JPWO2019155813A1 - Method of manufacturing radiation detector and apparatus of manufacturing radiation detector - Google Patents

Abstract

An object of the present invention is to provide a manufacturing apparatus and a manufacturing method of a radiation detector capable of performing simple and accurate alignment, improving luminance and resolution, and improving the use efficiency of a scintillator, and obtained by an imaging unit. Based on the information, at least two reference points satisfying the following are set on the grid-shaped partition walls formed on the light-emitting panel and the photoelectric conversion elements formed on the photoelectric conversion panel, and an operation using the information on the reference points is performed. To manufacture a radiation detector by executing a position adjusting step of operating a gantry on which a light-emitting panel and / or a photoelectric conversion panel is mounted based on a calculation result, and to provide a device capable of performing the same. Is the gist. [Selection diagram] Fig. 4

Description

  The present invention relates to a method for manufacturing a radiation detector used for a medical diagnostic apparatus, a nondestructive inspection apparatus, and the like, and an apparatus for manufacturing the same.

  Conventionally, X-ray images using films have been widely used in medical practice. However, since an X-ray image using a film is analog image information, digital radiation detection such as a computed radiography (CR) or a flat panel detector (FPD) has recently been used. Equipment is being developed.

  In the FPD, a scintillator panel, which is a luminous panel that converts radiation into visible light, is used. The scintillator panel includes an X-ray phosphor such as cesium iodide (CsI), and the X-ray phosphor emits visible light in response to the irradiated X-rays, and the light is emitted by a thin film transistor (TFT). The X-ray information is converted into digital image information by converting the X-ray information into an electric signal by using a CCD or a charge-coupled device (CCD). However, the FPD has a problem that the image resolution is low. This is because visible light is scattered by the phosphor itself when the X-ray phosphor emits light. In order to reduce the influence of this light scattering, a method has been proposed in which phosphors are filled in cells partitioned by partition walls (Patent Documents 1 to 4).

  However, as a method for forming such a partition wall, a method of etching a silicon wafer is known. In this method, the size of a scintillator panel that can be formed is limited by the size of the silicon wafer, and a 500 mm square is used. Could not be obtained. On the other hand, there is also a technique of manufacturing a scintillator panel by processing a partition having a low softening point glass containing 2 to 20% by mass of an alkali metal oxide as a main component into a large area with high precision using a glass powder-containing paste. It is known (Patent Document 4).

JP-A-5-60871 JP-A-5-188148 JP 2011-7552 A International Publication WO2012 / 161304 pamphlet

  In order to maximize the advantage of the scintillator panel having the cell structure with the partition walls, each element of the photoelectric conversion elements arranged on the light receiving substrate facing the scintillator panel and the pixels formed by the grid-like partition are positioned without displacement. It is important to attach and paste. If the position of the photoelectric conversion element is shifted from the light emitting portion due to the opening of the partition wall, that is, the scintillation, there is a partition wall that does not emit light in the light receiving area, and the light receiving efficiency decreases. Further, since the emitted light leaks into the adjacent photoelectric conversion element, there is a problem that the original image sharpness cannot be obtained. In order to avoid this, a technique for aligning the scintillator panel and the photoelectric conversion element and pasting them accurately is required. For this purpose, a method of providing an alignment mark outside each display area and coaxially aligning and attaching the alignment mark to each other may be used.

  However, in order to form an alignment mark that maintains a positional relationship with pixels in the display area with high precision, a technique such as a photolithographic technique is limited, and a processing technique is restricted. In addition, when the thickness of the partition wall is large, it is necessary to perform alignment with the marks spaced apart from each other, and the alignment accuracy is reduced due to the influence of the optical axis shift of the camera. Another problem is that it is not possible to confirm the displacement after bonding.

  In addition, as a method of performing alignment without using an alignment mark, a through-wall portion having no phosphor and a base material is provided in a part of the cell structure, and a photoelectric conversion element is visually recognized by a camera through the through-wall and aligned. There is also. In this case, there is a problem that the penetrating partition part becomes a non-display area and the effective area of the radiation detector is reduced.

  Therefore, an object of the present invention is to provide a manufacturing apparatus and a manufacturing method of a radiation detector capable of performing alignment easily and accurately and improving luminance, resolution, and use efficiency of a scintillator.

This object can be achieved by any of the following technical means.
(1) A grid-like partition formed in a matrix at the same pitch on a sheet-like base material (a region where cells partitioned by such a grid-like partition are arranged in a matrix is referred to as a partition-forming region). A light-emitting panel in which a material that emits visible light upon irradiation with radiation is arranged in a cell surrounded by the lattice-shaped partition walls (a structure in which the light-emitting material is arranged in the cell is simply referred to as a pixel) is referred to as a first pixel. The process of placing on a gantry,
A photoelectric conversion panel in which photoelectric conversion elements for detecting visible light are arranged in a matrix at the same pitch on a sheet-shaped transparent substrate (a region where such photoelectric conversion elements are arranged in a matrix is referred to as an element formation region). Placing on a second gantry,
A first imaging step of imaging at least two places from the surface of the luminous body panel on the first base on which the partition is provided, so that the partition is included;
From the side opposite to the surface on which the photoelectric conversion element of the photoelectric conversion panel on the second base is provided, via a transparent base material, or from the side of the surface on which the photoelectric conversion element is provided, the photoelectric conversion element is A second imaging step of imaging at least two locations to be included,
A first arithmetic processing step of performing arithmetic processing based on the images of the light-emitting panel and the photoelectric conversion panel captured in the first imaging step and the second imaging step;
A first position adjustment for operating the first mount and / or the second mount based on the result of the first arithmetic processing so as to arrange the luminous body panel and the photoelectric conversion panel in parallel to an opposing position; Process, and
A method for manufacturing a radiation detector, comprising: a laminating step of laminating and laminating the luminous body panel and the photoelectric conversion panel while maintaining a relative position on a horizontal plane,
Here, the pitch of the cells partitioned by the partition and the pitch of the photoelectric conversion elements, the cells partitioned by the partition in the light emitting panel, the photoelectric conversion elements are arranged in the photoelectric conversion panel, In at least two directions overlapping when facing each other, one of them is equal or one is an integral multiple of the other,
The regions to be imaged in the first imaging step and the second imaging step are at opposing positions when the two directions are arranged so as to overlap at the time of opposing arrangement, and in the partition wall forming region or the element forming region. Where the pixels or elements whose arrangement information is known are included, at least two areas in each of the partition wall forming area and the element forming area,
The first operation step includes:
a) A step of selecting a pixel or a photoelectric conversion element in each imaging region, provided that the relative arrangement information of the selected grid or photoelectric conversion element is made to match.

  b) a step of setting a reference point in the selected pixel or photoelectric conversion element, provided that the absolute position of the reference point in the grid or the photoelectric conversion element is matched.

