JP7132570B2 - Adhesive body, adhesive, method for manufacturing bonded body, and method for peeling adhesive body - Google Patents

Description

TECHNICAL FIELD The present invention relates to an adherent using a π-conjugated compound. The present invention also relates to a pressure-sensitive adhesive using a π-conjugated compound. The present invention also relates to a method for producing a joined body using the above-mentioned adherent. Furthermore, the present invention relates to a peeling method for peeling an adhesive body from a joined body.

BACKGROUND ART Conventionally, pressure-sensitive adhesives that can maintain an adhesive state continuously and can be easily peeled off have been studied. For example, Patent Literature 1 discloses an easily peelable pressure-sensitive adhesive sheet having a printed area forming a partial non-adhesive area on the adhesive surface.

JP 2008-075072 A

However, it is difficult for conventional easily peelable pressure-sensitive adhesives to achieve both adhesive strength and easy peelability. For example, the easily peelable pressure-sensitive adhesive sheet of Patent Literature 1 has a non-adhesive region on the pressure-sensitive adhesive surface, so it is difficult to exhibit high adhesive strength. In addition, if the non-adhesive region is expanded to improve releasability, there is a risk that the adhesive force will be further reduced.

An object of the present invention is to provide a viscous body that can exhibit high adhesive strength and can be easily peeled off. Another object of the present invention is to provide a pressure-sensitive adhesive capable of forming the adhesive body, a bonded body obtained by bonding the adhesive body and the adherend, and a peeling method for peeling the adhesive body from the bonded body. do.

In order to achieve the above object, the present inventors have developed a special π-conjugated skeleton that has both features of a rigid π-conjugated skeleton with high planarity and a flexible π-conjugated skeleton that can change molecular physical properties as the molecular skeleton moves. We focused on conjugated compounds. They have also found that by using the π-conjugated compound, it is possible to form an adherent that has both high adhesive strength and easy peelability.

［式中、Ｒ^１は炭素原子数３～２０のアルキル基を少なくとも一つ有する基を示し、ｎは１～３の整数を示す。複数のＲ^１は互いに同一であっても異なっていてもよく、複数のｎは互いに同一であっても異なっていてもよい。］ A first aspect of the present invention relates to an adhesive body comprising an adhesive surface containing an adhesive component and a dismantling adhesive surface containing a π-conjugated compound represented by the following formula (1).

[In the formula, R ¹ represents a group having at least one alkyl group having 3 to 20 carbon atoms, and n represents an integer of 1 to 3. A plurality of R ¹ 's may be the same or different, and a plurality of n's may be the same or different. ]

The π-conjugated compound has a rigid acene skeleton and a flexible cyclooctatetraene skeleton. Further, the π-conjugated compound has a temperature range indicating a solid state, a temperature range indicating a liquid crystal state, and a temperature range indicating a liquid state, and the temperature range indicating the liquid crystal state or a temperature exceeding the temperature range After contacting the adherend with , the adhesive force can be expressed by cooling to a solid state. Further, the physical properties of the π-conjugated compound in the solid state hardly change even when exposed to light, but when exposed to light in the liquid crystal state, a part of the molecular structure changes and transitions to a fluid liquid state. Therefore, the dismantling adhesive surface containing the π-conjugated compound can exhibit adhesive strength, and the adhesive strength can be easily reduced by light irradiation in a predetermined temperature range. .

The sticky body has a sticky surface and a dismantling adhesive surface. Therefore, when attached to an adherend, high adhesive strength can be exhibited due to the contribution of both the adhesive surface and the dismantling adhesive surface. In addition, at the time of peeling, light irradiation is performed under a predetermined temperature range to reduce the adhesive force of the dismantling adhesive surface, thereby making it easy to peel.

A second aspect of the present invention is a pressure-sensitive adhesive layer containing a pressure-sensitive adhesive component; A cohesive body comprising:

In such a sticky body, when a dismantling adhesive layer is partially formed on the pressure-sensitive adhesive layer, the adhesive surface of the pressure-sensitive adhesive layer and the dismantling property of the dismantling adhesive layer are formed by pressing against the adherend. The adhesive surface can be brought into contact with the adherend. In addition, even if the dismantling adhesive layer is formed on the entire surface of the pressure-sensitive adhesive layer, the dismantling adhesive layer may be partially broken by pressing strongly when sticking to the adherend. By stretching in the in-plane direction before sticking to the body, by peeling off a part of the dismantling adhesive layer before sticking to the adherend, etc., the adhesive layer on the joint surface with the adherend An adhesive surface and a dismantling adhesive surface by a dismantling adhesive layer can be formed. Therefore, according to the viscous body, when it is attached to an adherend, a high adhesive force can be exhibited due to the contributions of both the tacky surface and the dismantling adhesive surface. In addition, at the time of peeling, light irradiation is performed under a predetermined temperature range to reduce the adhesive force of the dismantling adhesive surface, thereby making it easy to peel.

A third aspect of the present invention relates to an adhesive body comprising an adhesive layer containing an adhesive component and a π-conjugated compound represented by formula (1) above.

Such an adhesive body can achieve high adhesive strength due to the contribution of both the adhesive component and the π-conjugated compound due to the presence of the adhesive component and the π-conjugated compound on the bonding surface with the adherend. In addition, at the time of peeling, the π-conjugated compound is fluidized by light irradiation under a predetermined temperature range, and the peelability of the pressure-sensitive adhesive layer can be improved.

［式中、Ｒ^２は炭素原子数３～２０のアルキル基又は炭素原子数３～２０のアルコキシ基を示し、ｐは１～５の整数を示す。ｐが２以上のとき、複数のＲ^２は互いに同一であっても異なっていてもよい。］ R ¹ above may be a group represented by the following formula (2).

[In the formula, R ² represents an alkyl group having 3 to 20 carbon atoms or an alkoxy group having 3 to 20 carbon atoms, and p represents an integer of 1 to 5. When p is 2 or more, multiple R ² may be the same or different. ]

A π-conjugated compound in which R ¹ is a group represented by the above formula (2) is easy to produce, and by changing R ² and p, it is possible to appropriately adjust the temperature range exhibiting a liquid crystal state.

The π-conjugated compound may exhibit a liquid crystal state in at least a part of the temperature range of 35 to 150°C. An adherent using such a π-conjugated compound can be peeled off in a temperature range in which the adherend is unlikely to be adversely affected.

The adhesive component may contain at least one selected from the group consisting of adhesive resins and tackifiers.

The storage elastic modulus of the pressure-sensitive adhesive composed of the pressure-sensitive adhesive component may be 10 ³ Pa to 10 ⁷ Pa.

［式中、Ｒ^１は炭素原子数３～２０のアルキル基を少なくとも一つ有する基を示し、ｎは１～３の整数を示す。複数のＲ^１は互いに同一であっても異なっていてもよく、複数のｎは互いに同一であっても異なっていてもよい。］ A fourth aspect of the present invention relates to an adhesive containing an adhesive component and a π-conjugated compound represented by the following formula (1).

[In the formula, R ¹ represents a group having at least one alkyl group having 3 to 20 carbon atoms, and n represents an integer of 1 to 3. A plurality of R ¹ 's may be the same or different, and a plurality of n's may be the same or different. ]

［式中、Ｒ^２は炭素原子数３～２０のアルキル基又は炭素原子数３～２０のアルコキシ基を示し、ｐは１～５の整数を示す。ｐが２以上のとき、複数のＲ^２は互いに同一であっても異なっていてもよい。］ R ¹ above may be a group represented by the following formula (2).

[In the formula, R ² represents an alkyl group having 3 to 20 carbon atoms or an alkoxy group having 3 to 20 carbon atoms, and p represents an integer of 1 to 5. When p is 2 or more, multiple R ² may be the same or different. ]

A fifth aspect of the present invention is a method for producing a bonded body in which the viscous body and the adherend are bonded together, wherein the viscid body and the adherend are pressed against the adherend to The present invention relates to a method for manufacturing a joined body, including a joining step of joining the two.

The bonding step may be a step of pressing the adhesive body against the adherend under a temperature range in which the π-conjugated compound exhibits a liquid crystal state or a temperature exceeding the temperature range. According to such a bonding step, the π-conjugated compound contributes to adhesiveness, and the adherent is strongly adhered to the adherend.

The manufacturing method may further include a heating step of heating the bonding surface between the adherent and the adherend to a temperature range in which the π-conjugated compound exhibits a liquid crystal state or a temperature exceeding the temperature range. According to such a heating step, the π-conjugated compound contributes to adhesiveness, so that the viscous body temporarily adhered in the bonding step is strongly adhered to the adherend.

