JPWO2018110215A1 - Module parts - Google Patents

Abstract

The module component (10) includes a multilayer substrate (20) including a magnetic layer (21), mounted electronic components (51, 52), and an outer conductor (60). The multilayer substrate (20) includes a first main surface (203) and a second main surface (204) facing each other, and side surfaces (201, 202) connecting the first main surface (203) and the second main surface (204). ) And ground terminal conductors (411, 412) on the second main surface (204). The mountable electronic components (51, 52) are mounted on the component mounting land conductors (441, 442). The outer conductor (60) covers the first main surface (203) and the side surfaces (201, 202) of the multilayer substrate (20). The multilayer substrate (20) includes a magnetic layer (21), a low-frequency ground path (SL), and a high-frequency ground path (SH), and includes an outer conductor (60) and ground terminal conductors (411, 412). Is connected. The low-frequency ground path (SL) includes an outer conductor (60), a first ground layer (430) disposed on the first main surface (203) side of the magnetic layer (21), and a magnetic layer (21). The first via conductor (450) penetrating in the thickness direction is connected.

Description

  The present invention relates to a module component including a substrate including a magnetic body and an electronic component mounted on the surface of the substrate.

  Conventionally, various module components in which electronic components are mounted on the surface of a substrate have been put into practical use. For example, Patent Document 1 describes a DC-DC converter module in which a choke coil is built in a ferrite substrate and electronic components such as a switching IC chip and a capacitor are surface-mounted. The module described in Patent Document 1 includes a metal cap. The metal cap is disposed on the surface side of the ferrite substrate and covers the mounting area of the electronic component.

  In such a DC-DC converter module, it is known that noise radiated from electronic components is generated. Noise is suppressed by the metal cap.

International Publication No. WO2010 / 016367A1

  However, the metal cap provided in the DC-DC converter module described in Patent Document 1 can shield noise radiated upward from the surface of the ferrite substrate, but is radiated toward the side surface of the substrate. Noise cannot be shielded.

  Further, in the conventional configuration, since the noise is guided to the ground terminal on the back surface through the via in the ferrite substrate, the high frequency noise cannot be sufficiently dropped to the ground.

  Further, with the configuration of Patent Document 1, low frequency noise cannot be efficiently dropped to the ground.

  Therefore, an object of the present invention is to efficiently drop high-frequency noise and low-frequency noise to the ground.

  The module component of the present invention includes a multilayer substrate including a magnetic layer, a mountable electronic component, and an outer conductor. The multilayer substrate has a first main surface and a second main surface facing each other, a side surface connecting the first main surface and the second main surface, and a ground terminal conductor on the second main surface. The mountable electronic component is mounted on a component mounting land conductor. The outer surface conductor covers the first main surface and the side surface of the multilayer substrate.

  The multilayer substrate includes a magnetic layer, a low-frequency ground path, and a high-frequency ground path. Each ground path connects the outer conductor and the ground terminal conductor.

  The low-frequency ground path connects the outer conductor, the first ground layer disposed on the first main surface side of the magnetic layer, and the first via conductor penetrating in the thickness direction of the magnetic layer. .

  In this configuration, due to the bead effect of the first via conductor, low-frequency noise generated from the mounted electronic component passes through the low-frequency ground path and efficiently falls to the ground.

  The module component of the present invention preferably has the following configuration.

  The high-frequency ground path connects the outer conductor, the second ground layer disposed on the second main surface side of the magnetic body, and the second via conductor that connects the second ground layer and the ground terminal conductor.

  In this configuration, due to the skin effect of the outer conductor, high-frequency noise generated from the mounted electronic component passes through the high-frequency ground path and falls to the ground.

  The module component of the present invention preferably has the following configuration. The multilayer substrate includes a first nonmagnetic layer on the first main surface side of the magnetic layer, and a second nonmagnetic layer on the second main surface side of the magnetic layer. A first ground layer is provided at the interface between the magnetic layer and the first nonmagnetic layer, and a second ground layer is provided at the interface between the magnetic layer and the second nonmagnetic layer.

  In this configuration, due to the ductility of the first ground layer and the second ground layer, the magnetic layer and the first nonmagnetic layer, and the magnetic layer and the second nonmagnetic layer are difficult to peel off.

  The module component of the present invention preferably has the following configuration. The thickness of the first ground layer is greater than the thickness of the second ground layer.

  In this configuration, the direct current resistance of the first ground layer is lowered, and low frequency noise is easily propagated to the first ground layer.

