JPWO2019038846A1 - Method for manufacturing optical component and method for manufacturing transparent sealing member - Google Patents

Abstract

The present invention relates to a method for manufacturing an optical component and a method for manufacturing a transparent sealing member. An optical component having a mounting substrate (18) on which at least one optical element (12) is mounted and a transparent sealing member (20) made of a transparent glass body (24) metal-bonded to the mounting substrate (18) ( In the manufacturing method of 10), a particle fixing step of fixing a plurality of particles (26) to a bonding surface (24a) of the transparent sealing member (20) with the mounting substrate (18), and the transparent sealing member (20). And a mounting substrate (18) are metal-bonded together.

Description

The present invention relates to a method of manufacturing an optical component used in, for example, an LED (light emitting diode), an LD (semiconductor laser), etc., and a method of manufacturing a transparent sealing member which is a constituent member of the optical component.

Generally, an optical component having an optical element that emits ultraviolet rays (for example, an LED or an LD) requires a transparent sealing member in order to protect the optical element from outside air and moisture.

Japanese Patent Application Laid-Open No. 2001-237335 discloses a metal heat sink on which a semiconductor element is mounted, a metal frame joined to the upper surface of the heat sink by a brazing material such as silver solder, and the upper surface of the frame. There is disclosed a casing composed of a ceramic lid joined by a brazing material.

By the way, in the case of using metal joining, for example, a brazing material, in the joining of the mounting substrate on which the LED is mounted and the transparent sealing member made of a transparent glass body such as quartz glass or borosilicate glass, the transparent sealing is a prerequisite. The metal bonding is performed after the metal plating layer is formed on the end surface of the member and the mounting board. However, in this metal joining, the adhesion between the transparent sealing member and the metal plating layer is poor, and good sealing properties may not be obtained in some cases.

Therefore, a vapor deposition film having a multi-layer structure is formed between the transparent sealing member and the metal plating layer to improve the adhesion between the transparent sealing member and the metal plating layer.

However, since it is necessary to form a vapor-deposited film having a multi-layer structure between the transparent sealing member and the metal plating layer, there are problems that the manufacturing process becomes complicated, the number of steps is increased, and the cost is increased.

The present invention has been made in consideration of such problems, and when metal-bonding a transparent sealing member made of a transparent glass body and a mounting substrate, a multilayer structure is provided between the transparent sealing member and the metal plating layer. Provided are a method for manufacturing an optical component and a method for manufacturing a transparent sealing member, which eliminates the need to form a vapor deposition film having a structure, can simplify the manufacturing process of an optical component, reduce the number of steps, and reduce the manufacturing cost. The purpose is to do.

[1] A method of manufacturing an optical component according to a first aspect of the present invention includes a mounting substrate on which at least one optical element is mounted, and a transparent sealing member made of a transparent glass body metal-bonded to the mounting substrate. In the method of manufacturing an optical component, a particle fixing step of fixing a plurality of particles to a bonding surface of the transparent sealing member with the mounting substrate, and a metal bonding step of metal-bonding the transparent sealing member and the mounting substrate. And having.

This eliminates the need to form a vapor-deposited film having a multilayer structure between the transparent sealing member and the metal plating layer when metal-bonding the transparent sealing member and the mounting substrate, and simplifies the manufacturing process of the optical component. In addition, it is possible to reduce the man-hours and the manufacturing cost.

[2] In the first aspect of the present invention, the metal bonding step includes a step of forming a first metal plating layer on a portion of the transparent sealing member to which the plurality of particles are fixed, and a mounting board, At least a step of forming a second metal plating layer on a portion to which the transparent sealing member is joined, and a brazing material including the first metal plating layer of the transparent sealing member and the second metal plating layer of the mounting substrate. And the step of joining in.