A sixth aspect of the present invention is a method for peeling off the viscous body from a bonded body in which the viscid body and the adherend are bonded, wherein at least one of the bonding surfaces of the viscid body and the adherend is Part 3 relates to a method for peeling an adherent, including the step of irradiating light under a temperature range in which the π-conjugated compound exhibits a liquid crystal state. In such a peeling method, the contribution of the π-conjugated compound to the adhesiveness is eliminated by light irradiation, so that the adherent can be easily peeled off.

ADVANTAGE OF THE INVENTION According to this invention, the adhesion body which can express high adhesive force and can peel easily is provided. Further, according to the present invention, there are provided a pressure-sensitive adhesive capable of forming the cohesive body, a bonded body obtained by bonding the cohesive body and an adherend, and a peeling method for peeling the cohesive body from the bonded body.

It is a cross-sectional view showing a preferred form of the adherence body. (a) is a top view showing a preferred form of an adherent, and (b) is a cross-sectional view showing a cross section along II-II. (a) is a top view showing a preferred form of an adherent, and (b) is a cross-sectional view showing a cross section along III-III. It is a cross-sectional view showing a preferred form of the adherence body. It is a cross-sectional view showing a preferred form of the adherence body. It is a cross-sectional view showing a preferred form of the adherence body. It is a cross-sectional view showing a preferred form of the adherence body.

Preferred embodiments of the invention are described below.

(π conjugated compound)
The π-conjugated compound according to this embodiment is a compound represented by the following formula (1).

In the formula, R ¹ represents a group having at least one alkyl group having 3-20 carbon atoms, and n represents an integer of 1-3. A plurality of R ¹ 's may be the same or different, and a plurality of n's may be the same or different.

The π-conjugated compound has a temperature range exhibiting a solid state, a temperature range exhibiting a liquid crystal state, and a temperature range exhibiting a liquid state. Adhesive force can be developed by cooling to a solid state after contact with an adherend. In addition, although the physical properties of the π-conjugated compound in the solid state hardly change even when irradiated with light, when the compound is irradiated with light in the liquid crystal state, part of the molecular structure changes and transitions to a fluid liquid state. Therefore, according to the π-conjugated compound, it is possible to form a dismantling adhesive surface that can exhibit adhesive strength and can easily reduce the adhesive strength by irradiating light in a predetermined temperature range. .

After the light irradiation in the liquid crystal state, for example, the π-conjugated compound is heated to a temperature at which the π-conjugated compound is in a liquid state (for example, a temperature exceeding 150° C.) and then cooled, so that the molecular structure of the π-conjugated compound is returned to the initial state. can be returned. That is, the dismantling adhesive surface containing the π-conjugated compound can be reused by heat treatment after peeling from the adherend.

More specifically, the π-conjugated compound is thought to have a V-shaped molecular skeleton bent by a cyclooctatetraene skeleton, and an integrated structure in which the V-shaped molecular skeleton is stacked in a certain temperature range. It is considered that the liquid crystal state is exhibited by removing the crystal.

The following formula ( ¹ -a) is a V-shaped V-shaped It is a formula explaining a molecular skeleton. Other π-conjugated compounds also have similar V-shaped molecular skeletons.

The π-conjugated compound is considered to form a dimer by photodimerization reaction of the acene skeleton or the cyclooctatetraene skeleton when irradiated with light in a liquid crystal state. Then, dimerization of a part of the π-conjugated compound in the liquid crystal state collapses the above-described accumulation structure, and the liquid crystal state changes to the liquid state, thereby exhibiting fluidity. In addition, since this dimerization reaction is caused by light irradiation in the liquid crystal state and not by light irradiation in the solid state, fluidization does not occur even if light is irradiated in the temperature range that indicates the solid state .

Further, in the π-conjugated compound, it is considered that, for example, when the π-conjugated compound is heated to a temperature at which the π-conjugated compound exhibits a liquid state, the reverse reaction of the dimerization reaction occurs to generate a monomer from the dimer. Therefore, even if the π-conjugated compound loses the liquid crystal state due to the mixture of dimers due to light irradiation in the liquid crystal state, it can be restored to the liquid crystal state by heating to cause the reverse reaction of the dimerization reaction. will show

Light irradiation may be any as long as the π-conjugated compound in the liquid crystal state can form a dimer. For example, the light irradiation may be ultraviolet irradiation with a wavelength of 300-400 nm. Such ultraviolet rays can easily fluidize a π-conjugated compound in a liquid crystal state.

Further, when n in formula (1) is 1, the irradiated light preferably includes light with a wavelength of 254 nm, and when n in formula (1) is 2, the irradiated light has a wavelength of 365 nm. of ultraviolet rays. As a result, fluidization of the π-conjugated compound can be efficiently caused.

In formula (1), R ¹ represents a group having at least one alkyl group having 3 to 20 carbon atoms. When R ¹ is such a group, a π-conjugated compound that exhibits a liquid crystal state in a predetermined temperature range while having a rigid acene skeleton and a flexible cyclooctatetraene skeleton is realized. Moreover, in such a π-conjugated compound, the temperature range in which the liquid crystal state is exhibited can be easily adjusted by changing the number of carbon atoms in the alkyl group of R ¹ .

The alkyl group possessed by R ¹ may be branched or linear, but is preferably linear. The number of carbon atoms in the alkyl group is preferably 4-20, more preferably 6-20. A plurality of R ^1s may be the same or different, but are preferably the same. A π-conjugated compound in which a plurality of R ^1s are the same has the advantage of being easy to produce.

In formula (1), n represents an integer of 1-3. n may be the same or different, but are preferably the same. A π-conjugated compound in which a plurality of n's are the same has the advantage of being easy to manufacture.

R ¹ is preferably a group represented by the following formula (2). A π-conjugated compound having such R ¹ can be easily produced by the production method described below. In addition, such a π-conjugated compound can easily adjust the temperature range in which it exhibits a liquid crystal state by changing ^R2 and p.

In the formula, R ² represents an alkyl group having 3 to 20 carbon atoms or an alkoxy group having 3 to 20 carbon atoms, and p represents an integer of 1 to 5. When p is 2 or more, multiple R ² may be the same or different.

The alkyl group for R ² may be branched or linear, preferably linear. The number of carbon atoms in the alkyl group is preferably 4-20, more preferably 6-20.

The alkoxy group for R ² may be branched or linear, preferably linear. The number of carbon atoms in the alkoxy group is preferably 4-20, more preferably 6-20.

p is preferably 1-3, more preferably 1 or 2.

Among the groups represented by the formula (2), groups represented by the following formulas (2-1), (2-2), (2-3) or (2-4) are particularly preferable as R ¹ be.

R ¹ is not limited to the above groups, and may be any group having at least one alkyl group having 3 to 20 carbon atoms. R ¹ may be ^a group that imparts liquid crystallinity to the π-conjugated compound, or may be a group selected so that the π-conjugated compound exhibits a liquid crystal state in a predetermined temperature range. R ¹ can also be selected from general substituents introduced to impart liquid crystallinity, such as those described in Chemical Review, 2009, vol 109, 6275-6540.

The π-conjugated compound preferably exhibits a liquid crystal state in at least part of the temperature range of 35 to 150° C. (more preferably 40 to 140° C., still more preferably 70 to 100° C.). An adherent using such a π-conjugated compound can be peeled off in a temperature range in which the adherend is unlikely to be adversely affected.

The π-conjugated compound preferably exhibits a liquid crystal state at a temperature range of 35° C. or higher, more preferably 40° C. or higher, and even more preferably 50° C. or higher. When the temperature range showing the liquid crystal state is 35° C. or higher, fluidization due to unexpected light irradiation during the process is less likely to occur.

The π-conjugated compound preferably exhibits a liquid crystal state in a temperature range of 150° C. or lower, more preferably 145° C. or lower. Since such a π-conjugated compound can relatively easily bring the π-conjugated compound into a liquid crystal state, the use of such a π-conjugated compound facilitates adhesion and peeling of the adhesive body.

(Method for producing π-conjugated compound)
One aspect of the method for producing the π-conjugated compound is described below. The production method of this embodiment includes a step of reacting a tetraformyl compound represented by the following formula (3) with a 2-butenedioic acid diester. In the formula, n represents an integer of 1-3.

According to the reaction between the tetraformyl compound and the 2-butenedioic acid diester, the acene skeleton can be extended, and two ester groups can be provided on each of the benzene rings at both ends. That is, according to the above reaction, a compound represented by the following formula (5) can be obtained. In the formula, R ³ represents a group derived from the ester moiety of 2-butenedioic acid diester.

