JPWO2019240932A5 - - Google Patents
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- JPWO2019240932A5 JPWO2019240932A5 JP2020568737A JP2020568737A JPWO2019240932A5 JP WO2019240932 A5 JPWO2019240932 A5 JP WO2019240932A5 JP 2020568737 A JP2020568737 A JP 2020568737A JP 2020568737 A JP2020568737 A JP 2020568737A JP WO2019240932 A5 JPWO2019240932 A5 JP WO2019240932A5
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- solder
- wave
- support frame
- actuator
- nozzle
- Prior art date
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Claims (10)
ハウジングと、
前記ハウジングに結合されたコンベヤであって、前記ハウジングを通してプリント回路基板を給送するコンベヤと、
前記ハウジングに結合されたウェーブはんだ付けステーションとを具備し、
前記ウェーブはんだ付けステーションは、はんだ材料のリザーバーと、はんだウェーブを生成するウェーブはんだノズル組立体とを備え、前記コンベヤが、はんだウェーブ上を移動方向に移動して、ウェーブはんだ動作が実行されるようになっており、該ウェーブはんだノズル組立体は、ノズルコアフレームと、該ノズルコアフレームに結合されたはんだ分配バッフルと、摺動プレートとを備え、前記ノズルコアフレーム、はんだ分配バッフルおよび摺動プレートによりノズルが形成され、該摺動プレートは、前記ノズルが、前記はんだ分配バッフルを通して狭い幅のはんだウェーブをもたらす近接位置と、前記ノズルが、前記はんだ分配バッフルを通して幅の広いはんだウェーブをもたらす離隔位置との間で、前記ノズルコアフレームに対して可動となっており、
前記ウェーブはんだノズル組立体は、更に、
前記ノズルコアフレームに固定された排出側支持フレームと、
前記排出側支持フレームに結合され該排出側支持フレームに対して移動する作動支持フレームであって、前記摺動プレートが固定されている前記作動支持フレームと、
前記作動支持フレームを移動させるアクチュエーター組立体とを具備し、
前記アクチュエーター組立体は、前記リザーバーに固定されたアクチュエーター支持部と、該アクチュエーター支持部に固定され、該アクチュエーター支持部によって支持されるアクチュエーターとを備えているウェーブはんだ付け機。 In a wave soldering machine that performs a wave soldering operation on a printed circuit board
With the housing
A conveyor coupled to the housing that feeds the printed circuit board through the housing.
A wave soldering station coupled to the housing is provided .
The wave soldering station comprises a reservoir of solder material and a wave solder nozzle assembly that produces a solder wave so that the conveyor moves in a moving direction on the solder wave to perform a wave soldering operation. The wave solder nozzle assembly comprises a nozzle core frame, a solder distribution baffle coupled to the nozzle core frame, and a sliding plate, the nozzle core frame, the solder distribution baffle, and sliding. A nozzle is formed by the plate, and the sliding plate is separated from the proximity position where the nozzle brings a narrow solder wave through the solder distribution baffle and the distance where the nozzle brings a wide solder wave through the solder distribution baffle. It is movable with respect to the nozzle core frame between the position and the soldering core frame.
The wave solder nozzle assembly further includes
The discharge side support frame fixed to the nozzle core frame and
An actuating support frame that is coupled to the discharge side support frame and moves with respect to the discharge side support frame, the actuating support frame to which the sliding plate is fixed, and the actuating support frame.
It comprises an actuator assembly for moving the actuating support frame.
The actuator assembly is a wave soldering machine including an actuator support portion fixed to the reservoir and an actuator fixed to the actuator support portion and supported by the actuator support portion .
ノズルコアフレームと、
前記ノズルコアフレームに固定されたはんだ分配バッフルと、
前記ノズルコアフレーム及び前記はんだ分配バッフルとともにノズルを形成する摺動プレートであって、該摺動プレートは、前記ノズルが、前記はんだ分配バッフルを通して狭い幅のはんだウェーブをもたらす近接位置と、前記ノズルが、前記はんだ分配バッフルを通して幅の広いはんだウェーブをもたらす離隔位置との間で、前記ノズルコアフレームに対して可動な摺動プレートと、
前記ノズルコアフレームに固定された排出側支持フレームと、
前記排出側支持フレームに結合されるとともに、該排出側支持フレームに対して移動する作動支持フレームであって、前記摺動プレートが固定されている前記作動支持フレームと、
前記作動支持フレームを移動させるアクチュエーター組立体とを具備し、
前記アクチュエーター組立体は、リザーバーに固定されたアクチュエーター支持部と、該アクチュエーター支持部に固定され、該アクチュエーター支持部によって支持されるアクチュエーターとを備えているウェーブはんだノズル組立体。 In a wave solder nozzle assembly of a wave soldering station that performs a wave soldering operation on a printed circuit board.
