EP3797432B1 - Method for producing a plurality of resistance on a ceramic substrate - Google Patents
Method for producing a plurality of resistance on a ceramic substrate Download PDFInfo
- Publication number
- EP3797432B1 EP3797432B1 EP19730343.1A EP19730343A EP3797432B1 EP 3797432 B1 EP3797432 B1 EP 3797432B1 EP 19730343 A EP19730343 A EP 19730343A EP 3797432 B1 EP3797432 B1 EP 3797432B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- resistor
- electrically conductive
- strips
- conductive material
- carrier plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 239000000919 ceramic Substances 0.000 title claims description 5
- 239000000758 substrate Substances 0.000 title claims description 5
- 239000000463 material Substances 0.000 claims description 113
- 239000004020 conductor Substances 0.000 claims description 84
- 238000000034 method Methods 0.000 claims description 48
- 239000000523 sample Substances 0.000 claims description 17
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 238000000889 atomisation Methods 0.000 claims description 3
- 238000009834 vaporization Methods 0.000 claims 1
- 230000008016 vaporization Effects 0.000 claims 1
- 238000004544 sputter deposition Methods 0.000 description 3
- 229910001252 Pd alloy Inorganic materials 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- ZINJLDJMHCUBIP-UHFFFAOYSA-N ethametsulfuron-methyl Chemical compound CCOC1=NC(NC)=NC(NC(=O)NS(=O)(=O)C=2C(=CC=CC=2)C(=O)OC)=N1 ZINJLDJMHCUBIP-UHFFFAOYSA-N 0.000 description 2
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000011990 functional testing Methods 0.000 description 1
- CLDVQCMGOSGNIW-UHFFFAOYSA-N nickel tin Chemical compound [Ni].[Sn] CLDVQCMGOSGNIW-UHFFFAOYSA-N 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/006—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistor chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/01—Mounting; Supporting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
- H01C17/24—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material
- H01C17/242—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material by laser
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
- H01C17/281—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals by thick film techniques
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/001—Mass resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/003—Thick film resistors
Definitions
- the present invention relates to a method for producing a multiplicity of resistor modules, each of which comprises a carrier with a group of resistor elements, at the ends of which a respective first and second electrical connection is provided.
- document US2014055228A1 describes a method for producing a plurality of resistor modules, each comprising a carrier with a group of resistor elements, at the ends of which a respective first and second electrical connection is provided.
- Processes of this type are used to produce resistor modules that are used in electrical components and / or electrical devices and can be conductively connected to the circuits of the components or devices by means of the electrical connections.
- the resistor modules can have at least two resistor elements which are formed on one side of a carrier in strips arranged parallel to one another.
- the strips of the resistor elements can be twice as wide as they are long, which usually results in a roughly square shape for the resistor modules.
- the resistance material and the electrically conductive material are applied to the carrier plate in a regular manner in strips or zones, the applied resistance material and the applied electrically conductive material overlapping in certain areas. These overlapping areas serve as electrical connections of the resistor modules, by means of which the resistor modules can be conductively connected to the electrical component or device.
- the transverse direction and the longitudinal direction define two reference directions running perpendicular to one another and do not necessarily designate a longitudinal shape of the carrier plate, the strips of the resistor material, or the resistor module.
- the size of the electrical connections of the resistance elements formed can be determined in a simple manner and in particular minimized independently of the (not arbitrarily reduced) size of the zones of the electrically conductive material.
- the intermediate regions of the zones of the electrically conductive material allow the electrical resistance to be tested prior to the separation according to an advantageous embodiment which will be explained below.
- the rows of strips of the resistance material and the rows of zones of the electrically conductive material are arranged alternately next to one another in the transverse direction, but not necessarily in the same number.
- a respective row of zones of the electrically conductive material can be arranged between two rows of strips of the resistance material, the number of rows of strips of the resistance material corresponding in particular to the number of rows of zones of the electrically conductive material can.
- two respective rows of zones of the electrically conductive material are arranged between two rows of strips of the resistance material, the number of rows of zones of the electrically conductive material in particular being twice as large how the number of rows of strips of the resistor material can be.
- only one of the two ends of a respective zone of the electrically conductive material ultimately overlaps a strip of the resistance material, while the other end of the respective zone is cut off in step d) and thus does not serve to contact a strip of the resistance material.
- resistor modules of the most varied of sizes can be produced.
- the method does not impose any restrictions on the dimensions of the resistor modules.
- the method can be used to produce resistor modules that are characterized by small dimensions and can also be used in components or devices that require a particularly compact design of the resistor modules, such as mobile phones, smartphones, smartwatches, hearing aids or similar devices.
- the respective resistor assembly formed by severing the carrier plate comprises a portion of the carrier plate that forms the carrier of the resistor assembly, a group of strips of the resistor material that form the group of resistance elements of the resistor assembly, a number of first ends of zones of the electrical conductive material which form the first electrical connections of the resistance elements, and a number of second ends of zones of the electrically conductive material which form the second electrical connections of the resistance elements.
- each resistance element is electrically conductively connected in the transverse direction by overlapping its two ends with a respective end of a zone of the electrically conductive material, which serve as the respective electrical connection for connection to the electrical component or device.
- the mutual distances between the transverse directional cuts and the mutual distances between the first and second longitudinal directional cuts are preferably selected such that the resistor module formed, in particular a resistor module with two resistor elements, has a width of less than 0.6 mm and a length of less than 0.8 mm, wherein the width is in particular in a range from 0.3 mm to 0.34 mm and the length is in particular in a range from 0.54 mm to 0.62 mm and the width is preferably approximately 0.32 mm and the length is preferably 0.58 mm.
- These small dimensions are outside the range of the resistor modules that can be produced by previous methods. In other words, resistor modules in these dimensions can be produced exclusively by the method according to the invention.
- the group of strips of the resistive material comprises two strips of the resistive material.
- the resistor module accordingly comprises two resistor elements.
- Each of the resistance elements can be separately connected to an electrical component or device or to an electrical circuit by means of the first and second ends of two zones of the electrically conductive material or the electrical connections formed thereby.
- the strips of the resistor material of the respective resistor module formed are of the same size.
- the strips of the resistance material have the same widths, the same lengths and the same thicknesses.
- a resistor module is thus formed, the resistor elements of which have the same resistance values.
- the strips of the resistance material of the resistance module formed are of different sizes, in particular with different widths transversely to the direction of extension of the strips of the resistance material between the first end and the second end. Accordingly, the resistance values of the resistance elements of the respective resistance module formed can be of different sizes.
- the arrangement of the resistance elements adjoining one another in the form of strips allows different geometries of the resistance elements with correspondingly different resistance values to be achieved in a simple manner. For this purpose, it is sufficient to change the length of the strips of the resistance material in the process and, in accordance with this, also to change the arrangement and the spacing of adjacent zones of the electrically conductive material.
- the carrier plate preferably comprises a ceramic substrate which, in particular due to its electrically insulating property, prevents electrical contact between the resistance material and the electrically conductive material outside the zones of the electrically conductive material.
- Such carrier plates are easy to manufacture and can be manufactured inexpensively and in large numbers.
- the ceramic substrate enables simple and problem-free severing of the carrier plate in step d).
- the resistance material and the electrically conductive material are only applied to the underside of the carrier plate.
- the upper side of the carrier of the resistance module formed is free of resistance elements and / or electrical connections.
- the resistor module is thus designed for assembly and contacting in a flip-chip design.
- the advantage of this construction is that the resistor module can be connected directly with the electrical connections downwards to the electrical circuit of the device or component and / or can be inserted into it, whereby the attachment of further connecting wires to the resistor module or to the circuit can be dispensed with .
- step b) of forming the plurality of strips of the resistance material comprises applying a metal layer to the underside of the carrier plate by cathode sputtering and locally removing the metal layer by evaporation.
- cathode atomization the so-called “sputtering” layers of the resistance material can be applied to the carrier plate in a small thickness, which are characterized by great uniformity and good reproducibility. This enables the production of a large number of resistance elements, the resistance values of which are all in a predetermined, narrow range.
- the resistance material in the form of a plurality of strips on the carrier plate, can be ablated or evaporated outside the predetermined areas of the strips, for example by a laser.
- the resistor material can be limited precisely and with great positional accuracy to the areas of the strips.
- a mask can be applied to the underside of the carrier plate, which mask has a large number of clearances corresponding to the strips.
- the resistor material can be vapor-deposited onto the underside of the carrier plate.
- the resistor material only comes into contact with the carrier plate at the locations of the clearances, as a result of which After the mask has been removed, a plurality of strips of the resistance material is formed on the carrier plate.
- other methods are also conceivable for forming the strips of the resistor material.
- step c) of forming the plurality of zones of the electrically conductive material comprises printing the underside of the carrier plate with an electrically conductive paste, in particular with a silver-palladium alloy.
- an electrically conductive paste in particular with a silver-palladium alloy.
- a printing plate can be used on which the electrically conductive paste is applied in a regular pattern, the pattern corresponding to the arrangement of the zones.
- the pattern of the electrically conductive paste applied to the printing plate is matched to the arrangement of the strips of the resistance material.
- electroplating in particular nickel-tin electroplating, of the zones can also take place.
- step b) of forming the plurality of strips of the resistance material and step c) of forming the plurality of zones of the electrically conductive material can also be carried out in reverse order or partially simultaneously.
- the overlapping of the strips of the resistance material with the zones of the electrically conductive material can take place in such a way that the respective strip of the resistance material partially covers the respective zones of the electrically conductive material, or in such a way that the respective zones of the electrically conductive material the respective strip of the resistance material partially cover.
- the carrier plate is severed in step d) by means of a laser beam.
