JPWO2017081779A1 - 電子機器の冷却システム - Google Patents
電子機器の冷却システム Download PDFInfo
- Publication number
- JPWO2017081779A1 JPWO2017081779A1 JP2016546555A JP2016546555A JPWO2017081779A1 JP WO2017081779 A1 JPWO2017081779 A1 JP WO2017081779A1 JP 2016546555 A JP2016546555 A JP 2016546555A JP 2016546555 A JP2016546555 A JP 2016546555A JP WO2017081779 A1 JPWO2017081779 A1 JP WO2017081779A1
- Authority
- JP
- Japan
- Prior art keywords
- cooling
- coolant
- cooling system
- cooling tank
- tank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/206—Cooling means comprising thermal management
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B15/00—Systems controlled by a computer
- G05B15/02—Systems controlled by a computer electric
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- Computer Hardware Design (AREA)
- Automation & Control Theory (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
11、50、60 冷却槽
12 天板
13 熱交換器
15、17 流通路
19 ポンプ
21、41 漏出受け部
23、33 別の漏出受け部
22、24、34、42 蓋材
25、35 通路
31 設置面
32 床面
36 支柱
40 分散板
51、61 上部構造
52 流入管
53、63 下部構造
54 流出管
55 免震装置
56、67 フレキシブルな管
57 フレキシブルな流通路
66 分配器
Claims (6)
- 電子機器を冷却液中に浸漬して直接冷却する冷却システムであって、
冷却液が入れられた冷却槽と、
前記冷却槽から冷却液が漏出したときに該漏出した冷却液を受けるよう、前記冷却槽と床面との間に配置される漏出受け部とを含み、
前記漏出受け部が、
前記冷却槽から受ける荷重を分散させる分散板と、
該分散板上に前記冷却槽を囲むように設けられた、閉じられた側壁と、
該閉じられた側壁と前記冷却槽との間の上部開口を覆う蓋材から構成されている、
冷却システム。 - 前記冷却槽が、前記床面に固定される下部構造と、電子機器が前記冷却液中に浸漬される上部構造と、前記下部構造と前記上部構造との間に配置される免震装置とを含んでいる、請求項1に記載の冷却システム。
- 前記下部構造が、冷えた冷却液を分配する分配器を含み、前記上部構造が、前記分配された冷えた冷却液を前記冷却槽内に流入させる、複数の流入管を含み、前記複数の流入管の各々と前記分配器とが、フレキシブルな管により連結されている、請求項2に記載の冷却システム。
- 前記上部構造が、前記冷却槽内で暖められた冷却液を前記冷却槽外に流出させる、複数の流出管を含み、前記下部構造が、前記暖められた冷却液を集める集合器を含み、前記複数の流出管の各々と前記集合器とが、フレキシブルな管により連結されている、請求項2又は3に記載の冷却システム。
- 前記下部構造が、冷えた冷却液を通す入口通路を備え、前記上部構造が、前記冷えた冷却液を分配する分配器と、前記分配された冷えた冷却液を前記冷却槽内に流入させる、複数の流入管とを含み、前記入口通路と前記分配器とが、フレキシブルな管により連結されている、請求項2に記載の冷却システム。
- 前記上部構造が、前記冷却槽内で暖められた冷却液を前記冷却槽外に流出させる、複数の流出管と、前記暖められた冷却液を集める集合器とを含み、前記下部構造が、前記暖められた冷却液を通す出口通路を備え、前記集合器と前記出口通路とが、フレキシブルな管により連結されている、請求項2又は3に記載の冷却システム。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2015/081791 WO2017081779A1 (ja) | 2015-11-11 | 2015-11-11 | 電子機器の冷却システム |
Publications (2)
Publication Number | Publication Date |
---|---|
JP6127217B1 JP6127217B1 (ja) | 2017-05-10 |
JPWO2017081779A1 true JPWO2017081779A1 (ja) | 2017-11-09 |
Family
ID=58694809
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016546555A Active JP6127217B1 (ja) | 2015-11-11 | 2015-11-11 | 電子機器の冷却システム |
Country Status (5)
Country | Link |
---|---|
US (1) | US20180356866A1 (ja) |
EP (1) | EP3376338A4 (ja) |
JP (1) | JP6127217B1 (ja) |
CN (1) | CN108369442A (ja) |
WO (1) | WO2017081779A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108475090A (zh) * | 2015-11-11 | 2018-08-31 | 株式会社ExaScaler | 电子设备的冷却系统 |
