WO2010016367A1 - Composite electronic component - Google Patents

Composite electronic component Download PDF

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Publication number
WO2010016367A1
WO2010016367A1 PCT/JP2009/062862 JP2009062862W WO2010016367A1 WO 2010016367 A1 WO2010016367 A1 WO 2010016367A1 JP 2009062862 W JP2009062862 W JP 2009062862W WO 2010016367 A1 WO2010016367 A1 WO 2010016367A1
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Prior art keywords
chip
electronic component
composite electronic
control
substrate
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PCT/JP2009/062862
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French (fr)
Japanese (ja)
Inventor
谷口勝己
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株式会社村田製作所
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Publication of WO2010016367A1 publication Critical patent/WO2010016367A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/04—Fixed inductances of the signal type  with magnetic core
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F2017/0066—Printed inductances with a magnetic layer

Definitions

  • the present invention relates to a composite electronic component constructed by mounting various components including a control IC chip on a laminated substrate having a built-in magnetic element such as a smooth coil and a transformer among main components.
  • FIG. 1 is a cross-sectional view of the power converter shown in Patent Document 1.
  • a first conductor 4 is formed on the front surface of a ferrite substrate 1
  • a second conductor 5 is formed on the back surface, and the first conductor 4 and the second conductor 5 pass through the ferrite substrate 1.
  • the surfaces of the first conductor 4 and the second conductor 5 are covered with a resist or an insulating protective film 8 to form a toroidal endless solenoid thin film inductor.
  • the array 14 constitutes a power conversion device.
  • the coil electrode is formed on the ferrite substrate 1
  • the semiconductor chip is mounted on the surface of the substrate, and the semiconductor chip is connected to the connection wiring passing through the side portion of the substrate.
  • the magnetic field generated around the coil electrode spreads around the power converter, affecting the characteristics of the circuit components mounted on the circuit board together with the power converter. Will be given.
  • an object of the present invention is to provide a composite electronic component in which the magnetic field generated by the coil is difficult to spread around and the generation of radiation noise is suppressed.
  • the present invention is configured as follows.
  • a composite electronic component comprising a switching element and a coil conductor,
  • the coil conductor is formed on a laminated substrate, the switching element is provided in a control IC chip having a connection terminal on a lower surface, and either the winding start or the winding end of the coil conductor is connected to the connection terminal and It is assumed that it is provided directly under the control IC chip.
  • the connection end of the coil conductor is arranged immediately below the control IC chip, so that the control IC chip suppresses an electric field and a magnetic field, so that radiation noise can be reduced.
  • the multilayer substrate is made of a magnetic material, and the coil conductor is exposed at the outer surface of the multilayer substrate as the connection terminal and the other is formed inside the multilayer substrate.
  • the coil conductor has a helical shape, the winding central axis direction of the coil conductor is the same as the lamination direction of the laminated substrate, and the center of the control IC chip is substantially wound around the coil conductor. It is assumed that it is mounted on the upper surface of the laminated substrate so as to pass through the rotation center axis. Because the magnetic flux density is small at the coil conductor winding center position (center) on the top surface of the multilayer substrate, the control IC chip is mounted so that the center of the control IC chip substantially coincides with the coil conductor winding center. Thus, the disturbance of the magnetic field of the coil conductor can be reduced.
  • connection terminal of the control IC chip is directly connected to one end of the coil conductor.
  • at least one end of the coil conductor is exposed to the outer surface of the multilayer substrate and is electrically connected to the control IC chip at that portion, so unnecessary connection portions are not exposed to the outer surface of the multilayer substrate, and radiation noise is reduced. Occurrence is suppressed.
  • the control IC chip and other elements are mounted on the multilayer substrate, a metal cap is disposed so as to cover an upper portion of the multilayer substrate, and a lead portion of the metal cap is provided on a side surface of the multilayer substrate. It is set as the structure joined. Thereby, radiation noise from the DC-DC converter can be suppressed.
  • the lead portion of the metal cap is drawn to the lower surface of the multilayer substrate and also serves as a ground electrode.
  • the mounting portion of the metal cap replaces the ground electrode on the lower surface or side surface of the multilayer substrate, so that the parasitic inductance is reduced compared to the case where a via conductor for connecting the metal cap to the ground is formed in the multilayer substrate.
  • a small composite electronic component in which radiation noise is sufficiently suppressed can be configured.
  • FIG. 1 is an exploded perspective view of a DC-DC converter module 51 according to a first embodiment.
  • FIG. 2 is a circuit diagram and a waveform diagram of a DC-DC converter module 51 according to a first embodiment.
  • FIG. 5 is an exploded perspective view of a DC-DC converter module 52 according to a second embodiment.
  • FIG. 5 is a circuit diagram of a DC-DC converter module 52 according to a second embodiment.
  • FIG. 6 is an exploded perspective view of a DC-DC converter module 53 according to a third embodiment. It is a disassembled perspective view of the DC-DC converter module 54 which concerns on 4th Embodiment.
  • a DC-DC converter module 51 which is an example of a composite electronic component according to the first embodiment, will be described with reference to FIGS. 2 is an exploded perspective view of the DC-DC converter module 51, and FIG. 3 is a circuit diagram and a waveform diagram thereof.
  • FIG. 2 in order to show the configuration of the inside and the bottom surface of the magnetic substrate 30, it is shown transparent. This drawing method is the same for the other embodiments described below.
  • lower surface terminals 42, 43, and 44 are formed on the lower surface of the magnetic substrate 30.
  • an upper surface electrode (a pattern is not shown) is formed on the upper surface of the magnetic substrate 30.
  • a smoothing coil L1 connected between the lower surface terminal and the upper surface electrode is formed inside the magnetic substrate 30, a smoothing coil L1 connected between the lower surface terminal and the upper surface electrode is formed.
  • the smoothing coil L1 has a helical shape.
  • a control IC chip 31 including a switching element, an input capacitor Ca, and an output capacitor Cb are mounted on the upper surface of the magnetic substrate 30. These components are electrically connected to the upper surface electrode of the magnetic substrate 30. In particular, one end of the smoothing coil L ⁇ b> 1 is exposed as the connection terminal 41 on the upper surface of the magnetic substrate 30. Further, the control IC chip 31 has a CSP (Chip size package) shape, and bumps for face down bonding (connection terminals on the control IC chip side) are provided on the lower surface thereof, one of which is a smoothing coil L1. Is directly connected to the connection terminal 41 at one end of the terminal.
  • CSP Chip size package
  • the other end of the smoothing coil L1 may be drawn to the upper surface or the lower surface of the magnetic substrate 30 by a via conductor or the like formed in the magnetic substrate 30.
  • connection terminal 41 at one end of the smoothing coil L ⁇ b> 1 is provided directly under the control IC chip 31. Therefore, since the electrode in the control IC chip 31 shields the magnetic field generated by the smoothing coil L1, radiation noise is suppressed.
