JPWO2017073459A1 - Light emitting system - Google Patents

Abstract

  A partition member (20) partitions the space where a person stays from the outside. The space is inside a moving body (30) such as a vehicle. The board | substrate (100) is arrange | positioned at the above-mentioned space side surface among the partition members (20), and has translucency. A plurality of light emitting portions and an insulating film (150) are arranged on the above-mentioned space side surface (second surface (100b)) of the substrate (100). The light emitting portion (140) is transparent from the outside. It has a first electrode 110, an organic layer 120, and a second electrode 130. The insulating film 150 defines a plurality of light emitting portions 140. The substrate 100), a third region (106: translucent region), which is a region where the second electrode (130) and the insulating film (150) are not formed, is provided between adjacent light emitting portions (140). ing.

Description

  The present invention relates to a light emitting system.

  In recent years, development of light-emitting devices using organic EL has progressed. This light-emitting device is used as a lighting device or a display device, and has a configuration in which an organic layer is sandwiched between a first electrode and a second electrode. In general, a transparent material is used for the first electrode, and a metal material is used for the second electrode.

  Patent Document 1 describes that a predetermined condition is provided for the shape of the second electrode in order to provide light-transmitting property to a light-emitting device using organic EL.

JP 2014-154404 A

  Development of a system that emits light toward the outside by attaching a light emitting member to a partition member that partitions a space where a person stays from the outside, such as a window, has been performed. At this time, it is desired that the light emitting member does not hinder the visibility from the inside of the space to the outside.

  As a problem to be solved by the present invention, when a light emitting member is attached to a partition member that partitions a space where a person stays from the outside, the light emitting member does not hinder the visibility from the inside of the space to the outside. As an example.

The invention described in claim 1 is a light-emitting device that is disposed on a light-transmitting partition member that partitions the first space and the second space, and that has a transmissive portion and a light-emitting portion.
With
In the light emitting system, the light emission intensity for the second space is 0% or more and 10% or less with respect to the light emission intensity for the first space.

The invention according to claim 5 is a translucent partition member that partitions the first space and the second space;
A translucent substrate disposed on the surface of the partition member on the second space side;
A plurality of light emitting units disposed on the substrate;
An insulating film defining the plurality of light emitting portions;
With
The light emitting unit has a light transmitting first electrode, a light emitting layer, and a second electrode from the first space side,
In the light-emitting system, a light-transmitting region that is a region where the insulating film and the second electrode are not formed is provided between two adjacent light-emitting portions of the substrate.

The invention according to claim 9 is a translucent partition member that partitions the first space and the second space;
A plurality of light emitting portions formed on the partition member;
An insulating film defining the plurality of light emitting portions;
With
The light emitting unit has a light transmitting first electrode, a light emitting layer, and a second electrode from the first space side,
In the light-emitting system, a light-transmitting region that is a region where the insulating film and the second electrode are not formed is provided between two adjacent light-emitting portions of the partition member.

  The above-described object and other objects, features, and advantages will become more apparent from the preferred embodiments described below and the accompanying drawings.

It is sectional drawing which shows the structure of the light-emitting system which concerns on embodiment. It is sectional drawing which shows the structure of the light-emitting device which concerns on embodiment. It is the figure which expanded the light emission part of the light-emitting device. It is a top view of a light-emitting device. 1 is a cross-sectional view illustrating a configuration of a light emitting device according to Example 1. FIG. 6 is a cross-sectional view illustrating a configuration of a light emitting device according to Example 2. FIG. 6 is a cross-sectional view illustrating a configuration of a light emitting device according to Example 3. FIG. 6 is a cross-sectional view illustrating a configuration of a light emitting device according to Example 4. FIG. Each figure is an enlarged view of a region surrounded by a dotted line α in FIG. FIG. 10 is a cross-sectional view illustrating a configuration of a light emitting device according to Example 5. It is a top view of the light-emitting device shown in FIG. It is a top view which shows the modification of FIG. FIG. 10 is a cross-sectional view illustrating a configuration of a light emitting system according to Example 6. FIG. 10 is a cross-sectional view illustrating a configuration of a light emitting system according to Example 7. It is sectional drawing which shows the modification of FIG. FIG. 10 is a cross-sectional view illustrating a configuration of a light emitting system according to Example 8. 10 is a cross-sectional view illustrating a configuration of a light emitting system according to Example 9. FIG. It is a figure which shows the light emission characteristic of the light-emitting device which concerns on embodiment. It is a figure which shows the light emission characteristic of the light-emitting device which concerns on embodiment.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In all the drawings, the same reference numerals are given to the same components, and the description will be omitted as appropriate.

  FIG. 1 is a cross-sectional view illustrating a configuration of a light emitting system according to an embodiment. The light emitting system includes a light emitting device 10 and a partition member 20. The partition member 20 has translucency, and partitions two spaces (first space and second space) from each other. One of the first space and the second space is, for example, the inside of a structure or a moving body. In other words, the partition member 20 partitions, for example, a space where a person stays from the outside. The light emitting device 10 includes a substrate 100, a plurality of light emitting portions 140 (described later using FIG. 2), and an insulating film 150 (described later using FIG. 2). The light emitting unit 140 is disposed on the surface of the substrate 100 where the person stays (second surface 100b). In order from the outside, the light transmitting first electrode 110, the organic layer 120 (light emitting layer), And a second electrode 130. The insulating film 150 defines a plurality of light emitting portions 140. A third region 106 (translucent region) is provided between two adjacent light emitting units 140 in the substrate 100. The third region 106 is a region where the insulating film 150 and the second electrode 130 are not formed.

