JP6806057B2 - Cutting device - Google Patents

Description

One aspect of the present invention relates to a cutting device that cuts a work by a laser beam.

As a cutting device using a laser beam, for example, the device described in Patent Document 1 is known. The apparatus described in Patent Document 1 manufactures an electrode by irradiating a band-shaped electrode having an active material layer formed on a band-shaped metal foil with a laser beam and cutting the electrode. In particular, in this device, in order to ensure cutting quality while increasing the processing speed, the laser head irradiates a laser beam having a preset energy intensity according to the elapsed time from the time when the laser head starts moving. ..

Japanese Unexamined Patent Publication No. 2012-221912

In the apparatus described in Patent Document 1, by changing the energy intensity using one laser oscillator, a portion is cut from only the metal foil and a portion where an active material layer is formed on the metal foil. However, since these two parts have different thicknesses and the like, it is difficult to satisfy the cutting quality of each of the two parts only by changing the cutting processing conditions such as energy intensity with one laser oscillator.

Therefore, in one aspect of the present invention, it is an object of the present invention to propose a cutting device capable of cutting which satisfies the cutting quality of each of a plurality of parts of the work.

The cutting device according to one aspect of the present invention is a cutting device that cuts a work by a laser beam, and is a pulse wave laser optical oscillator that oscillates a pulse wave laser beam and a continuous wave laser that oscillates a continuous wave laser beam. A second part made of a second material different from the first material of the work is continuously waved by cutting the first part made of the first material of the work with a laser beam of a pulse wave. Cut with the laser beam of.

In the case of a pulse wave laser beam, by giving a very high energy in which energy is concentrated in a short pulse width to the work, melting due to heat can be suppressed and the work can be cut. On the other hand, in the case of continuous wave laser light, the work can be cut by melting by heat by continuously applying energy of a predetermined magnitude to the work. In the cutting device, the first part, which is suitable for cutting by suppressing heat melting, is cut with a pulse wave laser beam, and the second part, which is suitable for cutting by heat melting, is cut by a continuous wave. By cutting with a laser beam, it is possible to perform cutting that satisfies the cutting quality of each of a plurality of parts of the work.

In the cutting device of one embodiment, a first scanner that changes the irradiation direction of the laser beam of the pulse wave oscillated by the pulse wave laser optical oscillator along the cutting point in the first part of the work, and a continuous wave laser. A configuration may be provided including a second scanner that changes the irradiation direction of the continuous wave laser beam oscillated by the optical oscillator along the cut portion in the second portion of the work.

In the cutting device of one embodiment, the thickness of the first portion may be thinner than the thickness of the second portion. In particular, in the cutting device of one embodiment, the work is a strip-shaped electrode in which an active material layer is formed on a predetermined portion of the strip-shaped metal foil, and the first portion is a portion composed of only the metal foil of the strip-shaped electrode. The second portion is a portion in which an active material layer is formed on the metal foil of the strip-shaped electrode.

The cutting device according to one aspect of the present invention is a cutting device that cuts a work by a laser beam, and is a pulse wave laser optical oscillator that oscillates a pulse wave laser beam and a continuous wave laser that oscillates a continuous wave laser beam. The spot of the laser beam of the pulse wave is relatively moved so as to cut the first portion of the optical oscillator and the first material of the work with the laser beam of the pulse wave, and the first material of the work is A control device for relatively moving the spot of the continuous wave laser beam so as to cut the second portion made of a different second material with the continuous wave laser beam is provided.

In the case of a pulse wave laser beam, by giving a very high energy in which energy is concentrated in a short pulse width to the work, melting due to heat can be suppressed and the work can be cut. On the other hand, in the case of continuous wave laser light, the work can be cut by melting by heat by continuously applying energy of a predetermined magnitude to the work. In the cutting device, the first part, which is suitable for cutting by suppressing heat melting, is cut with a pulse wave laser beam, and the second part, which is suitable for cutting by heat melting, is cut by a continuous wave. By cutting with a laser beam, it is possible to perform cutting that satisfies the cutting quality of each of a plurality of parts of the work.