c) calculating the direction in which the base on which the light emitting panel or the photoelectric conversion element panel is mounted, the moving length, and the rotation angle so that the sum of the distances between the reference points in each of the opposing regions is minimized;
A method for manufacturing a radiation detector, comprising:
(2) After the first position adjustment and before the bonding step,
A third imaging step of imaging a partition on the photoelectric conversion element and the luminous body panel from a surface of the photoelectric conversion panel opposite to a surface on which the photoelectric conversion element is provided;
A second arithmetic processing step of performing arithmetic processing based on the image of the photoelectric conversion element and the image of the partition wall captured in the third imaging step;
A second position adjusting step of operating the first mount and / or the second mount based on the calculation result of the second calculation processing step to adjust a relative position between the light-emitting panel and the photoelectric conversion panel; Including
The second arithmetic processing step detects a shift amount between the image of the partition wall and the image between the rows of the photoelectric conversion elements and detects a mount on which the light emitting panel or the photoelectric conversion element panel is mounted so as to minimize the shift amount. The method for manufacturing a radiation detector according to the above (1), wherein the operation direction, the moving length, and the rotation angle are calculated.
(3) The bonding step (1) or (2), wherein the bonding step is performed by pressing the luminous body panel and the photoelectric conversion panel using an elastic roller or a pad via an adhesive sheet. Method for manufacturing a radiation detector.
(4) The method for producing a radiation detector according to (3), wherein the pressurization using the elastic roller or the pad is performed under a reduced pressure atmosphere.
(5) The radiation detector according to (1) or (2), wherein, in the bonding step, the light-emitting panel and the photoelectric conversion panel are bonded to each other via an adhesive that is cured by heat or ultraviolet light. Production method.
(6) a first base on which the first panel is placed;
A second mount on which the second panel is placed,
A first imaging device arranged to face the first gantry at the time of imaging, and arranged on the back side of the second gantry to image the first panel and the second panel;
An arithmetic unit that performs arithmetic processing based on images of the first panel and the second panel captured by the first imaging device;
Position adjusting means for operating the first frame and / or the second frame based on the result of the first arithmetic processing so as to arrange the first panel and the second panel in parallel to the opposing position. ,and,
A panel bonding apparatus, comprising: bonding means for bonding and bonding the first panel and the second panel while maintaining a relative position on a horizontal plane,
The second mount is configured such that the second panel can be observed by a first imaging device,
A grid-like partition wall in which the first panel is formed in a matrix at the same pitch on a sheet-like base material and a material that emits visible light by irradiating radiation to cells surrounded by the grid-like partition wall are arranged. A light-emitting panel (a structure in which the light-emitting material is disposed in the cell is simply referred to as a pixel), and the second panel includes a photoelectric conversion element that detects visible light on a sheet-shaped transparent substrate. A photoelectric conversion panel arranged in a matrix at the same pitch, wherein a pitch of cells divided by the partition walls and a pitch of the photoelectric conversion elements are equal in at least two directions overlapping when facing each other, or one is the other integer. The area of the luminous body panel and the area of the photoelectric conversion panel, which are imaged by the first imaging device, are arranged so as to overlap each other when the two directions face each other. It is in the opposite position, and, when allocation information is an area that contains pixels or elements are known,
A. The first imaging device is at least two places so as to include a partition of the first panel, and at least two places so as to include a photoelectric conversion element of a photoelectric conversion panel from the back side of the second gantry. Can be imaged, and
B. The arithmetic means uses the input imaging data, at least,
a) A pixel or a photoelectric conversion element is selected in each imaging region (provided that the relative arrangement information of the selected grid or the photoelectric conversion element matches).
b) A reference point is set in the selected pixel or photoelectric conversion element (provided that the absolute position of the reference point in the grid or the photoelectric conversion element is the same).
c) Calculate the direction in which the base on which the light emitting panel or the photoelectric conversion element panel is mounted, the moving length, and the rotation angle so as to minimize the sum of the distances between the reference points in each of the opposing areas, and output the calculated result. An apparatus for manufacturing a radiation detector.
(7) a first mount on which the first panel is placed;
A second mount on which the second panel is placed,
A first imaging device arranged to face the first gantry, and imaging the first panel;
A second imaging device that is arranged to face the second gantry and captures an image of a second panel;
An arithmetic unit that performs arithmetic processing based on images of the first panel and the second panel captured by the first imaging device and the second imaging device;
Position adjusting means for operating the first frame and / or the second frame based on a result of the arithmetic processing to arrange the first panel and the second panel in parallel to opposing positions; and
A panel bonding apparatus, comprising: bonding means for bonding and bonding the first panel and the second panel while maintaining a relative position on a horizontal plane,
A grid-like partition wall in which the first panel is formed in a matrix at the same pitch on a sheet-like base material and a material that emits visible light by irradiating radiation to cells surrounded by the grid-like partition wall are arranged. A light-emitting panel (a structure in which the light-emitting material is disposed in the cell is simply referred to as a pixel), and the second panel includes a photoelectric conversion element that detects visible light on a sheet-shaped transparent substrate. A photoelectric conversion panel arranged in a matrix at the same pitch, wherein a pitch of cells divided by the partition walls and a pitch of the photoelectric conversion elements are equal in at least two directions overlapping when facing each other, or one is the other integer. In a double relationship,
Areas of the luminous body panel and the photoelectric conversion panel, which are imaged by the first imaging device and the second imaging device, are at opposing positions when the two directions are arranged so as to overlap at the time of opposing arrangement, and the arrangement information Is a region that contains pixels or elements that are known,
A. The first imaging device is capable of imaging at least two locations so as to include the partition wall of the first panel, and the second imaging device is capable of imaging at least two locations so as to include the photoelectric conversion element of the photoelectric conversion panel. And
B. The arithmetic means uses the input imaging data, at least,
a) A pixel or a photoelectric conversion element is selected in each imaging region (provided that the relative arrangement information of the selected grid or the photoelectric conversion element matches).
b) A reference point is set in the selected pixel or photoelectric conversion element (provided that the absolute position of the reference point in the grid or the photoelectric conversion element is the same).
c) Calculate the direction in which the base on which the light emitting panel or the photoelectric conversion element panel is mounted, the moving length, and the rotation angle so as to minimize the sum of the distances between the reference points in each of the opposing regions, and output the result. An apparatus for manufacturing a radiation detector.
(8) The apparatus for manufacturing a radiation detector according to (6) or (7), wherein the bonding unit includes an elastic roller or a pad that presses the first panel and the second panel.

  ADVANTAGE OF THE INVENTION According to this invention, a scintillator panel and a photoelectric conversion panel which have a cell structure formed of a partition can be bonded together, making the pixel of each other correspond with high precision. In addition, the pixels can be aligned and attached to each other without providing a dedicated alignment mark, and the entire surface of the pixel of the photoelectric conversion element can be used as an effective display area of the radiation detector.

It is the perspective view which represented typically the arrangement relationship of a scintillator panel and a photoelectric conversion panel. It is the front view which represented typically the structure of a scintillator panel and a photoelectric conversion panel. It is sectional drawing which represented the arrangement | positioning relationship of a scintillator panel and a photoelectric conversion panel typically. It is a front view for explaining setting of a reference point in a scintillator panel and a photoelectric conversion panel. It is an external view which shows the example of an alignment and bonding apparatus. FIG. 5 is a flowchart for visually explaining an example of alignment and bonding steps according to the present invention.

  Hereinafter, the present invention will be described with reference to the drawings, but the present invention is not construed as being limited to the embodiments shown in the drawings.

  As radiation used for light emission of the luminous body panel, electromagnetic radiation such as X-rays and γ-rays and particle radiations such as α-rays, β-rays and neutron rays can be used. Among them, X-rays are preferably used.

  FIG. 1 is a perspective view schematically showing an arrangement relationship between a scintillator panel, which is a light emitting panel, and a photoelectric conversion panel. The scintillator panel 1 includes a scintillator layer having a fluorescent substance, absorbs energy of incident radiation such as X-rays, and emits electromagnetic waves having a wavelength in the range of 300 to 800 nm, that is, from visible light to ultraviolet light. Emit electromagnetic waves (light) in a range that covers infrared light. The photoelectric conversion panel 2 has photoelectric conversion elements arranged in a plane on a transparent substrate. The scintillator panel 1 and the photoelectric conversion panel 2 are bonded via an adhesive or the like. Generally, the scintillator panel and the photoelectric conversion panel are each in the form of a rectangular sheet, and the light emitting surface of the scintillator panel and the photoelectric conversion element group in which the photoelectric conversion panels are arranged are bonded to face each other. Generally, an electrode connected to each element is formed in a plurality of blocks around the photoelectric conversion panel as lead-out wiring, and a flexible wiring member or the like is adhered and connected to a circuit board when forming an FPD later. .

