JPWO2016208686A1 - Cutting device - Google Patents

Abstract

A cutting device (1) for cutting a workpiece (ZE) with laser light (CW, PW), a pulse wave laser light oscillator (10) for oscillating a pulsed laser light (PW), and a continuous wave laser light A continuous wave laser beam oscillator (11) that oscillates (CW), and cuts the first portion made of the first material (M) of the workpiece (ZE) with the laser beam (PW) of the pulse wave And a cutting device (1) for cutting a second portion made of the second material (A) different from the first material (M) of the workpiece (ZE) with the continuous wave laser beam (CW). ).

Description

  One aspect of the present invention relates to a cutting apparatus that cuts a workpiece with laser light.

  As a cutting device using a laser beam, for example, a device described in Patent Document 1 is known. The apparatus described in Patent Document 1 manufactures an electrode by irradiating a laser beam to a band-shaped electrode in which an active material layer is formed on a band-shaped metal foil. In particular, in this apparatus, in order to ensure cutting quality while increasing the processing speed, the laser head irradiates laser light having a preset energy intensity according to the elapsed time from the time when the movement of the laser head is started. .

JP2012-221912A

  In the apparatus described in Patent Document 1, the energy intensity is changed using a single laser oscillator, so that the portion only from the metal foil and the portion where the active material layer is formed on the metal foil are cut. However, since these two portions have different thicknesses or the like, it is difficult to satisfy the cutting quality of the two portions only by changing the cutting processing conditions such as energy intensity with one laser oscillator.

  Therefore, an object of one aspect of the present invention is to propose a cutting apparatus capable of cutting that satisfies the cutting quality of a plurality of parts of a workpiece.

  A cutting device according to one aspect of the present invention is a cutting device that cuts a workpiece with laser light, and a pulse wave laser light oscillator that oscillates pulsed laser light, and a continuous wave laser that oscillates continuous wave laser light. An optical oscillator, cutting a first portion made of a first material of a workpiece with a laser beam of a pulse wave, and forming a second portion made of a second material different from the first material of the workpiece on a continuous wave Cut with the laser beam.

  In the case of pulsed laser light, the work can be cut while suppressing melting by heat by giving the work very high energy in which energy is concentrated within a short pulse width. On the other hand, in the case of a continuous wave laser beam, the workpiece can be cut by melting by heat by continuously applying energy of a predetermined magnitude to the workpiece. In the cutting apparatus, the first part suitable for cutting with suppressed melting by heat is cut with a pulsed laser beam, and the second part suitable for cutting by melting with heat is continuously waved. By cutting with laser light, it is possible to perform cutting that satisfies the cutting quality of a plurality of parts of the workpiece.

  In the cutting apparatus according to the embodiment, the first scanner that changes the irradiation direction of the laser beam of the pulse wave oscillated by the pulse wave laser beam oscillator so as to follow the cutting position in the first portion of the workpiece, and the continuous wave laser It is good also as a structure provided with the 2nd scanner which changes the irradiation direction of the continuous wave laser beam oscillated with the optical oscillator so that the cutting location in the 2nd part of a workpiece | work may be followed.

  In the cutting device of one embodiment, the thickness of the first portion may be thinner than the thickness of the second portion. In particular, in the cutting apparatus according to one embodiment, the workpiece is a strip electrode in which an active material layer is formed on a predetermined portion of the strip-shaped metal foil, and the first portion is a portion composed only of the metal foil of the strip-shaped electrode. The second portion is a portion in which an active material layer is formed on the metal foil of the strip electrode.

  A cutting device according to one aspect of the present invention is a cutting device that cuts a workpiece with laser light, and a pulse wave laser light oscillator that oscillates pulsed laser light, and a continuous wave laser that oscillates continuous wave laser light. The spot of the laser beam of the pulse wave is relatively moved so that the first portion made of the first material of the workpiece is cut by the laser beam of the pulse wave, and the first material of the work is And a controller that relatively moves the spot of the continuous wave laser beam so as to cut the second portion made of the different second material with the continuous wave laser beam.

