WO2019156170A1 - Shaping apparatus, droplet movement device, target object production method, droplet movement method, and program - Google Patents

Abstract

This shaping apparatus is provided with: a movement processing part for moving a droplet; and a shaping part for performing shaping by partially changing the droplet into a solid body in a predetermined shaping area.

Description

Modeling device, droplet moving device, object production method, droplet moving method and program

The present invention relates to a modeling apparatus, a droplet moving device, an object production method, a droplet moving method, and a program.
This application claims priority based on Japanese Patent Application No. 2018-20556 filed on Feb. 7, 2018, the entire disclosure of which is incorporated herein.

Stereolithography is one of the methods that can form a three-dimensional object. In optical modeling, a target object is modeled by applying light such as ultraviolet laser light to a liquid material to partially change the material into a solid.
In relation to stereolithography, Non-Patent Document 1 discloses a method of modeling a silver microstructure by photoreduction. In the method described in Non-Patent Document 1, the aqueous solution containing silver ions is irradiated with laser light to condense silver into a target shape, and then the aqueous solution is removed.

Non-Patent Document 2 shows an experimental example in which stereolithography is performed by combining a plurality of materials. In the experimental example described in Non-Patent Document 2, an acrylic resin and a methacrylic resin are formed by photopolymerization, and then the magnetic material is electrolessly plated. As a result, only acrylic resin is selectively plated out of acrylic resin and methacrylic resin.
In this way, an object having various characteristics can be modeled by performing optical modeling using a plurality of types of materials.

When forming a target object by changing the liquid material to solid as in optical modeling or photoreduction, it is necessary to install the liquid material in an area where modeling is performed, such as a laser light irradiation range. Such a method is a burden on the user who performs the installation. In particular, when modeling is performed using a plurality of materials, it is necessary to clean the target object during modeling each time the material is replaced, and to place the cleaned target object and the next material in an area where modeling is performed. is there. For this reason, the burden of the user who performs work is large. Further, when performing precision machining such as when the target is small, the installation position and orientation accuracy are required when installing the cleaned target, and the burden on the user who performs the work is further increased.

The present invention relates to a modeling apparatus, a droplet moving device, a target object production method, and a droplet moving method that can reduce the burden of installing a liquid material when modeling a target object by changing the liquid material into a solid. Methods and programs are provided.

According to the first aspect of the present invention, the modeling apparatus includes a movement processing unit that moves a droplet, a modeling unit that performs modeling by partially changing the droplet into a solid within a predetermined modeling region, Is provided.

The movement processing unit may move the droplets by generating a temperature gradient in the droplets using a point heater using electromagnetic waves.

The movement processing unit may move the droplet on a surface on which a water-repellent material is partially arranged.

The movement processing unit may increase the amount of heating by the point heater as the distance to which the droplet is to be moved is larger.

The movement processing unit may increase the heating amount by the point heater as the wettability of the droplet is smaller.

The movement processing unit may increase the amount of heating by the point heater as the viscosity of the droplet increases.

The movement processing unit moves each of a plurality of droplets made of different types of materials at different timings, and the modeling unit partially changes each of the plurality of droplets into a solid within the modeling region. You may make it perform the said modeling.

The movement processing unit moves each of a droplet that is a material of the target object and a droplet of the cleaning liquid at different timings, and the modeling unit is a droplet that is a material of the target object in the modeling region The object may be shaped by partially changing to a solid. *

The modeling unit may irradiate the laser beam from below the substrate so that the droplet placed on the substrate through which the laser beam is transmitted is focused in the droplet.

According to the second aspect of the present invention, the modeling apparatus moves each of a plurality of droplets made of different types of materials as the material of the object at different timings, and moves the plurality of droplets A movement processing unit that moves the droplets of the cleaning liquid at a timing different from the timing of the modeling, and a modeling unit that models the object by partially changing the plurality of droplets into a solid within a predetermined modeling region, Is provided.

According to the third aspect of the present invention, the droplet moving device includes a movement processing unit that moves the droplet by generating a temperature gradient in the droplet using a point heater using electromagnetic waves.

According to the fourth aspect of the present invention, the object production method includes a step of performing modeling by partially changing a droplet into a solid within a predetermined modeling region, and a step of performing the modeling after application. Moving the droplets out of the modeling area.

According to the fifth aspect of the present invention, the droplet moving method includes a step of moving the droplet by generating a temperature gradient in the droplet using a point heater using electromagnetic waves.

According to the sixth aspect of the present invention, the program causes the computer to perform modeling by changing the droplet partially into a solid within a predetermined modeling area, and after applying the modeling. And a step of moving a droplet out of the modeling area.

According to the seventh aspect of the present invention, the program is a program for causing a computer to execute a step of moving the droplet by generating a temperature gradient in the droplet using a point heater by electromagnetic waves.

According to the embodiment of the present invention, when a liquid material is changed to a solid and an object is formed, the burden of installing the liquid material can be reduced.

It is a schematic block diagram which shows the function structure of the modeling system which concerns on embodiment. It is a figure which shows the example of the position where the modeling part which concerns on embodiment forms the focus of a laser beam. It is a figure which shows the example of the positional relationship of the laser beam emission part of the modeling part which concerns on embodiment, and a droplet. It is a figure which shows the example of arrangement | positioning of the droplet which concerns on embodiment. It is a figure which shows the example of the position where the movement process part which concerns on embodiment irradiates the beam for a heating. It is a figure which shows the example of the relationship of the force in the droplet when the temperature gradient has not arisen. It is a figure which shows the example of the relationship of the force in the droplet in case the temperature gradient has arisen. It is a figure which shows the example of direction of the force which arises in a droplet in embodiment. It is a figure which shows the example of the positional relationship of the laser beam emission part and droplet of the movement process part which concern on embodiment. It is a figure which shows the structural example of the observation part which concerns on embodiment. It is a figure which shows the 1st example of arrangement | positioning of the material which concerns on embodiment. It is a figure which shows the 2nd example of arrangement | positioning of the material which concerns on embodiment. It is a figure which shows the 3rd example of arrangement | positioning of the material which concerns on embodiment. It is a figure which shows the 4th example of arrangement | positioning of the material which concerns on embodiment. It is a figure which shows the 5th example of arrangement | positioning of the material which concerns on embodiment. It is a figure which shows the 6th example of arrangement | positioning of the material which concerns on embodiment. It is a figure which shows the 7th example of arrangement | positioning of the material which concerns on embodiment. It is a figure which shows the 8th example of arrangement | positioning of the material which concerns on embodiment. It is a figure which shows the 9th example of arrangement | positioning of the material which concerns on embodiment. It is a figure which shows the 10th example of arrangement | positioning of the material which concerns on embodiment. It is a graph which shows the example of the relationship between the heating temperature of the droplet by the movement process part which concerns on embodiment, and the movement distance of a droplet. It is a graph which shows the example of the relationship between the wettability of the droplet which concerns on embodiment, and the movement distance of a droplet. It is a graph which shows the example of the relationship between the viscosity of the droplet concerning embodiment, and the movement distance of a droplet. It is a flowchart which shows the example of the process sequence which the control apparatus which concerns on embodiment controls the modeling apparatus and produces | generates the target object. It is a figure which shows the 1st example of the target object obtained using the modeling apparatus which concerns on embodiment. It is a figure which shows the 1st example which gave the copper plating to the target object obtained using the modeling apparatus which concerns on embodiment. It is a figure which shows the 2nd example of the target object obtained using the modeling apparatus which concerns on embodiment. It is a figure which shows the 2nd example which gave the copper plating to the target object obtained using the modeling apparatus which concerns on embodiment. It is a figure which shows the 3rd example of the target object obtained using the modeling apparatus which concerns on embodiment. It is the figure which looked at a part of 5th solid substance which concerns on embodiment from the horizontal slanting upper side. It is a figure which shows the 3rd example which gave the copper plating to the target object obtained using the modeling apparatus which concerns on embodiment. It is a figure which shows the example of the relationship between the angle of the beam for modeling which concerns on embodiment, and the position of a focus.