- This allows a precise and efficient method of structuring the carrier plate, whereby with this technique it is also possible to carry out several severing cuts in quick succession in one work step.
- the transverse directional cuts, the first longitudinal directional cuts and the second longitudinal directional cuts can be carried out in any order for severing the carrier plate in step d).
- the regular arrangement of the transverse directional cuts, the first longitudinal directional cuts and the second longitudinal directional cuts follows or corresponds to the regular pattern of the strips of the resistance material and the regular pattern of the zones of the electrically conductive material.
- the electrical resistance of a respective strip of the resistance material is measured prior to the severing of the carrier plate by the first and second longitudinal cuts, in particular before step d), with contact probes on that zone of the electrically conductive material which is connected to the first end of the respective Strip of the resistance material overlaps, and are applied to that zone of the electrically conductive material which overlaps with the second end of the respective strip of the resistance material.
- the measured values can be checked as part of a quality control to determine whether the resistance values are in a specified nominal range or whether deviations from them can be determined.
- the contact probes can be Kelvin probes which measure the electrical resistance of the respective zone of the resistance material by means of the Kelvin method.
- Measuring the electrical resistance before cutting through the carrier plate has the advantage that the entire area of a respective zone of the electrically conductive material is available for attaching a contact probe, which is due to the small size of the resistor unit and the small size ratio between the contact probe and the respective zone of the electrically conductive material makes positioning of the contact probe considerably easier or possible in the first place.
- a second aspect of the invention relates to a resistor assembly that has been produced according to a method according to the invention, with a carrier, a group of resistance elements arranged on the underside of the carrier, first electrical connections which are connected to a respective first end of the resistance elements, and second electrical connections which are connected to a respective second end of the resistor elements, the resistor module having a width of less than 0.6 mm and a length of less than 0.8 mm, the width in particular in a range from 0.3 mm to 0 , 34 mm and the length is in particular in a range from 0.54 mm to 0.62 mm.
- the resistor module is designed for assembly and contacting in a flip-chip design and, due to its small size, can be used in electrical components or devices that require a particularly compact design of the resistor modules, such as mobile phones, smartphones, smartwatches, hearing aids or similar devices.
- Fig. 1 shows a section of a carrier plate 10 according to step a) of an embodiment of a method according to the invention for producing a plurality of resistor modules.
- the carrier plate 10 can be formed from a ceramic substrate which forms an electrically insulating carrier device for receiving a resistor material and an electrically conductive material.
- Arrows and the letters "Q", "L” denote a transverse direction Q and a longitudinal direction L orthogonal thereto.
- the transverse direction Q and the longitudinal direction L define two mutually perpendicular reference directions and do not necessarily denote a longitudinal shape of the carrier plate 10 or the resistor modules formed .
- the carrier plate 10 comprises an upper side 12 and an underside 14, which in FIG Fig. 1 is shown in plan view.
- step b) of the method according to the invention which is described in Fig. 2 is shown, a plurality of strips 16 of a resistor material is applied to the underside 14 of the carrier plate 10 in a regular pattern.
- the strips 16 are arranged in rows 18 which extend in the longitudinal direction L and are arranged next to one another with respect to the transverse direction Q.
- Fig. 2 shows a section of the carrier plate 10 in which, for example, sixteen strips 16 are arranged in four parallel rows 18.
- the arrangement of the strips 16 can be continued in both the mutually orthogonal directions Q and L in accordance with the pattern shown.
- the strips 16 have a first end 20 and a second end 22 along the transverse direction Q.
- the resistor material can be applied, for example, by cathode atomization, a so-called "sputtering" method.
- This technique has the advantage that the resistor material is removed can be applied in a layer of uniform thickness to the underside 14 of the carrier plate 10 and layers of small thickness can also be produced.
- other methods of applying the resistance material to the carrier plate 10 are also conceivable.
- the resistance material can be applied to the carrier plate, for example, in continuous areas extending parallel along the longitudinal direction L.
- a laser can be used which removes or vaporizes resistance material at predetermined intervals along the longitudinal direction L.
- a precise and positionally accurate arrangement of the strips 16 can be achieved by means of this method.
- the underside 14 of the carrier plate 10 can be covered, for example, by a mask (not shown) before the application of the resistance material, which mask has clearances at the location of the strips 16 and can be made of plastic, for example.
- the strips 16 of the resistor material are of equal size to one another, ie the strips 16 of the resistor material have the same widths and lengths and the same thicknesses. Accordingly, the strips 16 of the resistance material have the same electrical resistance values. In other embodiments, the strips can be of different sizes to provide strips 16 of resistive material with different electrical To generate resistance values. This can be achieved in a simple manner by varying the length of the strips along the longitudinal direction L.
- Fig. 3 shows step c) of the method according to the invention, in which a plurality of zones 24 of an electrically conductive material is formed on the underside 14 of the carrier plate 10.
- the zones 24 of the electrically conductive material are applied in a regular pattern to the carrier plate 10, the zones 24 of the electrically conductive material being arranged in a plurality of rows 26 which extend in the longitudinal direction L and are arranged next to one another with respect to the transverse direction Q.
- the rows 26 of the zones 24 of the electrically conductive material run parallel to the rows 18 of the strips 16 of the resistance material and alternate with them in the transverse direction Q, so that the number of rows 26 of the zones 24 of the electrically conductive material is essentially the Number of rows 18 of strips 16 of the resistor material corresponds.
- the zones 24 of the electrically conductive material each have a first end 28, an intermediate region 30 and a second end 32 along the transverse direction Q, wherein, except at the edge regions of the carrier plate 10, the strips 16 of the resistance material at their first ends 20 with the overlap first end 28 of a respective zone 24 of the electrically conductive material and overlap at their second ends 22 with the second end 32 of a respective zone 24 of the electrically conductive material.
- the regular pattern of the zones 24 is matched to the regular pattern of the strips 16 in such a way that on each strip 16 there is an overlap area with a respective zone 24 at its first end 20 and an overlap area with a respective zone 24 at its second end 22 is formed.
- the zones 24 of the electrically conductive material can for example consist of a silver-palladium alloy.
- the zones 24 can be attached in Form of a paste, in particular by printing the underside 14 of the carrier plate 10, are formed.
- the electrically conductive paste is applied to a printing plate (not shown) in a regular pattern corresponding to a predetermined arrangement of the zones 24. Using this technique, a large number of zones 24 of the electrically conductive material can be produced efficiently in one printing process.
- the illustrated step c) of forming the plurality of zones 24 of the electrically conductive material can also be carried out in reverse order or partially simultaneously.
- the overlapping of the strips 16 of the resistance material with the zones 24 of the electrically conductive material can either take place in such a way that the respective strip 16 of the resistance material partially covers the respective zones 24 of the electrically conductive material, or in such a way that the respective zones 24 of the electrically conductive material Material partially cover the respective strip 16 of the resistance material.
- Fig. 4 an optional step to check the functionality and / or to characterize the resistance modules formed is shown.
- contact probes 34 in particular Kelvin probes, are brought into contact with the zones 24 of the electrically conductive material which are assigned to a respective strip 16 of the resistance material.
- Fig. 4 only the contact points of the contact probes 34 are illustrated.
- the contact probes 34 are at that zone 24 of the electrically conductive material which overlaps with the first end 20 of the respective strip 16 of the resistance material, and at that zone 24 of the electrically conductive material which overlaps with the second end 22 of the respective strip 16 of the resistance material , created.
- the contact probes 36 are designed for this purpose, for example to measure the electrical resistance of a respective strip 16 of the resistance material and thus the electrical resistance of the respective resistance element to be formed by means of the Kelvin method. The measured values can then be used to determine whether the resistance values are in a predetermined range or whether there are any deviations.
- step d By performing the functional test after step c) of the method and before cutting through the carrier plate 10 according to step d), the attachment of the contact probes 34 to the respective zones 24 is facilitated, since at this point in time of the method the area of the intermediate areas 30 of the zones 24 is available for this.
- at least one pair of contact probes 34 is required (one contact probe 34 each on both sides of the respective strip 16), and several pairs of contact probes 34 can also be used to test several strips 16 at the same time.
- Fig. 5 shows step d) of the method according to the invention, in which a plurality of resistor modules 44 are separated from the carrier plate 10 occupied by rows 18 of strips 16 of the resistance material and rows 26 of zones 24 of the electrically conductive material by means of a sequence of cuts.
- the sequence of cuts includes transverse directional cuts 36 along the transverse direction Q, first longitudinal directional cuts 38 along the longitudinal direction L and second longitudinal directional cuts 40 along the longitudinal direction L.
- the regular arrangement of the transverse directional cuts 36, the first longitudinal directional cuts 38 and the second longitudinal directional cuts 40 corresponds to the regular pattern of the strips 16 of the resistance material and the regular pattern of the zones 24 of the electrically conductive material.
- the cross-directional cuts 36 run between groups 42 of strips 16 of the resistance material that are assigned to one another and are adjacent to one another in the longitudinal direction L.
- the groups 42 each comprise two strips 16.
- the groups 42 can, however, also comprise more or only one strip 16.
- the number of strips 16 of the resistor material of the resistor modules 44 can be changed by simply adapting the cutting distances.
- the first longitudinal cuts 38 separate the first ends 28 from the intermediate regions 30 of a respective row 26 of zones 24 of the electrically conductive material.
- the second longitudinal cuts 40 separate the second ends 32 from the intermediate regions 30 of a respective row 26 of zones 24 of the electrically conductive material.
- the transverse directional cuts 36, the first longitudinal directional cuts 38 and the second longitudinal directional cuts 40 are generally made in any order.
- the severing of the carrier plate 10 can be carried out, for example, by means of a laser beam, which allows precise and efficient structuring of the carrier plate 10 in one operation.
