JPWO2017169760A1 - Electronic devices - Google Patents

Abstract

In an electronic device in which an electrode is formed on the main surface, it is possible to reduce probe pin stepping and electrode breakage.
The electronic device 1 a is an electronic device used for electrical inspection such as a semiconductor element to which a probe pin is connected, and is configured by forming an electrode 3 on the main surface 20 of the wiring board 2. Protrusions 5 are formed on the periphery of the surface 30 of the electrode 3. The electrode 3 is formed by sequentially laminating a Cu plating layer 3 a, a Ni plating layer 3 b, and an Au plating layer 3 c, and the projections 5 a to 5 c are formed on the plating layers 3 a to 3 c to form the protrusions 5. . When the projection 5 serves as a guide for the probe pin and the probe pin is likely to contact the vicinity of the end of the electrode 3, the projection 5 is guided to the outside of the electrode 3, so that the probe pin hits the end of the electrode 3. The electrode can be prevented from being damaged.

Description

The present invention relates to an electronic device including an electrode formed on a main surface of a substrate.

  With the recent increase in the density of external terminals of semiconductor elements, development of a wiring board for a probe card capable of electrical inspection of this type of semiconductor element is underway. For example, a ceramic wiring substrate 100 described in Patent Document 1 includes a ceramic layer 101 in which a plurality of ceramic insulating layers 101a are stacked, and a resin layer 102 in which a plurality of insulating resin layers 102a are stacked, and a ceramic layer. The resin layer 102 is laminated on 101. In the resin layer 102, insulating resin layers 102a and wiring layers 103 are alternately laminated, and the wiring layers 103 positioned above and below the insulating resin layer 102a are connected by via conductors 104. In addition, the via conductor 104 formed in the lowermost insulating resin layer 102 a and the end of the internal wiring 105 exposed on the upper surface of the ceramic wiring substrate 100 are electrically connected.

  In the wiring substrate 100 mounted on such a probe card, the wiring layer 103a disposed on the surface of the insulating resin layer 102a (the surface of the insulating resin layer 102a opposite to the surface facing the ceramic layer 101) Is connected to the probe pin.

Japanese Patent Laying-Open No. 2011-108959 (see paragraphs 0027 to 0030, FIG. 1, etc.)

  However, in the structure of the wiring substrate 100, when the wiring layer 103a located on the surface of the insulating resin layer 102a is small, the probe pin may not be in contact with a predetermined position of the wiring layer 103a. For example, there is a problem that the probe pin comes into contact with a position other than the wiring layer 103a (stepping off), or the probe pin comes into contact with the end of the wiring layer 103a and the end of the wiring layer 103a is damaged. .

  The present invention has been made in view of the above problems, and in an electronic device having an electrode formed on the main surface, by forming a protrusion on the periphery of the electrode surface, the probe pin can be stepped off or the electrode can be damaged. The purpose is to reduce.

  In order to achieve the above-described object, the multilayer wiring board of the present invention is an electronic device comprising a substrate and an electrode formed on the main surface of the substrate, and a protrusion is formed on the periphery of the surface of the electrode. It is characterized by having.

  According to this configuration, the protrusion provided on the periphery of the electrode serves as a guide for contacting the probe pin, and when the probe pin is about to contact the end of the electrode, the probe pin is guided inside the protrusion. In other words, the probe pin can be prevented from coming into contact with the end portion of the electrode and causing damage to the electrode or abnormal appearance.

  Further, the protrusion may be formed so as to go around the periphery. In this case, since the projecting portion that serves as a guide for the probe pin is arranged so as to surround the periphery of the electrode, the probe pin can be more efficiently guided to the inside or outside of the electrode, and damage to the electrode can be prevented. Can do.

  The protrusion may include a first inclined surface that faces the outer periphery of the electrode and a second inclined surface that faces the inner side of the surface opposite to the first inclined surface. In this case, since the shape of the protrusion is an inclined surface, the probe pin can be guided along the inclined surface when the probe pin contacts the vicinity of the protrusion. When the probe pin is guided to the outside of the electrode along the first inclined surface, the probe pin is deviated from the electrode, so that the electrode can be prevented from being damaged. Conversely, when the probe pin is guided inside the electrode along the second inclined surface, the probe pin can be reliably brought into contact with the electrode.