Compounds of formula (5) correspond to compounds of formula (1) when R ³ is a group having at least one alkyl group having 3 to 20 carbon atoms. That is, when a 2-butenedioic acid diester having a group corresponding to R ¹ of formula (1) in the ester moiety is used as the 2-butenedioic acid diester, the above π-conjugated compound can be obtained by the above reaction. As the 2-butenedioic acid diester, either fumarate diester or maleate diester can be used.

Here, the 2-butenedioic acid diester having a group corresponding to R ¹ of formula (1) in the ester moiety can be represented by the following formula (4-1) or (4-2). In the formula, R ¹ has the same definition as R ¹ in formula (1).

In addition, in the compound represented by formula (5), R ³ may not be a group corresponding to R ¹ in formula (1). In this case, the π-conjugated compound can be obtained by transesterifying the compound represented by formula (5) to convert R ³ to a group corresponding to R ¹ in formula (1).

Incidentally, the tetraformyl compound represented by formula (3) can be produced by a known method. Am. Chem. Soc. , 2013, 135, 8842 (Yuan, C.; Saito, S.; Camacho, C.; Irle, S.; Hisaki, I.; Yamaguchi, S.).

The reaction conditions for the above tetraformyl compound and 2-butenedioic acid diester are, for example, C.I. Lin et al, Chem. Commun. 2009, 45, 803; Lin et al, Org. Biomol. Chem. 2011, 9, 4507, it can be appropriately set with reference to the description of the acene extension reaction.

For example, the above reaction can be carried out by reacting a tetraformyl compound with 2-butenedioic acid diester in the presence of tributylphosphine and diazabicycloundecene in a methylene chloride solvent under a nitrogen atmosphere. Also, the compound obtained by the reaction can be purified by, for example, column chromatography (silica gel column chromatography and/or high performance liquid chromatography).

As the reaction solvent used in the above reaction, in addition to the methylene chloride described above, for example, a halogen solvent such as 1,2-dichloroethane, an aromatic solvent such as toluene, or the like can be used.

In the above reaction, trialkylphosphine such as trimethylphosphine, triethylphosphine, and tripropylphosphine can be used in place of tributylphosphine described above. Further, in the above reaction, the diazabicycloundecene base described above can also be used. Specifically, strong bases such as potassium tert-butoxide and sodium hydride can be preferably used.

The reaction temperature for the above reaction can be, for example, 25° C. or higher, and may be raised to the boiling point of the solvent used.

(adhesive)
The adhesive body according to the present embodiment may be one that achieves both high adhesive strength to an adherend and easy peelability by a combination of the adhesive component and the π-conjugated compound.

The adherence substance according to the present embodiment can exhibit high adhesive strength due to the contribution of both the adherence component and the π-conjugated compound. Further, by irradiating light in a predetermined temperature range, the contribution of the π-conjugated compound to adhesiveness can be reduced, so that it can be easily peeled off from the adherend.

In addition, in the adhesive body according to the present embodiment, the adhesive component exhibits adhesiveness at room temperature, whereas the π-conjugated compound does not exhibit adhesiveness in a solid state, and in order to exhibit adhesive strength, a liquid crystal state or a liquid I need to transfer to a state. Due to such a difference in adhesion form, the adhesive body according to the present embodiment can be applied to various bonding methods such as temporary bonding by the action of the adhesive component and then bonding by expressing the action of the π-conjugated compound.

In addition, the adhesive body according to the present embodiment can be applied to various applications because the adhesive strength and peelability can be adjusted by changing the ratio of the adhesive component and the π-conjugated compound on the bonding surface with the adherend.

In one aspect, the adherent may comprise an adhesive surface containing an adhesive component and a dismantling adhesive surface containing the π-conjugated compound. Such an adhesive body can exhibit high adhesive strength when attached to an adherend due to the contributions of both the adhesive surface and the dismantling adhesive surface. In addition, at the time of peeling, light irradiation is performed under a predetermined temperature range to reduce the adhesive force of the dismantling adhesive surface, thereby making it easy to peel.

The adhesive body may include the adhesive surface and the detachable adhesive surface on the surface to be bonded to the adherend, and does not need to have the above shape before bonding to the adherend. .

In one aspect, the adherent may comprise an adhesive layer containing an adhesive component, and a dismantling adhesive layer disposed on the adhesive layer and containing the π-conjugated compound.

The adhesive body may have a dismantling adhesive layer partially formed on the adhesive layer. In this case, the adhesive surface of the pressure-sensitive adhesive layer and the dismantling adhesive surface of the dismantling adhesive layer can be brought into contact with the adherend by pressing the adherend.

Further, the adhesive body may have a dismantling adhesive layer formed on the entire surface of the adhesive layer. In this case, the detachable adhesive layer is partially broken by pressing strongly when attached to the adherend, stretched in the in-plane direction before attachment to the adherend, and dismantled before attachment to the adherend. By a method such as peeling off a part of the adhesive layer, an adhesive surface by the adhesive layer and a dismantling adhesive surface by the dismantling adhesive layer can be formed on the bonding surface with the adherend.

In one aspect, the adherent has an adhesive portion containing an adhesive component and a dismantling adhesive portion containing a π-conjugated compound, and the adhesive surface comprising the adhesive portion and the dismantling adhesive surface comprising the dismantling adhesive portion. may be provided with a joint surface having

The adherent may have, for example, a structure in which a dispersed phase comprising a dismantling adhesive part is dispersed in a continuous phase comprising an adhesive part. Further, the adherent may have a structure in which a dispersed phase comprising the adhesive portion is dispersed in a continuous phase comprising the dismantling adhesive portion. Further, the adhesive body may have a structure in which an adhesive portion and a dismantling adhesive portion are respectively formed on a base material. You can stay or stay away.

In one aspect, the adherent may have a pressure-sensitive adhesive layer composed of a pressure-sensitive adhesive containing a pressure-sensitive adhesive component and a π-conjugated compound. Such an adhesive body can be regarded as having, for example, a mixture of fine adhesive surfaces and dismantleable adhesive surfaces on the adhesive layer.

The above-mentioned adhesive can strongly adhere the adhesive layer to the adherend due to the contribution of both the adhesive component and the π-conjugated compound. In addition, the adhesive strength of the viscous body is lowered, and the viscid body can be easily peeled off.

In the present embodiment, the adhesive component is not particularly limited as long as it can be used as an adhesive. As the adhesive component, for example, a known adhesive may be used.

The tacky component may be, for example, a composition capable of forming a tacky adhesive (pressure-sensitive adhesive) at room temperature (eg, 25° C.).

The storage modulus of the adhesive composed of the adhesive component may be, for example, 10 ³ Pa to 10 ⁷ Pa.

The adhesive component may contain, for example, at least one selected from the group consisting of adhesive resins and tackifiers. The tacky resin may be a known tacky resin, for example, a resin having the storage modulus described above. The tackifier may be a known tackifier, such as petroleum-based resins, terpene resins, terpene phenolic resins, aromatic modified terpene resins, coumarone-indene resins, natural resin rosins, modified rosins, glycerol ester rosins, Pentaerythritol ester rosin, phenol resin, xylene resin, alicyclic petroleum resin, styrene resin, dicyclopentadiene resin and the like may be used. These may be used individually by 1 type, and may be used in mixture of 2 or more types.

In the present embodiment, the dismantling adhesive layer and the dismantling adhesive part may contain other components other than the π-conjugated compound within the range in which the effects of the present invention are exhibited. Other components include thermoplastic polymers such as poly(meth)acrylates, polysiloxanes, polyimides, polyamideimides, polyesters, polyamides, and styrenic polymers; (meth)acrylates, epoxy compounds, etc. Curable monomer components; photoinitiators and the like.

Preferred forms of the adherence body will be described below with reference to the drawings. Note that the drawings are drawn in an exaggerated manner in order to facilitate understanding, and the dimensional ratios and the like are not limited to those described in the drawings.

(first form)
FIG. 1 is a cross-sectional view showing a preferred form of the adherence body. The adhesive body 10 shown in FIG. 1 includes a dismantling adhesive layer 11 containing a π-conjugated compound, an adhesive layer 12 containing an adhesive component, and a substrate 13 . The adhesive body 10 has a dismantling adhesive layer 11 on one main surface of the adhesive layer 12 and a substrate 13 on the other main surface of the adhesive layer 12 .

