JP2017223632A - Radiation detection device and method for manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reliably hold and fix a sensor panel and a wavelength conversion body and prevent positional displacement to improve durability, eliminate an adhesive layer between the sensor panel and wavelength conversion body to suppress scattering of light, and improve MTP and image quality.SOLUTION: A radiation detection device comprises: a sensor panel 120; a wavelength conversion body 235 (fiber optic plate (FOP) 230 and scintillator 220) that converts the wavelength of an incident radiation; and a horizontal direction regulating member 210 that is provided on the periphery of the wavelength conversion body 235 and holds the sensor panel 120 and wavelength conversion body 235 in contact therewith.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a radiation detection apparatus and a manufacturing method thereof.

  In recent years, a digital radiation detection apparatus in which a sensor panel having a plurality of photoelectric conversion elements formed on a surface and a scintillator that emits light having a wavelength that can be detected by the photoelectric conversion elements when irradiated with radiation has been commercialized. . This radiation detection apparatus is used for industrial and industrial uses such as non-destructive inspection, and for medical use for uses such as fluoroscopy.

  As scintillators for converting radiation into visible light, those made of an alkali halide material typified by a material in which CsI is doped with Tl and those made of a material in which GdOS is doped with Tb are mainly used. As a sensor panel for detecting visible light, a sensor array in which a plurality of photoelectric conversion elements and TFTs are arranged in a two-dimensional array on a glass substrate or a resin film substrate to form a photoelectric conversion unit is used. CMOS sensors and CCD sensors in which photoelectric conversion elements are two-dimensionally arranged on a silicon substrate or the like to form a photoelectric conversion unit are also used for sensor panels.

  In the radiation detection apparatus of Patent Document 1, the scintillator panel is formed of a hard substrate and an X-ray phosphor layer (scintillator), and the movement in the horizontal direction is restricted by the outer frame member contacting and fixing to the hard substrate. In addition, movement in the vertical direction can be limited by being pressed against the imaging unit by the buffer member. In the radiation detection apparatus of Patent Document 2, a wavelength converter including a scintillator and a so-called fiber optic plate (FOP) arranged to suppress deterioration of the image sensor due to radiation not absorbed by the scintillator is provided. ing. Among the wavelength converters, the FOP is fixed to the frame body via an adhesive, and an adhesive layer between the FOP and the MOS type image sensor becomes unnecessary. In the radiation detection apparatus of Patent Document 3, a side surface of a scintillator panel in which a scintillator is formed on a substrate and a housing portion of a ceramic case are fixed with a resin 24.

International Publication No. 2001/066331 JP 2000-28735 A JP 2000-9845 A

  In the radiation detection apparatus disclosed in Patent Document 1, the outer frame member only comes into contact with the hard substrate and is not in contact with the scintillator and the imaging unit. Therefore, the scintillator may be displaced during use. Since the cross-sectional shape of the upper surface of the imaging unit is a linear upward convex shape, the upwardly convex portion present at the center of the imaging unit and the scintillator are in point contact or line contact. In this case, there is a problem that the sharpness (MTF) is lowered and the scintillator panel is damaged when the scintillator is displaced.

  In the radiation detection apparatus of Patent Document 2, since the FOP is bonded and fixed with a frame body, there is no movement such as displacement of the FOP during use. However, since the scintillator is not fixed by a frame or the like, the scintillator is displaced during use. In this case, it is necessary to bond the two through an adhesive layer between the scintillator and the FOP. At this time, as described in Patent Document 2, the deterioration of image quality due to bubbles mixed in the adhesive layer and the scattering of light caused by the adhesive layer disposed between the phosphor and the FOP are avoided, and the deterioration of the MTF and the image quality is avoided. The problem of not being able to occur.

  The radiation detection apparatus of Patent Document 3 adopts a configuration in which the scintillator panel is fixed to the imaging element by fixing the side surface of the scintillator panel with the resin 24. Therefore, in the manufacturing process of the radiation detection apparatus, it becomes difficult to perform an intermediate inspection after the scintillator panel is positioned relative to the image sensor, and the scintillator panel and the image sensor due to contamination are prevented from being damaged. There is a problem that is difficult.

  The present invention has been made in view of the above problem, and the position regulating member securely holds and fixes the wavelength conversion body with respect to the sensor panel by the position regulating member without adhering the position regulating member to the wavelength conversion body. Radiation detection apparatus capable of preventing MDF and improvement in image quality by preventing light scattering by preventing an adhesion layer between the sensor panel and the wavelength converter, and improving MTF and image quality It aims to provide a method.

  The radiation detection apparatus of the present invention is fixed to the sensor panel at the periphery of the sensor panel, the wavelength converter, and the wavelength converter, and comes into contact with the wavelength converter in a non-adhered state. And a position restricting member that defines a horizontal relative position of the wavelength converter with the sensor panel.

  The manufacturing method of the radiation detection apparatus of the present invention includes a first step of placing a wavelength converter on a sensor panel, a position restricting member fixed to a periphery of the wavelength converter on the sensor panel, and the position restricting member. In a non-adhered state to hold the wavelength converter, hold the wavelength converter, and define a horizontal relative position of the wavelength converter with the sensor panel.