- the strips 16 of the resistance material can generally have a longitudinal shape (in particular essentially rectangular), wherein the respective longitudinal axis of the strips 16 of the resistance material can be aligned along the longitudinal direction L or along the transverse direction Q.
- the strips 16 of the resistance material can also have an essentially square shape, for example.
- Fig. 6 shows in a bottom view, by way of example, a resistor module 44 of the plurality of resistor modules which were produced by steps a) to d) of the method explained.
- Each resistor assembly 44 accordingly comprises a portion of the carrier plate 10 which forms the carrier 48 of the resistor assembly 44, a group 42 of strips 16 of the resistor material which form a group of resistor elements 50 of the resistor assembly 44, a number of first ends 28 of zones 24 of the electrically conductive material, which form first electrical connections 52 of the resistance elements 50, and a number of second ends 32 of zones 24 of the electrically conductive material, which form second electrical connections 54 of the resistance elements 50.
- the first electrical connections 52 are connected to a respective first end of the resistance elements 50 and the second electrical connections 54 are connected to a respective second end of the resistance elements 50. Due to the arrangement of the resistor elements 50 on the underside of the carrier 48, the resistor module 44 is particularly suitable for mounting and contacting in a flip-chip design.
- the mutual distances between the transverse directional cuts 36 and the mutual distances between the first and second longitudinal directional cuts 38, 40 are selected such that the resistor assembly 44 has a width of less than 0.6 mm and a length of less than 0.8 mm, the width can in particular be in a range from 0.3 mm to 0.34 mm and the length can in particular be in a range from 0.54 mm to 0.62 mm. Due to its small size, which can be achieved by the method according to the invention, the resistor module 44 can be used in electrical components or devices which require a particularly small and compact design of the resistor modules.
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Description
Die vorliegende Erfindung betrifft ein Verfahren zur Herstellung einer Vielzahl von Widerstandsbaueinheiten, die jeweils einen Träger mit einer Gruppe von Widerstandselementen umfassen, an deren Enden ein jeweiliger erster und zweiter elektrischer Anschluss vorgesehen ist. Dokument
Derartige Verfahren dienen der Herstellung von Widerstandsbaueinheiten, die in elektrischen Bauteilen und/oder elektrischen Geräten eingesetzt und mittels der elektrischen Anschlüsse mit den Schaltkreisen der Bauteile oder Geräte leitend verbunden werden können. Die Widerstandsbaueinheiten können zumindest zwei Widerstandselemente aufweisen, die auf einer Seite eines Trägers in parallel zueinander angeordneten Streifen ausgebildet sind. Beispielsweise können die Streifen der Widerstandselemente doppelt so breit wie lang sein, wodurch sich für die Widerstandsbaueinheiten zumeist eine ansatzweise quadratische Form ergibt. Für den Einsatz in immer kleineren Bauteilen oder Geräten kann es erforderlich sein, auch die Größe der Widerstandbaueinheiten entsprechend zu verkleinern. Mit den bekannten Verfahren gelingt es bisher jedoch nicht, Widerstandsbaueinheiten herzustellen, deren Abmessungen, ausgedrückt in Länge mal Breite, 0,8 mm x 0,6 mm unterschreiten.Processes of this type are used to produce resistor modules that are used in electrical components and / or electrical devices and can be conductively connected to the circuits of the components or devices by means of the electrical connections. The resistor modules can have at least two resistor elements which are formed on one side of a carrier in strips arranged parallel to one another. For example, the strips of the resistor elements can be twice as wide as they are long, which usually results in a roughly square shape for the resistor modules. For use in ever smaller components or devices, it may be necessary to reduce the size of the resistor modules accordingly. With the known methods, however, it has so far not been possible to produce resistor modules whose dimensions, expressed in length times width, are less than 0.8 mm × 0.6 mm.
Es ist daher Aufgabe der Erfindung, ein Verfahren zu schaffen, mittels dessen sich kostengünstig, zuverlässig und effizient eine Vielzahl von verkleinerten Widerstandsbaueinheiten herstellen lässt.It is therefore the object of the invention to create a method by means of which a large number of scaled-down resistor modules can be produced in a cost-effective, reliable and efficient manner.
Die Aufgabe wird durch ein Verfahren gemäß Anspruch 1 gelöst, insbesondere umfassend die Schritte:
- a) Bereitstellen einer Trägerplatte, die eine Oberseite und eine Unterseite aufweist;
- b) Ausbilden einer Vielzahl von Streifen eines Widerstandsmaterials an der Unterseite der Trägerplatte, die entlang einer Querrichtung ein erstes Ende und ein zweites Ende aufweisen, in einem regelmäßigen Muster dergestalt, dass entlang einer Längsrichtung, die senkrecht zu der Querrichtung verläuft, eine jeweilige Reihe von Streifen des Widerstandsmaterials gebildet ist und dass mehrere derartiger Reihen in Querrichtung nebeneinander angeordnet sind;
- c) Ausbilden einer Vielzahl von Zonen eines elektrisch leitenden Materials an der Unterseite der Trägerplatte, die entlang der Querrichtung ein erstes Ende, einen Zwischenbereich und ein zweites Ende aufweisen, in einem regelmäßigen Muster dergestalt, dass entlang der Längsrichtung eine jeweilige Reihe von Zonen des elektrisch leitenden Materials gebildet ist und dass mehrere derartiger Reihen in Querrichtung nebeneinander angeordnet sind, wobei die Reihen von Streifen des Widerstandsmaterials und die Reihen von Zonen des elektrisch leitenden Materials in Querrichtung abwechselnd angeordnet sind, und wobei, mit Ausnahme von Randbereichen der Trägerplatte, die Streifen des Widerstandsmaterials an ihren ersten Enden mit dem ersten Ende einer jeweiligen Zone des elektrisch leitenden Materials überlappen und an ihren zweiten Enden mit dem zweiten Ende einer jeweiligen Zone des elektrisch leitenden Materials überlappen;
- d) Durchtrennen der Trägerplatte durch regelmäßige Querrichtungsschnitte entlang der Querrichtung, erste Längsrichtungsschnitte entlang der Längsrichtung und zweite Längsrichtungsschnitte entlang der Längsrichtung dergestalt, dass die Querrichtungsschnitte zwischen Gruppen von einander zugeordneten, in Längsrichtung zueinander benachbarten Streifen des Widerstandsmaterials verlaufen, dass ferner die ersten Längsrichtungsschnitte die ersten Enden von den Zwischenbereichen einer jeweiligen Reihe von Zonen des elektrisch leitenden Materials abtrennen, und dass die zweiten Längsrichtungsschnitte die zweiten Enden von den Zwischenbereichen einer jeweiligen Reihe von Zonen des elektrisch leitenden Materials (insbesondere der vorgenannten Reihe oder einer anderen Reihe) abtrennen, so dass entlang der Querrichtung abwechselnd eine jeweilige Widerstandsbaueinheit und ein jeweiliger Restabschnitt der Trägerplatte gebildet ist, der abgetrennte Zwischenbereiche einer Reihe von Zonen des elektrisch leitenden Materials aufweist.
- a) providing a carrier plate which has an upper side and a lower side;
- b) Forming a plurality of strips of a resistor material on the underside of the carrier plate, which strips have a first end and a second end along a transverse direction, in a regular pattern such that a respective row of Strips of the resistance material is formed and that a plurality of such rows are arranged in the transverse direction next to one another;
- c) Forming a plurality of zones of an electrically conductive material on the underside of the carrier plate, which have a first end, an intermediate region and a second end along the transverse direction, in a regular pattern such that a respective series of zones of the electrically conductive material is formed and that several such rows are arranged in the transverse direction next to one another, the rows of strips of the resistance material and the rows of zones of the electrically conductive material are arranged alternately in the transverse direction, and wherein, with the exception of edge regions of the carrier plate, the strips of Resistive material overlap at their first ends with the first end of a respective zone of the electrically conductive material and at their second ends overlap with the second end of a respective zone of the electrically conductive material;
- d) severing the carrier plate by regular transverse cuts along the transverse direction, first longitudinal cuts along the longitudinal direction and second longitudinal cuts along the longitudinal direction in such a way that the transverse cuts are between Groups of mutually associated, longitudinally adjacent strips of the resistance material run, furthermore that the first longitudinal-direction cuts separate the first ends from the intermediate regions of a respective row of zones of the electrically conductive material, and that the second longitudinal-direction cuts the second ends from the intermediate regions of a respective row separate from zones of the electrically conductive material (in particular the aforementioned row or another row) so that a respective resistor module and a respective residual section of the carrier plate is formed alternately along the transverse direction, which has separated intermediate areas of a series of zones of the electrically conductive material.
Bei dem erfindungsgemäßen Verfahren werden somit das Widerstandsmaterial und das elektrisch leitende Material in jeweils regelmäßiger Weise in Streifen bzw. Zonen auf die Trägerplatte aufgebracht, wobei das aufgebrachte Widerstandsmaterial und das aufgebrachte elektrisch leitende Material sich an bestimmten Bereichen überlappen. Diese Überlappungsbereiche dienen als elektrischer Anschlüsse der Widerstandsbaueinheiten, mittels derer die Widerstandsbaueinheiten leitend mit dem elektrischen Bauteil oder Gerät verbunden werden können.In the method according to the invention, the resistance material and the electrically conductive material are applied to the carrier plate in a regular manner in strips or zones, the applied resistance material and the applied electrically conductive material overlapping in certain areas. These overlapping areas serve as electrical connections of the resistor modules, by means of which the resistor modules can be conductively connected to the electrical component or device.