  FIG. 2 is a front view schematically showing a configuration of a scintillator panel as a light-emitting panel and a photoelectric conversion panel. In the scintillator panel 1, cells partitioned by partition walls are formed in a matrix at the same pitch in a direction in which the scintillator panel 3 extends in the matrix direction. The region arranged in a shape is called a partition wall forming region), and the partitioned cells are filled with the phosphor 8. Here, as the direction in which the cells extend, for example, two directions can be assumed in the case of a rectangular cell, and three directions can be assumed in the case of a regular hexagonal or triangular cell. It is needless to say that it is desirable to have the same pitch in the direction of. In the photoelectric conversion panel 2, photoelectric conversion elements, which include a photodiode 14 and a TFT 15 in this figure, are formed in a matrix on the transparent substrate 12 at the same pitch in the direction in which the photoelectric conversion panel 2 extends. A region where the conversion elements are arranged in a matrix is referred to as an element formation region.) Needless to say, it is desirable that the pitch be the same in all directions in which the photoelectric conversion elements extend.

  In the present invention, the pitch of the cells partitioned by the partition and the pitch of the photoelectric conversion elements are such that the cells partitioned by the partitions are arranged in the light-emitting panel, and the photoelectric conversion elements are arranged in the photoelectric conversion panel. In at least two directions overlapping when facing each other, one of them is equal or the other is an integral multiple of the other. For example, when the cells partitioned by the partition on the luminous body panel and the photoelectric conversion elements on the photoelectric conversion panel are the same in shape and size, and are arranged in the same pattern, the cells are partitioned by the partition. Can be matched in all directions in which a given cell extends and a photoelectric conversion element extends. In the case where one pitch is an integral multiple of the other pitch in one extending direction, a plurality of Of cells or photoelectric conversion elements can correspond to one photoelectric conversion element or cell. By taking at least two such directions, it is possible to establish a correspondence between the cells and the photoelectric conversion elements which are divided by the partition in a plane.

  As a typical example, as shown in FIG. 2, the cell and the photoelectric conversion element partitioned by the partition are both rectangular and have the same shape and size. In addition, it is preferable to do so because it is possible to increase the utilization efficiency of the substrate and to increase the efficiency from light emission such as fluorescence to photoelectric conversion. Here, the width of the partition and the distance between the photoelectric conversion elements do not necessarily need to be equal, and the size of the cell and the photoelectric conversion element divided by the partition is the center line of the partition and the center line of the gap between the photoelectric conversion elements. It can be understood as being surrounded. It is preferable that the width of the partition wall and the distance between the photoelectric conversion elements are equal or the latter is shorter in order to increase the utilization efficiency of emitted light.

  Since the photoelectric conversion panel has a photoelectric conversion element formed on a transparent substrate, light can be transmitted outside the element formation region. Further, the photoelectric conversion element can be observed from the back surface of the panel.

  FIG. 3 is a sectional view taken along the line ab in FIG. The scintillator panel 1 according to this example has a configuration in which a flat base material 3 and a scintillator layer including a partition 6 are bonded via an adhesive layer 4. A cell structure is formed in the space defined by the partition walls 6, and the cells are filled with the phosphors 8. A reflective layer 7 is formed on the surface of the partition 6, and a partition reinforcing layer 5 is provided between the partition 6 and the adhesive layer 4. The scintillator panel 1 and the photoelectric conversion panel 2 are bonded by a transparent bonding layer 9. The photoelectric conversion panel 2 includes a photoelectric conversion element 10 and an output layer 11 arranged two-dimensionally on a transparent substrate 12, and is connected to a power supply unit 13. When light emitted by the radiation reaches the photoelectric conversion element 10, an electric signal is output through the output layer 11. As shown in FIG. 3, in this scintillator panel, pixels of the scintillator are formed by a grid of partition walls, and the pixel pitch is a partition pitch which is an interval between adjacent partition walls. By designing the partition pitch to be the same as the pitch of the elements formed by the photoelectric conversion elements 10, the pixels in the panel can be bonded in a one-to-one correspondence. Thereby, the light emitted by the radiation can be transmitted to the photoelectric conversion element corresponding to each cell without diffusing to the adjacent pixels, and an image with high sharpness can be obtained. Although not shown, one of the pixel pitches may be an integral multiple of the other. Generally, as the pixel pitch is smaller, an image with higher sharpness can be obtained, but the sensitivity, which is an index of brightness, is lower. For example, by designing and bonding a partition pitch that is an integral multiple of the pixel pitch of the photoelectric conversion element, a panel with higher sensitivity but lower sharpness can be manufactured.

  Hereinafter, an example of a method for manufacturing the scintillator panel 1 which is a light-emitting panel used in the present invention will be described. A glass powder-containing paste A is applied to the entire surface of a base material such as a glass substrate on a flat plate by a screen printing method or the like, and dried to obtain a coating film A. A paste B containing glass powder is applied to the entire surface of the coating film A using a screen printing method or the like, and dried to obtain a coating film B. It is preferable that the coating film B is formed so as to completely cover the coating film A. These are baked to remove organic components. The glass powder-containing paste A is mainly composed of an inorganic powder having a melting point higher than the firing temperature, and the glass powder-containing paste B is mainly composed of a low-melting glass powder having a melting point lower than the firing temperature. Is a non-sintered layer, and the coating film B covering the non-sintered layer can be a sintered layer. By forming the coating film A as a non-sintered layer, it can be used as a separation assisting layer for layer separation performed in a later step. Since the coating film B, which is a sintered layer, is strong, it can be used as a partition reinforcing layer 5 for stably forming a grid-like partition. A paste C containing glass powder is applied on the coating film B in a sheet shape using a slit die coater or the like, and dried to obtain a coating film C. The coating film C is patterned by a photolithography method or the like to obtain a grid-like partition pattern. This is baked and the organic component is removed to obtain the partition walls 6. The reflection layer 7 is formed so as to cover the surface of the formed partition, and the inside of the cell partitioned by the partition is filled with the phosphor 8. Next, the scintillator layer above the partition auxiliary layer formed of the base material and the coating film B is peeled from the coating film A, which is the release auxiliary layer, by cutting the outer peripheral portion of the partition pattern including the coating film A of the substrate. can do. The scintillator panel 1 can be manufactured by bonding this to a base material 3 made of a material having low radiation absorption such as a film using the adhesive layer 4.

The method for manufacturing a radiation detector according to the present invention includes the following steps.
(1) Step of mounting luminous body panel on first gantry (2) Step of mounting photoelectric conversion panel on second gantry (3) Partition of scintillator panel on first gantry is provided First imaging step of imaging at least two places so that the partition is included from the surface on the side of (4) from the surface of the photoelectric conversion panel on the second gantry opposite to the surface on which the photoelectric conversion elements are provided A second imaging step of imaging at least two places via the transparent base material or from the side of the surface on which the photoelectric conversion element is provided so as to include the photoelectric conversion element; (5) a first imaging step and a second imaging step A first arithmetic processing step of performing arithmetic processing based on the images of the light-emitting panel and the photoelectric conversion panel captured in the imaging step (6), based on the result of the first arithmetic processing, on the first base or the second frame. Operate the gantry to position the light-emitting panel and photoelectric conversion panel in opposite positions A first position adjustment step (7) while maintaining the relative position in the horizontal plane light emitter panel and step of bonding by superimposing photoelectric conversion panel arranged parallel to the.