Hereinafter, although embodiment of this invention is described, the following embodiment does not limit the invention concerning a claim. In addition, not all the combinations of features described in the embodiments are essential for the solving means of the invention.
FIG. 1 is a schematic block diagram illustrating a functional configuration of a modeling system according to the embodiment. As shown in FIG. 1, the modeling system 1 includes a modeling device 100 and a control device 200. The modeling apparatus 100 includes a modeling unit 110, a movement processing unit 120, and an observation unit 150. The control device 200 includes a display unit 210, an operation input unit 220, a storage unit 280, and a processing unit 290.

The modeling system 1 generates a target object by partially changing the liquid material into an individual.
The modeling apparatus 100 is an apparatus that executes generation of a target object. In particular, the modeling apparatus 100 models an object by partially changing the droplets of each of the one or more materials into a solid. A droplet here is a lump of liquid that is gathered by surface tension. Modeling here is to make a shape.

The modeling unit 110 performs modeling by partially changing the droplets of the material into a solid within the modeling region. Specifically, the liquid material is changed to a solid at the focal position by irradiating the droplet with laser light and focusing the laser beam in the droplet. A modeling area | region here is an area | region where the modeling part 110 can change material into solid. Specifically, the modeling area is an area where the modeling unit 110 can focus the laser beam.

Hereinafter, a case where the material is a photocurable resin and the modeling unit 110 cures the photocurable resin from a liquid to a solid by optical modeling will be described as an example.
However, the method by which the modeling unit 110 performs modeling is not limited to a specific method as long as it is a method capable of partially changing the material droplets to solid. For example, the modeling unit 110 may model the photopolymerization, photocrosslink, photoreduction, or a combination thereof.

Further, the laser beam used for modeling by the modeling unit 110 may be any laser beam that can cure the material, and is not limited to a laser beam having a specific wavelength. For example, the modeling unit 110 may use ultraviolet laser light or blue laser light. Alternatively, the modeling unit 110 may perform modeling by a two-photon modeling method using two-photon absorption using near-infrared femtosecond-pulse laser light.

FIG. 2 shows an example of a position where the modeling unit 110 can focus the laser beam. In FIG. 2, laser light emission portions of the modeling unit 110 and the movement processing unit 120 are shown. In addition to the movement processing unit 120 and the modeling unit 110, the modeling apparatus 100 includes a support base 130 and a dropping port 140. A glass plate substrate 810 used as a substrate for object modeling is placed on the support base 130. The support base 130 supports the substrate 810. A droplet 820 is placed on the substrate 810. The laser beam irradiated by the modeling unit 110 is also referred to as a modeling beam B11.
FIG. 2 shows an example in which the laser beam emitting portion, the support base 130, the substrate 810, and the droplet 820 of the modeling unit 110 and the movement processing unit 120 are viewed from the side (horizontal direction).

2 is a droplet of material. The droplet 820 is placed on the substrate 810. The modeling unit 110 irradiates the modeling beam B11 from below the substrate 810 so that the droplet 820 that transmits the modeling beam B11 is focused in the droplet 820. The modeling beam B11 irradiated by the modeling unit 110 is focused at a point P11. For this reason, the part of point P11 among the droplets 820 changes from a liquid to a solid.

The laser beam emitting portion of the modeling unit 110 can move back and forth and left and right in FIG. Further, the modeling unit 110 can move the focus position of the modeling beam B11 up and down in FIG. Therefore, the modeling unit 110 can three-dimensionally move the focus position of the modeling beam B11 in the vertical and horizontal directions and the front and rear in FIG.
The modeling unit 110 moves the focal position of the modeling beam B11 in the droplet 820 along the shape of the target object, so that the material can be processed into the target shape.

Also, as shown in FIG. 2, the modeling unit 110 irradiates the modeling beam B11 from the lower side of the substrate 810, so that the modeling beam B11 reaches the upper surface of the droplet 820 after focusing. Therefore, the position where the modeling beam B11 is focused is not affected by refraction according to the shape of the droplet 820 due to the surface tension. In this respect, the modeling system 1 can perform the positioning of the focal point of the modeling beam B11 with high accuracy.
However, the modeling unit 110 may irradiate the modeling beam B11 from above the droplet 820. Thereby, even when the droplet 820 is placed on an opaque object such as when the droplet 820 is dropped on the upper surface of the opaque board, the material is partially irradiated by irradiating the modeling beam B11 to the droplet 820. Can be changed to solid.

The dropping port 140 drops the cleaning liquid. This cleaning liquid is a liquid for removing the liquid material adhering to the solid material after processing the liquid material. The dropping port 140 cleans the solid material located in the modeling area by dropping the cleaning liquid toward the modeling area. That is, the dripping port 140 removes the liquid material adhering to the solid material located in the modeling area.
However, the method by which the modeling system 1 cleans the solid material is not limited to the method in which the cleaning liquid is dropped from the dropping port 140. The modeling system 1 may move the cleaning liquid prepared in the form of the droplet 820 in advance to immerse the solid material in the cleaning liquid, thereby cleaning the solid material.

FIG. 3 shows an example of the positional relationship between the laser beam emitting portion of the modeling unit 110 and the droplet 820. FIG. 3 shows an example in which the laser beam emitting portion of the modeling unit 110 is viewed from above. In this example, the substrate 810 supported by the support base 130 is positioned on the laser beam emitting portion of the modeling unit 110, and two droplets 820 of different materials are placed on the substrate 810. The two droplets 820 are a first material droplet 821-11 and a second material droplet 821-12. In order to distinguish the material droplet from the cleaning liquid droplet, reference numeral 821 is attached to the material droplet.

Of the material droplets 821, the first material droplet 821-11 is positioned on the laser beam emitting portion of the modeling unit 110. When the modeling unit 110 irradiates the modeling beam B11 to focus on the droplet 821-11 of the first material, the focal portion of the droplet 821-11 changes from liquid to solid.
The modeling system 1 performs processing of the second material using the second material droplet 821-12 after processing the first material using the first material droplet 821-11, whereby the first material is processed. An object can be produced that includes both the second material and the second material. For such processing, the movement processing unit 120 moves the droplet 820.

