydride (manufactured by JX Energy Co., Ltd .; Compound represented by formula (a-1-1))
HPMDA: 1,2,4,5-Cyclohexanetetracarboxylic dianhydride (compound corresponding to alicyclic tetracarboxylic dianhydride (a-1))
s-BPDA: 3,3', 4,4'-biphenyltetracarboxylic dianhydride (manufactured by Mitsubishi Chemical Corporation, compound represented by formula (a-2-1s))
TAHQ: p-phenylenebis (trimeritate) dianhydride (manufactured by Manac Inc., compound represented by formula (a-2-2))
ODPA: 4,4'-oxydiphthalic anhydride (compound represented by formula (a-2-3))
CBDA: 1,2,3,4-cyclobutanetetracarboxylic dianhydride 6FDA: 4,4'-(hexafluoroisopropyridene) diphthalic anhydride <diamine component>
6FODA: 2,2'-bis (trifluoromethyl) -4,4'-diaminodiphenyl ether (manufactured by ChinaTech (Tianjin) Chemical Co., Ltd., compound represented by formula (b-1))
BAFL: 9,9-bis (4-aminophenyl) fluorene (manufactured by Taoka Chemical Industry Co., Ltd .; compound represented by formula (b-3))
<Other ingredients>
X-22-1660B-3: Both-terminal amino-modified silicone oil (manufactured by Shin-Etsu Chemical Co., Ltd., compound represented by the formula (b-2) (functional group equivalent: 2200 g / mol or 2170 g / mol))
実施例及び比較例において使用した、溶媒及び触媒の略号等は下記の通りである。
NMP:N−メチル−2−ピロリドン(三菱ケミカル株式会社製)
TEA:トリエチルアミン(関東化学株式会社製)The abbreviations of the solvent and catalyst used in Examples and Comparative Examples are as follows.
NMP: N-methyl-2-pyrrolidone (manufactured by Mitsubishi Chemical Corporation)
TEA: Triethylamine (manufactured by Kanto Chemical Co., Inc.)
〈実施例1〉
ステンレス製半月型撹拌翼、窒素導入管、冷却管を取り付けたディーンスターク、温度計、ガラス製エンドキャップを備えた500mLの5つ口丸底フラスコに、6FODAを32.858g(0.0977モル)、及びNMPを90.000g投入し、系内温度70℃、窒素雰囲気下、回転数200rpmで撹拌して溶液を得た。
この溶液に、CpODA 22.936g(0.060モル)、及びNMP 22.500gを一括で添加した後、イミド化触媒としてTEAを0.302g投入し、マントルヒーターで加熱し、約20分かけて反応系内温度を190℃まで上げた。留去される成分を捕集し、回転数を粘度上昇に合わせて調整しつつ、反応系内温度を190℃に保持して1時間還流した。その後、NMPを54.435g添加して、反応系内温度を50℃まで冷却し、イミド繰り返し構造単位を有するオリゴマーを含む溶液を得た。
得られた溶液に、s−BPDA 11.704g(0.040モル)、及びNMP 8.065gを一括で添加し、50℃で5時間撹拌した。その後、NMPを107.143g添加し、均一化した後、NMP 17.857gにX−22−1660B−3を7.723g(0.002モル)溶解させた混合液を投入し、更に約1時間撹拌した。その後、固形分濃度が約15質量%になるようにNMPを添加し均一化させることで、イミド繰り返し構造単位とアミド酸構造単位とを有する共重合体を含むワニスを得た。
続いてガラス板上へ、得られたワニスをスピンコートにより塗布し、ホットプレートで80℃、20分間保持し、その後、空気雰囲気下、熱風乾燥機中350℃で30分加熱し溶媒を蒸発させ、ポリイミドフィルムを得た。結果を表1に示す。
実施例1のように、イミド繰り返し構造単位とアミド酸構造単位を有する共重合体を「PI−AA」と称する。<Example 1>
32.858 g (0.0977 mol) of 6FODA in a 500 mL five-necked round-bottom flask equipped with a stainless steel half-moon agitator, a nitrogen inlet tube, a Dean Stark with a cooling tube, a thermometer, and a glass end cap. , And 90.000 g of NMP were added, and the mixture was stirred at a system temperature of 70 ° C. and a nitrogen atmosphere at a rotation speed of 200 rpm to obtain a solution.
After adding 22.936 g (0.060 mol) of CpODA and 22.500 g of NMP in a batch to this solution, 0.302 g of TEA was added as an imidization catalyst and heated with a mantle heater over about 20 minutes. The temperature inside the reaction system was raised to 190 ° C. The components to be distilled off were collected, and the temperature inside the reaction system was maintained at 190 ° C. and refluxed for 1 hour while adjusting the rotation speed according to the increase in viscosity. Then, 54.435 g of NMP was added to cool the temperature inside the reaction system to 50 ° C. to obtain a solution containing an oligomer having an imide repeating structural unit.
To the obtained solution, 11.704 g (0.040 mol) of s-BPDA and 8.065 g of NMP were added all at once, and the mixture was stirred at 50 ° C. for 5 hours. Then, 107.143 g of NMP was added and homogenized, and then a mixed solution prepared by dissolving 7.723 g (0.002 mol) of X-22-1660B-3 in 17.857 g of NMP was added, and the mixture was further added for about 1 hour. Stirred. Then, NMP was added and homogenized so that the solid content concentration became about 15% by mass to obtain a varnish containing a copolymer having an imide repeating structural unit and an amic acid structural unit.
Subsequently, the obtained varnish is applied onto a glass plate by spin coating, held on a hot plate at 80 ° C. for 20 minutes, and then heated in a hot air dryer at 350 ° C. for 30 minutes in an air atmosphere to evaporate the solvent. , Polyimide film was obtained. The results are shown in Table 1.
A copolymer having an imide repeating structural unit and an amic acid structural unit as in Example 1 is referred to as "PI-AA".
〈実施例2〉
ステンレス製半月型撹拌翼、窒素導入管、冷却管を取り付けたディーンスターク、温度計、ガラス製エンドキャップを備えた500mLの5つ口丸底フラスコに、6FODAを26.953g(0.0802モル)、及びNMPを56.000g投入し、系内温度70℃、窒素雰囲気下、回転数200rpmで撹拌して溶液を得た。
この溶液に、CpODA 19.231g(0.050モル)、及びNMP 14.000gを一括で添加した後、イミド化触媒としてTEAを0.253g投入し、マントルヒーターで加熱し、約20分かけて反応系内温度を190℃まで上げた。留去される成分を捕集し、回転数を粘度上昇に合わせて調整しつつ、反応系内温度を190℃に保持して1時間還流した。その後、NMPを85.806g添加して、反応系内温度を50℃まで冷却し、イミド繰り返し構造単位を有するオリゴマーを含む溶液を得た。
得られた溶液に、s−BPDA 9.814g(0.033モル)、及びNMP 7.527gを一括で添加し50℃で5時間撹拌した。その後、NMPを100.000g添加し均一化した後、NMP 16.667gにX−22−1660B−3を14.002g(0.003モル)溶解させた混合液を投入し、更に約1時間撹拌し、固形分濃度が約20質量%の共重合体(PI−AA)を含むワニスを得た。
続いてガラス板上へ、得られたワニスをスピンコートにより塗布し、ホットプレートで80℃、20分間保持し、その後、空気雰囲気下、熱風乾燥機中350℃で30分加熱し溶媒を蒸発させ、ポリイミドフィルムを得た。結果を表1に示す。<Example 2>
26.953 g (0.0802 mol) of 6FODA in a 500 mL five-necked round-bottom flask equipped with a stainless steel half-moon agitator, a nitrogen inlet tube, a Dean Stark with a cooling tube, a thermometer, and a glass end cap. , And 56.000 g of NMP were added, and the mixture was stirred at a system temperature of 70 ° C. and a nitrogen atmosphere at a rotation speed of 200 rpm to obtain a solution.
To this solution, 19.231 g (0.050 mol) of CpODA and 14.000 g of NMP were added all at once, then 0.253 g of TEA was added as an imidization catalyst, and the mixture was heated with a mantle heater over about 20 minutes. The temperature inside the reaction system was raised to 190 ° C. The components to be distilled off were collected, and the temperature inside the reaction system was maintained at 190 ° C. and refluxed for 1 hour while adjusting the rotation speed according to the increase in viscosity. Then, 85.806 g of NMP was added to cool the temperature inside the reaction system to 50 ° C. to obtain a solution containing an oligomer having an imide repeating structural unit.
To the obtained solution, 9.814 g (0.033 mol) of s-BPDA and 7.527 g of NMP were added all at once, and the mixture was stirred at 50 ° C. for 5 hours. Then, after adding 100.000 g of NMP to homogenize, a mixed solution prepared by dissolving 14.002 g (0.003 mol) of X-22-1660B-3 in 16.667 g of NMP was added, and the mixture was further stirred for about 1 hour. Then, a varnish containing a copolymer (PI-AA) having a solid content concentration of about 20% by mass was obtained.