  • the smooth coil L1 is exposed to the outer surface of the multilayer substrate only at the connection terminal 41 and is electrically connected to the control IC chip at that portion, unnecessary connection portions are not exposed to the outer surface of the multilayer substrate, and radiation noise is generated. Occurrence is suppressed.
  • the magnetic field (magnetic flux) leaking from the coil can be reduced, and the influence of the magnetic field on other circuits can be reduced.
  • the smoothing coil L1 has a helical shape, and the winding center axis direction is the same as the lamination direction of the magnetic substrate 30, and the center of the control IC chip 31 passes through the winding center axis of the smoothing coil L1.
  • the magnetic substrate 30 is mounted on the upper surface. Therefore, the disturbance of the magnetic field of the coil conductor due to the mounting of the control IC can be reduced.
  • the DC-DC converter module 51 is mounted on the wiring board of the electronic device, and the input voltage source 21 is connected to the input terminal IN of the DC-DC converter module 51 as shown in FIG. 2 and 3, the input terminal IN corresponds to the lower surface terminal 42, the output terminal OUT corresponds to the lower surface terminal 44, and the ground terminal GND corresponds to the lower surface terminal 43.
  • the other parts are denoted by the same reference numerals.
  • the control IC chip 31 includes a switching element Q1 and a diode D1 as a flywheel element, and a switching control circuit for performing switching control thereof.
  • the switching control circuit in the control IC chip 31 turns on / off the switching element Q1.
  • the DC-DC converter module 51 constitutes a step-down DC-DC converter.
  • the input current Ia is a discontinuous wave in which a rectangular pulse current flows when the switching element Q1 is turned on. Become.
  • the output current Ib flowing through the smoothing coil L1 has a continuous wave shape including ripples.
  • the diode D1 is used as a synchronous rectifying element that acts as a flywheel element, but an FET may be provided as a flywheel element.
  • an FET is used as the switching element, but a bipolar transistor may be used. The same applies to each of the embodiments shown in the second and subsequent embodiments.
  • a non-insulated step-down DC-DC converter is configured on the magnetic substrate 30, but a transformer is configured on the magnetic substrate 30 in place of the smoothing coil L1 to provide an insulating type.
  • a forward type DC-DC converter may be configured.
  • a DC-DC converter module 52 as an example of a composite electronic component according to the second embodiment will be described with reference to FIGS. 4 is an exploded perspective view of the DC-DC converter module 52, and FIG. 5 is a circuit diagram thereof.
  • lower surface terminals 42, 43, 44 are formed on the lower surface of the magnetic substrate 30.
  • an upper surface electrode (a pattern is not shown) is formed on the upper surface of the magnetic substrate 30.
  • a smoothing coil L1 and inductors L2, L3, and L4 connected between the lower surface terminal and the upper surface electrode are formed inside the magnetic substrate 30, respectively.
  • the smoothing coil L1 has a helical shape.
  • the inductors L2, L3, and L4 are configured by via conductors.
  • a control IC chip 31 including a switching element, an input capacitor Ca, and an output capacitor Cb are mounted on the upper surface of the magnetic substrate 30. These components are electrically connected to the upper surface electrode of the magnetic substrate 30.
  • one end of the smoothing coil L ⁇ b> 1 is exposed as the connection terminal 41 on the upper surface of the magnetic substrate 30.
  • the control IC chip 31 has a CSP shape, and a bump for face down bonding (connection terminal on the control IC chip side) is provided on the lower surface, one of which is connected to one end of the smoothing coil L1. Directly connected to the terminal 41.
  • This DC-DC converter module 52 constitutes a step-down DC-DC converter, and as shown in FIG. 5, the input current Ia is a discontinuous wave in which a rectangular pulse current flows when the switching element Q1 is turned on.
  • the output current Ib flowing through the smoothing coil L1 has a continuous wave shape including ripples.
  • the waveform of each part is the same as that shown in the first embodiment.
  • the DC-DC converter module 52 shown in FIG. 4 is different from a normal step-down DC-DC converter in that inductors L2 and L3 are serially connected to a current line (input line) flowing from the input voltage source 21 to the input terminal IN. Is inserted.
  • the inductors L2 and L3 are configured by via conductors inside the magnetic substrate 30, and the inductance causes a pulse current flowing from the input voltage source 21 when the switching element Q1 is turned on. Is suppressed. Therefore, the pulse current containing a lot of high frequency components almost completely flows through the input capacitor Ca and hardly flows out to the outside. As a result, the noise problem associated with the use of the DC-DC converter module can be reduced.
  • the winding direction of the smoothing coil L1 shown in FIG. 4 is different from the winding direction (wiring direction) of the other inductors L2 to L4 by 90 degrees, that is, the magnetic fields are orthogonal to each other.
  • the magnetic coupling between the smoothing coil L1 and the other inductors L2 to L4 is reduced, no unnecessary electromotive voltage is generated in L2 to L4, and the ripple voltage generated in the input voltage and the output voltage is reduced.
  • L2 to L4 are short one-turn inductors, the magnetic flux generated by the wiring is not large and the influence on the adjacent wiring is small.
  • the magnetic flux generated by the smoothing coil L1 is the largest in the DC-DC converter module 52, it is also important that the winding direction of the smoothing coil L1 and the wiring direction of the upper surface electrode are different by 90 degrees and the magnetic fields are orthogonal to each other. is there. As a result, the flux linkage is reduced and the magnetic coupling with the upper surface electrode can be reduced.
  • FIG. 6A is an exploded perspective view of the DC-DC converter module 53 according to the third embodiment, and FIG. 6B is a front view thereof.
  • the DC-DC converter module 53 according to the third embodiment includes the metal cap 32 in addition to the DC-DC converter module 52 shown in FIG.
  • the metal cap 32 is formed by bending a metal plate, and is formed in a size that covers the upper portion of the magnetic substrate 30.
  • metal cap lead-out portions 33 protrude from the two opposing side surfaces.
  • the metal cap 32 is put on.
  • the joint portion Sa at the base of the lead portion 33 of the metal cap 32 is soldered to the ground electrode on the upper surface or side surface of the magnetic substrate 30, and the joint portion Sb at the tip is connected to the ground electrode on the lower surface or side surface of the magnetic substrate 30. Soldered.
  • the metal cap 32 acts as a shield case, and radiation noise from the DC-DC converter module 53 is suppressed. Further, since the lead portion 33 of the metal cap 32 is drawn to the lower surface of the magnetic substrate 30 and also serves as a ground electrode, the lead portion 33 serves as a ground connection electrode. For this reason, the parasitic inductance is reduced compared to the case where the via conductor for ground connection is formed in the magnetic substrate 30, and the magnetic field generated in the via conductor does not increase in the magnetic substrate. Characteristics are obtained.