Nozzle core frame and
The solder distribution baffle fixed to the nozzle core frame and
A sliding plate that forms a nozzle with the nozzle core frame and the solder distribution baffle, wherein the nozzle is in close proximity to the nozzle to bring a narrow width solder wave through the solder distribution baffle. A sliding plate that is movable with respect to the nozzle core frame, and a sliding plate that provides a wide solder wave through the solder distribution baffle .
The discharge side support frame fixed to the nozzle core frame and
An actuating support frame that is coupled to the discharge side support frame and moves with respect to the discharge side support frame, and the actuated support frame to which the sliding plate is fixed.
It comprises an actuator assembly for moving the actuating support frame.
The actuator assembly is a wave solder nozzle assembly including an actuator support portion fixed to a reservoir and an actuator fixed to the actuator support portion and supported by the actuator support portion .
はんだ分配バッフルを備えるウェーブはんだノズル組立体にはんだ材料を給送することと、
前記はんだ分配バッフルに対して可動な摺動プレートを備える前記ウェーブはんだノズル組立体を用いて、はんだウェーブの幅を調節することと、
プリント回路基板上でウェーブはんだ付け動作を実行することとを含み、
はんだウェーブの幅は、前記はんだ分配バッフルを通して狭い幅のはんだウェーブをもたらす近接位置と、前記はんだ分配バッフルを通して幅の広いはんだウェーブをもたらす離隔位置との間で、前記はんだ分配バッフルを支持するノズルコアフレームに対して前記ウェーブはんだノズル組立体の前記摺動プレートを移動させることによって調節され、
該摺動プレートに結合された作動支持フレームを移動させるアクチュエーター組立体によって前記摺動プレートが移動するようにした方法。 In the method of adjusting the width of the solder wave of the wave solder nozzle assembly of the wave soldering machine,
Feeding solder material to a wave solder nozzle assembly with a solder distribution baffle,
Adjusting the width of the solder wave and using the wave solder nozzle assembly with the sliding plate movable with respect to the solder distribution baffle.
Including performing a wave soldering operation on a printed circuit board,
The width of the solder wave is a nozzle core that supports the solder distribution baffle between a close position that provides a narrow solder wave through the solder distribution baffle and a separation position that provides a wide solder wave through the solder distribution baffle. Adjusted by moving the sliding plate of the wave solder nozzle assembly with respect to the frame,
A method in which the sliding plate is moved by an actuator assembly that moves an actuating support frame coupled to the sliding plate .
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US16/008,382 | 2018-06-14 | ||
US16/008,382 US10780516B2 (en) | 2018-06-14 | 2018-06-14 | Wave solder nozzle with automated adjustable sliding plate to vary solder wave width |
PCT/US2019/033791 WO2019240932A1 (en) | 2018-06-14 | 2019-05-23 | Wave solder nozzle with automated adjustable sliding plate to vary solder wave width |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2021527330A JP2021527330A (en) | 2021-10-11 |
JPWO2019240932A5 true JPWO2019240932A5 (en) | 2022-06-01 |
JP7290669B2 JP7290669B2 (en) | 2023-06-13 |
Family
ID=66912932
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020568737A Active JP7290669B2 (en) | 2018-06-14 | 2019-05-23 | Wave solder nozzle with automatically adjustable sliding plate to change solder wave width |
Country Status (5)
Country | Link |
---|---|
US (1) | US10780516B2 (en) |
EP (1) | EP3807039B1 (en) |
JP (1) | JP7290669B2 (en) |
CN (1) | CN112533719A (en) |
WO (1) | WO2019240932A1 (en) |
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-
2018
- 2018-06-14 US US16/008,382 patent/US10780516B2/en active Active
-
2019
- 2019-05-23 JP JP2020568737A patent/JP7290669B2/en active Active
- 2019-05-23 WO PCT/US2019/033791 patent/WO2019240932A1/en active Application Filing
- 2019-05-23 CN CN201980037234.4A patent/CN112533719A/en active Pending
- 2019-05-23 EP EP19731397.6A patent/EP3807039B1/en active Active
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