Subsequently, the obtained varnish is applied onto a glass plate by spin coating, held on a hot plate at 80 ° C. for 20 minutes, and then heated in a hot air dryer at 350 ° C. for 30 minutes in an air atmosphere to evaporate the solvent. , Polyimide film was obtained. The results are shown in Table 1.
〈実施例3〉
ステンレス製半月型撹拌翼、窒素導入管、冷却管を取り付けたディーンスターク、温度計、ガラス製エンドキャップを備えた500mLの5つ口丸底フラスコに、6FODAを25.096g(0.0746モル)、及びNMPを56.000g投入し、系内温度70℃、窒素雰囲気下、回転数200rpmで撹拌して溶液を得た。
この溶液に、CpODA 18.144g(0.047モル)、及びNMP 14.000gを一括で添加した後、イミド化触媒としてTEAを0.253g投入し、マントルヒーターで加熱し、約20分かけて反応系内温度を190℃まで上げた。留去される成分を捕集し、回転数を粘度上昇に合わせて調整しつつ、反応系内温度を190℃に保持して1時間還流した。その後、NMPを85.806g添加して、反応系内温度を50℃まで冷却し、イミド繰り返し構造単位を有するオリゴマーを含む溶液を得た。
得られた溶液に、s−BPDA 9.259g(0.0315モル)、及びNMP 7.527gを一括で添加し50℃で5時間撹拌した。その後、NMPを100.000g添加し均一化した後、NMP 16.667gにX−22−1660B−3を17.502g(0.004モル)溶解させた混合液を投入し、更に約1時間撹拌し、固形分濃度が約20質量%の共重合体(PI−AA)を含むワニスを得た。
続いてガラス板上へ、得られたワニスをスピンコートにより塗布し、ホットプレートで80℃、20分間保持し、その後、空気雰囲気下、熱風乾燥機中350℃で30分加熱し溶媒を蒸発させ、ポリイミドフィルムを得た。結果を表1に示す。<Example 3>
25.906 g (0.0746 mol) of 6FODA in a 500 mL five-necked round-bottom flask equipped with a stainless steel half-moon agitator, a nitrogen inlet tube, a Dean Stark with a cooling tube, a thermometer, and a glass end cap. , And 56.000 g of NMP were added, and the mixture was stirred at a system temperature of 70 ° C. and a nitrogen atmosphere at a rotation speed of 200 rpm to obtain a solution.
After adding 18.144 g (0.047 mol) of CpODA and 14.000 g of NMP in a batch to this solution, 0.253 g of TEA was added as an imidization catalyst, and the mixture was heated by a mantle heater over about 20 minutes. The temperature inside the reaction system was raised to 190 ° C. The components to be distilled off were collected, and the temperature inside the reaction system was maintained at 190 ° C. and refluxed for 1 hour while adjusting the rotation speed according to the increase in viscosity. Then, 85.806 g of NMP was added to cool the temperature inside the reaction system to 50 ° C. to obtain a solution containing an oligomer having an imide repeating structural unit.
To the obtained solution, 9.259 g (0.0315 mol) of s-BPDA and 7.527 g of NMP were added all at once, and the mixture was stirred at 50 ° C. for 5 hours. Then, after adding 100.000 g of NMP to homogenize, a mixed solution prepared by dissolving 17.502 g (0.004 mol) of X-22-1660B-3 in 16.667 g of NMP was added, and the mixture was further stirred for about 1 hour. Then, a varnish containing a copolymer (PI-AA) having a solid content concentration of about 20% by mass was obtained.
Subsequently, the obtained varnish is applied onto a glass plate by spin coating, held on a hot plate at 80 ° C. for 20 minutes, and then heated in a hot air dryer at 350 ° C. for 30 minutes in an air atmosphere to evaporate the solvent. , Polyimide film was obtained. The results are shown in Table 1.
〈実施例4〉
ステンレス製半月型撹拌翼、窒素導入管、冷却管を取り付けたディーンスターク、温度計、ガラス製エンドキャップを備えた500mLの5つ口丸底フラスコに、6FODAを14.806g(0.044モル)、BAFLを15.343g(0.044モル)及びNMPを56.000g投入し、系内温度70℃、窒素雰囲気下、回転数200rpmで撹拌して溶液を得た。
この溶液に、CpODA 27.576g(0.072モル)、及びNMP 14.000gを一括で添加した後、イミド化触媒としてTEAを0.363g投入し、マントルヒーターで加熱し、約20分かけて反応系内温度を190℃まで上げた。留去される成分を捕集し、回転数を粘度上昇に合わせて調整しつつ、反応系内温度を190℃に保持して1時間還流した。その後、NMPを85.806g添加して、反応系内温度を50℃まで冷却し、イミド繰り返し構造単位を有するオリゴマーを含む溶液を得た。
得られた溶液に、s−BPDA 5.277g(0.0179モル)、及びNMP 7.527gを一括で添加し50℃で5時間撹拌した。その後、NMPを100.000g添加し均一化した後、NMP 16.667gにX−22−1660B−3を6.998g(0.002モル)溶解させた混合液を投入し、更に約1時間撹拌し、固形分濃度が約20質量%の共重合体(PI−AA)を含むワニスを得た。
続いてガラス板上へ、得られたワニスをスピンコートにより塗布し、ホットプレートで80℃、20分間保持し、その後、空気雰囲気下、熱風乾燥機中350℃で30分加熱し溶媒を蒸発させ、ポリイミドフィルムを得た。結果を表1に示す。<Example 4>
14.806 g (0.044 mol) of 6FODA in a 500 mL five-necked round-bottom flask equipped with a stainless steel crescent-shaped stirring blade, a nitrogen inlet tube, a Dean Stark with a cooling tube, a thermometer, and a glass end cap. , BaFL (15.343 g (0.044 mol)) and NMP (56.000 g) were added, and the mixture was stirred at a system temperature of 70 ° C. and a nitrogen atmosphere at a rotation speed of 200 rpm to obtain a solution.
After adding 27.576 g (0.072 mol) of CpODA and 14.000 g of NMP to this solution all at once, 0.363 g of TEA was added as an imidization catalyst, and the mixture was heated with a mantle heater over about 20 minutes. The temperature inside the reaction system was raised to 190 ° C. The components to be distilled off were collected, and the temperature inside the reaction system was maintained at 190 ° C. and refluxed for 1 hour while adjusting the rotation speed according to the increase in viscosity. Then, 85.806 g of NMP was added to cool the temperature inside the reaction system to 50 ° C. to obtain a solution containing an oligomer having an imide repeating structural unit.
To the obtained solution, 5.277 g (0.0179 mol) of s-BPDA and 7.527 g of NMP were added all at once, and the mixture was stirred at 50 ° C. for 5 hours. Then, after adding 100.000 g of NMP to homogenize, a mixed solution prepared by dissolving 6.998 g (0.002 mol) of X-22-1660B-3 in 16.667 g of NMP was added, and the mixture was further stirred for about 1 hour. Then, a varnish containing a copolymer (PI-AA) having a solid content concentration of about 20% by mass was obtained.
Subsequently, the obtained varnish is applied onto a glass plate by spin coating, held on a hot plate at 80 ° C. for 20 minutes, and then heated in a hot air dryer at 350 ° C. for 30 minutes in an air atmosphere to evaporate the solvent. , Polyimide film was obtained. The results are shown in Table 1.
〈実施例5〉
ステンレス製半月型撹拌翼、窒素導入管、冷却管を取り付けたディーンスターク、温度計、ガラス製エンドキャップを備えた500mLの5つ口丸底フラスコに、6FODAを26.235g(0.0780モル)、及びNMPを56.000g投入し、系内温度70℃、窒素雰囲気下、回転数200rpmで撹拌して溶液を得た。
この溶液に、CpODA 24.985g(0.065モル)、及びNMP 14.000gを一括で添加した後、イミド化触媒としてTEAを0.329g投入し、マントルヒーターで加熱し、約20分かけて反応系内温度を190℃まで上げた。留去される成分を捕集し、回転数を粘度上昇に合わせて調整しつつ、反応系内温度を190℃に保持して1時間還流した。その後、NMPを85.806g添加して、反応系内温度を50℃まで冷却し、イミド繰り返し構造単位を有するオリゴマーを含む溶液を得た。
得られた溶液に、s−BPDA 4.781g(0.0163モル)、及びNMP 7.527gを一括で添加し50℃で5時間撹拌した。その後、NMPを100.000g添加し均一化した後、NMP 16.667gにX−22−1660B−3を13.999g(0.003モル)溶解させた混合液を投入し、更に約1時間撹拌し、固形分濃度が約20質量%の共重合体(PI−AA)を含むワニスを得た。
続いてガラス板上へ、得られたワニスをスピンコートにより塗布し、ホットプレートで80℃、20分間保持し、その後、空気雰囲気下、熱風乾燥機中350℃で30分加熱し溶媒を蒸発させ、ポリイミドフィルムを得た。結果を表1に示す。<Example 5>
26.235 g (0.0780 mol) of 6FODA in a 500 mL five-necked round-bottom flask equipped with a stainless steel half-moon agitator, a nitrogen inlet tube, a Dean Stark with a cooling tube, a thermometer, and a glass end cap. , And 56.000 g of NMP were added, and the mixture was stirred at a system temperature of 70 ° C. and a nitrogen atmosphere at a rotation speed of 200 rpm to obtain a solution.
