JPWO2019156170A1 - Modeling equipment, droplet movement equipment, object production method, droplet movement method and program - Google Patents

Abstract

The modeling apparatus includes a moving processing unit for moving the droplets, and a modeling unit that performs modeling by partially changing the droplets into a solid within a predetermined modeling area.

Description

The present invention relates to a modeling device, a droplet moving device, an object production method, a droplet moving method and a program.
This application claims priority on the basis of Japanese Patent Application No. 2018-20556 filed on February 7, 2018 and incorporates all of its disclosures herein.

Stereolithography is one of the methods that can form a three-dimensional object. In stereolithography, a liquid material is irradiated with light such as an ultraviolet laser beam to partially change the material into a solid to form an object.
In relation to stereolithography, Non-Patent Document 1 discloses a method of forming a fine structure of silver by photoreduction. In the method described in Non-Patent Document 1, an aqueous solution containing silver ions is irradiated with laser light to condense silver into a desired shape, and then the aqueous solution is removed.

Further, Non-Patent Document 2 shows an experimental example of performing stereolithography by combining a plurality of materials. In the experimental example described in Non-Patent Document 2, the acrylic resin and the methacrylic resin are respectively molded by photopolymerization, and then the magnetic material is electroless plated. As a result, of the acrylic resin and the methacrylic resin, only the acrylic resin is selectively plated.
In this way, by performing stereolithography using a plurality of types of materials, it is possible to form a target object having various characteristics.

Yao-Yu Cao, Nobuyuki Takeyasu, Takuo Tanaka, Xuan-Ming Duan, and Satoshi Kawata, "3D Metallic Nanostructure Fabrication by Surfactant-Assisted Multiphoton-Induced Reduction", Small, 2009, Vol. 5, No. 10, p. 1144-1148 Tommaso Zandrini, Shuhei Taniguchi and Shoji Maruo, "Magnetically Driven Micromachines Created by Two-Photon Microfabrication and SelectiveElectroless Magnetite Plating for Lab-on-a-Chip Applications", Micromachines, 2017, Vol. 8, No. 35, p.1 -8

When a liquid material is changed to a solid to form a target object such as stereolithography or photoreduction, it is necessary to install the liquid material in an area where the modeling is performed, such as an irradiation range of laser light. Such a method is burdensome for the user who performs the installation. In particular, when modeling is performed using a plurality of materials, it is necessary to wash the target object in the process of modeling every time the material is replaced, and to install the washed target object and the next material in the area where the modeling is performed. is there. Therefore, the burden on the user who performs the work is large. Further, when precision processing is performed such as when the target object is small, the accuracy of the installation position and orientation is required when installing the cleaned target object, which further increases the burden on the user who performs the work.

INDUSTRIAL APPLICABILITY According to the present invention, when a liquid material is changed to a solid to form an object, the burden of installing the liquid material can be reduced, a modeling device, a droplet moving device, a target product production method, and a droplet moving. Provide methods and programs.

According to the first aspect of the present invention, the modeling apparatus includes a moving processing unit that moves droplets, and a modeling unit that performs modeling by partially changing the droplets into solids within a predetermined modeling region. To be equipped.

The movement processing unit may move the droplet by causing a temperature gradient in the droplet by using a point heater using an electromagnetic wave.

The movement processing unit may move the droplet on a surface on which the water-repellent material is partially arranged.

The movement processing unit may increase the amount of heating by the point heater as the distance to which the droplets should be moved increases.

The moving processing unit may increase the amount of heating by the point heater as the wettability of the droplets becomes smaller.

The moving processing unit may increase the amount of heating by the point heater as the viscosity of the droplet increases.

The movement processing unit moves a plurality of droplets made of different types of materials at different timings, and the modeling unit partially changes each of the plurality of droplets into a solid within the modeling region. By doing so, the modeling may be performed.

The moving processing unit moves the droplets that are the material of the target object and the droplets of the cleaning liquid at different timings, and the modeling unit moves the droplets that are the material of the target object within the modeling region. The target object may be modeled by partially changing.

The modeling unit may irradiate the droplets on the substrate through which the laser beam is transmitted with the laser beam from below the substrate so as to focus on the droplets.

According to the second aspect of the present invention, the modeling apparatus moves a plurality of droplets made of a material of a target object and different types of materials at different timings, and also moves the plurality of droplets at different timings. A moving processing unit that moves the droplets of the cleaning liquid at a timing different from the timing of causing the cleaning liquid, and a modeling unit that shapes the target object by partially changing the plurality of droplets into a solid within a predetermined modeling region. To be equipped.

According to the third aspect of the present invention, the droplet moving device includes a moving processing unit that moves the droplet by causing a temperature gradient in the droplet using a point heater using an electromagnetic wave.

According to the fourth aspect of the present invention, the target product production method includes a step of performing modeling by partially changing droplets into a solid within a predetermined modeling region, and a step of performing the modeling after application. The step of moving the droplet to the outside of the modeling region is included.

According to a fifth aspect of the present invention, the method for moving a droplet includes a step of moving the droplet by causing a temperature gradient in the droplet using a point heater using an electromagnetic wave.

According to a sixth aspect of the present invention, the program applies a step of performing modeling by partially changing droplets into a solid within a predetermined modeling region and a step of performing the modeling to a computer. This is a program for executing the step of moving the droplets out of the modeling region.

According to a seventh aspect of the present invention, the program is a program for causing a computer to execute a step of moving the droplet by causing a temperature gradient in the droplet by using a point heater using an electromagnetic wave.

According to the embodiment of the present invention, when the liquid material is changed to a solid to form the target object, the burden of installing the liquid material can be reduced.

It is a schematic block diagram which shows the functional structure of the modeling system which concerns on embodiment. It is a figure which shows the example of the position where the modeling part which concerns on embodiment can focus a laser beam. It is a figure which shows the example of the positional relationship between the laser beam emitting part of the modeling part which concerns on embodiment, and a droplet. It is a figure which shows the arrangement example of the droplet which concerns on embodiment. It is a figure which shows the example of the position which the moving processing part which concerns on embodiment irradiates a heating beam. It is a figure which shows the example of the relationship of the force in a droplet when a temperature gradient is not generated. It is a figure which shows the example of the relationship of the force in a droplet when a temperature gradient occurs. It is a figure which shows the example of the direction of the force generated in the droplet in an embodiment. It is a figure which shows the example of the positional relationship between the laser light emitting part and the droplet of the moving processing part which concerns on embodiment. It is a figure which shows the structural example of the observation part which concerns on embodiment. It is a figure which shows the 1st example of the arrangement of the material which concerns on embodiment. It is a figure which shows the 2nd example of the arrangement of the material which concerns on embodiment. It is a figure which shows the 3rd example of the arrangement of the material which concerns on embodiment. It is a figure which shows the 4th example of the arrangement of the material which concerns on embodiment. It is a figure which shows the 5th example of the arrangement of the material which concerns on embodiment. It is a figure which shows the sixth example of the arrangement of the material which concerns on embodiment. It is a figure which shows the 7th example of the arrangement of the material which concerns on embodiment. It is a figure which shows the 8th example of the arrangement of the material which concerns on embodiment. It is a figure which shows the 9th example of the arrangement of the material which concerns on embodiment. It is a figure which shows the tenth example of the arrangement of the material which concerns on embodiment. It is a graph which shows the example of the relationship between the heating temperature of a droplet by the movement processing part which concerns on embodiment, and the movement distance of a droplet. It is a graph which shows the example of the relationship between the wettability of a droplet and the moving distance of a droplet according to the embodiment. It is a graph which shows the example of the relationship between the viscosity of a droplet and the moving distance of a droplet which concerns on embodiment. It is a flowchart which shows an example of the processing procedure which the control device which concerns on embodiment controls a modeling apparatus and generates an object. It is a figure which shows the 1st example of the object obtained by using the modeling apparatus which concerns on embodiment. It is a figure which shows the 1st example which copper-plated the object obtained by using the modeling apparatus which concerns on embodiment. It is a figure which shows the 2nd example of the object obtained by using the modeling apparatus which concerns on embodiment. It is a figure which shows the 2nd example which copper-plated the object obtained by using the modeling apparatus which concerns on embodiment. It is a figure which shows the 3rd example of the object obtained by using the modeling apparatus which concerns on embodiment. It is a figure which saw a part of the 5th solid matter which concerns on embodiment from the side diagonally above. It is a figure which shows the 3rd example which copper-plated the object obtained by using the modeling apparatus which concerns on embodiment. It is a figure which shows the example of the relationship between the angle of the modeling beam which concerns on embodiment, and the position of a focal point.