The movement processing unit 120 moves the droplet 820. Specifically, the movement processing unit 120 moves the droplet 820 by generating a temperature gradient in the droplet 820 using a point heater using electromagnetic waves.
The modeling apparatus 100 including the movement processing unit 120 corresponds to an example of a droplet moving apparatus.
The movement processing unit 120 irradiates the droplet 820 by partially heating the point heater electromagnetic wave (for example, infrared laser light) by irradiating the edge of the droplet 820 or the substrate 810 in the vicinity of the droplet 820 or both. Create a temperature gradient. However, the electromagnetic wave used for the point heater by the movement processing unit 120 may be an electromagnetic wave other than that which changes the liquid material to a solid, and is not limited to an electromagnetic wave having a specific frequency and an electromagnetic wave having a specific method.

FIG. 4 shows an arrangement example of the droplets 820. FIG. 4 shows an example when the substrate 810 is viewed obliquely from above. In this example, a third material droplet 821-21, a fourth material droplet 821-22, a fifth material droplet 821-23, and a cleaning liquid droplet are positioned on the substrate 810. ing. In order to distinguish between the liquid droplets of the material and the liquid droplets of the cleaning liquid, the liquid droplets of the cleaning liquid are denoted by reference numeral 822.
The modeling system 1 positions each of the third material droplet 821-21, the fourth material droplet 821-22, and the fifth material droplet 821-23 in the modeling region and partially changes them into a solid. Thus, an object including the first material, the second material, and the third material can be generated.

In addition, the modeling system 1 performs cleaning liquid every time the third material droplet 821-21, the fourth material droplet 821-22, and the fifth material droplet 821-23 are partially changed to solid. The solid material is washed by moving the droplet 822 to the modeling area. As described above, as a method of cleaning the solid material, a method of dropping the cleaning liquid from the dropping port 140 may be used instead of the method of moving the liquid droplet 822 of the cleaning liquid.

4, the modeling unit 110 irradiates the modeling beam B11 from below the substrate 810. On the other hand, the movement processing unit 120 irradiates the point heater electromagnetic wave from above the substrate 810. The electromagnetic wave irradiated by the movement processing unit 120 is also referred to as a heating beam B12. The movement processing unit 120 may irradiate infrared laser light as the heating beam B12. However, the electromagnetic wave irradiated by the movement processing unit 120 is not limited to an electromagnetic wave having a specific frequency as long as it can add a temperature gradient to the droplet. The heating beam B12 is not limited to laser light.

FIG. 4 shows both the modeling beam B11 and the heating beam B12 for explanation. However, while the modeling unit 110 is irradiating the modeling beam B11, the movement processing unit 120 does not irradiate the heating beam B12 to the droplet 820 located in the modeling region. After the modeling unit 110 finishes processing on the material located in the modeling region, the movement processing unit 120 irradiates the material positioned in the modeling region with the heating beam B12 and applies the material that remains liquid to the modeling region. Move outside.

FIG. 5 shows an example of a position where the movement processing unit 120 irradiates the heating beam B12. As in the case of FIG. 2, in FIG. 5, the laser beam emitting portions of the modeling unit 110 and the movement processing unit 120, the support base 130 and the dropping port 140, the substrate 810 placed on the support base 130, and the substrate 810 A drop 820 is shown on the top. As in the case of FIG. 2, FIG. 5 shows an example in which the laser beam emitting portions of the modeling unit 110 and the movement processing unit 120, the support base 130, the substrate 810, and the droplet 820 are viewed from the side (horizontal direction). .

FIG. 2 shows an example in which the modeling unit 110 irradiates the modeling beam B11, whereas FIG. 5 shows an example in which the movement processing unit 120 irradiates the heating beam B12. Show.
In the example of FIG. 5, the movement processing unit 120 irradiates the substrate 810 near the droplet 820 with the heating beam B12. As a result, the movement processing unit 120 heats the heating beam B12 side of the droplet 820 to cause a temperature gradient in the droplet 820.

FIG. 6 shows an example of the force relationship in the droplet 820 when no temperature gradient has occurred. In the example of FIG. 6, γ _L indicates the surface tension in the droplet 820. γ _S indicates the surface tension of the solid (surface tension in the substrate 810). γ _LS indicates the solid-liquid interfacial tension. θ represents the contact angle of the droplet 820 with respect to the substrate 810.
In the case of FIG. 6, Young's formula is shown as formula (1).

In FIG. 6, the forces in the droplet 820 are balanced, and the droplet 820 does not move.

FIG. 7 shows an example of the force relationship in the droplet 820 when a temperature gradient is occurring. In the example of FIG. 7, the force on the non-heated side is indicated by a variable name with “′” added to the variable name used in FIG. Specifically, γ ′ _L indicates the surface tension in the droplet 820. γ ′ _S indicates the surface tension of the solid (surface tension in the substrate 810). γ ′ _LS indicates the solid-liquid interfacial tension. θ ′ represents a contact angle of the droplet 820 with respect to the substrate 810.

On the other hand, in the example of FIG. 7, the force on the heated side is indicated by adding “″” to the variable name. Specifically, γ ″ _L indicates the surface tension in the droplet 820. γ ″ _S indicates the surface tension of the solid (surface tension in the substrate 810). γ ″ _LS indicates the solid-liquid interfacial tension. θ ″ represents the contact angle of the droplet 820 with respect to the substrate 810.
In the example of FIG. 7, a temperature difference occurs between the high temperature side temperature T _H and the low temperature side temperature T _L (T _H > T _L ), and a temperature gradient is generated in the substrate 810 and the droplet 820. Due to this temperature gradient, the contact angle and the surface tension change from the case of FIG. 6 on the high temperature side and the low temperature side, respectively.
On the low temperature side, the contact angle θ ′ is larger than the contact angle θ in the case of FIG. 6, and the horizontal component of the surface tension γ ′ _L between the liquid and the gas decreases. The force F ′ acting on the low temperature side interface is represented by the formula (2) with the direction of the surface tension γ ′ _s of the solid being positive.

“F ′> 0”, and the direction of the force F ′ is the direction from the higher temperature gradient to the lower temperature gradient, similar to the direction of the surface tension γ ′ _S of the solid.
On the other hand, on the high temperature side, the contact angle θ ″ is smaller than the contact angle θ in the case of FIG. 6, and the horizontal component of the surface tension γ ″ _L between the liquid and the gas increases. The force F ″ acting on the interface on the high temperature side is represented by the equation (3), with the direction of the surface tension γ ″ _s of the solid being positive.

“F ″ <0”, and the direction of the force F ″ is the direction from the higher temperature gradient to the lower one, contrary to the direction of the surface tension γ ″ _S of the solid.
FIG. 8 shows an example of the direction of the force generated in the droplet. As described above, the direction of the force F ′ and the direction of the force F ″ are both from the higher gradient temperature to the lower gradient temperature. A force F _Total obtained by combining the force F ′ and the force F ″ is expressed as in Expression (4).