  In the case of pulsed laser light, the work can be cut while suppressing melting by heat by giving the work very high energy in which energy is concentrated within a short pulse width. On the other hand, in the case of a continuous wave laser beam, the workpiece can be cut by melting by heat by continuously applying energy of a predetermined magnitude to the workpiece. In the cutting apparatus, the first part suitable for cutting with suppressed melting by heat is cut with a pulsed laser beam, and the second part suitable for cutting by melting with heat is continuously waved. By cutting with laser light, it is possible to perform cutting that satisfies the cutting quality of a plurality of parts of the workpiece.

  The cutting device of one embodiment includes a first scanner and a second scanner, and the control device relatively moves the spot of the laser beam of the pulse wave by the control of the first scanner, and controls the second scanner. Thus, the spot of the continuous wave laser beam may be relatively moved.

  In the cutting apparatus according to the embodiment, the control device includes a continuous wave laser beam so that an unirradiated region of the continuous wave laser beam is generated on the second portion side from the boundary between the first portion and the second portion. The spot of the laser beam of the pulse wave may be relatively moved so that the non-irradiated region is irradiated with the laser beam of the pulse wave. In this case, when the non-irradiated region is irradiated with the pulsed laser beam, the control device has a heat input amount to the workpiece by the pulsed laser beam compared to when the first portion is irradiated with the pulsed laser beam. The pulse wave laser light oscillator may be controlled so as to increase.

  According to one aspect of the present invention, cutting that satisfies the cutting quality of a plurality of parts of a workpiece is possible.

It is a figure showing typically the composition of the cutting device concerning one embodiment. (A) is a top view of the strip | belt-shaped electrode before cutting | disconnection, (b) is a top view of the electrode after cutting | disconnection. It is an example of the time change of the energy of a pulse wave laser beam and a continuous wave laser beam. FIG. 3 is an enlarged view of FIG. 2A and is a diagram for explaining cutting near the boundary. FIG. 3 is an enlarged view of FIG. 2A and is a diagram for explaining cutting near the boundary.

  Hereinafter, a cutting device according to an embodiment of one aspect of the present invention will be described with reference to the drawings. In addition, the same code | symbol is attached | subjected about the element which is the same or it corresponds in each figure, and the overlapping description is abbreviate | omitted.

  In one embodiment, the present invention is applied to a cutting apparatus that is incorporated in a production line for electrodes used in batteries and cuts individual electrodes from a strip electrode (workpiece). This cutting device is a cutting device which cuts a strip electrode with a laser beam. The manufactured electrode is used for a power storage device such as a secondary battery or an electric double layer capacitor. The secondary battery is, for example, a non-aqueous electrolyte secondary battery such as a lithium ion secondary battery. In this embodiment, it is assumed that an electrode used for a lithium ion secondary battery is manufactured.

  The electrode has an active material layer formed by applying an electrode paste on at least one surface of a metal foil. The electrode has a tab on which an active material layer is not formed at the end of the metal foil. The metal foil is, for example, an aluminum foil in the case of the positive electrode, and a copper foil or a nickel foil in the case of the negative electrode. The electrode paste is in the form of a slurry having a predetermined viscosity and includes an active material, a binder, a solvent, and the like. The active material is a positive electrode active material or a negative electrode active material. The positive electrode active material is, for example, a composite oxide or a sulfur-based material. The composite oxide includes at least one of manganese, nickel, cobalt, and aluminum and lithium. Examples of the negative electrode active material include graphite, highly oriented graphite, carbon such as mesocarbon microbeads, hard carbon, and soft carbon, alkali metals such as lithium and sodium, metal compounds, and SiOx (0.5 ≦ x ≦ 1.5). ) And the like, and boron-added carbon. Examples of the binder include fluorine-containing resins such as polyvinylidene fluoride, polytetrafluoroethylene, and fluororubber, thermoplastic resins such as polypropylene and polyethylene, imide resins such as polyimide and polyamideimide, and alkoxysilyl group-containing resins. The solvent is, for example, an organic solvent such as NMP (N-methylpyrrolidone), methanol, methyl isobutyl ketone. The electrode paste may contain a conductive auxiliary such as carbon black, graphite, acetylene black, and ketjen black (registered trademark). The electrode paste may contain a thickening agent such as carboxymethylcellulose (CMC).

  In addition, when cutting an electrode from a strip-shaped electrode, contact-type cutting (punching) using a blade is generally performed. This cutting device using a cutting tool temporarily stops the transportation of the strip electrode every time the electrode is cut, so that the production efficiency of the electrode is lowered. On the other hand, the cutting device using laser light does not need to stop the conveyance of the strip electrode during cutting, so that the electrode production efficiency is high.