Since the plurality of particles are fixed to the bonding surface of the transparent sealing member with the mounting substrate, when the first metal plating layer is formed on the portion of the transparent sealing member where the plurality of particles are fixed, Since the adhesion of the first metal plating layer to the plurality of particles is better than the adhesion to the transparent glass body, the adhesion to the transparent sealing member made of the transparent glass body is improved. As a result, it is not necessary to form a vapor deposition film having a multilayer structure between the transparent sealing member and the first metal plating layer. This leads to simplification of the manufacturing process of the optical component, reduction of man-hours, and reduction of manufacturing cost.

[3] In the first aspect of the present invention, the particle fixing step includes a step of arranging powder on a plate material, and an end face of the transparent glass body or a precursor of the transparent glass body on the plate material on which the powder is arranged. The method may include the step of placing the body with the end face down, and the step of heat-treating the transparent glass body or the precursor of the transparent glass body at a temperature lower than the melting point of the powder.

A powder is placed on a plate material, a transparent glass body (which will later become a transparent sealing member) or a precursor of a transparent glass body is placed on the plate material on which the powder is placed, and a transparent glass body or a precursor of the transparent glass body is placed. By heat-treating the body at a temperature lower than the melting point of the powder, it is possible to easily fix the plurality of particles to the bonding surface of the transparent sealing member with the mounting substrate.

[4] In the first aspect of the present invention, in the particle fixing step, a step of applying a powdered paste to an end surface of the transparent glass body or an end surface of a precursor of the transparent glass body, and the transparent step on a plate material. A step of placing the end face of the glass body or the end face of the precursor of the transparent glass body downward, and heat-treating the transparent glass body or the precursor of the transparent glass body at a temperature lower than the melting point of the powder. And a process.

To the end face of the transparent glass body or the end face of the precursor of the transparent glass body, the powdered paste is applied, and the end face of the transparent glass body or the precursor of the transparent glass body is placed with the end face down on the plate material, By heat-treating the transparent glass body or the precursor of the transparent glass body at a temperature lower than the melting point of the powder, a plurality of particles can be easily fixed to the bonding surface of the transparent sealing member with the mounting substrate. In this case, the consumption of particles can be suppressed, which is advantageous in terms of material cost. Further, when applying the powdered paste, it is possible to fix a plurality of particles at any place on the end surface of the transparent glass body or the end surface of the precursor of the transparent glass body, and the degree of freedom in design is also improved. ..

[5] In the first aspect of the present invention, the melting point of the particles is preferably higher than the melting point of the transparent glass body.

[6] In the first aspect of the present invention, the particles may be nitride, carbide or boride ceramic particles.

[7] In the first aspect of the present invention, the constituent material of the ceramic particles is AlN (aluminum nitride), Si ₃ N ₄ (silicon nitride), SiC (silicon carbide), WC (tungsten carbide), Mo ₂ C (carbonization). It is preferably molybdenum), BN (boron nitride), B ₄ C (boron carbide), MoB (molybdenum boride) or WB (tungsten boride).

[8] In the first aspect of the present invention, the particles may be metal particles.

[9] In the first aspect of the present invention, the constituent material of the metal particles (32b) is Mo (molybdenum), W (tungsten), Ti (titanium), Zr (zirconium), Pt (platinum), B (boron). , Cr (chromium) or Ir (iridium).

[10] In the first aspect of the present invention, the particles may be intermetallic compound particles.

[11] The constituent material of the intermetallic compound particles is preferably a silicide.

[12] In this case, the constituent material of the intermetallic compound particles is preferably MoSi ₂ or WSi ₂ .

[13] In the first aspect of the present invention, the average particle size of the particles is preferably in the range of 0.1 to 10 μm.

[14] In the first aspect of the present invention, it is preferable that a surface roughness Ra of a portion of the transparent sealing member that is joined to the mounting substrate is 0.1 to 10 μm.