Since the direction of the force F ′ and the direction of the force F ″ are from the higher temperature gradient to the lower direction, the direction of the force F _Total is also lower from the higher temperature gradient as shown in FIG. It becomes the direction. The droplet 820 moves from a higher temperature gradient to a lower temperature gradient using the force _FTotal as a driving force. Accordingly, the droplet 820 moves in a direction away from the position where the movement processing unit 120 is heated.

FIG. 9 shows an example of the positional relationship between the laser beam emitting portion of the movement processing unit 120 and the droplet 820. FIG. 9 shows an example in which the laser beam irradiated portion of the movement processing unit 120 and the substrate 810 are viewed obliquely from above. In this example, a droplet 821-31 of the sixth material is placed on the substrate 810. A region A11 indicates a portion where the movement processing unit 120 irradiates the heating beam B12. The movement processing unit 120 irradiates the substrate 810 in the vicinity of the sixth material droplet 821-31 with the heating beam B12 and heats it, thereby generating a temperature gradient in the sixth material droplet 821-31.

The observation unit 150 captures an image of the target object.
FIG. 10 is a diagram illustrating a configuration example of the observation unit 150. In the example of FIG. 10, the observation unit 150 includes an observation light source 151, a beam splitter 152, an observation lens 153, a CCD camera 154, and a display device 155.
The observation light source 151 emits illumination light B13 for photographing a target object. The target object here may be a thing in the middle of modeling. The illumination light B13 is applied to the object. After a part of the illumination light B13 is reflected or absorbed, the remaining light is incident on the beam splitter 152 via the laser light emitting portion of the modeling unit 110.

In the example of FIG. 10, the observation light source 151 is located above the modeling area, like the dropping port 140 in FIG. While the observation light source 151 irradiates the illumination light B13, the arrangement position of the dropping port 140 and the arrangement position of the observation light light source 151 may be switched. Alternatively, the dripping port 140 may be arranged so that the position of the dripping port 140 and the position of the observation light source 151 do not overlap each other, for example, a cleaning liquid or a liquid material is dropped from an obliquely upper side of the modeling region to the modeling region.

The beam splitter 152 includes a half mirror and reflects the illumination light B13. The beam splitter 152 receives not only the illumination light B13 but also the modeling beam B11. The beam splitter 152 passes the modeling beam B11 and advances it toward the laser beam emitting portion of the modeling unit 110. Due to the reflection of the illumination light B13, the beam splitter 152 turns the illumination light B13 that has passed through the same path as the modeling beam B11 in the direction opposite to the modeling beam B11 in a direction different from the direction of the path of the modeling beam B11. .

The observation lens 153 refracts the illumination light B13 so that the illumination light B13 forms an image at the position of the imaging element of the CCD camera 154.
The CCD camera 154 receives the illumination light B13 and performs photoelectric conversion to generate image data of the target object.
The display device 155 has a display screen such as a liquid crystal panel or an LED panel, and displays an image of the object. Specifically, the display device 155 receives input of image data of the object generated by the CCD camera and displays an image indicated by the image data.
However, the configuration and arrangement of the observation unit 150 are not limited to those shown in FIG. For example, the observation unit 150 may take an image of the object from above, or may take an image from obliquely upward or obliquely downward.

The control device 200 controls the modeling device 100 to generate a target object. For example, the control device 200 controls the timing at which the modeling unit 110 irradiates the modeling beam B11 and the focal position of the modeling beam B11. In addition, the control device 200 controls the timing at which the movement processing unit 120 irradiates the heating beam B12, the irradiation position, and the intensity of the heating beam B12. Further, the control device 200 controls the timing at which the dropping port 140 drops the cleaning liquid.
The control device 200 functions as a user interface of the modeling system 1.
The control device 200 is configured using a computer such as a personal computer or a workstation.

The display unit 210 has a display screen such as a liquid crystal panel or an LED panel, and displays various images. In particular, the display unit 210 presents information regarding the modeling system 1 to the user.
The display unit 210 may be configured using the display device 155, or may be configured separately from the display device 155.
The operation input unit 220 includes input devices such as a keyboard and a mouse and receives user operations. In particular, the operation input unit 220 receives a user operation for performing settings related to the modeling system 1.

The storage unit 280 stores various data. The storage unit 280 is configured using a storage device provided in the control device 200.
The processing unit 290 controls each unit of the control device 200 and executes various processes. The processing unit 290 is configured by a CPU (Central Processing Unit) provided in the control device 200 reading out a program from the storage unit 280 and executing it.
The control device 200 may automatically control the modeling device 100 based on a preset program or the like. Alternatively, the user may input an instruction to the control apparatus 200 online, and the control apparatus 200 may control the modeling apparatus 100 according to the user's instruction.

Next, replacement of the droplet 820 located in the modeling area will be described with reference to FIGS.
FIG. 11 shows a first example of material arrangement. FIG. 11 shows an example of material arrangement at the start of processing in which the modeling system 1 generates a target object. In the example of FIG. 11, droplets 821-41 of the seventh material and droplets 821-42 of the eighth material different from the seventh material are placed on the substrate 810. Moreover, area | region A21 has shown the modeling area | region.
From the state of FIG. 11, the modeling unit 110 irradiates the modeling material beam B11 on the seventh material droplet 821-41 located in the modeling region (region A21) to form one of the seventh material droplets 821-41. Change the part from liquid to solid.

FIG. 12 is a diagram illustrating a second example of the arrangement of materials. In the example of FIG. 12, the positions of the substrate 810, the seventh material droplet 821-41, the eighth material droplet 821-42, and the region A21 are the same as those in FIG. On the other hand, the example of FIG. 12 is different from the case of FIG. 11 in that the solid material 840 is present in the droplet 821-41 of the seventh material.
A solid material 840 in FIG. 12 is a seventh material solid material 840-41, which corresponds to an example of a target object being generated. Specifically, from the state of FIG. 11, the modeling unit 110 irradiates the modeling material beam B11 to the seventh material droplet 821-41, and a part of the seventh material droplet 821-41 is solidified from the liquid. What is changed to is the solid material 840-41 of the seventh material in FIG.

FIG. 13 shows a third example of material arrangement. In the example of FIG. 13, the positions of the substrate 810, the eighth material droplet 821-42, the seventh material solid 840-41, and the region A21 are the same as in FIG. On the other hand, the example of FIG. 13 is different from the case of FIG. 12 in that the droplet 821-41 of the seventh material moves from the inside to the outside of the region A21.
FIG. 12 shows an example of a state in which the processing of the seventh material droplet 821-41 by the modeling unit 110 is completed. The movement processing unit 120 moves the seventh material droplet 821-41 after use to the outside of the region A21, and the state shown in FIG. 13 is obtained. The movement processing unit 120 moves the droplet, but does not move the solid material. In the example of FIG. 13 as well, the seventh material droplet 821-41 moves from the inside of the region A21 to the outside, while the seventh material solid matter 840-41 remains in the region A21.