Hereinafter, embodiments of the present invention will be described, but the following embodiments do not limit the inventions claimed. Also, not all combinations of features described in the embodiments are essential to the means of solving the invention.
FIG. 1 is a schematic block diagram showing a functional configuration of a modeling system according to an embodiment. As shown in FIG. 1, the modeling system 1 includes a modeling device 100 and a control device 200. The modeling device 100 includes a modeling unit 110, a moving processing unit 120, and an observation unit 150. The control device 200 includes a display unit 210, an operation input unit 220, a storage unit 280, and a processing unit 290.

The modeling system 1 partially changes the liquid material into a solid to generate the target object.
The modeling device 100 is a device that executes the generation of the target object. In particular, the modeling apparatus 100 models an object by partially changing droplets of each of one or more materials into solids. A droplet referred to here is a mass of liquid that is collected by surface tension. The modeling here is to make something with a shape.

The modeling unit 110 performs modeling by partially changing the droplets of the material into a solid in the modeling region. Specifically, by irradiating the droplet with a laser beam and focusing the laser beam inside the droplet, the liquid material is changed to a solid at the position of the focal point. The modeling region referred to here is a region in which the modeling unit 110 can change the material to a solid state. Specifically, the modeling region is an region in which the modeling unit 110 can focus the laser beam.

In the following, a case where the material is a photocurable resin and the modeling unit 110 cures the photocurable resin from a liquid to a solid by stereolithography will be described as an example.
However, the method in which the modeling unit 110 performs modeling is not limited to a specific method as long as it can partially change the droplets of the material into a solid. For example, the method in which the modeling unit 110 performs modeling may be any one of photopolymerization, photocrosslink, photoreduction, or a combination thereof.

Further, the laser light used by the modeling unit 110 for modeling may be any laser light capable of curing the material, and is not limited to the laser light having a specific wavelength. For example, the modeling unit 110 may use an ultraviolet laser beam or a blue laser beam. Alternatively, the modeling unit 110 may perform modeling by a two-photon modeling method using two-photon absorption using near-infrared femtosecond-pulse laser light.

FIG. 2 shows an example of a position where the modeling unit 110 focuses the laser beam. In FIG. 2, laser light emitting portions of each of the modeling unit 110 and the moving processing unit 120 are shown. Further, the modeling apparatus 100 includes a support base 130 and a dropping port 140 in addition to the moving processing unit 120 and the modeling unit 110. On the support base 130, a glass plate substrate 810 used as a substrate for modeling an object is placed. The support base 130 supports the substrate 810. Further, the droplet 820 is placed on the substrate 810. The laser beam emitted by the modeling unit 110 is also referred to as a modeling beam B11.
FIG. 2 shows an example in which the laser beam emitting portion, the support base 130, the substrate 810, and the droplet 820 of each of the modeling unit 110 and the moving processing unit 120 are viewed from the side (horizontal direction).

The droplet 820 shown in FIG. 2 is a droplet of the material. Droplets 820 are mounted on substrate 810. The modeling unit 110 irradiates the droplet 820 passing through the modeling beam B11 with the modeling beam B11 from below the substrate 810 so as to focus on the inside of the droplet 820. The modeling beam B11 irradiated by the modeling unit 110 is focused at the point P11. Therefore, the portion of the droplet 820 at point P11 changes from a liquid to a solid.

The laser beam emitting portion of the modeling unit 110 can be moved back and forth and left and right in FIG. Further, the modeling unit 110 can move the position of the focal point of the modeling beam B11 up and down in FIG. Therefore, the modeling unit 110 can three-dimensionally move the position of the focal point of the modeling beam B11 to the top, bottom, left, right, front and back of FIG.
The modeling unit 110 moves the focal position of the modeling beam B11 in the droplet 820 along the shape of the target object, so that the material can be processed into the shape of the target object.

Further, as shown in FIG. 2, when the modeling unit 110 irradiates the modeling beam B11 from the lower side of the substrate 810, the modeling beam B11 reaches the upper surface of the droplet 820 after focusing. Therefore, the position where the modeling beam B11 is focused is not affected by the refraction according to the shape of the droplet 820 due to surface tension. In this respect, the modeling system 1 can perform the focusing alignment of the modeling beam B11 with high accuracy.
However, the modeling unit 110 may irradiate the modeling beam B11 from above the droplet 820. As a result, even when the droplet 820 is located on an opaque object such as when the droplet 820 is dropped on the upper surface of an opaque board, the droplet 820 is irradiated with the modeling beam B11 to partially irradiate the material. Can be transformed into a solid.

The cleaning liquid is dropped into the dropping port 140. This cleaning liquid is a liquid for removing the liquid material adhering to the solidified material after processing the liquid material. The dropping port 140 cleans the solid material located in the modeling region by dropping the cleaning liquid toward the modeling region. That is, the dropping port 140 removes the liquid material adhering to the solid material located in the modeling region.
However, the method by which the modeling system 1 cleans the solid material is not limited to the method of dropping the cleaning liquid from the dropping port 140. The modeling system 1 may immerse the solid material in the cleaning liquid by moving the cleaning liquid prepared in advance in the form of droplets 820, thereby cleaning the solid material.

FIG. 3 shows an example of the positional relationship between the laser beam emitting portion of the modeling portion 110 and the droplet 820. FIG. 3 shows an example in which the laser beam emitting portion of the modeling portion 110 is viewed from above. In this example, the substrate 810 supported by the support base 130 is located on the laser beam emitting portion of the modeling portion 110, and two droplets 820 of different materials are placed on the substrate 810. The two droplets 820 are droplets 821-11 of the first material and droplets 821-12 of the second material. In order to distinguish between the droplets of the material and the droplets of the cleaning liquid, the droplets of the material are designated by reference numeral 821.