[15] In the first aspect of the present invention, the transparent glass body is preferably made of quartz glass or borosilicate glass. Quartz glass is particularly preferable. That is, although quartz glass is excellent in transparency, it has a large difference in thermal expansion from the mounting substrate and is easily peeled off. However, the bonding strength can be increased in metal bonding with the mounting substrate by performing a step of fixing a plurality of particles on the bonding surface of the transparent sealing member with the mounting substrate. That is, the manufacturing method according to the present invention is effective when a transparent glass body such as quartz glass having a large thermal expansion difference from the mounting substrate is bonded to the mounting substrate.

[16] A method for manufacturing a transparent sealing member according to a second aspect of the present invention, which is used for a package for accommodating at least one optical element, and transparent glass which is metal-bonded to a mounting substrate on which the optical element is mounted. In the method for producing a transparent sealing member comprising a body, a step of disposing powder on a plate material, and an end surface of the transparent glass body or an end surface of the transparent glass body on the plate material on which the powder is disposed. The transparent encapsulation in which particles are fixed to the end face by going through a step of placing the powder down, a step of performing heat treatment at a temperature lower than the melting point of the powder, and a step of removing the transparent glass body from the plate material. It is characterized in that a member is obtained.

For example, when a transparent sealing member is metal-bonded to a mounting substrate on which an optical element is mounted to produce an optical component, it is not necessary to form a vapor deposition film having a multilayer structure between the transparent sealing member and the metal plating layer. Therefore, the manufacturing process of the optical component can be simplified, the number of steps can be reduced, and the manufacturing cost can be reduced.

[17] A method for manufacturing a transparent sealing member according to a third aspect of the present invention, which is used for a package for accommodating at least one optical element, and transparent glass which is metal-bonded to a mounting substrate on which the optical element is mounted. In the method for producing a transparent sealing member consisting of a body, a step of applying a powdered paste to the end face of the transparent glass body or the end face of the precursor of the transparent glass body, and the end face of the transparent glass body on a plate material. Alternatively, by passing through the step of placing the precursor of the transparent glass body with the end face down, performing a heat treatment at a temperature lower than the melting point of the powder, and removing the transparent glass body from the plate material. A transparent sealing member having particles fixed to the end faces is obtained.

Also in this invention, for example, when a transparent sealing member is metal-bonded to a mounting substrate on which an optical element is mounted to manufacture an optical component, a vapor deposition film having a multilayer structure is formed between the transparent sealing member and the metal plating layer. Since it is not necessary to do so, the manufacturing process of the optical component can be simplified, the number of steps can be reduced, and the manufacturing cost can be reduced. Particularly, in the present invention, the consumption of particles can be suppressed, which is advantageous in terms of material cost. Further, when applying the powdered paste, it is possible to fix a plurality of particles at any place on the end surface of the transparent glass body or the end surface of the precursor of the transparent glass body, and the degree of freedom in design is also improved. ..

As described above, according to the optical component manufacturing method and the transparent sealing member manufacturing method of the present invention, for example, the transparent sealing member is metal-bonded to the mounting substrate on which the optical element is mounted to manufacture the optical component. In this case, since it is not necessary to form a multilayer film between the transparent sealing member and the metal plating layer, the manufacturing process of the optical component can be simplified, the number of steps can be reduced, and the manufacturing cost can be reduced.