FIG. 14 shows a fourth example of material arrangement. In the example of FIG. 14, the positions of the substrate 810, the seventh material droplet 821-41, the eighth material droplet 821-42, the seventh material solid 840-41, and the region A21 are the same as in FIG. It is. On the other hand, FIG. 14 is different from the case of FIG. 13 in that there is a cleaning liquid droplet 822 in the region A21.
From the state of FIG. 13, the dropping port 140 drops the cleaning liquid into the modeling region (region A <b> 21), so that the state of FIG. 14 is reached. In the state shown in FIG. 13, the droplet 821-41 of the seventh material has moved out of the region A21, but the liquid seventh material remains on the surface of the solid material 840-41 of the seventh material. . Therefore, the dropping port 140 drops the cleaning liquid into the region A21 and immerses the solid material 840-41 of the seventh material in the cleaning liquid. Thereby, the modeling system 1 cleans the surface of the solid material 840-41 of the seventh material. Specifically, the modeling system 1 removes the liquid seventh material attached to the surface of the solid material 840-41 of the seventh material.

FIG. 15 shows a fifth example of material arrangement. In the example of FIG. 15, the positions of the substrate 810, the seventh material droplet 821-41, the eighth material droplet 821-42, the seventh material solid 840-41, and the region A21 are the same as in FIG. It is. On the other hand, FIG. 15 is different from FIG. 14 in that the cleaning liquid droplets 822 are removed from the substrate 810.
14, the movement processing unit 120 moves the cleaning liquid droplets 822 from the inside of the region A21 to the outside of the upper surface of the substrate 810, whereby the cleaning liquid droplets 822 are removed from the substrate 810, and FIG. It becomes the state of.

FIG. 16 shows a sixth example of material arrangement. In the example of FIG. 16, the positions of the substrate 810, the seventh material droplet 821-41, the seventh material solid 840-41, and the region A21 are the same as those in FIG. On the other hand, FIG. 16 is different from the case of FIG. 15 in that the droplet 821-42 of the eighth material moves from the outside to the inside of the region A21.
The movement processing unit 120 moves the droplets 821-42 of the eighth material into the region A21 from the state of FIG.

FIG. 17 shows a seventh example of material arrangement. In the example of FIG. 17, the positions of the substrate 810, the seventh material droplet 821-41, the eighth material droplet 821-42, the seventh material solid 840-41, and the region A21 are the same as in FIG. It is. On the other hand, FIG. 17 differs from the case of FIG. 16 in that the eighth material solid material 840-42 is present in the eighth material droplet 821-42 in addition to the seventh material solid material 840-41. In the example of FIG. 17, the solid material 840-41 of the seventh material and the solid material 840-42 of the eighth material constitute the solid material 840.
In the state of FIG. 16, the modeling unit 110 irradiates the modeling material B11 to the droplet 821-42 of the eighth material to change a part of the droplet 821-42 of the eighth material from liquid to solid. This is a solid material 840-42 of the eighth material in FIG.

FIG. 18 shows an eighth example of material arrangement. In the example of FIG. 18, the positions of the substrate 810, the seventh material droplet 821-41, the seventh material solid 840-41, the eighth material solid 840-42, and the region A21 are the same as in FIG. It is. On the other hand, FIG. 18 differs from the case of FIG. 17 in that the droplet 821-42 of the eighth material moves from the inside of the region A21 to the outside.
FIG. 17 shows an example of a state in which the processing of the eighth material droplet 821-42 by the modeling unit 110 is completed. The movement processing unit 120 moves the droplets 821-42 of the eighth material after use from the inside to the outside of the region A21, so that the state shown in FIG. 18 is obtained. As described above, the movement processing unit 120 moves the droplet, but does not move the solid material. Also in the example of FIG. 18, the eighth material droplet 821-42 moves from the inside of the region A21 to the outside, while the solid material 840-42 of the eighth material remains in the region A21.

FIG. 19 shows a ninth example of material arrangement. In the example of FIG. 19, the substrate 810, the seventh material droplet 821-41, the eighth material droplet 821-42, the seventh material solid 840-41, the eighth material solid 840-42, and the region A21. The position of is the same as in the case of FIG. On the other hand, FIG. 19 is different from the case of FIG. 18 in that there is a cleaning liquid droplet 822 in the region A21.
From the state of FIG. 18, the dropping port 140 drops the cleaning liquid into the modeling region (region A <b> 21), so that the state of FIG. 19 is reached. In the state of FIG. 18, the eighth material droplet 821-42 has moved out of the region A 21, but the liquid eighth material remains on the surface of the solid material 840. Therefore, the dropping port 140 drops the cleaning liquid into the region A21 and immerses the solid material 840 in the cleaning liquid. Thereby, the modeling system 1 cleans the surface of the solid object 840. Specifically, the modeling system 1 removes the liquid eighth material adhering to the surface of the seventh material solid 840-41 and the surface of the eighth material solid 840-42.

FIG. 20 shows a tenth example of material arrangement. In the example of FIG. 20, the substrate 810, the seventh material droplet 821-41, the eighth material droplet 821-42, the seventh material solid 840-41, the eighth material solid 840-42, and the region A21. The position of is the same as in the case of FIG. On the other hand, FIG. 20 is different from FIG. 19 in that the cleaning liquid droplets 822 are removed from the substrate 810.
19, the movement processing unit 120 moves the cleaning liquid droplet 822 from the inside of the region A21 to the outside of the upper surface of the substrate 810, whereby the cleaning liquid droplet 822 is removed from the substrate 810, and FIG. It becomes the state of.
20 corresponds to an example of a completed target object. As described above, in the example of FIGS. 11 to 20, the modeling system 1 generates a multi-material object using a plurality of materials such as the seventh material and the eighth material.

When the droplet 820 is moved, the movement processing unit 120 may move the laser light emitting portion while emitting the heating beam B12 from the laser light emitting portion. The movement processing unit 120 moves the laser light irradiation portion so as to follow the moving droplet 820, so that the droplet 820 can be continuously moved, and thereby the moving distance of the droplet 820 can be adjusted.
Alternatively, the movement processing unit 120 may irradiate a laser beam having an intensity corresponding to the distance to which the droplet 820 is moved. The moving distance of the droplet 820 can be adjusted by the intensity of the laser beam (heating beam B12) irradiated by the movement processing unit 120.

FIG. 21 is a graph showing an example of the relationship between the heating temperature of the droplet 820 and the movement distance of the droplet 820 by the movement processing unit 120. FIG. 21 shows the heating temperature and the movement distance of the droplet 820 when the heating temperature of the droplet 820 is adjusted by adjusting the intensity of the heating beam B12 without moving the laser beam emitting portion of the movement processing unit 120. An example of the relationship is shown. The heating temperature here is the temperature of the region of the substrate 810 where the heating beam B12 is most condensed and heated.
FIG. 21 shows an example in which acrylate resin droplets are used as the droplets 820.