  In addition, an inclination angle of the second inclined surface with respect to the surface of the electrode may be smaller than that of the first inclined surface. In this case, since the inclination angle of the second inclined surface with respect to the electrode surface is smaller than that of the first inclined surface, the probe pin is likely to be guided to the outside when it contacts the vicinity of the apex of the protrusion, so that the electrode is damaged. Can be prevented more reliably.

  The electrode may be formed of a plurality of plating layers. In this case, the projecting portion can be easily formed by adjusting the current density and additives when performing plating.

  Moreover, the peripheral part in the said electrode may be thicker than the part located inside the said peripheral part among the said electrodes. In this case, since the peripheral portion of the electrode is formed thicker than the inside, the peripheral portion of the electrode serves as a guide for the probe pin, and damage to the electrode can be prevented.

  The board is a laminated wiring board for a probe card to which a plurality of probe pins are connected, and the board is provided on a surface of the ceramic laminated section formed by laminating a plurality of ceramic layers and the ceramic laminated section. A resin portion, and the electrode may be provided on a main surface of the resin portion. In this case, it is possible to provide a probe card having high durability and high connection reliability with the mother board.

  According to the present invention, by providing a projection on the periphery of the electrode formed on the main surface of the substrate, when the probe pin comes into contact with the vicinity of the end of the electrode, the projection becomes a guide, and the probe pin By guiding to the outside or the inside, it is possible to prevent the electrode from being damaged by the probe pin hitting the end of the electrode.

It is an enlarged view of the section of the electronic device concerning a 1st embodiment of the present invention. It is the figure which expanded a part of electronic device of FIG. It is a figure which shows the manufacturing method of the wiring board of FIG. It is a figure which shows the manufacturing method of the wiring board concerning 2nd Embodiment of this invention. It is a figure which shows the manufacturing method of the wiring board concerning 2nd Embodiment of this invention. It is sectional drawing of the conventional wiring board.

<First Embodiment>
An electronic device 1a according to a first embodiment of the present invention will be described with reference to FIG. 1 and FIG. 1 is an enlarged view of a cross section of the electronic device 1a, and FIG. 2 is an enlarged view of a part of the electrodes of the electronic device 1a of FIG.

  The electronic device 1a according to this embodiment has a plurality of electrodes 3 formed on the main surface 20 of the wiring board 2, and is used by being mounted on a probe card used for electrical inspection of non-inspected objects such as semiconductor elements, for example. The As shown in FIG. 1, the electronic device 1 a includes a wiring board 2 and an electrode 3 formed on the main surface 20 of the wiring board 2. A power feeding film 4 is formed between the wiring board 2 and the electrode 3. The electronic device 1a mounted on the probe card is usually formed with a plurality of electrodes, which will be described with reference to an enlarged view of one of the electrodes.

  The wiring board 2 can be formed of various ceramics such as a low-temperature co-fired ceramic (LTCC) and a high-temperature fired ceramic (HTCC) mainly composed of a ceramic (for example, alumina) containing borosilicate glass. it can. Further, the wiring board 2 may have a multilayer structure.

  On the main surface 20 of the wiring substrate 2, the power supply film 4 is formed. This is for supplying power when performing electroplating, and Ti or Cu is formed by sputtering. Further, an electrode 3 made of a plurality of plating layers is formed on the power feeding film 4. The electrode 3 includes a Cu plating layer 3a, a Ni plating layer 3b, and an Au plating layer 3c. Each of the plating layers 3a to 3c is formed by electrolytic Cu plating, electrolytic Ni plating, or electrolytic Au plating.