It is sectional drawing which shows an example of the optical component manufactured by the manufacturing method of the optical component which concerns on this Embodiment. FIG. 2A is an enlarged cross-sectional view showing a state in which ceramic particles are fixed to the end surface of the transparent glass body, with a part thereof omitted, and FIG. 2B shows a state in which metal particles are fixed to the end surface of the transparent glass body, partly omitted. FIG. 2C is an enlarged cross-sectional view in which a state in which intermetallic compound particles are fixed to the end surface of the transparent glass body is partially omitted. 6 is a flowchart showing a manufacturing process of the optical component according to the present embodiment. FIG. 4A is a process diagram showing a state where a transparent glass body is produced by cutting out or high temperature molding, and FIG. 4B is a process diagram showing a state where the transparent glass body is produced by a powder sintering method. 5A is a process diagram showing a state in which ceramic powder is placed on a plate material, and FIG. 5B is a process diagram showing a state in which a precursor of a transparent glass body or a transparent glass body is placed on the ceramic powder, and FIG. FIG. 5D is a process drawing showing a state of being heat-treated at a temperature lower than the melting point of ceramic powder, and FIG. 5D is a process drawing showing a state of removing a plate material to obtain a transparent sealing member to which ceramic particles are fixed. FIG. 6A is a process diagram showing a state in which pasted ceramic powder is applied to the end face of the precursor of the transparent glass body or the end face of the transparent glass body, and FIG. 6B is the precursor of the transparent glass body or the transparent glass on the plate material. FIG. 6C is a process diagram showing a state in which the body is placed, FIG. 6C is a process diagram showing a state of being heat-treated at a temperature lower than the melting point of the ceramic powder, and FIG. 6D is a transparent seal in which the plate material is removed and the ceramic particles are fixed. It is process drawing which shows the state made into a stop member. FIG. 7A is an explanatory diagram showing a method of obtaining an X-ray CT image from the joint surface of the transparent sealing member, and FIG. 7B is a diagram showing a convex portion due to particles exposed (projecting) from the joint surface in the acquired X-ray CT image. It is explanatory drawing which shows the method of obtaining surface roughness from height.

Hereinafter, embodiments of the method of manufacturing an optical component and the method of manufacturing a transparent sealing member according to the present invention will be described with reference to FIGS. 1 to 7B.

First, as shown in FIG. 1, an optical component 10 manufactured by the method for manufacturing an optical component according to the present embodiment contains, for example, at least one optical element 12 that emits ultraviolet light and an optical element 12. And the package 14. The package 14 has, for example, a plate-shaped mounting substrate 18 having the mounting surface 16 of the optical element 12, and a transparent sealing member 20 made of a transparent glass body 24 that is metal-bonded to the mounting substrate 18. The mounting substrate 18 is made of, for example, AlN (aluminum nitride).

The optical element 12 is mounted on the mounting surface 16 of the mounting substrate 18, as described above. Although not shown, the optical element 12 is formed by stacking, for example, a GaN-based crystal layer having a quantum well structure on a sapphire substrate (coefficient of thermal expansion: 7.7×10 ⁻⁶ /° C.). As a mounting method of the optical element 12, for example, so-called face-up mounting is adopted in which the light emitting surface 12a is mounted so as to face the transparent sealing member 20. That is, the terminal (not shown) led out from the optical element 12 and the circuit wiring (not shown) formed on the mounting substrate 18 are electrically connected by, for example, a bonding wire (not shown).

The transparent sealing member 20 is formed in a cylindrical shape having an upper surface closed and a lower surface opening, and has a recess 22 surrounding the optical element 12 mounted on the mounting surface 16 of the mounting substrate 18. The outer shape of the transparent sealing member 20 is, for example, a cylindrical shape, a polygonal tube shape, or the like. Of course, the transparent sealing member 20 may have a flat plate shape without the recess 22.

The transparent sealing member 20 has a height of 0.5 to 10 mm and an outer diameter of 3.0 to 10 mm. The optical element 12 has a thickness of 0.005 to 0.5 mm, a vertical dimension of 0.5 to 2.0 mm and a horizontal dimension of 0.5 to 2. It is 0 mm.

The transparent sealing member 20 of the optical component 10 includes a transparent glass body 24 and a plurality of particles 26 fixed to a bonding surface 24 a (also referred to as an end surface 24 a) of the transparent glass body 24 with the mounting substrate 18. Have and.

Further, the bonding portion between the transparent sealing member 20 and the mounting substrate 18 is at least the transparent sealing member of the first metal plating layer 28a formed on the bonding surface 24a side of the transparent sealing member 20 and the mounting substrate 18. It has the 2nd metal plating layer 28b formed in the part to which 20 is joined, and the brazing material 30 formed between the 1st metal plating layer 28a and the 2nd metal plating layer 28b.