The cutting device of one embodiment includes a first scanner and a second scanner, and the control device relatively moves the spot of the laser beam of the pulse wave under the control of the first scanner and controls the second scanner. The spot of the continuous wave laser beam may be relatively moved by the above.

In the cutting device of one embodiment, the control device uses a continuous wave laser beam so that an unirradiated region of the continuous wave laser beam is generated from the boundary between the first portion and the second portion to the second portion side. The spots of the pulse wave may be relatively moved, and the spots of the pulse wave laser light may be relatively moved so that the pulse wave laser light is irradiated to the unirradiated region. In this case, when the control device irradiates the unirradiated region with the laser beam of the pulse wave, the amount of heat input to the work by the laser beam of the pulse wave is higher than that when the laser beam of the pulse wave is irradiated to the first portion. The pulse wave laser light oscillator may be controlled so that

According to one aspect of the present invention, it is possible to perform cutting that satisfies the cutting quality of each of a plurality of parts of the work.

It is a figure which shows typically the structure of the cutting apparatus which concerns on one Embodiment. (A) is a plan view of the strip-shaped electrode before cutting, and (b) is a plan view of the electrode after cutting. This is an example of the time change of the energy of the pulse wave laser beam and the continuous wave laser beam. It is an enlarged view of FIG. 2A, and is the figure explaining the cutting near the boundary. It is an enlarged view of FIG. 2A, and is the figure explaining the cutting near the boundary.

Hereinafter, the cutting device according to the embodiment of one aspect of the present invention will be described with reference to the drawings. In each figure, the same or corresponding elements are designated by the same reference numerals, and duplicate description will be omitted.

In one embodiment, it is incorporated into a manufacturing line of electrodes used in a battery and applied to a cutting device that cuts individual electrodes from a strip-shaped electrode (work). This cutting device is a cutting device that cuts a band-shaped electrode with a laser beam. The manufactured electrodes are used, for example, in a power storage device such as a secondary battery or an electric double layer capacitor. The secondary battery is, for example, a non-aqueous electrolyte secondary battery such as a lithium ion secondary battery. In this embodiment, it is assumed that an electrode used for a lithium ion secondary battery is manufactured.

The electrode is coated with an electrode paste on at least one surface of a metal foil to form an active material layer. The electrode has a tab on which no active material layer is formed at the end of the metal foil. The metal foil is, for example, an aluminum foil in the case of a positive electrode, and a copper foil or a nickel foil in the case of a negative electrode. The electrode paste is in the form of a slurry having a predetermined viscosity and contains an active material, a binder, a solvent and the like. The active material is a positive electrode active material or a negative electrode active material. The positive electrode active material is, for example, a composite oxide or a sulfur-based material. The composite oxide contains at least one of manganese, nickel, cobalt and aluminum and lithium. The negative electrode active material includes, for example, graphite, highly oriented graphite, mesocarbon microbeads, carbon such as hard carbon and soft carbon, alkali metals such as lithium and sodium, metal compounds, and SiOx (0.5 ≦ x ≦ 1.5). ) And other metal oxides and boron-added carbon. The binder is, for example, a fluororesin such as polyvinylidene fluoride, polytetrafluoroethylene, or fluororubber, a thermoplastic resin such as polypropylene or polyethylene, an imide-based resin such as polyimide or polyamideimide, or an alkoxysilyl group-containing resin. The solvent is, for example, an organic solvent such as NMP (N-methylpyrrolidone), methanol, or methyl isobutyl ketone. Further, the electrode paste may contain a conductive auxiliary agent such as carbon black, graphite, acetylene black, and Ketjen black (registered trademark). In addition, the electrode paste may contain a thickener such as carboxymethyl cellulose (CMC).

When cutting an electrode from a strip-shaped electrode, contact-type cutting (punching) using a cutting tool is generally performed. This cutting device using a cutting tool temporarily stops the transport of the strip-shaped electrode each time the electrode is cut, so that the production efficiency of the electrode is lowered. On the other hand, the cutting device using a laser beam does not need to stop the transport of the strip-shaped electrode during cutting, so that the production efficiency of the electrode is high.