  • FIG. 7 is an exploded perspective view of the DC-DC converter module 54 according to the fourth embodiment.
  • lower surface terminals 42, 43, and 44 are formed on the lower surface of the magnetic substrate 30.
  • an upper surface electrode (a pattern is not shown) is formed on the upper surface of the magnetic substrate 30.
  • a smoothing coil L1 and inductors L2 and L3 connected between the lower surface terminal and the upper surface electrode are formed inside the magnetic substrate 30.
  • a side conductor S4 connected between the lower surface terminal and the upper surface electrode is formed on the side surface of the magnetic substrate 30.
  • the smoothing coil L1 is composed of a helical conductor.
  • the inductors L2 and L3 are configured by via conductors. Others are the same as those shown in FIG.
  • the inductor L4 of FIG. 5 shown in the second embodiment is eliminated, the impedance of the output capacitor Cb with respect to the output ripple is reduced, and the rectangular wave component appearing in the ripple of the output voltage is effectively suppressed accordingly. Is done.

Abstract

Provided is a composite electronic component wherein a magnetic field generated by a coil does not easily expand to the surrounding areas and generation of radiation noise is suppressed. On a lower surface of a magnetic material substrate (30), lower surface electrodes (42, 43, 44) are formed.  On an upper surface of the magnetic material substrate (30), an upper surface electrode is formed.  In the magnetic material substrate (30), a helical smoothing coil (L1) is configured between the lower surface terminal and the upper surface electrode such that the lower surface terminal and the upper surface electrode are connected.  On the upper surface of the magnetic material substrate (30), a control IC chip (31) including a switching element, an input capacitor (Ca) and an output capacitor (Cb) are mounted.  One end of the smoothing coil (L1) is formed to expose from the upper surface of the magnetic material substrate (30) as a connecting terminal (41).  On a lower surface of the control IC chip (31), bumps for bonding are arranged, and one of the bumps is directly connected to the connecting terminal (41).

Description

複合電子部品Composite electronic components
　この発明は、主要部品のうちの平滑コイルやトランスなどの磁気素子を内蔵した積層基板上に制御用ＩＣチップを含む各種部品を搭載して構成した複合電子部品に関するものである。 The present invention relates to a composite electronic component constructed by mounting various components including a control IC chip on a laminated substrate having a built-in magnetic element such as a smooth coil and a transformer among main components.
　フェライト基板を用いた小型の電力変換装置（ＤＣ－ＤＣコンバータ）が特許文献１に開示されている。図１はこの特許文献１に示されている電力変換装置の断面図である。この図１に示すように、フェライト基板１の表面に第１導体４が形成され、裏面に第２導体５が形成され、第１導体４と第２導体５がフェライト基板１を貫通する接続導体３で接続され、第１導体４と第２導体５の表面がレジストまたは絶縁保護膜８で被覆され、トロイダル状の無端ソレノイドの薄膜インダクタが形成され、この薄膜インダクタと半導体チップ１１と積層セラミックコンデンサアレイ１４とで電力変換装置が構成されている。 A small power converter (DC-DC converter) using a ferrite substrate is disclosed in Patent Document 1. FIG. 1 is a cross-sectional view of the power converter shown in Patent Document 1. In FIG. As shown in FIG. 1, a first conductor 4 is formed on the front surface of a ferrite substrate 1, a second conductor 5 is formed on the back surface, and the first conductor 4 and the second conductor 5 pass through the ferrite substrate 1. 3, the surfaces of the first conductor 4 and the second conductor 5 are covered with a resist or an insulating protective film 8 to form a toroidal endless solenoid thin film inductor. The thin film inductor, the semiconductor chip 11, and the multilayer ceramic capacitor The array 14 constitutes a power conversion device.
特開２００４－７２８１５号公報JP 2004-72815 A
　しかし、特許文献１に記載の電力変換装置では、フェライト基板１上にコイル電極が形成され、その基板表面に半導体チップが実装され、さらに基板の側部を通る接続配線に半導体チップが接続されている。 However, in the power conversion device described in Patent Document 1, the coil electrode is formed on the ferrite substrate 1, the semiconductor chip is mounted on the surface of the substrate, and the semiconductor chip is connected to the connection wiring passing through the side portion of the substrate. Yes.
　このようにフェライト基板上にコイル電極が形成されていると、コイル電極周囲に発生する磁界が電力変換装置の周囲に広がり、電力変換装置とともに回路基板上に実装される回路部品等の特性に影響を与えてしまう。 When the coil electrode is formed on the ferrite substrate in this way, the magnetic field generated around the coil electrode spreads around the power converter, affecting the characteristics of the circuit components mounted on the circuit board together with the power converter. Will be given.
　また、ＤＣ－ＤＣコンバータの場合、入力電圧を所定の電圧に昇降圧して出力端子へ出力する際にＦＥＴによるスイッチング動作により矩形波を作成するが、このＦＥＴから出力端子までの間の配線都は、放射ノイズの発生源となる。特許文献１のような構成では、コイル電極とＦＥＴの端子とがフェライト基板の外面に露出した状態で接続されているので、この部分で上記放射ノイズが発生するという問題がある。 In the case of a DC-DC converter, when the input voltage is stepped up and down to a predetermined voltage and output to the output terminal, a rectangular wave is created by the switching operation by the FET. The wiring capital between this FET and the output terminal is , A source of radiation noise. In the configuration as disclosed in Patent Document 1, since the coil electrode and the terminal of the FET are connected in a state of being exposed on the outer surface of the ferrite substrate, there is a problem that the radiation noise is generated in this portion.
　そこで、この発明の目的は、コイルが発生する磁界が周囲に広がりにくく、また放射ノイズの発生が抑えられた複合電子部品を提供することにある。 Therefore, an object of the present invention is to provide a composite electronic component in which the magnetic field generated by the coil is difficult to spread around and the generation of radiation noise is suppressed.
　上記課題を解決するために、この発明は次のように構成する。
（１）スイッチング素子およびコイル導体を備えた複合電子部品であって、
　前記コイル導体は積層基板に形成され、前記スイッチング素子は下面に接続端子を有する制御用ＩＣチップに備えられ、前記コイル導体の巻き始めまたは巻き終わりのいずれか一方は、前記接続端子と接続され且つ前記制御用ＩＣチップの直下に設けられたものとする。
　このように、制御用ＩＣチップの直下にコイル導体の接続端が配置されることにより、制御用ＩＣチップが電界及び磁界を抑制するので、放射ノイズを削減できる。 In order to solve the above problems, the present invention is configured as follows.
(1) A composite electronic component comprising a switching element and a coil conductor,
The coil conductor is formed on a laminated substrate, the switching element is provided in a control IC chip having a connection terminal on a lower surface, and either the winding start or the winding end of the coil conductor is connected to the connection terminal and It is assumed that it is provided directly under the control IC chip.