  In the present invention, the luminous body panel and the photoelectric conversion panel are preferably mounted on a gantry that can be operated in the horizontal direction, the height direction, and the rotation axis direction, and the relative positions thereof can be adjusted. In addition, it is sufficient that both mounts can adjust the relative positions of the light-emitting panel and the photoelectric conversion panel. In addition, it is preferable to mount the luminous body panel and the photoelectric conversion panel in advance so that the orientation of the panel to which the luminous body panel and the photoelectric conversion panel are bonded is identical in order to avoid unnecessary operation of the gantry.

  Next, the regions to be imaged in the first imaging step and the second imaging step are located at opposing positions when the panels are superimposed, and the arrangement information in the partition wall formation region or the element formation region is known. That is, it is necessary that there are at least two regions including the pixel or the element, from which the information of the pixel or the element can be obtained from the real object. In a first calculation step to be described later, a reference point is set in the imaged area. However, since the imaged area is selected so as to be opposed, the reference point between the reference points in the opposed area is set. It is possible to enhance the alignment accuracy between the light-emitting panel and the photoelectric conversion panel based on the result of the distance minimization operation.

  There is no particular limitation on the imaging device used in the first imaging step and the second imaging step, but a CCD camera is generally used. Further, in the second imaging step, since the photoelectric conversion panel is manufactured using a transparent base material, imaging through the transparent base material from the surface opposite to the surface on which the photoelectric conversion elements are provided can be performed. It is also possible to take an image from the side on which the photoelectric conversion element is provided, but since the image can be taken using the same camera, the side opposite to the side on which the photoelectric conversion element is provided It is desirable to perform imaging from the surface through a transparent base material.

  Next, in the first calculation step, an example in which a cell partitioned by a partition on a light-emitting panel and a photoelectric conversion element on a photoelectric conversion panel are formed as squares of the same size so that the present invention can be easily understood. This will be described with reference to FIG.

  First, a pixel is selected in a light emitting panel for setting a reference point from an imaged area, and a photoelectric conversion element is selected in a photoelectric conversion panel. The selection of the pixel or the photoelectric conversion element is made based on the coordinate information of the pixel or the photoelectric conversion element which is known in advance. For example, when square pixels or photoelectric conversion elements are arranged as shown in FIG. 4, the coordinates of the pixel or the photoelectric conversion element are specified as the pixels in the m-th row and the n-th column (where m and n are integers). be able to. In order to enable such selection, it is preferable that the imaging area includes a pixel or a photoelectric conversion element having a unique characteristic, and the coordinate information of the pixel or the photoelectric conversion element having the unique characteristic is included. The element to be selected can be determined based on As a pixel or a photoelectric conversion element having such a unique feature, a pixel or a photoelectric conversion element having a different number of adjacent pixels or photoelectric conversion elements can be given. For example, in the case where the partition wall formation region or the element formation region as shown in FIG. 4 is rectangular, a pixel or a photoelectric conversion element at a corner corresponds to such a pixel or a photoelectric conversion element. For example, the coordinate information of the four corners in the rectangular partition wall forming region can be grasped as unique information when the partition panel is manufactured, and the same applies to the photoelectric conversion panel.

  This will be specifically described with reference to FIG. FIG. 4 is a schematic view of a corner portion of a scintillator panel provided with a partition wall and a corner portion of a photoelectric conversion panel opposite to the surface provided with a photoelectric conversion element. These corners have a positional relationship of facing each other when the two panels are overlapped, and an image of the area shown in FIG. 4 is taken in the first imaging step and the second imaging step. Although only one corner is shown in the figure, two or more corners are implemented in each panel. As an example of setting a reference pixel from an image obtained by imaging the partition wall forming region of the scintillator panel, a pixel at the corner portion or a photoelectric conversion element is used as a pixel or a photoelectric conversion element having unique characteristics. Three pixels are selected in the X direction (horizontal direction in the figure) toward the X direction, and the third pixel in the Y direction (vertical direction in the figure) is selected. On the other hand, on the photoelectric conversion panel side, one pixel in the X direction and one pixel in the Y direction are selected.

  The pixels for setting the reference point are obtained at least two each in the light-emitting panel and the photoelectric conversion panel, and these pixels or the photoelectric conversion elements are selected such that the relative arrangement information matches. The coincidence of the relative arrangement information means that selection is made such that the distance on the coordinate information between the selected pixels and the distance on the coordinate information between the selected photoelectric conversion elements match. This is concretely based on the above-described example (an example in which the cells partitioned by the partition on the light-emitting panel and the photoelectric conversion elements on the photoelectric conversion panel are formed of the same size square as in FIG. 4). To explain, the coordinate information of the pixel selected on the light emitting panel is α (a, b) and β (c, d), and the coordinate information of the pixel selected on the photoelectric conversion panel is γ (A, B) and δ ( C, D) means that the relationship of (Equation 1) and (Equation 2) is established. Note that α (a, b) means the a-th pixel in the X direction and the b-th pixel in the Y direction from the pixel at the zero point.

(Ac) = (AC) (Equation 1)
(B−d) = (BD) (Equation 2)
Note that, in this example, an example is used in which a cell partitioned by a partition on the light-emitting panel and a photoelectric conversion element on the photoelectric conversion panel are formed in a square of the same size. If the pitch in the X direction is twice as large as the pitch of the photoelectric conversion elements of the photoelectric conversion panel in the X direction, (Equation 1) is expressed as (Equation 1 ′).

1/2 × (ac) = (AC) (Equation 1 ′)
Needless to say, since the coordinate information of a pixel or a photoelectric conversion element having a unique characteristic included in the area to be imaged can be input to the arithmetic means as a known information, It is not necessary that the zero point is reflected.

In the present invention, it is possible to preferably perform a second arithmetic processing step described later. However, when the luminous body panel and the photoelectric conversion panel are overlapped, the partition wall formation region is viewed from the side of the photoelectric conversion panel. It is desirable to overlap the elements so as to protrude outside the element formation region so that they can be observed without being hidden. This is concretely based on the above-described example (an example in which the cells partitioned by the partition on the light-emitting panel and the photoelectric conversion elements on the photoelectric conversion panel are formed of the same size square as in FIG. 4). To explain, the pixels of the luminous body panel are arranged in m rows and n columns, the photoelectric conversion elements of the photoelectric conversion panel are arranged in M rows and N columns, and the coordinate information of the pixel in which the reference point on the light emitting panel side is set is shown. When ε (e, f) and coordinate information of the corresponding photoelectric conversion element of the photoelectric conversion panel are ζ (E, F) (where e, f, E, F are positive integers),
(E−E) ≧ 1, (f−F) ≧ 1
Is preferable, and in that case, it is desirable that the partition wall forming region is larger in size than the element forming region, and from the viewpoint of increasing the number of effective pixels,
m> M, n> N,
me ≧ M, n−f ≧ N,
Is preferably satisfied.

  Next, a reference point is set in the selected pixel or photoelectric conversion element. Here, the reference point is selected such that the absolute position in the pixel coincides with the absolute position in the photoelectric conversion element. An example of the simplest setting is to select a lattice point, that is, a place (point) where the contact with other pixels or photoelectric conversion elements is the largest. This is concretely based on the above-described example (an example in which the cells partitioned by the partition on the light-emitting panel and the photoelectric conversion elements on the photoelectric conversion panel are formed of the same size square as in FIG. 4). In FIG. 4, the lower left corner of the grid (the scintillator panel reference point 16 in FIG. 4) and the corresponding lower left corner on the photoelectric conversion element (the photoelectric conversion panel reference point 17 in FIG. 4) are selected. In addition, for example, the point may be defined as a point 1 μm above the lower left corner.