  The module component of the present invention preferably has the following configuration. The magnetic layer includes a coil connected to the mounting electronic component. The coil is surrounded by a first ground layer, a second ground layer, and an outer conductor.

  In this configuration, radiation of noise generated in the coil to the outside is suppressed.

  The module component of the present invention preferably has the following configuration. The first via conductor and the second via conductor are arranged on the side of the multilayer substrate from the coil in plan view of the multilayer substrate.

  In this configuration, since the first via conductor and the second via conductor are not disposed in the coil opening, the coil characteristics are improved.

  The module component of the present invention preferably has the following configuration. The first via conductor and the second via conductor are at least partially matched.

  In this configuration, it is not necessary to form the first via conductor and the second via conductor separately, which facilitates manufacturing and reduces costs.

  The module component of the present invention preferably has the following configuration. The thickness of the first ground layer is greater than the thickness of the outer conductor.

  In this configuration, high frequency noise is easily propagated to the outer conductor, and low frequency noise is easily propagated to the first ground layer.

  The module component of the present invention preferably has the following configuration. The mounted electronic component is covered with a resin layer. The outer conductor is a metal film formed by a thin film process on the surface of the resin layer.

  With this configuration, the mounted electronic component can be thinned.

  According to the present invention, each of high frequency noise and low frequency noise can be efficiently dropped to the ground.

(A) is side surface sectional drawing which shows schematic structure of the module component which concerns on the 1st Embodiment of this invention, (B) is a side view. It is a perspective view which shows schematic structure of the module component which concerns on the 1st Embodiment of this invention. FIG. 3 is an enlarged perspective view showing a low frequency ground path and a high frequency ground path of the module component according to the first embodiment of the present invention. It is the graph shown about the frequency characteristic of the ferrite bead. It is a schematic circuit diagram which shows the example of a power supply circuit to which the module component which concerns on the 1st Embodiment of this invention is applied. It is side surface sectional drawing which shows schematic structure of the module component which concerns on the 2nd Embodiment of this invention.

(First embodiment)
FIG. 1A is a side sectional view showing a schematic configuration of a module component according to the first embodiment of the present invention. FIG. 1B is a side view of the module component. FIG. 2 is a perspective view of a schematic configuration of the module component of the present invention. FIG. 3 is a schematic diagram showing a path where low-frequency noise and high-frequency noise of module parts fall to the ground. FIG. 4 is a graph showing frequency characteristics of ferrite beads. FIG. 5 is a schematic circuit diagram showing an example of a power supply circuit to which the module component is applied.

  As shown in FIGS. 1A and 2, the module component 10 includes a ferrite substrate 20, a sealing resin 30, mounted electronic components 51 and 52, and an outer conductor 60.

  The ferrite substrate 20 has a rectangular shape in plan view, that is, a rectangular parallelepiped shape. In other words, the ferrite substrate 20 includes a first main surface 203 and a second main surface 204 that face each other, and further, a first side surface 201 and a second side that connect the first main surface 203 and the second main surface 204. It has a side surface 202.

  The ferrite substrate 20 includes a magnetic layer 21 and nonmagnetic layers 22 and 23. The nonmagnetic layer 22 corresponds to the “first nonmagnetic layer” of the present invention, and the nonmagnetic layer 23 corresponds to the “second nonmagnetic layer” of the present invention.

  The nonmagnetic layer 22 and the nonmagnetic layer 23 are stacked with the magnetic layer 21 interposed therebetween. The nonmagnetic layer 22 is in contact with the first main surface 203 side of the magnetic layer 21. The nonmagnetic layer 23 is in contact with the second main surface 204 side of the magnetic layer 21. In other words, the ferrite substrate 20 is laminated in the order of the nonmagnetic layer 22, the magnetic layer 21, and the nonmagnetic layer 23 along the thickness direction.

  In this configuration, the outer surface (the surface orthogonal to the thickness direction) of the ferrite substrate 20 on the nonmagnetic layer 22 side is the first main surface 203 of the ferrite substrate 20, and the outer surface of the ferrite substrate 20 on the nonmagnetic layer 23 side. (A surface orthogonal to the thickness direction) is the second main surface 204 of the ferrite substrate 20.

  The ground terminal conductors 411 and 412 and the external connection terminal conductor 413 are formed on the second main surface 204 of the ferrite substrate 20. The component mounting land conductors 441 and 442 are formed on the first main surface 203 of the ferrite substrate 20. The mounting electronic component 51 is mounted on the component mounting land conductor 441, and the mounting electronic component 52 is mounted on the component mounting land conductor 442.