As described above, the connection end of the coil conductor is arranged immediately below the control IC chip, so that the control IC chip suppresses an electric field and a magnetic field, so that radiation noise can be reduced.
（２）前記積層基板は磁性体から成り、前記コイル導体は、その一方端が前記接続端子として前記積層基板の外面に露出し、その他が前記積層基板の内部に形成されたものとする。
　この構造により、コイル導体の殆ど全体が磁性体内に設けられることになるので、コイルから漏れる磁界（磁束）を少なくでき、他の回路への磁界による影響を小さくすることができる。 (2) The multilayer substrate is made of a magnetic material, and the coil conductor is exposed at the outer surface of the multilayer substrate as the connection terminal and the other is formed inside the multilayer substrate.
With this structure, almost the entire coil conductor is provided in the magnetic body, so that the magnetic field (magnetic flux) leaking from the coil can be reduced and the influence of the magnetic field on other circuits can be reduced.
（３）前記コイル導体はヘリカル状を成し、当該コイル導体の巻回中心軸方向は前記積層基板の積層方向と同じであり、前記制御用ＩＣチップは、その中心が前記コイル導体のほぼ巻回中心軸を通るように前記積層基板の上面に搭載されているものとする。
　積層基板の上面でコイル導体の巻回中心軸位置（中央部）は磁束密度が小さいため、制御用ＩＣチップをその中心がコイル導体の巻回中心とほぼ一致することにより、制御用ＩＣを搭載することによるコイル導体の磁界の乱れを小さくすることができる。 (3) The coil conductor has a helical shape, the winding central axis direction of the coil conductor is the same as the lamination direction of the laminated substrate, and the center of the control IC chip is substantially wound around the coil conductor. It is assumed that it is mounted on the upper surface of the laminated substrate so as to pass through the rotation center axis.
Because the magnetic flux density is small at the coil conductor winding center position (center) on the top surface of the multilayer substrate, the control IC chip is mounted so that the center of the control IC chip substantially coincides with the coil conductor winding center. Thus, the disturbance of the magnetic field of the coil conductor can be reduced.
（４）前記制御用ＩＣチップの接続端子は前記コイル導体の一方端に直接接続された構成とする。
　このようにコイル導体の少なくとも一方端が積層基板の外面に露出して、その部分で制御用ＩＣチップと導通するので、不要な接続部が積層基板の外面に露出することがなく、放射ノイズの発生が抑えられる。 (4) A connection terminal of the control IC chip is directly connected to one end of the coil conductor.
In this way, at least one end of the coil conductor is exposed to the outer surface of the multilayer substrate and is electrically connected to the control IC chip at that portion, so unnecessary connection portions are not exposed to the outer surface of the multilayer substrate, and radiation noise is reduced. Occurrence is suppressed.
（５）前記積層基板上に前記制御用ＩＣチップ及びその他の素子が実装され、前記積層基板の上部を覆うように金属キャップが配置され、且つ当該金属キャップの引き出し部は前記積層基板の側面に接合されている構成とする。
　これにより、ＤＣ－ＤＣコンバータからの放射ノイズが抑制できる。 (5) The control IC chip and other elements are mounted on the multilayer substrate, a metal cap is disposed so as to cover an upper portion of the multilayer substrate, and a lead portion of the metal cap is provided on a side surface of the multilayer substrate. It is set as the structure joined.
Thereby, radiation noise from the DC-DC converter can be suppressed.
（６）前記金属キャップの引き出し部は、前記積層基板の下面にまで引き出されてグランド電極を兼用したものとする。
　この構成により、金属キャップの取り付け部が積層基板の下面または側面のグランド電極の代わりになるため、積層基板内に金属キャップをグランドに接続するためのビア導体を形成した場合に比べて寄生インダクタンスを小さくできる。すなわち、フェライト基板内にグランド接続用のビア導体を通すと、そのビア導体で発生した磁界が磁性体の積層基板によりさらに大きくなるため、良好な接地特性及びシールド特性が得られなくなるが、上記の構成により、この問題は生じない。 (6) The lead portion of the metal cap is drawn to the lower surface of the multilayer substrate and also serves as a ground electrode.
With this configuration, the mounting portion of the metal cap replaces the ground electrode on the lower surface or side surface of the multilayer substrate, so that the parasitic inductance is reduced compared to the case where a via conductor for connecting the metal cap to the ground is formed in the multilayer substrate. Can be small. That is, if a via conductor for ground connection is passed through a ferrite substrate, the magnetic field generated by the via conductor is further increased by the laminated substrate of the magnetic material, so that good grounding characteristics and shielding characteristics cannot be obtained. The configuration does not cause this problem.
　この発明によれば、放射ノイズが充分に抑制された小型の複合電子部品が構成できる。 According to this invention, a small composite electronic component in which radiation noise is sufficiently suppressed can be configured.
特許文献１に示されている電力変換装置の断面図である。It is sectional drawing of the power converter device shown by patent document 1. FIG. 第１の実施形態に係るＤＣ－ＤＣコンバータモジュール５１の分解斜視図である。1 is an exploded perspective view of a DC-DC converter module 51 according to a first embodiment. 第１の実施形態に係るＤＣ－ＤＣコンバータモジュール５１の回路図及び波形図である。FIG. 2 is a circuit diagram and a waveform diagram of a DC-DC converter module 51 according to a first embodiment. 第２の実施形態に係るＤＣ－ＤＣコンバータモジュール５２の分解斜視図である。FIG. 5 is an exploded perspective view of a DC-DC converter module 52 according to a second embodiment. 第２の実施形態に係るＤＣ－ＤＣコンバータモジュール５２の回路図である。FIG. 5 is a circuit diagram of a DC-DC converter module 52 according to a second embodiment. 第３の実施形態に係るＤＣ－ＤＣコンバータモジュール５３の分解斜視図である。FIG. 6 is an exploded perspective view of a DC-DC converter module 53 according to a third embodiment. 第４の実施形態に係るＤＣ－ＤＣコンバータモジュール５４の分解斜視図である。It is a disassembled perspective view of the DC-DC converter module 54 which concerns on 4th Embodiment.
《第１の実施形態》
　第１の実施形態に係る複合電子部品の一例であるＤＣ－ＤＣコンバータモジュール５１について図２・図３を参照して説明する。
　図２はＤＣ－ＤＣコンバータモジュール５１の分解斜視図、図３はその回路図及び波形図である。図２では、磁性体基板３０の内部および下面の構成を示すために透明化して表している。この描き方は以降に示す他の実施形態についても同様である。 << First Embodiment >>
A DC-DC converter module 51, which is an example of a composite electronic component according to the first embodiment, will be described with reference to FIGS.