After adding 24.985 g (0.065 mol) of CpODA and 14.000 g of NMP in a batch to this solution, 0.329 g of TEA was added as an imidization catalyst and heated with a mantle heater over about 20 minutes. The temperature inside the reaction system was raised to 190 ° C. The components to be distilled off were collected, and the temperature inside the reaction system was maintained at 190 ° C. and refluxed for 1 hour while adjusting the rotation speed according to the increase in viscosity. Then, 85.806 g of NMP was added to cool the temperature inside the reaction system to 50 ° C. to obtain a solution containing an oligomer having an imide repeating structural unit.
To the obtained solution, 4.781 g (0.0163 mol) of s-BPDA and 7.527 g of NMP were added all at once, and the mixture was stirred at 50 ° C. for 5 hours. Then, after adding 100.000 g of NMP to homogenize, a mixed solution prepared by dissolving 13.999 g (0.003 mol) of X-22-1660B-3 in 16.667 g of NMP was added, and the mixture was further stirred for about 1 hour. Then, a varnish containing a copolymer (PI-AA) having a solid content concentration of about 20% by mass was obtained.
Subsequently, the obtained varnish is applied onto a glass plate by spin coating, held on a hot plate at 80 ° C. for 20 minutes, and then heated in a hot air dryer at 350 ° C. for 30 minutes in an air atmosphere to evaporate the solvent. , Polyimide film was obtained. The results are shown in Table 1.
〈実施例6〉
ステンレス製半月型撹拌翼、窒素導入管、冷却管を取り付けたディーンスターク、温度計、ガラス製エンドキャップを備えた500mLの5つ口丸底フラスコに、6FODAを26.250g(0.0781モル)、及びNMPを60.000g投入し、系内温度70℃、窒素雰囲気下、回転数200rpmで撹拌して溶液を得た。
この溶液に、CpODA 18.802g(0.049モル)、及びNMP 15.000gを一括で添加した後、イミド化触媒としてTEAを0.247g投入し、マントルヒーターで加熱し、約20分かけて反応系内温度を190℃まで上げた。留去される成分を捕集し、回転数を粘度上昇に合わせて調整しつつ、反応系内温度を190℃に保持して1時間還流した。その後、NMPを91.135g添加して、反応系内温度を50℃まで冷却し、イミド繰り返し構造単位を有するオリゴマーを含む溶液を得た。
得られた溶液に、TAHQ 14.946g(0.0326モル)、及びNMP 8.865gを一括で添加し50℃で5時間撹拌した。その後、NMPを218.750g添加し均一化した後、NMP 31.250gにX−22−1660B−3を15.002g(0.003モル)溶解させた混合液を投入し、更に約1時間撹拌し、固形分濃度が約15質量%の共重合体(PI−AA)を含むワニスを得た。
続いてガラス板上へ、得られたドワニスをスピンコートにより塗布し、ホットプレートで80℃、20分間保持し、その後、空気雰囲気下、熱風乾燥機中350℃で30分加熱し溶媒を蒸発させ、ポリイミドフィルムを得た。結果を表1に示す。<Example 6>
26.250 g (0.0781 mol) of 6FODA in a 500 mL five-necked round-bottom flask equipped with a stainless steel half-moon agitator, a nitrogen inlet tube, a Dean Stark with a cooling tube, a thermometer, and a glass end cap. , And 60.000 g of NMP were added, and the mixture was stirred at a system temperature of 70 ° C. and a nitrogen atmosphere at a rotation speed of 200 rpm to obtain a solution.
After adding 18.802 g (0.049 mol) of CpODA and 15.000 g of NMP in a batch to this solution, 0.247 g of TEA was added as an imidization catalyst, and the mixture was heated by a mantle heater over about 20 minutes. The temperature inside the reaction system was raised to 190 ° C. The components to be distilled off were collected, and the temperature inside the reaction system was maintained at 190 ° C. and refluxed for 1 hour while adjusting the rotation speed according to the increase in viscosity. Then, 91.135 g of NMP was added to cool the temperature inside the reaction system to 50 ° C. to obtain a solution containing an oligomer having an imide repeating structural unit.
To the obtained solution, 14.946 g (0.0326 mol) of TAHQ and 8.865 g of NMP were added all at once, and the mixture was stirred at 50 ° C. for 5 hours. Then, after adding 218.750 g of NMP to homogenize, a mixed solution prepared by dissolving 15.002 g (0.003 mol) of X-22-1660B-3 in 31.250 g of NMP was added, and the mixture was further stirred for about 1 hour. Then, a varnish containing a copolymer (PI-AA) having a solid content concentration of about 15% by mass was obtained.
Subsequently, the obtained dwanis is applied onto a glass plate by spin coating, held on a hot plate at 80 ° C. for 20 minutes, and then heated in a hot air dryer at 350 ° C. for 30 minutes in an air atmosphere to evaporate the solvent. , Polyimide film was obtained. The results are shown in Table 1.
〈実施例7〉
ステンレス製半月型撹拌翼、窒素導入管、冷却管を取り付けたディーンスターク、温度計、ガラス製エンドキャップを備えた500mLの5つ口丸底フラスコに、6FODAを24.408g(0.0726モル)、及びNMPを60.000g投入し、系内温度70℃、窒素雰囲気下、回転数200rpmで撹拌して溶液を得た。
この溶液に、CpODA 17.738g(0.046モル)、及びNMP 15.000gを一括で添加した後、イミド化触媒としてTEAを0.233g投入し、マントルヒーターで加熱し、約20分かけて反応系内温度を190℃まで上げた。留去される成分を捕集し、回転数を粘度上昇に合わせて調整しつつ、反応系内温度を190℃に保持して1時間還流した。その後、NMPを91.135g添加して、反応系内温度を50℃まで冷却し、イミド繰り返し構造単位を有するオリゴマーを含む溶液を得た。
得られた溶液に、TAHQ 14.101g(0.0308モル)、及びNMP 8.865gを一括で添加し50℃で5時間撹拌した。その後、NMPを218.750g添加し均一化した後、NMP 31.250gにX−22−1660B−3を18.753g(0.004モル)溶解させた混合液を投入し、更に約1時間撹拌し、固形分濃度が約15質量%の共重合体(PI−AA)を含むワニスを得た。
続いてガラス板上へ、得られたワニスをスピンコートにより塗布し、ホットプレートで80℃、20分間保持し、その後、空気雰囲気下、熱風乾燥機中350℃で30分加熱し溶媒を蒸発させ、ポリイミドフィルムを得た。結果を表1に示す。<Example 7>
24.408 g (0.0726 mol) of 6FODA in a 500 mL five-necked round-bottom flask equipped with a stainless steel half-moon agitator, a nitrogen inlet tube, a Dean Stark with a cooling tube, a thermometer, and a glass end cap. , And 60.000 g of NMP were added, and the mixture was stirred at a system temperature of 70 ° C. and a nitrogen atmosphere at a rotation speed of 200 rpm to obtain a solution.
After adding 17.738 g (0.046 mol) of CpODA and 15.000 g of NMP to this solution all at once, 0.233 g of TEA was added as an imidization catalyst, and the mixture was heated with a mantle heater over about 20 minutes. The temperature inside the reaction system was raised to 190 ° C. The components to be distilled off were collected, and the temperature inside the reaction system was maintained at 190 ° C. and refluxed for 1 hour while adjusting the rotation speed according to the increase in viscosity. Then, 91.135 g of NMP was added to cool the temperature inside the reaction system to 50 ° C. to obtain a solution containing an oligomer having an imide repeating structural unit.
To the obtained solution, 14.101 g (0.0308 mol) of TAHQ and 8.865 g of NMP were added all at once, and the mixture was stirred at 50 ° C. for 5 hours. Then, after adding 218.750 g of NMP to homogenize, a mixed solution prepared by dissolving 18.753 g (0.004 mol) of X-22-1660B-3 in 31.250 g of NMP was added, and the mixture was further stirred for about 1 hour. Then, a varnish containing a copolymer (PI-AA) having a solid content concentration of about 15% by mass was obtained.
