JPWO2020001982A5

JPWO2020001982A5 -

Info

Publication number: JPWO2020001982A5
Application number: JP2020571768A
Authority: JP
Publication date: 2022-06-07

Description

一実施形態によれば、ステップｄ）におけるキャリアプレートを切断するステップは、レーザービームによって行われる。このプロセスにおいて、これは、キャリアプレートを構築するための精密で効率的な方法を可能にし、この技術では、１つの作業ステップにおいて簡潔なシーケンスで複数の切り込みの切断を実施することも可能になる。横断方向の切り込み、第１の長手方向の切り込み、および第２の長手方向の切り込みは、一般的に、ステップｄ）におけるキャリアプレートの切断のために、任意の所望の順序で実施され得る。横断方向の切り込み、第１の長手方向の切り込み、および第２の長手方向の切り込みの規則的な配置は、この点に関して、抵抗器材料のストリップの規則的なパターン、および、導電性材料のゾーンの規則的なパターンに追従または対応している。
According to one embodiment, the step of cutting the carrier plate in step d) is performed by a laser beam. In this process, this enables a precise and efficient method for constructing carrier plates, and the technique also allows the cutting of multiple cuts in a concise sequence in one working step. .. The transverse cut, the first longitudinal cut, and the second longitudinal cut can generally be made in any desired order for cutting the carrier plate in step d). The regular arrangement of the transverse cuts, the first longitudinal cuts, and the second longitudinal cuts in this regard is the regular pattern of strips of resistor material, and the zones of conductive material. Follows or corresponds to the regular pattern of.

一実施形態によれば、抵抗器材料のそれぞれのストリップの電気抵抗は、第１の長手方向の切り込みおよび第２の長手方向の切り込みによってキャリアプレートを切断するステップの前に（特に、ステップｄ）の前に）測定され、接触プローブは、抵抗器材料のそれぞれのストリップの第１の端部と重なる導電性材料のゾーンに適用され、また、抵抗器材料のそれぞれのストリップの第２の端部と重なる導電性材料のゾーンに適用される。測定値は、抵抗値が所定の公称範囲内にあるかどうか、または、それからの偏差が見出され得るかどうかについて、品質コントロールの一部としてチェックされ得る。接触プローブは、特に、ケルビンプローブであることが可能であり、ケルビンプローブは、ケルビン方法によって抵抗器材料のそれぞれのゾーンの電気抵抗を測定する。キャリアプレートの切断の前の電気抵抗の測定は、導電性材料のそれぞれのストリップの全表面が接触プローブの適用のために利用可能となるという利点をもたらし、これは、接触プローブの位置決めを実質的に容易にし、または、抵抗器ユニットの小さいサイズに起因して、および、接触プローブと導電性材料のそれぞれのゾーンとの間の小さいサイズ関係に起因して、接触プローブの位置決めを可能にする。
According to one embodiment, the electrical resistance of each strip of resistor material is prior to the step of cutting the carrier plate with a first longitudinal cut and a second longitudinal cut (particularly step d). Measured (before), the contact probe is applied to the zone of conductive material that overlaps the first end of each strip of resistor material, and also the second end of each strip of resistor material. Applies to zones of conductive material that overlap the section. The measured value may be checked as part of quality control as to whether the resistance value is within a given nominal range or if deviations from it can be found. The contact probe can be, in particular, a Kelvin probe, which measures the electrical resistance of each zone of the resistor material by the Kelvin method. The measurement of electrical resistance prior to cutting the carrier plate has the advantage that the entire surface of each strip of conductive material is available for application of the contact probe, which effectively positions the contact probe. It facilitates or allows positioning of the contact probe due to the small size of the resistor unit and due to the small size relationship between the contact probe and each zone of the conductive material.