  The ferrite substrate 20 includes a first ground layer 430 at the interface between the nonmagnetic layer 22 and the magnetic layer 21. The ferrite substrate 20 includes a second ground layer 420 at the interface between the nonmagnetic layer 23 and the magnetic layer 21. That is, the first ground layer 430 is disposed on the first main surface 203 side of the magnetic layer 21, and the second ground layer 420 is disposed on the second main surface 204 side of the magnetic layer 21.

  With this configuration, the magnetic layer 21 and the nonmagnetic layer 22, and the magnetic layer 21 and the nonmagnetic layer 23 are difficult to peel off due to the ductility of the first ground layer 430 and the second ground layer 420.

  The first ground layer 430 and the second ground layer 420 have portions exposed to the first side surface 201 and the second side surface 202 of the ferrite substrate 20.

  The ferrite substrate 20 penetrates the magnetic layer 21 in the thickness direction and includes via conductors 451 and 461. The via conductors 451 and 461 connect the first ground layer 430 and the second ground layer 420.

  Furthermore, the ferrite substrate 20 includes via conductors 452 and 462 that penetrate the nonmagnetic layer 23 in the thickness direction. The via conductor 452 connects the second ground layer 420 and the ground terminal conductor 411. Similarly, the via conductor 462 connects the second ground layer 420 and the ground terminal conductor 412.

  Here, as shown in FIGS. 1A, 1B, and 3, the via conductor 451 and the via conductor 452 are connected with the second ground layer 420 interposed therebetween. That is, the via conductor 450 has a structure in which the via conductor 451 and the via conductor 452 are connected. Similarly, as shown in FIGS. 1A and 1B, the via conductor 461 and the via conductor 462 are connected with the second ground layer interposed therebetween. That is, the via conductor 460 has a structure in which the via conductor 461 and the via conductor 462 are connected. These via conductors 450 and 460 correspond to the “first via conductor” of the present invention, and the via conductors 452 and 462 correspond to the “second via conductor” of the present invention.

  The via conductor 451 and the via conductor 452 overlap in plan view, and the via conductor 461 and the via conductor 462 overlap in plan view. Thereby, the connection distance between the first ground layer 430 and the ground terminal conductors 411 and 412 can be shortened. Thus, low frequency noise is more likely to fall to ground.

  A plurality of via conductors 450 and via conductors 460 may be formed.

  The sealing resin 30 is formed on the first main surface 203 side of the ferrite substrate 20. The sealing resin 30 covers the first main surface 203 of the ferrite substrate 20 and the mounted electronic components 51 and 52.

  The outer conductor 60 is a surface of the sealing resin 30 opposite to the surface in contact with the ferrite substrate 20 (surface as the module component 10), the side surface of the sealing resin 30, the first side surface 201 and the second side surface of the ferrite substrate 20. 202 and the side surface including 202 is covered. At this time, the outer conductor 60 covers up to the second ground layer 420.

  In this configuration, the outer conductor 60 and the first ground layer 430 are connected by the first side surface 201. The first ground layer 430 is connected to the ground terminal conductor 411 via the via conductor 450 (the via conductor 451 and the via conductor 452). Similarly, the outer conductor 60 and the first ground layer 430 are connected by the second side surface 202. The first ground layer 430 is connected to the ground terminal conductor 412 via the via conductor 460 (via conductor 461 and via conductor 462).

  The via conductors 451 and 461 are arranged inside the magnetic layer 21 and have impedance characteristics as shown in FIG. 4 due to bead characteristics. Schematically, the impedance in the low frequency region becomes small.

  Specifically, as can be seen from the graph shown in FIG. 4, due to the bead effect, the impedance Z, the reactance component jX, and the resistance component R are low in the low frequency region and high in the high frequency region. That is, as with the inductor, the impedance Z decreases as the frequency decreases, and the impedance Z increases as the frequency increases. For this reason, it works as a low-pass filter.

  The low frequency noise and the high frequency noise in the present invention are preferably defined as follows. As shown in FIG. 4, the frequency at which the impedance Z and the resistance component R in the ferrite bead have peak values is FP. Noise having a frequency lower than the frequency FP is defined as low-frequency noise, and frequency higher than the frequency FP is defined as high-frequency noise. The thresholds for the low frequency noise and the high frequency noise can be set low. The value of the frequency FP is determined by the material of the magnetic layer 21. In other words, the material of the magnetic layer 21 can be selected in consideration of the frequency FP.