Subsequently, the obtained varnish is applied onto a glass plate by spin coating, held on a hot plate at 80 ° C. for 20 minutes, and then heated in a hot air dryer at 350 ° C. for 30 minutes in an air atmosphere to evaporate the solvent. , Polyimide film was obtained. The results are shown in Table 1.
〈実施例8〉
ステンレス製半月型撹拌翼、窒素導入管、冷却管を取り付けたディーンスターク、温度計、ガラス製エンドキャップを備えた500mLの5つ口丸底フラスコに、6FODAを34.383g(0.1023モル)、及びNMPを56.000g投入し、系内温度70℃、窒素雰囲気下、回転数200rpmで撹拌して溶液を得た。
この溶液に、CpODA 23.583g(0.061モル)、及びNMP 14.000gを一括で添加した後、イミド化触媒としてTEAを0.310g投入し、マントルヒーターで加熱し、約20分かけて反応系内温度を190℃まで上げた。留去される成分を捕集し、回転数を粘度上昇に合わせて調整しつつ、反応系内温度を190℃に保持して1時間還流した。その後、NMPを85.806g添加して、反応系内温度を50℃まで冷却し、イミド繰り返し構造単位を有するオリゴマーを含む溶液を得た。
得られた溶液に、s−BPDA 12.034g(0.0409モル)、及びNMP 7.527gを一括で添加し50℃で5時間撹拌した。その後、NMPを116.667g添加し均一化させ、固形分濃度が約20質量%の共重合体(PI−AA)を含むワニスを得た。
続いてガラス板上へ、得られたワニスをスピンコートにより塗布し、ホットプレートで80℃、20分間保持し、その後、空気雰囲気下、熱風乾燥機中350℃で30分加熱し溶媒を蒸発させ、ポリイミドフィルムを得た。結果を表1に示す。<Example 8>
34.383 g (0.1023 mol) of 6FODA in a 500 mL five-necked round-bottom flask equipped with a stainless steel half-moon agitator, a nitrogen inlet tube, a Dean Stark with a cooling tube, a thermometer, and a glass end cap. , And 56.000 g of NMP were added, and the mixture was stirred at a system temperature of 70 ° C. and a nitrogen atmosphere at a rotation speed of 200 rpm to obtain a solution.
After adding 23.583 g (0.061 mol) of CpODA and 14.000 g of NMP in a batch to this solution, 0.310 g of TEA was added as an imidization catalyst and heated with a mantle heater over about 20 minutes. The temperature inside the reaction system was raised to 190 ° C. The components to be distilled off were collected, and the temperature inside the reaction system was maintained at 190 ° C. and refluxed for 1 hour while adjusting the rotation speed according to the increase in viscosity. Then, 85.806 g of NMP was added to cool the temperature inside the reaction system to 50 ° C. to obtain a solution containing an oligomer having an imide repeating structural unit.
12.034 g (0.0409 mol) of s-BPDA and 7.527 g of NMP were added collectively to the obtained solution, and the mixture was stirred at 50 ° C. for 5 hours. Then, 116.667 g of NMP was added and homogenized to obtain a varnish containing a copolymer (PI-AA) having a solid content concentration of about 20% by mass.
Subsequently, the obtained varnish is applied onto a glass plate by spin coating, held on a hot plate at 80 ° C. for 20 minutes, and then heated in a hot air dryer at 350 ° C. for 30 minutes in an air atmosphere to evaporate the solvent. , Polyimide film was obtained. The results are shown in Table 1.
〈実施例9〉
ステンレス製半月型撹拌翼、窒素導入管、冷却管を取り付けたディーンスターク、温度計、ガラス製エンドキャップを備えた500mLの5つ口丸底フラスコに、6FODAを26.694g(0.0794モル)、及びNMPを56.000g投入し、系内温度70℃、窒素雰囲気下、回転数200rpmで撹拌して溶液を得た。
この溶液に、CpODAを19.053g(0.0496モル)、及びNMP 14.000gを一括で添加した後、イミド化触媒としてTEAを0.251g投入し、マントルヒーターで加熱し、約20分かけて反応系内温度を190℃まで上げた。留去される成分を捕集し、回転数を粘度上昇に合わせて調整しつつ、反応系内温度を190℃に保持して1時間還流した。その後、NMPを85.806g添加して、反応系内温度を50℃まで冷却し、イミド繰り返し構造単位を有するオリゴマーを含む溶液を得た。
得られた溶液に、ODPA 10.251g(0.0330モル)、及びNMP 7.527gを一括で添加し50℃で5時間撹拌した。その後、NMPを100.000g添加し均一化した後、NMP 16.667gにX−22−1660B−3を14.001g(0.00323モル)溶解させた混合液を投入し、更に約1時間撹拌し、固形分濃度が約20質量%の共重合体(PI−AA)を含むワニスを得た。
続いてガラス板上へ、得られたワニスをスピンコートにより塗布し、ホットプレートで80℃、20分間保持し、その後、空気雰囲気下、熱風乾燥機中350℃で30分加熱し溶媒を蒸発させ、ポリイミドフィルムを得た。結果を表1に示す。<Example 9>
26.694 g (0.0794 mol) of 6FODA in a 500 mL five-necked round-bottom flask equipped with a stainless steel crescent-shaped stirring blade, a nitrogen inlet tube, a Dean Stark with a cooling tube, a thermometer, and a glass end cap. , And 56.000 g of NMP were added, and the mixture was stirred at a system temperature of 70 ° C. and a nitrogen atmosphere at a rotation speed of 200 rpm to obtain a solution.
To this solution, 19.053 g (0.0496 mol) of CpODA and 14.000 g of NMP were added all at once, then 0.251 g of TEA was added as an imidization catalyst, and the mixture was heated with a mantle heater for about 20 minutes. The temperature inside the reaction system was raised to 190 ° C. The components to be distilled off were collected, and the temperature inside the reaction system was maintained at 190 ° C. and refluxed for 1 hour while adjusting the rotation speed according to the increase in viscosity. Then, 85.806 g of NMP was added to cool the temperature inside the reaction system to 50 ° C. to obtain a solution containing an oligomer having an imide repeating structural unit.
To the obtained solution, 10.251 g (0.0330 mol) of ODPA and 7.527 g of NMP were added all at once, and the mixture was stirred at 50 ° C. for 5 hours. Then, after adding 100.000 g of NMP to homogenize, a mixed solution prepared by dissolving 14.001 g (0.00323 mol) of X-22-1660B-3 in 16.667 g of NMP was added, and the mixture was further stirred for about 1 hour. Then, a varnish containing a copolymer (PI-AA) having a solid content concentration of about 20% by mass was obtained.
Subsequently, the obtained varnish is applied onto a glass plate by spin coating, held on a hot plate at 80 ° C. for 20 minutes, and then heated in a hot air dryer at 350 ° C. for 30 minutes in an air atmosphere to evaporate the solvent. , Polyimide film was obtained. The results are shown in Table 1.
〈実施例10〉
ステンレス製半月型撹拌翼、窒素導入管、冷却管を取り付けたディーンスターク、温度計、ガラス製エンドキャップを備えた500mLの5つ口丸底フラスコに、6FODAを31.535g(0.0938モル)、及びNMPを56.000g投入し、系内温度70℃、窒素雰囲気下、回転数200rpmで撹拌して溶液を得た。
この溶液に、HPMDA 13.048g(0.0582モル)、及びNMP 14.000gを一括で添加した後、イミド化触媒としてTEAを0.295g投入し、マントルヒーターで加熱し、約20分かけて反応系内温度を190℃まで上げた。留去される成分を捕集し、回転数を粘度上昇に合わせて調整しつつ、反応系内温度を190℃に保持して1時間還流した。その後、NMPを85.806g添加して、反応系内温度を50℃まで冷却し、イミド繰り返し構造単位を有するオリゴマーを含む溶液を得た。
得られた溶液に、s−BPDA 11.417g(0.0388モル)、及びNMP 7.527gを一括で添加し50℃で5時間撹拌した。その後、NMPを100.000g添加し均一化した後、NMP 16.667gにX−22−1660B−3を13.999g(0.00323モル)溶解させた混合液を投入し、更に約1時間撹拌し、固形分濃度が約20質量%の共重合体(PI−AA)を含むワニスを得た。
続いてガラス板上へ、得られたワニスをスピンコートにより塗布し、ホットプレートで80℃、20分間保持し、その後、空気雰囲気下、熱風乾燥機中350℃で30分加熱し溶媒を蒸発させ、ポリイミドフィルムを得た。結果を表1に示す。<Example 10>
31.535g (0.0938mol) of 6FODA in a 500mL five-necked round-bottom flask equipped with a stainless half-moon stirring blade, a nitrogen inlet tube, a Dean Stark with a cooling tube, a thermometer, and a glass end cap. , And 56.000 g of NMP were added, and the mixture was stirred at a system temperature of 70 ° C. and a nitrogen atmosphere at a rotation speed of 200 rpm to obtain a solution.