  The partition member 20 is a window of the moving body 30 for a person to move, for example, and is formed using glass or translucent resin. The moving body 30 is, for example, a car, a train, or an airplane. When the moving body 30 is an automobile, the partition member 20 is a windshield, a rear glass, or a window glass (for example, a door glass) attached to the side of the seat. When the partition member 20 is rear glass, the plurality of light emitting units 140 function as, for example, brake lamps. Further, when the partition member 20 is a windshield or a rear glass, the plurality of light emitting units 140 may be turn lamps. Alternatively, it may be a window that partitions the interior and exterior of a room such as a conference room. A light emitting system that can identify whether or not the conference room is used by turning on / off the light emitting unit 140 may be used.

  The light extraction side surface of the light emitting device 10 (for example, the first surface 100 a of the substrate 100) is fixed to the inner surface (first surface 22) of the partition member 20 via the adhesive layer 200. For this reason, the light emitted from the light emitting unit 140 of the light emitting device 10 is emitted to the outside of the moving body 30 via the partition member 20. On the other hand, as will be described later, the light emitting device 10 has optical transparency. For this reason, a person located inside the moving body 30 can visually recognize the outside of the moving body 30 through the partition member 20. The entire first surface 100a of the substrate 100 may be fixed to the first surface 22 of the partition member 20 via the adhesive layer 200, or a part of the first surface 100a (for example, two sides facing each other). May be fixed to the first surface 22 of the partition member 20. The light emitting device 10 may be attached to the partition member 20 in a direction in which light from the light emitting unit 140 is radiated into the moving body 30 via the partition member 20.

  FIG. 2 is a cross-sectional view illustrating a configuration of the light emitting device 10. FIG. 3 is an enlarged view of the light emitting unit 140 of the light emitting device 10. The light emitting device 10 according to the embodiment is a lighting device or a display device. 2 and 3 show a case where the light emitting device 10 is a lighting device. The light emitting device 10 includes a substrate 100, a plurality of light emitting units 140, and an insulating film 150. The substrate 100 is made of a light transmissive material. The plurality of light emitting units 140 are separated from each other, and all include the first electrode 110, the organic layer 120, and the second electrode 130. The first electrode 110 is a light-transmitting electrode, and the second electrode 130 is a light-shielding electrode. At least a part of the first electrode 110 and the second electrode 130 overlap. However, the second electrode 130 may be a translucent electrode. The organic layer 120 is located between the first electrode 110 and the second electrode 130. The insulating film 150 covers the edge of the first electrode 110. Further, at least a part of the insulating film 150 is not covered with the second electrode 130.

  When viewed from the direction perpendicular to the substrate 100, the light emitting device 10 includes a first region 102, a second region 104, and a third region 106 (translucent region). The first region 102 is a region overlapping with the second electrode 130. That is, the first region 102 is a region covered with the second electrode 130 when viewed from a direction perpendicular to the substrate 100. When the second electrode 130 has a light shielding property, the first region 102 is a region that does not transmit light. The second region 104 is a region including the insulating film 150 among regions between the plurality of light emitting units 140. The third region 106 is a region that does not include the insulating film 150 among regions between the plurality of light emitting units 140. And since the width | variety of the 2nd area | region 104 is narrower than the width | variety of the 3rd area | region 106, the light-emitting device 10 has sufficient light transmittance. Details will be described below.

The substrate 100 is a light-transmitting substrate such as a glass substrate or a resin substrate. The substrate 100 may have flexibility. In the case of flexibility, the thickness of the substrate 100 is, for example, not less than 10 μm and not more than 1000 μm. The substrate 100 is, for example, a polygon such as a rectangle or a circle. When the substrate 100 is a resin substrate, the substrate 100 is formed using, for example, PEN (polyethylene naphthalate), PES (polyethersulfone), PET (polyethylene terephthalate), or polyimide. When the substrate 100 is a resin substrate, an inorganic barrier film such as SiN _x or SiON is formed on at least one surface (preferably both surfaces) of the substrate 100 in order to prevent moisture from permeating the substrate 100. It is preferable.

  A light emitting unit 140 is formed on one surface of the substrate 100. The light emitting unit 140 has a configuration in which a first electrode 110, an organic layer 120 including a light emitting layer, and a second electrode 130 are stacked in this order. When the light emitting device 10 is an illumination device, the plurality of light emitting units 140 extend in a line shape. On the other hand, when the light emitting device 10 is a display device, the plurality of light emitting units 140 are arranged so as to form a matrix, or form a segment or display a predetermined shape (for example, display an icon). It may be. The plurality of light emitting units 140 are formed for each pixel.

  The first electrode 110 is a transparent electrode having optical transparency. The material of the transparent electrode is a material containing a metal, for example, a metal oxide such as ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), IWZO (Indium Tungsten Zinc Oxide), or ZnO (Zinc Oxide). The thickness of the first electrode 110 is, for example, not less than 10 nm and not more than 500 nm. The first electrode 110 is formed using, for example, a sputtering method or a vapor deposition method. The first electrode 110 may be a carbon nanotube or a conductive organic material such as PEDOT / PSS. The first electrode 110 may have a stacked structure in which a plurality of films are stacked. In the drawing, a plurality of linear first electrodes 110 are formed on a substrate 100 in parallel with each other. For this reason, the first electrode 110 is not located in the second region 104 and the third region 106.