  The manufacturing method of the radiation detection apparatus of this invention is the 1st process of fixing a position control member to the location in which the periphery of the wavelength converter mounted on a sensor panel is located, and the said position control member on the said sensor panel The wavelength converter is placed so as to fit in a region defined by the above, and the position regulating member is brought into contact with the wavelength converter in a non-adhered state to hold the wavelength converter, and the wavelength converter A second step of defining a horizontal relative position with the sensor panel.

  According to the present invention, the wavelength regulating body is securely held and fixed to the sensor panel by the position regulating member without adhering the position regulating member to the wavelength converting body, so that the positional deviation is prevented and durability is improved. Furthermore, an adhesive layer between the sensor panel and the wavelength converter is not required, and light scattering is suppressed, thereby improving MTF and image quality.

It is a schematic diagram which shows schematic structure of the radiation detection apparatus by 1st Embodiment. It is a schematic diagram which shows schematic structure of the radiation detection apparatus by 1st Embodiment. It is sectional drawing of the principal part of the radiation detection apparatus in the various modifications of 1st Embodiment. It is sectional drawing of the principal part of the radiation detection apparatus in the various modifications of 1st Embodiment. It is a schematic diagram which shows the manufacturing method of the radiation detection apparatus by 2nd Embodiment in process order. It is a schematic diagram which shows the manufacturing method of the radiation detection apparatus by 2nd Embodiment in process order. It is a schematic diagram which shows the manufacturing method of the radiation detection apparatus by 2nd Embodiment in process order. It is a schematic diagram which shows the manufacturing method of the radiation detection apparatus by 3rd Embodiment in order of a process. It is a schematic diagram which shows the manufacturing method of the radiation detection apparatus by 3rd Embodiment in order of a process. It is a schematic diagram which shows the manufacturing method of the radiation detection apparatus by 3rd Embodiment in order of a process. It is a schematic diagram which shows the manufacturing method of the radiation detection apparatus by 4th Embodiment in order of a process. It is a schematic diagram which shows the manufacturing method of the radiation detection apparatus by 4th Embodiment in order of a process. It is a schematic diagram which shows schematic structure of the radiation diagnostic system by 5th Embodiment.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

(First embodiment)
In the present embodiment, a configuration of the radiation detection apparatus is disclosed. 1 and 2 are schematic views showing a schematic configuration of the radiation detection apparatus according to the first embodiment. FIG. 1A is a sectional view of the overall configuration, and FIG. 1B is a plan view of a radiation detection panel that is a main component. 2A is a cross-sectional view taken along a broken line II ′ in FIG. 1B, and FIG. 2B is a cross-sectional view taken along a broken line II-II ′ in FIG. The radiation detection apparatus 100 includes a radiation detection panel 110, a support panel 270 on which the radiation detection panel 110 is placed and fixed, a drive substrate 280 disposed below the support panel 270 via a spacer 290, and a housing 320 that stores these. Configured.

  The radiation detection panel 110 includes a sensor panel 120, a wavelength conversion body 235 placed on the sensor panel 120, and a horizontal direction regulating member 210 that holds and fixes the sensor panel 120 and the wavelength conversion body 235. Yes.

  The sensor panel 120 is configured by attaching one or a plurality of sensor chips 240 on a sensor base 250 via an adhesive layer. The sensor chip 240 and the drive substrate 280 are electrically connected by the wiring material 260. As the adhesive layer, a general fixing resin such as an adhesive material made of an acrylic resin or a silicone resin, an epoxy resin, a silicone resin, or an adhesive made of an acrylic resin can be used. As the sensor chip 240, a sensor array in which a plurality of pixel portions 241 having photoelectric conversion elements and TFTs are arranged in a two-dimensional array on a glass substrate or a resin film substrate to form a photoelectric conversion portion can be used. A CMOS sensor or a CCD sensor in which photoelectric conversion elements are two-dimensionally arranged on a silicon substrate or the like to form a photoelectric conversion unit may be used. When a photoelectric conversion element is formed over a glass substrate, the configuration of the photoelectric conversion element is not particularly limited, and an MIS type sensor, a PIN type sensor, a TFT type sensor, or the like can be used as appropriate.

  The sensor panel 120 may include only the sensor chip 240 without the sensor base 250. In this case, what formed the photoelectric conversion element on the glass substrate of thickness 0.5mm or more is used suitably. However, higher durability can be obtained by attaching the sensor chip 240 to the sensor base 250.