After adding 13.048 g (0.0582 mol) of HPMDA and 14.000 g of NMP in a batch to this solution, 0.295 g of TEA was added as an imidization catalyst and heated with a mantle heater over about 20 minutes. The temperature inside the reaction system was raised to 190 ° C. The components to be distilled off were collected, and the temperature inside the reaction system was maintained at 190 ° C. and refluxed for 1 hour while adjusting the rotation speed according to the increase in viscosity. Then, 85.806 g of NMP was added to cool the temperature inside the reaction system to 50 ° C. to obtain a solution containing an oligomer having an imide repeating structural unit.
11.417 g (0.0388 mol) of s-BPDA and 7.527 g of NMP were added collectively to the obtained solution, and the mixture was stirred at 50 ° C. for 5 hours. Then, after adding 100.000 g of NMP to homogenize, a mixed solution prepared by dissolving 13.999 g (0.00323 mol) of X-22-1660B-3 in 16.667 g of NMP was added, and the mixture was further stirred for about 1 hour. Then, a varnish containing a copolymer (PI-AA) having a solid content concentration of about 20% by mass was obtained.
Subsequently, the obtained varnish is applied onto a glass plate by spin coating, held on a hot plate at 80 ° C. for 20 minutes, and then heated in a hot air dryer at 350 ° C. for 30 minutes in an air atmosphere to evaporate the solvent. , Polyimide film was obtained. The results are shown in Table 1.
〈実施例11〉
ステンレス製半月型撹拌翼、窒素導入管、冷却管を取り付けたディーンスターク、温度計、ガラス製エンドキャップを備えた500mLの5つ口丸底フラスコに、6FODAを29.073g(0.0865モル)、及びNMPを56.000g投入し、系内温度70℃、窒素雰囲気下、回転数200rpmで撹拌して溶液を得た。
この溶液に、CpODA 10.343g(0.0269モル)、HPMDA 6.032g(0.0269モル)、及びNMP 14.000gを一括で添加した後、イミド化触媒としてTEAを0.272g投入し、マントルヒーターで加熱し、約20分かけて反応系内温度を190℃まで上げた。留去される成分を捕集し、回転数を粘度上昇に合わせて調整しつつ、反応系内温度を190℃に保持して1時間還流した。その後、NMPを85.806g添加して、反応系内温度を50℃まで冷却し、イミド繰り返し構造単位を有するオリゴマーを含む溶液を得た。
得られた溶液に、s−BPDA 10.556g(0.0359モル)、及びNMP7.527gを一括で添加し50℃で5時間撹拌した。その後、NMPを100.000g添加し均一化した後、NMP 16.667gにX−22−1660B−3を13.998g(0.00323モル)溶解させた混合液を投入し、更に約1時間撹拌し、固形分濃度が約20質量%の共重合体(PI−AA)を含むワニスを得た。
続いてガラス板上へ、得られたワニスをスピンコートにより塗布し、ホットプレートで80℃、20分間保持し、その後、空気雰囲気下、熱風乾燥機中350℃で30分加熱し溶媒を蒸発させ、ポリイミドフィルムを得た。結果を表1に示す。<Example 11>
29.073 g (0.0865 mol) of 6FODA in a 500 mL five-necked round-bottom flask equipped with a stainless steel half-moon agitator, a nitrogen inlet tube, a Dean Stark with a cooling tube, a thermometer, and a glass end cap. , And 56.000 g of NMP were added, and the mixture was stirred at a system temperature of 70 ° C. and a nitrogen atmosphere at a rotation speed of 200 rpm to obtain a solution.
To this solution, 10.343 g (0.0269 mol) of CpODA, 6.032 g (0.0269 mol) of HPMDA, and 14.000 g of NMP were added all at once, and then 0.272 g of TEA was added as an imidization catalyst. It was heated with a mantle heater and the temperature inside the reaction system was raised to 190 ° C. over about 20 minutes. The components to be distilled off were collected, and the temperature inside the reaction system was maintained at 190 ° C. and refluxed for 1 hour while adjusting the rotation speed according to the increase in viscosity. Then, 85.806 g of NMP was added to cool the temperature inside the reaction system to 50 ° C. to obtain a solution containing an oligomer having an imide repeating structural unit.
To the obtained solution, 10.556 g (0.0359 mol) of s-BPDA and 7.527 g of NMP were added all at once, and the mixture was stirred at 50 ° C. for 5 hours. Then, after adding 100.000 g of NMP to homogenize, a mixed solution prepared by dissolving 13.998 g (0.00323 mol) of X-22-1660B-3 in 16.667 g of NMP was added, and the mixture was further stirred for about 1 hour. Then, a varnish containing a copolymer (PI-AA) having a solid content concentration of about 20% by mass was obtained.
Subsequently, the obtained varnish is applied onto a glass plate by spin coating, held on a hot plate at 80 ° C. for 20 minutes, and then heated in a hot air dryer at 350 ° C. for 30 minutes in an air atmosphere to evaporate the solvent. , Polyimide film was obtained. The results are shown in Table 1.
〈実施例12〉
ステンレス製半月型撹拌翼、窒素導入管、冷却管を取り付けたディーンスターク、温度計、ガラス製エンドキャップを備えた500mLの5つ口丸底フラスコに、6FODAを29.554g(0.0879モル)、及びNMPを56.000g投入し、系内温度70℃、窒素雰囲気下、回転数200rpmで撹拌して溶液を得た。
この溶液に、CpODAを17.512g(0.0456モル)、及びNMP 14.000gを一括で添加した後、イミド化触媒としてTEAを0.231g投入し、マントルヒーターで加熱し、約20分かけて反応系内温度を190℃まで上げた。留去される成分を捕集し、回転数を粘度上昇に合わせて調整しつつ、反応系内温度を190℃に保持して1時間還流した。その後、NMPを85.806g添加して、反応系内温度を50℃まで冷却し、イミド繰り返し構造単位を有するオリゴマーを含む溶液を得た。
得られた溶液に、CBDA 8.935g(0.0456モル)、及びNMP 7.527gを一括で添加し50℃で5時間撹拌した。その後、NMPを100.000g添加し均一化した後、NMP 16.667gにX−22−1660B−3を13.999g(0.00323モル)溶解させた混合液を投入し、更に約1時間撹拌し、固形分濃度が約20質量%の共重合体(PI−AA)を含むワニスを得た。
続いてガラス板上へ、得られたワニスをスピンコートにより塗布し、ホットプレートで80℃、20分間保持し、その後、空気雰囲気下、熱風乾燥機中350℃で30分加熱し溶媒を蒸発させ、ポリイミドフィルムを得た。結果を表1に示す。<Example 12>
29.554 g (0.0879 mol) of 6FODA in a 500 mL five-necked round-bottom flask equipped with a stainless steel half-moon agitator, a nitrogen inlet tube, a Dean Stark with a cooling tube, a thermometer, and a glass end cap. , And 56.000 g of NMP were added, and the mixture was stirred at a system temperature of 70 ° C. and a nitrogen atmosphere at a rotation speed of 200 rpm to obtain a solution.
After adding 17.512 g (0.0456 mol) of CpODA and 14.000 g of NMP in a batch to this solution, 0.231 g of TEA was added as an imidization catalyst, heated with a mantle heater, and took about 20 minutes. The temperature inside the reaction system was raised to 190 ° C. The components to be distilled off were collected, and the temperature inside the reaction system was maintained at 190 ° C. and refluxed for 1 hour while adjusting the rotation speed according to the increase in viscosity. Then, 85.806 g of NMP was added to cool the temperature inside the reaction system to 50 ° C. to obtain a solution containing an oligomer having an imide repeating structural unit.
To the obtained solution, 8.935 g (0.0456 mol) of CBDA and 7.527 g of NMP were added all at once, and the mixture was stirred at 50 ° C. for 5 hours. Then, after adding 100.000 g of NMP to homogenize, a mixed solution prepared by dissolving 13.999 g (0.00323 mol) of X-22-1660B-3 in 16.667 g of NMP was added, and the mixture was further stirred for about 1 hour. Then, a varnish containing a copolymer (PI-AA) having a solid content concentration of about 20% by mass was obtained.
Subsequently, the obtained varnish is applied onto a glass plate by spin coating, held on a hot plate at 80 ° C. for 20 minutes, and then heated in a hot air dryer at 350 ° C. for 30 minutes in an air atmosphere to evaporate the solvent. , Polyimide film was obtained. The results are shown in Table 1.
