JPWO2020127594A5 - - Google Patents

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Publication number
JPWO2020127594A5
JPWO2020127594A5 JP2021536355A JP2021536355A JPWO2020127594A5 JP WO2020127594 A5 JPWO2020127594 A5 JP WO2020127594A5 JP 2021536355 A JP2021536355 A JP 2021536355A JP 2021536355 A JP2021536355 A JP 2021536355A JP WO2020127594 A5 JPWO2020127594 A5 JP WO2020127594A5
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JP
Japan
Prior art keywords
channel
measured
range
article
metal substrate
Prior art date
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Pending
Application number
JP2021536355A
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English (en)
Japanese (ja)
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JP2022516028A (ja
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Priority claimed from DE102018133553.9A external-priority patent/DE102018133553A1/de
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Publication of JP2022516028A publication Critical patent/JP2022516028A/ja
Publication of JPWO2020127594A5 publication Critical patent/JPWO2020127594A5/ja
Pending legal-status Critical Current

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JP2021536355A 2018-12-21 2019-12-18 金属基材および金属基材中のチャネルを含む物品、ならびにその製造方法 Pending JP2022516028A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102018133553.9 2018-12-21
DE102018133553.9A DE102018133553A1 (de) 2018-12-21 2018-12-21 Gegenstand mit einem Metallsubstrat und einem Kanal im Metallsubstrat sowie Verfahren zu dessen Herstellung
PCT/EP2019/086112 WO2020127594A1 (fr) 2018-12-21 2019-12-18 Objet comportant un substrat métallique et un canal dans le substrat métallique ainsi que son procédé de fabrication

Publications (2)

Publication Number Publication Date
JP2022516028A JP2022516028A (ja) 2022-02-24
JPWO2020127594A5 true JPWO2020127594A5 (fr) 2022-12-27

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ID=69156381

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021536355A Pending JP2022516028A (ja) 2018-12-21 2019-12-18 金属基材および金属基材中のチャネルを含む物品、ならびにその製造方法

Country Status (7)

Country Link
US (1) US20220048133A1 (fr)
EP (1) EP3898066A1 (fr)
JP (1) JP2022516028A (fr)
CN (1) CN113226625A (fr)
BR (1) BR112021012060A2 (fr)
DE (1) DE102018133553A1 (fr)
WO (1) WO2020127594A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102020120343A1 (de) 2020-07-31 2022-02-03 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein Verwendung eines metallischen Implantates mit einer porenöffnungsbelegten Oberfläche zum Herstellen eines wirkstoffbeladenen metallischen Implantates
CN114178710A (zh) * 2020-08-24 2022-03-15 奥特斯(中国)有限公司 部件承载件及其制造方法
AT524312B1 (de) * 2020-12-22 2022-05-15 Hofall Holding 1 Gmbh Verfahren zur Herstellung eines oberflächenmodifizierten Metallimplantats
WO2023061960A1 (fr) * 2021-10-13 2023-04-20 Tata Steel Ijmuiden B.V. Procédé d'élimination d'une écaille d'oxyde d'un produit en acier et produit en acier amélioré
CN115323346B (zh) * 2022-07-27 2024-02-20 中国航空制造技术研究院 一种重载轴承和齿轮表面的织构化涂层及制备方法

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US4504727A (en) * 1982-12-30 1985-03-12 International Business Machines Corporation Laser drilling system utilizing photoacoustic feedback
GB9619856D0 (en) * 1996-09-24 1996-11-06 Fotomechanix Ltd Channel forming method
ES2233919T3 (es) 1998-06-30 2005-06-16 Siemens Ag Interfaz aerea para sistemas de telecomunicaciones con telecomunicacion inalambrica entre aparatos de emision/recepcion moviles y/o estacionarios.
AU2002247135A1 (en) * 2001-02-12 2002-08-28 Morgan T. Johnson Laser micromachining and electrical structures
US6755949B1 (en) * 2001-10-09 2004-06-29 Roche Diagnostics Corporation Biosensor
DE102005052409B3 (de) 2005-10-31 2007-07-05 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Beschichtungsverfahren, dessen Verwendung sowie beschichtete Körper
WO2007111518A1 (fr) * 2006-03-27 2007-10-04 Nano Cluster Devices Limited Remplissage de structures d'échelle nanométrique et micrométrique
US20080216926A1 (en) 2006-09-29 2008-09-11 Chunlei Guo Ultra-short duration laser methods for the nanostructuring of materials
ES2514521T3 (es) 2009-05-15 2014-10-28 Swiss Micro Laser Gmbh Método de generación de una estructura superficial
CA3016976C (fr) * 2009-08-07 2021-05-25 Smarter Alloys Inc. Procedes et systemes de traitement de materiaux, y compris des materiaux a memoire de forme _
JP5848104B2 (ja) * 2011-11-21 2016-01-27 株式会社ダイセル 複合成形体の製造方法
JP5798535B2 (ja) * 2012-09-07 2015-10-21 ダイセルポリマー株式会社 複合成形体の製造方法
DE102012112550A1 (de) * 2012-12-18 2014-06-18 Lpkf Laser & Electronics Ag Verfahren zur Metallisierung eines Werkstücks sowie ein Schichtaufbau aus einem Werkstück und einer Metallschicht
JP5701414B1 (ja) * 2013-03-26 2015-04-15 ダイセルポリマー株式会社 複合成形体の製造方法
US20160059353A1 (en) 2013-05-03 2016-03-03 Newsouth Innovations Pty Limited Surface structuring of metals
US10092976B2 (en) * 2013-08-27 2018-10-09 Designers Edge Inc. Machining metal removal control
US9981340B2 (en) * 2015-07-13 2018-05-29 King Fahd University Of Petroleum And Minerals Laser ablation method for treating a copper alloy containing metallic surface and increasing hydrophobicity
JP6921057B2 (ja) * 2015-09-09 2021-08-18 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド レーザ処理装置、ワークピースをレーザ処理する方法及び関連する構成
CN105798454B (zh) 2016-04-29 2017-09-12 西安交通大学 一种利用纳秒激光诱导裂纹制备微纳米复合结构的方法
BE1024182B1 (fr) * 2016-05-02 2017-12-04 LASER ENGINEERING APPLICATIONS S.A. en abrégé LASEA S.A. Méthode de structuration d'un substrat

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