JPWO2018092606A1 - Film for sealing, cured product thereof, and electronic device - Google Patents

Abstract

(A) An epoxy resin, (B) a curing agent, (C) a curing accelerator, and (D) a sealing film containing an inorganic filler, wherein 25 of the components (A) to (C) The content of the liquid component that is liquid at ° C. is 20 to 30% by mass based on the total mass of the components (A) to (D), and the content of the component (D) is the above (A) to (D) The film for sealing which is 70-80 mass% on the basis of the total mass of a component, and whose solvent content is 0.05 mass% or less on the basis of the total mass of the film for sealing.

Description

  The present disclosure relates to a sealing film, a cured product thereof, and an electronic device. More specifically, the present disclosure relates to a sealing film that enables sealing of a semiconductor device, embedding of an electronic component disposed on a printed wiring board, a cured product thereof, and an electronic apparatus.

  In recent years, sealing films with excellent handling properties have been widely used for sealing electronic components such as semiconductor elements, capacitors, and resistance elements on a mounting substrate.

  As such a sealing film, for example, a sheet-like film formed by applying a varnish (composition) prepared by blending an epoxy resin, a curing agent, and a filler onto the film. An epoxy resin composition material has been proposed (see, for example, Patent Document 1).

JP 2012-25907 A

  As described above, the sheet-like epoxy resin composition material described in Patent Document 1 is formed by preparing various varnishes to prepare a varnish (composition) and then applying the varnish on a support. Produced.

  However, in such a production method, when the varnish-like epoxy resin composition applied on the support is dried, there is a large difference in the amount of solvent between the exposed side and the support side. It is difficult to produce a sealing film having a thickness of 5 mm.

  In addition, as described in Patent Document 1, in a sealing film obtained by laminating a plurality of sealing films produced by applying a varnish-like epoxy resin composition, a film thickness of 300 μm or more is obtained. When sealing and molding a component, a problem such as blistering may occur due to the solvent contained in the sealing film.

  Accordingly, an object of the present disclosure is to provide a sealing film that can suppress blistering during sealing molding and has good flexibility and good fluidity even when the thickness is 300 μm or more. Another object of the present invention is to provide an electronic apparatus including an electronic component or an electronic device sealed with the sealing film and the cured product thereof.

  In order to achieve the above object, one aspect of the present disclosure is a sealing film containing (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator, and (D) an inorganic filler. Of the components (A) to (C) (components (A), (B) and (C)), the content of the liquid component which is liquid at 25 ° C. is the above (A) to (D ) Component ((A) component, (B) component, (C) component and (D) component) based on the total mass of 20 to 30% by mass, and the content of the above (D) component is the above (A ) To (D) 70 to 80% by mass based on the total mass of components, and the content of the solvent is 0.05% by mass or less based on the total mass of the sealing film. provide.

  The sealing film according to one aspect of the present disclosure has good flexibility and good fluidity, and suppresses blistering during sealing molding even when the thickness is 300 μm or more. be able to. Therefore, according to the above disclosure, it is possible to provide a sealing film having a thickness of 300 μm or more capable of collectively sealing a thick package having TSV (Through-Silicon Via) or the like.

  The sealing film of the present disclosure that satisfies the above conditions is a kneaded product obtained by kneading (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator, and (D) an inorganic filler. Can be obtained by plastic working. In other words, it is possible to form a sealing film without applying a varnish containing an epoxy resin and an inorganic filler on the film, thus suppressing blistering during curing molding caused by the solvent contained in the sealing film. can do. As a result, the performance of the sealing film can be improved.

  In the sealing film, the content of the component (D) may be 70 to 78% by mass based on the total mass of the components (A) to (D).

  In the sealing film, the average particle size of the component (D) may be 0.01 to 50 μm.

  Another aspect of the present disclosure provides a cured product of the sealing film according to one aspect of the present disclosure.

  Another aspect of the present disclosure includes an electronic component or an electronic device, and a sealing unit that includes the cured product of the sealing film according to one aspect of the present disclosure that seals the electronic component or the electronic device. An electronic device is provided.

  According to the present disclosure, even when the thickness is 300 μm or more, the swelling film at the time of sealing molding can be suppressed, and a sealing film having good flexibility and good fluidity, and An electronic device including the cured product and an electronic component or an electronic device sealed with the sealing film can be provided.

  Hereinafter, a mode for carrying out the present disclosure (hereinafter referred to as “the present embodiment”) will be described in detail. Note that the present disclosure is not limited to the following embodiment.

