JPWO2020003123A5 - - Google Patents
Download PDFInfo
- Publication number
- JPWO2020003123A5 JPWO2020003123A5 JP2020573001A JP2020573001A JPWO2020003123A5 JP WO2020003123 A5 JPWO2020003123 A5 JP WO2020003123A5 JP 2020573001 A JP2020573001 A JP 2020573001A JP 2020573001 A JP2020573001 A JP 2020573001A JP WO2020003123 A5 JPWO2020003123 A5 JP WO2020003123A5
- Authority
- JP
- Japan
- Prior art keywords
- composition according
- composition
- substrate
- polymer melt
- tackifier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Claims (10)
中間ブロックセグメント及び複数の末端ブロックセグメントを含むブロックコポリマー成分であって、各末端ブロックセグメントがポリスチレンを含む、ブロックコポリマー成分と、
５０℃～１６０℃のガラス転移温度を有する（メタ）アクリル官能性添加剤と、
前記中間ブロックセグメントと相溶性であり、炭化水素を含む第１の粘着付与剤と、
前記末端ブロックセグメントと相溶性であり、ポリフェニレンエーテルを含む第２の粘着付与剤と、
を含む、接着剤組成物。 Adhesive composition
A block copolymer component containing an intermediate block segment and a plurality of terminal block segments, wherein each terminal block segment contains polystyrene, and a block copolymer component.
With a (meth) acrylic functional additive having a glass transition temperature of 50 ° C to 160 ° C,
The first tackifier, which is compatible with the intermediate block segment and contains a hydrocarbon,
A second tackifier that is compatible with the terminal block segment and contains polyphenylene ether.
An adhesive composition comprising.
支持体と、
前記支持体上に配置され、請求項１～５のいずれか一項に記載の前記組成物から構成される感圧接着剤と、
を備える、テープ。 It's a tape
With the support,
A pressure-sensitive adhesive which is arranged on the support and is composed of the composition according to any one of claims 1 to 5 .
With tape.
基材と、
前記基材上に配置され、請求項１～５のいずれか一項に記載の前記組成物から構成される感圧接着剤層と、
を備える、接合アセンブリ。 It ’s a joint assembly,
With the base material
A pressure-sensitive adhesive layer arranged on the substrate and composed of the composition according to any one of claims 1 to 5 .
A joining assembly.
請求項１～５のいずれか一項に記載の前記組成物をポリマー溶融物を得るのに十分な温度まで加熱することと、
前記ポリマー溶融物を基材上に配置することと、
前記ポリマー溶融物及び前記基材を冷却して、前記組成物のミクロ相分離を誘導し、前記接合アセンブリを得ることと、
を含む、製造方法。 A method of manufacturing a joined assembly
The composition according to any one of claims 1 to 5 is heated to a temperature sufficient to obtain a polymer melt.
Placing the polymer melt on a substrate and
The polymer melt and the substrate are cooled to induce microphase separation of the composition to obtain the bonded assembly.
Manufacturing method, including.
請求項１～５のいずれか一項に記載の前記組成物をポリマー溶融物を得るのに十分な温度まで加熱することと、
前記ポリマー溶融物を剥離面上に配置することと、
前記ポリマー溶融物及び基材を冷却して、前記組成物のミクロ相分離を誘導し、前記パッケージ接着剤を得ることと、
を含む、製造方法。 It is a manufacturing method of package adhesive.
The composition according to any one of claims 1 to 5 is heated to a temperature sufficient to obtain a polymer melt.
Placing the polymer melt on the peeled surface and
The polymer melt and the substrate are cooled to induce microphase separation of the composition to obtain the package adhesive.
Manufacturing method, including.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201862690837P | 2018-06-27 | 2018-06-27 | |
| US62/690,837 | 2018-06-27 | ||
| PCT/IB2019/055344 WO2020003123A1 (en) | 2018-06-27 | 2019-06-25 | Adhesive compositions, assemblies, and methods thereof |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2021529857A JP2021529857A (en) | 2021-11-04 |
| JPWO2020003123A5 true JPWO2020003123A5 (en) | 2022-07-05 |
| JP7373513B2 JP7373513B2 (en) | 2023-11-02 |
Family
ID=67874482
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020573001A Active JP7373513B2 (en) | 2018-06-27 | 2019-06-25 | Adhesive composition, assembly, and method thereof |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20210130662A1 (en) |
| EP (1) | EP3814441B1 (en) |
| JP (1) | JP7373513B2 (en) |
| KR (1) | KR20210023876A (en) |
| CN (1) | CN112384585B (en) |
| WO (1) | WO2020003123A1 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11725308B2 (en) | 2019-08-19 | 2023-08-15 | 3M Innovative Properties Company | Core-sheath filaments including crosslinkable and crosslinked adhesive compositions and methods of making the same |
| WO2021130617A1 (en) * | 2019-12-23 | 2021-07-01 | 3M Innovative Properties Company | Adhesive tape and methods of making |
| WO2024023646A1 (en) * | 2022-07-29 | 2024-02-01 | 3M Innovative Properties Company | Stabilized hot melt pressure-sensitive adhesives |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE635349A (en) | 1962-07-24 | |||
| NL295699A (en) | 1962-07-24 | |||
| US3257357A (en) | 1963-04-01 | 1966-06-21 | Du Pont | Copolymers of polyphenylene ethers |
| US3257358A (en) | 1963-07-02 | 1966-06-21 | Du Pont | 2, 6-dichloro-1, 4-polyphenylene ether |
| WO1990014396A1 (en) * | 1989-05-23 | 1990-11-29 | Exxon Chemical Patents Inc. | Adhesive compositions containing low molecular weight polyphenylene oxides |