  The organic layer 120 has a light emitting layer. The organic layer 120 has a configuration in which, for example, a hole injection layer, a light emitting layer, and an electron injection layer are stacked in this order. A hole transport layer may be formed between the hole injection layer and the light emitting layer. In addition, an electron transport layer may be formed between the light emitting layer and the electron injection layer. The organic layer 120 may be formed by a vapor deposition method. In addition, at least one layer of the organic layer 120, for example, a layer in contact with the first electrode 110, may be formed by a coating method such as an inkjet method, a printing method, or a spray method. In this case, the remaining layers of the organic layer 120 are formed by vapor deposition. Moreover, all the layers of the organic layer 120 may be formed using the apply | coating method. In addition, you may have another light emitting layer (for example, inorganic light emitting layer) instead of the organic layer 120. FIG.

  The second electrode 130 is made of, for example, a metal selected from the first group consisting of Al, Au, Ag, Pt, Mg, Sn, Zn, and In, or an alloy of a metal selected from the first group. Contains a metal layer. In this case, the second electrode 130 has a light shielding property. The thickness of the second electrode 130 is, for example, not less than 10 nm and not more than 500 nm. However, the second electrode 130 may be formed using the material exemplified as the material of the first electrode 110. The second electrode 130 is formed using, for example, a sputtering method or a vapor deposition method. In the example shown in this drawing, the light emitting device 10 has a plurality of linear second electrodes 130. The second electrode 130 is provided for each of the first electrodes 110 and is wider than the first electrode 110. For this reason, when viewed from the direction perpendicular to the substrate 100, the entire first electrode 110 is overlapped and covered by the second electrode 130 in the width direction. Further, the first electrode 110 is wider than the second electrode 130, and when viewed from a direction perpendicular to the substrate 100, the first electrode 110 may be entirely covered with the first electrode 110 in the width direction. Good.

  The edge of the first electrode 110 is covered with an insulating film 150. The insulating film 150 is made of, for example, a photosensitive resin material such as polyimide, and surrounds a portion of the first electrode 110 that becomes the light emitting portion 140. An edge in the width direction of the second electrode 130 is located on the insulating film 150. In other words, when viewed from a direction perpendicular to the substrate 100, a part of the insulating film 150 protrudes from the second electrode 130. In the example shown in this drawing, the organic layer 120 is also formed on the top and side surfaces of the insulating film 150. However, the organic layer 120 is divided between the adjacent light emitting units 140.

  As described above, the light emitting device 10 includes the first region 102, the second region 104, and the third region 106. The first region 102 is a region overlapping with the second electrode 130. The second region 104 is a region including the insulating film 150 among regions between the plurality of light emitting units 140. In the example shown in this drawing, the second region 104 is a region that overlaps with the insulating film 150 and does not overlap with the second electrode 130. The organic layer 120 is also formed in the second region 104. The third region 106 is a region that does not include the insulating film 150 among regions between the plurality of light emitting units 140. In the example shown in the drawing, the organic layer 120 is not formed in at least a part of the third region 106. The width of the second region 104 is narrower than the width of the third region 106. The width of the third region 106 may be wider or narrower than that of the first region 102. When the width of the first region 102 is 1, the width of the second region 104 is, for example, 0 or more (or more than 0 or 0.1 or more) 0.2 or less, and the width of the third region 106 is, for example, 0.3. It is 2 or less. The width of the first region 102 is, for example, 50 μm or more and 500 μm or less, the width of the second region 104 is, for example, 0 μm or more (or more than 0 μm), 100 μm or less, and the width of the third region 106 is, for example, 15 μm or more and 1000 μm or less. is there.

  FIG. 4 is a plan view of the light emitting device 10. 2 corresponds to the AA cross section of FIG. In the example shown in this figure, the first region 102, the second region 104, and the third region 106 are all linear and extend in the same direction. As shown in FIGS. 2 and 2, the second region 104, the first region 102, the second region 104, and the third region 106 are repeatedly arranged in this order.

  Next, a method for manufacturing the light emitting device 10 will be described. First, the first electrode 110 is formed on the substrate 100 by using, for example, a sputtering method. Next, the first electrode 110 is formed into a predetermined pattern using, for example, a photolithography method. Next, the insulating film 150 is formed on the edge of the first electrode 110. For example, when the insulating film 150 is formed of a photosensitive resin, the insulating film 150 is formed in a predetermined pattern through an exposure and development process. Next, the organic layer 120 and the second electrode 130 are formed in this order. When the organic layer 120 includes a layer formed by an evaporation method, this layer is formed in a predetermined pattern using, for example, a mask. The second electrode 130 is also formed in a predetermined pattern using, for example, a mask. Thereafter, the light emitting unit 140 is sealed using a sealing member (not shown).

  The adhesive layer 200 adheres the partition member 20 and the light emitting device 10. The material is not particularly limited as long as it has such a function. In addition, when the refractive index of the partition member 20 and the refractive index of the substrate 100 of the light emitting device 10 are the same, for example, when both are formed of glass, the adhesive layer 200 having the same or close refractive index as both. Is used. On the other hand, when the refractive index is different between the partition member 20 and the substrate 100 (for example, the partition member 20 is formed of plastic and the substrate 100 is formed of glass), the refractive index of the adhesive layer 200 is the same as that of the partition member 20. A numerical value between the substrates 100 is preferred. By doing in this way, it is because light emission of the light-emitting device 10 can be efficiently taken out outside through the partition member 20. Moreover, it is preferable that the light emitting device 10 and the partition member 20 are bonded without a gap. This is because if there is a gap, the light emitted from the light emitting device 10 is reflected by the partition member 20 and the reflected light is transmitted to the inside through the second region 104 and the third region 106 of the light emitting device 10.