  Projections 5 are formed on the surface 30 of the electrode 3 so as to make one round of the periphery. In this embodiment, the projections 5 are formed by forming the projections 5a to 5c on the plating layers 3a to 3c, respectively. As shown in FIG. 2, when viewed from a direction perpendicular to the main surface 20 of the wiring substrate 2, the protrusion 5 has a first inclined surface 6 a and a second inclined surface 6 b. The inclination angle 60b of the second inclined surface 6b with respect to the surface 30 of the electrode 3 is formed smaller than the inclination angle 60a of the first inclined surface 6a, and the first inclined surface 6a is steeper than the second inclined surface 6b. ing.

(Method for manufacturing a wiring board)
Next, a method for manufacturing the electronic device 1a will be described with reference to FIG. First, as shown in FIG. 3A, the wiring board 2 is prepared, and the power supply film 4 is formed on the main surface 20 of the wiring board 2. The power supply film 4 is formed by depositing Ti or Cu by sputtering. Thereafter, a plating resist 7 is formed on the power feeding film 4. The plating resist 7 can be formed by, for example, applying a photosensitive resin such as an epoxy resin at a predetermined position, exposing and developing. Next, the Cu plating layer 3a of the electrode 3 is formed by electrolytic Cu plating. At this time, the convex part 5a is formed in the peripheral part of Cu plating layer 3a by adjusting the conditions of plating. The conditions can be adjusted, for example, by increasing the current density or adjusting the type and ratio of additives.

  Next, as shown in FIG. 3B, electrolytic Ni plating treatment is performed on the Cu plating layer 3a to form the Ni plating layer 3b. Next, as shown in FIG. 3C, electrolytic Au plating is performed on the Ni plating layer 3b to form the Au plating layer 3c. At this time, the protrusions 5b and 5c are also formed on the Ni plating layer 3b and the Au plating layer 3c, respectively, along the protrusions 5a formed on the Cu plating layer 3a.

  Thereafter, as shown in FIG. 3D, the plating resist 7 is peeled off. Next, as shown in FIG. 3E, the region covered with the plating resist 7 of the power supply film 4, that is, the power supply film 4 exposed from the electrode 3 is removed by etching, whereby the electronic device 1a is completed. To do.

  Therefore, according to the above-described embodiment, when the probe pin is brought into contact with the electrode 3, the protruding portion 5 formed on the peripheral portion of the surface 30 of the electrode 3 serves as a guide, and the probe pin is guided to the outside of the electrode. It is possible to prevent the probe pin from hitting the end of the electrode 3 and damaging the electrode 3. It is also possible to guide the probe pin to the inside of the electrode 3 and bring the probe pin into contact with the vicinity of the center of the electrode 3.

  Further, since the protrusion 5 has the first inclined surface 6a and the second inclined surface 6b, when the probe pin is likely to come into contact with the vicinity of the end portion of the electrode 3, it is guided to the outside or the inside of the electrode 3. It can be done smoothly. Further, by forming the inclination angle 60b of the second inclined surface 6b smaller than the inclination angle 60a of the first inclined surface 6a, the probe pin is guided to the outside when the probe pin is likely to come into contact with the vicinity of the apex of the protrusion 5. This makes it easier to prevent the electrode 3 from being damaged or deformed.

  Further, by forming the electrode 3 with a plurality of plating layers, the protrusion 5 can be easily formed on the surface 30 of the electrode 3.

  Note that the height of the protrusion 5 is preferably 10% or more higher than the thickness of the flat portion of the electrode 3. If the height of the protrusion 5 is not sufficient, the effect of guiding the probe pin may not be sufficiently obtained.

Second Embodiment
An electronic device 1a according to a second embodiment of the present invention will be described with reference to FIGS. 4 and 5 are diagrams showing a method for manufacturing the electronic device 1a.

  The electronic device 1b according to this embodiment differs from the first embodiment described with reference to FIG. 1 and FIG. 2 in that no protrusion is formed on the Cu plating layer 3a and the electronic device 1a The manufacturing method is different. Since other configurations are the same as those of the electronic device 1a of the first embodiment, the description thereof is omitted by giving the same reference numerals.