The cutting device 1 according to the embodiment will be described with reference to FIGS. 1 to 3. FIG. 1 is a diagram schematically showing a configuration of a cutting device according to an embodiment. FIG. 2A is a plan view of the strip-shaped electrode before cutting, and FIG. 2B is a plan view of the electrode after cutting. FIG. 3 is an example of time-dependent changes in the energies of the pulse wave laser beam and the continuous wave laser beam. In FIG. 3, the horizontal axis is time and the vertical axis is energy.

When manufacturing an electrode, the steps of kneading each of the above substances to form an electrode paste, the step of applying the electrode paste to a strip-shaped metal foil, and the step of drying the coated electrode paste into a strip-shaped metal foil. A band-shaped electrode ZE in which the active material layer A is formed on the band-shaped metal foil M shown in FIG. 2A is generated by a step of forming the active material layer or the like. In this embodiment, the strip-shaped electrode ZE in which the active material layer A is formed by continuous coating on at least one surface of the metal foil M is used, and two electrodes are arranged in the width direction of the strip-shaped electrode ZE. The strip-shaped electrode ZE is coated with the active material layer A at the central portion in the width direction at a predetermined interval (an interval longer than the length of the tab T) from each end portion in the width direction. In the cutting step, the electrode E shown in FIG. 2B is cut out from the strip-shaped electrode ZE by the cutting device 1. When manufacturing an electrode, in addition to the above-mentioned steps, there are steps such as pressing, baking, and inspection.

The band-shaped electrode ZE (work) has a portion (first portion) composed of only the metal foil M (first material) and a portion (second portion) composed of the metal foil M and the active material layer A (second material). Part) and. The thickness of the metal foil M is, for example, several tens of μm. The thickness of the active material layer A is, for example, several hundred μm. Therefore, the thickness of the portion made of only the metal foil M is much thinner than the thickness of the portion made of the metal foil M and the active material layer A. The strip-shaped electrode ZE shown in FIG. 2A shows a line CL indicating a cutting portion to be cut by the cutting device 1 by a broken line. This cutting line CL is a virtual line, and the line is not actually drawn.

The cutting device 1 cuts the band-shaped electrode ZE using two types of laser light, a pulse wave and a continuous wave. In particular, the pulse wave laser light PW is used for the portion of the band-shaped electrode ZE made of only the metal foil M, and the continuous wave laser light CW is used for the portion made of the metal foil M and the active material layer A. The cutting device 1 irradiates the laser beams PW and CW from above the strip-shaped electrode ZE being conveyed. Further, the cutting device 1 irradiates the continuous wave laser light CW on the upstream side of the pulse wave laser light PW in the transport direction D. Further, the cutting device 1 irradiates the laser beams by moving the centers of the spots of the laser beams PW and CW along the cutting line CL corresponding to the outer shape of the electrode E. In particular, the portion of the cutting line CL consisting only of the metal foil M is irradiated with the pulse wave laser beam PW, and the portion of the cutting line CL consisting of the metal foil M and the active material layer A is irradiated with the continuous wave laser beam CW. Will be done. The cutting device 1 includes a pulse wave laser optical oscillator 10, a continuous wave laser optical oscillator 11, a scanner (first scanner) 12, a scanner (second scanner) 13, and a control device 14.

The strip-shaped electrode ZE is conveyed at a predetermined speed by a transfer device (not shown). In this transfer device, for example, the strip-shaped electrode ZE is sent out from the unwinding roll and conveyed, and the scanners 12 and 13 of the cutting device 1 are arranged at predetermined positions during the transfer. The transport speed is, for example, several m / min. More preferably, the transport speed is, for example, a dozen meters / minute (10 m or more). During transportation, a predetermined tension is applied to the strip-shaped electrode ZE.