  The first calculation step is performed based on the reference points determined in this manner. The calculation in the first calculation step is performed in such a manner as to minimize the sum of the distances between the reference points in each of the opposing regions, the direction in which the gantry on which the light-emitting panel or the photoelectric conversion panel is mounted, the moving length, and the rotation angle. Is calculated. For example, when there are two reference points on the light emitting panel and two reference points on the photoelectric conversion panel, a line connecting the reference point on the light emitting panel and a line connecting the reference point on the photoelectric conversion panel When they face each other, they overlap (that is, the two line segments are parallel without any twisting relationship, and the distance between the line segments is the minimum (however, the distance between the light-emitting panel and the photoelectric conversion panel is This is to find a position that minimizes the length of the part that does not overlap and that does not overlap (that is, the part of the line that protrudes).

  In the case where the number of reference points is three or more, overlap of polygons formed by connecting the reference points is minimized (for example, displacement that minimizes the distance between vertices in two overlapping polygons, overlapping area). Is calculated).

  Subsequently, based on the result of the first calculation step, the gantry on which the light-emitting panel and the photoelectric conversion panel are mounted is operated, and the alignment, that is, the first position adjustment is completed. In addition, both gantry may be operated, or only one of the gantry may be operated.

Further, the present invention is preferable, after the first position adjustment step and before the bonding step described later,
A third imaging step of imaging a partition on the photoelectric conversion element and the luminous body panel from a surface of the photoelectric conversion panel opposite to a surface on which the photoelectric conversion element is provided;
A second arithmetic processing step of performing arithmetic processing based on the image of the photoelectric conversion element and the image of the partition wall captured in the third imaging step;
A second position adjusting step of adjusting the relative positions of the luminous body panel and the photoelectric conversion panel by operating the first gantry and the second gantry based on the arithmetic result of the second arithmetic processing step;
Wherein the second arithmetic processing step detects a shift amount between the image of the partition wall and the image between the rows of the photoelectric conversion elements and minimizes the shift amount by using the light emitting panel or the photoelectric conversion unit. The direction in which the gantry on which the conversion element panel is mounted is operated, the moving length, and the rotation angle are calculated.

  That is, after the first position adjustment step, alignment with high accuracy has been performed, but there is a possibility that a slight twist relationship has occurred between the row of pixels and the row of photoelectric conversion elements.

  Therefore, in the third imaging step, the rows of the photoelectric conversion elements and the partition walls are imaged from the surface opposite to the surface on which the photoelectric conversion elements are provided, and in the second arithmetic processing step, the direction in which each extends is determined. The degree of twist is calculated, and the twist is corrected based on the calculation result in the second position adjustment step. In the second operation step, the extending direction of the partition is obtained in the light-emitting panel by image processing. However, in the photoelectric conversion element panel, the gap between the photoelectric conversion elements is detected and the extension of the photoelectric conversion element is detected. The calculation can be performed with high accuracy by obtaining the direction of presence.

  Next, the bonding step will be described.

  A known method can be adopted as a method of bonding the light emitting panel and the photoelectric conversion panel. For example, it is possible to firmly adhere by pressing with an adhesive sheet and an elastic roller or a pad. In addition, bonding can be performed via an adhesive that is cured by heat or ultraviolet light. The area to which the adhesive sheet or the adhesive is applied may be the whole area of the partition wall forming area or the element forming area, or may be one part. In the case of one part, the gap between the light-emitting panel and the photoelectric conversion panel can be reduced as much as possible by providing it to the outer peripheral part of the panel. In the aligned bonding, the luminous body panel and the photoelectric conversion panel should be bonded so as not to be displaced, that is, they should be bonded while maintaining their relative positions on the horizontal plane.

  Embodiments of the present invention will be described more specifically below, but the present invention is not construed as being limited to such specific examples.

  FIG. 5 schematically shows an example of the configuration of an alignment bonding apparatus capable of implementing the present invention. Two suction stages with the panel suction surfaces facing each other, a lower stage 18 (corresponding to a second gantry) and an upper stage 20 (corresponding to a first gantry) are provided. The lower stage 18 has a mechanism that slides in the left-right direction (X direction), can move to just below the upper stage, and can also move in the vertical direction (Y direction), the rotation direction (θ direction), and the vertical direction (Z direction). You can move. The panel fixed to the lower stage 18 by this mechanism (corresponding to the position adjusting means) can be transferred to the upper stage 20 after being moved so as to be sandwiched between the lower stage 18 and the upper stage 20. After the panel is delivered to the upper stage, another panel is sucked to the lower stage and moved in the same manner, so that the two panels can be overlapped. Further, a through hole 19 is provided at a predetermined position in the lower stage, and a panel (a second panel) sucked through the through hole 19 by two cameras 21 (corresponding to the first imaging device) installed on the opposite surface of the upper stage. 2 (corresponding to the second panel) can be imaged from the back surface. The imaging of the panel (corresponding to the first panel) adsorbed on the upper stage 20 can be performed with the lower stage retracted from the facing surface. Images can also be taken through the stage panel. With such an apparatus configuration, when a reference point serving as a bonding reference is arranged at the position of the panel corresponding to the through hole, position measurement and alignment, that is, alignment of the panel can be performed. If the image of the reference points of the two panels to be bonded together with the camera fixed is taken, the panel position can be measured in the same coordinate system. The rubber roller 22 can press the surface of the panel while the two panels attached to the lower stage are placed on the lower stage, and can move the lower stage in the X direction to uniformly bond the two. In addition, by installing a camera 21 '(not shown) on the opposite side of the lower stage, it is also possible to adopt a configuration in which each panel adsorbed on the upper and lower stages is imaged from its front side. In this case, since it is not necessary to image the back surface of the panel through the lower stage, the through hole 19 provided in the lower stage is not necessarily required. However, in order to align and bond the panels with each other with high precision, the positional relationship between the camera 21 and the camera 21 ′ is set and installed with high accuracy in advance, and the positional relationship between the camera 21 and the camera 21 ′ is different from the position information of the camera used in the calculation by the calculation means. It is necessary to install the system so that it does not occur. This is because the operation is performed based on the images captured by the respective cameras and the position of the panel is adjusted based on the result, so that the positional deviation of the cameras leads to the positional deviation at the time of bonding.

  Next, a preferred method of bonding the scintillator panel and the photoelectric conversion panel will be described using the apparatus shown in FIG. 5 as an example. FIG. 6 schematically shows one example of the process.

  In step 1, the lower stage is moved to a position farthest from the upper stage (hereinafter, a standby position). Place the scintillator panel on the lower stage at the standby position and fix it by suction. It is assumed that the direction in which the panel is mounted takes into consideration in advance the partition formation region and the shape of the pixel formed by the partition. The alignment is performed with the partition forming surface, which is the bonding surface, facing down. Here, the position is adjusted to a position where the partition wall forming region at the panel corner falls within the field of view of the camera when the image is captured using the camera in step 4 later. It is preferable to provide a reference pin on the stage, which can be used as a reference marking or a panel can be held down.

  In step 2, the lower stage is moved in the X direction to just below the upper stage. Thereafter, the lower stage is raised (Z direction), and the scintillator panel is brought into contact with the suction surface of the upper stage. By turning on the suction of the upper stage and then turning off the suction of the lower stage, the scintillator panel can be transferred to the upper stage.

  In step 3, the lower stage is lowered (Z direction) and moved to the standby position.