Of the material droplets 821, the first material droplets 821-11 are located above the laser beam emitting portion of the modeling unit 110. When the modeling unit 110 irradiates the modeling beam B11 to focus on the droplets 821-11 of the first material, the focal portion of the droplets 821-11 changes from a liquid to a solid.
The modeling system 1 processes the first material using the droplets 821-11 of the first material, and then processes the second material using the droplets 821-12 of the second material, thereby processing the first material. It is possible to produce an object containing both the second material and the second material. For such processing, the moving processing unit 120 moves the droplet 820.

The movement processing unit 120 moves the droplet 820. Specifically, the movement processing unit 120 moves the droplet 820 by creating a temperature gradient in the droplet 820 using a point heater using electromagnetic waves.
The modeling device 100 including the movement processing unit 120 corresponds to an example of a droplet moving device.
The moving processing unit 120 irradiates the edge of the droplet 820, the substrate 810 in the vicinity of the droplet 820, or both of them with an electromagnetic wave for a point heater (for example, infrared laser light) to partially warm the droplet 820. Creates a temperature gradient. However, the electromagnetic wave used by the moving processing unit 120 for the point heater may be any electromagnetic wave other than the one that changes the liquid material into a solid, and is not limited to the electromagnetic wave of a specific frequency and the electromagnetic wave of a specific method.

FIG. 4 shows an arrangement example of the droplet 820. FIG. 4 shows an example when the substrate 810 is viewed from diagonally above. In this example, droplets 821-21 of the third material, droplets 821-22 of the fourth material, droplets 821-23 of the fifth material, and droplets of the cleaning liquid are located on the substrate 810. ing. In order to distinguish between the droplets of the material and the droplets of the cleaning liquid, the droplets of the cleaning liquid are designated by reference numeral 822.
The modeling system 1 positions each of the droplets 821-21 of the third material, the droplets 821-22 of the fourth material, and the droplets 821-23 of the fifth material in the modeling region and partially transforms them into solids. This makes it possible to produce an object including the first material, the second material, and the third material.

Further, in the modeling system 1, each time the droplets 821-21 of the third material, the droplets 821-22 of the fourth material, and the droplets 821-23 of the fifth material are partially solidified, the cleaning liquid is changed. Droplets 822 of the are moved to the build area to wash the solid material. As described above, as a method for cleaning the solid material, a method of dropping the cleaning liquid from the dropping port 140 may be used instead of the method of moving the droplet 822 of the cleaning liquid.

In the example of FIG. 4, the modeling unit 110 irradiates the modeling beam B11 from below the substrate 810. On the other hand, the moving processing unit 120 irradiates the electromagnetic wave for the point heater from above the substrate 810. The electromagnetic wave emitted by the moving processing unit 120 is also referred to as a heating beam B12. The moving processing unit 120 may irradiate the infrared laser beam as the heating beam B12. However, the electromagnetic wave emitted by the moving processing unit 120 is not limited to an electromagnetic wave having a specific frequency as long as it can give a temperature gradient to the droplet. Further, the heating beam B12 is not limited to the laser beam.

In FIG. 4, both the modeling beam B11 and the heating beam B12 are shown for explanation. However, while the modeling unit 110 is irradiating the modeling beam B11, the moving processing unit 120 does not irradiate the droplet 820 located in the modeling region with the heating beam B12. After the modeling unit 110 finishes processing the material located in the modeling area, the moving processing unit 120 irradiates the material located in the modeling area with the heating beam B12 to produce the material as a liquid in the modeling area. Move it out.

FIG. 5 shows an example of a position where the moving processing unit 120 irradiates the heating beam B12. Similar to the case of FIG. 2, in FIG. 5, the laser beam emitting portion, the support base 130 and the dropping port 140 of each of the modeling unit 110 and the moving processing unit 120, the substrate 810 mounted on the support base 130, and the substrate 810 are shown. The droplet 820 resting on is shown. Similar to the case of FIG. 2, FIG. 5 shows an example in which the laser beam emitting portion, the support base 130, the substrate 810, and the droplet 820 of each of the modeling unit 110 and the moving processing unit 120 are viewed from the side (horizontal direction). ..

FIG. 2 shows an example in which the modeling unit 110 irradiates the modeling beam B11, whereas FIG. 5 shows an example in which the moving processing unit 120 irradiates the heating beam B12. Shown.
In the example of FIG. 5, the moving processing unit 120 irradiates the substrate 810 in the vicinity of the droplet 820 with the heating beam B12. As a result, the moving processing unit 120 heats the side of the heating beam B12 of the droplet 820 to generate a temperature gradient in the droplet 820.

FIG. 6 shows an example of the force relationship in the droplet 820 when no temperature gradient occurs. In the example of FIG. 6, γ _L indicates the surface tension at the droplet 820. γ _S indicates the surface tension of the solid (surface tension on the substrate 810). γ _LS indicates solid-liquid interfacial tension. θ indicates the contact angle of the droplet 820 with respect to the substrate 810.
In the case of FIG. 6, Young's equation is expressed as equation (1).

In FIG. 6, the forces in the droplet 820 are balanced, and the droplet 820 does not move.

FIG. 7 shows an example of the relationship of forces in the droplet 820 when a temperature gradient is occurring. In the example of FIG. 7, the force on the unheated side is shown by the variable name in which "'" is added to the variable name used in FIG. Specifically, gamma _'L denotes the surface tension in the droplet 820. gamma _'S indicates the solid surface tension (surface tension at the substrate 810). gamma _'LS shows the solid-liquid interfacial tension. θ'indicates the contact angle of the droplet 820 with respect to the substrate 810.

On the other hand, in the example of FIG. 7, the force on the heated side is shown by adding "''" to the variable name. Specifically, γ'' _L indicates the surface tension of the droplet 820. γ'' _S indicates the surface tension of the solid (surface tension on the substrate 810). γ'' _LS indicates solid-liquid interfacial tension. θ'' indicates the contact angle of the droplet 820 with respect to the substrate 810.
In the example of FIG. 7, the temperature difference between the temperature _{T L (T H> T L} ) of the temperature _{T H} and the low temperature side of the high temperature side occurs, the temperature gradient is caused in the substrate 810 and the droplet 820. Due to this temperature gradient, the contact angle and surface tension change from the case of FIG. 6 on the high temperature side and the low temperature side, respectively.
In the low temperature side, the contact angle theta 'are larger than the contact angle theta in the case of FIG. 6, the surface tension γ between the liquid and the gas' horizontal component of the _L is decreased. Force acting on the interface of the low-temperature side F 'is a solid surface tension gamma' as a positive orientation of _s, it is represented by equation (2).

'It is "> 0, the force F F''direction of, the orientation and the same temperature gradient of the surface tension γ' _S of the solid is in the direction of higher to lower from the side.
On the other hand, in the high temperature side, the contact angle theta '' are smaller than the contact angle theta in the case of FIG. 6, the surface tension γ between the liquid and the gas 'horizontal component of _{the' L} increases. The force F ″ acting on the interface on the high temperature side is expressed by the equation (3) with the direction of the surface tension γ ″ _s of the solid as positive.