In the graph of FIG. 21, the horizontal axis represents time, and the vertical axis represents the movement distance of the droplet 820.
Lines L11, L12, L13, and L14 show examples of the relationship between the elapsed time and the droplet movement distance when the heating temperature is 75 ° C., 95 ° C., 130 ° C., and 160 ° C., respectively. In any of the lines L11, L12, L13, and L14, the droplet moves a certain distance according to the heating temperature, and after that, does not move and stays in place.
In the example of FIG. 21, the moving distance of the droplet 820 (the moving distance until the droplet 820 almost does not move) increases as the heating temperature increases.

Therefore, the amount of heating by the point heater may be increased as the required moving distance increases according to the required moving distance that the movement processing unit 120 should move the droplet 820. The magnitude of the heating temperature can be adjusted by the magnitude of the voltage applied to the point heater of the movement processing unit 120. As the voltage applied to the point heater of the movement processing unit 120 increases, the moving distance of the droplet 820 increases.

FIG. 22 is a graph showing an example of the relationship between the wettability of the droplet 820 and the moving distance of the droplet 820. FIG. 22 shows the wettability of the droplet 820 according to the surface characteristics of the substrate 810 and the droplet 820 when the laser beam emission portion of the movement processing unit 120 is not moved and the intensity of the heating beam B12 is the same. The example of the relationship with a movement distance is shown. In the example of FIG. 22, acrylate resin droplets are used as the droplets 820, and the heating temperature is 130 ° C.

In the graph of FIG. 22, the horizontal axis represents time, and the vertical axis represents the movement distance of the droplet 820.
Lines L21, L22, and L23 are obtained when the surface of the substrate 810 is coated with fluorine, when the surface treatment of the substrate 810 is not performed, or when the surface of the substrate 810 is subjected to a silane coupling treatment of an organic functional group. The example of the relationship between time and the movement distance of a droplet is shown.
The wettability of the droplet 820 was the smallest in the case of fluorine coating (line L21), and the contact angle of the droplet 820 was 66 °. Next, when the surface treatment of the substrate 810 was not performed (line L22), the wettability was small, and the contact angle of the droplet 820 was 20 °. In the case of the silane coupling treatment of the organic functional group (line L23), the wettability was the largest, and the contact angle of the droplet 820 was 12 °.

In any of the lines L21, L22, and L23, the droplet moves a certain distance according to the wettability, and after that, does not move and stays in place.
In the example of FIG. 22, as the wettability of the droplet 820 increases, the moving distance of the droplet 820 (the moving distance until the droplet 820 almost does not move) increases.
Therefore, the moving distance of the droplet 820 may be adjusted by processing the surface of the substrate 810. For example, the intensity of the laser beam (heating beam B12) output from the movement processing unit 120 by applying a process for increasing the wettability of the droplet 820 to the surface of the substrate 810, such as a silane coupling process of an organic functional group. Can be made relatively small, and the moving distance of the droplet 820 can be secured.

Alternatively, the movement processing unit 120 may increase the amount of heating by the point heater as the wettability decreases according to the wettability of the droplet 820. Thereby, the influence of the wettability on the moving distance of the droplet 820 can be reduced, and in this respect, the moving distance of the droplet 820 can be made constant regardless of the wettability.

Further, as in the case of fluorine coating (line L21), the property that the droplet 820 does not substantially move when the water repellency process is performed on the moving surface of the droplet 820 may be positively utilized.
For example, a path along which the droplet 820 moves may be patterned by applying a fluorine coat pattern on the surface of the substrate 810. Since the droplet 820 moves while avoiding the fluorine-coated portion, the droplet 820 can be moved along a specific path (path not fluorine-coated) by the fluorine-coated pattern. As described above, the movement processing unit 120 may move the droplet 820 on the surface where the water-repellent material is partially disposed.

FIG. 23 is a graph showing an example of the relationship between the viscosity of the droplet 820 and the moving distance of the droplet 820. FIG. 23 shows the relationship between the viscosity of the droplet 820 (material viscosity) and the movement distance of the droplet 820 when the laser beam emission portion of the movement processing unit 120 is not moved and the intensity of the heating beam B12 is the same. An example of the relationship is shown. In the example of FIG. 23, the heating temperature is 130.degree. In addition, the wettability condition is made the same by performing silane coupling treatment of an organic functional group on the surface of the substrate 810.

In the graph of FIG. 23, the horizontal axis indicates time, and the vertical axis indicates the moving distance of the droplet 820.
Lines L31, L32, and L33 show examples of the relationship between the elapsed time and the moving distance of the droplets of the methacrylate resin droplets, the acrylate resin droplets, and the cleaning liquid droplets, respectively.
Regarding the viscosity of the droplet 820, the methacrylate resin (line L31) was the largest. The viscosity of the methacrylate resin droplets was 1802 cps. Next, in the case of the acrylate resin (line L32), the viscosity was large, and the viscosity was 95 cps. In the case of the cleaning liquid (line L33), the viscosity was the smallest, and the viscosity was 7.4 cps.

In any of the lines L31, L32, and L33, the droplet moves a certain distance according to the viscosity, and after that, it does not move approximately and remains in place.
In the example of FIG. 23, the greater the viscosity of the droplet 820, the shorter the moving distance of the droplet 820 (the moving distance until the droplet 820 is not substantially moved).
Therefore, the movement processing unit 120 may increase the amount of heating by the point heater as the viscosity increases according to the viscosity of the droplet 820. Thereby, the influence of the viscosity on the moving distance of the droplet 820 can be reduced, and in this respect, the moving distance of the droplet 820 can be made constant regardless of the viscosity.

Next, the operation of the modeling system 1 will be described with reference to FIG.
FIG. 24 is a flowchart illustrating an example of a processing procedure in which the control device 200 controls the modeling device 100 to generate an object.
In the process of FIG. 24, the control device 200 controls the modeling unit 110 to perform the modeling process (step S101). The modeling unit 110 irradiates the modeling beam B11 on the material droplet 821 in the modeling region according to the control of the control device 200, and focuses the modeling beam B11 in the material droplet 821. At the focal point, the material changes from liquid to solid.

Next, the control device 200 controls the movement processing unit 120 to retract the material droplet 821 out of the modeling region (step S102). The movement processing unit 120 moves the material droplet 821 in the modeling area to the outside of the modeling area according to the control of the control device 200.
Next, the control device 200 controls the dropping port 140 to drop the cleaning liquid (Step S103). The dropping port 140 drops the cleaning liquid into the modeling area according to the control of the control device 200. This dripping cleans the solid material in the modeling area.

Next, the control device 200 controls the movement processing unit 120 to remove the cleaning liquid droplets 822 (step S104). The movement processing unit 120 moves the liquid droplet 822 of the cleaning liquid in the modeling area to the outside of the substrate 810 according to the control of the control device 200. By this movement, the movement processing unit 120 removes the cleaning liquid droplet 822 from the substrate 810.
Next, the control device 200 determines whether or not the object is completed (step S105). When it determines with the target object having been completed (step S105: YES), the control apparatus 200 complete | finishes the process of FIG.