As the first metal plating layer 28a, for example, an Au/Sn film, an Au film, a Ni film or the like can be used. As the second metal plating layer 28b, for example, an Au/Sn film, an Au film, an Ag film, a Ni film or the like can be used. As the brazing material 30, for example, Ag/Sn solder, Au/Sn solder, or the like can be used.

The particles 26 can be selected from nitride, carbide or boride ceramic particles 26a, for example, as shown in FIG. 2A. In this case, as a constituent material of the ceramic particles 26a, for example, AlN (melting point: 2200° C.), Si ₃ N ₄ (melting point: 1900° C.), SiC (melting point: 2730° C.), WC (melting point: 2870° C.) or Mo ₂ C (melting point: 2687° C.), BN (melting point: 2730° C.), B ₄ C (melting point: 2763° C.), MoB (melting point: 2823° C.), WB (melting point: 3073° C.), or the like can be selected. The average particle size of the ceramic particles 26a is preferably in the range of 0.1 to 10 μm.

Here, a method of manufacturing the optical component 10 according to the present embodiment will be described with reference to FIGS. 3 to 5D.

First, in step S1 of FIG. 3, a plurality of particles 26 are fixed to the bonding surface 24a of the transparent sealing member 20 with the mounting substrate 18 (particle fixing step). As a result, the transparent sealing member 20 according to this embodiment is completed. Then, in step S2, the bonding surface 24a of the transparent sealing member 20 and the mounting substrate 18 are metal-bonded (metal bonding step).

In the metal bonding step (S2), in step S2a, the first metal plating layer 28a is formed on the portion of the transparent sealing member 20 to which the plurality of particles 26 are fixed. Then, in step S2b, the second metal plating layer 28b is formed on at least the portion of the mounting substrate 18 to which the transparent sealing member 20 is joined. Then, in step S2c, the first metal plating layer 28a of the transparent sealing member 20 and the second metal plating layer 28b of the mounting substrate 18 are joined with the brazing material 30. As a result, the optical component 10 according to this embodiment is completed.

Next, the particle fixing step (S1) described above will be described with reference to FIGS. 4A to 6D.

First, the transparent glass body 24 is produced. Examples of the method for producing the transparent glass body 24 include (a) cutting out from a bulk base material, (b) high temperature molding, (c) powder sintering method, and the like.

The cutting process is performed from the bulk base material of the transparent glass body 24 to produce the transparent glass body 24 as shown in FIG. 4A. In the high temperature molding, a material is poured into a mold at a high temperature, or a material piece is put in the mold and is deformed into a mold at a high temperature to produce a transparent glass body 24 as shown in FIG. 4A.

The powder sintering method is, for example, casting a molding slurry containing silica powder and an organic compound in a molding die, and after solidifying by a chemical reaction between the organic compounds, for example, a dispersion medium and a curing agent or a curing agent mutual chemical reaction, The mold 32 is released from the mold to prepare a precursor 32 of the transparent glass body 24 as shown in FIG. 4B. Then, the precursor 32 is heat-treated to produce the transparent glass body 24.

Next, the particles 26 are fixed to the end surface 24a of the transparent glass body 24 (see FIG. 2A). As a method of fixing the ceramic particles 26a to the end surface 24a of the transparent glass body 24, for example, the following two methods can be mentioned.

That is, in the first method, as shown in FIG. 5A, a ceramic powder 42 is placed on a plate material having a high melting point, for example, a plate material 40 made of molybdenum, and then, as shown in FIG. 5B, a transparent glass body is placed thereon. The end surface 32a of the precursor 32 of 24 or the end surface 24a of the transparent glass body 24 is placed downward (preferably standing). Thereafter, as shown in FIG. 5C, heat treatment is performed at a temperature lower than the melting point of the ceramic powder 42 (preferably a temperature lower than the melting point of the plate material 40. The same applies hereinafter). When the precursor 32 is used in the step of FIG. 5B, the precursor 32 is sintered to become the transparent glass body 24. Thereafter, as shown in FIG. 5D, the plate member 40 is removed to obtain the transparent sealing member 20 in which the ceramic particles 26a are fixed to the joint surface 24a.