2 is an exploded perspective view of the DC-DC converter module 51, and FIG. 3 is a circuit diagram and a waveform diagram thereof. In FIG. 2, in order to show the configuration of the inside and the bottom surface of the magnetic substrate 30, it is shown transparent. This drawing method is the same for the other embodiments described below.
　図２に示すように、磁性体基板３０の下面には下面端子４２，４３，４４が形成されている。磁性体基板３０の上面には上面電極（パターンについては不図示）が形成されている。磁性体基板３０の内部には、下面端子と上面電極との間につながる平滑コイルＬ１が構成されている。平滑コイルＬ１はヘリカル状を成している。 As shown in FIG. 2, lower surface terminals 42, 43, and 44 are formed on the lower surface of the magnetic substrate 30. On the upper surface of the magnetic substrate 30, an upper surface electrode (a pattern is not shown) is formed. Inside the magnetic substrate 30, a smoothing coil L1 connected between the lower surface terminal and the upper surface electrode is formed. The smoothing coil L1 has a helical shape.
　磁性体基板３０の上面には、スイッチング素子を含む制御用ＩＣチップ３１、入力コンデンサＣａ、及び出力コンデンサＣｂが搭載される。これらの部品は磁性体基板３０の上面電極に電気的に接続される。特に、平滑コイルＬ１の一方端は接続端子４１として、磁性体基板３０の上面に露出形成されている。また、制御用ＩＣチップ３１はＣＳＰ（Chip size package）形状であり、その下面にはフェイスダウンボンディング用のバンプ（制御用ＩＣチップ側の接続端子）が設けられていて、その１つが平滑コイルＬ１の一方端の接続端子４１に直接接続される。 A control IC chip 31 including a switching element, an input capacitor Ca, and an output capacitor Cb are mounted on the upper surface of the magnetic substrate 30. These components are electrically connected to the upper surface electrode of the magnetic substrate 30. In particular, one end of the smoothing coil L <b> 1 is exposed as the connection terminal 41 on the upper surface of the magnetic substrate 30. Further, the control IC chip 31 has a CSP (Chip size package) shape, and bumps for face down bonding (connection terminals on the control IC chip side) are provided on the lower surface thereof, one of which is a smoothing coil L1. Is directly connected to the connection terminal 41 at one end of the terminal.
　なお、平滑コイルＬ１の他方端は磁性体基板３０の内部に形成されたビア導体等により磁性体基板３０の上面又は下面に引き出されてもよい。 Note that the other end of the smoothing coil L1 may be drawn to the upper surface or the lower surface of the magnetic substrate 30 by a via conductor or the like formed in the magnetic substrate 30.
　平滑コイルＬ１の一方端の接続端子４１は制御用ＩＣチップ３１の直下に設けられている。そのため、平滑コイルＬ１が発生する磁界を制御用ＩＣチップ３１内の電極が遮蔽するので、放射ノイズが抑制される。 The connection terminal 41 at one end of the smoothing coil L <b> 1 is provided directly under the control IC chip 31. Therefore, since the electrode in the control IC chip 31 shields the magnetic field generated by the smoothing coil L1, radiation noise is suppressed.
　また、平滑コイルＬ１は接続端子４１でのみ積層基板の外面に露出して、その部分で制御用ＩＣチップと導通するので、不要な接続部が積層基板の外面に露出することがなく、放射ノイズの発生が抑えられる。 Further, since the smooth coil L1 is exposed to the outer surface of the multilayer substrate only at the connection terminal 41 and is electrically connected to the control IC chip at that portion, unnecessary connection portions are not exposed to the outer surface of the multilayer substrate, and radiation noise is generated. Occurrence is suppressed.
　また、平滑コイルＬ１の殆ど全体が磁性体内に設けられることになるので、コイルから漏れる磁界（磁束）を少なくでき、他の回路への磁界による影響を小さくすることができる。 Also, since almost the entire smoothing coil L1 is provided in the magnetic body, the magnetic field (magnetic flux) leaking from the coil can be reduced, and the influence of the magnetic field on other circuits can be reduced.
　平滑コイルＬ１はヘリカル状を成し、その巻回中心軸方向は磁性体基板３０の積層方向と同じであり、制御用ＩＣチップ３１は、その中心が平滑コイルＬ１のほぼ巻回中心軸を通るように磁性体基板３０の上面に搭載されている。そのため、制御用ＩＣを搭載することによるコイル導体の磁界の乱れを小さくすることができる。 The smoothing coil L1 has a helical shape, and the winding center axis direction is the same as the lamination direction of the magnetic substrate 30, and the center of the control IC chip 31 passes through the winding center axis of the smoothing coil L1. As described above, the magnetic substrate 30 is mounted on the upper surface. Therefore, the disturbance of the magnetic field of the coil conductor due to the mounting of the control IC can be reduced.
　上記ＤＣ－ＤＣコンバータモジュール５１は電子機器の配線基板に実装された状態で、図３（Ａ）に示すように、ＤＣ－ＤＣコンバータモジュール５１の入力端子ＩＮに入力電圧源２１が接続される。図２・図３において、入力端子ＩＮは下面端子４２、出力端子ＯＵＴは下面端子４４、グランド端子ＧＮＤは下面端子４３にそれぞれ対応している。その他の部分には同一符号を付している。 The DC-DC converter module 51 is mounted on the wiring board of the electronic device, and the input voltage source 21 is connected to the input terminal IN of the DC-DC converter module 51 as shown in FIG. 2 and 3, the input terminal IN corresponds to the lower surface terminal 42, the output terminal OUT corresponds to the lower surface terminal 44, and the ground terminal GND corresponds to the lower surface terminal 43. The other parts are denoted by the same reference numerals.
　制御用ＩＣチップ３１はスイッチング素子Ｑ１と、フライホイール素子としてのダイオードＤ１とともにそれらのスイッチング制御を行うスイッチング制御回路を備えている。制御用ＩＣチップ３１内のスイッチング制御回路はスイッチング素子Ｑ１をオン・オフする。 The control IC chip 31 includes a switching element Q1 and a diode D1 as a flywheel element, and a switching control circuit for performing switching control thereof. The switching control circuit in the control IC chip 31 turns on / off the switching element Q1.
　このＤＣ－ＤＣコンバータモジュール５１は降圧型ＤＣ－ＤＣコンバータを構成していて、図３（Ｂ）に示すとおり、入力電流Ｉａはスイッチング素子Ｑ１のオン時に矩形波状のパルス電流が流れる不連続波状になる。平滑コイルＬ１に流れる出力電流Ｉｂはリップルを含む連続波状になる。 The DC-DC converter module 51 constitutes a step-down DC-DC converter. As shown in FIG. 3B, the input current Ia is a discontinuous wave in which a rectangular pulse current flows when the switching element Q1 is turned on. Become. The output current Ib flowing through the smoothing coil L1 has a continuous wave shape including ripples.