  With reference to FIGS. 1-3, the cutting device 1 which concerns on one Embodiment is demonstrated. FIG. 1 is a diagram schematically illustrating a configuration of a cutting device according to an embodiment. FIG. 2A is a plan view of the strip electrode before cutting, and FIG. 2B is a plan view of the electrode after cutting. FIG. 3 shows an example of the temporal change in energy of the pulsed laser beam and the continuous wave laser beam. In FIG. 3, the horizontal axis is time, and the vertical axis is energy.

  When manufacturing an electrode, the above-mentioned substances are kneaded to produce an electrode paste, the electrode paste is applied to a strip-shaped metal foil, and the coated electrode paste is dried to form a strip-shaped metal foil. The band-shaped electrode ZE in which the active material layer A is formed on the band-shaped metal foil M shown in FIG. 2A is generated by the process of forming the active material layer. In this embodiment, a strip electrode ZE having an active material layer A formed on at least one surface of the metal foil M by continuous coating is assumed to be two strips in which two electrodes are arranged in the width direction of the strip electrode ZE. The strip-shaped electrode ZE is coated with the active material layer A at the center in the width direction with a predetermined interval (interval longer than the length of the tab T) from each end in the width direction. In the cutting step, the electrode E shown in FIG. 2B is cut out from the strip electrode ZE by the cutting device 1. When manufacturing an electrode, there are processes such as pressing, baking, and inspection in addition to the above-described processes.

  The band-shaped electrode ZE (workpiece) includes a portion (first portion) made of only the metal foil M (first material), and a portion (second portion) made of the metal foil M and the active material layer A (second material). Part). The thickness of the metal foil M is, for example, several tens of μm. The thickness of the active material layer A is, for example, several hundred μm. Therefore, the thickness of the part consisting only of the metal foil M is very thin compared to the thickness of the part consisting of the metal foil M and the active material layer A. In addition, in the strip-like electrode ZE shown in FIG. 2A, a line CL indicating a cutting portion cut by the cutting device 1 is indicated by a broken line. This cutting line CL is an imaginary line, and no line is actually drawn.

  The cutting device 1 cuts the strip-shaped electrode ZE using two types of laser light, a pulse wave and a continuous wave. In particular, the pulse wave laser beam PW is used for a portion made of only the metal foil M of the strip electrode ZE, and the continuous wave laser beam CW is used for a portion made of the metal foil M and the active material layer A. The cutting device 1 irradiates the laser beams PW and CW from above the belt-like electrode ZE being conveyed. Further, the cutting device 1 irradiates the continuous wave laser light CW in the transport direction D on the upstream side of the pulse wave laser light PW. Moreover, the cutting device 1 irradiates the laser beam PW and CW by moving the centers of the spots of the laser beams PW and CW along the cutting line CL corresponding to the outer shape of the electrode E, respectively. In particular, a portion of the cutting line CL made of only the metal foil M is irradiated with the pulsed laser beam PW, and a portion of the cutting line CL made of the metal foil M and the active material layer A is irradiated with the continuous wave laser light CW. Is done. The cutting device 1 includes a pulse wave laser light oscillator 10, a continuous wave laser light oscillator 11, a scanner (first scanner) 12, a scanner (second scanner) 13, and a control device 14.

  The strip electrode ZE is transported at a predetermined speed by a transport device (not shown). In this transport device, for example, the belt-like electrode ZE is sent out from the unwinding roll and transported, and the scanners 12 and 13 of the cutting device 1 are arranged at predetermined locations in the middle of the transport. The conveyance speed is, for example, several m / min. More preferably, a conveyance speed is 10 dozen meters / minute (10 m or more), for example. During the conveyance, a predetermined tension (tension) is applied to the belt-like electrode ZE.

  The pulse wave laser beam oscillator 10 is an oscillator that oscillates a pulse wave laser beam PW. The pulse wave laser beam oscillator 10 outputs the oscillated pulse wave laser beam PW to the scanner 12. The wavelength of the pulsed laser beam PW is, for example, 1000 to 1100 nm. The output of the pulsed laser beam PW is, for example, 25W. In the pulse wave laser beam oscillator 10, the output can be changed within a predetermined range. The pulse width of the pulsed laser beam PW is, for example, 10 p seconds (10 picoseconds). The repetition frequency of the pulsed laser beam PW is, for example, 200 kHz. In the pulsed laser beam oscillator 10, the repetition frequency can be changed within a predetermined range.