The wavelength converter 235 includes a fiber optic plate (FOP) 230 and a scintillator 220 placed on the FOP 230. In this embodiment, at least a part of the front surface of the sensor panel 120 and at least a part of the back surface of the FOP 230 are in contact with each other, and no adhesive layer or the like is provided between them. At least a part of the front surface of the FOP 230 and at least a part of the back surface of the scintillator 220 are in contact with each other, and no adhesive layer or the like is provided between them. The scintillator 220 for converting radiation into visible light is a powder phosphor in which a small amount of a trivalent rare earth such as terbium or europium is used as a luminescent center on a base made of an alkali halide material or a metal oxysulfide. A deposited layer can be used. As a material mainly containing an alkali halide, for example, CsI: Tl, CsI: Na, CsBr: Tl, NaI: Tl, LiI: Eu, KI: Tl, or the like is used. As the metal oxysulfide powder phosphor, for example, a powder phosphor (GOS) in which Gb ₂ O ₂ S is doped with Tb is used. The scintillator 220 is formed by applying and drying or bonding GOS or the like. Further, a phosphor protective layer made of metal or resin may be formed on the upper surface of the scintillator 220. Thereby, durability and moisture resistance of the scintillator 220 can be improved. The FOP 230 suppresses deterioration of the sensor panel 120 due to radiation that has not been absorbed by the scintillator 220. For example, the FOP 230 is configured by forming fiber-like silica glass containing lead into a plate shape.

The horizontal direction regulating member 210 is fixed to the sensor panel 120 at the four corners of the periphery of the wavelength converter 235. The horizontal direction regulating member 210 is held in contact with the side surface of the wavelength conversion body 235 (FOP 230 and scintillator 220) in a non-adhesive state, and regulates the relative position of the wavelength conversion body 235 with the sensor panel 120 in the horizontal direction. It is a member. In the present embodiment, the FOP 230 and the scintillator 220 have the same size, and the horizontal direction regulating member 210 abuts the FOP 230 and the scintillator 220 on the same side surface in a non-adhered state and holds the FOP 230 and the scintillator 220. The horizontal direction regulating member 210 holds and fixes the sensor chip 240 together with the wavelength converter 235 on the side surface, and the lower end thereof is bonded and fixed by the sensor base 250 and the adhesive layer 211. Examples of the material of the horizontal direction regulating member 210 include those containing PEEK resin, polyethylene resin, epoxy resin, acrylic resin, silicone resin, Al, Fe, Au, Ag, Cu, W, Mo, Cr, Ni, etc. An alloy or a mixture containing a metal can be preferably used. The material preferably has a moisture permeability of 30 g / m ² · day or less. Since the horizontal direction regulating member 210 is disposed on the periphery of the sensor panel 120 and the wavelength converter 235, the light transmittance is not limited and may be transparent or opaque. By using the horizontal direction regulating member 210, it is possible to reliably prevent occurrence of a horizontal displacement between the sensor panel 120 and the FOP 230 and between the FOP 230 and the scintillator 220.

  The housing 320 is configured by fixing the radiation incident window 300 and the radiation detection device case 310 with an adhesive made of, for example, an epoxy resin. Inside the housing 320, at least a part of the inner wall surface of the radiation incident window 300 is in contact with at least a part of the surface of the scintillator 220, and no adhesive layer or the like is provided between them. A buffer material may be inserted between the inner wall surface of the radiation incident window 300 and the scintillator 220. The radiation entrance window 300 and the horizontal direction regulating member 210 do not necessarily have to be in contact with each other. The inner wall surface of the radiation detection device case 310 and the back surface of the drive substrate 280 are arranged to face each other with a spacer 290 interposed therebetween. As a material of the radiation entrance window 300, a material made of a single element such as amorphous carbon, crystalline carbon, or silicon crystal can be used. Further, as the material, fiber reinforced resins such as CFRP and GFRP, alloys containing metal elements such as Mg, Al, and Ca, resins such as polyethylene, acrylic, and epoxy may be used.

  If the contact between the radiation incident window 300 and the scintillator 220 is poor due to large unevenness between the surface of the radiation incident window 300 and the surface of the scintillator 220, an unevenness absorbing material may be sandwiched between the radiation incident window 300 and the scintillator 220. good. As a material of the unevenness absorbing material, an organic resin material such as urethane resin or rubber can be suitably used. In this case, the unevenness absorbing material is bonded to the radiation incident window 300, and the radiation incident window 300 is configured including the unevenness absorbing material.

  As described above, the radiation incident window 300 and the scintillator 220 are in contact with each other, the sensor panel 120 and the FOP 230 are in contact with each other, and the layers are sandwiched from above and below. Thereby, the positional deviation of the sensor panel 120 and the wavelength converter 235 in the vertical direction is reliably prevented.

  As described above, according to the radiation detection apparatus 100 of the present embodiment, the wavelength converter 235 is attached to the sensor panel 120 by the horizontal regulating member 210 without adhering the horizontal regulating member 210 to the wavelength converter 235. Is securely held and prevented from being displaced. Therefore, an adhesive layer between the sensor panel 120 and the FOP 230 and between the FOP 230 and the scintillator 220 is not required, and light scattering is suppressed, thereby improving MTF and image quality.

(Modification)
Hereinafter, various modifications of the radiation detection apparatus according to the present embodiment will be described. These modifications differ from the present embodiment in that the shape and the like of the horizontal direction regulating member are different in the radiation detection panel. 3 and 4 are cross-sectional views of main parts of the radiation detection apparatus according to various modifications. 3 (a) is Modification 1, FIG. 3 (b) is Modification 2, FIG. 3 (c) is Modification 3, FIG. 3 (d) is Modification 4, FIG. 4 (a) is Modification 5, FIG. 4B shows Modification 6 and FIG. 4C shows Modification 7.