  In step 4, a camera captures an image of a corner of the partition wall forming region of the scintillator panel. It is preferable to image two or more places, and it is more preferable to include diagonal corners from the viewpoint of alignment accuracy. The magnification of the camera can be switched in two stages between a low magnification of several tens of times to get the partition wall formation area at the corner into the field of view and a high magnification of several hundred times used for high-precision position measurement, or continuously changed. Are preferred. Further, the pixel resolution of the camera is preferably 1 μm or less. In imaging at a low magnification, a corner portion of the partition wall forming region is taken into view, and a specific pixel is selected from the view. The pixel to be selected is assumed to have known design position information in the partition formation region, and automatic detection can be performed by setting the distance from the pixel at the corner in advance in the apparatus. If the automatic detection is not performed, the pixel pitch may be measured from the pixel pitch based on the pixel at the corner, and manually selected. Next, a bonding reference point is selected from the selected pixels. If the enlargement function of the camera can be used, the enlarged image is taken around the selected pixel. As the reference point, a point that can specify the position coordinates on the panel, such as one corner, the center of one side, or the center of the grid, is selected. By measuring the position of the reference point, the positional relationship between the scintillator panel and the device can be obtained.

  In step 5, the photoelectric conversion panel is placed on the lower stage at the standby position and fixed by suction. The mounting direction is determined from the direction in which the scintillator is placed in step 1 so that the positional relationship is appropriate when both panels are bonded. In addition, the surface on which the photoelectric conversion element, which is the bonding surface, is formed faces upward, and alignment is performed. As in the case of the scintillator panel, it is adjusted to a position where the element formation region at the panel corner falls within the field of view of the camera when the image is captured by the camera in the later step 7. Since the camera corresponds to the position of the through hole of the lower stage at a position where the lower stage has moved to immediately below the upper stage, it is possible to capture an image of the element formation region from the transparent substrate side (panel back surface) of the photoelectric conversion panel through this through hole.

  In step 6, the release film of the transparent adhesive sheet previously attached to the photoelectric conversion panel is peeled off to expose the adhesive surface. The attachment of the transparent adhesive sheet can be performed using a general laminating apparatus. At this time, the intrusion of foreign matter becomes a drawback. Therefore, consideration must be given to a clean environment such as a clean room, and charge removal by an ionizer. The transparent adhesive sheet is preferably thin as long as adhesion can be maintained, and is preferably about 5 to 30 μm. This is to reduce the loss of visible light emitted from the scintillator and to suppress light leakage between the partition and the photoelectric conversion element. In this embodiment, a transparent adhesive sheet applied to the entire surface of the element forming region of the photoelectric conversion panel is used as the adhesive layer, but an adhesive that is cured by heat or ultraviolet light may be formed in advance as the adhesive layer. The adhesive can be applied by a screen printing method, a slit coater, a dispenser, or the like. Further, the adhesive layer can be applied to a part such as an outer peripheral portion of the panel.

  In step 7, the lower stage is moved in the X direction to just below the upper stage. Thereafter, the lower stage is raised (Z direction), and the scintillator panel of the upper stage and the photoelectric conversion panel are brought close to each other. The gap between the panels is preferably about 100 to 500 μm. If it is less than 100 μm, a part of the panel may come into contact before alignment. If it is more than 500 μm, there is a high possibility that the imaging surface of the panel deviates from the depth of focus of the camera. Because it is gone. An image of an element formation region at a corner is taken from the transparent substrate side (back surface) of the photoelectric conversion panel through a through hole of the lower stage in a state where the panel is close to the panel. It is preferable that two or more corners are imaged similarly to the scintillator panel, and the positional relationship between the two panels is relatively matched. In low-magnification imaging, a corner of the element formation region is set in the field of view, and a specific photoelectric conversion element is selected from the field of view. It is preferable to select an element to be selected that overlaps the lattice selected in step 4 in design. In selecting an element, it is preferable that the partition formation area of the scintillator panel is set to be located outside the element formation area of the photoelectric conversion panel on all sides of the panel. Accordingly, when viewed from the transparent substrate side of the photoelectric conversion panel, the element on the outer peripheral portion of the photoelectric conversion panel and the partition wall of the scintillator can be visually recognized at the same time, and it is possible to confirm the presence / absence of a positional shift between the elements. As in the case of the scintillator panel, the element can be automatically detected by setting the distance from the element at the corner in advance, as in the case of the scintillator panel. When not automatically detected, the pitch may be calculated based on the element at the corner, and may be selected manually. Next, a bonding reference point is selected from the selected elements. If the enlargement function of the camera can be used, the enlarged image is taken around the selected element. As the reference point, a point that can specify the position coordinates on the panel, such as one corner, the center of one side, or the center of the element, is selected. By measuring the position of the reference point, the positional relationship between the photoelectric conversion panel and the device can be obtained. The lower stage is operated by calculating the coordinates of the reference point obtained in step 4 and the coordinates of the reference point obtained in this step so that the sum of the distances between the respective reference points is minimized with the panels facing each other. Is performed to align the elements with the pixels.

  In step 8, the aligned elements at the outer peripheral portion of the photoelectric conversion panel and the partitions located outside thereof are imaged from the transparent substrate side of the photoelectric conversion panel through the through hole of the lower stage in the same field of view through the transparent substrate, and the positional deviation is detected. Check for presence. If the alignment is normally performed, the grid of the partition will be located on the extension of the photoelectric conversion element. It is preferable to confirm the presence / absence of misalignment on the diagonal of the panel. If there is a displacement, the steps subsequent to the selection of the reference point in step 7 may be performed again to confirm again, or an arithmetic processing may be performed based on the captured image to detect the amount of image deviation. Then, the lower stage can be operated to correct the deviation so as to minimize the deviation amount. After confirming that there is no displacement, the lower stage is further raised while maintaining the horizontal positional relationship, and the scintillator panel and the photoelectric conversion panel are brought into contact via the transparent adhesive sheet. As a result, the two panels are bonded together while maintaining the position after the alignment.

  In step 9, the suction of the upper stage is released, and the lower stage is lowered. Thereafter, the lower stage is moved in the X direction while an elastic roller such as rubber is pressed against the entire width of the scintillator panel. Thereby, the entire panel can be uniformly pressed and adhered. Instead of a roller, a flat pad that presses the entire panel can be used. The rubber hardness of the elastic body is preferably 40 to 70 degrees. If it is less than 40 degrees, even if the amount of pushing into the panel is increased, the amount of deformation of the rubber becomes large, and it is difficult to transmit the necessary pressure. If it exceeds 70 degrees, the partition wall of the scintillator panel may be broken when pushed. The step of pressing the elastic body against the panel in order to increase the uniformity of the bonding may be repeated plural times. Further, in order to suppress air bubbles at the time of bonding, the whole apparatus can be installed in a vacuum chamber, and steps 8 and 9 can be performed under reduced pressure atmosphere. When an adhesive that is cured by heat or ultraviolet light is used as the adhesive layer, in step 9, heating or ultraviolet irradiation, which is a process for curing the adhesive, can be performed.

  In step 10, the lower stage is returned to the standby position, the stage is released from suction, and the bonded panel is removed. Through the steps described above, the cells and the photoelectric conversion elements defined by the partition walls of the scintillator panel and the photoelectric conversion panel can be bonded with high accuracy.

  Hereinafter, the present invention will be described specifically with reference to examples. The gist of the present invention is not construed as being limited to this example.