  FIG. 3 shows an example of the time change PE of the energy of the pulsed laser beam PW. Thus, the pulsed laser beam PW is energy having a pulse width of a short time every fixed time according to the repetition frequency. Since the pulse wave laser beam PW concentrates energy in the pulse width of this short time, the peak energy becomes very large. By shortening the pulse width or increasing the output, the peak energy of each pulse increases. In the case of the pulsed laser beam PW, multiphoton excitation is likely to occur due to this very high peak energy.

  The continuous wave laser beam oscillator 11 is an oscillator that oscillates a continuous wave laser beam CW. The continuous wave laser beam oscillator 11 outputs the oscillated continuous wave laser beam CW to the scanner 13. The wavelength of the continuous wave laser beam CW is, for example, 1000 to 1100 nm. The output of the continuous wave laser beam CW is, for example, 500W. In the continuous wave laser light oscillator 11, the output can be changed within a predetermined range. Since the thickness of the active material layer A is thicker than that of the metal foil M, a higher output than that of the metal foil M is required to cut the active material layer A.

  FIG. 3 shows an example of the time change CE of the energy of the continuous wave laser beam CW. As described above, the continuous wave laser beam CW has continuous energy having a predetermined magnitude. The energy of the continuous wave laser beam CW is high energy for cutting the thick active material layer A, but is lower than the peak energy concentrated in the short pulse width of the pulse wave laser beam PW.

  The scanner 12 is a device that moves the pulsed laser beam PW along the cutting line CL of a portion made of only the metal foil M with respect to the belt-like electrode ZE being conveyed. The scanner 12 is disposed at a position above the belt-like electrode ZE to be conveyed, and irradiates the pulsed laser beam PW toward the belt-like electrode ZE below. The scanner 12 includes, for example, two mirrors and two drive devices that change the angles of the mirrors around the rotation axes in different directions (that is, change the irradiation direction three-dimensionally by combining the two mirrors). And a condensing lens. In the scanner 12, the angle of each mirror is changed by each driving device, and the pulse wave laser beam PW is reflected by the two mirrors to change the irradiation direction. The cutting speed by the pulsed laser beam PW changes according to the speed at which the angle of each mirror is changed by each driving device. The cutting speed is, for example, several m / min. More preferably, the cutting speed is, for example, several tens of m / min. The cutting speed is set independently of the transport speed of the strip electrode ZE transported by the transport device. The pattern for changing the angle of each mirror and the changing speed in each driving device are preset for each conveying speed and stored in the scanner 12. In the scanner 12, the pulsed laser beam PW reflected by the two mirrors is incident on the condenser lens, and the pulsed laser beam PW collected by the condenser lens is irradiated toward the belt-shaped electrode ZE being conveyed. . The spot diameter of the condensed pulse wave laser beam PW is, for example, 100 μm.

  The scanner 13 is a device that moves the continuous wave laser light CW along the cutting line CL of the portion made of the metal foil M and the active material layer A with respect to the belt-like electrode ZE being conveyed. The scanner 13 is disposed at a position above the belt-like electrode ZE to be conveyed, and irradiates the continuous-wave laser light CW toward the lower belt-like electrode ZE. The scanner 13 is disposed upstream of the scanner 12 in the transport direction D, and irradiates the continuous wave laser light CW upstream of the pulsed laser light PW emitted from the scanner 12. The configuration of the scanner 13 is the same as that of the scanner 12, and includes, for example, two mirrors, two drive devices, and a condenser lens. The cutting speed of the continuous wave laser beam CW is, for example, several meters / minute. The spot diameter of the condensed continuous wave laser beam CW is, for example, 100 μm.