-Modification 1-
In this example, as shown in FIG. 3A, in the radiation detection panel 110, the FOP 230 and the scintillator 220 constituting the wavelength converter 235 on the sensor panel 120 are different sizes. Here, the scintillator 220 is larger than the FOP 230. It is said to be size. The horizontal direction regulating member 210 has a side surface 210a and a side surface 210b projecting inward from the side surface 210a so as to fit the FOP 230 and the scintillator 220. The horizontal regulating member 210 is held and fixed in contact with the side surface of the scintillator 220 at the side surface 210a and the side surface of the FOP 230 at the side surface 210b.

  According to the radiation detection apparatus 100 of this example, even when the sensor panel 120 and the wavelength converter 235 are different in size due to the horizontal direction regulating member 210 without adhering the horizontal direction regulating member 210 to the wavelength converting body 235. It is securely held and fixed to prevent displacement. Therefore, an adhesive layer between the sensor panel 120 and the FOP 230 and between the FOP 230 and the scintillator 220 is not required, and light scattering is suppressed, thereby improving MTF and image quality.

-Modification 2-
In this example, as shown in FIG. 3B, in the radiation detection panel 110, the FOP 230 and the scintillator 220 constituting the wavelength converter 235 on the sensor panel 120 are different sizes. Here, the FOP 230 is larger than the scintillator 220. It is said to be size. The horizontal direction regulating member 210 has a side surface 210c and a side surface 210d that protrudes inward from the side surface 210c so as to fit the FOP 230 and the scintillator 220. The horizontal regulating member 210 is held and fixed in contact with the side surface of the FOP 230 at the side surface 210c and the side surface of the scintillator 220 at the side surface 210d.

  According to the radiation detection apparatus 100 of this example, even when the sensor panel 120 and the wavelength converter 235 are different in size due to the horizontal direction regulating member 210 without adhering the horizontal direction regulating member 210 to the wavelength converting body 235. It is securely held and fixed to prevent displacement. Therefore, an adhesive layer between the sensor panel 120 and the FOP 230 and between the FOP 230 and the scintillator 220 is not required, and light scattering is suppressed, thereby improving MTF and image quality.

-Modification 3-
When there is no possibility of damage to the sensor chip 240, the horizontal direction regulating member 210 may be directly fixed to the sensor chip 240. In this example, as shown in FIG. 3C, in the radiation detection panel 110, the horizontal direction regulating member 210 has its lower end bonded and fixed by the sensor chip 240 and the adhesive layer 211 of the sensor panel 120, and FOP 230 and The scintillator 220 is held.

  According to the radiation detection apparatus 100 of the present example, the horizontal direction regulating member 210 is securely held and fixed to the sensor panel 120 by the horizontal direction regulating member 210 without bonding the horizontal direction regulating member 210 to the wavelength converting body 235. Misalignment is prevented. Therefore, an adhesive layer between the sensor panel 120 and the FOP 230 and between the FOP 230 and the scintillator 220 is not required, and light scattering is suppressed, thereby improving MTF and image quality.

-Modification 4-
In this example, as in Modification 2, the FOP 230 is larger in size than the scintillator 220 in the radiation detection panel 110 as shown in FIG. The horizontal direction regulating member 210 has its lower end joined and fixed to the sensor base 250 by a fixing member, for example, a screw 212, and is held and fixed in contact with the side surface of the FOP 230 at the side surface 210c and the side surface of the scintillator 220 at the side surface 210d. Yes.

  According to the radiation detection apparatus 100 of this example, the horizontal direction regulating member 210 is securely bonded and fixed to the sensor base 250 with the screw 212 in a non-adhered state, and the sensor panel 120 and the wavelength converter 235 are held and fixed. Misalignment is prevented. Therefore, an adhesive layer between the sensor panel 120 and the FOP 230 and between the FOP 230 and the scintillator 220 is not required, and light scattering is suppressed, thereby improving MTF and image quality.

-Modification 5-
In this example, as shown in FIG. 4A, in the radiation detection panel 110, the horizontal direction regulating member 210 includes a first member 213 and a second member 214 that are separate from each other. The first member 213 is in contact with the side surface of the FOP 230 on its side surface and is held and fixed. The second member 214 is in contact with the side surface of the scintillator 220 on its side surface and is held and fixed. The first member 213 and the second member 214 are bonded and fixed by an adhesive layer 215, and the lower end of the first member 213 is bonded and fixed by the sensor chip 240 of the sensor panel 120 and the adhesive layer 211.

  According to the radiation detection apparatus 100 of this example, the first member 213 and the second member 214 securely hold and fix the sensor panel 120 and the wavelength conversion body 235 individually in a non-bonded state, thereby preventing misalignment. . Therefore, an adhesive layer between the sensor panel 120 and the FOP 230 and between the FOP 230 and the scintillator 220 is not required, and light scattering is suppressed, thereby improving MTF and image quality.