〈実施例13〉
ステンレス製半月型撹拌翼、窒素導入管、冷却管を取り付けたディーンスターク、温度計、ガラス製エンドキャップを備えた500mLの5つ口丸底フラスコに、6FODAを25.114g(0.0747モル)、及びNMPを56.000g投入し、系内温度70℃、窒素雰囲気下、回転数200rpmで撹拌して溶液を得た。
この溶液に、CpODA 23.960g(0.0623モル)、及びNMP 14.000gを一括で添加した後、イミド化触媒としてTEAを0.315g投入し、マントルヒーターで加熱し、約20分かけて反応系内温度を190℃まで上げた。留去される成分を捕集し、回転数を粘度上昇に合わせて調整しつつ、反応系内温度を190℃に保持して1時間還流した。その後、NMPを85.806g添加して、反応系内温度を50℃まで冷却し、イミド繰り返し構造単位を有するオリゴマーを含む溶液を得た。
得られた溶液に、6FDA 6.923g(0.0156モル)、及びNMP 7.527gを一括で添加し50℃で5時間撹拌した。その後、NMPを100.000g添加し均一化した後、NMP 16.667gにX−22−1660B−3を14.003g(0.00323モル)溶解させた混合液を投入し、更に約1時間撹拌し、固形分濃度が約20質量%の共重合体(PI−AA)を含むワニスを得た。
続いてガラス板上へ、得られたワニスをスピンコートにより塗布し、ホットプレートで80℃、20分間保持し、その後、空気雰囲気下、熱風乾燥機中350℃で30分加熱し溶媒を蒸発させ、ポリイミドフィルムを得た。結果を表1に示す。<Example 13>
25.114 g (0.0747 mol) of 6FODA in a 500 mL five-necked round-bottom flask equipped with a stainless steel half-moon agitator, a nitrogen inlet tube, a Dean Stark with a cooling tube, a thermometer, and a glass end cap. , And 56.000 g of NMP were added, and the mixture was stirred at a system temperature of 70 ° C. and a nitrogen atmosphere at a rotation speed of 200 rpm to obtain a solution.
After adding 23.960 g (0.0623 mol) of CpODA and 14.000 g of NMP in a batch to this solution, 0.315 g of TEA was added as an imidization catalyst and heated with a mantle heater over about 20 minutes. The temperature inside the reaction system was raised to 190 ° C. The components to be distilled off were collected, and the temperature inside the reaction system was maintained at 190 ° C. and refluxed for 1 hour while adjusting the rotation speed according to the increase in viscosity. Then, 85.806 g of NMP was added to cool the temperature inside the reaction system to 50 ° C. to obtain a solution containing an oligomer having an imide repeating structural unit.
To the obtained solution, 6.923 g (0.0156 mol) of 6FDA and 7.527 g of NMP were added all at once, and the mixture was stirred at 50 ° C. for 5 hours. Then, after adding 100.000 g of NMP to homogenize, a mixed solution prepared by dissolving 14.003 g (0.00323 mol) of X-22-1660B-3 in 16.667 g of NMP was added, and the mixture was further stirred for about 1 hour. Then, a varnish containing a copolymer (PI-AA) having a solid content concentration of about 20% by mass was obtained.
Subsequently, the obtained varnish is applied onto a glass plate by spin coating, held on a hot plate at 80 ° C. for 20 minutes, and then heated in a hot air dryer at 350 ° C. for 30 minutes in an air atmosphere to evaporate the solvent. , Polyimide film was obtained. The results are shown in Table 1.
〈比較例1〉
ステンレス製半月型撹拌翼、窒素導入管、冷却管を取り付けたディーンスターク、温度計、ガラス製エンドキャップを備えた500mLの5つ口丸底フラスコに、6FODAを36.293g(0.1079モル)、及びNMPを59.112g投入し、系内温度70℃、窒素雰囲気下、回転数200rpmで撹拌して溶液を得た。
この溶液に、CpODAを24.894g(0.065モル)、s−BPDA 12.703g(0.043モル)、及びNMP 14.778gを一括で添加した後、イミド化触媒としてTEAを0.546g投入し、マントルヒーターで加熱し、約20分かけて反応系内温度を190℃まで上げた。留去される成分を捕集し、回転数を粘度上昇に合わせて調整しつつ、反応系内温度を190℃に保持して3時間還流した。
その後、固形分濃度が約20質量%となるようにNMPを201.110g添加して、反応系内温度を100℃まで冷却した後、更に約1時間撹拌して均一化して、ポリイミド(PI)ワニスを得た。
続いてガラス板上へ、得られたポリイミドワニスをスピンコートにより塗布し、ホットプレートで80℃、20分間保持し、その後、空気雰囲気下、熱風乾燥機中350℃で30分加熱し溶媒を蒸発させ、ポリイミドフィルムを得た。結果を表1に示す。<Comparative example 1>
36.293 g (0.1079 mol) of 6FODA in a 500 mL five-necked round-bottom flask equipped with a stainless steel half-moon agitator, a nitrogen inlet tube, a Dean Stark with a cooling tube, a thermometer, and a glass end cap. , And 59.112 g of NMP were added, and the mixture was stirred at a system temperature of 70 ° C. and a nitrogen atmosphere at a rotation speed of 200 rpm to obtain a solution.
To this solution, 24.894 g (0.065 mol) of CpODA, 12.703 g (0.043 mol) of s-BPDA, and 14.778 g of NMP were added all at once, and then 0.546 g of TEA as an imidization catalyst was added. The mixture was charged and heated with a mantle heater, and the temperature inside the reaction system was raised to 190 ° C. over about 20 minutes. The components to be distilled off were collected, and the temperature inside the reaction system was maintained at 190 ° C. and refluxed for 3 hours while adjusting the rotation speed according to the increase in viscosity.
Then, 201.110 g of NMP was added so that the solid content concentration became about 20% by mass, the temperature in the reaction system was cooled to 100 ° C., and then stirred for about 1 hour to homogenize the polyimide (PI). I got a varnish.
Subsequently, the obtained polyimide varnish was applied onto a glass plate by spin coating, held on a hot plate at 80 ° C. for 20 minutes, and then heated in a hot air dryer at 350 ° C. for 30 minutes in an air atmosphere to evaporate the solvent. To obtain a polyimide film. The results are shown in Table 1.
〈比較例2〉
ステンレス製半月型撹拌翼、窒素導入管、冷却管を取り付けたディーンスターク、温度計、ガラス製エンドキャップを備えた500mLの5つ口丸底フラスコに、6FODAを32.662g(0.097モル)、及びNMPを130.667g投入し、系内温度70℃、窒素雰囲気下、回転数200rpmで撹拌して溶液を得た。
この溶液に、CpODA 37.338g(0.097モル)、及びNMP 32.667gを一括で添加し室温にて5時間撹拌した。
その後、固形分濃度が約20質量%となるようにNMPを116.667g添加し、更に約1時間撹拌して均一化して、ポリアミド酸(PAA)ワニスを得た。
続いてガラス板上へ、得られたポリアミド酸ワニスをスピンコートにより塗布し、ホットプレートで80℃、20分間保持し、その後、空気雰囲気下、熱風乾燥機中350℃で30分加熱し溶媒を蒸発させたがフィルム全面にクラックが入っており測定には至らなかった。結果を表1に示す。<Comparative example 2>
32.662 g (0.097 mol) of 6FODA in a 500 mL five-necked round-bottom flask equipped with a stainless steel crescent-shaped stirring blade, a nitrogen inlet tube, a Dean Stark with a cooling tube, a thermometer, and a glass end cap. , And 130.667 g of NMP were added, and the mixture was stirred at a system temperature of 70 ° C. and a nitrogen atmosphere at a rotation speed of 200 rpm to obtain a solution.
To this solution, 37.338 g (0.097 mol) of CpODA and 32.667 g of NMP were added all at once, and the mixture was stirred at room temperature for 5 hours.
Then, 116.667 g of NMP was added so that the solid content concentration became about 20% by mass, and the mixture was further stirred for about 1 hour to homogenize to obtain a polyamic acid (PAA) varnish.
Subsequently, the obtained polyamic acid varnish was applied onto a glass plate by spin coating, held on a hot plate at 80 ° C. for 20 minutes, and then heated in a hot air dryer at 350 ° C. for 30 minutes in an air atmosphere to remove the solvent. Although it was evaporated, the entire surface of the film had cracks and could not be measured. The results are shown in Table 1.