  The control device 14 is an electronic control unit that controls the cutting device 1, and includes a memory such as a CPU [Central Processing Unit], a ROM [Read Only Memory], and a RAM [Random Access Memory], an input / output circuit, and the like. The control device 14 may be incorporated as one function of the control device of the electrode production line, or may be configured as a control device dedicated to the cutting device 1. The control device 14 controls the laser light oscillators 10 and 11 and the scanners 12 and 13 so as to synchronize with the transport of the strip electrode ZE by the transport device. For this purpose, information on the conveyance speed of the strip electrode ZE by the conveyance device is input to the control device 14. The conveyance speed is calculated from, for example, a detection value detected by a rotary encoder provided on the unwinding roll of the conveyance device. When the transport of the belt-like electrode ZE by the transport device is started, the control device 14 oscillates the pulsed laser beam PW with the pulsed wave laser beam oscillator 10 and oscillates the continuous wave laser beam CW with the continuous wave laser beam oscillator 11. Let Further, the control device 14 operates the two drive devices of the scanner 12 according to the conveyance speed, and operates the two drive devices of the scanner 13 according to the conveyance speed. When the transport of the strip electrode ZE is completed, the control device 14 stops the driving devices of the pulse wave laser beam oscillator 10, the continuous wave laser beam oscillator 11, and the scanners 12 and 13.

  Note that in the cutting device 1, the assist gas may be sprayed to the portions where the laser beams PW and CW are irradiated to the strip electrode ZE. In the cutting apparatus 1, the scanner 12 is arranged upstream of the scanner 13 in the transport direction D, and the pulsed laser beam PW is irradiated upstream of the continuous wave laser beam CW irradiated from the scanner 13. May be.

  The operation of the cutting device 1 will be described. In the transport device, the strip electrode ZE is transported at a predetermined transport speed. During the conveyance of the strip electrode ZE, the pulse wave laser beam oscillator 10 oscillates the pulse wave laser beam PW and outputs the pulse wave laser beam PW to the scanner 12. The continuous wave laser light oscillator 11 oscillates the continuous wave laser light CW and outputs the continuous wave laser light CW to the scanner 13.

  In the scanner 13, the angle of each mirror is changed by each driving device in synchronization with the conveyance of the strip electrode ZE. In the scanner 13, the input continuous wave laser light CW is sequentially reflected by the two mirrors to change the irradiation direction, and the continuous wave laser light CW is condensed by the condenser lens and is applied to the strip electrode ZE. Irradiate toward. The irradiated continuous wave laser beam CW moves on the cutting line CL (particularly, the portion where the active material layer A is formed) of the belt-like electrode ZE being conveyed.

  High energy is continuously given to the portion of the strip electrode ZE irradiated with the continuous wave laser beam CW. As a result, the portion irradiated with the continuous wave laser beam CW is cut by melting the active material or the like by the continuously applied high energy heat. At this time, the melted material such as the active material may solidify and adhere to the cut surface (for example, a lumpy material adheres). Even when deposits are formed on the cut surface in this way, the active material layer A is thick, and therefore the size of the deposits hardly increases beyond the thickness of the active material layer. Therefore, even when the manufactured electrode (positive electrode, negative electrode) is used for a battery (particularly, a battery in which the positive electrode and the negative electrode are laminated via a separator), this deposit damages the separator and causes the positive electrode and the negative electrode to The possibility of shorting is very low. Therefore, although the cutting is performed by melting using the continuous wave laser beam CW, the cutting quality of the portion where the active material layer A is formed in the strip electrode ZE is sufficiently satisfied. In the case of cutting by melting using the continuous wave laser beam CW, the thick active material layer A can be cut in a short irradiation time. Therefore, the cutting using the continuous wave laser beam CW can cut the thick active material layer A even if the conveyance speed and the cutting speed are set to high speeds. By increasing the conveyance speed and the cutting speed, the production amount of the electrode E per unit time increases, and the production efficiency increases.

  In the scanner 12, the angle of each mirror is changed by each driving device in synchronization with the conveyance of the strip electrode ZE. In the scanner 12, the input pulse wave laser beam PW is sequentially reflected by the two mirrors to change the irradiation direction, and the pulse wave laser beam PW is condensed by the condenser lens and is applied to the strip electrode ZE. Irradiate toward. The portion irradiated with the pulsed laser beam PW moves on the cutting line CL (particularly, only the metal foil M) of the belt-like electrode ZE being conveyed. Moreover, the location irradiated with the pulsed laser beam PW is downstream of the location irradiated with the continuous wave laser beam CW. Therefore, when the pulse wave laser beam PW is irradiated, the portion of the strip electrode ZE where the active material layer A is formed is already cut.