　図３に示した例では、フライホイール素子として作用させる同期整流素子としてダイオードＤ１を用いたが、フライホイール素子としてＦＥＴを設けてもよい。また図３の例ではスイッチング素子としてＦＥＴを用いたがバイポーラトランジスタであってもよい。このことは第２の実施形態以降に示す各実施形態についても同様である。 In the example shown in FIG. 3, the diode D1 is used as a synchronous rectifying element that acts as a flywheel element, but an FET may be provided as a flywheel element. In the example of FIG. 3, an FET is used as the switching element, but a bipolar transistor may be used. The same applies to each of the embodiments shown in the second and subsequent embodiments.
　さらに、図２・図３に示した例では磁性体基板３０に非絶縁型の降圧型ＤＣ－ＤＣコンバータを構成したが、磁性体基板３０に平滑コイルＬ１に代えてトランスを構成して絶縁型のフォワード型ＤＣ－ＤＣコンバータを構成してもよい。 Further, in the example shown in FIGS. 2 and 3, a non-insulated step-down DC-DC converter is configured on the magnetic substrate 30, but a transformer is configured on the magnetic substrate 30 in place of the smoothing coil L1 to provide an insulating type. A forward type DC-DC converter may be configured.
《第２の実施形態》
　第２の実施形態に係る複合電子部品の一例であるＤＣ－ＤＣコンバータモジュール５２について図４・図５を参照して説明する。
　図４はＤＣ－ＤＣコンバータモジュール５２の分解斜視図、図５はその回路図である。 << Second Embodiment >>
A DC-DC converter module 52 as an example of a composite electronic component according to the second embodiment will be described with reference to FIGS.
4 is an exploded perspective view of the DC-DC converter module 52, and FIG. 5 is a circuit diagram thereof.
　図４に示すように、磁性体基板３０の下面には下面端子４２，４３，４４が形成されている。磁性体基板３０の上面には上面電極（パターンについては不図示）が形成されている。磁性体基板３０の内部には、下面端子と上面電極との間につながる平滑コイルＬ１、インダクタＬ２，Ｌ３，Ｌ４がそれぞれ構成されている。平滑コイルＬ１はヘリカル状を成している。インダクタＬ２，Ｌ３，Ｌ４はビア導体により構成されている。 As shown in FIG. 4, lower surface terminals 42, 43, 44 are formed on the lower surface of the magnetic substrate 30. On the upper surface of the magnetic substrate 30, an upper surface electrode (a pattern is not shown) is formed. A smoothing coil L1 and inductors L2, L3, and L4 connected between the lower surface terminal and the upper surface electrode are formed inside the magnetic substrate 30, respectively. The smoothing coil L1 has a helical shape. The inductors L2, L3, and L4 are configured by via conductors.
　磁性体基板３０の上面には、スイッチング素子を含む制御用ＩＣチップ３１、入力コンデンサＣａ、及び出力コンデンサＣｂが搭載される。これらの部品は磁性体基板３０の上面電極に電気的に接続される。特に、平滑コイルＬ１の一方端は接続端子４１として、磁性体基板３０の上面に露出形成されている。また、制御用ＩＣチップ３１はＣＳＰ形状であり、その下面にはフェイスダウンボンディング用のバンプ（制御用ＩＣチップ側の接続端子）が設けられていて、その１つが平滑コイルＬ１の一方端の接続端子４１に直接接続される。 A control IC chip 31 including a switching element, an input capacitor Ca, and an output capacitor Cb are mounted on the upper surface of the magnetic substrate 30. These components are electrically connected to the upper surface electrode of the magnetic substrate 30. In particular, one end of the smoothing coil L <b> 1 is exposed as the connection terminal 41 on the upper surface of the magnetic substrate 30. Further, the control IC chip 31 has a CSP shape, and a bump for face down bonding (connection terminal on the control IC chip side) is provided on the lower surface, one of which is connected to one end of the smoothing coil L1. Directly connected to the terminal 41.
　このＤＣ－ＤＣコンバータモジュール５２は降圧型ＤＣ－ＤＣコンバータを構成していて、図５に示すとおり、入力電流Ｉａはスイッチング素子Ｑ１のオン時に矩形波状のパルス電流が流れる不連続波状になる。平滑コイルＬ１に流れる出力電流Ｉｂはリップルを含む連続波状になる。各部の波形は、第１の実施形態に示したものと同様である。 This DC-DC converter module 52 constitutes a step-down DC-DC converter, and as shown in FIG. 5, the input current Ia is a discontinuous wave in which a rectangular pulse current flows when the switching element Q1 is turned on. The output current Ib flowing through the smoothing coil L1 has a continuous wave shape including ripples. The waveform of each part is the same as that shown in the first embodiment.
　図４に示したＤＣ－ＤＣコンバータモジュール５２が通常の降圧型ＤＣ－ＤＣコンバータと異なるのは、入力電圧源２１から入力端子ＩＮに流れる電流ライン（入力ライン）に対して直列にインダクタＬ２，Ｌ３が挿入されていることである。このインダクタＬ２，Ｌ３は図４に示したとおり、磁性体基板３０の内部のビア導体によって構成されたものであり、そのインダクタンスによって、スイッチング素子Ｑ１のオン時に入力電圧源２１から流れ込むパルス電流が効果的に抑制される。そのため、高周波成分を多く含むパルス電流は、ほぼ完全に入力コンデンサＣａを流れ、外部には殆ど流出しない。これにより、ＤＣ－ＤＣコンバータモジュールを使用することに伴うノイズの問題を小さくできる。 The DC-DC converter module 52 shown in FIG. 4 is different from a normal step-down DC-DC converter in that inductors L2 and L3 are serially connected to a current line (input line) flowing from the input voltage source 21 to the input terminal IN. Is inserted. As shown in FIG. 4, the inductors L2 and L3 are configured by via conductors inside the magnetic substrate 30, and the inductance causes a pulse current flowing from the input voltage source 21 when the switching element Q1 is turned on. Is suppressed. Therefore, the pulse current containing a lot of high frequency components almost completely flows through the input capacitor Ca and hardly flows out to the outside. As a result, the noise problem associated with the use of the DC-DC converter module can be reduced.
　また、図４に示した平滑コイルＬ１の巻き方向と、他のインダクタＬ２～Ｌ４の巻き方向（配線方向）が９０度異なっていること、すなわち互いの磁界が直交している。その構造により、平滑コイルＬ１と他のインダクタＬ２～Ｌ４との磁気結合が小さくなり、Ｌ２～Ｌ４に不要な起電圧が発生せず、入力電圧と出力電圧に生じるリップル電圧が小さなものとなる。また、Ｌ２～Ｌ４は短い１ターンのインダクタであるので、その配線が作る磁束は大きくはなく、隣接配線への影響は小さい。 Also, the winding direction of the smoothing coil L1 shown in FIG. 4 is different from the winding direction (wiring direction) of the other inductors L2 to L4 by 90 degrees, that is, the magnetic fields are orthogonal to each other. With this structure, the magnetic coupling between the smoothing coil L1 and the other inductors L2 to L4 is reduced, no unnecessary electromotive voltage is generated in L2 to L4, and the ripple voltage generated in the input voltage and the output voltage is reduced. Further, since L2 to L4 are short one-turn inductors, the magnetic flux generated by the wiring is not large and the influence on the adjacent wiring is small.