(Method for manufacturing a wiring board)
A method for manufacturing the electronic device 1b according to this embodiment will be described with reference to FIGS. First, as shown in FIG. 4A, the wiring board 2 is prepared, and the power supply film 4 is formed on the main surface 20. The power supply film 4 is formed by depositing Ti or Cu by sputtering. Thereafter, a plating resist 7 is formed on the power feeding film 4. The plating resist 7 can be formed by, for example, applying a photosensitive resin such as an epoxy resin at a predetermined position, exposing and developing. Next, the Cu plating layer 3a of the electrode 3 is formed by electrolytic Cu plating. Next, as shown in FIG. 4B, electrolytic Ni plating treatment is performed on the Cu plating layer 3a to form the Ni plating layer 3b.

  Next, as shown in FIG. 4C, a Ni plating resist 8 is formed on the Ni plating layer 3b formed in FIG. 4B. The Ni plating resist 8 can also be formed by exposing and developing a photosensitive resin such as an epoxy resin. Note that the Ni plating resist 8 may be formed in a tapered shape, for example, in accordance with the shape of the protrusion 5 formed in the subsequent process.

  Next, as shown in FIG. 4D, electrolytic Ni plating is performed again on the Ni plating layer 3b formed in FIG. 4B to form the convex portion 5b. At this time, the plating conditions are adjusted so that the central portion of the convex portion 5b swells. The adjustment of the conditions includes, for example, methods such as changing the current density and adjusting the type and ratio of additives.

  Thereafter, as shown in FIG. 4 (e), after removing the Ni plating resist 8, an electrolytic Au plating process is performed as shown in FIG. 4 (f) to form an Au plating layer 3c. At this time, due to the shape of the convex portion 5b formed on the Ni plating layer 3b, the convex portion 5c is also formed on the Au plating layer 3c.

  Next, as shown in FIG. 5A, the plating resist 7 is peeled off. Next, as shown in FIG. 5B, the region covered with the plating resist 7 of the power supply film 4, that is, the power supply film 4 exposed from the electrode 3 is removed by etching, whereby the electronic device 1b is completed. To do.

  Therefore, according to the above-described embodiment, the same effect as that of the first embodiment can be obtained.

  The present invention is not limited to the above-described embodiment, and various modifications other than those described above can be made without departing from the spirit of the present invention. For example, in the above-described embodiment, when the electrolytic plating is performed on the Cu plating layer 3a or the Ni plating layer 3b, the convex portion 5a or the convex portion 5b is formed. However, for example, the Cu plating layer 3a or the Ni plating layer 3b May not form a convex part, and may form the convex part 5c only in the Au plating layer 3c.

  In the above-described embodiment, the electrode 3 is formed by a plurality of plating layers, but the electrode 3 may be formed by other than plating.

  The present invention is not limited to the above-described probe card wiring substrate, but can be applied to various electronic devices having electrodes formed on the surface.

DESCRIPTION OF SYMBOLS 1a, 1b Electronic device 2 Wiring board 3 Electrode 5 Projection part 6a 1st inclined surface 6b 2nd inclined surface

Claims (7)

In an electronic device comprising a substrate and an electrode formed on the main surface of the substrate,
An electronic device, wherein a protrusion is formed on a peripheral edge of the surface of the electrode.   The electronic device according to claim 1, wherein the protrusion is formed so as to go around the periphery.   The said protrusion part has the 1st inclined surface which goes to the outer side of the peripheral edge of the said electrode, and the 2nd inclined surface which goes to the inner side of the said surface opposite to this 1st inclined surface, It is characterized by the above-mentioned. The electronic device according to.   The electronic device according to claim 3, wherein an inclination angle of the second inclined surface with respect to the surface of the electrode is smaller than that of the first inclined surface.   The electronic device according to claim 1, wherein the electrode is formed of a plurality of plating layers.   6. The electronic device according to claim 1, wherein a peripheral edge portion of the electrode is thicker than a portion of the electrode positioned inside the peripheral edge portion. The board is a laminated wiring board for probe cards to which a plurality of probe pins are connected,
The substrate includes a ceramic laminated portion in which a plurality of ceramic layers are laminated, and a resin portion provided on a surface of the ceramic laminated portion, and the electrode is provided on a main surface of the resin portion. An electronic device according to any one of claims 1 to 6.

Images