  A very high energy obtained by concentrating energy in a short pulse width is instantaneously applied to a portion of the strip electrode ZE irradiated with the pulsed laser beam PW, and multiphoton excitation occurs. Thereby, the location irradiated with the pulse wave laser beam PW is cut by disconnecting the metal molecules forming the metal foil M. Therefore, in the cutting using the pulse wave laser beam PW, cutting by melting can be suppressed, so that the solidified product can be prevented from solidifying and adhering to the cut surface. Even when deposits are formed on the cut surface, the size of the deposits is small, so the possibility that the deposits damage the separator and short-circuit the positive electrode and the negative electrode is very low. Therefore, although the portion of the strip electrode ZE only of the metal foil M is very thin, the cutting quality of the portion of the strip electrode ZE only of the metal foil M is sufficiently satisfied. Further, in the case of cutting using the pulsed laser beam PW, the metal foil M is thin, so that the metal foil M can be cut in a short irradiation time. Therefore, the cutting using the pulse wave laser beam PW can also set the conveyance speed and the cutting speed to a high speed, similarly to the cutting using the continuous wave laser beam CW.

  According to this cutting device 1, a portion of the strip electrode ZE made only of the metal foil M is cut by the pulsed laser beam PW, and a portion made of the metal foil M and the active material layer A is a continuous wave laser. By cutting with optical CW, cutting that satisfies the cutting quality of these two parts can be achieved. Moreover, according to this cutting device 1, since the conveyance speed and cutting speed of the strip electrode ZE can be set to a high speed, the production efficiency of the electrode E can be improved. When the electrode E (positive electrode, negative electrode) is used in the battery after being cut by the cutting device 1, it is possible to suppress a short circuit caused by the deposit on the cut surface of the electrode E in the battery.

  As mentioned above, although embodiment of the one side surface of this invention was described, it is implemented with various forms, without being limited to the said embodiment.

  For example, in the above embodiment, the portion of the strip electrode made of only the metal foil is cut with the pulsed laser beam, and the portion of the metal foil and the active material layer is cut with the continuous wave laser beam. The first part that is cut by the above method and the second part that is cut by the continuous wave laser beam can be applied to other parts. For example, a protective layer that protects the active material layer (for example, a protective layer using ceramic) is provided. In the case of an electrode having a strip electrode, the portion made of the metal foil and the protective layer and the portion made only of the metal foil are cut with a pulsed laser beam, and the portion made of the metal foil, the active material layer and the protective layer is continuously wave laser light. It is set as the structure cut | disconnected by.

  Moreover, in the said embodiment, although applied to the 2 strip | belt-shaped strip | belt-shaped electrode with which two electrodes were arrange | positioned in the width direction, it is applicable also to the 1 strip | strand-shaped strip | belt-shaped electrode with which one electrode was arrange | positioned in the width direction. is there. Moreover, in the said embodiment, although it applied to the strip | belt-shaped electrode by which the active material layer was formed by continuous coating to strip | belt-shaped metal foil, the active material layer was formed at predetermined intervals by intermittent coating of strip | belt-shaped metal foil. It can also be applied to a strip electrode.

  In the above embodiment, since the workpiece (band electrode) side being conveyed cannot be moved freely, the present invention is applied to a cutting apparatus that can irradiate laser light while moving the laser beam along the workpiece cutting line. If the workpiece can be moved, the present invention can be applied to a cutting device that moves a workpiece in accordance with a cutting line and irradiates a certain portion with laser light.

  Here, as described above, in the cutting device 1, the control device 14 controls the pulse wave laser light oscillator 10 and the continuous wave laser light oscillator 11 to thereby generate the pulse wave laser light PW and the continuous wave laser light CW. Oscillate. Further, the control device 14 controls the scanner 12 to move the spot of the pulsed laser beam PW relative to the strip electrode ZE along the cutting line CL. Further, the control device 14 controls the scanner 13 to move the spot of the continuous wave laser beam CW relative to the strip electrode ZE along the cutting line CL. Thereby, the cutting device 1 cuts the strip electrode ZE.