In the second method, as shown in FIG. 6A, first, the end surface 32a of the precursor 32 of the transparent glass body 24 or the end surface 24a of the transparent glass body 24 is printed, dipped, or sprayed with the pasted ceramic powder 42. Alternatively, it is applied by a method such as brush coating. Thereafter, as shown in FIG. 6B, after drying, the precursor 32 of the transparent glass body 24 or the transparent glass body 24 is placed (preferably standing) on a plate material having a high melting point, for example, a plate material 40 made of molybdenum. .. Then, as shown in FIG. 6C, heat treatment is performed at a temperature lower than the melting point of the ceramic powder 42. When the precursor 32 is used in the step of FIG. 6B, the precursor 32 is sintered to become the transparent glass body 24. Then, as shown in FIG. 6D, the plate member 40 is removed to obtain the transparent sealing member 20 in which the ceramic particles 26a are fixed to the joint surface 24a.

In the above-mentioned example, the example in which the ceramic particles 26a are used as the particles 26 is shown, but in addition, as shown in FIG. 2B, the metal particles 26b may be used. In this case, as a constituent material of the metal particles 26b, for example, Mo (melting point: 2623° C.), W (melting point: 3422° C.), Ti (melting point: 1668° C.), Zr (melting point: 1855° C.), Pt (melting point: 1768). C.), B (melting point: 2076° C.), Cr (melting point: 1907° C.), Ir (melting point: 2447° C.) and the like can be selected.

The particles 26 may be intermetallic compound particles 26c, as shown in FIG. 2C. In this case, the constituent material of the intermetallic compound particles 26c is preferably a silicide, and for example, MoSi ₂ (melting point: 2030° C.), WSi ₂ (melting point: 2160° C.) or the like can be selected.

The transparent sealing member 20 preferably has a surface roughness Ra of 0.1 to 10 μm at a portion to be joined to the mounting substrate 18. The surface roughness Ra of the portion bonded to the mounting substrate 18 is not the surface roughness of the bonding surface 24a itself, but the particles 26 (ceramic particles 26a, metal particles 26b, or intermetallic compound particles 26c) on the bonding surface 24a. The surface roughness after fixing is shown.

The surface roughness Ra was measured as follows. For example, as shown in FIG. 7A, for example, an X-ray CT image of the joint surface 24a of the transparent sealing member 20 along a preset measurement line La was acquired. Then, as shown in FIG. 7B, a plurality of convex portions 50 formed by the particles 26 exposed (projecting) from the bonding surface 24a are selected from the acquired X-ray CT image. For example, for example, five convex portions 50 are selected in descending order of height h. Then, the average value of the heights h of the selected five convex portions 50 was defined as the surface roughness Ra.

As described above, in the present embodiment, the particle fixing step of fixing the plurality of particles 26 to the bonding surface 24a of the transparent sealing member 20 with the mounting substrate 18, and the transparent sealing member 20 and the mounting substrate 18 are performed. Since it has a metal bonding step of metal bonding, the following operational effects are achieved.

That is, since the plurality of particles 26 are fixed to the joint surface 24 a of the transparent sealing member 20 with the mounting substrate 18, the first portion is attached to the portion of the transparent sealing member 20 to which the plurality of particles 26 are fixed. When the metal plating layer 28a is formed, the adhesion of the first metal plating layer 28a to the plurality of particles 26 is better than the adhesion to the transparent glass body 24. Adhesion is improved. As a result, it is not necessary to form a vapor deposition film having a multilayer structure between the transparent sealing member 20 and the first metal plating layer 28a. This leads to simplification of the manufacturing process of the optical component 10, reduction of man-hours, and reduction of manufacturing cost.