  The sealing film of this embodiment includes (A) an epoxy resin (hereinafter also referred to as “component (A)”), (B) a curing agent (hereinafter also referred to as “component (B)”), and (C) curing. A sealing film containing an accelerator (hereinafter also referred to as (C) component) and (D) an inorganic filler (hereinafter also referred to as (D) component), wherein (A) The content of the liquid component that is liquid at 25 ° C. among the components (C) is 20 to 30% by mass based on the total mass of the components (A) to (D), and the content of the component (D) The amount is 70 to 80% by mass based on the total mass of the components (A) to (D), and the solvent content is 0.05% by mass or less based on the total mass of the sealing film. .

<(A) Epoxy resin>
(A) As an epoxy resin, if it has 2 or more glycidyl groups in 1 molecule, it can be especially used without a restriction | limiting. As the component (A), for example, bisphenol A type epoxy resin, bisphenol AP type epoxy resin, bisphenol AF type epoxy resin, bisphenol B type epoxy resin, bisphenol BP type epoxy resin, bisphenol C type epoxy resin, bisphenol E type epoxy resin Bisphenol F type epoxy resin, bisphenol G type epoxy resin, bisphenol M type epoxy resin, bisphenol S type epoxy resin, bisphenol P type epoxy resin, bisphenol PH type epoxy resin, bisphenol TMC type epoxy resin, bisphenol Z type epoxy resin, hexane Bisphenol S type epoxy resin such as diol bisphenol S diglycidyl ether, novolak phenol type epoxy resin, biphenyl type epoxy resin , Naphthalene type epoxy resins, dicyclopentadiene type epoxy resins, bixylenol type epoxy resins such as bixylenol diglycidyl ether, hydrogenated bisphenol A type epoxy resins such as hydrogenated bisphenol A glycidyl ether, and dibasic acid-modified diesters thereof Examples thereof include glycidyl ether type epoxy resins and aliphatic epoxy resins. (A) A component may be used individually by 1 type and may use 2 or more types together.

  A commercially available epoxy resin can also be used for (A) component. As a commercially available epoxy resin, for example, trade name: EXA4700 (tetrafunctional naphthalene type epoxy resin) manufactured by DIC Corporation, trade name: NC-7000 (naphthalene skeleton-containing polyfunctional solid epoxy resin) manufactured by Nippon Kayaku Co., Ltd. Naphthalene type epoxy resins such as Nippon Kayaku Co., Ltd., trade name: EPPN-502H (trisphenol epoxy resin) and other epoxidized products of the condensation products of phenols and aromatic aldehydes having phenolic hydroxyl groups (trisphenol type) Epoxy resin); product name manufactured by DIC Corporation: dicyclopentadiene aralkyl type epoxy resin such as Epicron HP-7200H (dicyclopentadiene skeleton-containing polyfunctional solid epoxy resin); product name manufactured by Nippon Kayaku Co., Ltd .: NC- 3000H (Biphenyl skeleton-containing polyfunctional solid epoxy tree Biphenyl aralkyl type epoxy resins such as DIC Co., Ltd .; trade names manufactured by DIC Corporation: Epicron N660, Epicron N690, Nippon Kayaku Co., Ltd. trade names: EOCN-104S and other novolak epoxy resins; manufactured by Nissan Chemical Industries, Ltd. Product name: Tris (2,3-epoxypropyl) isocyanurate such as TEPIC, DIC Corporation product name: Epicron 860, Epicron 900-IM, Epicron EXA-4816, Epicron EXA-4822, manufactured by Asahi Ciba Co., Ltd. Product name: Araldite AER280, Toto Kasei Co., Ltd. Product name: Epototo YD-134, Mitsubishi Chemical Corporation product name: JER834, JER872, Sumitomo Chemical Co., Ltd. Product name: ELA-134, Mitsubishi Chemical Corporation Product name: Epicoat 807, 815, 25, 827, 828, 834, 1001, 1004, 1007, 1009, trade names made by Dow Chemical Co., Ltd .: DER-330, 301, 361, trade names made by Tohto Kasei Co., Ltd .: bisphenol A type epoxy such as YD8125, YDF8170, etc. Resin; Trade name: 806 grade bisphenol F epoxy resin manufactured by Mitsubishi Chemical Corporation; Trade name: 828 grade bisphenol A epoxy resin manufactured by Mitsubishi Chemical Corporation; Trade name: Epicron HP-4032 Naphthalene-type epoxy resin such as DIC Corporation; Naphthalene-type epoxy resin such as Epiklon HP-4032; DIC Corporation product name: phenol novolac-type epoxy resin such as Epiklon N-740, Nagase ChemteX Corporation Product name: Nadekor DLC301 And aliphatic epoxy resins. These epoxy resins may be used individually by 1 type, and may use 2 or more types together.