-Modification 6
In this example, as in Modification 1, the scintillator 220 is larger in size than the FOP 230 in the radiation detection panel 110 as shown in FIG. The horizontal direction regulating member 210 is configured to include a first member 213 and a second member 214 that are different from each other and have different sizes so as to be adapted to the FOP 230 and the scintillator 220, respectively. The first member 213 is in contact with the side surface of the FOP 230 on its side surface and is held and fixed. The second member 214 is in contact with the side surface of the scintillator 220 on its side surface and is held and fixed. The first member 213 and the second member 214 are bonded and fixed by an adhesive layer 215, and the lower end of the first member 213 is bonded and fixed by the sensor chip 240 of the sensor panel 120 and the adhesive layer 211.

  According to the radiation detection apparatus 100 of the present example, the first member 213 and the second member 214 ensure that the sensor panel 120 and the wavelength conversion body 235 are individually held and fixed in a non-adhered state even when the sizes thereof are different. This prevents the displacement. Therefore, an adhesive layer between the sensor panel 120 and the FOP 230 and between the FOP 230 and the scintillator 220 is not required, and light scattering is suppressed, thereby improving MTF and image quality.

-Modification 7-
In this example, as in Modification 4, as shown in FIG. 4C, the lower end of the horizontal direction regulating member 210 is bonded and fixed by the sensor base 250 and the screw 212. Further, the horizontal direction regulating member 210 and the FOP 230 are held and fixed by an abutting member, for example, a screw 216, and the horizontal direction regulating member 210 and the scintillator 220 are held and fixed by an abutting member, for example, a screw 217.

  According to the radiation detection apparatus 100 of this example, the horizontal direction regulating member 210 is securely joined and fixed to the sensor base 250 with the screw 212, and the horizontal direction regulating member 210 and the wavelength converter 235 are held and fixed with the screws 216 and 217. Thus, misalignment is prevented. For this reason, the radiation detection panel 110 can be easily disassembled when necessary during the manufacturing process. Adhesive layers between the sensor panel 120 and the FOP 230 and between the FOP 230 and the scintillator 220 are not required, and light scattering is suppressed, thereby improving MTF and image quality.

(Second Embodiment)
Next, a second embodiment will be described. In this embodiment, the radiation detection apparatus of FIG. 1A according to the first embodiment is taken as an example, and a manufacturing method thereof is disclosed. 5 to 7 are schematic views showing a method of manufacturing the radiation detection apparatus according to the second embodiment in the order of steps. 5 and 6 and FIGS. 7A and 7B are plan views, and FIG. 7C is a cross-sectional view taken along line III-III ′ of FIG. 7B.

  First, as shown in FIG. 5A, the sensor chip 240 made of a CMOS sensor is arranged on the sensor base 250 via an adhesive to produce the sensor panel 120. As the sensor chip 240, for example, a CMOS sensor formed on a Si substrate is used. As the sensor base 250, for example, a glass plate made of non-alkali glass having a thickness of about 2 mm is used. A wiring member 260 that electrically connects the sensor chip 240 and the drive substrate 280 is formed. For example, a flexible printed circuit board is used as the wiring member 260.

  Subsequently, as shown in FIG. 5B, alignment between the sensor base 250 (or the sensor panel 120) and the positioning member 401 is performed using the outer shape alignment member 400. Subsequently, as shown in FIG. 6A, the FOP 230 is disposed on the sensor chip 240 exposed in the frame of the positioning member 401. As FOP230, what was comprised from the silica glass containing lead glass, for example is used. Subsequently, as shown in FIG. 6 (b), the scintillator 220 is arranged on the FOP 230 in an overlapping manner. As the scintillator 220, for example, CsI: TlI formed by vacuum deposition on an amorphous carbon substrate having a thickness of 1 mm and using parylene as a phosphor protective layer are used. A wavelength converter 235 is configured by the FOP 230 and the scintillator 220.

  Subsequently, as shown in FIG. 7A, horizontal direction regulating members 210 made of, for example, a PEEK material are disposed at the four corners of the periphery of the wavelength converter 235. The horizontal direction regulating member 210 is adhesively fixed on the sensor base 250 by, for example, an adhesive PDS1 (thickness 50 μm) manufactured by Panac as an adhesive layer, and is held and fixed in contact with the side surface of the wavelength converter 235 in a non-adhesive state. Subsequently, as shown in FIGS. 7B and 7C, the outer shape matching member 400 and the positioning member 401 are removed. As described above, the radiation detection panel 110 of FIG. 1A is manufactured.

  An intermediate inspection is performed on the manufactured radiation detection panel 110 of FIG. When the determination result of the inspection satisfies a predetermined acceptance criterion, the process proceeds to a step of fixing to the radiation detection device case 310 described later. When the determination result of the inspection does not satisfy the predetermined acceptance criteria, for example, when the presence of foreign matter is confirmed between the sensor panel 120 and the FOP 230 or between the FOP 230 and the scintillator 220, the radiation detection panel 110 is disassembled. And clean. Since the radiation detection panel 110 does not have an adhesive layer between the sensor panel 120 and the FOP 230 or between the FOP 230 and the scintillator 220, the radiation detection panel 110 can be easily disassembled. Specifically, after removing the horizontal direction regulating member 210 from the radiation detection panel 110, the scintillator 220 and the FOP 230 are sequentially removed and returned to the state of FIG. After the sensor panel 120, the scintillator 220, and the FOP 230 are cleaned and foreign matter is removed, the processes in FIGS. 5A to 7B are performed again.