　ＤＣ－ＤＣコンバータモジュール５２内で平滑コイルＬ１によって生じる磁束が最も大きいので、平滑コイルＬ１の巻き方向と上面電極の配線方向とが９０度異なっていて互いの磁界が直交していることも重要である。そのことにより、磁束の鎖交が少なくなり、上面電極との磁気結合も小さくすることができる。 Since the magnetic flux generated by the smoothing coil L1 is the largest in the DC-DC converter module 52, it is also important that the winding direction of the smoothing coil L1 and the wiring direction of the upper surface electrode are different by 90 degrees and the magnetic fields are orthogonal to each other. is there. As a result, the flux linkage is reduced and the magnetic coupling with the upper surface electrode can be reduced.
《第３の実施形態》
　第３の実施形態に係る複合電子部品の一例であるＤＣ－ＤＣコンバータモジュールについて図６を参照して説明する。
　図６（Ａ）は第３の実施形態に係るＤＣ－ＤＣコンバータモジュール５３の分解斜視図、図６（Ｂ）はその正面図である。この第３の実施形態に係るＤＣ－ＤＣコンバータモジュール５３は、図４に示したＤＣ－ＤＣコンバータモジュール５２に金属キャップ３２を備えたものである。 << Third Embodiment >>
A DC-DC converter module, which is an example of a composite electronic component according to a third embodiment, will be described with reference to FIG.
6A is an exploded perspective view of the DC-DC converter module 53 according to the third embodiment, and FIG. 6B is a front view thereof. The DC-DC converter module 53 according to the third embodiment includes the metal cap 32 in addition to the DC-DC converter module 52 shown in FIG.
　図６（Ａ）において、金属キャップ３２は金属板を折り曲げ加工したものであり、磁性体基板３０の上部を覆うサイズに形成されている。また、その２つの対向する側面に金属キャップの引き出し部３３がそれぞれ突出している。 6A, the metal cap 32 is formed by bending a metal plate, and is formed in a size that covers the upper portion of the magnetic substrate 30. FIG. In addition, metal cap lead-out portions 33 protrude from the two opposing side surfaces.
　図６（Ａ）に示すように、磁性体基板３０の上面に制御用ＩＣチップ３１、入力コンデンサＣａ、出力コンデンサＣｂがそれぞれ搭載された後、金属キャップ３２が被せられる。金属キャップ３２の引き出し部３３の根元の接合部Ｓａは磁性体基板３０の上面または側面にあるグランド電極に半田付けされ、先端の接合部Ｓｂは磁性体基板３０の下面または側面にあるグランド電極に半田付けされる。 As shown in FIG. 6A, after the control IC chip 31, the input capacitor Ca, and the output capacitor Cb are mounted on the upper surface of the magnetic substrate 30, the metal cap 32 is put on. The joint portion Sa at the base of the lead portion 33 of the metal cap 32 is soldered to the ground electrode on the upper surface or side surface of the magnetic substrate 30, and the joint portion Sb at the tip is connected to the ground electrode on the lower surface or side surface of the magnetic substrate 30. Soldered.
　このような構造により、金属キャップ３２はシールドケースとして作用し、ＤＣ－ＤＣコンバータモジュール５３からの放射ノイズが抑制される。また、金属キャップ３２の引き出し部３３は磁性体基板３０の下面にまで引き出されてグランド電極を兼用しているので、この引き出し部３３がグランド接続電極の代わりになる。そのため、磁性体基板３０内にグランド接続用ビア導体を形成した場合に比べて寄生インダクタンスが小さくなり、ビア導体で発生した磁界が磁性体基板で大きくなることもないため、良好な接地特性及びシールド特性が得られる。 With such a structure, the metal cap 32 acts as a shield case, and radiation noise from the DC-DC converter module 53 is suppressed. Further, since the lead portion 33 of the metal cap 32 is drawn to the lower surface of the magnetic substrate 30 and also serves as a ground electrode, the lead portion 33 serves as a ground connection electrode. For this reason, the parasitic inductance is reduced compared to the case where the via conductor for ground connection is formed in the magnetic substrate 30, and the magnetic field generated in the via conductor does not increase in the magnetic substrate. Characteristics are obtained.
《第４の実施形態》
　第４の実施形態に係る複合電子部品の一例である降圧型ＤＣ－ＤＣコンバータモジュールについて図７を参照して説明する。
　図７は第４の実施形態に係るＤＣ－ＤＣコンバータモジュール５４の分解斜視図である。図７に示すように、磁性体基板３０の下面には下面端子４２，４３，４４が形成されている。磁性体基板３０の上面には上面電極（パターンについては不図示）が形成されている。磁性体基板３０の内部には、下面端子と上面電極間にそれぞれつながる平滑コイルＬ１、インダクタＬ２，Ｌ３が構成されている。磁性体基板３０の側面には、下面端子と上面電極間につながる側面導体Ｓ４が形成されている。平滑コイルＬ１はヘリカル状の導体で構成されている。インダクタＬ２，Ｌ３はビア導体により構成されている。その他は図２に示したものと同様である。 << Fourth Embodiment >>
A step-down DC-DC converter module, which is an example of a composite electronic component according to a fourth embodiment, will be described with reference to FIG.
FIG. 7 is an exploded perspective view of the DC-DC converter module 54 according to the fourth embodiment. As shown in FIG. 7, lower surface terminals 42, 43, and 44 are formed on the lower surface of the magnetic substrate 30. On the upper surface of the magnetic substrate 30, an upper surface electrode (a pattern is not shown) is formed. Inside the magnetic substrate 30, a smoothing coil L1 and inductors L2 and L3 connected between the lower surface terminal and the upper surface electrode are formed. A side conductor S4 connected between the lower surface terminal and the upper surface electrode is formed on the side surface of the magnetic substrate 30. The smoothing coil L1 is composed of a helical conductor. The inductors L2 and L3 are configured by via conductors. Others are the same as those shown in FIG.
　このような構成により、第２の実施形態で示した図５のインダクタＬ４が無くなり、出力リップルに対する出力コンデンサＣｂのインピーダンスが低くなり、その分出力電圧のリップルに現れる矩形波成分が効果的に抑制される。 With such a configuration, the inductor L4 of FIG. 5 shown in the second embodiment is eliminated, the impedance of the output capacitor Cb with respect to the output ripple is reduced, and the rectangular wave component appearing in the ripple of the output voltage is effectively suppressed accordingly. Is done.
