JP6127218B1 - 電子機器の冷却システム - Google Patents
電子機器の冷却システム Download PDFInfo
- Publication number
- JP6127218B1 JP6127218B1 JP2016546556A JP2016546556A JP6127218B1 JP 6127218 B1 JP6127218 B1 JP 6127218B1 JP 2016546556 A JP2016546556 A JP 2016546556A JP 2016546556 A JP2016546556 A JP 2016546556A JP 6127218 B1 JP6127218 B1 JP 6127218B1
- Authority
- JP
- Japan
- Prior art keywords
- cooling
- coolant
- cooling system
- cooling tank
- tank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F19/00—Preventing the formation of deposits or corrosion, e.g. by using filters or scrapers
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20263—Heat dissipaters releasing heat from coolant
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2265/00—Safety or protection arrangements; Arrangements for preventing malfunction
- F28F2265/16—Safety or protection arrangements; Arrangements for preventing malfunction for preventing leakage
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2265/00—Safety or protection arrangements; Arrangements for preventing malfunction
- F28F2265/30—Safety or protection arrangements; Arrangements for preventing malfunction for preventing vibrations
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
Abstract
Description
11、50、60 冷却槽
12 天板
13 熱交換器
15、17 流通路
19 ポンプ
21、41 漏出受け部
23、33 別の漏出受け部
22、24、34、42 蓋材
25、35 通路
31 設置面
32 床面
36 支柱
40 分散板
51、61 上部構造
52 流入管
53、63 下部構造
54 流出管
55 免震装置
56、67 フレキシブルな管
57 フレキシブルな流通路
66 分配器
Claims (5)
- 電子機器を冷却液中に浸漬して直接冷却する冷却システムであって、
冷却液が入れられた冷却槽と、
前記冷却槽から冷却液が漏出したときに該漏出した冷却液を受けるよう、前記冷却槽と床面との間に配置される漏出受け部とを含み、
前記冷却槽が、
前記漏出受け部の底部を介して前記床面に固定される下部構造と、
前記電子機器が前記冷却液中に浸漬される上部構造と、
前記下部構造と前記上部構造との間に配置される免震装置と
を含んでいる、冷却システム。 - 前記下部構造が、冷えた冷却液を分配する分配器を含み、前記上部構造が、前記分配された冷えた冷却液を前記冷却槽内に流入させる、複数の流入管を含み、前記複数の流入管の各々と前記分配器とが、フレキシブルな管により連結されている、請求項1に記載の冷却システム。
- 前記上部構造が、前記冷却槽内で暖められた冷却液を前記冷却槽外に流出させる、複数の流出管を含み、前記下部構造が、前記暖められた冷却液を集める集合器を含み、前記複数の流出管の各々と前記集合器とが、フレキシブルな管により連結されている、請求項1又は2に記載の冷却システム。
- 前記下部構造が、冷えた冷却液を通す入口通路を備え、前記上部構造が、前記冷えた冷却液を分配する分配器と、前記分配された冷えた冷却液を前記冷却槽内に流入させる、複数の流入管とを含み、前記入口通路と前記分配器とが、フレキシブルな管により連結されている、請求項1に記載の冷却システム。
- 前記上部構造が、前記冷却槽内で暖められた冷却液を前記冷却槽外に流出させる、複数の流出管と、前記暖められた冷却液を集める集合器とを含み、前記下部構造が、前記暖められた冷却液を通す出口通路を備え、前記集合器と前記出口通路とが、フレキシブルな管により連結されている、請求項1又は2に記載の冷却システム。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2015/081792 WO2017081780A1 (ja) | 2015-11-11 | 2015-11-11 | 電子機器の冷却システム |
Publications (2)
Publication Number | Publication Date |
---|---|
JP6127218B1 true JP6127218B1 (ja) | 2017-05-10 |
JPWO2017081780A1 JPWO2017081780A1 (ja) | 2017-11-09 |
Family
ID=58694802
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016546556A Active JP6127218B1 (ja) | 2015-11-11 | 2015-11-11 | 電子機器の冷却システム |
Country Status (5)
Country | Link |
---|---|
US (1) | US20180363994A1 (ja) |
EP (1) | EP3376339A4 (ja) |
JP (1) | JP6127218B1 (ja) |
CN (1) | CN108475090A (ja) |
WO (1) | WO2017081780A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI690686B (zh) * | 2018-10-31 | 2020-04-11 | 英業達股份有限公司 | 冷卻裝置 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11023021B2 (en) * | 2016-04-28 | 2021-06-01 | Exascaler Inc. | Cooling system to minimize generation of bubbles inside flow passage by utilizing an auxiliary pump |
US11452238B2 (en) * | 2017-06-07 | 2022-09-20 | 3M Innovative Properties Company | Fluids for immersion cooling |
US10765033B1 (en) * | 2019-05-23 | 2020-09-01 | Microsoft Technology Licensing, Llc | Immersion cooling enclosures with insulating liners |
JP2023000067A (ja) * | 2021-06-17 | 2023-01-04 | 三菱重工業株式会社 | コンテナ型データセンタ |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5517335U (ja) * | 1978-07-19 | 1980-02-04 | ||