"F"<0", and the direction of the force F" is from the higher side to the lower side of the temperature gradient, which is opposite to the direction of the surface tension γ " _S of the solid.
FIG. 8 shows an example of the direction of the force generated in the droplet. As described above, both the direction of the force F'and the direction of the force F'are from the higher gradient temperature to the lower gradient temperature. The force F _{Total, which} is a combination of the force _{F'and the} force F'', is expressed by Eq. (4).

Since both the direction of the force F'and the direction of the force F'' are from the higher temperature gradient to the lower temperature gradient, the direction of the force F _Total is also from the higher temperature gradient to the lower temperature gradient as shown in FIG. It becomes the direction to. The droplet 820 moves from the higher temperature gradient to the lower temperature gradient by using the force F _Total as a driving force. Therefore, the droplet 820 moves in a direction away from the position where the moving processing unit 120 is heating.

FIG. 9 shows an example of the positional relationship between the laser beam emitting portion of the moving processing unit 120 and the droplet 820. FIG. 9 shows an example in which the laser beam irradiation portion of the moving processing unit 120 and the substrate 810 are viewed from diagonally above. In this example, a droplet 821-31 of the sixth material is placed on the substrate 810. Further, the region A11 shows a portion where the moving processing unit 120 irradiates the heating beam B12. The moving processing unit 120 irradiates the substrate 810 in the vicinity of the droplets 821-31 of the sixth material with the heating beam B12 to heat the substrates, thereby causing a temperature gradient in the droplets 821-31 of the sixth material.

The observation unit 150 captures an image of the target object.
FIG. 10 is a diagram showing a configuration example of the observation unit 150. In the example of FIG. 10, the observation unit 150 includes an observation light source 151, a beam splitter 152, an observation lens 153, a CCD camera 154, and a display device 155.
The observation light light source 151 irradiates the illumination light B13 for photographing the target object. The object here may be in the process of being modeled. The illumination light B13 irradiates the target object. After a part of the illumination light B13 is reflected or absorbed, the remaining light is incident on the beam splitter 152 via the laser beam emitting portion of the modeling portion 110.

In the example of FIG. 10, the observation light source 151 is located above the modeling region, like the dropping port 140 in FIG. While the observation light light source 151 irradiates the illumination light B13, the arrangement position of the dropping port 140 and the arrangement position of the observation light light source 151 may be exchanged. Alternatively, the drop port 140 may be arranged so that the position of the drop port 140 and the position of the observation light light source 151 do not overlap, such as dropping a cleaning liquid or a liquid material from diagonally above the modeling region toward the modeling region.

The beam splitter 152 includes a half mirror and reflects the illumination light B13. The beam splitter 152 receives not only the incident light B13 but also the incident beam B11 for modeling. The beam splitter 152 passes through the modeling beam B11 and advances toward the laser beam emitting portion of the modeling unit 110. Due to the reflection of the illumination light B13, the beam splitter 152 redirects the illumination light B13, which has passed the same path as the modeling beam B11 in the opposite direction to the modeling beam B11, in a direction different from the direction of the path of the modeling beam B11. ..

The observation lens 153 refracts the illumination light B13 so that the illumination light B13 forms an image at the position of the image sensor of the CCD camera 154.
The CCD camera 154 receives the illumination light B13 and performs photoelectric conversion to generate image data of the target object.
The display device 155 has a display screen such as a liquid crystal panel or an LED panel, and displays an image of an object. Specifically, the display device 155 receives the input of the image data of the target object generated by the CCD camera, and displays the image indicated by the image data.
However, the configuration and arrangement of the observation unit 150 are not limited to those shown in FIG. For example, the observation unit 150 may shoot the target object from above, or may shoot from an obliquely upward direction or an obliquely downward direction.

The control device 200 controls the modeling device 100 to generate an object. For example, the control device 200 controls the timing at which the modeling unit 110 irradiates the modeling beam B11 and the position of the focal point of the modeling beam B11. In addition, the control device 200 controls the timing at which the moving processing unit 120 irradiates the heating beam B12, the irradiation position, and the intensity of the heating beam B12. Further, the control device 200 controls the timing at which the dropping port 140 drops the cleaning liquid.
Further, the control device 200 functions as a user interface of the modeling system 1.
The control device 200 is configured by using a computer such as a personal computer or a workstation.

The display unit 210 has a display screen such as a liquid crystal panel or an LED panel, and displays various images. In particular, the display unit 210 presents information about the modeling system 1 to the user.
The display unit 210 may be configured by using the display device 155, or may be configured separately from the display device 155.
The operation input unit 220 includes an input device such as a keyboard and a mouse, and receives user operations. In particular, the operation input unit 220 receives a user operation for setting the modeling system 1.

The storage unit 280 stores various data. The storage unit 280 is configured by using the storage device included in the control device 200.
The processing unit 290 controls each unit of the control device 200 to execute various processes. The processing unit 290 is configured by a CPU (Central Processing Unit) included in the control device 200 reading a program from the storage unit 280 and executing the program.
The control device 200 may automatically control the modeling device 100 based on a preset program or the like. Alternatively, the user may input an instruction to the control device 200 online, and the control device 200 may control the modeling device 100 according to the user's instruction.

Next, the replacement of the droplet 820 located in the modeling region will be described with reference to FIGS. 11 to 20.
FIG. 11 shows a first example of material placement. FIG. 11 shows an example of the arrangement of materials at the start of the process in which the modeling system 1 produces an object. In the example of FIG. 11, a droplet 821-41 of the seventh material and a droplet 821-42 of the eighth material different from the seventh material are placed on the substrate 810. Further, the area A21 indicates a modeling area.
From the state of FIG. 11, the modeling unit 110 irradiates the modeling beam B11 on the droplets 821-41 of the seventh material located in the modeling region (region A21), and one of the droplets 821-41 of the seventh material. Change the part from liquid to solid.

FIG. 12 is a diagram showing a second example of material arrangement. In the example of FIG. 12, the positions of the substrate 810, the droplet 821-41 of the seventh material, the droplet 821-42 of the eighth material, and the region A21 are the same as in the case of FIG. On the other hand, the example of FIG. 12 is different from the case of FIG. 11 in that the solid matter 840 is contained in the droplet 821-41 of the seventh material.
The solid matter 840 in FIG. 12 is the solid matter 840-41 of the seventh material, and corresponds to an example of the target product in the process of being produced. Specifically, from the state of FIG. 11, the modeling unit 110 irradiates the droplets 821-41 of the seventh material with the modeling beam B11 to make a part of the droplets 821-41 of the seventh material from liquid to solid. The solid matter 840-41 of the seventh material of FIG. 12 was changed to.

FIG. 13 shows a third example of material placement. In the example of FIG. 13, the positions of the substrate 810, the droplets 821-42 of the eighth material, the solid matter 840-41 of the seventh material, and the region A21 are the same as in the case of FIG. On the other hand, the example of FIG. 13 is different from the case of FIG. 12 in that the droplet 821-41 of the seventh material moves from the inside to the outside of the region A21.
FIG. 12 shows an example of a state in which the modeling unit 110 has finished processing the droplets 821-41 of the seventh material. The movement processing unit 120 moves the droplets 821-41 of the seventh material after the end of use from the inside to the outside of the region A21, so that the state shown in FIG. 13 is obtained. The movement processing unit 120 moves the droplets, but does not move the solid material. In the example of FIG. 13, the droplets 821-41 of the seventh material are moving from the inside to the outside of the region A21, while the solid matter 840-41 of the seventh material remains in the region A21.