  In the present embodiment, among the first region 102, the second region 104, and the third region 106, the third region 106 has the highest light transmittance (transmitting portion), and the first region 102 includes the light emitting unit 140. The light transmittance is the lowest. Further, the second region 104 (semi-transmissive portion) has a light transmittance lower than that of the third region 106 due to the presence of the insulating film 150, but has a light transmittance higher than that of the first region 102. . The light emission intensity of the light-emitting device 10 with respect to the second space described above (for example, a space where people stay, in the drawing, the region on the second surface 100b side) is the first space (for example, the region on the outside side). In the drawing, the light emission intensity of the light emitting device 10 with respect to the first surface 100a side) is 0% or more and 10% or less, preferably 0% or more and 1% or less, and more preferably 0% or more and 0.1% or less. This is because, in the first region 102 including the light emitting unit 140, the second electrode 130 having a light shielding property is located closer to the space where the person stays than the organic layer 120.

  In the present embodiment, the width of the second region 104 is narrower than the width of the third region 106. For this reason, in the light emitting device 10, the area occupancy of the second region 104 is lower than the area occupancy of the third region 106. Therefore, the light transmittance of the light emitting device 10 is increased. For this reason, even if the light emitting device 10 is attached to the partition member 20, a person inside the moving body 30 can visually recognize the outside of the moving body 30 through the light emitting device 10 and the partition member 20. In addition, when the second electrode 130 is formed using a light-shielding material such as a metal, the light from the light emitting unit 140 is difficult to reach a person inside the moving body 30. For this reason, the visibility from the inside of the moving body 30 to the outside does not deteriorate due to the light from the light emitting unit 140.

  The insulating film 150 is formed of a light-transmitting material, but generally the light transmittance of the light-transmitting material varies depending on the wavelength of light. For this reason, when the width of the insulating film 150 is wide, the spectral distribution of the light changes when light passes through the insulating film 150. In this case, when an object is viewed through the light emitting device 10, the color of the object looks different from the actual color. That is, the color of the object changes through the light emitting device 10. For example, when the absorption at a blue wavelength of 400 nm to 600 nm is 50% and is larger than the absorption at other wavelengths, the blue color becomes weak and yellowish when viewed through the light emitting device 10. In contrast, in the present embodiment, since the width of the second region 104 is narrower than the width of the third region 106, the above-described color change can be suppressed.

Example 1
FIG. 5 is a cross-sectional view illustrating a configuration of the light emitting device 10 according to Example 1, and corresponds to FIG. 2 in the embodiment. The light emitting device 10 according to the present example has the same configuration as the light emitting device 10 according to the embodiment except for the layout of the organic layer 120. Moreover, an example of the usage method of the light-emitting device 10 which concerns on a present Example is as having shown in embodiment.

  In the present embodiment, the organic layer 120 is formed on the entire surface of the third region 106. In other words, the organic layer 120 is continuously formed over the first region 102, the second region 104, and the third region 106. The organic layer 120 is continuously formed so as to connect the plurality of light emitting units 140.

  FIG. 18 shows the angle dependency of the light emission intensity with respect to the first surface 100a side (FIG. 18A) and the light emission intensity with respect to the second surface 100b side (FIG. 18B) in the light emitting device 10 according to this example. The result of having measured is shown. In this measurement, the perpendicular direction of the substrate 100 was 0 °, and the direction parallel to the substrate 100 was 90 °.

  As shown in FIG. 18A, on the first surface 100a side of the light emitting device 10, the angle at which the light emission intensity is strongest was 0 °. The light emission intensity decreased as the angle increased (in other words, the measurement direction moved obliquely from the front of the light emitting device 10).

  On the other hand, as shown in FIG. 18B, on the second surface 100b side of the light emitting device 10, the angle at which the light emission intensity was the weakest was 0 °. However, at any angle, the light emission intensity of the light emitting device 10 with respect to the second surface 100b side of the light emitting device 10 was 5% or less of the light emission intensity with respect to the first surface 100a side. In particular, at the front surface (0 °) of the light emitting device 10, the light emission intensity of the light emitting device 10 with respect to the second surface 100b side of the light emitting device 10 was 0.02% or less of the light emission intensity with respect to the first surface 100a side.

  FIG. 19 shows the measurement of the angle dependence of the emission spectrum on the first surface 100a side (FIG. 19A) and the second surface 100b side (FIG. 19B) in the light emitting device 10 of this example. The results are shown. The light emitting layer of the organic layer 120 contains a red light emitting material.

  Also in the present example, the light transmittance of the light emitting device 10 is increased as in the embodiment. Moreover, since the organic layer 120 is formed continuously, the cost for forming the organic layer 120 is reduced.

(Example 2)
FIG. 6 is a cross-sectional view illustrating a configuration of the light emitting device 10 according to Example 2, and corresponds to FIG. 3 in the embodiment. The light emitting device 10 according to this example has the same configuration as that of the light emitting device 10 according to the first embodiment except for the width of the second electrode 130. Moreover, an example of the usage method of the light-emitting device 10 which concerns on a present Example is as having shown in embodiment.

  In the present embodiment, the width of the second electrode 130 is narrower than the width of the first electrode 110. For this reason, when viewed from a direction perpendicular to the substrate 100, the end portion of the first electrode 110 in the width direction protrudes from the second electrode 130. In other words, a part of the second region 104 overlaps the first electrode 110.

  Also in the present example, the light transmittance of the light emitting device 10 is increased as in the embodiment.

(Example 3)
FIG. 7 is a cross-sectional view illustrating a configuration of the light emitting device 10 according to Example 3, and corresponds to FIG. 3 in the embodiment. The light emitting device 10 according to the present example has the same configuration as that of the light emitting device 10 according to the first embodiment, except that the peeling preventing unit 160 is provided. Moreover, an example of the usage method of the light-emitting device 10 which concerns on a present Example is as having shown in embodiment.