Das Vereinzeln, d.h. die Ausbildung einzelner Widerstandsbaueinheiten erfolgt am Ende des Verfahrens, wobei geeignete Schnitte die Trägerplatte in Längsrichtung und in Querrichtung durchtrennen, und zwar derart, dass sogleich eine Vielzahl von Widerstandsbaueinheiten hergestellt wird. Dabei definieren die Querrichtung und die Längsrichtung zwei senkrecht zueinander verlaufende Bezugsrichtungen, und bezeichnen nicht unbedingt eine Längsform der Trägerplatte, der Streifen des Widerstandsmaterials, oder der Widerstandsbaueinheit.Separation, ie the formation of individual resistor modules, takes place at the end of the process, with suitable cuts severing the carrier plate in the longitudinal direction and in the transverse direction, specifically in such a way that a large number of resistor modules are produced at the same time. The transverse direction and the longitudinal direction define two reference directions running perpendicular to one another and do not necessarily designate a longitudinal shape of the carrier plate, the strips of the resistor material, or the resistor module.
Durch das Abtrennen der Zwischenbereiche der Zonen des elektrisch leitenden Materials werden Restabschnitte der Trägerplatte gebildet, die bei dem Herstellungsverfahren zwar als Ausschuss anfallen. Allerdings kann durch geeignete Wahl der ersten und zweiten Längsrichtungsschnitte die Größe der elektrischen Anschlüsse der gebildeten Widerstandselemente auf einfache Weise festgelegt und insbesondere unabhängig von der (nicht beliebig verkleinerbaren) Größe der Zonen des elektrisch leitenden Materials minimiert werden. Ferner ermöglichen die Zwischenbereiche der Zonen des elektrisch leitenden Materials vor dem Abtrennen gemäß einer nachstehend noch erläuterten vorteilhaften Ausführungsform eine Prüfung des elektrischen Widerstands.By separating the intermediate areas of the zones of the electrically conductive material, residual sections of the carrier plate are formed, which are indeed produced as rejects during the manufacturing process. However, through a suitable choice of the first and second longitudinal cuts, the size of the electrical connections of the resistance elements formed can be determined in a simple manner and in particular minimized independently of the (not arbitrarily reduced) size of the zones of the electrically conductive material. Furthermore, the intermediate regions of the zones of the electrically conductive material allow the electrical resistance to be tested prior to the separation according to an advantageous embodiment which will be explained below.
Gemäß dem erfindungsgemäßen Verfahren sind die Reihen von Streifen des Widerstandsmaterials und die Reihen von Zonen des elektrisch leitenden Materials in Querrichtung abwechselnd nebeneinander, aber nicht unbedingt in gleicher Anzahl angeordnet. Beispielsweise kann, mit Ausnahme von Randbereichen der Trägerplatte, zwischen zwei Reihen von Streifen des Widerstandsmaterials eine jeweilige Reihe von Zonen des elektrisch leitenden Materials angeordnet sein, wobei die Anzahl der Reihen von Streifen des Widerstandsmaterials insbesondere der Anzahl der Reihen von Zonen des elektrisch leitenden Materials entsprechen kann. Alternativ ist es jedoch auch möglich, dass, mit Ausnahme von Randbereichen der Trägerplatte, zwischen zwei Reihen von Streifen des Widerstandsmaterials zwei jeweilige Reihen von Zonen des elektrisch leitenden Materials angeordnet sind, wobei die Anzahl der Reihen von Zonen des elektrisch leitenden Materials insbesondere doppelt so groß wie die Anzahl der Reihen von Streifen des Widerstandsmaterials sein kann. In dem letztgenannten Fall überlappt letztlich nur eines der beiden Enden einer jeweiligen Zone des elektrisch leitenden Materials mit einem Streifen des Widerstandsmaterials, während das andere Ende der jeweiligen Zone in dem Schritt d) abgetrennt wird und somit nicht zur Kontaktierung eines Streifens des Widerstandsmaterials dient.According to the method according to the invention, the rows of strips of the resistance material and the rows of zones of the electrically conductive material are arranged alternately next to one another in the transverse direction, but not necessarily in the same number. For example, with the exception of edge regions of the carrier plate, a respective row of zones of the electrically conductive material can be arranged between two rows of strips of the resistance material, the number of rows of strips of the resistance material corresponding in particular to the number of rows of zones of the electrically conductive material can. Alternatively, however, it is also possible that, with the exception of edge regions of the carrier plate, two respective rows of zones of the electrically conductive material are arranged between two rows of strips of the resistance material, the number of rows of zones of the electrically conductive material in particular being twice as large how the number of rows of strips of the resistor material can be. In the latter case, only one of the two ends of a respective zone of the electrically conductive material ultimately overlaps a strip of the resistance material, while the other end of the respective zone is cut off in step d) and thus does not serve to contact a strip of the resistance material.
Durch eine geeignete Wahl der Länge und Breite und der gegenseitigen Abstände von benachbarten Streifen des Widerstandsmaterials und der gegenseitigen Abstände von benachbarten Zonen des elektrisch leitenden Materials lassen sich Widerstandsbaueinheiten verschiedenster Größen herstellen.By a suitable choice of the length and width and the mutual spacings between adjacent strips of the resistance material and the mutual spacings between adjacent zones of the electrically conductive material, resistor modules of the most varied of sizes can be produced.
Aus dem Verfahren ergeben sich keine Einschränkungen bezüglich der Abmessungen der Widerstandsbaueinheiten. Insbesondere sind mittels des Verfahrens Widerstandsbaueinheiten herstellbar, die sich durch kleine Abmessungen auszeichnen und auch in Bauteilen oder Geräten einsetzbar sind, die eine besonders kompakte Ausbildung der Widerstandsbaueinheiten erfordern, wie beispielsweise Mobiltelefone, Smartphones, Smartwatches, Hörgeräte oder ähnliche Geräte.The method does not impose any restrictions on the dimensions of the resistor modules. In particular, the method can be used to produce resistor modules that are characterized by small dimensions and can also be used in components or devices that require a particularly compact design of the resistor modules, such as mobile phones, smartphones, smartwatches, hearing aids or similar devices.
Bevorzugte Ausführungsformen sind den abhängigen Ansprüchen sowie der Beschreibung zu entnehmen.Preferred embodiments can be found in the dependent claims and the description.
Gemäß einer Ausführungsform umfasst die durch das Durchtrennen der Trägerplatte gebildete jeweilige Widerstandsbaueinheit einen Abschnitt der Trägerplatte, der den Träger der Widerstandsbaueinheit bildet, eine Gruppe von Streifen des Widerstandsmaterials, die die Gruppe von Widerstandselementen der Widerstandsbaueinheit bilden, eine Anzahl von ersten Enden von Zonen des elektrisch leitenden Materials, die die ersten elektrischen Anschlüsse der Widerstandselemente bilden, und eine Anzahl von zweiten Enden von Zonen des elektrisch leitenden Materials, die die zweiten elektrischen Anschlüsse der Widerstandselemente bilden. Somit ist jedes Widerstandselement in der Querrichtung durch Überlappung seiner beiden Enden mit einem jeweiligen Ende einer Zone des elektrisch leitenden Materials elektrisch leitend verbunden, welche als jeweiliger elektrischer Anschluss zur Verbindung mit dem elektrischen Bauteil oder Gerät dienen.According to one embodiment, the respective resistor assembly formed by severing the carrier plate comprises a portion of the carrier plate that forms the carrier of the resistor assembly, a group of strips of the resistor material that form the group of resistance elements of the resistor assembly, a number of first ends of zones of the electrical conductive material which form the first electrical connections of the resistance elements, and a number of second ends of zones of the electrically conductive material which form the second electrical connections of the resistance elements. Thus, each resistance element is electrically conductively connected in the transverse direction by overlapping its two ends with a respective end of a zone of the electrically conductive material, which serve as the respective electrical connection for connection to the electrical component or device.
Bevorzugt sind die gegenseitigen Abstände der Querrichtungsschnitte und die gegenseitigen Abstände der ersten und zweiten Längsrichtungsschnitte derart gewählt, dass die gebildete Widerstandsbaueinheit, insbesondere eine Widerstandsbaueinheit mit zwei Widerstandselementen, eine Breite kleiner als 0,6 mm und eine Länge kleiner als 0,8 mm aufweist, wobei die Breite insbesondere in einem Bereich von 0,3 mm bis 0,34 mm liegt und die Länge insbesondere in einem Bereich von 0,54 mm bis 0,62 mm liegt und wobei die Breite bevorzugt ca. 0,32 mm und die Länge bevorzugt 0,58 mm beträgt. Diese geringen Abmessungen liegen außerhalb des Bereichs der durch bisherige Verfahren herstellbaren Widerstandsbaueinheiten. Mit anderen Worten sind ausschließlich durch das erfindungsgemäße Verfahren Widerstandsbaueinheiten in diesen Dimensionen herstellbar.The mutual distances between the transverse directional cuts and the mutual distances between the first and second longitudinal directional cuts are preferably selected such that the resistor module formed, in particular a resistor module with two resistor elements, has a width of less than 0.6 mm and a length of less than 0.8 mm, wherein the width is in particular in a range from 0.3 mm to 0.34 mm and the length is in particular in a range from 0.54 mm to 0.62 mm and the width is preferably approximately 0.32 mm and the length is preferably 0.58 mm. These small dimensions are outside the range of the resistor modules that can be produced by previous methods. In other words, resistor modules in these dimensions can be produced exclusively by the method according to the invention.