  Subsequently, the radiation detection panel 110 is fixed to the radiation detection device case 310 via the spacer 290. The radiation incident window 300 is disposed so as to be in contact with the scintillator 220 on the radiation detection panel 110. The radiation detection device case 310 and the radiation incident window 300 are fixed with, for example, aluminum screws to form a housing 320. Thus, the radiation detection apparatus 100 shown in FIG. 1A is completed.

  As described above, according to the present embodiment, the sensor panel 120 and the wavelength conversion body 235 are securely held and fixed by the horizontal direction regulating member 210 in a non-adhered state, thereby preventing misalignment. Therefore, an adhesive layer between the sensor panel 120 and the FOP 230 and between the FOP 230 and the scintillator 220 is not required, and light scattering is suppressed, thereby improving MTF and image quality. Further, since the adhesive layer is unnecessary, when the foreign matter is confirmed by performing an intermediate inspection of the manufactured radiation detection panel 110, the radiation detection panel 110 can be disassembled to easily remove the foreign matter. it can. Thereby, damage to the radiation detection panel 110 due to foreign matter or the like can be prevented, and a radiation detection apparatus can be manufactured with a high yield. Furthermore, the time required for bonding the adhesive layer and the curing time of the adhesive layer can be reduced, and the productivity of the radiation detection apparatus is improved.

(Third embodiment)
Next, a third embodiment will be described. In this embodiment, the radiation detection apparatus of FIG. 3A according to Modification 1 of the first embodiment is taken as an example, and a manufacturing method that does not require the outer shape alignment member 400 and the positioning member 401 is disclosed. 8 to 10 are schematic views showing a method of manufacturing the radiation detection apparatus according to the third embodiment in the order of steps. 8A is a plan view, FIG. 8B is a cross-sectional view taken along IV-IV ′ in FIG. 8A, and FIG. 8C is taken along VV ′ in FIG. 8A. It is sectional drawing. FIGS. 9A and 9B are plan views. 10A is a cross-sectional view taken along VI-VI ′ in FIG. 9B, and FIG. 10B is a cross-sectional view taken along VII-VII ′ in FIG. 9B.

  First, as shown in FIG. 8, a sensor chip 240 made of a CMOS sensor is arranged on a sensor base 250 placed and fixed on a support panel 270 via an adhesive to produce a sensor panel 120. As the sensor chip 240, for example, a CMOS sensor formed on a Si substrate is used. As the sensor base 250, for example, a glass plate made of non-alkali glass having a thickness of about 2 mm is used. A wiring member 260 that electrically connects the sensor chip 240 and the drive substrate 280 is formed. For example, a flexible printed circuit board is used as the wiring member 260. A horizontal direction regulating member 210 made of, for example, an epoxy resin is provided at the four corners of the periphery of the sensor chip 240 on the sensor base 250 and the central part of the two opposing sides (where the periphery of the wavelength converter 235 is positioned in a process described later). Fixed placement. The horizontal direction regulating member 210 is bonded and fixed on the sensor base 250 as an adhesive layer 211 by, for example, an adhesive material PDS1 (thickness 50 μm) manufactured by Panac.

  Subsequently, as shown in FIG. 9A, the FOP 230 is disposed on the sensor chip 240. The FOP 230 is fitted into a region defined by the horizontal direction regulating member 210 fixedly disposed at the four corners of the peripheral edge of the sensor chip 240 and the central part of the two opposite sides, and contacts the horizontal direction regulating member 210 in a non-adhered state. Retained. As FOP230, what was comprised from the silica glass containing lead glass, for example is used.

  Subsequently, as shown in FIG. 9B and FIG. 10, the scintillator 220 is placed on the FOP 230 so as to overlap. The scintillator 220 is fitted on the FOP 230 in an area defined by the horizontally-arranged horizontal regulating member 210 that is fixedly arranged, and is held in contact with the horizontal-direction regulating member 210 in a non-adhered state. As the scintillator 220, for example, CsI: TlI formed by vacuum deposition on an amorphous carbon substrate having a thickness of 1 mm and using parylene as a phosphor protective layer are used. A wavelength converter 235 is configured by the FOP 230 and the scintillator 220. As described above, the radiation detection panel 110 shown in FIG.

  Also in the present embodiment, an intermediate inspection is performed on the manufactured radiation detection panel 110 of FIG. If there is a problem with the inspection result, the radiation detection panel 110 can be easily disassembled and cleaned to remove foreign matter or the like.

  Subsequently, the radiation detection panel 110 is fixed to the radiation detection device case 310 via the spacer 290. The radiation incident window 300 is disposed so as to be in contact with the scintillator 220 on the radiation detection panel 110. The radiation detection device case 310 and the radiation incident window 300 are fixed with, for example, aluminum screws to form a housing 320. Thus, the radiation detection apparatus 100 is completed.