  As the component (A), a liquid epoxy resin at 25 ° C. may be used. The liquid epoxy resin is not particularly limited as long as it is liquid at 25 ° C. Examples of liquid epoxy resins include bisphenol A, bisphenol F, biphenyl, novolac, dicyclopentadiene, polyfunctional phenol, naphthalene, aralkyl-modified, alicyclic, and alcoholic glycidyl. Examples include ether, glycidylamine-based resins, and glycidyl ester-based resins. These may be used individually by 1 type and may use 2 or more types together. Among the above, the liquid epoxy resin may be a bisphenol F type epoxy resin from the viewpoint of imparting handleability.

  In this specification, the epoxy resin that is liquid at 25 ° C. refers to an epoxy resin having a viscosity at 25 ° C. of 400 Pa · s or less as measured with an E-type viscometer or a B-type viscometer.

  The content of the component (A) may be 5 to 30% by mass based on the total mass of the components (A) to (D) from the viewpoint of imparting good handling properties to the sealing film. 5-20 mass% may be sufficient and 10-20 mass% may be sufficient.

<(B) Curing agent>
(B) The curing agent can be used without particular limitation as long as it has a functional group that reacts with two or more glycidyl groups in one molecule. Examples of the functional group that reacts with the glycidyl group include a phenolic hydroxyl group, an amine, and an acid anhydride (such as phthalic anhydride). Examples of the component (B) include phenol resins, acid anhydrides, imidazole compounds, aliphatic amines, and alicyclic amines. (B) A component may be used individually by 1 type and may use 2 or more types together.

  As the phenol resin, any known phenol resin can be used without particular limitation as long as it has two or more phenolic hydroxyl groups in one molecule. Examples of the phenolic resin include phenols such as phenol, cresol, xylenol, resorcinol, catechol, bisphenol A, and bisphenol F, or naphthols such as α-naphthol, β-naphthol, and dihydroxynaphthalene, and formaldehyde, acetaldehyde, propionaldehyde, and benzaldehyde. , Resins obtained by condensation or cocondensation with aldehydes such as salicylaldehyde under acidic catalyst, biphenyl skeleton type phenol resin, paraxylylene modified phenol resin, metaxylylene / paraxylylene modified phenol resin, melamine modified phenol resin, terpene modified phenol resin , Dicyclopentadiene modified phenolic resin, cyclopentadiene modified phenolic resin, polycyclic aromatic ring modified phenolic resin, Examples include xylylene-modified naphthol resin. A phenol resin may be used individually by 1 type, and may use 2 or more types together.

  A commercially available phenol resin can also be used for a phenol resin. Examples of commercially available phenol resins include trade names of DIC Corporation: Phenolite LF2882, Phenolite LF2822, Phenolite TD-2090, Phenolite TD-2149, Phenolite VH-4150, Phenolite VH4170, Meiwa Kasei Co., Ltd. Product names manufactured by the company: MEH7000, MEH8000H, product names manufactured by Mitsui Chemicals, Inc .: XLC-LL, XLC-4L, products manufactured by Nippon Steel & Sumikin Chemicals, Inc .: SN-100, SN-300, SN-400, Air -Product name manufactured by Water Co., Ltd .: SK Resin HE910. These may be used alone or in combination of two or more.

  As the component (B), a liquid curing agent at 25 ° C. may be used. The liquid curing agent is not particularly limited as long as it is liquid at 25 ° C. As a liquid hardening | curing agent, what has 2 or more of functional groups which react with a glycidyl group in 1 molecule is preferable, for example, a phenol resin, an acid anhydride, an imidazole compound, an aliphatic amine, and an alicyclic amine Etc. These curing agents may be used alone or in combination of two or more. As a phenol resin which shows a liquid state at 25 ° C., those containing a bisphenol skeleton are preferable, for example, bisphenols such as bisphenol A, bisphenol F, bisphenol AD, and bisphenol S; dihydroxybiphenyls such as 4,4′-dihydroxybiphenyl. Dihydroxyphenyl ethers such as bis (4-hydroxyphenyl) ether; and straight chain alkyl groups, branched alkyl groups, aryl groups, hydroxyalkyl groups, allyl groups, cyclic aliphatic groups on the aromatic ring of these phenol skeletons, etc. And a straight chain alkyl group, a branched alkyl group, an allyl group, an allyl group with a substituent, a cyclic aliphatic group, or an alkoxycarbonyl group introduced into the carbon atom at the center of these bisphenol skeletons. Polycyclic bifunctional phenols It is.