In the first method of the particle fixing step, the end surface 24a of the transparent glass body 24 or the precursor 32 of the transparent glass body 24 is placed with the end surface 32a facing down on the plate material 40 on which the ceramic powder 42 is arranged, and the transparent material is transparent. Since the glass body 24 or the precursor 32 of the transparent glass body 24 is heat-treated at a temperature lower than the melting point of the ceramic powder 42, a plurality of bonding surfaces 24a of the transparent sealing member 20 with the mounting substrate 18 can be easily formed. The ceramic particles 26a can be fixed. The same applies to the metal particles 26b and the intermetallic compound particles 26c.

In the second method of the particle fixing step, the pasted ceramic powder 42 is applied to the end surface 24a of the transparent glass body 24 or the end surface 32a of the precursor 32 of the transparent glass body 24, and the transparent glass body 24 is applied onto the plate material 40. End surface 24a or the precursor 32 of the transparent glass body 24 is placed with the end surface 32a facing down, and the transparent glass body 24 or the precursor 32 of the transparent glass body 24 is heat-treated at a temperature lower than the melting point of the ceramic powder 42. Therefore, the plurality of ceramic particles 26a can be easily fixed to the joint surface 24a of the transparent sealing member 20 with the mounting substrate 18. In this case, the consumption of the ceramic particles 26a can be suppressed, which is advantageous in terms of material cost. In addition, when applying the pasted ceramic powder 42, it is possible to fix a plurality of ceramic particles 26a at any place on the end surface 24a of the transparent glass body 24 or the end surface 32a of the precursor 32 of the transparent glass body 24. Therefore, the degree of freedom in design is improved. These effects are the same for the metal particles 26b and the intermetallic compound particles 26c.

The manufacturing method of the optical component and the manufacturing method of the transparent sealing member according to the present invention are not limited to the above-described embodiments, and it goes without saying that various configurations can be adopted without departing from the gist of the present invention. is there.

Claims (17)