  Accordingly, the low frequency noise is generated from the outer conductor 60 to the first ground layer 430 via the via conductor 451 via the via conductor 452 (via the via conductor 450), to the ground terminal conductor 411, or from the via conductor 461. The signal is transmitted to the ground terminal conductor 412 through the via conductor 462 (via the via conductor 460). That is, the low-frequency noise passes through the low-frequency ground path SL shown in FIG. 3 and is efficiently dropped to the ground terminal. This path corresponds to the “low frequency ground path” in the present invention.

  Further, in this configuration, the outer conductor 60 and the second ground layer 420 are connected by the first side surface 201. The second ground layer 420 is connected to the ground terminal conductor 411 through the via conductor 452. Similarly, the outer conductor 60 and the second ground layer 420 are connected by the second side face 202. The second ground layer 420 is connected to the ground terminal conductor 412 via the via conductor 462.

  The high-frequency noise propagates through the outer conductor 60 due to the skin effect of the outer conductor 60, propagates from the outer conductor 60 to the second ground layer 420, passes through the via conductors 452 and 462 from the second ground layer 420, and then serves as a ground terminal conductor 411 and 412. That is, the high frequency noise passes through the high frequency ground path SH shown in FIG. 3 and is efficiently dropped to the ground terminal. This path corresponds to the “high-frequency ground path” in the present invention.

  As described above, the module component 10 can effectively propagate both the low-frequency noise and the high-frequency noise to the ground terminal conductors 411 and 412 by having the above-described configuration.

  Therefore, radiation noise to the outside and noise from the outside can be suppressed.

  Furthermore, as shown in FIGS. 1A, 1 </ b> B, and 2, the module component 10 includes a coil 401 in the magnetic layer 21. As shown in FIG. 2, the coil 401 is realized as a spiral conductor having an opening at the center in a plan view of the ferrite substrate 20 and having the thickness direction as an axial direction.

  In this configuration, the via conductor 451 is disposed closer to the first side surface 201 than the coil 401 when the ferrite substrate 20 is viewed in plan. Similarly, the via conductor 461 is disposed closer to the second side surface 202 than the coil 401. Therefore, the influence of the via conductors 451 and 461 on the coil 401 is reduced, and the characteristics of the coil are improved.

  The coil 401 is disposed at a position surrounded by the first ground layer 430, the second ground layer 420, and the outer conductor 60. Therefore, the radiation to the outside of the noise generated in the coil 401 can be suppressed.

  Furthermore, the via conductor 451 is preferably disposed at a position close to the first side surface 201. Similarly, the via conductor 461 is preferably disposed at a position close to the second side surface 202. As a result, the DC resistance is lowered, and the low frequency noise is efficiently transmitted to the low frequency ground path SL.

  When the thickness d430 of the first ground layer 430 is larger than the thickness d200 of the outer conductor 60, the low frequency noise is more easily propagated through the low frequency ground path SL, and the high frequency noise is propagated through the high frequency ground path SH. It becomes easy. Accordingly, the thickness d430 of the first ground layer 430 is preferably larger than the thickness d420 of the second ground layer 420. As a result, low frequency noise and high frequency noise are more efficiently dropped to the ground.

  The module component 10 having such a configuration is applied to a circuit as shown in FIG. As shown in FIG. 5, the module component 10 includes an input terminal PIN, an output terminal POUT, a ground terminal PGND, a control IC 71, an input capacitor 72, an inductor (choke coil) 73, a noise conduction unit 74, and an output capacitor 75. .

  An input terminal of the control IC 71 is connected to the input terminal PIN. A noise conduction unit 74 is connected to the input terminal PIN and the ground terminal PGND. An input capacitor 72 is connected between the input terminal PIN and the ground terminal PGND. A noise conduction unit 74 is connected to the output end of the control IC 71. Further, an inductor 73 is connected to the output terminal of the control IC 71, and the inductor 73 is connected to the output terminal POUT. An output capacitor 75 is connected between the output terminal POUT and the ground terminal PGND. The ground terminal PGND is connected to an external ground (ground potential) that is a reference potential.

  The noise conduction unit 74 is realized by the low-frequency ground path SL and the high-frequency ground path SH configured as described above.