  The peeling prevention unit 160 is provided on the surface of the substrate 100 where the light emitting unit 140 is formed. The peeling prevention unit 160 is insulated from the first electrode 110 and is formed of a material having higher adhesion to the insulating film 150 than the substrate 100. The insulating film 150 is formed from the edge of the first electrode 110 to the peeling prevention unit 160. In the example shown in the figure, the peeling prevention unit 160 is made of the same material as the first electrode 110 and is physically separated from the first electrode 110 to be insulated from the first electrode 110. ing. In this case, the peeling prevention unit 160 is formed in the same process as the first electrode 110. The insulating film 150 is also formed on a region of the substrate 100 located between the peeling prevention unit 160 and the first electrode 110. The edge of the insulating film 150 is located on the peeling prevention unit 160.

  Also in the present example, the light transmittance of the light emitting device 10 is increased as in the embodiment. Further, the edge of the insulating film 150 is located on the peeling preventing portion 160. The peeling prevention unit 160 has higher adhesion to the insulating film 150 than the substrate 100. Accordingly, the insulating film 150 can be prevented from peeling off. In the case of using the substrate 100 having flexibility, it becomes more difficult to peel off.

(Example 4)
FIG. 8 is a cross-sectional view illustrating a configuration of the light emitting device 10 according to Example 4, and corresponds to FIG. 3 in the embodiment. The light emitting device 10 according to the present example has the same configuration as that of the light emitting device 10 according to Example 3, except that the conductive portion 170 is provided. Moreover, an example of the usage method of the light-emitting device 10 which concerns on a present Example is as having shown in embodiment.

  The conductive portion 170 is, for example, an auxiliary electrode for the first electrode 110 and is in contact with the first electrode 110. The conductive portion 170 is formed of a material having a lower resistance value than that of the first electrode 110, and is formed using, for example, at least one metal layer. The conductive portion 170 has a configuration in which, for example, a first metal layer such as Mo or Mo alloy, a second metal layer such as Al or Al alloy, and a third metal layer such as Mo or Mo alloy are stacked in this order. Yes. Of these three metal layers, the second metal layer is the thickest. The conductive portion 170 is covered with the insulating film 150. For this reason, the conductive part 170 is not directly connected to either the organic layer 120 or the second electrode 130.

  FIG. 9A is a first example of an enlarged view of a region surrounded by a dotted line α in FIG. In the example shown in this figure, the conductive portion 170 has a configuration in which a second layer 174 is stacked on a first layer 172. The first layer 172 is formed of a metal such as Al or Al alloy, for example, and the second layer 174 is formed of a conductive material having a higher hardness and a lower etching rate than the first layer 172, such as Mo or Mo alloy. Has been. The first layer 172 is made of a material having a lower resistance than the second layer 174. When the first layer 172 is formed of an AlNd alloy, the second layer 174 is formed of a MoNb alloy. The thickness of the first layer 172 is, for example, not less than 50 nm and not more than 1000 nm. Preferably it is 600 nm or less. The second layer 174 is thinner than the first layer 172. The thickness of the second layer 174 is, for example, 100 nm or less, preferably 60 nm or less, more preferably 30 nm or less.

  The visible light reflectance of the second layer 174 is lower than the visible light reflectance of the first layer 172. For example, for light having a wavelength of 530 nm, the reflectance of the second layer 174 is about 60%, and the reflectance of the first layer 172 is about 90%.

  The width of the first layer 172 is narrower than the width of the second layer 174. For this reason, in the width direction of the conductive portion 170, the end portion of the first layer 172 is located closer to the center of the conductive portion 170 than the end portion of the second layer 174. The distance d between the end of the first layer 172 and the end of the second layer 174 is preferably 150 nm or more, more preferably 300 nm or more.

  In addition, at least a part of the conductive portion 170 overlaps the second electrode 130. The width w of the conductive portion 170 overlapping the second electrode 130 is preferably, for example, 150 nm or more. In the example shown in this drawing, the entire conductive portion 170 overlaps the second electrode 130.

  The timing for forming the conductive portion 170 is after the first electrode 110 is formed and before the insulating film 150 is formed. The conductive portion 170 is formed as follows, for example. First, the first layer 172 and the second layer 174 are formed in this order by using a film forming method such as a sputtering method. Next, a resist pattern (not shown) is formed on the second layer 174, and the second layer 174 and the first layer 172 are etched (for example, wet etching) using the resist pattern as a mask. At this time, the etching is made isotropic. Also, under this etching condition, the etching rate of the first layer 172 is faster than the etching rate of the second layer 174. For this reason, the first layer 172 is etched faster than the second layer 174. As a result, the side surface of the first layer 172 enters the center side of the conductive portion 170 more than the side surface of the second layer 174. That is, the end portion of the first layer 172 is positioned closer to the center of the conductive portion 170 than the end portion of the second layer 174. Note that the size of the interval d is controlled by adjusting etching conditions (for example, etching time).

  Also in the present example, the light transmittance of the light emitting device 10 is increased as in the embodiment. Further, since the conductive portion 170 is formed on the first electrode 110, the apparent resistance value of the first electrode 110 can be lowered. Moreover, it is suppressed that the color of the thing when seeing an object via the light-emitting device 10 looks different from an actual color.

  Further, since the conductive portion 170 is covered with the insulating film 150, the amount of light transmitted through the insulating film 150 increases when light is reflected from the end face of the conductive portion 170. Since the light transmittance of the insulating film 150 varies depending on the wavelength of light, when the amount of light transmitted through the insulating film 150 increases, the color of the object changes when the object is viewed through the light emitting device 10. The chance of seeing is increased. On the other hand, in the present embodiment, the visible light reflectance of the second layer 174 is lower than the visible light reflectance of the first layer 172. The end portion of the first layer 172 is located closer to the center of the conductive portion 170 than the end portion of the second layer 174. Accordingly, at least part of the light incident on the end portion of the first layer 172 is blocked by the second layer 174. Thereby, the amount of light transmitted through the insulating film 150 can be reduced.