An optical component having a mounting substrate (18) on which at least one optical element (12) is mounted, and a transparent sealing member (20) made of a transparent glass body (24) metal-bonded to the mounting substrate (18). In the manufacturing method of (10),
A particle fixing step of fixing a plurality of particles (26) to a bonding surface (24a) of the transparent sealing member (20) with the mounting substrate (18);
A method of manufacturing an optical component, comprising a metal bonding step of metal-bonding the transparent sealing member (20) and the mounting substrate (18). The method of manufacturing an optical component according to claim 1,
The metal bonding step,
A step of forming a first metal plating layer (28a) on a portion of the transparent sealing member (20) to which the plurality of particles (26) are fixed,
Forming a second metal plating layer (28b) on at least a portion of the mounting substrate (18) to which the transparent sealing member (20) is joined;
Bonding the first metal plating layer (28a) of the transparent sealing member (20) and the second metal plating layer (28b) of the mounting board (18) with a brazing material (30). A method for manufacturing an optical component, which is characterized by the above. The method for manufacturing an optical component according to claim 1 or 2,
The particle fixing step,
Placing the powder (42) on the plate (40),
The end face (24a) of the transparent glass body (24) or the precursor (32) of the transparent glass body (24) is placed on the plate member (40) on which the powder (42) is placed with the end face (32a) facing down. And the step of placing
And a step of heat-treating the transparent glass body (24) or the precursor (32) of the transparent glass body (24) at a temperature lower than the melting point of the powder (42). Method. The method for manufacturing an optical component according to claim 1 or 2,
The particle fixing step,
Applying a pasted powder (42) to the end surface (24a) of the transparent glass body (24) or the end surface (32a) of the precursor (32) of the transparent glass body (24);
Placing the end face (24a) of the transparent glass body (24) or the end face (32a) of the precursor (32) of the transparent glass body (24) on the plate material (40),
And a step of heat-treating the transparent glass body (24) or the precursor (32) of the transparent glass body (24) at a temperature lower than the melting point of the powder (42). Method. The method for manufacturing an optical component according to any one of claims 1 to 4,
The melting point of the particles (26) is higher than the melting point of the transparent glass body (24). The method for manufacturing an optical component according to claim 1, wherein
The said particle|grain (26) is a nitride, a carbide|carbonized_material, or a boride ceramic particle (26a), The manufacturing method of the optical component characterized by the above-mentioned. The method of manufacturing an optical component according to claim 6,
The constituent material of the ceramic particles (26a) is AlN (aluminum nitride), Si ₃ N ₄ (silicon nitride), SiC (silicon carbide), WC (tungsten carbide), Mo ₂ C (molybdenum carbide), BN (boron nitride). ), B ₄ C (boron carbide), MoB (molybdenum boride) or WB (tungsten boride). The method for manufacturing an optical component according to claim 1, wherein
The said particle|grain (26) is a metal particle (26b), The manufacturing method of the optical component characterized by the above-mentioned. The method of manufacturing an optical component according to claim 8,
The constituent material of the metal particles (26b) is Mo (molybdenum), W (tungsten), Ti (titanium), Zr (zirconium), Pt (platinum), B (boron), Cr (chromium) or Ir (iridium). And a method of manufacturing an optical component. The method for manufacturing an optical component according to claim 1, wherein
The said particle|grain (26) is an intermetallic compound particle|grain (26c), The manufacturing method of the optical component characterized by the above-mentioned. The method for manufacturing an optical component according to claim 10,
The method for manufacturing an optical component, wherein the constituent material of the intermetallic compound particles (26c) is a silicide. The method for manufacturing an optical component according to claim 10,
The method for producing an optical component, wherein the constituent material of the intermetallic compound particles (26c) is MoSi ₂ or WSi ₂ . The method for manufacturing an optical component according to any one of claims 1 to 12,
The method for producing an optical component, wherein the particles (26) have an average particle diameter in the range of 0.1 to 10 μm. The method for manufacturing an optical component according to any one of claims 1 to 13,
A method for manufacturing an optical component, wherein a surface roughness Ra of a portion of the transparent sealing member (20) that is joined to the mounting substrate (18) is 0.1 to 10 μm. The method for manufacturing an optical component according to any one of claims 1 to 14,
The method for manufacturing an optical component, wherein the transparent glass body (24) is made of quartz glass or borosilicate glass. A transparent glass body (24) used for a package (14) for containing at least one optical element (12) and metal-bonded to a mounting substrate (18) on which the optical element (12) is mounted. In the method for manufacturing the sealing member (20),
Placing the powder (42) on the plate (40),
The end face (24a) of the transparent glass body (24) or the precursor (32) of the transparent glass body (24) is placed on the plate member (40) on which the powder (42) is placed with the end face (32a) facing down. And the step of placing
Performing a heat treatment at a temperature lower than the melting point of the powder (42),
The transparent sealing member (20) having the particles (26) fixed to the end face (24a) is obtained by a step of removing the transparent glass body (24) from the plate material (40). A method for manufacturing a transparent sealing member. A transparent glass body (24) used for a package (14) for containing at least one optical element (12) and metal-bonded to a mounting substrate (18) on which the optical element (12) is mounted. In the method for manufacturing the sealing member (20),
Applying a pasted powder (42) to the end surface (24a) of the transparent glass body (24) or the end surface (32a) of the precursor (32) of the transparent glass body (24);
Placing the end face (24a) of the transparent glass body (24) or the end face (32a) of the precursor (32) of the transparent glass body (24) on the plate material (40),
Performing a heat treatment at a temperature lower than the melting point of the powder (42),
A transparent sealing member (20) having particles (26) fixed to an end face (24a) is obtained by going through the step of removing the transparent glass body (24) from the plate material (40). Manufacturing method of sealing member.

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