The adhesive body 10 may be, for example, a tape-like or film-like adhesive body having one principal surface composed of the dismantling adhesive layer 11 and the other principal surface composed of the substrate 13 . Since the adhesive layer 12 of the adhesive body 10 is less exposed, the adhesive body 10 is excellent in handleability during storage and use.

The adherent 10 is bonded to the adherend on the surface (bonding surface) on the dismantling adhesive layer 11 side. For example, the viscous body 10 is placed on the adherend so that the dismantling adhesive layer 11 and the adherend are in contact with each other, and the viscous body 10 is strongly pressed against the adherend to form the dismantling adhesive layer. By partially breaking the adhesive layer 11, the pressure-sensitive adhesive layer 12 and the adherend can be brought into contact with each other and temporarily adhered to the adherend.

Alternatively, the adhesive body 10 may be stretched in the in-plane direction to partially break the dismantling adhesive layer 11, thereby exposing the adhesive layer 12 on the joint surface. In this case, by lightly pressing the viscous body 10 arranged on the adherend, the adhesive layer 12 and the adherend are adhered, and the viscous body 10 can be temporarily adhered to the adherend.

Alternatively, the adhesive body 10 may expose the adhesive layer 12 on the joint surface by partially peeling off the dismantling adhesive layer 11 . In this case, by lightly pressing the viscous body 10 arranged on the adherend, the adhesive layer 12 and the adherend are adhered, and the viscous body 10 can be temporarily adhered to the adherend.

The adhesive 10 temporarily adhered to the adherend is heated to a temperature range in which the π-conjugated compound exhibits a liquid crystal state or a temperature exceeding the temperature range, and then cooled to a temperature range in which the π-conjugated compound exhibits a solid state. Therefore, it can be strongly bonded to the adherend.

Alternatively, the adhesive 10 may be bonded to an adherend by pressing it against the adherend in a state where the π-conjugated compound exhibits a liquid crystal state or is heated to a temperature exceeding the temperature range. In this case, the fluidized dismantling adhesive layer 11 is pushed aside and a part of the adhesive layer 12 is brought into contact with the adherend, whereby the adhesive strength of the adhesive layer 12 is exhibited. In addition, when the π-conjugated compound is cooled to a temperature range in which the π-conjugated compound is in a solid state after being attached to the adherend, the adhesive strength of the dismantling adhesive layer 11 is exhibited, and the adherend 10 and the adherend are firmly bonded. spliced.

If the π-conjugated compound can form a laminated structure, the dismantling adhesive layer 11 can exhibit adhesive strength even when it is extremely thin. From this point of view, the thickness of the dismantling adhesive layer 11 may be, for example, 0.1 μm or more. From the viewpoint of facilitating breakage of the dismantling adhesive layer 11 and cost reduction, the thickness of the dismantling adhesive layer 11 may be, for example, 50 μm or less, preferably 30 μm or less, and 10 μm. The following are more preferred.

The thickness of the pressure-sensitive adhesive layer 12 is not particularly limited. The thickness of the pressure-sensitive adhesive layer 12 may be appropriately changed according to the type of pressure-sensitive adhesive forming the pressure-sensitive adhesive layer 12, the application of the adherence body 10, and the like. The thickness of the adhesive layer 12 may be, for example, 0.1-100 μm, preferably 0.1-60 μm.

In FIG. 1, the adhesive body 10 has a substrate 13 on the main surface of the adhesive layer 12 opposite to the dismantling adhesive layer 11 . Note that the adhesive body 10 does not necessarily have a base material, and may be composed of a dismantling adhesive layer 11 and an adhesive layer 12 .

The type and shape of the base material 13 are not particularly limited, and can be appropriately changed according to the type of adhesive constituting the adhesive layer 12, the application of the adherence body 10, and the like. The base material 13 may be, for example, a metal base material, an inorganic base material, a resin base material, or the like. Moreover, the shape of the substrate 13 may be, for example, a film shape, a tape shape, a rectangular parallelepiped shape, or the like.

The substrate 13 may be one of the members forming an assembly together with the adherend. Also, the substrate 13 may be a support member or a protection member that is temporarily attached to an adherend.

The adhesive body 10 may further have another structure on the surface of the substrate 13 opposite to the adhesive layer 12 . For example, the adhesive body 10 may further have an adhesive structure formed by a combination of an adhesive component and a π-conjugated compound on the surface of the substrate 13 opposite to the adhesive layer 12 . The adhesive structure may be, for example, the same structure as the dismantling adhesive layer 11 and the adhesive layer 12, or may be the same structure as the adhesive structure possessed by other forms described later.

(Second form)
FIG. 2(a) is a top view showing a preferred form of the adherent, and FIG. 2(b) is a cross-sectional view showing a II-II cross section of FIG. 2(a). The adhesive body 20 shown in FIG. 2 includes a dismantling adhesive layer 21 containing a π-conjugated compound, an adhesive layer 22 containing an adhesive component, and a substrate 23 . The adhesive body 20 has a plurality of strip-shaped dismantling adhesive layers 21 on one main surface of the adhesive layer 22 and a substrate 23 on the other main surface of the adhesive layer 22 .

The adhesive 20 may be, for example, a tape-like or film-like adhesive. Since the adhesive layer 22 of the adhesive body 20 is partially exposed, the adhesive body 20 can be easily temporarily adhered by pressing it against an adherend. The adhesive 20 temporarily adhered to the adherend is heated to a temperature range in which the π-conjugated compound exhibits a liquid crystal state or a temperature exceeding the temperature range, and then cooled to a temperature range in which the π-conjugated compound exhibits a solid state. Therefore, it can be strongly bonded to the adherend.

Alternatively, the adhesive body 20 may be bonded to the adherend by pressing it against the adherend in a state where the π-conjugated compound exhibits a liquid crystal state or is heated to a temperature exceeding the temperature range. In this case, the adhesive strength of the adhesive layer 22 is exhibited by the contact between the exposed portion of the adhesive layer 22 and the adherend, and the π-conjugated compound is in a solid state after being attached to the adherend. By cooling, the adhesive strength of the dismantling adhesive layer 21 is exhibited, and the sticky substance 20 and the adherend are firmly bonded.

If the π-conjugated compound can form a laminated structure, the dismantling adhesive layer 21 can exhibit adhesive strength even when it is extremely thin. From this point of view, the thickness of the dismantling adhesive layer 21 may be, for example, 0.1 μm or more. From the viewpoint of cost reduction, the thickness of the dismantling adhesive layer 21 may be, for example, 50 μm or less, preferably 30 μm or less, and more preferably 10 μm or less.

The width of the dismantling adhesive layer 21 and the distance between adjacent dismantling adhesive layers 21 (that is, the width of the exposed portion of the pressure-sensitive adhesive layer 22) are not particularly limited, and may be determined depending on the desired adhesiveness and peelability. may be changed as appropriate. By increasing the ratio of the dismantling adhesive layer 21 to the bonding surface, the peelability is further improved. Further, by increasing the proportion of the adhesive layer 22 exposed to the bonding surface, the adhesive strength during temporary bonding and the bonding strength with the adherend are improved.

In the adhesive body 20 , the multiple dismantling adhesive layers 21 preferably have substantially the same width, and are preferably arranged regularly on the adhesive layer 22 .

In the adhesive body 20, the dismantling adhesive layer 21 is formed at an angle with respect to the width direction and the length direction of the tape-shaped adhesive body 20, but the angle of the dismantling adhesive layer 21 is the width direction. Or it may be parallel to the length direction. By forming the dismantling adhesive layer 21 like the sticky substance 20, the dismantling adhesive layer 21 is present at the interface with the adherend regardless of whether it is peeled from the width direction or the length direction. and the releasability becomes better.

The thickness of the adhesive layer 22 is not particularly limited, and may be changed as appropriate according to the type of adhesive constituting the adhesive layer 22, the application of the viscous body 20, and the like. The thickness of the adhesive layer 22 may be, for example, 0.1-100 μm, preferably 0.1-60 μm.

In FIG. 2, the adhesive body 20 has a substrate 23 on the main surface of the adhesive layer 22 opposite to the dismantling adhesive layer 21 . Note that the adhesive body 20 does not necessarily have a base material, and may be composed of the dismantling adhesive layer 21 and the adhesive layer 22 .

The type and shape of the base material 23 are not particularly limited, and can be appropriately changed according to the type of adhesive constituting the adhesive layer 22 and the application of the adherent 20 . The base material 23 may be, for example, a metal base material, an inorganic base material, a resin base material, or the like. Moreover, the shape of the substrate 23 may be, for example, a film shape, a tape shape, a rectangular parallelepiped shape, or the like.