  In this specification, the liquid curing agent at 25 ° C. refers to one having a viscosity at 25 ° C. of 400 Pa · s or less measured with an E-type viscometer or a B-type viscometer.

  The content of the component (B) is 50 to 100 parts by mass with respect to 100 parts by mass of the component (A) from the viewpoint of reducing the unreacted component (A) and the unreacted component (B). It may be 55-90 mass parts, and may be 60-75 mass parts.

  The ratio of the component (A) and the component (B) is the ratio of the equivalent of the glycidyl group of the component (A) and the equivalent of the functional group that reacts with the glycidyl group of the component (B) (equivalent of the glycidyl group of the epoxy resin / The equivalent of the functional group that reacts with the glycidyl group of the curing agent) may be 0.7 to 2.0, 0.8 to 1.8, or 0.9 to 1.7. May be. When this ratio is in the above range, the unreacted component (A) or the unreacted component (B) decreases, and desired cured film properties tend to be easily obtained when the sealing film is cured.

<(C) Curing accelerator>
(C) Although it can use without a restriction | limiting especially as a hardening accelerator, An amine type or phosphorus type hardening accelerator may be sufficient. Examples of amine-based curing accelerators include imidazole compounds, aliphatic amines, aromatic amines, modified amines, and polyamide resins. Examples of the phosphorus curing accelerator include organic phosphorus compounds such as phosphine oxide, phosphonium salt, and diphosphine. Among these curing accelerators, the component (C) may be an imidazole compound because it is rich in derivatives and easily obtains a desired activation temperature.

  As the component (C), a liquid curing accelerator at 25 ° C. may be used. The liquid curing accelerator is not particularly limited as long as it is liquid at 25 ° C. Examples of the liquid curing accelerator include organic phosphorus compounds such as phosphine and phosphonium salts, DBU (1,8-diazabicyclo [5.4.0] undecene-7), DBN (1,5-diazabicyclo [4.3]. .0] nonene-5) and the like. These may be used individually by 1 type and may use 2 or more types together.

  In this specification, the liquid curing accelerator at 25 ° C. refers to one having a viscosity at 25 ° C. of 400 Pa · s or less measured with an E-type viscometer or a B-type viscometer.

  The content of the component (C) may be 0.01 to 5 parts by mass, or 0.1 to 3 parts by mass with respect to 100 parts by mass of the total mass of the components (A) and (B). It may be 0.3 to 1.5 parts by mass. When the content of the component (C) is 0.01 parts by mass or more, a sufficient curing acceleration effect is easily obtained. On the other hand, when the content of the component (C) is 5 parts by mass or less, the progress of curing during the production of the sealing film or during storage is suppressed, and the molding accompanying the cracking of the sealing film or an increase in melt viscosity There is a tendency for defects to decrease.

<Liquid component>
The sealing film of this embodiment is a liquid component which is liquid at 25 ° C. among the components (A) to (C), and is 20 to 30% by mass based on the total mass of the components (A) to (D). contains. When the content of the liquid component is 20% by mass or more, a sealing film can be obtained by plastic processing of the kneaded product of the components (A) to (D), and curing due to the solvent contained in the sealing film Swelling during molding can be suppressed. Moreover, the film for sealing which has favorable flexibility and favorable fluidity | liquidity can be obtained as content of a liquid component is 20 mass% or more. On the other hand, when the content of the liquid component is 30% by mass or less, a sealing film having a thickness of 300 μm or more can be obtained. Moreover, favorable handleability can be provided to the film for sealing because content of a liquid component exists in the said range. From the viewpoint of obtaining the above effect at a higher level, the content of the liquid component may be 20 to 28% by mass or 20 to 25% by mass.

  The liquid component may be only one component among the components (A) to (C), or may be two or more components. In the sealing film of this embodiment, it is preferable that at least the component (A) includes a liquid component, and it is more preferable that at least the component (A) and the component (B) include a liquid component. In addition, (A) component may contain the liquid epoxy resin in 25 degreeC, and the solid epoxy resin in 25 degreeC. The component (B) may contain a liquid curing agent at 25 ° C. and a solid curing agent at 25 ° C. The component (C) may contain a liquid curing accelerator at 25 ° C. and a solid curing accelerator at 25 ° C.