FIG. 14 shows a fourth example of material placement. In the example of FIG. 14, the positions of the substrate 810, the droplets 821-41 of the seventh material, the droplets 821-42 of the eighth material, the solid matter 840-41 of the seventh material, and the region A21 are the same as in FIG. Is. On the other hand, FIG. 14 is different from the case of FIG. 13 in that the cleaning liquid droplet 822 is located in the region A21.
From the state of FIG. 13, the dropping port 140 drops the cleaning liquid into the modeling region (region A21) to reach the state of FIG. In the state of FIG. 13, the droplet 821-41 of the seventh material has moved out of the region A21, but the liquid seventh material remains on the surface of the solid material 840-41 of the seventh material. .. Therefore, the dropping port 140 drops the cleaning liquid into the region A21 and immerses the solid substance 840-41 of the seventh material in the cleaning liquid. As a result, the modeling system 1 cleans the surface of the solid material 840-41 of the seventh material. Specifically, the modeling system 1 removes the liquid seventh material adhering to the surface of the solid matter 840-41 of the seventh material.

FIG. 15 shows a fifth example of material placement. In the example of FIG. 15, the positions of the substrate 810, the droplets 821-41 of the seventh material, the droplets 821-42 of the eighth material, the solid matter 840-41 of the seventh material, and the region A21 are the same as in FIG. Is. On the other hand, FIG. 15 is different from the case of FIG. 14 in that droplets 822 of the cleaning liquid are removed from the substrate 810.
From the state of FIG. 14, the moving processing unit 120 moves the cleaning liquid droplets 822 from the inside of the region A21 to the outside of the upper surface of the substrate 810, whereby the cleaning liquid droplets 822 are removed from the substrate 810, and FIG. It becomes the state of.

FIG. 16 shows a sixth example of material placement. In the example of FIG. 16, the positions of the substrate 810, the droplets 821-41 of the seventh material, the solid matter 840-41 of the seventh material, and the region A21 are the same as in the case of FIG. On the other hand, FIG. 16 is different from the case of FIG. 15 in that the droplet 821-42 of the eighth material moves from the outside to the inside of the region A21.
From the state of FIG. 15, the movement processing unit 120 moves the droplet 821-42 of the eighth material into the region A21, so that the state of FIG. 16 is obtained.

FIG. 17 shows a seventh example of material placement. In the example of FIG. 17, the positions of the substrate 810, the droplets 821-41 of the seventh material, the droplets 821-42 of the eighth material, the solid matter 840-41 of the seventh material, and the region A21 are the same as in FIG. Is. On the other hand, FIG. 17 is different from the case of FIG. 16 in that the solid matter 840-42 of the eighth material is present in addition to the solid matter 840-41 of the seventh material in the droplet 821-42 of the eighth material. In the example of FIG. 17, the solid matter 840-41 of the seventh material and the solid matter 840-42 of the eighth material constitute the solid matter 840.
From the state of FIG. 16, the modeling unit 110 irradiates the droplets 821-42 of the eighth material with the modeling beam B11 to change a part of the droplets 821-42 of the eighth material from liquid to solid. , 840-42 solid matter of the eighth material of FIG.

FIG. 18 shows an eighth example of material placement. In the example of FIG. 18, the positions of the substrate 810, the droplet 821-41 of the seventh material, the solid matter 840-41 of the seventh material, the solid matter 840-42 of the eighth material, and the region A21 are the same as in the case of FIG. Is. On the other hand, FIG. 18 is different from the case of FIG. 17 in that the droplet 821-42 of the eighth material moves from the inside to the outside of the region A21.
FIG. 17 shows an example of a state in which the modeling unit 110 has finished processing the droplets 821-42 of the eighth material. The movement processing unit 120 moves the droplets 821-42 of the eighth material after the end of use from the inside to the outside of the area A21, so that the state shown in FIG. 18 is obtained. As described above, the moving processing unit 120 moves the droplets, but does not move the solid material. Also in the example of FIG. 18, the droplet 821-42 of the eighth material is moving from the inside to the outside of the region A21, while the solid matter 840-42 of the eighth material remains in the region A21.

FIG. 19 shows a ninth example of material arrangement. In the example of FIG. 19, the substrate 810, the droplet 821-41 of the seventh material, the droplet 821-42 of the eighth material, the solid matter 840-41 of the seventh material, the solid matter 840-42 of the eighth material, and the region A21. The position of is the same as in the case of FIG. On the other hand, FIG. 19 is different from the case of FIG. 18 in that droplets 822 of the cleaning liquid are present in the region A21.
From the state of FIG. 18, the dropping port 140 drops the cleaning liquid into the modeling region (region A21) to reach the state of FIG. In the state of FIG. 18, the droplet 821-42 of the eighth material has moved out of the region A21, but the liquid eighth material remains on the surface of the solid material 840. Therefore, the dropping port 140 drops the cleaning liquid into the region A21 and immerses the solid matter 840 in the cleaning liquid. As a result, the modeling system 1 cleans the surface of the solid material 840. Specifically, the modeling system 1 removes the liquid eighth material adhering to the surface of the seventh material solid 840-41 and the surface of the eighth material solid 840-42.

FIG. 20 shows a tenth example of material arrangement. In the example of FIG. 20, the substrate 810, the droplet 821-41 of the seventh material, the droplet 821-42 of the eighth material, the solid matter 840-41 of the seventh material, the solid matter 840-42 of the eighth material, and the region A21. The position of is the same as in the case of FIG. On the other hand, FIG. 20 is different from the case of FIG. 19 in that droplets 822 of the cleaning liquid are removed from the substrate 810.
From the state of FIG. 19, the moving processing unit 120 moves the cleaning liquid droplets 822 from the inside of the region A21 to the outside of the upper surface of the substrate 810, whereby the cleaning liquid droplets 822 are removed from the substrate 810, and FIG. 20 It becomes the state of.
The solid material 840 in FIG. 20 corresponds to an example of a completed target product. As described above, in the examples of FIGS. 11 to 20, the modeling system 1 produces a multi-material object using a plurality of materials such as the seventh material and the eighth material.

When moving the droplet 820, the movement processing unit 120 may move the laser light emitting portion while emitting the heating beam B12 from the laser light emitting portion. By moving the laser beam irradiation portion so that the movement processing unit 120 follows the moving droplet 820, the droplet 820 can be continuously moved, whereby the moving distance of the droplet 820 can be adjusted.
Alternatively, the movement processing unit 120 may irradiate a laser beam having an intensity corresponding to the distance to which the droplet 820 is moved. The moving distance of the droplet 820 can be adjusted by the intensity of the laser beam (heating beam B12) irradiated by the moving processing unit 120.