  As described above, according to the present embodiment, the sensor panel 120 and the wavelength converter 235 are reliably held and fixed by the horizontal direction regulating member 210 to prevent displacement. Therefore, an adhesive layer between the sensor panel 120 and the FOP 230 and between the FOP 230 and the scintillator 220 is not required, and light scattering is suppressed, thereby improving MTF and image quality. Further, since the adhesive layer is unnecessary, when the foreign matter is confirmed by performing an intermediate inspection of the manufactured radiation detection panel 110, the radiation detection panel 110 can be disassembled to easily remove the foreign matter. it can. Thereby, damage to the radiation detection panel 110 due to foreign matter or the like can be prevented. Furthermore, the time required for bonding the adhesive layer and the curing time of the adhesive layer can be reduced, and the productivity of the radiation detection apparatus is improved. In addition, a jig or tool is not required for arranging the FOP 230 and the scintillator 220, and the horizontal direction regulating member 210 is arranged, and the side surfaces of the FOP 230 and the scintillator 220 are fitted into the horizontal direction regulating member 210, so that reliable holding and fixing are possible. It becomes. Therefore, compared with 2nd Embodiment, a man-hour can be reduced and cost can be reduced.

(Fourth embodiment)
Next, a fourth embodiment will be described. In the present embodiment, the radiation detection apparatus of FIG. 3C according to Modification 3 of the first embodiment is taken as an example, and a manufacturing method thereof is disclosed. FIGS. 11-12 is a schematic diagram which shows the manufacturing method of the radiation detection apparatus by 4th Embodiment in order of a process. FIGS. 11A and 11B are plan views. 12A is a plan view, FIG. 12B is a sectional view taken along the line VIII-VIII ′ in FIG. 12A, and FIG. 12C is a sectional view of the entire configuration.

  First, as shown in FIG. 11A, the sensor chip 240 is placed and fixed on the support panel 270 via an adhesive. As the sensor chip 240, glass having a thickness of about 0.7 mm is used. A pixel portion 241 having a photoelectric conversion element and a TFT is formed on the surface of the sensor chip 240. In the present embodiment, the sensor panel 120 does not have a sensor base and is configured only by the sensor chip 240 including the pixel unit 241. A wiring member 260 that electrically connects the sensor chip 240 and the drive substrate 280 is formed. For example, COF (Chip On Film) is used as the wiring member 260. Horizontal direction regulating members 210 made of, for example, epoxy resin are arranged at the four corners on the sensor chip 240. The horizontal direction regulating member 210 is directly bonded and fixed on the sensor chip 240 by, for example, an adhesive material PDS1 (thickness: 50 μm) manufactured by Panac as the adhesive layer 211.

  Subsequently, as shown in FIG. 11B, the FOP 230 and the scintillator 220 are sequentially arranged on the sensor chip 240 having the pixel portion 241 on the surface. As FOP230, what was comprised from the silica glass containing lead glass, for example is used. As the scintillator 220, for example, CsI: TlI formed by vacuum deposition on an amorphous carbon substrate having a thickness of 1 mm and using parylene as a phosphor protective layer are used. The FOP 230 and the scintillator 220 are fitted into the horizontal restriction member 210 while being restricted in position, and the four corners abut against the horizontal restriction member 210 and are held and fixed.

Subsequently, as shown in FIG. 12, the sealing resin 402 is sealed along the peripheral edges of the FOP 230 and the scintillator 220 so as to cover the horizontal direction regulating member 210. The sealing resin 402 preferably has a moisture permeability of 30 g / m ² · day or less, and is a material containing a resin such as silicone resin, epoxy resin, acrylic resin, vinyl chloride, vinylidene chloride, and polyparaxylylene. Can be used. Here, for example, an epoxy resin is used. The horizontal direction regulating member 210 may be made of the same material as the sealing resin 402. Further, the adhesive layer 211 may be made of the same material as the sealing resin 402. Thus, the radiation detection panel 110 in FIG. 3C is manufactured.

  Also in the present embodiment, an intermediate inspection is performed on the manufactured radiation detection panel 110 as in the second embodiment. If there is a problem with the inspection result, the radiation detection panel 110 can be easily disassembled and cleaned to remove foreign matter or the like.

  Subsequently, the radiation detection panel 110 is fixed to the radiation detection device case 310 via the spacer 290. The radiation incident window 300 is disposed so as to be in contact with the scintillator 220 on the radiation detection panel 110. The radiation detection device case 310 and the radiation incident window 300 are fixed with, for example, aluminum screws to form a housing 320. As described above, the radiation detection apparatus 100 is completed as shown in FIG.