Gemäß einer Ausführungsform umfasst die Gruppe von Streifen des Widerstandsmaterials zwei Streifen des Widerstandsmaterials. Die Widerstandsbaueinheit umfasst dementsprechend zwei Widerstandselemente. Aber auch Ausführungsformen mit mehr als zwei, beispielsweise drei oder vier, Streifen des Widerstandsmaterials sind möglich. Dabei ist jedes der Widerstandselemente mittels der ersten bzw. zweiten Enden von zwei Zonen des elektrisch leitendenden Materials bzw. der hierdurch gebildeten elektrischen Anschlüsse separat mit einem elektrischen Bauteil oder Gerät oder mit einer elektrischen Schaltung verbindbar.According to one embodiment, the group of strips of the resistive material comprises two strips of the resistive material. The resistor module accordingly comprises two resistor elements. However, embodiments with more than two, for example three or four, strips of the resistance material are possible. Each of the resistance elements can be separately connected to an electrical component or device or to an electrical circuit by means of the first and second ends of two zones of the electrically conductive material or the electrical connections formed thereby.
Durch die regelmäßige Anordnung der Streifen des Widerstandsmaterials und der Zonen des elektrisch leitenden Materials, insbesondere durch die reihenförmig aneinander anschließende Anordnung der Widerstandselemente, lassen sich verschiedene Geometrien der Widerstandsbaueinheiten mit zwei oder mehreren Widerstandselementen in einfacher Weise erreichen. Hierzu genügt es, bei dem Herstellungsverfahren die Einteilung der Gruppen einander zugeordneter benachbarter Streifen und, damit einhergehend, die gegenseitigen Abstände der Querrichtungsschnitte zu verändern.Due to the regular arrangement of the strips of the resistance material and the zones of the electrically conductive material, in particular due to the row-like arrangement of the resistance elements, different geometries of the resistance units with two or more resistance elements can be achieved in a simple manner. For this purpose, it is sufficient in the production process to change the division of the groups of adjacent strips assigned to one another and, as a result, to change the mutual spacing of the cross-directional cuts.
Gemäß einer Ausführungsform sind die Streifen des Widerstandsmaterials der gebildeten jeweiligen Widerstandsbaueinheit gleich groß. Mit anderen Worten weisen die Streifen des Widerstandsmaterials gleiche Breiten, gleichen Längen sowie gleiche Dicken auf. Somit wird eine Widerstandsbaueinheit gebildet, deren Widerstands-'elemente gleiche Widerstandswerte aufweisen.According to one embodiment, the strips of the resistor material of the respective resistor module formed are of the same size. In other words, the strips of the resistance material have the same widths, the same lengths and the same thicknesses. A resistor module is thus formed, the resistor elements of which have the same resistance values.
Gemäß einer weiteren Ausführungsform sind die Streifen des Widerstandsmaterials der gebildeten Widerstandsbaueinheit unterschiedlich groß, insbesondere mit unterschiedlicher Breite quer zu der Erstreckungsrichtung der Streifen des Widerstandsmaterials zwischen dem ersten Ende und dem zweiten Ende. Dementsprechend können die Widerstandswerte der Widerstandselemente der gebildeten jeweiligen Widerstandsbaueinheit unterschiedlich groß sein.According to a further embodiment, the strips of the resistance material of the resistance module formed are of different sizes, in particular with different widths transversely to the direction of extension of the strips of the resistance material between the first end and the second end. Accordingly, the resistance values of the resistance elements of the respective resistance module formed can be of different sizes.
Durch die streifenförmig aneinander anschließende Anordnung der Widerstandselemente lassen sich verschiedene Geometrien der Widerstandselemente mit entsprechenden verschiedenen Widerstandswerten in einfacher Weise erzielen. Hierzu genügt es, im Verfahren die Länge der Streifen des Widerstandmaterials zu ändern und, darauf abgestimmt, auch die Anordnung und die Abstände benachbarter Zonen des elektrisch leitenden Materials zu ändern.The arrangement of the resistance elements adjoining one another in the form of strips allows different geometries of the resistance elements with correspondingly different resistance values to be achieved in a simple manner. For this purpose, it is sufficient to change the length of the strips of the resistance material in the process and, in accordance with this, also to change the arrangement and the spacing of adjacent zones of the electrically conductive material.
Bevorzugt umfasst die Trägerplatte ein keramisches Substrat, welche insbesondere durch seine elektrisch isolierende Eigenschaft verhindert, dass außerhalb der Zonen des elektrisch leitenden Materials ein elektrischer Kontakt zwischen dem Widerstandmaterial und dem elektrisch leitenden Material besteht. Derartige Trägerplatten sind einfach in der Herstellung und lassen sich kostengünstig und in großen Stückzahlen herstellen. Im Übrigen ermöglicht das keramische Substrat ein einfaches und problemloses Durchtrennen der Trägerplatte in Schritt d).The carrier plate preferably comprises a ceramic substrate which, in particular due to its electrically insulating property, prevents electrical contact between the resistance material and the electrically conductive material outside the zones of the electrically conductive material. Such carrier plates are easy to manufacture and can be manufactured inexpensively and in large numbers. In addition, the ceramic substrate enables simple and problem-free severing of the carrier plate in step d).
Gemäß einer Ausführungsform werden das Widerstandsmaterial und das elektrisch leitende Material lediglich an der Unterseite der Trägerplatte aufgebracht. Das bedeutet, dass die Oberseite des Trägers der gebildeten Widerstandsbaueinheit frei von Widerstandselementen und/oder elektrischen Anschlüssen ist. Die Widerstandsbaueinheit ist somit für eine Montage und Kontaktierung in einer Flip-Chip Bauweise ausgebildet. Der Vorteil dieser Bauweise liegt darin, dass die Widerstandsbaueinheit direkt mit den elektrischen Anschlüssen nach unten mit dem elektrischen Schaltkreis des Geräts oder Bauteils verbindbar und/oder in diesen einsetzbar ist, wobei auf die Anbringung weiterer Anschlussdrähte an der Widerstandsbaueinheit oder an dem Schaltkreis verzichtet werden kann.According to one embodiment, the resistance material and the electrically conductive material are only applied to the underside of the carrier plate. This means that the upper side of the carrier of the resistance module formed is free of resistance elements and / or electrical connections. The resistor module is thus designed for assembly and contacting in a flip-chip design. The advantage of this construction is that the resistor module can be connected directly with the electrical connections downwards to the electrical circuit of the device or component and / or can be inserted into it, whereby the attachment of further connecting wires to the resistor module or to the circuit can be dispensed with .
Gemäß einer Ausführungsform umfasst der Schritt b) des Ausbildens der Vielzahl von Streifen des Widerstandsmaterials das Aufbringen einer Metallschicht an der Unterseite der Trägerplatte durch Kathodenzerstäubung und ein lokales Abtragen der Metallschicht durch Abdampfen. Durch die Kathodenzerstäubung, das sogenannte "Sputtern", lassen sich Schichten des Widerstandsmaterials in geringer Dicke auf die Trägerplatte aufbringen, die sich durch eine große Gleichmäßigkeit und eine gute Reproduzierbarkeit auszeichnen. Dies ermöglicht die Herstellung einer Vielzahl von Widerstandselementen, deren Widerstandswerte alle in einem vorgegebenen, engen Bereich liegen.According to one embodiment, step b) of forming the plurality of strips of the resistance material comprises applying a metal layer to the underside of the carrier plate by cathode sputtering and locally removing the metal layer by evaporation. By means of cathode atomization, the so-called "sputtering", layers of the resistance material can be applied to the carrier plate in a small thickness, which are characterized by great uniformity and good reproducibility. This enables the production of a large number of resistance elements, the resistance values of which are all in a predetermined, narrow range.
Um das Widerstandsmaterial in Form einer Vielzahl von Streifen auf der Trägerplatte aufzubringen, kann das Widerstandsmaterial außerhalb der vorgegebenen Bereiche der Streifen, beispielweise durch einen Laser, abgetragen bzw. abgedampft werden. Mittels dieser Methode lässt sich das Widerstandsmaterial präzise und mit großer Positionsgenauigkeit auf die Bereiche der Streifen begrenzen.In order to apply the resistance material in the form of a plurality of strips on the carrier plate, the resistance material can be ablated or evaporated outside the predetermined areas of the strips, for example by a laser. Using this method, the resistor material can be limited precisely and with great positional accuracy to the areas of the strips.
Alternativ kann eine Maske an die Unterseite der Trägerplatte angelegt werden, welche eine Vielzahl von, den Streifen entsprechenden Freistellungen aufweist. Nach Anlegen der Maske kann das Widerstandsmaterial auf die Unterseite der Trägerplatte aufgedampft werden. Durch die Maske kommt das Widerstandsmaterial nur an den Stellen der Freistellungen mit der Trägerplatte in Kontakt, wodurch sich nach dem Entfernen der Maske auf der Trägerplatte eine Vielzahl von Streifen des Widerstandsmaterials ausbildet. Neben dem großflächigen Aufbringen und lokalen Abtragen des Widerstandmaterials oder dem Anbringen einer Maske sind jedoch auch andere Methoden denkbar, um die Streifen des Widerstandmaterials auszubilden.Alternatively, a mask can be applied to the underside of the carrier plate, which mask has a large number of clearances corresponding to the strips. After applying the mask, the resistor material can be vapor-deposited onto the underside of the carrier plate. Through the mask, the resistor material only comes into contact with the carrier plate at the locations of the clearances, as a result of which After the mask has been removed, a plurality of strips of the resistance material is formed on the carrier plate. In addition to the large-area application and local removal of the resistor material or the attachment of a mask, however, other methods are also conceivable for forming the strips of the resistor material.