FIG. 21 is a graph showing an example of the relationship between the heating temperature of the droplet 820 by the moving processing unit 120 and the moving distance of the droplet 820. FIG. 21 shows the heating temperature and the moving distance of the droplet 820 when the heating temperature of the droplet 820 is adjusted by adjusting the intensity of the heating beam B12 without moving the laser light emitting portion of the moving processing unit 120. An example of the relationship with is shown. The heating temperature referred to here is the temperature of the region of the substrate 810 where the heating beam B12 is most focused and heated.
FIG. 21 shows an example in which a droplet of acrylate resin is used as the droplet 820.

In the graph of FIG. 21, the horizontal axis represents time and the vertical axis represents the moving distance of the droplet 820.
The lines L11, L12, L13, and L14 show an example of the relationship between the elapsed time and the moving distance of the droplet when the heating temperatures are 75 ° C., 95 ° C., 130 ° C., and 160 ° C., respectively. In any of the lines L11, L12, L13, and L14, the droplet travels a certain distance depending on the heating temperature, and thereafter, it does not move substantially and stays in place.
In the example of FIG. 21, the larger the heating temperature, the larger the moving distance of the droplet 820 (the moving distance until the droplet 820 approximately stops moving).

Therefore, depending on the required movement distance at which the movement processing unit 120 should move the droplet 820, the larger the required movement distance, the larger the amount of heating by the point heater may be. The magnitude of the heating temperature can be adjusted by the magnitude of the voltage applied to the point heater of the moving processing unit 120. The larger the voltage applied to the point heater of the movement processing unit 120, the larger the movement distance of the droplet 820.

FIG. 22 is a graph showing an example of the relationship between the wettability of the droplet 820 and the moving distance of the droplet 820. FIG. 22 shows the wettability of the droplet 820 due to the surface characteristics of the substrate 810 and the wettability of the droplet 820 when the intensity of the heating beam B12 is the same without moving the laser beam emitting portion of the moving processing unit 120. An example of the relationship with the travel distance is shown. In the example of FIG. 22, a droplet of acrylate resin is used as the droplet 820, and the heating temperature is set to 130 ° C.

In the graph of FIG. 22, the horizontal axis represents time and the vertical axis represents the moving distance of the droplet 820.
The lines L21, L22, and L23 are different from each other when the surface of the substrate 810 is coated with fluorine, when the surface of the substrate 810 is not treated, or when the surface of the substrate 810 is subjected to a silane coupling treatment of an organic functional group. An example of the relationship between time and the moving distance of a droplet is shown.
The wettability of the droplet 820 was the smallest in the case of the fluorine coating (line L21), and the contact angle of the droplet 820 was 66 °. Next, when the surface treatment of the substrate 810 was not performed (line L22), the wettability was small, and the contact angle of the droplet 820 was 20 °. In the case of the silane coupling treatment of the organic functional group (line L23), the wettability was the largest, and the contact angle of the droplet 820 was 12 °.

In any of the lines L21, L22, and L23, the droplet travels a certain distance depending on the wettability, and thereafter, it does not move substantially and stays in place.
In the example of FIG. 22, the greater the wettability of the droplet 820, the greater the moving distance of the droplet 820 (the moving distance until the droplet 820 is approximately immobile).
Therefore, the moving distance of the droplet 820 may be adjusted by treating the surface of the substrate 810. For example, the intensity of the laser beam (heating beam B12) output by the moving processing unit 120 by subjecting the surface of the substrate 810 to a treatment for increasing the wettability of the droplet 820, such as a silane coupling treatment of an organic functional group. Can be made relatively small, and the moving distance of the droplet 820 can be secured.

Alternatively, the moving processing unit 120 may increase the amount of heating by the point heater as the wettability is smaller, depending on the wettability of the droplet 820. Thereby, the influence of the wettability on the moving distance of the droplet 820 can be reduced, and in this respect, the moving distance of the droplet 820 can be brought close to constant regardless of the wettability.

Further, as in the case of the fluorine coating (line L21), when the moving surface of the droplet 820 is water-repellent, the property that the droplet 820 hardly moves may be positively utilized.
For example, the surface of the substrate 810 may be patterned with a fluorine coating to pattern the path of movement of the droplet 820. Since the droplet 820 moves away from the fluorine-coated portion, the fluorine-coated pattern allows the droplet 820 to move along a specific path (non-fluorine-coated path). In this way, the movement processing unit 120 may move the droplet 820 on the surface on which the water-repellent material is partially arranged.

FIG. 23 is a graph showing an example of the relationship between the viscosity of the droplet 820 and the moving distance of the droplet 820. FIG. 23 shows the viscosity of the droplet 820 (viscosity of the material) and the moving distance of the droplet 820 when the laser light emitting portion of the moving processing unit 120 is not moved and the intensity of the heating beam B12 is the same. An example of the relationship is shown. In the example of FIG. 23, the heating temperature is set to 130 ° C. Further, the surface of the substrate 810 is subjected to a silane coupling treatment of an organic functional group to make the wettability conditions the same.

In the graph of FIG. 23, the horizontal axis represents time and the vertical axis represents the moving distance of the droplet 820.
Lines L31, L32, and L33 show examples of the relationship between the elapsed time and the moving distance of the droplets of the methacrylate resin, the acrylate resin droplets, and the cleaning liquid, respectively.
Regarding the viscosity of the droplet 820, the case of the methacrylate resin (line L31) was the largest. The viscosity of the methacrylate resin droplets was 1802 cps. Next, in the case of the acrylate resin (line L32), the viscosity was large, and the viscosity was 95 cps. In the case of the cleaning liquid (line L33), the viscosity was the smallest, and the viscosity was 7.4 cps.

In any of the lines L31, L32, and L33, the droplet travels a certain distance depending on the viscosity, and thereafter, it does not move substantially and stays in place.
In the example of FIG. 23, the larger the viscosity of the droplet 820, the smaller the moving distance of the droplet 820 (the moving distance until the droplet 820 is approximately immobile).
Therefore, the moving processing unit 120 may increase the amount of heating by the point heater as the viscosity increases according to the viscosity of the droplet 820. Thereby, the influence of the viscosity on the moving distance of the droplet 820 can be reduced, and in this respect, the moving distance of the droplet 820 can be brought close to constant regardless of the viscosity.

Next, the operation of the modeling system 1 will be described with reference to FIG. 24.
FIG. 24 is a flowchart showing an example of a processing procedure in which the control device 200 controls the modeling device 100 to generate an object.
In the process of FIG. 24, the control device 200 controls the modeling unit 110 to perform the modeling process (step S101). The modeling unit 110 irradiates the material droplet 821 in the modeling area with the modeling beam B11 under the control of the control device 200 to focus the modeling beam B11 in the material droplet 821. The material changes from liquid to solid at the focal point.

Next, the control device 200 controls the movement processing unit 120 to retract the material droplet 821 out of the modeling region (step S102). The movement processing unit 120 moves the droplet 821 of the material in the modeling region to the outside of the modeling region under the control of the control device 200.
Next, the control device 200 controls the dropping port 140 to drop the cleaning liquid (step S103). The dropping port 140 drops the cleaning liquid into the modeling region under the control of the control device 200. This dripping cleans the solid material within the build area.