On the other hand, when it is determined that the target object is not completed (step S105: NO), the control device 200 controls the movement processing unit 120 to move the material droplet 821 to be used next to the modeling region ( Step S106). The movement processing unit 120 moves a droplet 821 of the material to be used next from the outside of the modeling area into the modeling area under the control of the control device 200.
After step S106, the process returns to step S101.

Next, an example of an object obtained using the modeling apparatus 100 will be described with reference to FIGS.
FIG. 25 shows a first example of an object obtained using the modeling apparatus 100. The first solid 840a shown in FIG. 25 includes a methacrylate solid 840-51 and an acrylate solid 840-52. The first solid object 840a corresponds to an example of an object obtained using the modeling apparatus 100.

The movement processing unit 120 moves each of the methacrylate droplets and the acrylate droplets to the modeling region, and the modeling unit 110 performs processing using each of these droplets. Thereby, the multi-material target object containing a methacrylate and an acrylate like the 1st solid substance 840a can be produced | generated.
In addition, as shown in FIG. 25 with a scale of 50 μm (micrometer), a minute object can be generated using the modeling apparatus 100.

FIG. 26 shows a first example in which a target obtained using the modeling apparatus 100 is plated with copper. The second solid material 840b shown in FIG. 26 is obtained by performing electroless copper plating on the first solid material 840a shown in FIG.
Of the methacrylate solid 840-51 and the acrylate solid 840-52 in FIG. 25, the acrylate solid 840-52 is copper plated, but the methacrylate solid 840-51 is copper plated. Is not given. The second solid material 840b shown in FIG. 26 includes methacrylate solid material 840-51 and copper plating 840-53. Thus, by producing a multi-material object containing methacrylate and acrylate, the obtained object can be selectively plated.

FIG. 27 shows a second example of an object obtained using the modeling apparatus 100. The third solid material 840c shown in FIG. 27 includes methacrylate solid material 840-51 and acrylate solid material 840-52. The third solid object 840c corresponds to an example of an object obtained using the modeling apparatus 100.
The movement processing unit 120 moves each of the methacrylate droplets and the acrylate droplets to the modeling region, and the modeling unit 110 performs processing using each of these droplets. Thereby, the target object of the multimaterial containing a methacrylate and an acrylate like the 3rd solid substance 840c can be generated.

In addition, as shown in FIG. 27 with a scale of 50 μm, a minute object can be generated using the modeling apparatus 100.
Further, the third solid material 840c is a pyramid-shaped solid material in which square plate-shaped solid materials are stacked. In this manner, a three-dimensional object can be generated using the modeling apparatus 100.

FIG. 28 shows a second example in which a target obtained using the modeling apparatus 100 is plated with copper. The fourth solid material 840d shown in FIG. 28 is obtained by performing electroless copper plating on the third solid material 840c shown in FIG.
Of the methacrylate solid 840-51 and the acrylate solid 840-52 in FIG. 27, the acrylate solid 840-52 is copper plated, but the methacrylate solid 840-51 is copper plated. Is not given. The fourth solid material 840d in FIG. 28 includes methacrylate solid material 840-51 and copper plating 840-53. Thus, by producing a multi-material object containing methacrylate and acrylate, the obtained object can be selectively plated.

FIG. 29 shows a third example of an object obtained using the modeling apparatus 100. The fifth solid 840e shown in FIG. 29 includes methacrylate solid 840-51 and acrylate solid 840-52. The fifth solid object 840e corresponds to an example of an object obtained using the modeling apparatus 100.
The movement processing unit 120 moves each of the methacrylate droplets and the acrylate droplets to the modeling region, and the modeling unit 110 performs processing using each of these droplets. Thereby, the target object of the multimaterial containing a methacrylate and an acrylate like the 3rd solid substance 840c can be generated.

FIG. 30 is a diagram of a part of the fifth solid material 840e as viewed from obliquely above. As shown in FIGS. 29 and 30, the fifth solid material 840e has a cavity inside. In this way, a three-dimensional object having a cavity inside can be generated using the modeling apparatus 100.
In addition, as shown in FIG. 30 with a scale of 6.66 μm, a minute object can be generated using the modeling apparatus 100.

FIG. 31 shows a third example in which a target obtained using the modeling apparatus 100 is plated with copper. 31 is obtained by performing electroless copper plating on the fifth solid material 840e shown in FIGS. 29 and 30. The sixth solid material 840f shown in FIG.
Of the methacrylate solids 840-51 and acrylate solids 840-52 of FIGS. 29 and 30, copper plating is applied to the acrylate solids 840-52. Is not copper plated. The sixth solid material 840f in FIG. 31 includes methacrylate solid material 840-51 and copper plating 840-53. Thus, by producing a multi-material object containing methacrylate and acrylate, the obtained object can be selectively plated.

As described above, the movement processing unit 120 moves the droplet 820. The modeling unit 110 performs modeling by partially changing the droplet 820 to a solid within a predetermined modeling area.
As described above, since the movement processing unit 120 moves the droplet 820, the user does not need to manually dispose the droplet in the modeling region, for example, by dropping the material liquid onto the substrate 810 with a dropper. According to the modeling apparatus 100, the burden of installing the liquid material can be reduced when the target material is modeled by changing the liquid material into a solid.

The movement processing unit 120 moves the droplet 820 by generating a temperature gradient in the droplet 820 using a point heater using electromagnetic waves.
Accordingly, the droplet 820 can be moved with a relatively simple configuration in which the modeling apparatus 100 includes a point heater using electromagnetic waves.

In addition, the movement processing unit 120 moves the droplet 820 on the surface where the water-repellent material is partially disposed.
By showing a path along which the droplet 820 moves using a water repellent material, the droplet 820 can be moved along a specific path.

Further, the movement processing unit 120 increases the amount of heating by the point heater as the required moving distance increases, according to the required moving distance to which the droplet 820 should be moved.
Since the movement distance of the droplet 820 increases as the heating amount by the point heater increases, the modeling apparatus 100 adjusts the movement amount of the droplet 820 according to the necessary movement amount by adjusting the heating amount by the point heater. be able to.

Further, the movement processing unit 120 increases the amount of heating by the point heater as the wettability is smaller according to the wettability of the droplet 820.
Thereby, the influence of the wettability on the moving distance of the droplet 820 can be reduced, and in this respect, the moving distance of the droplet 820 can be made constant regardless of the wettability.

In addition, the movement processing unit 120 increases the amount of heating by the point heater as the viscosity increases according to the viscosity of the droplet 820.
Thereby, the influence of the viscosity on the moving distance of the droplet 820 can be reduced, and in this respect, the moving distance of the droplet 820 can be made constant regardless of the viscosity.

Further, the movement processing unit 120 moves each of the plurality of types of material droplets 821 at different timings. The plurality of types of material droplets 821 are independent of each other. The modeling unit 110 performs modeling using each of a plurality of types of material droplets 821 in the modeling region.
Thereby, the modeling apparatus 100 can produce | generate the target object containing multiple types of material.