The substrate 23 may be one of the members forming an assembly together with the adherend. Also, the substrate 23 may be a support member or a protection member that is temporarily attached to an adherend.

The adhesive body 20 may further have another structure on the surface of the substrate 23 opposite to the adhesive layer 22 . For example, the adhesive body 20 may further have an adhesive structure formed by a combination of an adhesive component and a π-conjugated compound on the surface of the substrate 23 opposite to the adhesive layer 22 . The adhesive structure may be, for example, the same structure as the dismantling adhesive layer 21 and the pressure-sensitive adhesive layer 22, or may be the same structure as the adhesive structure possessed by other embodiments of the present specification.

(Third form)
FIG. 3(a) is a top view showing a preferred form of the adherent, and FIG. 3(b) is a sectional view showing the III-III section of FIG. 3(a). The adhesive body 30 shown in FIG. 3 includes a dismantling adhesive layer 31 containing a π-conjugated compound, an adhesive layer 32 containing an adhesive component, and a substrate 33 . The adhesive body 30 has a plurality of dismantling adhesive layers 31 provided on one main surface of an adhesive layer 32 while being spaced apart from each other, and a substrate 33 on the other main surface of the adhesive layer 32 . is provided.

The adhesive 30 may be, for example, a tape-like or film-like adhesive. Since the adhesive layer 32 of the adhesive body 30 is partially exposed, the adhesive body 30 can be easily temporarily adhered by being pressed against the adherend. The adhesive 30 temporarily adhered to the adherend is heated to a temperature range in which the π-conjugated compound exhibits a liquid crystal state or a temperature exceeding the temperature range, and then cooled to a temperature range in which the π-conjugated compound exhibits a solid state. Therefore, it can be strongly bonded to the adherend.

Alternatively, the adhesive 30 may be bonded to the adherend by pressing it against the adherend in a state where the π-conjugated compound exhibits a liquid crystal state or is heated to a temperature exceeding the temperature range. In this case, the adhesive strength of the adhesive layer 32 is exhibited by the contact between the exposed portion of the adhesive layer 32 and the adherend, and the π-conjugated compound is in a solid state after being attached to the adherend. By cooling, the adhesive strength of the dismantling adhesive layer 31 is exhibited, and the sticky substance 30 and the adherend are firmly bonded.

If the π-conjugated compound can form a laminated structure, the dismantling adhesive layer 31 can exhibit adhesive strength even when it is extremely thin. From this point of view, the thickness of the dismantling adhesive layer 31 may be, for example, 0.1 μm or more. From the viewpoint of cost reduction, the thickness of the dismantling adhesive layer 31 may be, for example, 50 μm or less, preferably 30 μm or less, and more preferably 10 μm or less.

The shape of the dismantling adhesive layer 31 and the distance between adjacent dismantling adhesive layers 21 are not particularly limited, and may be changed as appropriate according to the desired adhesiveness and peelability. By increasing the ratio of the dismantling adhesive layer 31 to the bonding surface, the peelability is further improved. Further, by increasing the proportion of the adhesive layer 32 exposed to the bonding surface, the adhesive strength during temporary bonding and the bonding strength with the adherend are improved.

In the adhesive body 30 , the multiple dismantling adhesive layers 31 preferably have substantially the same shape, and are preferably arranged regularly on the adhesive layer 32 .

The thickness of the adhesive layer 32 is not particularly limited, and may be changed as appropriate according to the type of adhesive constituting the adhesive layer 32, the application of the viscous body 30, and the like. The thickness of the adhesive layer 32 may be, for example, 0.1-100 μm, preferably 0.1-60 μm.

In FIG. 3, the adhesive body 30 has a substrate 33 on the main surface of the adhesive layer 32 opposite to the dismantling adhesive layer 31 . Note that the adhesive body 30 does not necessarily have a base material, and may be composed of the dismantling adhesive layer 31 and the adhesive layer 32 .

The type and shape of the base material 33 are not particularly limited, and can be changed as appropriate according to the type of adhesive constituting the adhesive layer 32, the application of the adherent 30, and the like. The base material 33 may be, for example, a metal base material, an inorganic base material, a resin base material, or the like. Moreover, the shape of the base material 33 may be, for example, a film shape, a tape shape, a rectangular parallelepiped shape, or the like.

The substrate 33 may be one of the members forming an assembly together with the adherend. Also, the substrate 33 may be a support member or a protection member that is temporarily attached to an adherend.

The adhesive body 30 may further have another structure on the surface of the substrate 33 opposite to the adhesive layer 32 . For example, the adhesive body 30 may further have an adhesive structure formed by a combination of an adhesive component and a π-conjugated compound on the surface of the substrate 33 opposite to the adhesive layer 32 . The adhesive structure may be, for example, the same structure as the dismantling adhesive layer 31 and the pressure-sensitive adhesive layer 32, or may be the same structure as the adhesive structure possessed by other embodiments of the present specification.

(Fourth form)
FIG. 4 is a cross-sectional view showing a preferred form of the adherence body. The adhesive body 40 shown in FIG. 4 includes a dismantling adhesive layer 41 containing a π-conjugated compound, an adhesive layer 42 containing an adhesive component, and a substrate 43 . In the adhesive body 40, the adhesive layer 42 is provided with a plurality of recesses on one main surface side, and the dismantling adhesive layer 41 is provided in the recesses. Thus, in the adhesive body 40, the dismantling adhesive surface of the dismantling adhesive layer 41 and the adhesive surface of the adhesive layer 42 are formed on the same surface.

The adhesive 40 may be, for example, a tape-like or film-like adhesive. Since the adhesive layer 42 of the adhesive body 40 is partially exposed, the adhesive body 40 can be easily temporarily adhered by being pressed against the adherend. The adhesive 40 temporarily adhered to the adherend is heated to a temperature range in which the π-conjugated compound exhibits a liquid crystal state or a temperature exceeding the temperature range, and then cooled to a temperature range in which the π-conjugated compound exhibits a solid state. Therefore, it can be strongly bonded to the adherend.

Alternatively, the adhesive 40 may be bonded to the adherend by pressing it against the adherend in a state where the π-conjugated compound exhibits a liquid crystal state or is heated to a temperature exceeding the temperature range. In this case, the adhesive strength of the adhesive layer 42 is exhibited by the contact between the exposed portion of the adhesive layer 42 and the adherend, and the π-conjugated compound is in a solid state after being attached to the adherend. By cooling, the dismantling adhesive layer 41 exerts an adhesive force, and the viscous body 40 and the adherend are firmly bonded.

If the π-conjugated compound can form a laminated structure, the dismantling adhesive layer 41 can exhibit adhesive strength even when it is extremely thin. From this point of view, the thickness of the dismantling adhesive layer 41 may be, for example, 0.1 μm or more. From the viewpoint of cost reduction, the thickness of the dismantling adhesive layer 41 may be, for example, 50 μm or less, preferably 30 μm or less, and more preferably 10 μm or less.

The shape of the dismantling adhesive layer 41 and the distance between adjacent dismantling adhesive layers 41 are not particularly limited, and may be changed as appropriate according to desired adhesiveness and peelability. By increasing the ratio of the dismantling adhesive layer 41 to the joint surface, the releasability is further improved. Moreover, by increasing the ratio of the adhesive layer 42 exposed to the bonding surface, the adhesive strength during temporary bonding and the bonding strength with the adherend are improved. The dismantling adhesive layer 41 may be formed, for example, so as to form a top view similar to that of FIG. 2(a), or to form a top view similar to that of FIG. 3(a). .

In the adhesive body 40 , the multiple dismantling adhesive layers 41 preferably have substantially the same shape, and are preferably arranged regularly on the adhesive layer 42 .

The thickness of the adhesive layer 42 is not particularly limited, and may be changed as appropriate according to the type of adhesive constituting the adhesive layer 42 and the application of the viscous body 40 . The thickness of the adhesive layer 42 may be, for example, 0.1-100 μm, preferably 0.1-60 μm.

In FIG. 4 , the adhesive body 40 has a substrate 43 on the main surface of the adhesive layer 42 opposite to the dismantling adhesive layer 41 . Note that the adhesive body 40 does not necessarily have a base material, and may be composed of the dismantling adhesive layer 41 and the adhesive layer 42 .

The type and shape of the base material 43 are not particularly limited, and can be appropriately changed according to the type of adhesive constituting the adhesive layer 42 and the application of the viscous body 40 . The base material 43 may be, for example, a metal base material, an inorganic base material, a resin base material, or the like. Moreover, the shape of the base material 43 may be, for example, a film shape, a tape shape, a rectangular parallelepiped shape, or the like.