Next, the control device 200 controls the movement processing unit 120 to remove the droplets 822 of the cleaning liquid (step S104). The movement processing unit 120 moves the droplets 822 of the cleaning liquid in the modeling region to the outside of the substrate 810 under the control of the control device 200. By this movement, the movement processing unit 120 removes the droplets 822 of the cleaning liquid from the top of the substrate 810.
Next, the control device 200 determines whether or not the target object is completed (step S105). When it is determined that the target object is completed (step S105: YES), the control device 200 ends the process of FIG. 24.

On the other hand, when it is determined that the target object is not completed (step S105: NO), the control device 200 controls the movement processing unit 120 to move the droplet 821 of the material to be used next to the modeling region (step S105: NO). Step S106). The movement processing unit 120 moves the droplet 821 of the material to be used next from the outside of the modeling region to the inside of the modeling region under the control of the control device 200.
After step S106, the process returns to step S101.

Next, an example of the target object obtained by using the modeling apparatus 100 will be described with reference to FIGS. 25 to 31.
FIG. 25 shows a first example of an object obtained by using the modeling apparatus 100. The first solid 840a shown in FIG. 25 contains a methacrylate solid 840-51 and an acrylate solid 840-52. The first solid matter 840a corresponds to an example of a target object obtained by using the modeling apparatus 100.

The moving processing unit 120 moves each of the methacrylate droplet and the acrylate droplet to the modeling region, and the modeling unit 110 performs processing using each of these droplets. This makes it possible to produce a multi-material target product containing methacrylate and acrylate, such as the first solid product 840a.
Further, as shown in FIG. 25 on a scale of 50 μm (micrometer), a minute target object can be generated by using the modeling apparatus 100.

FIG. 26 shows a first example in which a target object obtained by using the modeling apparatus 100 is copper-plated. The second solid matter 840b shown in FIG. 26 is obtained by subjecting the first solid matter 840a shown in FIG. 25 to electroless copper plating.
Of the methacrylate solid 840-51 and the acrylate solid 840-52 shown in FIG. 25, the acrylate solid 840-52 is copper-plated, while the methacrylate solid 840-51 is copper-plated. Is not applied. The second solid 840b of FIG. 26 contains a methacrylate solid 840-51 and copper plating 840-53. By producing a multi-material target product containing methacrylate and acrylate in this way, the obtained target product can be selectively plated.

FIG. 27 shows a second example of the target object obtained by using the modeling apparatus 100. The third solid 840c shown in FIG. 27 contains a methacrylate solid 840-51 and an acrylate solid 840-52. The third solid material 840c corresponds to an example of a target product obtained by using the modeling apparatus 100.
The moving processing unit 120 moves each of the methacrylate droplet and the acrylate droplet to the modeling region, and the modeling unit 110 performs processing using each of these droplets. This makes it possible to produce a multi-material target product containing methacrylate and acrylate, such as the third solid product 840c.

Further, as shown in FIG. 27 on a scale of 50 μm, the modeling apparatus 100 can be used to generate a minute target object.
Further, the third solid material 840c is a pyramid-shaped solid material obtained by stacking square plate-shaped solid materials. In this way, the modeling device 100 can be used to generate a three-dimensional object.

FIG. 28 shows a second example in which the target object obtained by using the modeling apparatus 100 is copper-plated. The fourth solid material 840d shown in FIG. 28 is obtained by subjecting the third solid material 840c shown in FIG. 27 to electroless copper plating.
Of the methacrylate solid 840-51 and the acrylate solid 840-52 of FIG. 27, the acrylate solid 840-52 is copper-plated, while the methacrylate solid 840-51 is copper-plated. Is not applied. The fourth solid 840d of FIG. 28 contains a methacrylate solid 840-51 and copper plating 840-53. By producing a multi-material target product containing methacrylate and acrylate in this way, the obtained target product can be selectively plated.

FIG. 29 shows a third example of the target object obtained by using the modeling apparatus 100. The fifth solid 840e shown in FIG. 29 contains a methacrylate solid 840-51 and an acrylate solid 840-52. The fifth solid material 840e corresponds to an example of a target product obtained by using the modeling apparatus 100.
The moving processing unit 120 moves each of the methacrylate droplet and the acrylate droplet to the modeling region, and the modeling unit 110 performs processing using each of these droplets. This makes it possible to produce a multi-material target product containing methacrylate and acrylate, such as the third solid product 840c.

FIG. 30 is a view of a part of the fifth solid material 840e viewed from diagonally above. As shown in FIGS. 29 and 30, the fifth solid material 840e has a cavity inside. In this way, the modeling device 100 can be used to generate a three-dimensional object having a cavity inside.
Further, as shown in FIG. 30 with a scale of 6.66 μm, the modeling apparatus 100 can be used to generate a minute target object.

FIG. 31 shows a third example in which the target object obtained by using the modeling apparatus 100 is copper-plated. The sixth solid material 840f shown in FIG. 31 is obtained by subjecting the fifth solid material 840e shown in FIGS. 29 and 30 to electroless copper plating.
Of the methacrylate solid 840-51 and the acrylate solid 840-52 of FIGS. 29 and 30, the acrylate solid 840-52 is copper-plated, but the methacrylate solid 840-51 Is not copper plated. The sixth solid 840f in FIG. 31 contains a methacrylate solid 840-51 and copper plating 840-53. By producing a multi-material target product containing methacrylate and acrylate in this way, the obtained target product can be selectively plated.

As described above, the movement processing unit 120 moves the droplet 820. The modeling unit 110 performs modeling by partially changing the droplet 820 into a solid within a predetermined modeling area.
In this way, since the movement processing unit 120 moves the droplet 820, the user does not need to manually arrange the droplet in the modeling region, for example, by dropping the liquid material on the substrate 810 with a dropper. According to the modeling apparatus 100, in this respect, when the liquid material is changed to a solid to form the target object, the burden of installing the liquid material can be reduced.

Further, the movement processing unit 120 moves the droplet 820 by causing a temperature gradient in the droplet 820 using a point heater using electromagnetic waves.
As a result, the droplet 820 can be moved with a relatively simple configuration in which the modeling apparatus 100 includes a point heater using electromagnetic waves.

In addition, the movement processing unit 120 moves the droplet 820 on the surface on which the water-repellent material is partially arranged.
By showing the path of movement of the droplet 820 using a water-repellent material, the droplet 820 can be moved along a specific path.

Further, the movement processing unit 120 increases the amount of heating by the point heater as the required movement distance increases according to the required movement distance to move the droplet 820.
Since the moving distance of the droplet 820 increases as the heating amount by the point heater increases, the modeling apparatus 100 adjusts the moving amount of the droplet 820 according to the required moving amount by adjusting the heating amount by the point heater. be able to.

Further, the moving processing unit 120 increases the amount of heating by the point heater as the wettability becomes smaller according to the wettability of the droplet 820.
Thereby, the influence of the wettability on the moving distance of the droplet 820 can be reduced, and in this respect, the moving distance of the droplet 820 can be brought close to constant regardless of the wettability.

Further, the moving processing unit 120 increases the amount of heating by the point heater as the viscosity increases according to the viscosity of the droplet 820.
Thereby, the influence of the viscosity on the moving distance of the droplet 820 can be reduced, and in this respect, the moving distance of the droplet 820 can be brought close to constant regardless of the viscosity.