  As shown in FIG. 9B, the conductive portion 170 may have a configuration in which the first layer 172 is stacked on the second layer 174. In this case, at least a part of the light reflected by the end portion of the first layer 172 is blocked by the second layer 174 before entering the substrate 100. Thereby, the amount of light transmitted through the insulating film 150 can be reduced.

  9C, the conductive portion 170 may have a configuration in which a second layer 174, a first layer 172, and a second layer 174 are stacked in this order. In the example of FIG. 9C, the film thicknesses of the two second layers 174 may be different from each other or the same.

(Example 5)
FIG. 10 is a cross-sectional view illustrating the configuration of the light emitting device 10 according to the fifth embodiment. FIG. 11 is a plan view of the light emitting device 10 shown in FIG. However, some members are omitted in FIG. FIG. 10 corresponds to the BB cross section of FIG. The light emitting device 10 according to this example has the same configuration as that of the light emitting device 10 according to the embodiment or any of Examples 1 to 4 except that the sealing member 180 and the desiccant 190 are provided.

  In the example shown in the figure, the planar shape of the substrate 100 is, for example, a polygon such as a rectangle or a circle. The sealing member 180 has translucency and is formed using, for example, glass or resin. The sealing member 180 is a polygon or a circle similar to the substrate 100, and has a shape in which a recess is provided at the center. The edge of the sealing member 180 is fixed to the substrate 100 with an adhesive. Thereby, the space surrounded by the sealing member 180 and the substrate 100 is sealed. The plurality of light emitting units 140 are all located in a sealed space.

  The light emitting device 10 includes a first terminal 112, a first lead wire 114, a second terminal 132, and a second lead wire 134. The first terminal 112, the first lead wiring 114, the second terminal 132, and the second lead wiring 134 are all formed on the same surface of the substrate 100 as the light emitting unit 140. The first terminal 112 and the second terminal 132 are located outside the sealing member 180. The first lead wire 114 connects the first terminal 112 and the first electrode 110, and the second lead wire 134 connects the second terminal 132 and the second electrode 130. In other words, each of the first lead wiring 114 and the second lead wiring 134 extends from the inside to the outside of the sealing member 180.

  The first terminal 112, the second terminal 132, the first lead wiring 114, and the second lead wiring 134 have, for example, a layer formed of the same material as that of the first electrode 110. In addition, at least a part of at least one of the first terminal 112, the second terminal 132, the first lead wiring 114, and the second lead wiring 134 is a metal film having a lower resistance than the first electrode 110 on this layer. (For example, a film similar to the conductive portion 170) may be included. This metal film does not need to be formed on all of the first terminal 112, the second terminal 132, the first lead wiring 114, and the second lead wiring 134. Of the first terminal 112, the first lead wire 114, the second terminal 132, and the second lead wire 134, a layer formed of the same material as the first electrode 110 is formed in the same process as the first electrode 110. Yes. For this reason, the first electrode 110 is integrated with at least a part of the layer of the first terminal 112. When these have a metal film, the metal film is formed in the same process as that of the conductive portion 170, for example. In this case, the light transmittance of the first terminal 112, the first lead wire 114, the second terminal 132, and the second lead wire 134 is lower than the light transmittance of the substrate 100.

  In the example shown in the drawing, the first lead wiring 114 and the second lead wiring 134 are formed one by one for one light emitting unit 140. The plurality of first lead wires 114 are all connected to the same first terminal 112, and the plurality of second lead wires 134 are all connected to the same second terminal 132. The first terminal 112 is connected to a positive terminal of a control circuit via a conductive member such as a bonding wire or a lead terminal, and the second terminal 132 is controlled via a conductive member such as a bonding wire or a lead terminal. The negative terminal of the circuit is connected.

  The desiccant 190 is a region sealed with the sealing member 180 and does not overlap any of the light emitting portions 140 when viewed from a direction perpendicular to the substrate 100, for example, the first extraction wiring 114 and the first wiring. It is arranged in a region overlapping with at least one of the two lead wires 134.

  Specifically, the desiccant 190 contains a drying member such as CaO or BaO. The light transmittance of the desiccant 190 is lower than the light transmittance of the substrate 100. The desiccant 190 is fixed to the surface of the sealing member 180 that faces the substrate 100. In the example shown in the drawing, the desiccant 190 is disposed in each of the region overlapping the first lead wiring 114 and the region overlapping the second lead wiring 134. In other words, the desiccant 190 is disposed along two opposite sides of the rectangular substrate 100, but is disposed along the remaining two sides, that is, the remaining two sides and the light emitting unit 140. Not.

  FIG. 12 is a plan view showing a modification of FIG. In the example shown in this drawing, a part of the first terminal 112 and the second terminal 132 is located inside the sealing member 180. At least a part of the desiccant 190 overlaps at least one of the first terminal 112 and the second terminal 132.