In addition, the movement processing unit 120 moves the material droplet 821 and the cleaning liquid droplet 822 at different timings. The modeling unit 110 models the material droplet 821 in the modeling area.
This eliminates the need for the user to manually move not only the material droplet 821 but also the cleaning liquid droplet 822. According to the modeling apparatus 100, the burden on the user can be reduced in this respect.

In addition, the modeling unit 110 irradiates the droplet 820 placed on the substrate 810 that transmits the laser beam (modeling beam B11) with laser light from below the substrate 810 so as to focus on the droplet 820. .
When the modeling unit 110 irradiates the laser beam from the lower side of the substrate 810, the laser beam reaches the upper surface of the droplet 820 after focusing. Therefore, the position where the laser beam is focused is not affected by refraction according to the shape of the droplet 820 due to surface tension. In this respect, the modeling system 1 can perform the alignment of the focus of the laser light with high accuracy.

Note that the method of changing the position where the modeling beam B11 is focused is not limited to the method of changing the position of the laser beam emitting portion of the modeling unit 110. Instead of the laser beam emitting portion of the modeling unit 110, the support base 130 may be moved.
Alternatively, the angle at which the laser beam emitting portion of the modeling unit 110 emits the modeling beam B11 may be changed.

FIG. 32 shows an example of the relationship between the angle of the modeling beam B11 and the position of the focal point.
In the example of FIG. 32, the laser beam emitting portion of the modeling unit 110 functions as an objective lens, and the modeling beam incident from the side opposite to the droplet 820 (the lower side of FIG. 32) is refracted to the side of the droplet 820 ( Irradiate to the upper side of FIG.
The incident angle of the shaped beam B11 to the laser beam emitted portion of the shaping part 110 indicated by theta _I. The exit angle of the shaped beam B11 from the laser beam emitted portion of the shaping part 110 indicated by theta _O. The outgoing angle θ _O varies depending on the incident angle θ _I. As the emission angle θ _O changes, the position of the point P11 where the modeling beam B11 is focused also changes. Accordingly, the shaped portion 110, by changing the incident angle theta _I to the laser beam emitted portion of a shaped beam B11, the position of the laser beam emitted portion, without the need to any position of the substrate 810 is changed, for molding The position where the beam B11 is focused can be changed.
As a method for changing the incident angle theta _I, for example, it is possible to use a method of the mirror is provided, to change the orientation of the mirror between the light source and the laser beam emitted portion of the shaped portion 110 of the shaped beam B11.

Note that the dripping port 140 may drop the liquid material into the modeling region in addition to the cleaning liquid or instead of the cleaning liquid. In this case, the modeling unit 110 irradiates the modeling beam B11 on the material droplet 820 dropped by the dropping port 140 into the modeling region, and solidifies a part of the material droplet 820. Thereafter, the movement processing unit 120 irradiates the heating beam B12 to move the material droplet 820 to the outside of the modeling region. Thus, modeling can be performed as in the case where the movement processing unit 120 moves the material droplet 820 into the modeling region as described above.

Note that a program for realizing all or part of the functions performed by the control device 200 is recorded on a computer-readable recording medium, and the program recorded on the recording medium is read into a computer system and executed. Thus, the processing of each unit may be performed. Here, the “computer system” includes an OS and hardware such as peripheral devices.
Further, the “computer system” includes a homepage providing environment (or display environment) if a WWW system is used.
The “computer-readable recording medium” refers to a storage device such as a flexible medium, a magneto-optical disk, a portable medium such as a ROM or a CD-ROM, and a hard disk incorporated in a computer system. The program may be a program for realizing a part of the functions described above, and may be a program capable of realizing the functions described above in combination with a program already recorded in a computer system.

As described above, the embodiment of the present invention has been described in detail with reference to the drawings. However, the specific configuration is not limited to this embodiment, and design changes and the like within the scope of the present invention are included.

The present invention may be applied to a modeling apparatus, a droplet moving device, an object production method, a droplet moving method, and a program.

DESCRIPTION OF SYMBOLS 1 Modeling system 100 Modeling apparatus 110 Modeling part 120 Movement processing part 130 Support stand 140 Drip port 200 Control apparatus 210 Display part 220 Operation input part 280 Storage part 290 Processing part

Claims (15)

1. A movement processing unit for moving droplets;
   A modeling part that performs modeling by partially changing the droplet into a solid within a predetermined modeling area; and
   A modeling apparatus comprising:
2. The modeling apparatus according to claim 1, wherein the movement processing unit moves the droplets by generating a temperature gradient in the droplets using a point heater using electromagnetic waves.
3. The modeling apparatus according to claim 2, wherein the movement processing unit moves the droplets on a surface on which a water-repellent material is partially disposed.
4. The modeling apparatus according to claim 2 or 3, wherein the movement processing unit increases the amount of heating by the point heater as the distance to which the droplet should be moved is larger.
5. The modeling apparatus according to any one of claims 2 to 4, wherein the movement processing unit increases a heating amount by the point heater as the wettability of the droplet is smaller.
6. The modeling apparatus according to any one of claims 2 to 5, wherein the movement processing unit increases the amount of heating by the point heater as the viscosity of the droplet increases.
7. The movement processing unit moves each of a plurality of droplets made of different types of materials at different timings,
   The modeling unit performs the modeling by partially changing each of the plurality of droplets into a solid in the modeling region.
   The modeling apparatus as described in any one of Claim 1 to 6.
8. The movement processing unit moves each of the droplets as the target material and the droplets of the cleaning liquid at different timings,
   The modeling unit models the object by partially changing a droplet that is a material of the object in the modeling region into a solid,
   The modeling apparatus as described in any one of Claim 1 to 7.
9. The said modeling part irradiates the said laser beam from the bottom of the said board | substrate so that the said droplet placed on the board | substrate which permeate | transmits a laser beam may be focused in the said droplet. The modeling apparatus according to claim 1.
10. A plurality of droplets made of different types of materials as the target material are moved at different timings, and the cleaning liquid droplets are moved at a timing different from the timing at which the plurality of droplets are moved. A movement processing unit;
    A modeling unit that models the object by partially changing the plurality of droplets into a solid within a predetermined modeling region;
    A modeling apparatus comprising:
11. A droplet moving apparatus comprising a movement processing unit that moves a droplet by generating a temperature gradient in the droplet using a point heater using electromagnetic waves.
12. A step of performing modeling by partially changing a droplet into a solid within a predetermined modeling region;
    Moving the droplet after application of the step of performing the modeling out of the modeling region;
    Including object production method.
13. A droplet moving method including a step of moving the droplet by generating a temperature gradient in the droplet using a point heater using electromagnetic waves.
14. On the computer,
    A step of performing modeling by partially changing a droplet into a solid within a predetermined modeling region;
    Moving the droplet after application of the step of performing the modeling out of the modeling region;
    A program for running
15. On the computer,
    A program for executing a step of moving the droplet by causing a temperature gradient to the droplet using a point heater by electromagnetic waves.

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