  In other words, the cutting device 1 uses the pulse wave laser beam PW to cut the spot of the pulse wave laser beam PW so as to cut the first portion made of the first material (metal foil M) of the workpiece (band electrode ZE). The second portion made of the first material of the workpiece and the second material (active material layer A) different from the first material is continuously moved so as to be cut by the continuous wave laser beam CW. A control device 14 that relatively moves the spot of the wave laser beam CW is provided. In particular, the control device 14 relatively moves the spot of the pulsed laser beam PW by the control of the scanner 12 and relatively moves the spot of the continuous wave laser beam CW by the control of the scanner 13.

  Subsequently, an example of control performed by the control device 14 will be described. 4 and 5 correspond to the enlarged view of FIG. Here, as shown in FIG. 4A, at least a part of the strip electrode ZE is irradiated with the continuous wave laser light CW (spot relative movement, scanning) along the cutting line CL of the second portion. It has been broken. Therefore, in the second portion of the strip electrode ZE, a region where the cutting is completed (hereinafter referred to as a second cutting completion region CLA) is formed along the cutting line CL.

  At this time, the spot of the continuous wave laser beam CW is prevented from reaching the boundary BL between the first portion and the second portion. This is because when the spot of the continuous wave laser beam CW crosses the boundary BL and the continuous wave laser beam CW having a relatively large output is irradiated to the first portion, a large dross of the metal foil M may be generated. Because there is. Therefore, here, the second cutting completion area CLA does not reach the boundary BL between the first part and the second part. In other words, the unirradiated area AR of the continuous wave laser beam CW is generated along the cutting line CL from the boundary BL between the first part and the second part to the second part side. The unirradiated area AR is a part on the boundary BL side in the second part, and is about 1 mm, for example.

  In such a state, as shown in FIG. 4B, irradiation with the pulsed laser beam PW (relative movement of the spot, scanning) is performed. That is, the spot of the pulsed laser beam PW is relatively moved along the cutting line CL so that the spot of the pulsed laser beam PW reaches the boundary BL from the first part side. Thereby, in the first portion of the strip electrode ZE, a region where the cutting is completed (hereinafter referred to as a first cutting completion region CLM) is formed along the cutting line CL.

  As shown in FIG. 5, the spot of the pulsed laser beam PW is relatively moved along the cutting line CL across the boundary BL so that the pulsed laser beam PW is irradiated onto the unirradiated region AR as it is. When the pulsed laser beam PW is irradiated onto the unirradiated region AR, the amount of heat input to the strip electrode ZE by the pulsed laser beam PW is larger than when the pulsed laser beam PW is irradiated onto the first portion. To do.

  In order to increase the amount of heat input to the strip electrode ZE, the irradiation condition of the pulsed laser beam PW is controlled. As an example of the control, it is conceivable to increase the repetition frequency, reduce the spot diameter using, for example, a 3D scanner, reduce the relative movement speed of the spot, or repeatedly irradiate a plurality of times. Or you may combine these several conditions. In this way, even the pulse wave laser light PW having a relatively small output can be cut by melting the second portion with a sufficient amount of heat input. Thereby, the first cutting completion area CLM and the second cutting completion area CLA are connected, and the cutting is completed.

  In the cutting apparatus 1, the irradiation with the continuous wave laser beam CW may be performed after the irradiation with the pulse wave laser beam PW. That is, first, the spot of the pulsed laser beam PW is relatively moved along the cutting line CL, so that the spot of the pulsed laser beam PW reaches the boundary BL from the first portion side. Subsequently, the spot of the pulse wave laser beam PW is relatively moved across the boundary BL along the cutting line CL so that the pulse wave laser beam PW is irradiated onto the unirradiated region AR. Thereby, first, the first cutting completion region CLM is formed.

  Thereafter, the spot of the continuous wave laser light CW is cut so that the second cutting completion area CLA by the continuous wave laser light CW is connected to the first cutting completion area CLM already formed beyond the boundary BL. Relative movement is performed along the line CL. The above operation of the cutting device 1 is realized by the control of the control device 14 as described above.

  In other words, in the cutting device 1, the control device 14 detects the continuous wave laser so that the unirradiated area AR of the continuous wave laser light CW is generated on the second portion side from the boundary BL between the first portion and the second portion. While relatively moving the spot of the light CW, the spot of the pulsed laser beam PW is relatively moved so that the pulsed laser beam PW is irradiated onto the unirradiated area AR. In particular, when the controller 14 irradiates the non-irradiated region AR with the pulsed laser beam PW, the control device 14 applies the pulsed laser beam PW to the strip electrode ZE as compared to when the pulsed laser beam PW is irradiated onto the first portion. The pulse wave laser beam oscillator 10 is controlled so as to increase the amount of heat input.