The substrate 43 may be one of the members forming an assembly together with the adherend. Also, the substrate 43 may be a support member or a protection member that is temporarily attached to the adherend.

The adhesive body 40 may have another structure on the surface of the substrate 43 opposite to the adhesive layer 42 . For example, the adhesive body 40 may further have an adhesive structure formed by a combination of an adhesive component and a π-conjugated compound on the surface of the substrate 43 opposite to the adhesive layer 42 . The adhesive structure may be, for example, the same structure as the dismantling adhesive layer 41 and the pressure-sensitive adhesive layer 42, or may be the same structure as the adhesive structure possessed by other embodiments of the present specification.

(Fifth form)
FIG. 5 is a cross-sectional view showing a preferred form of the adherence body. The adhesive body 50 shown in FIG. 5 includes a dismantling adhesive portion 51 containing a π-conjugated compound, an adhesive portion 52 containing an adhesive component, and a base material 53 . In the adhesive body 50, a dismantling adhesive portion 51 and an adhesive portion 52 are provided on one surface of a base material 53, respectively. is formed. The adhesive body 50 may also have a dismantling adhesive surface by the dismantling adhesive portion 51 and an adhesive surface by the adhesive portion 52 on the bonding surface on the opposite side of the base material 53 .

The adhesive 50 may be, for example, a tape-like or film-like adhesive. Since the adhesive surface is partially formed on the bonding surface of the adhesive body 50, temporary bonding can be easily performed by pressing the bonding surface against the adherend. The adhesive 50 temporarily adhered to the adherend is heated to a temperature range in which the π-conjugated compound exhibits a liquid crystal state or a temperature exceeding the temperature range, and then cooled to a temperature range in which the π-conjugated compound exhibits a solid state. Therefore, it can be strongly bonded to the adherend.

Alternatively, the adhesive 50 may be bonded to the adherend by pressing it against the adherend in a state where the π-conjugated compound exhibits a liquid crystal state or is heated to a temperature exceeding the temperature range. In this case, the adhesive force of the adhesive part 52 is exhibited by the contact between the adhesive surface and the adherend, and the π-conjugated compound is cooled to a temperature range in which the π-conjugated compound is in a solid state after being attached to the adherend. Adhesive strength is developed by the adhesive portion 51, and the adherend 50 and the adherend are firmly bonded.

The shape of the dismantling adhesive portion 51 and the adhesive portion 52 is not particularly limited, and may be changed as appropriate according to the desired adhesiveness and peelability. By increasing the ratio of the detachable adhesive surface to the joint surface, the releasability is further improved. Further, by increasing the ratio of the adhesive surface exposed to the bonding surface, the adhesive strength during temporary bonding and the bonding strength with the adherend are improved. The dismantling adhesive part 51 and the adhesive part 52 may be formed, for example, so as to form a top view similar to that of FIG. may

The thicknesses of the dismantling adhesive portion 51 and the adhesive portion 52 are not particularly limited, and may be changed as appropriate according to the type of adhesive forming the adhesive portion 52, the application of the adhesive body 50, and the like. The thickness of the detachable adhesive portion 51 and adhesive portion 52 may be, for example, 0.1 to 100 μm, preferably 0.1 to 60 μm.

In FIG. 5 , the adhesive body 50 has a base material 53 on the main surface of the adhesive portion 52 opposite to the dismantling adhesive portion 51 . Note that the adhesive body 50 does not necessarily have a base material, and may be composed of a dismantling adhesive portion 51 and an adhesive portion 52 .

The type and shape of the base material 53 are not particularly limited, and can be changed as appropriate according to the type of adhesive forming the adhesive portion 52, the application of the adherent 50, and the like. The base material 53 may be, for example, a metal base material, an inorganic base material, a resin base material, or the like. Moreover, the shape of the base material 53 may be, for example, a film shape, a tape shape, a rectangular parallelepiped shape, or the like.

The substrate 53 may be one of the members forming an assembly together with the adherend. Also, the substrate 53 may be a support member or a protection member that is temporarily attached to an adherend.

The adhesive body 50 may have other structures on the surface of the substrate 53 opposite to the dismantling adhesive portion 51 and the adhesive portion 52 . For example, the adhesive body 50 may further have an adhesive structure formed by a combination of an adhesive component and a π-conjugated compound on the surface of the substrate 53 opposite to the detachable adhesive portion 51 and the adhesive portion 52 . The adhesive structure may be, for example, the same structure as the dismantling adhesive part 51 and the adhesive part 52, or may be the same structure as the adhesive structure of other embodiments of the present specification.

(Sixth form)
FIG. 6 is a cross-sectional view showing a preferred form of the adherence body. The adhesive body 60 shown in FIG. 6 includes a first dismantling adhesive layer 61a and a second dismantling adhesive layer 61b containing a π-conjugated compound, and an adhesive layer 62 containing an adhesive component. there is In the adhesive body 60, a first dismantling adhesive layer 61a is provided on one main surface of the adhesive layer 62, and a second dismantling adhesive is provided on the other main surface of the adhesive layer 62. A layer 61b is provided.

The adhesive body 60 may be, for example, a tape-shaped or film-shaped adhesive body having a first dismantling adhesive layer 61a and a second dismantling adhesive layer 61b on each main surface. Since the adhesive layer 62 of the adhesive body 60 is less exposed, the adhesive body 60 is excellent in handleability during storage and use.

The adherent 60 is an adherend on both the surface (first bonding surface) on the side of the first dismantling adhesive layer 61a and the surface (second bonding surface) on the side of the second dismantling adhesive layer 61b. can be joined with For example, the adhesive body 60 is placed on the adherend so that the first dismantling adhesive layer 61a and the adherend are in contact with each other, and the adhesive body 60 is strongly pressed against the adherend. By breaking a part of one dismantling adhesive layer 61a, the pressure-sensitive adhesive layer 62 and the adherend can be brought into contact with each other and temporarily adhered to the adherend. Further, the adhesive body 60 is sandwiched between the first adherend and the second adherend, and pressure is applied from both sides of the adhesive body 60 to form the first dismantling adhesive layer 61a. and part of the second dismantling adhesive layer 61b to temporarily bond the first adherend and the second adherend.

In addition, the adhesive body 60 stretches in the in-plane direction to break a part of the first dismantling adhesive layer 61a and a part of the second dismantling adhesive layer 61b. The adhesive layer 62 may be exposed on the second joint surface. In this case, the first adherend and the second adherend are sandwiched between the first adherend and the second adherend, and the first adherend and the second adherend are separated through the adherend 60 by lightly applying pressure from both sides. It can be temporarily adhered to an adherend.

In addition, the adhesive body 60 is formed by peeling off a part of the first dismantling adhesive layer 61a and/or a part of the second dismantling adhesive layer 61b, thereby forming the first joint surface and/or the second adhesive layer 61b. You may expose the adhesive layer 62 to the joint surface of . In this case, the adherend and the viscid substance 60 can be easily temporarily adhered.

The temporarily bonded adhesive 60 is heated to a temperature range in which the π-conjugated compound exhibits a liquid crystal state or a temperature exceeding the temperature range, and then cooled to a temperature range in which the π-conjugated compound exhibits a solid state. can be strongly bonded to

In addition, both sides of the adhesive 60 placed between the first adherend and the second adherend are heated to a temperature range where the π-conjugated compound exhibits a liquid crystal state or a temperature exceeding this temperature range. It may be joined to the adherend by applying pressure from. In this case, the first dismantling adhesive layer 61a and the second dismantling adhesive layer 61b are pushed aside, and part of the adhesive layer 62 contacts the first adherend and the second adherend. As a result, the adhesive strength of the adhesive layer 62 is exhibited. Further, when the π-conjugated compound is cooled to a temperature range in which it exhibits a solid state, the first dismantling adhesive layer 61a and the second dismantling adhesive layer 61b exhibit adhesive strength, and the first adherend , the adherent 60 and the second adherend are firmly bonded.

The first dismantling adhesive layer 61a and the second dismantling adhesive layer 61b can exhibit adhesive strength even if they are extremely thin, as long as the π-conjugated compound can form a laminated structure. From this point of view, the thickness of the first dismantling adhesive layer 61a and the second dismantling adhesive layer 61b may each be, for example, 0.1 μm or more. From the standpoints of facilitating breakage and cost reduction, the thickness of each of the first dismantling adhesive layer 61a and the second dismantling adhesive layer 61b should be, for example, 50 μm or less. Well, 30 μm or less is preferable, and 10 μm or less is more preferable.