  As a photoelectric conversion panel, a thin film transistor (TFT) was connected to a transparent glass substrate having an element size of 139 × 139 μm, an effective element area of 302.464 × 249.88 mm, an effective element number of 2176 pixels × 1792 pixels, and a panel size of 311 × 258 mm. A panel in which photoelectric conversion elements composed of photodiodes were arranged in a matrix was prepared. A transparent adhesive sheet having an adhesive layer thickness of 25 μm was previously attached to the entire surface of the photoelectric conversion panel on which the photoelectric conversion element was formed, using a laminator. Pixels formed by lattice-shaped partitions as a scintillator panel have a size of 139 × 139 μm, an effective pixel area of 303.298 × 249.922 mm, and an effective pixel number of 2182 pixels × 1800 pixels (six pixels in the X and Y directions from the photoelectric conversion panel) A panel was prepared in which cells were partitioned by grid-like partition walls having a panel size of 304.298 × 250.922 mm and filled with a phosphor.

  The alignment and laminating apparatus has a suction stage on two flat plates arranged vertically facing each other, and the lower stage has a moving axis in a horizontal direction (XY), a vertical direction (Z), and a rotation direction (θ). , And the upper stage was fixed. Two CCD cameras for alignment capable of imaging diagonal positions of the upper stage were provided on opposite sides of the upper stage. A camera having a fixed position and capable of switching the magnification of 50 times as a low magnification and 200 times as a high magnification and having a resolution of 0.5 μm was used. The lower stage has two through holes at diagonal positions, and the two cameras correspond to the positions of the through holes when facing the upper stage. In addition, a predetermined pattern is automatically recognized from an image captured by a camera or an area set in an element, and a position measurement mechanism for measuring a position and a position measurement mechanism are calculated based on measurement position data. An alignment mechanism for moving is provided. A rubber roller capable of pressing the entire width of the stage was provided in order to uniformly bond the two panels that were temporarily bonded by bringing the upper and lower stages close to each other. The rubber roller used had a rubber hardness of 50 degrees.

  The scintillator panel was suction-fixed to the lower stage with the pixel surface formed by lattice-shaped partition walls facing down. The panel was placed so that the long side direction was the X direction of the apparatus and the short side direction was the Y direction. The scintillator panel was positioned by placing two sides on pins provided on the lower stage. The positioning pins were set so that the partition wall forming area at the corner of the scintillator panel could fit within the two alignment cameras when the lower stage was moved directly below the upper stage.

  After moving the lower stage to just below the upper stage, the lower stage was raised and the scintillator panel was brought into contact with the upper stage. At the same time, the scintillator panel was adsorbed and fixed on the upper stage, and the lower stage was released to adsorb and transfer the panel. The lower stage was lowered and moved to the standby position.

  Two alignment cameras take an image including the partition wall forming area at the corner of the scintillator panel located at the diagonal, and select the three pixels in the X and Y directions inside the panel from the pixels at the corner of this image. did. One corner of the grid close to the panel center was defined as a scintillator panel reference point. The grid is selected at a low magnification where the corner grid is within the field of view, the reference point is switched to a high magnification centered on the selected grid, and is determined by pattern matching that searches for a pre-registered image pattern from the image of the field of view. And the position was measured.

  Next, the lower stage was suction-fixed with the photoelectric conversion element surface of the photoelectric conversion panel facing upward. The direction was set so that the long side direction of the panel was the X direction of the apparatus and the short side direction was the Y direction along with the scintillator panel. Positioning was similarly performed using pins, and the element formation areas at the corners of the panel diagonal were set at positions where they could fit within the field of view of the two alignment cameras. After peeling off the release film of the transparent pressure-sensitive adhesive sheet that had been stuck in advance to expose the adhesive surface, the lower stage was moved to immediately below the upper stage. The lower stage was raised and stopped at a position where the distance between the photoelectric conversion panel and the scintillator panel was 0.3 mm.

  Here, an image of an element formation region at a corner located at a diagonal of the photoelectric conversion panel was taken using two alignment cameras. Imaging was performed from the back of the panel through a transparent substrate through a through hole provided in the lower stage. Here, an element serving as a reference of the photoelectric conversion panel was selected. As the element, the element at the most corner located at a position facing the lattice selected by the scintillator panel in design was selected. As in the scintillator panel, one corner close to the center of the panel was set as a reference point of the photoelectric conversion panel. Element selection, reference point selection and position measurement were also performed using two-stage imaging.

  Based on the position measurement results of two reference points measured on each panel, arithmetic processing is performed so that the sum of the distances between the opposed reference points is minimized, and the lower stage is moved in the X, Y, and θ directions. (Ie, left and right movement and rotation were performed). Here, at the high magnification of the camera, the element at the outermost peripheral part of the photoelectric conversion element and the partition grid of the scintillator panel located outside the element are simultaneously imaged, and no pixel displacement occurs by visual observation of the image displayed on the monitor. It was confirmed.

  Thereafter, the lower stage was raised while maintaining the positional relationship in the horizontal direction, and the panels were brought into contact with each other and temporarily bonded. Here, again, it was confirmed with a high magnification camera that no displacement occurred.

  The adhesion of the upper stage was released, and the rubber roller for bonding was operated while the lower stage was lowered, and the roller was moved to a position where the roller was pushed 0.5 mm into the scintillator panel. The lower stage was moved in the X direction while maintaining the pushing amount, and the entire surface of the panel was uniformly pressed and completely bonded. Thereafter, the lower stage was moved to the standby position to release the suction, and the bonded panel was removed.

  A circuit, a power supply, and the like were connected to this panel to make an FPD, and an X-ray detector was completed. An X-ray fluoroscopic image was taken using this. When the image was evaluated, an image sharpness of 139 μm, which was the same as the pixel pitch, was obtained. When a misalignment occurred, no characteristic moiré-like unevenness was observed. This was also confirmed from the characteristics.

1 scintillator panel (luminous body panel)
Reference Signs List 2 photoelectric conversion panel 3 base material 4 adhesive layer 5 partition reinforcing layer 6 partition 7 reflective layer 8 phosphor 9 transparent adhesive layer 10 photoelectric conversion element 11 output layer 12 transparent substrate 13 power supply unit 14 photodiode 15 TFT
16 scintillator panel reference point 17 photoelectric conversion panel reference point 18 lower stage 19 through hole 20 upper stage 21 camera 22 rubber roller

  The radiation detector manufactured by the manufacturing method of the present invention is used for a medical diagnostic device, a nondestructive inspection device, or the like.

Claims (8)