Claims

A method of manufacturing a plurality of resistor units (44), wherein each of the plurality of resistor units (44) includes a carrier ( 48 ) having a group of resistor elements (50), and the resistor element (44). The ends of 50) are provided with first and second electrical terminals (52, 54), respectively, according to the method.
a) A step of providing a carrier plate (10) having an upper side surface (12) and a lower side surface (14),
b) A step of forming a plurality of strips (16) of a resistor material on the lower side surface (14) of the carrier plate (10) in a regular pattern, wherein the strips (16) are in the transverse direction (Q). ) With a first end (20) and a second end (22), each row (18) of strips (16) of the resistor material in the transverse direction (Q). ) Is formed along the longitudinal direction (L) extending perpendicular to the), so that the plurality of the rows (18) are arranged next to each other in the transverse direction (Q). The steps and
c) A step of forming a plurality of zones (24) of the conductive material on the lower side surface (14) of the carrier plate (10) in a regular pattern, wherein the zones (24) are in the transverse direction (24). Along Q), it has a first end (28), an intermediate region (30), and a second end (32), each row (24) of the conductive material zone (24). 26) is formed along the longitudinal direction (L), and a plurality of the rows (26) are arranged adjacent to each other in the transverse direction (Q). , The row (18) of the strip of resistor material (16) and the row (26) of the zone (24) of the conductive material are arranged alternately in the transverse direction (Q). Except for the boundary region of the carrier plate (10), the strips (16) of the resistor material are at their first end (20), the said of each zone (24) of the conductive material. It overlaps with the first end (28), and at their second end (22), overlaps with the second end (32) of each zone (24) of the conductive material. , Steps and
d) A regular transverse cut (36) along the transverse direction (Q), a first longitudinal cut (38) along the longitudinal direction (L), and the longitudinal direction (L). In the step of cutting the carrier plate (10) by a second longitudinal notch (40) along, the transverse notches (36) are associated with each other and in the longitudinal direction (L). Adjacent to each other are extending between groups (42) of strips (16) of the resistor material, further the first longitudinal notch (38) is the conductive material. The first end (28) is separated from the intermediate region (30) of the row (26) of the zone (24), and the second longitudinal notch (40) is said. The second end (32) is configured to separate the second end (32) from the intermediate region (30) of each row (26) of the zone (24) of the conductive material and the respective resistance of the carrier plate (10). The vessel unit (44) and the respective residual sections (46) are formed alternately along the transverse direction (Q), and the residual sections (46) are zones of the conductive material (46). 24) A method comprising a step and an interstitial intermediate region (30) of column (26).

Each of the resistor units (44) formed by cutting the carrier plate (10) is
-With the section of the carrier plate (10) forming the carrier (48) of the resistor unit (44),
-A group (42) of strips (16) of the resistor material forming the group of resistor elements (50) of the resistor unit (44).
-A plurality of first ends (28) of the conductive material zone (24) forming the first electrical terminal (52) of the resistor element (50).
1. The first aspect of the present invention, which has a plurality of second ends (32) of a zone (24) of the conductive material forming the second electrical terminal (54) of the resistor element ( 50 ). the method of.

The mutual spacing of the transverse cuts (36) and the mutual spacing of the first longitudinal cuts and the second longitudinal cuts (38, 40) are the respective resistor units formed. (44) is selected to have a width of less than 0.6 mm and a length of less than 0.8 mm, the width can be in particular in the range of 0.3 mm to 0.34 mm, and the length is The method of claim 1 or claim 2, in particular, which can range from 0.54 mm to 0.62 mm.

The method of any one of claims 1 to 3, wherein the group (42) of strips (16) of the resistor material comprises two strips (16) of the resistor material.

The method of any one of claims 1 to 4, wherein the strips (16) of the resistor material of the formed resistor unit (44) are of equal size.

The strips (16) of the resistor material of the formed resistor unit (44) are of different sizes, particularly with the first end (20) and the second end (22). The method of any one of claims 1 to 4, wherein the resistor material has different widths in the transverse direction with respect to the extension of the strip (16) of the resistor material.

The method according to any one of claims 1 to 6, wherein the carrier plate (10) includes a ceramic substrate.

The method according to any one of claims 1 to 7, wherein the resistor material and the conductive material are applied only to the lower side surface (14) of the carrier plate (10).

Step b) of forming the plurality of strips (16) of the resistor material is
A step of applying a metal layer to the lower side surface (14) of the carrier plate (10) by cathode spraying.
The method of any one of claims 1-8, comprising local removal of the metal layer by evaporation.

Step c) of forming the plurality of zones (24) of the conductive material is
The method according to any one of claims 1 to 9, comprising printing the lower side surface (14) of the carrier plate (10) using a conductive paste.

The method according to any one of claims 1 to 10, wherein the step of cutting the carrier plate (10) in step d) is performed by a laser beam.

The electrical resistance of each strip (16) of the resistor material cuts the carrier plate (10) by the first longitudinal cut and the second longitudinal cut (38, 40). Measured prior to, the contact probe (34) is the zone (24) of the conductive material that overlaps the first end (20) of each of the strips (16) of the resistor material, and said. 13. The aspect of any one of claims 1 to 11 applied to the zone (24) of the conductive material that overlaps the second end (22) of each strip (16) of the resistor material. the method of.

A resistor unit (44) manufactured according to the method according to any one of claims 1 to 12, wherein the resistor unit (44) is a carrier (48) and a carrier (48). A group of resistor elements (50) arranged on the lower surface, a first electrical terminal (52) connected to the first end of each of the resistor elements (50), and the resistance. Includes a second electrical terminal (54) connected to each second end of the instrument element (50).
The resistor unit (44) has a width of less than 0.6 mm and a length of less than 0.8 mm, the width being particularly in the range of 0.3 mm to 0.34 mm, said length. Is, in particular, a resistor unit (44) in the range of 0.54 mm to 0.62 mm.