The thickness of the pressure-sensitive adhesive layer 62 is not particularly limited. I wish I had. The thickness of the adhesive layer 62 may be appropriately changed according to the type of adhesive constituting the adhesive layer 62, the application of the adherent 60, and the like. The thickness of the adhesive layer 62 may be, for example, 0.1-100 μm, preferably 0.1-60 μm.

(Seventh form)
FIG. 7 is a cross-sectional view showing a preferred form of the adherence body. The adhesive body 70 shown in FIG. 7 includes an adhesive layer 72 made of an adhesive containing an adhesive component and a π-conjugated compound and a base material 73 . A layer 72 is provided.

The adhesive 70 may be, for example, a tape-like or film-like adhesive. Since the adhesive layer 72 contains an adhesive component, the adhesive body 70 can be easily temporarily adhered to the adherend by pressing it against the adherend. The adhesive 70 temporarily adhered to the adherend is heated to a temperature range in which the π-conjugated compound exhibits a liquid crystal state or a temperature exceeding the temperature range, and then cooled to a temperature range in which the π-conjugated compound exhibits a solid state. Therefore, it can be strongly bonded to the adherend.

The thickness of the adhesive layer 72 is not particularly limited, and may be changed as appropriate according to the type of adhesive component, the application of the adhesive body 70, and the like. The thickness of the adhesive layer 72 may be, for example, 0.1-100 μm, preferably 0.1-60 μm.

The content of the π-conjugated compound in the adhesive constituting the adhesive layer 72 is not particularly limited, and may be changed as appropriate within the range in which the adhesive layer 72 can exhibit adhesiveness. By increasing the proportion of the π-conjugated compound in the pressure-sensitive adhesive, the releasability is further improved. In addition, by reducing the proportion of the π-conjugated compound in the pressure-sensitive adhesive, the adhesive strength during temporary adhesion and the bonding strength with the adherend are improved. The content of the π-conjugated compound may be, for example, 0.1% by mass or more, preferably 5% by mass or more, based on the total amount of the adhesive. Moreover, the content of the π-conjugated compound may be, for example, 50% by mass or less, preferably 30% by mass or less, based on the total amount of the adhesive.

In FIG. 7, an adhesive body 70 has a substrate 73 on one main surface of an adhesive layer 72 . Note that the adhesive body 70 does not necessarily have a base material, and may be composed only of the adhesive layer 72 .

The type and shape of the base material 73 are not particularly limited, and can be appropriately changed according to the type of adhesive forming the adhesive layer 72 and the application of the viscous body 70 . The base material 73 may be, for example, a metal base material, an inorganic base material, a resin base material, or the like. Moreover, the shape of the base material 73 may be, for example, a film shape, a tape shape, a rectangular parallelepiped shape, or the like.

The substrate 73 may be one of the members forming an assembly together with the adherend. Also, the substrate 73 may be a support member or a protection member that is temporarily attached to the adherend.

The adhesive body 70 may have another structure on the surface of the substrate 73 opposite to the adhesive layer 72 . For example, the adhesive body 70 may further have an adhesive structure formed by a combination of an adhesive component and a π-conjugated compound on the surface of the substrate 73 opposite to the adhesive layer 72 . The adhesive structure may be, for example, the same as the adhesive layer 72, or may have the same structure as the adhesive structures possessed by other embodiments of the present specification.

(Manufacturing method of joined body)
A method for manufacturing a bonded body according to the present embodiment includes a bonding step of pressing the above-described viscous material against an adherend to bond the viscous material and the adherend.

The bonding step may be carried out so that the viscous material and the adherend are adhered by the action of the adhesive component in the viscous material.

The bonding step may be a step of pressing the adhesive body against the adherend under a temperature range in which the π-conjugated compound exhibits a liquid crystal state or a temperature exceeding the temperature range. According to such a bonding step, both the adhesive component and the π-conjugated compound contribute to firmly bonding the adherent to the adherend.

Also, the bonding step may be a step of temporarily bonding the viscous body and the adherend. In this case, the manufacturing method according to the present embodiment further includes a heating step of heating the bonding surface between the adherent and the adherend to a temperature range in which the π-conjugated compound exhibits a liquid crystal state or a temperature exceeding the temperature range. you can stay According to such a heating step, both the adhesive component and the π-conjugated compound contribute to firmly bonding the adherent to the adherend.

The adherend is not particularly limited. Specific examples of adherends include glass, sapphire, quartz, calcium fluoride, stainless steel, aluminum, iron, silicon wafers, gallium nitride, and silicon carbide.

(Method for removing adhesive)
The method for peeling the adhesive body according to the present embodiment includes an irradiation step of irradiating at least part of the bonding surface between the adhesive body and the adherend with light under a temperature range in which the π-conjugated compound exhibits a liquid crystal state.

When the adherend has optical transparency, the irradiation step may be a step of irradiating the bonding surface with light from the adherend side. Further, when the adherent does not have a base material or the base material is light-transmitting, the irradiation step may be a step of irradiating light from the opposite side of the adherend to the adherend. Through the irradiation step, the adherent can be easily peeled off.

Further, the irradiation step may be a step of exfoliating the adhesive while irradiating the interface between the adhesive and the adherend with light in a direction parallel to the bonding surface.

The wavelength of the light irradiated in the irradiation step may be any wavelength that can be absorbed by the π-conjugated compound. The wavelength of the illuminating light may be, for example, 200-450 nm.

The irradiation amount of the light irradiated in the irradiation step may be appropriately changed according to the content of the π-conjugated compound on the bonding surface. For example, the irradiation amount of light may be such that the integrated light amount is 100 to 100000 mJ/cm ² with respect to the bonding surface. The integrated amount of light is preferably 200 to 50,000 mJ/cm ² , more preferably 200 to 30,000 mJ/cm ² .

Although the preferred embodiments of the present invention have been described above, the present invention is not limited to the above embodiments.

EXAMPLES The present invention will be described in more detail with reference to examples below, but the present invention is not limited to the examples.

(Synthesis of fumarate diester)
Maleic acid (81.7 mg, 0.70 mmol) and cesium carbonate (688.2 mg, 2.10 mmol) were dissolved in anhydrous dimethylformamide (3 mL) and stirred at room temperature for 50 minutes under nitrogen atmosphere. 3,4-Bis(dodecyloxy)benzyl bromide (1.91 g, 3.50 mmol) was added dropwise to the reaction solution, and the mixture was stirred at 60° C. for 3 days. After returning to room temperature, water was added to the reaction solution to stop the reaction, and the mixture was extracted with methylene chloride. The organic layer was washed with saturated brine, dried over anhydrous sodium sulfate, and the solvent was distilled off. Bis(3,4-bis( _dodecyloxy ) benzyl) fumarate (305.3 mg, 0.29 mmol, 42% yield).

The spectral data of bis(3,4-bis(dodecyloxy)benzyl)fumarate were as follows.
¹ H NMR (400 MHz, CDCl ₃ ): δ 6.83-6.92 (m, 8H), 5.13 (s, 4H), 3.98 (t, J=6.6Hz, 8H), 1. 77-1.84 (m, 8H), 1.26-1.45 (m, 72H), 0.86-0.89 (m, 12H);
¹³ C NMR (100 MHz, CDCl ₃ ): δ 164.9, 149.7, 149.4, 133.9, 127.9, 121.7, 114.7, 113.9, 69.6, 69.5 , 67.4, 32.1, 29.9, 29.8, 29.8, 29.6, 29.6, 29.5, 29.5, 29.4, 26.2, 26.2, 22 .8, 14.2;
HRMS (high resolution mass spectrometer) (APCI (atmospheric pressure chemical ionization), positive): [M ⁺ ] calcd. for _C66H112O8 , _1032.8352 ; found _1032.8379 .

(Production of π-conjugated compound A1)
A π-conjugated compound A1 was produced by the reaction represented by the following formula.