A grid-like partition formed in a matrix at the same pitch on a sheet-like base material (a region in which cells partitioned by the grid-like partition are arranged in a matrix is referred to as a partition-forming region) and the grid-like A luminous body panel in which a material that emits visible light by irradiation of radiation is arranged in a cell surrounded by the partition walls (a structure in which the luminescent material is arranged in the cell is simply referred to as a pixel) is placed on a first frame. Placing on the
A photoelectric conversion panel in which photoelectric conversion elements for detecting visible light are arranged in a matrix at the same pitch on a sheet-shaped transparent substrate (a region where such photoelectric conversion elements are arranged in a matrix is referred to as an element formation region). Placing on a second gantry,
A first imaging step of imaging at least two places from the surface of the luminous body panel on the first base on which the partition is provided, so that the partition is included;
From the side opposite to the surface on which the photoelectric conversion element of the photoelectric conversion panel on the second base is provided, via a transparent base material, or from the side of the surface on which the photoelectric conversion element is provided, the photoelectric conversion element is A second imaging step of imaging at least two locations to be included,
A first arithmetic processing step of performing arithmetic processing based on the images of the light-emitting panel and the photoelectric conversion panel captured in the first imaging step and the second imaging step;
A first position adjustment for operating the first mount and / or the second mount based on the result of the first arithmetic processing so as to arrange the luminous body panel and the photoelectric conversion panel in parallel to an opposing position; Process, and
A method for manufacturing a radiation detector, comprising: a laminating step of laminating and laminating the luminous body panel and the photoelectric conversion panel while maintaining a relative position on a horizontal plane,
Here, the pitch of the cells partitioned by the partition and the pitch of the photoelectric conversion elements, the cells partitioned by the partition in the light emitting panel, the photoelectric conversion elements are arranged in the photoelectric conversion panel, In at least two directions overlapping when facing each other, one of them is equal or one is an integral multiple of the other,
The regions to be imaged in the first imaging step and the second imaging step are at opposing positions when the two directions are arranged so as to overlap at the time of opposing arrangement, and in the partition wall forming region or the element forming region. Where the pixels or elements whose arrangement information is known are included, at least two areas in each of the partition wall forming area and the element forming area,
The first operation step includes:
a) A step of selecting a pixel or a photoelectric conversion element in each imaging region, provided that the relative arrangement information of the selected grid or photoelectric conversion element is made to match.
b) a step of setting a reference point in the selected pixel or photoelectric conversion element, provided that the absolute position of the reference point in the grid or the photoelectric conversion element is matched.
c) calculating the direction in which the base on which the light emitting panel or the photoelectric conversion element panel is mounted, the moving length, and the rotation angle so that the sum of the distances between the reference points in each of the opposing regions is minimized;
A method for manufacturing a radiation detector, comprising: After the first position adjustment and before the bonding step,
A third imaging step of imaging a partition on the photoelectric conversion element and the luminous body panel from a surface of the photoelectric conversion panel opposite to a surface on which the photoelectric conversion element is provided;
A second arithmetic processing step of performing arithmetic processing based on the image of the photoelectric conversion element and the image of the partition wall captured in the third imaging step;
A second position adjusting step of operating the first mount and / or the second mount based on the calculation result of the second calculation processing step to adjust a relative position between the light-emitting panel and the photoelectric conversion panel; Including
The second arithmetic processing step detects a shift amount between the image of the partition wall and the image between the rows of the photoelectric conversion elements and detects a mount on which the light emitting panel or the photoelectric conversion element panel is mounted so as to minimize the shift amount. The method for manufacturing a radiation detector according to claim 1, wherein an operation direction, a moving length, and a rotation angle are calculated. 3. The manufacturing of the radiation detector according to claim 1, wherein the bonding is performed by pressing the luminous body panel and the photoelectric conversion panel using an elastic roller or a pad via an adhesive sheet. 4. Method. The method for manufacturing a radiation detector according to claim 3, wherein the pressurization using the elastic roller or the pad is performed under a reduced pressure atmosphere. The method for manufacturing a radiation detector according to claim 1, wherein, in the bonding step, the light-emitting panel and the photoelectric conversion panel are bonded to each other via an adhesive that is cured by heat or ultraviolet light. A first frame on which the first panel is placed;
A second mount on which the second panel is placed,
A first imaging device arranged to face the first gantry at the time of imaging, and arranged on the back side of the second gantry to image the first panel and the second panel;
An arithmetic unit that performs arithmetic processing based on images of the first panel and the second panel captured by the first imaging device;
Position adjusting means for operating the first frame and / or the second frame based on a result of the arithmetic processing to arrange the first panel and the second panel in parallel to opposing positions; and
A panel bonding apparatus, comprising: bonding means for bonding and bonding the first panel and the second panel while maintaining a relative position on a horizontal plane,
The second mount is configured such that the second panel can be observed by a first imaging device,
A grid-like partition wall in which the first panel is formed in a matrix at the same pitch on a sheet-like base material and a material that emits visible light by irradiating radiation to cells surrounded by the grid-like partition wall are arranged. A light-emitting panel (a structure in which the light-emitting material is disposed in the cell is simply referred to as a pixel), and the second panel includes a photoelectric conversion element that detects visible light on a sheet-shaped transparent substrate. A photoelectric conversion panel arranged in a matrix at the same pitch, wherein a pitch of cells divided by the partition walls and a pitch of the photoelectric conversion elements are equal in at least two directions overlapping when facing each other, or one is the other integer. The area of the luminous body panel and the area of the photoelectric conversion panel, which are imaged by the first imaging device, are arranged so as to overlap each other when the two directions face each other. It is in the opposite position, and, when allocation information is an area that contains pixels or elements are known,
A. The first imaging device is at least two places so as to include a partition of the first panel, and at least two places so as to include a photoelectric conversion element of a photoelectric conversion panel from the back side of the second gantry. Can be imaged, and
B. The arithmetic means uses the input imaging data, at least,
a) A pixel or a photoelectric conversion element is selected in each imaging region (provided that the relative arrangement information of the selected grid or the photoelectric conversion element matches).
b) A reference point is set in the selected pixel or photoelectric conversion element (provided that the absolute position of the reference point in the grid or the photoelectric conversion element is the same).
c) Calculate the direction in which the base on which the light emitting panel or the photoelectric conversion element panel is mounted, the moving length, and the rotation angle so as to minimize the sum of the distances between the reference points in each of the opposing areas, and output the calculated result. An apparatus for manufacturing a radiation detector. A first frame on which the first panel is placed;
A second mount on which the second panel is placed,
A first imaging device arranged to face the first gantry, and imaging the first panel;
A second imaging device that is arranged to face the second gantry and captures an image of a second panel;
An arithmetic unit that performs arithmetic processing based on images of the first panel and the second panel captured by the first imaging device and the second imaging device;
Position adjusting means for operating the first frame and / or the second frame based on a result of the arithmetic processing to arrange the first panel and the second panel in parallel to opposing positions; and
A panel bonding apparatus, comprising: bonding means for bonding and bonding the first panel and the second panel while maintaining a relative position on a horizontal plane,
A grid-like partition wall in which the first panel is formed in a matrix at the same pitch on a sheet-like base material and a material that emits visible light by irradiating radiation to cells surrounded by the grid-like partition wall are arranged. A light-emitting panel (a structure in which the light-emitting material is disposed in the cell is simply referred to as a pixel), and the second panel includes a photoelectric conversion element that detects visible light on a sheet-shaped transparent substrate. A photoelectric conversion panel arranged in a matrix at the same pitch, wherein a pitch of cells divided by the partition walls and a pitch of the photoelectric conversion elements are equal in at least two directions overlapping when facing each other, or one is the other integer. In a double relationship,
Areas of the light-emitting panel and the photoelectric conversion panel, which are imaged by the first imaging device and the second imaging device, are at opposing positions when the two directions are arranged so as to overlap at the time of opposing arrangement, and Is a region that contains pixels or elements that are known,
A. The first imaging device is capable of imaging at least two locations so as to include the partition of the first panel, and the second imaging device is capable of imaging at least two locations so as to include a photoelectric conversion element of a photoelectric conversion panel. And
B. The arithmetic means uses the input imaging data, at least,
a) A pixel or a photoelectric conversion element is selected in each imaging region (provided that the relative arrangement information of the selected grid or the photoelectric conversion element matches).
b) A reference point is set in the selected pixel or photoelectric conversion element (provided that the absolute position of the reference point in the grid or the photoelectric conversion element is the same).
c) Calculate the direction in which the base on which the light emitting panel or the photoelectric conversion element panel is mounted, the moving length, and the rotation angle so as to minimize the sum of the distances between the reference points in each of the opposing areas, and output the calculated result. An apparatus for manufacturing a radiation detector.   8. The radiation detector manufacturing apparatus according to claim 6, wherein the bonding unit includes an elastic roller or a pad that presses the first panel and the second panel.