  Using the switching control by the control IC 71, the module component 10 steps down the input voltage Vin given to the input terminal PIN, and outputs it from the output terminal POUT as the output voltage Vout. That is, the module component 10 functions as a DC-DC converter.

  At this time, the module component 10 includes the noise conducting portion 74, so that low frequency noise such as switching noise and high frequency noise can be efficiently dropped to the ground.

  Note that the second ground layer may be omitted when the entire surfaces of the first side surface 201 and the second side surface 202 are covered.

(Second Embodiment)
Next, a module component according to the second embodiment of the present invention will be described with reference to the drawings. FIG. 6 is a side sectional view showing a schematic configuration of a module component according to the second embodiment of the present invention. As shown in FIG. 6, the module component 10A according to the second embodiment is different from the module component 10 according to the first embodiment in that an opening H420 and an opening H430 are provided. Other configurations are the same as those of the module component 10, and the description of the same parts is omitted.

  The opening H430 is provided in the first ground layer 430, and the opening H420 is provided in the second ground layer 420. The openings H420 and H430 preferably overlap the coil 401 in plan view.

  By providing the openings H420 and H430, the coupling between the electrical and magnetic coil 401 and the first ground layer 430 and the second ground layer 420 is suppressed, and the characteristics of the coil 401 are improved.

  Thereby, it is possible to realize the module component 10A which has excellent coil characteristics and can easily drop both low frequency noise and high frequency noise to the ground.

10, 10A: Module component 20: Ferrite substrate 21: Magnetic layer 22, 23: Nonmagnetic layer 30: Sealing resin 51, 52: Mounted electronic component 60: External conductor 71: Control IC
72: Input capacitor 73: Inductor 74: Noise conduction part 75: Output capacitor 201: First side surface 202: Second side surface 203: First main surface 204: Second main surface 401: Coil 411, 412: Ground terminal conductor 413 : External connection terminal conductor 420: second ground layer 430: first ground layers 441, 442: component mounting land conductors 450, 451, 452, 460, 461, 462: via conductors d200, d420, d430: thickness FP: Frequency H420, H430: Opening jX: Reactance component PGND: Ground terminal PIN: Input terminal POUT: Output terminal R: Resistance component SH: High frequency ground path SL: Low frequency ground path Vin: Input voltage Vout: Output voltage Z: Impedance

Claims (9)

A first main surface and a second main surface facing each other; a side surface connecting the first main surface and the second main surface; and a component-mounting land conductor on the first main surface, (2) A multilayer substrate including a ground terminal conductor on a main surface and including a magnetic layer;
A mounting electronic component mounted on the component mounting land conductor;
An outer conductor covering the first main surface side and the side surface of the multilayer substrate;
A low-frequency ground path for transmitting low-frequency noise by connecting the outer conductor and the ground terminal conductor;
A high-frequency ground path for transmitting high-frequency noise by connecting the outer conductor and the ground terminal conductor;
With
The low-frequency ground path is
A first ground layer disposed on the first main surface side of the magnetic layer;
A first via conductor that penetrates the magnetic layer in the thickness direction and connects the first ground layer and the ground terminal conductor;
Module parts. The high-frequency ground path is
A second ground layer disposed on the second main surface side of the magnetic layer;
A second via conductor connecting the second ground layer and the ground terminal conductor,
The module component according to claim 1. The multilayer substrate is
A first nonmagnetic layer on the first main surface side of the magnetic layer, and a second nonmagnetic layer on the second main surface side of the magnetic layer,
The first ground layer is disposed at an interface between the magnetic layer and the first non-magnetic layer;
The second ground layer is disposed at an interface between the magnetic layer and the second non-magnetic layer;
The module component according to claim 2. The thickness of the first ground layer is greater than the thickness of the second ground layer,
The module component according to claim 3. The magnetic layer has a coil connected to the mounting electronic component,
The module component according to any one of claims 2 to 4, wherein the coil is surrounded by the first ground layer, the second ground layer, and the outer conductor. The first via conductor and the second via conductor are disposed on the side of the multilayer substrate from the coil in a plan view of the multilayer substrate.
The module component according to claim 5. The first via conductor and the second via conductor are at least partially coincided,
The module component according to any one of claims 2 to 5. The thickness of the first ground layer is larger than the thickness of the outer conductor.
The module component according to any one of claims 1 to 6. The mounting electronic component is covered with a resin layer,
The module component according to claim 1, wherein the outer conductor is a metal film formed on a surface of the resin layer by a thin film process.

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