AU2020459333A1 (en) * | 2020-07-20 | 2022-05-26 | Ivan Kirillov | Fast flow cooling bath for multiprocessor circuit boards |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US233234A (en) * | 1880-10-12 | grage | ||
JPS6214704Y2 (ja) * | 1978-07-19 | 1987-04-15 | ||
JPS596849U (ja) * | 1982-07-05 | 1984-01-17 | 富士電機株式会社 | 水冷式半導体変換装置 |
JPH02124415U (ja) * | 1989-03-20 | 1990-10-12 | ||
US20090178727A1 (en) * | 2008-01-14 | 2009-07-16 | Murphy Stephen A | Combination water conservation apparatus and watering bucket with method of use |
CA2731994C (en) * | 2008-08-11 | 2018-03-06 | Green Revolution Cooling, Inc. | Liquid submerged, horizontal computer server rack and systems and methods of cooling such a server rack |
US7983040B2 (en) * | 2008-10-23 | 2011-07-19 | International Business Machines Corporation | Apparatus and method for facilitating pumped immersion-cooling of an electronic subsystem |
JP2010172640A (ja) * | 2009-02-02 | 2010-08-12 | Panasonic Corp | ドラム式洗濯機 |
US10054754B2 (en) * | 2009-02-04 | 2018-08-21 | Nikon Corporation | Thermal regulation of vibration-sensitive objects with conduit circuit having liquid metal, pump, and heat exchanger |
CN201726300U (zh) * | 2010-07-12 | 2011-01-26 | 四川英杰电气有限公司 | 一种用于igbt逆变电源中防止冷却漏水的装置 |
US8619425B2 (en) * | 2011-10-26 | 2013-12-31 | International Business Machines Corporation | Multi-fluid, two-phase immersion-cooling of electronic component(s) |
JP6127416B2 (ja) * | 2012-09-07 | 2017-05-17 | 富士通株式会社 | 電子機器 |
CA2914797A1 (en) * | 2013-05-06 | 2014-11-13 | Green Revolution Cooling, Inc. | System and method of packaging computing resources for space and fire-resistance |
JP2015078745A (ja) * | 2013-10-17 | 2015-04-23 | 株式会社ケイズベルテック | 免震機能を備えた受け台 |
CN103593018A (zh) * | 2013-11-13 | 2014-02-19 | 曙光信息产业(北京)有限公司 | 用于服务器系统的电气转接装置和服务器 |
CN104284536B (zh) * | 2014-10-28 | 2017-06-06 | 深圳绿色云图科技有限公司 | 服务器机柜及具有其的机柜组和液体浸没冷却服务器系统 |
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2015
- 2015-11-11 CN CN201580084495.3A patent/CN108369442A/zh active Pending
- 2015-11-11 EP EP15908299.9A patent/EP3376338A4/en not_active Withdrawn
- 2015-11-11 WO PCT/JP2015/081791 patent/WO2017081779A1/ja active Application Filing
- 2015-11-11 JP JP2016546555A patent/JP6127217B1/ja active Active
- 2015-11-11 US US15/773,128 patent/US20180356866A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
EP3376338A4 (en) | 2018-12-05 |
US20180356866A1 (en) | 2018-12-13 |
EP3376338A1 (en) | 2018-09-19 |
CN108369442A (zh) | 2018-08-03 |
JP6127217B1 (ja) | 2017-05-10 |
WO2017081779A1 (ja) | 2017-05-18 |
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