Gemäß einer Ausführungsform umfasst der Schritt c) des Ausbildens der Vielzahl von Zonen des elektrisch leitenden Materials das Bedrucken der Unterseite der Trägerplatte mit einer elektrisch leitenden Paste, insbesondere mit einer Silber-Palladium Legierung. Hierzu kann beispielsweise eine Druckplatte verwendet werden, auf der in einem regelmäßigen Muster die elektrisch leitende Paste aufgebracht wird, wobei das Muster der Anordnung der Zonen entspricht. Insbesondere ist das Muster der auf die Druckplatte aufgebrachten elektrisch leitenden Paste auf die Anordnung der Streifen des Widerstandmaterials abgestimmt.According to one embodiment, step c) of forming the plurality of zones of the electrically conductive material comprises printing the underside of the carrier plate with an electrically conductive paste, in particular with a silver-palladium alloy. For this purpose, for example, a printing plate can be used on which the electrically conductive paste is applied in a regular pattern, the pattern corresponding to the arrangement of the zones. In particular, the pattern of the electrically conductive paste applied to the printing plate is matched to the arrangement of the strips of the resistance material.
Nach dem Ausbilden der Vielzahl von Zonen des elektrisch leitenden Materials kann noch eine Galvanisierung, insbesondere eine Nickel-Zinn-Galvanisierung, der Zonen erfolgen.After the formation of the multiplicity of zones of the electrically conductive material, electroplating, in particular nickel-tin electroplating, of the zones can also take place.
Es versteht sich, dass der Schritt b) des Ausbildens der Vielzahl von Streifen des Widerstandsmaterials und der Schritt c) des Ausbildens der Vielzahl von Zonen des elektrisch leitenden Materials auch in umgekehrter Reihenfolge oder teilweise gleichzeitig ausgeführt werden können. Das Überlappen der Streifen des Widerstandsmaterials mit den Zonen des elektrisch leitenden Materials kann dabei dergestalt erfolgen, dass der jeweilige Streifen des Widerstandsmaterials die jeweiligen Zonen des elektrisch leitenden Materials teilweise überdeckt, oder dergestalt, dass die jeweiligen Zonen des elektrisch leitenden Materials den jeweiligen Streifen des Widerstandsmaterials teilweise überdecken.It goes without saying that step b) of forming the plurality of strips of the resistance material and step c) of forming the plurality of zones of the electrically conductive material can also be carried out in reverse order or partially simultaneously. The overlapping of the strips of the resistance material with the zones of the electrically conductive material can take place in such a way that the respective strip of the resistance material partially covers the respective zones of the electrically conductive material, or in such a way that the respective zones of the electrically conductive material the respective strip of the resistance material partially cover.
Gemäß einer Ausführungsform erfolgt das Durchtrennen der Trägerplatte in dem Schritt d) mittels eines Laser-Strahls. Dies erlaubt hierbei eine präzise und effiziente Methode zu einer Strukturierung der Trägerplatte, wobei es bei dieser Technik auch möglich ist, mehrere Durchtrennungsschnitte in kurzer Folge in einem Arbeitsschritt durchzuführen. Generell können für das Durchtrennen der Trägerplatte in dem Schritt d) die Querrichtungsschnitte, die ersten Längsrichtungsschnitte und die zweiten Längsrichtungsschnitte in einer beliebigen Reihenfolge ausgeführt werden. Dabei folgt bzw. entspricht die regelmäßige Anordnung der Querrichtungsschnitte, der ersten Längsrichtungsschnitte und der zweiten Längsrichtungsschnitte dem regelmäßigen Muster der Streifen des Widerstandsmaterials und dem regelmäßigen Muster der Zonen des elektrisch leitenden Materials.According to one embodiment, the carrier plate is severed in step d) by means of a laser beam. This allows a precise and efficient method of structuring the carrier plate, whereby with this technique it is also possible to carry out several severing cuts in quick succession in one work step. In general, the transverse directional cuts, the first longitudinal directional cuts and the second longitudinal directional cuts can be carried out in any order for severing the carrier plate in step d). The regular arrangement of the transverse directional cuts, the first longitudinal directional cuts and the second longitudinal directional cuts follows or corresponds to the regular pattern of the strips of the resistance material and the regular pattern of the zones of the electrically conductive material.
Gemäß einer Ausführungsform wird vor dem Durchtrennen der Trägerplatte durch die ersten und zweiten Längsrichtungsschnitte, insbesondere vor dem Schritt d), der elektrische Widerstand eines jeweiligen Streifens des Widerstandsmaterials gemessen, wobei Kontaktsonden an derjenigen Zone des elektrisch leitenden Materials, die mit dem ersten Ende des jeweiligen Streifens des Widerstandsmaterials überlappt, und an derjenigen Zone des elektrisch leitenden Materials, die mit dem zweiten Ende des jeweiligen Streifens des Widerstandsmaterials überlappt, angelegt werden. Die Messwerte können im Rahmen einer Qualitätskontrolle dahingehend überprüft werden, ob die Widerstandswerte in einem vorgegebenen nominellen Bereich liegen oder ob Abweichungen davon festzustellen sind. Insbesondere kann es sich bei den Kontaktsonden um Kelvin-Sonden handeln, welche mittels der Kelvin-Methode den elektrischen Widerstand der jeweiligen Zone des Widerstandsmaterials messen. Die Messung des elektrischen Widerstands vor dem Durchtrennen der Trägerplatte birgt den Vorteil, dass die gesamte Fläche einer jeweiligen Zone des elektrisch leitenden Materials für die Anbringung einer Kontaktsonde zu Verfügung steht, was wegen der geringen Größe der Widerstandbaueinheit und des geringen Größenverhältnisses zwischen der Kontaktsonde und der jeweiligen Zone des elektrisch leitenden Materials eine Positionierung der Kontaktsonde erheblich erleichtert bzw. erst ermöglicht.According to one embodiment, the electrical resistance of a respective strip of the resistance material is measured prior to the severing of the carrier plate by the first and second longitudinal cuts, in particular before step d), with contact probes on that zone of the electrically conductive material which is connected to the first end of the respective Strip of the resistance material overlaps, and are applied to that zone of the electrically conductive material which overlaps with the second end of the respective strip of the resistance material. The measured values can be checked as part of a quality control to determine whether the resistance values are in a specified nominal range or whether deviations from them can be determined. In particular, the contact probes can be Kelvin probes which measure the electrical resistance of the respective zone of the resistance material by means of the Kelvin method. Measuring the electrical resistance before cutting through the carrier plate has the advantage that the entire area of a respective zone of the electrically conductive material is available for attaching a contact probe, which is due to the small size of the resistor unit and the small size ratio between the contact probe and the respective zone of the electrically conductive material makes positioning of the contact probe considerably easier or possible in the first place.
Ein zweiter Aspekt der Erfindung betrifft eine Widerstandsbaueinheit, die gemäß einem erfindungsgemäßen Verfahren hergestellt worden ist, mit einem Träger, einer an der Unterseite des Trägers angeordneten Gruppe von Widerstandselementen, ersten elektrischen Anschlüssen, die mit einem jeweiligen ersten Ende der Widerstandselemente verbunden sind, und zweiten elektrischen Anschlüssen, die mit einem jeweiligen zweiten Ende der Widerstandselemente verbunden sind, wobei die Widerstandsbaueinheit eine Breite kleiner als 0,6 mm und eine Länge kleiner als 0,8 mm aufweist, wobei die Breite insbesondere in einem Bereich von 0,3 mm bis 0,34 mm liegt und die Länge insbesondere in einem Bereich von 0,54 mm bis 0,62 mm liegt. Die Widerstandsbaueinheit ist für eine Montage und Kontaktierung in einer Flip-Chip Bauweise ausgebildet und ist durch ihre geringe Größe in elektrischen Bauteilen oder Geräten einsetzbar, die eine besonders kompakte Ausbildung der Widerstandsbaueinheiten erfordern, wie beispielsweise Mobiltelefone, Smartphones, Smartwatches, Hörgeräte oder ähnliche Geräte.A second aspect of the invention relates to a resistor assembly that has been produced according to a method according to the invention, with a carrier, a group of resistance elements arranged on the underside of the carrier, first electrical connections which are connected to a respective first end of the resistance elements, and second electrical connections which are connected to a respective second end of the resistor elements, the resistor module having a width of less than 0.6 mm and a length of less than 0.8 mm, the width in particular in a range from 0.3 mm to 0 , 34 mm and the length is in particular in a range from 0.54 mm to 0.62 mm. The resistor module is designed for assembly and contacting in a flip-chip design and, due to its small size, can be used in electrical components or devices that require a particularly compact design of the resistor modules, such as mobile phones, smartphones, smartwatches, hearing aids or similar devices.
Nachfolgend wird die Erfindung bespielhaft anhand einer vorteilhaften Ausführungsform unter Bezugnahme auf die beigefügte Zeichnung beschrieben. Es zeigen, jeweils schematisch,
- Fig. 1
- Schritt a) einer Ausführungsform eines erfindungsgemäßen Verfahrens zur Herstellung einer Vielzahl von Widerstandsbaueinheiten;
- Fig. 2
- Schritt b) der Ausführungsform von
Fig. 1 ; - Fig. 3
- Schritt c) der Ausführungsform von
Fig. 1 ; - Fig. 4
- Funktionsüberprüfung der Ausführungsform von
Fig. 1 ; - Fig. 5
- Schritt d) der Ausführungsform von
Fig. 1 ; und - Fig. 6
- die Unteransicht einer Ausführungsform einer erfindungsgemäßen Widerstandsbaueinheit.
- Fig. 1
- Step a) of an embodiment of a method according to the invention for producing a plurality of resistor modules;
- Fig. 2
- Step b) of the embodiment of
Fig. 1 ; - Fig. 3
- Step c) of the embodiment of
Fig. 1 ; - Fig. 4
- Functional check of the embodiment of
Fig. 1 ; - Fig. 5
- Step d) of the embodiment of
Fig. 1 ; and - Fig. 6
- the bottom view of an embodiment of a resistor assembly according to the invention.
