JPWO2019211719A5 - - Google Patents
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- JPWO2019211719A5 JPWO2019211719A5 JP2020560998A JP2020560998A JPWO2019211719A5 JP WO2019211719 A5 JPWO2019211719 A5 JP WO2019211719A5 JP 2020560998 A JP2020560998 A JP 2020560998A JP 2020560998 A JP2020560998 A JP 2020560998A JP WO2019211719 A5 JPWO2019211719 A5 JP WO2019211719A5
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- JP
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- Prior art keywords
- layer
- polishing
- rotary tool
- substrate
- corner
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Claims (5)
８０以下のショアＡ硬度を有し、前記研磨層に結合された第１の層と、
前記第１の層に結合された第２の層とを含み、
前記第２の層のショアＡ硬度は前記第１の層のショアＡ硬度より低い、
研磨物品。 A polishing layer with a contact surface and
A first layer having a shore A hardness of 80 or less and bonded to the polishing layer,
Including a second layer bonded to the first layer
The shore A hardness of the second layer is lower than the shore A hardness of the first layer.
Polished goods .
前記研磨層に結合された第１の層と、
前記第１の層に結合された第２の層とを含み、
前記第２の層は、たわみ量２５％において１．５ＭＰａ以下の圧縮率を有し、たわみ量２５％における前記第１の層の圧縮率は、たわみ量２５％における前記第２の層の圧縮率よりも大きい、
研磨物品。 A polishing layer with a contact surface and
The first layer bonded to the polishing layer and
Including a second layer bonded to the first layer
The second layer has a compressibility of 1.5 MPa or less at a deflection amount of 25%, and the compression rate of the first layer at a deflection amount of 25% is the compression of the second layer at a deflection amount of 25%. Greater than the rate,
Polished goods.
前記回転工具の回転軸を画定する工具軸部と、
前記工具軸部に連結した、請求項１又は２のいずれか一項に記載の研磨物品とを含み、
前記研磨物品の前記接触面は、前記工具軸部とは反対の方向を向いている、
研磨用回転工具。 It is a rotary tool for polishing,
A tool shaft portion that defines the rotation axis of the rotary tool,
The polished article according to any one of claims 1 or 2 , which is connected to the tool shaft portion.
The contact surface of the polished article faces in the direction opposite to the tool shaft portion.
Rotating tool for polishing .
前記基材プラットフォームに固定された基材と、
請求項１又は２に記載の研磨物品を含む研磨用回転工具と、を含む、
アセンブリ。 Computer-controlled machining systems, including computer-controlled rotary tool holders and substrate platforms,
The base material fixed to the base material platform and
A polishing rotary tool including the polishing article according to claim 1 or 2 .
Assembly .
前記コンピュータ制御機械加工システムの前記回転工具ホルダに、請求項３に記載の研磨用回転工具を固定することと、
第１の主表面、第２の主表面、及び縁部表面を有する基材であって、前記縁部表面は前記第１の主表面と交差して第１の角部を形成し、前記縁部表面は前記第２の主表面と交差して第２の角部を形成する、基材を提供することと、
前記コンピュータ制御機械加工システムを作動して、前記基板の前記縁部、及び前記第１の角部の一部分と前記第２の角部の一部分とのうちの少なくとも一方を、前記研磨用回転工具の前記研磨層により研磨することと、
任意選択として、前記研磨用回転工具の前記研磨層は、前記基板の縁部、及び第１の角部の一部分と、前記第１の主表面の一部分と、前記第２の角部の一部分と、前記第２の主表面の一部分とのうちの少なくとも１つを、同時に研磨することとを含む、
基材を研磨する方法。 To provide a computer controlled machining system including a computer controlled rotary tool holder and a substrate platform.
The polishing rotary tool according to claim 3 is fixed to the rotary tool holder of the computer-controlled machining system.