〈比較例3〉
ステンレス製半月型撹拌翼、窒素導入管、冷却管を取り付けたディーンスターク、温度計、ガラス製エンドキャップを備えた500mLの5つ口丸底フラスコに、6FODAを33.828g(0.101モル)、及びNMPを92.657g投入し、系内温度70℃、窒素雰囲気下、回転数200rpmで撹拌して溶液を得た。
この溶液に、CpODA 23.613g(0.061モル)、及びNMP 23.164gを一括で添加した後、イミド化触媒としてTEAを0.311g投入し、マントルヒーターで加熱し、約20分かけて反応系内温度を190℃まで上げた。留去される成分を捕集し、回転数を粘度上昇に合わせて調整しつつ、反応系内温度を190℃に保持して1時間還流し、イミド繰り返し構造単位を有するオリゴマーを含む溶液を得た。
その後、NMPを51.114g添加して、反応系内温度を50℃まで冷却した後、s−BPDA 12.050g(0.041モル)、及びNMP 8.065gを一括で添加し50℃で1時間撹拌した。その後、NMPを107.143g添加し均一化した後、NMP 17.857gにX−22−1660B−3を7.723g(0.002モル)溶解させた混合液を投入し、更に約1時間撹拌した。マントルヒーターで加熱し、約20分かけて反応系内温度を190℃まで上げた。留去される成分を捕集し、回転数を粘度上昇に合わせて調整しつつ、反応系内温度を190℃に保持して3時間還流した。
その後、固形分濃度が約15質量%となるようにNMPを125.000g添加して、反応系内温度を100℃まで冷却した後、更に約1時間撹拌して均一化して、ポリイミドワニスを得た。
続いてガラス板上へ、得られたポリイミドワニスをスピンコートにより塗布し、ホットプレートで80℃、20分間保持し、その後、空気雰囲気下、熱風乾燥機中350℃で30分加熱し溶媒を蒸発させ、ポリイミドフィルムを得た。結果を表1に示す。
比較例3で得られたポリイミドは、CpODAと6FODAとから形成されるイミド繰り返し構造単位を有し、s−BPDAと6FODAとから形成されるイミド構造単位を有する。当該ポリイミドを「PI−I」と称する。<Comparative example 3>
33.828 g (0.101 mol) of 6FODA in a 500 mL five-necked round-bottom flask equipped with a stainless steel half-moon agitator, a nitrogen inlet tube, a Dean Stark with a cooling tube, a thermometer, and a glass end cap. , And 92.657 g of NMP were added, and the mixture was stirred at a system temperature of 70 ° C. and a nitrogen atmosphere at a rotation speed of 200 rpm to obtain a solution.
After adding 23.613 g (0.061 mol) of CpODA and 23.164 g of NMP in a batch to this solution, 0.311 g of TEA was added as an imidization catalyst and heated with a mantle heater over about 20 minutes. The temperature inside the reaction system was raised to 190 ° C. The components to be distilled off are collected, the rotation speed is adjusted according to the increase in viscosity, the temperature inside the reaction system is maintained at 190 ° C., and the mixture is refluxed for 1 hour to obtain a solution containing an oligomer having an imide repeating structural unit. rice field.
Then, 51.114 g of NMP was added to cool the temperature inside the reaction system to 50 ° C., then 12.050 g (0.041 mol) of s-BPDA and 8.065 g of NMP were added all at once and 1 at 50 ° C. Stirred for hours. Then, 107.143 g of NMP was added to homogenize, and then a mixed solution prepared by dissolving 7.723 g (0.002 mol) of X-22-1660B-3 in 17.857 g of NMP was added, and the mixture was further stirred for about 1 hour. bottom. It was heated with a mantle heater and the temperature inside the reaction system was raised to 190 ° C. over about 20 minutes. The components to be distilled off were collected, and the temperature inside the reaction system was maintained at 190 ° C. and refluxed for 3 hours while adjusting the rotation speed according to the increase in viscosity.
Then, 125.000 g of NMP was added so that the solid content concentration became about 15% by mass, the temperature in the reaction system was cooled to 100 ° C., and then the mixture was further stirred for about 1 hour to homogenize to obtain a polyimide varnish. rice field.
Subsequently, the obtained polyimide varnish was applied onto a glass plate by spin coating, held on a hot plate at 80 ° C. for 20 minutes, and then heated in a hot air dryer at 350 ° C. for 30 minutes in an air atmosphere to evaporate the solvent. To obtain a polyimide film. The results are shown in Table 1.
The polyimide obtained in Comparative Example 3 has an imide repeating structural unit formed from CpODA and 6FODA, and has an imide structural unit formed from s-BPDA and 6FODA. The polyimide is referred to as "PI-I".
〈比較例4〉
ステンレス製半月型撹拌翼、窒素導入管、冷却管を取り付けたディーンスターク、温度計、ガラス製エンドキャップを備えた500mLの5つ口丸底フラスコに、6FODAを37.333g(0.111モル)、及びNMPを130.667g投入し、系内温度50℃、窒素雰囲気下、回転数200rpmで撹拌して溶液を得た。
この溶液に、s−BPDA 32.667g(0.111モル)、及びNMP 32.667gを一括で添加し室温にて5時間撹拌した。
その後、固形分濃度が約20質量%となるようにNMPを116.667g添加し、更に約1時間撹拌して均一化して、ポリアミド酸(PAA)ワニスを得た。
続いてガラス板上へ、得られたポリアミド酸ワニスをスピンコートにより塗布し、ホットプレートで80℃、20分間保持し、その後、空気雰囲気下、熱風乾燥機中350℃で30分加熱し溶媒を蒸発させ、ポリイミドフィルムを得た。結果を表1に示す。
比較例4で得られたポリアミド酸は、s−BPDAと6FODAとから形成されるアミド酸繰り返し構造単位のみを有する。当該ポリアミド酸を「PAA」と称する。<Comparative Example 4>
37.333g (0.111mol) of 6FODA in a 500mL five-necked round-bottom flask equipped with a stainless steel half-moon stirring blade, a nitrogen inlet tube, a Dean Stark with a cooling tube, a thermometer, and a glass end cap. , And 130.667 g of NMP were added, and the mixture was stirred at a system temperature of 50 ° C. and a nitrogen atmosphere at a rotation speed of 200 rpm to obtain a solution.
32.667 g (0.111 mol) of s-BPDA and 32.667 g of NMP were added collectively to this solution, and the mixture was stirred at room temperature for 5 hours.
Then, 116.667 g of NMP was added so that the solid content concentration became about 20% by mass, and the mixture was further stirred for about 1 hour to homogenize to obtain a polyamic acid (PAA) varnish.
Subsequently, the obtained polyamic acid varnish was applied onto a glass plate by spin coating, held on a hot plate at 80 ° C. for 20 minutes, and then heated in a hot air dryer at 350 ° C. for 30 minutes in an air atmosphere to remove the solvent. Evaporation gave a polyimide film. The results are shown in Table 1.
The polyamic acid obtained in Comparative Example 4 has only an amic acid repeating structural unit formed from s-BPDA and 6FODA. The polyamic acid is referred to as "PAA".
実施例のイミド−アミド酸共重合体は、保存安定性と成形加工性を両立することができることがわかる。
更に表1に示すように、特定のイミド繰り返し構造単位及びアミド酸構造単位を有する共重合体から形成された、実施例1〜16のポリイミドフィルムは、無色透明性及び耐熱性に優れ、更に低リタデーション及び低残留応力に優れるものであった。It can be seen that the imide-amidoic acid copolymer of the example can achieve both storage stability and molding processability.
Further, as shown in Table 1, the polyimide films of Examples 1 to 16 formed from a polymer having a specific imide repeating structural unit and an amic acid structural unit are excellent in colorless transparency and heat resistance, and further low. It was excellent in polyimide and low residual stress.
Claims (23)
(式(1)中、
X1は炭素数4〜39の4価の脂肪族基、脂環基、芳香族基又はこれらの組み合わせからなる基であって、結合基として−O−、−SO2−、−CO−、−CH2−、−C(CH3)2−、−C2H4O−及び−S−からなる群から選ばれる少なくとも1つを有していてもよい。
X2はX1とは異なる炭素数4〜39の4価の脂肪族基、脂環基、芳香族基又はこれらの組み合わせからなる基であって、結合基として−O−、−SO2−、−CO−、−CH2−、−C(CH3)2−、−C2H4O−及び−S−からなる群から選ばれる少なくとも1つを有していてもよい。
Y1は炭素数4〜39の2価の脂肪族基、脂環基、芳香族基又はこれらの組み合わせからなる基であって、結合基として−O−、−SO2−、−CO−、−CH2−、−C(CH3)2−、−C2H4O−及び−S−からなる群から選ばれる少なくとも1つを有していてもよく、複数のY1は同一の組成を有する。
s及びtは正の整数である。)An imide-amide acid copolymer containing a repeating unit composed of an imide moiety (I) and an amic acid moiety (A) represented by the following formula (1).