In Schritt b) des erfindungsgemäßen Verfahrens, der in
Um das Widerstandsmaterial ausschließlich an den Stellen der Streifen 16 auf die Trägerplatte 10 aufzubringen, kann das Widerstandsmaterial beispielsweise in durchgehenden, sich parallel entlang der Längsrichtung L erstreckenden, Bereichen auf die Trägerplatte aufgebracht werden. Zur Ausbildung der einzelnen Streifen 16 (Segmentierung) kann ein Laser eingesetzt werden, der in vorgegebenen Abständen entlang der Längsrichtung L Widerstandsmaterial abträgt bzw. abdampft. Mittels dieser Methode lässt sich eine präzise und positionsgenaue Anordnung der Streifen 16 erzielen. Alternativ kann die Unterseite 14 der Trägerplatte 10 vor der Auftragung des Widerstandsmaterials beispielsweise durch eine nicht gezeigte Maske abgedeckt werden, welche an der Stelle der Streifen 16 Freistellungen aufweist und beispielsweise aus Kunststoff gefertigt sein kann. Nach der Aufbringung des Widerstandsmaterials und der nachfolgenden Entfernung der Maske ergibt sich somit auf der Trägerplatte 10 ein regelmäßiges Muster einer Vielzahl von Streifen 16 des Widerstandsmaterials. Denkbar sind jedoch auch andere Methoden, die alleine oder in Kombination mit einer Maske angewandt werden können, um auf der Trägerplatte 10 die Streifen 16 des Widerstandsmaterials präzise und dabei einfach und effizient auszubilden.In order to apply the resistance material to the
In der gezeigten Ausführungsform sind die Streifen 16 des Widerstandsmaterials gleich groß zueinander, d.h. die Streifen 16 des Widerstandsmaterials haben gleiche Breiten und Längen sowie gleiche Dicken. Dementsprechend weisen die Streifen 16 des Widerstandsmaterials gleiche elektrische Widerstandswerte auf. In anderen Ausführungsformen können die Streifen unterschiedliche Größen aufweisen, um damit Streifen 16 des Widerstandsmaterials mit unterschiedlichen elektrischen Widerstandswerten zu erzeugen. In einfacher Weise lässt sich dies durch eine Variation der Länge der Streifen entlang der Längsrichtung L erreichen.In the embodiment shown, the
Die Zonen 24 des elektrisch leitenden Materials weisen entlang der Querrichtung Q jeweils ein erstes Ende 28, einen Zwischenbereich 30 und ein zweites Ende 32 auf, wobei, außer an den Randbereichen der Trägerplatte 10, die Streifen 16 des Widerstandsmaterials an ihren ersten Enden 20 mit dem ersten Ende 28 einer jeweiligen Zone 24 des elektrisch leitenden Materials überlappen und an ihren zweiten Enden 22 mit dem zweiten Ende 32 einer jeweiligen Zone 24 des elektrisch leitenden Materials überlappen. Das regelmäßige Muster der Zonen 24 ist auf das regelmäßige Muster der Streifen 16 abgestimmt, und zwar dergestalt, dass an jedem Streifen 16 jeweils ein Überlappungsbereich mit einer jeweiligen Zone 24 an seinem ersten Ende 20 und ein Überlappungsbereich mit einer jeweiligen Zone 24 an seinem zweiten Ende 22 ausgebildet ist.The
Die Zonen 24 des elektrisch leitenden Materials können beispielsweise aus einer Silber-Palladium Legierung bestehen. Die Zonen 24 können durch Anbringung in Form einer Paste, insbesondere durch Bedrucken der Unterseite 14 der Trägerplatte 10, gebildet werden. Hierzu wird auf eine nicht gezeigte Druckplatte die elektrisch leitende Paste in einem regelmäßigen, einer vorgegebenen Anordnung der Zonen 24 entsprechenden Muster aufgebracht. Mittels dieser Technik lässt sich eine Vielzahl von Zonen 24 des elektrisch leitenden Materials effizient in einem Druckvorgang erzeugen.The
Der in
In
Die Kontaktsonden 34 werden an derjenigen Zone 24 des elektrisch leitenden Materials, der mit dem ersten Ende 20 des jeweiligen Streifens 16 des Widerstandsmaterials überlappt, und an derjenigen Zone 24 des elektrisch leitenden Materials, die mit dem zweiten Ende 22 des jeweiligen Streifens 16 des Widerstandsmaterials überlappt, angelegt. Dabei sind die Kontaktsonden 36 dazu ausgebildet, beispielsweise mittels der Kelvin-Methode den elektrischen Widerstand eines jeweiligen Streifens 16 des Widerstandsmaterials und somit den elektrischen Widerstand des zu bildenden jeweiligen Widerstandselements zu messen. Aus den Messwerten lässt sich sodann ermitteln, ob die Widerstandswerte in einem vorgegebenen Bereich liegen oder ob Abweichungen vorhanden sind.The contact probes 34 are at that
Durch die Durchführung der Funktionsprüfung nach Schritt c) des Verfahrens und vor dem Durchtrennen der Trägerplatte 10 gemäß dem Schritt d) wird die Anbringung der Kontaktsonden 34 an die jeweiligen Zonen 24 erleichtert, da zu diesem Zeitpunkt des Verfahrens auch die Fläche der Zwischenbereiche 30 der Zonen 24 hierfür zur Verfügung steht. Für das Prüfen der Streifen 16 des Widerstandsmaterials wird wenigstens ein Paar von Kontaktsonden 34 benötigt (je eine Kontaktsonde 34 auf den beiden Seiten des jeweiligen Streifens 16), wobei auch mehrere Paare von Kontaktsonden 34 dazu verwendet werden können, mehrere Streifen 16 gleichzeitig zu prüfen.By performing the functional test after step c) of the method and before cutting through the
Die regelmäßige Anordnung der Querrichtungsschnitte 36, der ersten Längsrichtungsschnitte 38 und der zweiten Längsrichtungsschnitte 40 entspricht dem regelmäßigen Muster der Streifen 16 des Widerstandsmaterials und dem regelmäßigen Muster der Zonen 24 des elektrisch leitenden Materials. Hierbei verlaufen die Querrichtungsschnitte 36 zwischen Gruppen 42 von einander zugeordneten, in Längsrichtung L zueinander benachbarten Streifen 16 des Widerstandsmaterials. In der beschriebenen Ausführungsform umfassen die Gruppen 42 jeweils zwei Streifen 16. Die Gruppen 42 können jedoch auch mehr oder auch nur einen Streifen 16 umfassen. Durch eine einfache Anpassung der Schnittabstände kann die Anzahl der Streifen 16 des Widerstandsmaterials der Widerstandsbaueinheiten 44 geändert werden.The regular arrangement of the transverse
Die ersten Längsrichtungsschnitte 38 trennen die ersten Enden 28 von den Zwischenbereichen 30 einer jeweiligen Reihe 26 von Zonen 24 des elektrisch leitenden Materials ab. Durch die zweiten Längsrichtungsschnitte 40 werden hingegen die zweiten Enden 32 von den Zwischenbereichen 30 einer jeweiligen Reihe 26 von Zonen 24 des elektrisch leitenden Materials abgetrennt. Somit wird durch die Abfolge von Schnitten 36, 38, 40 entlang der Querrichtung Q abwechselnd eine jeweilige Widerstandsbaueinheit 44 und ein jeweiliger Restabschnitt 46 der Trägerplatte ausgebildet. Der jeweilige Restabschnitt 46 umfasst abgetrennte Zwischenbereiche 30 einer Reihe 26 von Zonen 24 des elektrisch leitenden Materials und wird nach der Beendigung des Herstellungsverfahrens nicht mehr benötigt.The first
Es versteht sich, dass für das Durchtrennen der Trägerplatte 10 die Querrichtungsschnitte 36, die ersten Längsrichtungsschnitte 38 und die zweiten Längsrichtungsschnitte 40 generell in einer beliebigen Reihenfolge ausgeführt werden. Das Durchtrennen der Trägerplatte 10 kann beispielsweise mittels eines Laser-Strahls durchgeführt werden, was eine präzise und effiziente Strukturierung der Trägerplatte 10 in einem Arbeitsgang erlaubt.It goes without saying that for the severing of the
Die Streifen 16 des Widerstandsmaterials können generell eine Längsform aufweisen (insbesondere im Wesentlichen rechteckig), wobei die jeweilige Längsachse der Streifen 16 des Widerstandsmaterials entlang der Längsrichtung L oder entlang der Querrichtung Q ausgerichtet sein kann. Alternativ hierzu können die Streifen 16 des Widerstandsmaterials beispielsweise auch eine im Wesentlichen quadratische Form aufweisen.The
Im Verfahren sind die gegenseitigen Abstände der Querrichtungsschnitte 36 und die gegenseitigen Abstände der ersten und zweiten Längsrichtungsschnitte 38, 40 derart gewählt, dass die Widerstandsbaueinheit 44 eine Breite kleiner als 0,6 mm und eine Länge kleiner als 0,8 mm aufweist, wobei die Breite insbesondere in einem Bereich von 0,3 mm bis 0,34 mm liegen kann und die Länge insbesondere in einem Bereich von 0,54 mm bis 0,62 mm liegen kann. Durch ihre geringe Größe, die durch das erfindungsgemäße Verfahren erreicht werden kann, ist die Widerstandsbaueinheit 44 in elektrischen Bauteilen oder Geräten einsetzbar, die eine besonders kleine und kompakte Ausbildung der Widerstandsbaueinheiten erfordern.In the method, the mutual distances between the transverse
- 1010
- TrägerplatteCarrier plate
- 1212th
- OberseiteTop
- 1414th
- Unterseitebottom
- 1616
- Streifen des WiderstandsmaterialsStrips of resistor material
- 1818th
-
Reihe der Streifen 16 des WiderstandsmaterialsRow of
strips 16 of resistor material - 2020th
-
erstes Ende eines Streifens 16 des Widerstandsmaterialsfirst end of a
strip 16 of the resistive material - 2222nd
-
zweites Ende eines Streifens 16 des Widerstandsmaterialssecond end of a
strip 16 of the resistive material - 2424
- Zone des elektrisch leitenden MaterialsZone of the electrically conductive material
- 2626th
-
Reihe der Zonen 24 des elektrisch leitenden MaterialsRow of
zones 24 of the electrically conductive material - 2828
-
erstes Ende einer Zone 24 des elektrisch leitenden Materialsfirst end of a
zone 24 of the electrically conductive material - 3030th
-
Zwischenbereich einer Zone 24 des elektrisch leitenden MaterialsIntermediate area of a
zone 24 of the electrically conductive material - 3232
-
zweites Ende einer Zone 24 des elektrisch leitenden Materialssecond end of a
zone 24 of the electrically conductive material - 3434
- KontaktsondeContact probe
- 3636
- QuerrichtungsschnittCross direction cut
- 3838
- erster Längsrichtungsschnittfirst longitudinal cut
- 4040
- zweiter Längsrichtungsschnittsecond longitudinal cut
- 4242
- Gruppe benachbarter StreifenGroup of adjacent stripes
- 4444
- WiderstandsbaueinheitResistor assembly
- 4646
- RestabschnittRemainder section
- 4848
- Trägercarrier
- 5050
- WiderstandselementResistance element
- 5252
- erster elektrischer Anschlussfirst electrical connection
- 5454
- zweiter elektrischer Anschlusssecond electrical connection
- QuerrichtungTransverse direction
- LL.