  Also in the present example, the light transmittance of the light emitting device 10 is increased as in the embodiment. Further, when viewed from a direction perpendicular to the substrate 100, the desiccant 190 does not overlap the light emitting unit 140 and is located near the edge of the substrate 100. Therefore, as compared with the case where the desiccant 190 is provided at a position overlapping the light emitting unit 140, the desiccant 190 is less visible to the user. In particular, in the present embodiment, the desiccant 190 overlaps the first lead wiring 114 and the second lead wiring 134. The first lead wiring 114 and the second lead wiring 134 also have low light transmittance. For this reason, compared with the case where the desiccant 190 is not overlapped with the 1st extraction wiring 114 and the 2nd extraction wiring 134, the light transmittance of the light-emitting device 10 improves. In particular, when the first terminal 112 and the second terminal 132 are overlapped with the desiccant 190, the light transmittance of the light emitting device 10 is greatly improved as compared with the case where they are not overlapped.

  The luminance of the light emitting unit 140 varies depending on the temperature of the organic layer 120. When the desiccant 190 is provided at a position overlapping the organic layer 120, at least a part of the heat radiated from the light emitting unit 140 is absorbed by the desiccant 190. Therefore, the temperature of the region of the organic layer 120 that overlaps with the desiccant 190 is lower than the other regions of the organic layer 120. In this case, in-plane variation occurs in the luminance of the light emitting unit 140.

  On the other hand, in this embodiment, the desiccant 190 does not overlap the light emitting unit 140. Therefore, it is possible to suppress in-plane variation in the luminance of the light emitting unit 140.

  Further, due to the resistance of the first electrode 110 and the second electrode 130, the luminance of the region located near the first lead wiring 114 in the light emitting unit 140 and the region located near the second lead wiring 134 The brightness is higher than the brightness at the center of the light emitting unit 140. On the other hand, in the present embodiment, the desiccant 190 is provided at a position overlapping the first extraction wiring 114 and a position overlapping the second extraction wiring 134. Accordingly, the temperature of the region located near the first lead wire 114 in the organic layer 120 and the temperature of the region located near the second lead wire 134 are both the center of the light emitting unit 140 in the organic layer 120. It becomes lower than the temperature of the region located in the part. Thereby, the variation in the luminance of the light emitting unit 140 due to the resistance of the first electrode 110 and the second electrode 130 is absorbed. Accordingly, the in-plane variation in luminance of the light emitting unit 140 is reduced.

(Example 6)
FIG. 13 is a cross-sectional view illustrating a configuration of a light emitting system according to Example 6, and corresponds to FIG. 1 of the embodiment. The light emitting system according to this example is the same as the light emitting system according to the embodiment except that the light emitting device 10 is attached to the outer surface (second surface 24) of the moving body 30 in the partition member 20. It is a configuration.

  The light emitting device 10 according to this example has the configuration shown in the embodiment or any one of Examples 1 to 5. However, in the light emitting device 10, the surface opposite to the partition member 20 is a light extraction surface. In order to do this, it is necessary to make the light emitting device 10 a top emission type light emitting device, or to make the second surface 100b side of the light emitting device 10 face the partition member 20.

  In order to make the light emitting device 10 a top emission type, the material of the first electrode 110 and the material of the second electrode 130 may be switched. In other words, in this example, the second electrode 130 is formed using a light-transmitting material. On the other hand, the first electrode 110 is preferably formed using a light-shielding material such as metal.

  Also in this example, as in the embodiment, a person inside the moving body 30 can visually recognize the outside of the moving body 30 through the light emitting device 10 and the partition member 20. Further, the light from the light emitting device 10 is directly emitted to the outside of the moving body 30 without passing through the partition member 20. For this reason, compared with the embodiment, a person outside the moving body 30 can easily recognize the light from the light emitting device 10. Further, since the light emitting device 10 is attached to the outside of the moving body 30, that is, on the second surface 24 side of the partition member 20, the light emitted from the light emitting device 10 is reflected by the partition member 20 and enters the inside of the moving body 30. Can be suppressed.

(Example 7)
FIG. 14 is a cross-sectional view illustrating a configuration of a light emitting system according to Example 7, and corresponds to FIG. 1 of the embodiment. The light emitting system according to this example has the same configuration as that of the light emitting system according to the embodiment except that the light emitting device 10 is fixed to the partition member 20 using the fixing member 210. However, the light emitting device 10 may have any of the configurations of Examples 1 to 5.

  The fixing member 210 is a frame-like member, and the lower surface is fixed to the partition member 20 using the adhesive layer 200. The upper part of the fixing member 210 is bent toward the inside of the fixing member 210, and the edge of the light emitting device 10 is pressed by the bent part. However, the shape of the fixing member 210 is not limited to the example shown in this figure.

  Also in this example, as in the embodiment, a person inside the moving body 30 can visually recognize the outside of the moving body 30 through the light emitting device 10 and the partition member 20.

  Further, as shown in FIG. 15, the partition member 20 may be curved in a direction that protrudes toward the outside of the moving body 30. In such a case, it is difficult to directly fix the light emitting device 10 on the flat plate to the inner surface (first surface 22) of the partition member 20. However, when the fixing member 210 is used, the light emitting device 10 can be fixed to the first surface 22 of the partition member 20 even in such a case.

  When the curved partition member 20 and the light emitting device 10 on the flat plate are fixed by such a method, a filler may be filled in the gap between the partition member 20 and the light emitting device 10. As described above, when there is a gap, light emitted from the light emitting device 10 is reflected by the partition member 20, and the reflected light is transmitted to the inside through the second region 104 and the third region 106 of the light emitting device 10. When the refractive index of the partition member 20 and the refractive index of the substrate 100 of the light emitting device 10 are substantially the same (for example, when both are formed of glass), is the refractive index of the filling member the same as these refractive indexes? A close value is preferable. Further, when the partition member 20 and the substrate 100 have different refractive indexes (for example, the partition member 20 is formed of plastic and the substrate 100 is formed of glass), the refractive index of the filler is the refractive index of the partition member 20. A numerical value between the refractive index and the refractive index of the substrate 100 of the light emitting device 10 is preferable.