Specifically, tributylphosphine (325 μL, 1.30 mmol) was added to a methylene chloride solution (30 mL) of bis(3,4-bis(dodecyloxy)benzyl) fumarate 2 (1.25 g, 1.20 mmol) under a nitrogen atmosphere. It was added dropwise at 0° C. and the reaction solution was stirred at room temperature for 40 minutes. Thereafter, the reaction solution was added dropwise to a methylene chloride solution (60 mL) of tetraformyl compound 1 (208.6 mg, 0.50 mmol) (compound 1 in the above formula) cooled to 0°C under a nitrogen atmosphere. Diazabicycloundecene (5 μL, 0.05 mmol) was added dropwise. After stirring at 50° C. for 2 days, water was added to the reaction solution to stop the reaction, and the mixture was extracted with methylene chloride three times. After dehydrating the organic layer after extraction with anhydrous sodium sulfate, the solvent was distilled off. The residue was separated by silica gel column chromatography using a mixed solvent of hexane-methylene chloride-triethylamine (mixture ratio 2:48:1) (R _f value (retention factor value) = 0.80) to obtain a crude product. Obtained. Furthermore, π-conjugated compound A1 (343.6 mg, 0.14 mmol, yield 28%) was obtained as a yellow solid by purifying by high-performance liquid chromatography using a mixed solvent of chloroform and triethylamine (mixture ratio of 50:1). Compound A1) in the formula was obtained.

[Measurement by differential scanning calorimeter]
Using a differential scanning calorimeter (model: Exstar 6000 DSC 6200, manufactured by Seiko Instruments Inc.), the π-conjugated compound A1 was heated in a nitrogen atmosphere at a rate of 2° C./min to 200° C. indicating a liquid state. After being held at 200°C for 10 minutes, it was cooled at a rate of 2°C/min. As a result, an exothermic peak of 18.3 mJ/mg associated with the phase transition from liquid to liquid crystal was observed at 142.7°C, the extrapolation starting point. rice field. Furthermore, an exothermic peak of 14.8 mJ/mg associated with the phase transition from liquid crystal to crystal was observed at the extrapolation starting point of 67.3°C.

(Production of adhesive component A)
Septon 2004 (100 g, styrene-ethylene/propylene-styrene copolymer, manufactured by Kuraray Co., Ltd.) and Clearon P-105 (100 g, tackifier, manufactured by Yasuhara Chemical Co., Ltd.) are blended, and a kneader equipped with a propeller-type stirring blade is used. The adhesive component A was produced by melt-kneading at 200°C.

<Example 1>
(Manufacture of sticky substance)
The adhesive component A was coated on a polyethylene terephthalate film (50 μm thick) using a coater at a temperature of 180° C., and then cooled to obtain an adhesive tape T1 having an adhesive layer. The thickness of the adhesive layer was 20 μm.

Next, the π-conjugated compound melted at 170° C. was applied to a release treated film (Therapeal MFA, thickness 38 μm, manufactured by Toray Industries, Inc.) and cooled to form a dismantling adhesive layer. The obtained dismantling adhesive layer was laminated on the adhesive layer of the adhesive tape T1 to obtain the adhesive body A1 of Example 1. The thickness of the dismantling adhesive layer was 3 μm.

(Use of adhesive)
Adhesive A1 was pressed against a glass plate for temporary adhesion and heated to 70° C. to obtain a bonded body of glass plate and adherent A1 (adhesion area: 1.2 cm×1.2 cm). One side of the resulting joined body was fixed with a clamp, and the tip of a push-pull gauge (WPARX-10, manufactured by Shiro Sangyo Co., Ltd.) was hooked on a hole made at the end of the adhesive tape T1. A push-pull gauge was pulled to measure the 180° peel strength. This measurement was repeated 5 times, and the arithmetic mean of the peel strength measured each time was 4.4 N/1.2 cm.

Next, a bonded body was formed in the same manner as above, and while the bonded body was held at 100° C., ultraviolet light with a wavelength of 365 nm (illuminance of 2.6 W/cm ² ) was applied to the bonding surface from the glass side for 10 seconds. irradiated. After that, the peel strength was measured in the same manner as above, and the average peel strength was 2.8 N/1.2 cm.

From this result, it was confirmed that in the adherence body A1 of Example 1, the adhesive strength of the bonding surface can be reduced and the releasability can be improved by light irradiation under a predetermined temperature range.

<Comparative Example 1>
(Manufacture of sticky substance)
No dismantling adhesive was used. Specifically, the adhesive component A was coated on a polyethylene terephthalate film (thickness: 50 μm) at a temperature of 180° C. using a coater, and then cooled to obtain an adhesive tape T1 having an adhesive layer. The thickness of the adhesive layer was 20 μm. This pressure-sensitive adhesive tape T1 was used as the pressure-sensitive adhesive B1 of Comparative Example 1.

(Use of adhesive)
The adherent B1 was adhered to a glass plate to obtain a joined body of the glass plate and the adherent B1 (adhesion area: 1.2 cm×1.2 cm). As a result of measuring the peel strength of the obtained joined body in the same manner as in Example 1, the average peel strength was 4.3 N/1.2 cm.

Next, a bonded body was formed in the same manner as above, and while the bonded body was held at 100° C., ultraviolet light with a wavelength of 365 nm (illuminance of 2.6 W/cm ² ) was applied to the bonding surface from the glass side for 10 seconds. irradiated. After that, the peel strength was measured in the same manner as above, and the average peel strength was 6.3 N/1.2 cm.

<Comparative Example 2>
A laminate was formed by directly forming a dismantling adhesive layer on a polyethylene terephthalate film (thickness: 50 μm) without using adhesive component A. This laminate was not tacky and did not adhere to the glass plate when pressed against it at room temperature.

The adhesive body of the present invention can exhibit high adhesive strength due to the contribution of the adhesive component and the π-conjugated compound, and can be easily peeled off by reducing the adhesive strength of the bonding surface by light irradiation. Therefore, the adhesive body of the present invention can be expected to be applied in various fields as a peelable adhesive body.

10, 20, 30, 40, 50, 60, 70 Adhesive body 11, 21, 31, 41 Dismantling adhesive layer 51 Dismantling adhesive portion 61a First dismantling adhesive layer 61b ... second dismantling adhesive layer, 12, 22, 32, 42, 62, 72 ... adhesive layer, 52 ... adhesive portion, 13, 23, 33, 43, 53, 73 ... base material.

Claims (11)

an adhesive surface containing an adhesive component;
a dismantling adhesive surface containing a π-conjugated compound represented by the following formula (1);
A cohesive body comprising

[In the formula, R ¹ represents a group having at least one alkyl group having 3 to 20 carbon atoms, and n represents an integer of 1 to 3. A plurality of R ¹ 's may be the same or different, and a plurality of n's may be the same or different. ] an adhesive layer containing an adhesive component;
a dismantling adhesive layer disposed on the pressure-sensitive adhesive layer and containing a π-conjugated compound represented by the following formula (1);
A cohesive body comprising

[In the formula, R ¹ represents a group having at least one alkyl group having 3 to 20 carbon atoms, and n represents an integer of 1 to 3. A plurality of R ¹ 's may be the same or different, and a plurality of n's may be the same or different. ] 3. The adhesive body according to claim 2, wherein the dismantling adhesive layer is formed on the entire surface of the adhesive layer. The adherent according to any one of claims 1 to 3 , wherein said R ¹ is a group represented by the following formula (2).

[In the formula, R ² represents an alkyl group having 3 to 20 carbon atoms or an alkoxy group having 3 to 20 carbon atoms, and p represents an integer of 1 to 5. When p is 2 or more, multiple R ² may be the same or different. ] The adhesive body according to any one of claims 1 to 4, wherein the π-conjugated compound exhibits a liquid crystal state in at least a part of the temperature range of 35 to 150°C. The adhesive body according to any one of claims 1 to 5 , wherein the adhesive component contains at least one selected from the group consisting of adhesive resins and tackifiers. The adhesive body according to any one of claims 1 to 6 , wherein the adhesive composed of the adhesive component has a storage elastic modulus of 10 ³ Pa to 10 ⁷ Pa. A method for producing a bonded body in which the adherent and the adherend according to any one of claims 1 to 7 are bonded,
A method for producing a joined body, comprising a joining step of pressing the sticky body against the adherend to join the sticky body and the adherend. 9. Manufacture of the bonded body according to claim 8 , wherein the bonding step is a step of pressing the adhesive body against the adherend under a temperature range in which the π-conjugated compound exhibits a liquid crystal state or a temperature exceeding the temperature range. Method. The joined body according to claim 8 , further comprising a heating step of heating the bonding surface between the adherent and the adherend to a temperature range in which the π-conjugated compound exhibits a liquid crystal state or a temperature exceeding the temperature range. Production method. A method for peeling the cohesive body from the joined body in which the cohesive body and the adherend according to any one of claims 1 to 7 are joined,
A method for removing an adhesive, comprising the step of irradiating at least part of the joint surface between the adhesive and the adherend with light under a temperature range in which the π-conjugated compound exhibits a liquid crystal state.

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