  When the sealing film of the present embodiment contains a liquid epoxy resin at 25 ° C., the content of the components (A) to (D) is from the viewpoint of imparting good handling properties to the sealing film. Based on the total mass, it may be 5 mass% or more, 6 mass% or more, or 10 mass% or more. On the other hand, from the viewpoint of suppressing excessive tack on the film surface, the content of the liquid epoxy resin at 25 ° C. may be 20% by mass or less based on the total mass of the components (A) to (D). It may be 18% by mass or less, or 17% by mass or less.

  When the sealing film of this embodiment contains a liquid hardening | curing agent at 25 degreeC, the content is (A)-(D) component from a viewpoint which provides favorable handleability to the sealing film. Based on the total mass, it may be 1% by mass or more, 2% by mass or more, or 3% by mass or more. On the other hand, from the viewpoint of suppressing excessive tack on the film surface, the content of the liquid curing agent at 25 ° C. may be 20% by mass or less based on the total mass of the components (A) to (D). It may be 15% by mass or less, or 13% by mass or less.

<(D) Inorganic filler>
(D) As an inorganic filler, a conventionally well-known inorganic filler can be used and it is not limited to a specific thing. Examples of the component (D) include barium sulfate, barium titanate, amorphous silica, crystalline silica, fused silica, spherical silica, talc, clay, magnesium carbonate, calcium carbonate, aluminum oxide, aluminum hydroxide, silicon nitride, An example is aluminum nitride. As component (D), it is easy to improve the dispersibility in the resin by surface modification and the like, and since it has a relatively low coefficient of thermal expansion, desired cured film characteristics can be easily obtained. It may be a kind.

  The component (D) may be subjected to surface modification. The method of surface modification is not particularly limited, but a method using a silane coupling agent may be used because the surface modification is simple and there are many types of functional groups, so that desired characteristics are easily imparted. Examples of the silane coupling agent include alkyl silane, alkoxy silane, vinyl silane, epoxy silane, amino silane, acrylic silane, methacryl silane, mercapto silane, sulfide silane, isocyanate silane, sulfur silane, styryl silane, alkyl chloro silane, and the like.

  Examples of the silane coupling agent include methyltrimethoxysilane, dimethyldimethoxysilane, trimethylmethoxysilane, methyltriethoxysilane, methyltriphenoxysilane, ethyltrimethoxysilane, n-propyltrimethoxysilane, diisopropyldimethoxysilane, isobutyltrimethyl. Methoxysilane, diisobutyldimethoxysilane, isobutyltriethoxysilane, n-hexyltrimethoxysilane, n-hexyltriethoxysilane, cyclohexylmethyldimethoxysilane, n-octyltriethoxysilane, n-dodecylmethoxysilane, phenyltrimethoxysilane, diphenyl Dimethoxysilane, triphenylsilanol, methyltrichlorosilane, dimethyldichlorosilane, trimethylchlorosilane, n Octyldimethylchlorosilane, tetraethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3- (2-aminoethyl) aminopropyltrimethoxysilane, 3- (2-aminoethyl) aminopropylmethyldimethoxy Silane, 3-phenylaminopropyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropyltriethoxysilane, 3-glycidoxypropylmethyldiethoxy Silane, bis (3- (triethoxysilyl) propyl) disulfide, bis (3- (triethoxysilyl) propyl) tetrasulfide, vinyltriacetoxysilane, vinyltrimethoxysilane, vinyltriethoxy Silane, vinyltriisopropoxysilane, allyltrimethoxysilane, diallyldimethylsilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltriethoxysilane, 3-mercaptopropyltrimethoxy Examples include silane, 3-mercaptopropylmethyldimethoxysilane, 3-mercaptopropyltriethoxysilane, N- (1,3-dimethylbutylidene) -3-aminopropyltriethoxysilane, and aminosilane. These may be used alone or in combination of two or more.

  (D) Content of a component is 70-80 mass% on the basis of the total mass of (A)-(D) component from a viewpoint of obtaining the favorable handleability (flexibility etc.) as a film, 70-78 mass% may be sufficient.