(In equation (1),
X 1 is a group consisting of a tetravalent aliphatic group having 4 to 39 carbon atoms, an alicyclic group, an aromatic group or a combination thereof, and has -O-, -SO 2- , -CO- as a linking group. -CH 2 -, - C (CH 3) 2 -, - it may have at least one member selected from C 2 H 4 group consisting of O- and -S-.
X 2 is a tetravalent aliphatic group, an alicyclic group, an aromatic group, or combinations of these groups having a carbon number of 4-39, which is different from the X 1, -O a bonding group -, - SO 2 - , -CO-, -CH 2- , -C (CH 3 ) 2- , -C 2 H 4 O- and -S- may have at least one selected from the group.
Y 1 is a group consisting of a divalent aliphatic group having 4 to 39 carbon atoms, an alicyclic group, an aromatic group or a combination thereof, and as a linking group, -O-, -SO 2- , -CO-, -CH 2 -, - C (CH 3) 2 -, - it may have at least one member selected from C 2 H 4 group consisting of O- and -S-, a plurality of Y 1 are the same composition Have.
s and t are positive integers. )
前記アミド酸部分(A)が、テトラカルボン酸二無水物に由来する構成単位AA及びジアミンに由来する構成単位ABを有し、
構成単位IAが、脂環式テトラカルボン酸二無水物(a−1)に由来する構成単位(A−1)を含み、
構成単位IB及び構成単位ABが、エーテル結合を有する芳香族ジアミンに由来する構成単位を含む、請求項1〜6のいずれか1つに記載のイミド−アミド酸共重合体。The imide moiety (I) has a structural unit IA derived from a tetracarboxylic dianhydride and a structural unit IB derived from a diamine.
The amic acid moiety (A) has a structural unit AA derived from tetracarboxylic dianhydride and a structural unit AB derived from diamine.
Constituent unit IA comprises a structural unit (A-1) derived from alicyclic tetracarboxylic dianhydride (a-1).
The imide-amide acid copolymer according to any one of claims 1 to 6, wherein the structural unit IB and the structural unit AB contain a structural unit derived from an aromatic diamine having an ether bond.
前記アミド酸部分(A)が、テトラカルボン酸二無水物に由来する構成単位AA及びジアミンに由来する構成単位ABを有し、
構成単位IAが、脂環式テトラカルボン酸二無水物(a−1)に由来する構成単位(A−1)を含み、
構成単位IB及び構成単位ABが、含フッ素芳香族ジアミンに由来する構成単位を含む、請求項1〜6のいずれか1つに記載のイミド−アミド酸共重合体。The imide moiety (I) has a structural unit IA derived from a tetracarboxylic dianhydride and a structural unit IB derived from a diamine.
The amic acid moiety (A) has a structural unit AA derived from tetracarboxylic dianhydride and a structural unit AB derived from diamine.
Constituent unit IA comprises a structural unit (A-1) derived from alicyclic tetracarboxylic dianhydride (a-1).
The imide-amide acid copolymer according to any one of claims 1 to 6, wherein the structural unit IB and the structural unit AB contain a structural unit derived from a fluorine-containing aromatic diamine.
構成単位(A−2)が、下記式(a−2−1)で表される化合物に由来する構成単位(A−2−1)、下記式(a−2−2)で表される化合物に由来する構成単位(A−2−2)、下記式(a−2−3)で表される化合物に由来する構成単位(A−2−3)、及び下記式(a−2−4)で表される化合物に由来する構成単位(A−2−4)からなる群から選ばれる少なくとも1つを含む、請求項7〜9のいずれか1つに記載のイミド−アミド酸共重合体。
The structural unit (A-2) is derived from the compound represented by the following formula (a-2-1), the structural unit (A-2-1), and the compound represented by the following formula (a-2-2). Constituent unit derived from (A-2-2), structural unit derived from a compound represented by the following formula (a-2-3) (A-2-3), and the following formula (a-2-4). The imide-amide acid copolymer according to any one of claims 7 to 9, which comprises at least one selected from the group consisting of the structural unit (A-2-4) derived from the compound represented by.
(式(b−2)中、Z1及びZ2はそれぞれ独立に2価の脂肪族基、又は2価の芳香族基を示し、R1及びR2はそれぞれ独立に1価の芳香族基又は1価の脂肪族基を示し、R3及びR4はそれぞれ独立に1価の脂肪族基を示し、R5及びR6は、それぞれ独立に1価の脂肪族基又は1価の芳香族基を示し、m及びnはそれぞれ独立に1以上の整数を示し、mとnとの和は2〜1000の整数を示す。但し、R1及びR2の少なくとも一方は1価の芳香族基を示す。)The imide-amide acid copolymer according to any one of claims 7 to 10, further comprising a structural unit (B-2) derived from a compound represented by the following formula (b-2).
(In the formula (b-2), Z 1 and Z 2 each independently represent a divalent aliphatic group or a divalent aromatic group, and R 1 and R 2 each independently represent a monovalent aromatic group. Or monovalent aliphatic groups, R 3 and R 4 independently represent monovalent aliphatic groups, and R 5 and R 6 independently represent monovalent aliphatic groups or monovalent aromatic groups, respectively. Indicates a group, m and n each independently represent an integer of 1 or more, and the sum of m and n represents an integer of 2 to 1000, provided that at least one of R 1 and R 2 is a monovalent aromatic group. Shows.)
(式(b−3)中、Rはそれぞれ独立して、水素原子、フッ素原子又は炭素数1〜5のアルキル基を表わす。)The imide-according to any one of claims 7-14, wherein the structural unit IB and the structural unit AB further include a structural unit (B-3) derived from a compound represented by the following formula (b-3). Amidoic acid copolymer.
(In formula (b-3), R independently represents a hydrogen atom, a fluorine atom, or an alkyl group having 1 to 5 carbon atoms.)
工程1:イミド部分(I)を構成するテトラカルボン酸成分と、ジアミン成分とを反応させ、イミドオリゴマーを得る工程
工程2:工程1で得られたイミドオリゴマーと、アミド酸部分(A)を構成するテトラカルボン酸成分を反応させ、下記式(1)で表される、イミド部分(I)とアミド酸部分(A)とからなる繰り返し単位を含む、イミド−アミド酸共重合体を得る工程
(式(1)中、
X1は炭素数4〜39の4価の脂肪族基、脂環基、芳香族基又はこれらの組み合わせからなる基であって、結合基として−O−、−SO2−、−CO−、−CH2−、−C(CH3)2−、−C2H4O−及び−S−からなる群から選ばれる少なくとも1つを有していてもよい。
X2はX1とは異なる炭素数4〜39の4価の脂肪族基、脂環基、芳香族基又はこれらの組み合わせからなる基であって、結合基として−O−、−SO2−、−CO−、−CH2−、−C(CH3)2−、−C2H4O−及び−S−からなる群から選ばれる少なくとも1つを有していてもよい。
Y1は炭素数4〜39の2価の脂肪族基、脂環基、芳香族基又はこれらの組み合わせからなる基であって、結合基として−O−、−SO2−、−CO−、−CH2−、−C(CH3)2−、−C2H4O−及び−S−からなる群から選ばれる少なくとも1つを有していてもよく、複数のY1は同一の組成を有する。
s及びtは正の整数である。)A method for producing an imide-amidoic acid copolymer, which comprises the following steps 1 and 2.
Step 1: The tetracarboxylic acid component constituting the imide moiety (I) is reacted with the diamine component to obtain an imide oligomer. Step 2: The imide oligomer obtained in Step 1 and the amic acid moiety (A) are formed. A step of reacting the tetracarboxylic acid component to obtain an imide-amide acid copolymer containing a repeating unit consisting of an imide moiety (I) and an amic acid moiety (A) represented by the following formula (1).
(In equation (1),
X 1 is a group consisting of a tetravalent aliphatic group having 4 to 39 carbon atoms, an alicyclic group, an aromatic group or a combination thereof, and has -O-, -SO 2- , -CO- as a linking group. -CH 2 -, - C (CH 3) 2 -, - it may have at least one member selected from C 2 H 4 group consisting of O- and -S-.
X 2 is a tetravalent aliphatic group, an alicyclic group, an aromatic group, or combinations of these groups having a carbon number of 4-39, which is different from the X 1, -O a bonding group -, - SO 2 - , -CO-, -CH 2- , -C (CH 3 ) 2- , -C 2 H 4 O- and -S- may have at least one selected from the group.
Y 1 is a group consisting of a divalent aliphatic group having 4 to 39 carbon atoms, an alicyclic group, an aromatic group or a combination thereof, and as a linking group, -O-, -SO 2- , -CO-, -CH 2 -, - C (CH 3) 2 -, - it may have at least one member selected from C 2 H 4 group consisting of O- and -S-, a plurality of Y 1 are the same composition Have.
s and t are positive integers. )
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