  In addition to the light emitting system of the above embodiment, the light emitting device 10 and the adhesive layer 200 or the light emitting module including the light emitting device 10 and the fixing member 210 may be used.

(Example 8)
FIG. 16 is a cross-sectional view illustrating a configuration of a light emitting system according to Example 8. The light emitting system according to this example has the same configuration as that of the light emitting system according to the embodiment except that the light emitting unit 140 is formed on the first surface 22 or the second surface 24 of the partition member 20. In other words, in this example, the partition member 20 also serves as the substrate 100 in the embodiment. In addition, the light-emitting device 10 may have any structure of Examples 1-5.

  In this embodiment, a recess may be formed on the surface of the partition member 20 where the light emitting unit 140 is formed, and the light emitting unit 140 may be formed in the recess. For example, one recess may be formed in a region where the plurality of light emitting units 140 are formed, and the plurality of light emitting units 140 may be formed on the bottom surface of the recess. It may be formed. In this case, the light-emitting portion 140 may be sealed with a highly transmissive structure, for example, a structure in which a plurality of recesses are sealed at once by film sealing or the like. In any case where the concave portion is individual or plural with respect to the light emitting portion 140, it is possible to suppress the light emitting portion 140 from protruding from the partition member 20. In addition, when forming the light emission part 140 in the recessed part of the partition member 20, the upper part of the light emission part 140 may protrude from the 1st surface 22 (or 2nd surface 24) of the partition member 20, or the light emission part 140 of FIG. The whole may be located below the first surface 22 (or the second surface 24).

  Also in this example, as in the embodiment, a person inside the moving body 30 can visually recognize the outside of the moving body 30 through the light emitting device 10 and the partition member 20. In addition, since the light emitting system does not include the substrate 100, the manufacturing cost of the light emitting system is reduced.

Example 9
FIG. 17 is a cross-sectional view illustrating a configuration of a light emitting system according to Example 9. The light emitting system according to the present example has the same configuration as that of any one of the embodiment and Examples 1 to 8 except that a plurality of light emitting devices 10 are attached to the partition member 20. The plurality of light emitting devices 10 may be controlled to emit and extinguish according to the same control signal, or may be controlled to emit and extinguish according to different control signals.

  Also according to this embodiment, a person inside the moving body 30 can visually recognize the outside of the moving body 30 through the light emitting device 10 and the partition member 20.

  As mentioned above, although embodiment and the Example were described with reference to drawings, these are illustrations of this invention and can also employ | adopt various structures other than the above.

  This application claims the priority on the basis of Japanese application Japanese Patent Application No. 2015-210775 for which it applied on October 27, 2015, and takes in those the indications of all here.

Claims (13)

A light-emitting device that is disposed on a light-transmitting partition member that partitions the first space and the second space and includes a transmission part and a light-emitting part;
With
The light emission system whose light emission intensity with respect to said 2nd space is 0% or more and 10% or less with respect to the light emission intensity with respect to said 1st space. The light emitting system according to claim 1 comprises:
The light emission system whose light emission intensity with respect to said 2nd space is 0% or more and 1% or less with respect to the light emission intensity with respect to said 1st space. The light emitting system according to claim 2 comprises:
The light emission system whose light emission intensity with respect to said 2nd space is 0% or more and 0.1% or less with respect to the light emission intensity with respect to said 1st space. A light emitting system according to claim 3 is provided.
The light emitting device has an insulating film that defines the light emitting portion,
A light emitting system comprising a semi-transmissive portion that overlaps at least the insulating film between the transmissive portion and the light emitting portion. A translucent partition member that partitions the first space and the second space;
A translucent substrate disposed on the surface of the partition member on the second space side;
A plurality of light emitting units disposed on the substrate;
An insulating film defining the plurality of light emitting portions;
With
The light emitting unit has a light transmitting first electrode, a light emitting layer, and a second electrode from the first space side,
The light emitting system which has the translucent area | region which is an area | region in which the said insulating film and the said 2nd electrode are not formed between the two said adjacent light emission parts among the said board | substrates. The light emitting system according to claim 5.
The light emitting system, wherein the substrate is fixed to the partition member using an adhesive layer. The light-emitting system according to claim 5 or 6,
The light emitting system, wherein the substrate is fixed to the partition member using a fixing member. In the light-emitting device as described in any one of Claims 5-7,
In the light emitting unit, a part of the second electrode overlaps the insulating film,
The light emitting system, wherein the substrate includes a first region overlapping with the second electrode, a second region overlapping with the insulating film but not overlapping with the second electrode, and the light transmitting region. A translucent partition member that partitions the first space and the second space;
A plurality of light emitting portions formed on the partition member;
An insulating film defining the plurality of light emitting portions;
With
The light emitting unit has a light transmitting first electrode, a light emitting layer, and a second electrode from the first space side,
The light emitting system which has the translucent area | region which is an area | region in which the said insulating film and the said 2nd electrode are not formed between the two said adjacent light emission parts among the said partition members. The light-emitting device according to claim 9.
In the light emitting unit, a part of the second electrode overlaps the insulating film,
The partition system includes a first region that overlaps the second electrode, a second region that overlaps the insulating film but does not overlap the second electrode, and a light-transmitting region. The light-emitting system according to claim 8 or 10,
The light emitting system in which the width of the second region is narrower than the width of the translucent region. In the light emission system as described in any one of Claims 1-11,
The light emitting system, wherein the light emitting layer is an organic layer. In the light-emitting device as described in any one of Claims 1-12,
The second space is located inside a moving body for a person to move,
The light emitting system, wherein the partition member is a window of the moving body.

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