  As described above, according to the present embodiment, the wavelength conversion body 235 is securely held and fixed to the sensor panel 120 by the horizontal direction restriction member 210 without bonding the horizontal direction restriction member 210 to the wavelength conversion body 235. Misalignment is prevented. Therefore, an adhesive layer between the sensor panel 120 and the FOP 230 and between the FOP 230 and the scintillator 220 is not required, and light scattering is suppressed, thereby improving MTF and image quality. Further, since the adhesive layer is unnecessary, when the foreign matter is confirmed by performing an intermediate inspection of the manufactured radiation detection panel 110, the radiation detection panel 110 can be disassembled to easily remove the foreign matter. it can. Thereby, damage to the radiation detection panel 110 due to foreign matter or the like can be prevented. Furthermore, the time required for bonding the adhesive layer and the curing time of the adhesive layer can be reduced, and the productivity of the radiation detection apparatus is improved. In addition, a jig or tool is not required for arranging the FOP 230 and the scintillator 220, and the horizontal direction regulating member 210 is arranged, and the side surfaces of the FOP 230 and the scintillator 220 are fitted into the horizontal direction regulating member 210, so that reliable holding and fixing are possible. It becomes. Therefore, compared with 2nd Embodiment, a man-hour can be reduced and cost can be reduced. Further, the horizontal direction regulating member 210 is directly disposed on the sensor chip 240. Thereby, since the time and member for arrange | positioning the sensor chip 240 on a sensor base can be reduced, it becomes possible to manufacture the radiation detection apparatus which has higher productivity.

(Fifth embodiment)
In the present embodiment, a radiation diagnostic system including the radiation detection apparatus 100 according to the first to fourth embodiments or various modifications is disclosed. FIG. 13 is a schematic diagram showing a schematic configuration of a radiation diagnostic system according to the fifth embodiment.

  X-rays 510 generated by the X-ray tube 500 pass through the chest 530 of the patient (or subject) 520 and enter the radiation detection apparatus 100. The incident X-ray includes information on the inside of the patient 520. In the radiation detection apparatus 100, the scintillator emits light in response to the incidence of X-rays, and the photoelectric conversion element of the sensor panel performs photoelectric conversion to obtain electrical information. This information is converted into digital data, subjected to image processing by an image processor 540 serving as signal processing means, and can be observed on a display 550 serving as display means in the control room. Further, this information can be transferred to a remote place by a transmission processing means such as a network 560 such as a telephone, a LAN, and the Internet, and is displayed on a display 570 serving as a display means such as a doctor room in another place or stored in a recording means such as an optical disk. can do. A remote doctor can also make a diagnosis. Moreover, it can also record on the film 590 by the film processor 580 used as a recording means.

100: Radiation detector 120: Sensor panel 210: Horizontal direction regulating member 235: Wavelength converter

Claims (13)

A sensor panel;
A wavelength converter,
It is fixed to the sensor panel at the periphery of the wavelength converter, and holds the wavelength converter in contact with the wavelength converter in a non-adhered state, relative to the sensor panel in the horizontal direction of the wavelength converter. A radiation detection apparatus comprising: a position regulating member that regulates a position. The sensor panel has a base and a sensor chip on the base,
The radiation detection apparatus according to claim 1, wherein the position restriction member is fixed to the base.   The radiation detection apparatus according to claim 2, wherein the position restriction member is fixed to the base by a fixing member. The sensor panel has a sensor chip,
The radiation detection apparatus according to claim 1, wherein the position restriction member is fixed to the sensor chip. The position regulating member has a contact member;
5. The radiation detection apparatus according to claim 1, wherein the contact member contacts the wavelength converter in a non-adhered state to hold the wavelength converter. 6. The wavelength converter has a scintillator and a fiber optic plate,
6. The radiation according to claim 1, wherein the position restricting member holds the scintillator and the fiber optic plate in contact with the scintillator and the fiber optic plate in a non-adhered state. Detection device. The position restricting members each have a separate first member and second member,
The first member holds the fiber optic plate in contact with the fiber optic plate in an unbonded state;
The radiation detection apparatus according to claim 6, wherein the second member contacts the scintillator in a non-adhered state and holds the scintillator.   The radiation detection apparatus according to claim 1, wherein a resin that covers the position restriction member is formed. A housing for housing the sensor panel and the wavelength converter;
The radiation detection apparatus according to claim 1, wherein a buffer member is provided between the wavelength converter and an inner wall surface of the housing. A first step of placing a wavelength converter on the sensor panel;
A position regulating member is fixed to the periphery of the wavelength converter on the sensor panel, the wavelength regulating body is held by bringing the position regulating member into contact with the wavelength converter in a non-bonded state, and the wavelength converter And a second step of restricting the relative position in the horizontal direction with respect to the sensor panel. A first step of fixing the position regulating member at a position where the periphery of the wavelength converter placed on the sensor panel is located;
The wavelength converter is placed so as to be fitted in a region defined by the position restricting member on the sensor panel, and the position restricting member is brought into contact with the wavelength converter in a non-bonded state to A second step of holding and regulating a horizontal relative position of the wavelength converter with the sensor panel. A third step of performing an inspection after holding the wavelength converter by the position regulating member;
When it is determined that the acceptance criterion is not satisfied in the inspection in the third step, the position regulating member is removed from the sensor panel and the wavelength converter, and after performing a predetermined process,
The method for manufacturing a radiation detection apparatus according to claim 10, wherein the first step and the second step are performed again. The wavelength converter has a scintillator and a fiber optic plate,
The method of manufacturing a radiation detection apparatus according to claim 10, wherein the scintillator is placed on the sensor panel via a fiber optic plate.