  (D) 0.01-50 micrometers may be sufficient as the average particle diameter of a component, 0.1-25 micrometers may be sufficient, and 0.3-10 micrometers may be sufficient. When the average particle diameter is 0.01 μm or more, the aggregation of the inorganic filler is suppressed, and the inorganic filler tends to be easily dispersed. When the average particle size is 50 μm or less, there is a tendency that a good appearance can be obtained in printing by laser marking on the package surface after molding the semiconductor package. The average particle diameter is a particle diameter at a point corresponding to a volume of 50% when a cumulative frequency distribution curve based on the particle diameter is obtained with the total volume of the particles being 100%, and a particle size distribution measuring apparatus using a laser diffraction scattering method. Etc. can be measured.

  Other additives can be used for the sealing film of the present embodiment as long as the effects of the present disclosure are not impaired. Specific examples of such additives include elastomers, pigments, dyes, mold release agents, antioxidants, surface tension modifiers, and the like.

  The sealing film of the present disclosure can be manufactured, for example, as follows. The components (A) to (D) described above are melt-kneaded. The melt kneading method is not particularly limited, and examples thereof include a melt kneading method using a known kneader such as a mixing roll, a pressure kneader, and an extruder.

  The kneading conditions are not particularly limited as long as the temperature is equal to or higher than the softening point of each component described above. For example, considering the thermosetting property of the epoxy resin, preferably 30 to 130 ° C. Preferably, it is 60-110 degreeC, and time is 1 to 30 minutes, for example, Preferably, it is 5 to 15 minutes.

  The kneaded material prepared by the kneading method described above can be processed into a sealing film, for example, as follows. It can be processed by rolling, extruding, and pressing so as to have a desired thickness with a roll machine such as a biaxial roll or a calender roll, an extruder, or a press. The sealing film prepared in this way preferably retains its shape at room temperature from the viewpoints of handling properties and moldability.

  The processing temperature of the sealing film is not particularly limited as long as it is equal to or higher than the softening point of each component described above, but considering the thermosetting property and workability of the epoxy resin, for example, 30 to 150 ° C., preferably, 50-140 degreeC, More preferably, it is 60-120 degreeC.

  The thickness of the film for sealing is 100-1500 micrometers, for example, Preferably, it is 300-1200 micrometers. According to this embodiment, a sealing film having a thickness of 300 μm or more can be easily obtained.

  The sealing film may be formed on the support. As the support, for example, a polymer film can be used.

  Examples of the polymer film include polyolefin films such as polyethylene films, polypropylene films, and polyvinyl chloride films, polyester films such as polyethylene terephthalate films, polycarbonate films, acetylcellulose films, and tetrafluoroethylene films.

  The electronic component device according to the present embodiment includes an electronic component and a sealing portion that seals the electronic component, and the sealing portion includes the sealing film according to the present embodiment or a cured product thereof. . The electronic component device according to the present embodiment is formed by sealing an electronic component using a sealing film or a cured product thereof. Examples of the electronic component device including the electronic component include a semiconductor device including a semiconductor element. The electronic component may be an electronic component in an electronic device.

  Moreover, the electronic apparatus according to the present embodiment includes an electronic component or an electronic device, and a sealing portion that includes the cured product of the sealing film according to the present embodiment that seals the electronic component or the electronic device. Prepare.

  The manufacturing method of the electronic device according to the present embodiment obtains a sealing portion by sealing the electronic component or the electronic device with the sealing film according to the present embodiment, and curing the sealing film. A process. A sealing process is a process of sealing the electronic component or electronic device provided on the board | substrate by pressing the film for sealing under a heating, for example. The manufacturing method of the electronic device according to the present embodiment includes, for example, a step of sealing the electronic component or the electronic device with the sealing film by pressing the sealing film against the electronic component or the electronic device under heating, Curing a sealing film that seals the electronic component or electronic device to obtain a sealing portion.

  The electronic component or the electronic device can be sealed with the sealing film by a laminating method. The laminator used in the laminating method is not particularly limited, and examples thereof include roll type and balloon type laminators. Among these, a balloon type capable of vacuum pressurization can be used from the viewpoint of excellent embeddability.

  The laminating temperature is usually below the softening point when a support (such as a film-like support) is used. The laminating temperature is, for example, around the minimum melt viscosity of the sealing film. The pressure at the time of lamination varies depending on the size or density of the embedded electronic device (semiconductor element or the like), but may be 0.1 to 1.5 MPa, or 0.3 to 1.0 MPa. The laminating time is not particularly limited, but may be 20 to 600 seconds, 30 to 300 seconds, or 40 to 120 seconds.