A substrate having a first main surface, a second main surface, and an edge surface, wherein the edge surface intersects the first main surface to form a first corner, and the edge is formed. To provide a substrate, the surface of which crosses the second main surface to form a second corner.
By operating the computer-controlled machining system, the edge portion of the substrate, and at least one of a part of the first corner portion and a part of the second corner portion of the polishing rotary tool are used. Polishing with the polishing layer and
Optionally, the polishing layer of the polishing rotary tool includes a portion of the edge of the substrate, a first corner, a portion of the first main surface, and a portion of the second corner. , Including simultaneously polishing at least one of the parts of the second main surface.
A method of polishing a substrate.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201862665065P | 2018-05-01 | 2018-05-01 | |
| US62/665,065 | 2018-05-01 | ||
| PCT/IB2019/053483 WO2019211719A1 (en) | 2018-05-01 | 2019-04-29 | Conformable abrasive article |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2021522079A JP2021522079A (en) | 2021-08-30 |
| JPWO2019211719A5 true JPWO2019211719A5 (en) | 2022-05-11 |
| JP7337095B2 JP7337095B2 (en) | 2023-09-01 |
Family
ID=68386000
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020560998A Active JP7337095B2 (en) | 2018-05-01 | 2019-04-29 | Compatible Abrasive Article |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20210114171A1 (en) |
| JP (1) | JP7337095B2 (en) |
| KR (1) | KR20210002699A (en) |
| CN (1) | CN112041114B (en) |
| WO (1) | WO2019211719A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023101842A1 (en) * | 2021-11-30 | 2023-06-08 | Corning Incorporated | Localized polishing fixture and processes of using the same |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4945687A (en) * | 1989-07-25 | 1990-08-07 | Jason, Inc. | Rotary fininshing tool |
| JP3040905B2 (en) * | 1993-12-29 | 2000-05-15 | 株式会社花村硝子工業 | Double grinding wheel, glass plate edge grinding / polishing method and glass plate edge grinding / polishing apparatus |
| US20040020789A1 (en) * | 2000-02-17 | 2004-02-05 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
| CN100537147C (en) * | 2000-12-01 | 2009-09-09 | 东洋橡膠工业株式会社 | Polishing pad, method of manufacturing the polishing pad, and cushion layer for polishing pad |
| DE102004047563A1 (en) * | 2004-09-30 | 2006-04-06 | Asphericon Gmbh | Method of polishing |
| JP2006326795A (en) | 2005-05-30 | 2006-12-07 | Kurenooton Kk | Grinding wheel for polishing |
| JP2010522093A (en) * | 2007-03-21 | 2010-07-01 | スリーエム イノベイティブ プロパティズ カンパニー | How to remove surface defects |
| US8460060B2 (en) * | 2009-01-30 | 2013-06-11 | Smr Patents S.A.R.L. | Method for creating a complex surface on a substrate of glass |
| US9028296B2 (en) * | 2012-08-30 | 2015-05-12 | Corning Incorporated | Glass sheets and methods of shaping glass sheets |
| CA2936498C (en) * | 2014-02-06 | 2021-11-30 | Asahi Kasei Kogyo Co., Ltd. | Abrasive particle, manufacturing method of the same, polishing method, polishing device, and slurry |
| WO2015186076A2 (en) * | 2014-06-04 | 2015-12-10 | Paolo Baratti | Abrasive tool for machining surfaces |
| US10391605B2 (en) * | 2016-01-19 | 2019-08-27 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
-
2019
- 2019-04-29 US US17/051,861 patent/US20210114171A1/en active Pending
- 2019-04-29 KR KR1020207034543A patent/KR20210002699A/en not_active Application Discontinuation
- 2019-04-29 JP JP2020560998A patent/JP7337095B2/en active Active
- 2019-04-29 WO PCT/IB2019/053483 patent/WO2019211719A1/en active Application Filing
- 2019-04-29 CN CN201980029159.7A patent/CN112041114B/en active Active
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