- LängsrichtungLongitudinal direction
Claims (13)
- A method of manufacturing a plurality of resistor units (44) that each comprise a carrier (46) having a group of resistor elements (50) at whose ends a respective first and second electrical terminal (52, 54) is provided, comprising the steps:a) providing a carrier plate (10) that has an upper side (12) and a lower side (14);b) forming a plurality of strips (16) of a resistor material at the lower side (14) of the carrier plate (10), that have a first end (20) and a second end (22) along a transverse direction (Q), in a regular pattern such that a respective row (18) of strips (16) of the resistor material is formed along a longitudinal direction (L) that extends perpendicular to the transverse direction (Q) and such that a plurality of such rows (18) are arranged next to one another in the transverse direction (Q);c) forming a plurality of zones (24) of an electrically conductive material at the lower side (14) of the carrier plate (10), that have a first end (28), an intermediate region (30), and a second end (32) along the transverse direction (Q), in a regular pattern such that a respective row (26) of zones (24) of the electrically conductive material is formed along the longitudinal direction (L) and such that a plurality of such rows (26) are arranged next to one another in the transverse direction (Q), wherein the rows (18) of strips (16) of the resistor material and the rows (26) of zones (24) of the electrically conductive material are arranged alternately in the transverse direction (Q), and wherein, with the exception of border regions of the carrier plate (10), the strips (16) of the resistor material overlap the first end (28) of a respective zone (24) of the electrically conductive material at their first ends (20) and overlap the second end (32) of a respective zone (24) of the electrically conductive material at their second ends (22); andd) cutting through the carrier plate (10) by regular transverse incisions (36) along the transverse direction (Q), first longitudinal incisions (38) along the longitudinal direction (L), and second longitudinal incisions (40) along the longitudinal direction (L) such that the transverse incisions (36) extend between groups (42) of strips (16) of the resistor material that are associated with one another and that are adjacent to one another in the longitudinal direction (L), such that furthermore the first longitudinal incisions (38) detach the first ends (28) from the intermediate regions (30) of a respective row (26) of zones (24) of the electrically conductive material, and such that the second longitudinal incisions (40) detach the second ends (32) from the intermediate regions (30) of a respective row (26) of zones (24) of the electrically conductive material so that a respective resistor unit (44) and a respective residual section (46) of the carrier plate (10) are alternately formed along the transverse direction (Q), said respective residual section (46) including detached intermediate regions (30) of a row (26) of zones (24) of the electrically conductive material.
- A method in accordance with claim 1, wherein the respective resistor unit (44) formed by the cutting through of the carrier plate (10) has- a section of the carrier plate (10) that forms the carrier (48) of the resistor unit (44);- a group (42) of strips (16) of the resistor material that form the group of resistor elements (50) of the resistor unit (44);- a number of first ends (28) of zones (24) of the electrically conductive material that form the first electrical terminals (52) of the resistor elements (50); and- a number of second ends (32) of zones (24) of the electrically conductive material that forms the second electrical terminals (54) of the resistor elements (44).
- A method in accordance with claim 1 or claim 2, wherein the mutual spacings of the transverse incisions (36) and the mutual spacings of the first and second longitudinal incisions (38, 40) are selected such that the respective formed resistor unit (44) has a width of less than 0,6 mm and a length of less than 0,8 mm, with the width in particular being able to be in a range from 0,3 mm to 0,34 mm and the length in particular being able to be in a range from 0,54 mm to 0,62 mm.
- A method in accordance with any one of the preceding claims, wherein the group (42) of strips (16) of the resistor material comprises two strips (16) of the resistor material.
- A method in accordance with any one of the preceding claims, wherein the strips (16) of the resistor material of the formed resistor unit (44) are of equal size.
- A method in accordance with any one of the claims 1 to 4, wherein the strips (16) of the resistor material of the formed resistor unit (44) are of different sizes, in particular with a different width transversely to the extent of the strips (16) of the resistor material between the first end (20) and the second end (22).
- A method in accordance with any one of the preceding claims, wherein the carrier plate (10) comprises a ceramic substrate.
- A method in accordance with any one of the preceding claims, wherein the resistor material and the electrically conductive material are only applied to the lower side (14) of the carrier plate (10).
- A method in accordance with any one of the preceding claims, wherein step b) of forming the plurality of strips (16) of the resistor material comprises:applying a metal layer to the lower side (14) of the carrier plate (10) by cathode atomization; andlocal removal of the metal layer by vaporization.
- A method in accordance with any one of the preceding claims, wherein step c) of forming the plurality of zones (24) of the electrically conductive material comprises:
printing the lower side (14) of the carrier plate (10) with an electrically conductive paste. - A method in accordance with any one of the preceding claims, wherein the cutting through of the carrier plate (10) in step d) takes place by means of a laser beam.
- A method in accordance with any one of the preceding claims, wherein the electrical resistance of a respective strip (16) of the resistor material is measured before the cutting through of the carrier plate (10) by the first and second longitudinal incisions (38, 40), wherein contact probes (34) are applied to that zone (24) of the electrically conductive material that overlaps the first end (20) of the respective first strip (16) of the resistor material and to that zone (24) of the electrically conductive material that overlaps the second end (22) of the respective strip (16) of the resistor material
- A resistor unit (44) that has been manufactured in accordance with a method in accordance with any one of the preceding claims, comprising a carrier (48), a group of resistor elements (50) arranged at the lower side of the carrier (48), first electrical terminals (52) that are connected to a respective first end of the resistor elements (50), and second electrical terminals (54) that are connected to a respective second end of the resistor elements (50),
wherein the resistor unit (44) has a width of less than 0,6 mm and a length of less than 0,8 mm, with the width in particular being in a range from 0,3 mm to 0,34 mm and the length in particular being in a range from 0,54 mm to 0,62 mm.
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DE102018115205.1A DE102018115205A1 (en) | 2018-06-25 | 2018-06-25 | Process for manufacturing a large number of resistance units |
PCT/EP2019/065399 WO2020001982A1 (en) | 2018-06-25 | 2019-06-12 | Method for producing a plurality of resistance modular units over a ceramic substrate |
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EP (1) | EP3797432B1 (en) |
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-
2018
- 2018-06-25 DE DE102018115205.1A patent/DE102018115205A1/en not_active Withdrawn
-
2019
- 2019-06-12 KR KR1020217002406A patent/KR20210024096A/en not_active Application Discontinuation
- 2019-06-12 HU HUE19730343A patent/HUE057294T2/en unknown
- 2019-06-12 JP JP2020571768A patent/JP2021529434A/en active Pending
- 2019-06-12 CA CA3104943A patent/CA3104943A1/en active Pending
- 2019-06-12 US US17/255,803 patent/US11302462B2/en active Active
- 2019-06-12 WO PCT/EP2019/065399 patent/WO2020001982A1/en active Search and Examination
- 2019-06-12 ES ES19730343T patent/ES2896949T3/en active Active
- 2019-06-12 EP EP19730343.1A patent/EP3797432B1/en active Active
- 2019-06-12 CN CN201980042448.0A patent/CN112384998B/en active Active
- 2019-06-18 TW TW108121095A patent/TWI844548B/en active
Also Published As
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JP2021529434A (en) | 2021-10-28 |
DE102018115205A1 (en) | 2020-01-02 |
CN112384998A (en) | 2021-02-19 |
EP3797432A1 (en) | 2021-03-31 |
KR20210024096A (en) | 2021-03-04 |
WO2020001982A1 (en) | 2020-01-02 |
US20210272724A1 (en) | 2021-09-02 |
CN112384998B (en) | 2022-06-07 |
TWI844548B (en) | 2024-06-11 |
HUE057294T2 (en) | 2022-05-28 |
ES2896949T3 (en) | 2022-02-28 |
US11302462B2 (en) | 2022-04-12 |
TW202001940A (en) | 2020-01-01 |
CA3104943A1 (en) | 2020-01-02 |
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