JPS596849U (ja) * | 1982-07-05 | 1984-01-17 | 富士電機株式会社 | 水冷式半導体変換装置 |
JPH02124415U (ja) * | 1989-03-20 | 1990-10-12 | ||
US20130105120A1 (en) * | 2011-10-26 | 2013-05-02 | International Business Machines Corporation | Multi-fluid, two-phase immersion-cooling of electronic component(s) |
JP2015078745A (ja) * | 2013-10-17 | 2015-04-23 | 株式会社ケイズベルテック | 免震機能を備えた受け台 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9803510B2 (en) * | 2011-04-18 | 2017-10-31 | Holtec International | Autonomous self-powered system for removing thermal energy from pools of liquid heated by radioactive materials, and method of the same |
EP2321849B1 (en) * | 2008-08-11 | 2022-01-12 | Green Revolution Cooling, Inc. | Liquid submerged, horizontal computer server rack and systems and methods of cooling such a server rack |
US7983040B2 (en) * | 2008-10-23 | 2011-07-19 | International Business Machines Corporation | Apparatus and method for facilitating pumped immersion-cooling of an electronic subsystem |
JP2010172640A (ja) * | 2009-02-02 | 2010-08-12 | Panasonic Corp | ドラム式洗濯機 |
US10054754B2 (en) * | 2009-02-04 | 2018-08-21 | Nikon Corporation | Thermal regulation of vibration-sensitive objects with conduit circuit having liquid metal, pump, and heat exchanger |
US8472182B2 (en) * | 2010-07-28 | 2013-06-25 | International Business Machines Corporation | Apparatus and method for facilitating dissipation of heat from a liquid-cooled electronics rack |
WO2012149057A1 (en) * | 2011-04-25 | 2012-11-01 | Holtec International, Inc. | Air-cooled heat exchanger and system and method of using the same to remove waste thermal energy from radioactive materials |
JP6127416B2 (ja) * | 2012-09-07 | 2017-05-17 | 富士通株式会社 | 電子機器 |
WO2014182724A1 (en) * | 2013-05-06 | 2014-11-13 | Green Revolution Cooling, Inc. | System and method of packaging computing resources for space and fire-resistance |
WO2015183265A1 (en) * | 2014-05-28 | 2015-12-03 | Hewlett-Packard Development Company, L.P. | Multiple tank cooling system |
US9258926B2 (en) * | 2014-06-24 | 2016-02-09 | David Lane Smith | System and method for fluid cooling of electronic devices installed in a sealed enclosure |
US20180363993A1 (en) * | 2015-11-11 | 2018-12-20 | Motoaki saito | Cooling system for electronic device |
CN108369442A (zh) * | 2015-11-11 | 2018-08-03 | 株式会社ExaScaler | 电子设备的冷却系统 |
-
2015
- 2015-11-11 CN CN201580084503.4A patent/CN108475090A/zh active Pending
- 2015-11-11 WO PCT/JP2015/081792 patent/WO2017081780A1/ja active Application Filing
- 2015-11-11 EP EP15908300.5A patent/EP3376339A4/en not_active Withdrawn
- 2015-11-11 JP JP2016546556A patent/JP6127218B1/ja active Active
- 2015-11-11 US US15/773,140 patent/US20180363994A1/en not_active Abandoned
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5517335U (ja) * | 1978-07-19 | 1980-02-04 | ||
JPS596849U (ja) * | 1982-07-05 | 1984-01-17 | 富士電機株式会社 | 水冷式半導体変換装置 |
JPH02124415U (ja) * | 1989-03-20 | 1990-10-12 | ||
US20130105120A1 (en) * | 2011-10-26 | 2013-05-02 | International Business Machines Corporation | Multi-fluid, two-phase immersion-cooling of electronic component(s) |
JP2015078745A (ja) * | 2013-10-17 | 2015-04-23 | 株式会社ケイズベルテック | 免震機能を備えた受け台 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI690686B (zh) * | 2018-10-31 | 2020-04-11 | 英業達股份有限公司 | 冷卻裝置 |
Also Published As
Publication number | Publication date |
---|---|
US20180363994A1 (en) | 2018-12-20 |
CN108475090A (zh) | 2018-08-31 |
EP3376339A1 (en) | 2018-09-19 |
JPWO2017081780A1 (ja) | 2017-11-09 |
EP3376339A4 (en) | 2018-12-05 |
WO2017081780A1 (ja) | 2017-05-18 |
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