The pulse wave laser optical oscillator 10 is an oscillator that oscillates a pulse wave laser beam PW. The pulse wave laser light oscillator 10 outputs the oscillated pulse wave laser light PW to the scanner 12. The wavelength of the pulse wave laser beam PW is, for example, 1000 to 1100 nm. The output of the pulse wave laser beam PW is, for example, 25 W. In the pulse wave laser optical oscillator 10, the output can be changed within a predetermined range. The pulse width of the pulse wave laser beam PW is, for example, 10 ps (10 picoseconds). The repetition frequency of the pulse wave laser beam PW is, for example, 200 kHz. In the pulse wave laser optical oscillator 10, the repetition frequency can be changed within a predetermined range.

FIG. 3 shows an example of the time-varying PE of the energy of the pulse wave laser beam PW. As described above, the pulse wave laser beam PW is the energy of the pulse width for a short time at regular time intervals according to the repetition frequency. Since the pulse wave laser beam PW concentrates energy in the pulse width for this short time, the peak energy becomes very large. By shortening the pulse width or increasing the output, the peak energy of each pulse increases. In the case of pulsed wave laser light PW, multiphoton excitation is likely to occur due to this extremely high peak energy.

The continuous wave laser light oscillator 11 is an oscillator that oscillates a continuous wave laser light CW. The continuous wave laser light oscillator 11 outputs the oscillated continuous wave laser light CW to the scanner 13. The wavelength of the continuous wave laser beam CW is, for example, 1000 to 1100 nm. The output of the continuous wave laser beam CW is, for example, 500 W. In the continuous wave laser optical oscillator 11, the output can be changed within a predetermined range. Since the thickness of the active material layer A is thicker than that of the metal foil M, a higher output than that of the metal foil M is required to cut the active material layer A.

FIG. 3 shows an example of the time-varying CE of the energy of the continuous wave laser beam CW. As described above, the continuous wave laser light CW is continuous energy of a predetermined magnitude. The energy of this continuous wave laser beam CW is high because it cuts the thick active material layer A, but it is lower than the peak energy concentrated in the short pulse width of the pulse wave laser beam PW.

The scanner 12 is a device that moves the pulse wave laser beam PW with respect to the band-shaped electrode ZE being conveyed along the cutting line CL of the portion made of only the metal foil M. The scanner 12 is arranged at a position above the band-shaped electrode ZE to be transported, and irradiates the pulse wave laser beam PW toward the band-shaped electrode ZE below. The scanner 12 is, for example, two mirrors and two drive devices that change the angle of each mirror around a rotation axis in a different direction (that is, the irradiation direction is three-dimensionally changed by a combination of the two mirrors). And a condenser lens. In the scanner 12, the angle of each mirror is changed by each driving device, and the pulse wave laser beam PW is reflected by the two mirrors to change the irradiation direction. The cutting speed of the pulsed wave laser beam PW changes according to the speed at which the angle of each mirror is changed in each driving device. The cutting speed is, for example, several m / min. More preferably, the cutting speed is, for example, several tens of m / min. The cutting speed is set independently of the transport speed of the strip-shaped electrode ZE transported by the transport device. The pattern for changing the angle of each mirror in each drive device and the speed at which the angle is changed are preset for each transfer speed and stored in the scanner 12. In the scanner 12, the pulse wave laser beam PW reflected by the two mirrors is incident on the condenser lens, and the pulse wave laser beam PW condensed by the condenser lens is irradiated toward the band-shaped electrode ZE being conveyed. .. The spot diameter of the focused pulse wave laser beam PW is, for example, 100 μm.

The scanner 13 is a device that moves the continuous wave laser beam CW with respect to the band-shaped electrode ZE being conveyed along the cutting line CL of the portion composed of the metal foil M and the active material layer A. The scanner 13 is arranged at a position above the band-shaped electrode ZE to be conveyed, and irradiates the continuous wave laser beam CW toward the band-shaped electrode ZE below. Further, the scanner 13 is arranged on the upstream side of the scanner 12 in the transport direction D, and irradiates the continuous wave laser light CW on the upstream side of the pulse wave laser light PW emitted from the scanner 12. The configuration of the scanner 13 is the same as that of the scanner 12, and includes, for example, two mirrors, two driving devices, and a condenser lens. The cutting speed of the continuous wave laser beam CW is, for example, several m / min. The spot diameter of the focused continuous wave laser beam CW is, for example, 100 μm.