  In the cutting device 1, the strip electrode ZE can be cut while suppressing the dross of the metal foil M in the vicinity of the boundary BL between the first portion and the second portion with the above configuration. It becomes possible.

  About the above aspect, it adds to the following.

(Appendix 1)
A cutting device for cutting a workpiece by laser light,
A pulsed wave laser oscillator that oscillates a pulsed laser beam;
A continuous wave laser oscillator that oscillates a continuous wave laser beam;
With
The first portion of the workpiece made of the first material is cut by the laser beam of the pulse wave, and the second portion of the workpiece made of the second material different from the first material is cut by the continuous wave. Cutting device that cuts with laser light.

(Appendix 2)
The continuous wave laser beam is irradiated so that an unirradiated region of the continuous wave laser beam is generated on the second portion side from the boundary between the first portion and the second portion, and the pulse Irradiating the non-irradiated region with a laser beam of waves,
The cutting apparatus according to appendix 1.

(Appendix 3)
When irradiating the non-irradiated region with the pulsed laser beam, the amount of heat input to the workpiece by the pulsed laser beam is greater than when irradiating the first wave with the pulsed laser beam. To be bigger,
The cutting device according to attachment 2.

  Cutting that satisfies the cutting quality of a plurality of parts of the workpiece is possible.

  DESCRIPTION OF SYMBOLS 1 ... Cutting device, 10 ... Pulse wave laser beam oscillator, 11 ... Continuous wave laser beam oscillator, 12, 13 ... Scanner, 14 ... Control device.

Claims (8)

A cutting device for cutting a workpiece by laser light,
A pulsed wave laser oscillator that oscillates a pulsed laser beam;
A continuous wave laser oscillator that oscillates a continuous wave laser beam;
With
The first portion of the workpiece made of the first material is cut by the laser beam of the pulse wave, and the second portion of the workpiece made of the second material different from the first material is cut by the continuous wave. Cutting device that cuts with laser light. A first scanner that changes an irradiation direction of the laser beam of the pulse wave oscillated by the pulse wave laser oscillator so as to follow a cutting position in the first portion of the workpiece;
A second scanner that changes an irradiation direction of the continuous-wave laser light oscillated by the continuous-wave laser light oscillator so as to follow a cutting position in the second portion of the workpiece;
The cutting device according to claim 1, comprising:   The cutting apparatus according to claim 1 or 2, wherein a thickness of the first portion is thinner than a thickness of the second portion. The workpiece is a strip electrode in which an active material layer is formed on a predetermined portion of a strip metal foil,
The first part is a part consisting only of the metal foil of the strip electrode,
The cutting device according to claim 3, wherein the second portion is a portion in which the active material layer is formed on the metal foil of the strip electrode. A cutting device for cutting a workpiece by laser light,
A pulsed wave laser oscillator that oscillates a pulsed laser beam;
A continuous wave laser oscillator that oscillates a continuous wave laser beam;
The spot of the laser beam of the pulse wave is relatively moved so as to cut the first portion made of the first material of the workpiece with the laser beam of the pulse wave, and the first material of the workpiece A controller that relatively moves the spot of the continuous wave laser beam so as to cut a second portion made of a different second material with the continuous wave laser beam;
A cutting device comprising: A first scanner and a second scanner;
The control device relatively moves the spot of the laser beam of the pulse wave by the control of the first scanner, and relatively moves the spot of the laser beam of the continuous wave by the control of the second scanner.
The cutting device according to claim 5. The control device sets the spot of the continuous wave laser light so that an unirradiated region of the continuous wave laser light is generated on the second part side from the boundary between the first part and the second part. Relative movement and relative movement of the pulsed laser beam spot so that the unirradiated region is irradiated with the pulsed laser beam,
The cutting device according to claim 5 or 6. The control device is configured to irradiate the non-irradiated region with the pulsed laser light compared to when irradiating the first part with the pulsed laser light. Controlling the pulsed laser light oscillator so that the heat input to the
The cutting device according to claim 7.