  Curing of the sealing film can be performed, for example, in the air or under an inert gas. Although hardening temperature is not specifically limited, 80-280 degreeC may be sufficient, 100-240 degreeC may be sufficient, and 120-200 degreeC may be sufficient. If the curing temperature is 80 ° C. or higher, the curing of the sealing film proceeds sufficiently, and the occurrence of defects can be easily suppressed. If the curing temperature is 280 ° C. or lower, the occurrence of heat damage to other materials can be suppressed. The curing time is not particularly limited, but may be 30 to 600 minutes, 45 to 300 minutes, or 60 to 240 minutes. If the curing time is within these ranges, curing of the sealing film proceeds sufficiently, and good production efficiency is obtained. A plurality of curing conditions may be combined.

  The preferred embodiments of the sealing film and the electronic device according to the present disclosure have been described above. The present disclosure is not necessarily limited to the above-described embodiment, and may be modified as appropriate without departing from the spirit of the present disclosure. As an electronic component other than a semiconductor element, for example, the sealing film according to the present disclosure can be applied to wiring board material applications.

  Hereinafter, the present disclosure will be described in more detail with reference to examples. However, the present disclosure is not limited to these examples.

The following components were prepared to produce a sealing film.
((A) component: epoxy resin)
Epoxy resin a: Bisphenol F type epoxy resin (trade name: grade 806, manufactured by Mitsubishi Chemical Corporation, epoxy equivalent: 160, liquid at 25 ° C.)
Epoxy resin b: bisphenol A type epoxy resin (trade name, grade 828, epoxy equivalent: 185, manufactured by Mitsubishi Chemical Corporation, liquid at 25 ° C.)
Epoxy resin c: polyfunctional solid epoxy resin containing naphthalene skeleton (trade name: EXA-4750, epoxy equivalent: 182 manufactured by DIC Corporation, solid at 25 ° C.)
((B) component: curing agent)
Curing agent a: Phenol novolak (trade name: PAPS-PN2, manufactured by Asahi Organic Materials Co., Ltd., phenolic hydroxyl group equivalent: 104, solid at 25 ° C.)
Curing agent b: phenol novolak (trade name: MEH8000H, manufactured by Meiwa Kasei Co., Ltd., phenolic hydroxyl group equivalent: 140, liquid at 25 ° C.)
((C) component: curing accelerator)
Curing accelerator: Imidazole (trade name: 2PHZ-PW, manufactured by Shikoku Kasei Kogyo Co., Ltd., solid at 25 ° C.)
((D) component: inorganic filler)
Inorganic filler: Silica (trade name: SX-E2, phenylaminosilane treatment, average particle size 5.8 μm, manufactured by Admatechs Co., Ltd.)

(Examples 1-2)
Each component was blended according to the formulation shown in Table 1 (unit: mass%), and melt-kneaded at 60 to 100 ° C. for 10 minutes with a roll kneader to prepare a kneaded product.

  Next, the obtained kneaded material was formed into a film by a hot extrusion molding method, and a sealing film of Example 1 having a thickness of 500 μm and a sealing film of Example 2 having a thickness of 1000 μm were produced.

(Examples 3-6 and Comparative Examples 2-3)
Each component was blended with the formulation shown in Table 1 and Table 2 (unit: mass%), and melt-kneaded at 60 to 100 ° C. for 10 minutes with a roll kneader to prepare a kneaded product.

  Next, the obtained kneaded material was formed into a sheet shape by a flat plate pressing method to produce a sealing film having a thickness of 500 μm. However, in Comparative Example 2, the molded material flowed and the film shape could not be maintained, and a sealing film could not be produced.

(Comparative Example 1)
Each component was blended according to the formulation shown in Table 2 (unit: mass%). Methyl ethyl ketone as a solvent was added to the obtained formulation in an amount that was 15% by mass of the total mass of the composition after the addition of the solvent to prepare a varnish-like epoxy resin composition for coating. This varnish-like epoxy resin composition was coated on a support (polyethylene terephthalate film having a thickness of 38 μm) using a coating machine under the following conditions, and the film thickness was 250 μm (the thickness of the support was not included). A sealing film was prepared.
・ Coating head method: Comma ・ Coating and drying speed: 1 m / min ・ Drying conditions (temperature / furnace length): 110 ° C./3.3 m, 130 ° C./3.3 m, 140 ° C./3.3 m