Further, the movement processing unit 120 moves the droplets 821 of a plurality of types of materials at different timings. The droplets 821 of the plurality of materials are independent of each other. The modeling unit 110 performs modeling using each of the droplets 821 of a plurality of types of materials in the modeling area.
As a result, the modeling apparatus 100 can generate an object containing a plurality of types of materials.

Further, the moving processing unit 120 moves the material droplets 821 and the cleaning liquid droplets 822 at different timings. The modeling unit 110 models the droplets 821 of the material in the modeling area.
As a result, the user does not need to manually move not only the movement of the material droplets 821 but also the movement of the cleaning liquid droplets 822. According to the modeling apparatus 100, the burden on the user is light in this respect.

Further, the modeling unit 110 irradiates the droplet 820 on the substrate 810 through which the laser beam (modeling beam B11) is transmitted with the laser beam from below the substrate 810 so as to focus on the inside of the droplet 820. ..
When the modeling unit 110 irradiates the laser beam from the lower side of the substrate 810, the laser beam reaches the upper surface of the droplet 820 after focusing. Therefore, the position where the laser beam is focused is not affected by the refraction according to the shape of the droplet 820 due to surface tension. In this respect, the modeling system 1 can perform the focusing of the laser beam with high accuracy.

The method of changing the position where the modeling beam B11 is focused is not limited to the method of changing the position of the laser beam emitting portion of the modeling unit 110. The support base 130 may be moved instead of the laser light emitting portion of the modeling unit 110.
Alternatively, the angle at which the laser beam emitting portion of the modeling unit 110 emits the modeling beam B11 may be changed.

FIG. 32 shows an example of the relationship between the angle of the modeling beam B11 and the position of the focal point.
In the example of FIG. 32, the laser beam emitting portion of the modeling unit 110 functions as an objective lens and refracts the modeling beam incident from the side opposite to the droplet 820 (lower side of FIG. 32) to the side of the droplet 820 (the lower side of FIG. 32). Irradiate to the upper side of FIG. 32).
The angle of incidence of the modeling beam B11 on the laser beam emitting portion of the modeling unit 110 is indicated by θ _I. The emission angle of the modeling beam B11 from the laser beam emitting portion of the modeling unit 110 is indicated by θ _O. The exit angle θ _O changes according to the incident angle θ _I. As the exit angle θ _O changes, the position of the point P11 where the modeling beam B11 focuses also changes. Therefore, the modeling unit 110 does not need to change either the position of the laser light emitting portion or the position of the substrate 810 by changing the incident angle θ _I of the modeling beam B11 to the laser light emitting portion for modeling. The position where the beam B11 focuses can be changed.
As a method of changing the incident angle θ _I , for example, a method of providing a mirror between the light source of the modeling beam B11 and the laser beam emitting portion of the modeling unit 110 and changing the direction of the mirror can be used.

In addition, the dropping port 140 may drop the liquid material into the modeling region in addition to the cleaning liquid or instead of the cleaning liquid. In this case, the modeling unit 110 irradiates the modeling beam B11 with respect to the material droplet 820 dropped in the modeling area by the dropping port 140 to solidify a part of the material droplet 820. After that, the moving processing unit 120 irradiates the heating beam B12 to move the material droplets 820 out of the modeling region. As a result, modeling can be performed in the same manner as in the case where the movement processing unit 120 moves the droplet 820 of the material into the modeling region as described above.

A program for realizing all or part of the functions of the processing performed by the control device 200 is recorded on a computer-readable recording medium, and the program recorded on the recording medium is read by the computer system and executed. By doing so, each part may be processed. The term "computer system" as used herein includes hardware such as an OS and peripheral devices.
In addition, the "computer system" includes a homepage providing environment (or display environment) if a WWW system is used.
Further, the "computer-readable recording medium" refers to a portable medium such as a flexible disk, a magneto-optical disk, a ROM, or a CD-ROM, or a storage device such as a hard disk built in a computer system. Further, the above-mentioned program may be a program for realizing a part of the above-mentioned functions, and may further realize the above-mentioned functions in combination with a program already recorded in the computer system.

Although the embodiments of the present invention have been described in detail with reference to the drawings, the specific configuration is not limited to this embodiment, and design changes and the like within a range not deviating from the gist of the present invention are also included.

The present invention may be applied to a modeling device, a droplet moving device, an object production method, a droplet moving method and a program.

1 Modeling system 100 Modeling device 110 Modeling unit 120 Moving processing unit 130 Support stand 140 Drop port 200 Control device 210 Display unit 220 Operation input unit 280 Storage unit 290 Processing unit

Claims (15)

A movement processing unit that moves droplets,
A modeling part that performs modeling by partially changing the droplet into a solid within a predetermined modeling area,
A modeling device equipped with. The modeling apparatus according to claim 1, wherein the movement processing unit moves the droplets by causing a temperature gradient in the droplets by using a point heater using an electromagnetic wave. The modeling apparatus according to claim 2, wherein the moving processing unit moves the droplets on a surface on which a water-repellent material is partially arranged. The modeling apparatus according to claim 2 or 3, wherein the movement processing unit increases the amount of heating by the point heater as the distance to which the droplets should be moved increases. The modeling apparatus according to any one of claims 2 to 4, wherein the moving processing unit increases the amount of heating by the point heater as the wettability of the droplets becomes smaller. The modeling apparatus according to any one of claims 2 to 5, wherein the moving processing unit increases the amount of heating by the point heater as the viscosity of the droplet increases. The movement processing unit moves a plurality of droplets made of different types of materials at different timings.
The modeling portion performs the modeling by partially changing each of the plurality of droplets into a solid within the modeling region.
The modeling apparatus according to any one of claims 1 to 6. The movement processing unit moves the droplets that are the material of the target object and the droplets of the cleaning liquid at different timings.
The modeling portion forms the target object by partially changing the droplets that are the material of the target object into a solid in the modeling region.
The modeling apparatus according to any one of claims 1 to 7. Any of claims 1 to 8, wherein the modeling unit irradiates the droplets on the substrate through which the laser beam is transmitted with the laser beam from under the substrate so as to focus on the droplets. The modeling apparatus described in item 1. A plurality of droplets made of different types of materials as well as a target material are moved at different timings, and the droplets of the cleaning liquid are moved at a timing different from the timing at which the plurality of droplets are moved. With the movement processing unit
A modeling unit that models the target object by partially changing the plurality of droplets into a solid within a predetermined modeling region.
A modeling device equipped with. A droplet moving device including a moving processing unit that moves the droplet by causing a temperature gradient in the droplet using a point heater using an electromagnetic wave. The process of modeling by partially changing the droplet into a solid within a predetermined modeling area,
A step of moving the droplet after applying the step of performing the modeling to the outside of the modeling area,
Object production method including. A method for moving a droplet, which comprises a step of moving the droplet by creating a temperature gradient in the droplet using a point heater using an electromagnetic wave. On the computer
The process of modeling by partially changing the droplet into a solid within a predetermined modeling area,
A step of moving the droplet after applying the step of performing the modeling to the outside of the modeling area,
A program to execute. On the computer
A program for executing a step of moving a droplet by creating a temperature gradient in the droplet using a point heater using an electromagnetic wave.