２１…入力電圧源
３０…磁性体基板
３１…制御用ＩＣチップ
３２…金属キャップ
３３…引き出し部
４１…接続端子
４２，４３，４４…下面端子
５１～５４…ＤＣ－ＤＣコンバータモジュール
Ｃａ…入力コンデンサ
Ｃｂ…出力コンデンサ
ＩＮ…入力端子
ＯＵＴ…出力端子
ＧＮＤ…グランド端子
Ｌ１…平滑コイル
Ｌ２，Ｌ３，Ｌ４…インダクタ
Ｑ１…スイッチング素子
Ｄ１…ダイオード
Ｓ４…側面導体
Ｓａ…根元の接合部
Ｓｂ…先端の接合部
Ｉａ…入力電流
Ｉｂ…出力電流 DESCRIPTION OF SYMBOLS 21 ... Input voltage source 30 ... Magnetic substrate 31 ... Control IC chip 32 ... Metal cap 33 ... Lead-out part 41 ... Connection terminal 42, 43, 44 ... Bottom terminal 51-54 ... DC-DC converter module Ca ... Input capacitor Cb ... Output capacitor IN ... Input terminal OUT ... Output terminal GND ... Ground terminal L1 ... Smooth coils L2, L3, L4 ... Inductor Q1 ... Switching element D1 ... Diode S4 ... Side conductor Sa ... Root junction Sb ... End junction Ia ... Input current Ib ... Output current

Claims (6)

  1. 　スイッチング素子およびコイル導体を備えた複合電子部品であって、
    　前記コイル導体は積層基板に形成され、前記スイッチング素子は下面に接続端子を有する制御用ＩＣチップに備えられ、前記コイル導体の巻き始めまたは巻き終わりのいずれか一方は、前記接続端子と接続され且つ前記制御用ＩＣチップの直下にあることを特徴とする複合電子部品。     A composite electronic component comprising a switching element and a coil conductor,
    The coil conductor is formed on a laminated substrate, the switching element is provided in a control IC chip having a connection terminal on a lower surface, and either the winding start or the winding end of the coil conductor is connected to the connection terminal and A composite electronic component that is directly under the control IC chip.
  2. 　前記積層基板は磁性体から成り、前記コイル導体は、その一方端が前記積層基板の外面に露出し、その他が前記積層基板の内部に形成された、請求項１に記載の複合電子部品。 The composite electronic component according to claim 1, wherein the multilayer substrate is made of a magnetic material, and one end of the coil conductor is exposed to the outer surface of the multilayer substrate and the other is formed inside the multilayer substrate.
  3. 　前記コイル導体はヘリカル状を成し、当該コイル導体の巻回中心軸方向は前記積層基板の積層方向と同じであり、前記制御用ＩＣチップは、その中心が前記コイル導体のほぼ巻回中心軸を通るように前記積層基板の上面に搭載されている、請求項１または２に記載の複合電子部品。 The coil conductor has a helical shape, and the winding central axis direction of the coil conductor is the same as the lamination direction of the multilayer substrate, and the center of the control IC chip is substantially the winding central axis of the coil conductor. The composite electronic component according to claim 1, wherein the composite electronic component is mounted on an upper surface of the multilayer substrate so as to pass through.
  4. 　前記制御用ＩＣチップの接続端子は前記コイル導体の一方端に直接接続されている、請求項１～３のいずれかに記載の複合電子部品。 4. The composite electronic component according to claim 1, wherein a connection terminal of the control IC chip is directly connected to one end of the coil conductor.
  5. 　前記積層基板上に前記制御用ＩＣチップ及びその他の素子が実装され、前記積層基板の上部を覆うように金属キャップが配置され、且つ当該金属キャップの引き出し部は前記積層基板の側面に接合されている、請求項１～４のいずれかに記載の複合電子部品。 The control IC chip and other elements are mounted on the multilayer substrate, a metal cap is disposed so as to cover an upper portion of the multilayer substrate, and a lead portion of the metal cap is bonded to a side surface of the multilayer substrate. The composite electronic component according to any one of claims 1 to 4, wherein
  6. 　前記金属キャップの引き出し部は、前記積層基板の下面にまで引き出されてグランド電極を兼用している、請求項５に記載の複合電子部品。 The composite electronic component according to claim 5, wherein the lead-out portion of the metal cap is pulled out to the lower surface of the multilayer substrate and also serves as a ground electrode.
PCT/JP2009/062862 2008-08-06 2009-07-16 Composite electronic component WO2010016367A1 (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015079932A (en) * 2013-10-18 2015-04-23 サムソン エレクトロ−メカニックス カンパニーリミテッド． Composite electronic component and board for mounting the same
WO2018110215A1 (en) * 2016-12-15 2018-06-21 株式会社村田製作所 Module component
CN111886787A (en) * 2018-03-19 2020-11-03 株式会社村田制作所 Control circuit module, connection structure of electronic components, and power conversion device
EP3770930A1 (en) 2019-07-25 2021-01-27 Würth Elektronik Eisos Gmbh & CO. KG Electronic component and method for manufacturing an electronic component
CN113366636A (en) * 2019-03-22 2021-09-07 株式会社村田制作所 Circuit module

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08148597A (en) * 1994-11-17 1996-06-07 Toshiba Corp Semiconductor module
JP2007173713A (en) * 2005-12-26 2007-07-05 Hitachi Metals Ltd Component with built-in inductor, and dc-dc converter using same
JP2007194474A (en) * 2006-01-20 2007-08-02 Hitachi Metals Ltd Ferrite laminated component and multiphase converter using it

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08148597A (en) * 1994-11-17 1996-06-07 Toshiba Corp Semiconductor module
JP2007173713A (en) * 2005-12-26 2007-07-05 Hitachi Metals Ltd Component with built-in inductor, and dc-dc converter using same
JP2007194474A (en) * 2006-01-20 2007-08-02 Hitachi Metals Ltd Ferrite laminated component and multiphase converter using it

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015079932A (en) * 2013-10-18 2015-04-23 サムソン エレクトロ−メカニックス カンパニーリミテッド． Composite electronic component and board for mounting the same
WO2018110215A1 (en) * 2016-12-15 2018-06-21 株式会社村田製作所 Module component
CN111886787A (en) * 2018-03-19 2020-11-03 株式会社村田制作所 Control circuit module, connection structure of electronic components, and power conversion device
CN113366636A (en) * 2019-03-22 2021-09-07 株式会社村田制作所 Circuit module
EP3770930A1 (en) 2019-07-25 2021-01-27 Würth Elektronik Eisos Gmbh & CO. KG Electronic component and method for manufacturing an electronic component

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