Thereafter, two sealing films having a film thickness of 250 μm were laminated and bonded under the following conditions using a vacuum pressure laminator to produce a sealing film having a film thickness of 500 μm.
-Laminator device: vacuum pressurization laminator (trade name MVLP-500 manufactured by Meiki Seisakusho Co., Ltd.)
・ Lamination temperature: 90 ℃
・ Lamination pressure: 0.5 MPa
・ Evacuation time: 30 seconds ・ Lamination time: 40 seconds

<Evaluation>
(Flexibility evaluation)
The flexibility of the sealing film was evaluated by the following procedure using a bending tester. A bending tester (JIS type 1, cylindrical mandrel method) manufactured by Yoshimitsu Seiki Co., Ltd. was prepared as a tester. The sealing films of each Example and each Comparative Example were cut into 50 mm length and 50 mm width to prepare test pieces. One surface of the test piece (the surface of the support in Comparative Example 1) was brought into contact with a cylindrical mandrel having a diameter of 2 mm, the test piece was bent 135 °, and the flexibility was evaluated according to the following criteria. The evaluation results are shown in Tables 1 and 2.
A: Even when it was bent at 135 °, it did not crack and no cracks were formed.
B: Although it did not crack even if it bent 135 degrees, it cracked.
C: Cracked when bent at 135 °.

(Liquidity assessment)
The fluidity of the sealing film was evaluated by the following procedure. A rheometer (ARES G2) manufactured by TA Instruments was prepared as a testing machine. The sealing film 0.6 g of each example and each comparative example was formed into a circle having a diameter of 20 mm, and sandwiched between two Al parallel plates, and the melt viscosity was measured (measurement temperature 40 to 220 ° C., heating rate 5 ° C. / Min). The sealing film of Comparative Example 1 was measured after peeling the support. The fluidity was evaluated according to the following criteria. The evaluation results are shown in Tables 1 and 2.
A: The minimum melt viscosity is 100 Pa · s or less.
B: The minimum melt viscosity is greater than 100 Pa · s and 300 Pa · s or less.
C: The minimum melt viscosity is greater than 300 Pa · s.

(Blown evaluation)
The swelling of the sealing film was evaluated by the following procedure. The sealing films of each Example and each Comparative Example were cut into a length of 70 mm and a width of 100 mm to prepare test pieces. About the sealing film of the comparative example 1, it was set as the state which peeled the support body. The test piece was attached to a glass plate and heated in an oven at 140 ° C. for 10 minutes. The presence or absence of blistering was visually confirmed from the upper part of the sealing film and the glass surface. The evaluation results are shown in Tables 1 and 2.

(Solvent amount measurement)
The solvent content in the sealing film was calculated according to the following procedure. The sealing film of each Example and each Comparative Example was cut into a 5 cm square sample. About the sealing film of the comparative example 1, it was set as the state which peeled the support body. This sample was put in an aluminum cup whose mass was measured in advance, and the mass of the aluminum cup containing the sample was measured. Next, the sample was placed in an aluminum cup, heated in an oven at 180 ° C. for 10 minutes, and allowed to stand at room temperature for 10 minutes, and then the mass of the aluminum cup containing the sample was measured again. Next, the mass of the aluminum cup containing the sample before and after heating was subtracted from the measured value of the aluminum cup to determine the mass of the sealing film before and after heating. And, the value of weight reduction obtained by subtracting the mass of the sealing film after heating from the mass of the sealing film before heating, regardless of the presence or absence of the solvent, the mass of the solvent contained in the sealing film and did. And the ratio of the mass of the solvent with respect to the mass of the film for sealing before a heating was made into content (solvent amount) of a solvent. The results are shown in Tables 1 and 2.

Claims (5)

A sealing film containing (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator, and (D) an inorganic filler,
The content of the liquid component that is liquid at 25 ° C. among the components (A) to (C) is 20 to 30% by mass based on the total mass of the components (A) to (D),
The content of the component (D) is 70 to 80% by mass based on the total mass of the components (A) to (D),
The film for sealing whose content of a solvent is 0.05 mass% or less on the basis of the total mass of the film for sealing.   The film for sealing of Claim 1 whose content of the said (D) component is 70-78 mass% on the basis of the total mass of the said (A)-(D) component.   The film for sealing of Claim 1 or 2 whose average particle diameter of the said (D) component is 0.01-50 micrometers.   Hardened | cured material of the film for sealing as described in any one of Claims 1-3.   An electronic apparatus comprising: an electronic component or an electronic device; and a sealing unit including a cured product of the sealing film according to any one of claims 1 to 3 that seals the electronic component or the electronic device. .