| US5296547A (en) | 1993-01-28 | 1994-03-22 | Minnesota Mining And Manufacturing Company | Block copolymer having mixed molecular weight endblocks |
| US6277488B1 (en) * | 1998-10-28 | 2001-08-21 | 3M Innovative Properties Company | Adhesive composition containing a block copolymer composition and polyphenylene oxide resin and products thereof |
| AU1125299A (en) | 1998-10-28 | 2000-05-15 | Minnesota Mining And Manufacturing Company | Adhesive composition containing a block copolymer composition and polyphenylene oxide resin and products thereof |
| JP3628666B2 (en) * | 2001-03-28 | 2005-03-16 | 三洋化成工業株式会社 | Hot melt adhesive |
| US20030082362A1 (en) | 2001-07-31 | 2003-05-01 | Khandpur Ashish K. | High cohesive strength pressure sensitive adhesive foam |
| US6777080B2 (en) | 2002-04-04 | 2004-08-17 | 3M Innovative Properties Company | Pressure sensitive adhesive composition |
| DE10259965A1 (en) * | 2002-12-16 | 2004-07-15 | Tesa Ag | Heat activated adhesive film for the implantation of electrical modules in a telephone card, identity card or bank card comprises a vinyl aromatic block copolymer and a resin that is compatible with the terminal blocks |
| JP5433416B2 (en) | 2006-08-08 | 2014-03-05 | ワールド プラパティーズ、 インコーポレイテッド | Circuit materials, circuits and multilayer circuit laminates |
| CA2671436C (en) | 2006-12-07 | 2015-03-24 | 3M Innovative Properties Company | Blends of block copolymer and acrylic adhesives |
| JP2009102538A (en) | 2007-10-24 | 2009-05-14 | Aron Ever-Grip Ltd | Adhesive composition for polyphenylene ether-based resin |
| EP2692811A4 (en) * | 2011-03-28 | 2015-01-21 | Nippon Carbide Kogyo Kk | Adhesive composition and film for optical member |
| US20130225020A1 (en) * | 2012-02-24 | 2013-08-29 | Kraton Polymers Us Llc | High flow, hydrogenated styrene-butadiene-styrene block copolymer and applications |
| DE102013215296A1 (en) * | 2013-08-02 | 2015-02-05 | Tesa Se | PSA |
| EP3243886A1 (en) * | 2016-05-13 | 2017-11-15 | 3M Innovative Properties Company | Rubber-based pressure-sensitive adhesive having low voc characteristics |
-
2019
- 2019-06-25 JP JP2020573001A patent/JP7373513B2/en active Active
- 2019-06-25 WO PCT/IB2019/055344 patent/WO2020003123A1/en unknown
- 2019-06-25 CN CN201980042779.4A patent/CN112384585B/en active Active
- 2019-06-25 KR KR1020207036924A patent/KR20210023876A/en not_active Application Discontinuation
- 2019-06-25 EP EP19765317.3A patent/EP3814441B1/en active Active
- 2019-06-25 US US17/051,330 patent/US20210130662A1/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI248777B (en) | Method for connecting microcircuits and connection structure by the same | |
| JP2010512428A5 (en) | ||
| JP2020041119A5 (en) | Manufacturing method of reinforcing film and device with reinforcing film | |
| JP2016033215A5 (en) | ||
| TW200817489A (en) | Heat-activable adhesive tape particularly for bonding electronic components and conductor tracks | |
| TW200902663A (en) | Adhesive, double-sided adhesive sheet and display | |
| JP2009001635A (en) | Adhesive sheet, dicing die bonding tape and method for producing semiconductor device | |
| JP2000294580A (en) | Resin sealing method of semiconductor chip and adhesive tape for sticking of lead frame, etc. | |
| JP2986956B2 (en) | Adhesive sheet | |
| JPWO2020003123A5 (en) | ||
| JP2006199756A (en) | Bonding film, method for producing electronic component device and the resultant electronic component device | |
| JP2023065455A (en) | Adhesive sheet, article and method for producing article | |
| CN107001908A (en) | One pack system UV and heat cure high temperature can unsticking adhesive | |
| KR20190041684A (en) | Transparent polyimide composite film for flexible display and method for manufacturing the same | |
| JPS62127194A (en) | Production of anisotropic conductive solder joining material | |
| JP2024511357A (en) | LED transfer materials and processes | |
| JP7132570B2 (en) | Adhesive body, adhesive, method for manufacturing bonded body, and method for peeling adhesive body | |
| KR20190093180A (en) | Rework tape | |
| KR20180009606A (en) | Heat melt adhesive composition, heat melt dual sided adhesive tape, method for preparing heat melt double sided adhesive tape and method for using heat melt double sided adhesive tape | |
| TWI681232B (en) | Transparent polyimide composite film for flexible display and manufacturing method thereof | |
| JP2003209346A (en) | Method for mounting component and electronic device | |
| JP4321305B2 (en) | Wafer processing method | |
| JP6816286B2 (en) | Polyimide film for reflow process of semiconductor package and its manufacturing method | |
| JP2018206885A (en) | Adhesive tape | |
| JP4996960B2 (en) | External electrode formation method for chip-type electronic components |