The control device 14 is an electronic control unit that controls the cutting device 1, and includes a memory such as a CPU [Central Processing Unit], a ROM [Read Only Memory], and a RAM [Random Access Memory], an input / output circuit, and the like. The control device 14 may be incorporated as a function of the control device of the electrode production line, or may be configured as a control device dedicated to the cutting device 1. The control device 14 controls the laser optical oscillators 10 and 11 and the scanners 12 and 13 so as to be synchronized with the transfer of the band-shaped electrode ZE by the transfer device. Therefore, information on the transfer speed of the strip-shaped electrode ZE by the transfer device is input to the control device 14. The transport speed is calculated from, for example, a detection value detected by a rotary encoder provided on the unwinding roll of the transport device. When the transfer of the band-shaped electrode ZE by the transfer device is started, the control device 14 oscillates the pulse wave laser light PW by the pulse wave laser light oscillator 10 and oscillates the continuous wave laser light CW by the continuous wave laser light oscillator 11. Let me. Further, in the control device 14, the two drive devices of the scanner 12 are operated according to the transfer speed, and the two drive devices of the scanner 13 are operated according to the transfer speed. When the transport of the band-shaped electrode ZE is completed, the control device 14 stops the drive devices of the pulse wave laser optical oscillator 10, the continuous wave laser optical oscillator 11, and the scanners 12 and 13.

In the cutting device 1, the assist gas may be sprayed onto the strip-shaped electrode ZE at a location where the laser beams PW and CW are irradiated. Further, in the cutting device 1, the scanner 12 is arranged on the upstream side of the scanner 13 in the transport direction D, and the pulse wave laser light PW is irradiated on the upstream side of the continuous wave laser light CW emitted from the scanner 13. You may.

The operation of the cutting device 1 will be described. The transport device transports the strip-shaped electrode ZE at a predetermined transport speed. During the transfer of the band-shaped electrode ZE, the pulse wave laser light oscillator 10 oscillates the pulse wave laser light PW and outputs the pulse wave laser light PW to the scanner 12. The continuous wave laser light oscillator 11 oscillates the continuous wave laser light CW and outputs the continuous wave laser light CW to the scanner 13.

In the scanner 13, the angle of each mirror is changed by each drive device in synchronization with the transfer of the strip-shaped electrode ZE. Then, in the scanner 13, the input continuous wave laser light CW is sequentially reflected by these two mirrors to change the irradiation direction, and the continuous wave laser light CW is focused by the condenser lens and becomes the band-shaped electrode ZE. Irradiate toward. The irradiated continuous wave laser beam CW moves on the cutting line CL (particularly, the portion where the active material layer A is formed) of the strip-shaped electrode ZE being conveyed.

High energy is continuously applied to the portion of the band-shaped electrode ZE that is irradiated with the continuous wave laser beam CW. As a result, the portion irradiated with the continuous wave laser beam CW is cut off by melting the active material or the like by the heat of the continuously high energy. At this time, a melt such as an active material may solidify and adhere to the cut surface (for example, a lump-like substance may adhere). Even when deposits are formed on the cut surface in this way, the size of the deposits is rarely larger than the thickness of the active material layer because the active material layer A is thick. Therefore, even when the manufactured electrodes (positive electrode, negative electrode) are used for a battery (particularly, a battery in which a positive electrode and a negative electrode are laminated via a separator), this deposit damages the separator and separates the positive electrode and the negative electrode. The possibility of short-circuiting is very low. Therefore, although the cutting is performed by melting using the continuous wave laser beam CW, the cutting quality of the portion of the strip-shaped electrode ZE in which the active material layer A is formed is sufficiently satisfied. Further, in the case of cutting by melting using continuous wave laser light CW, the thick active material layer A can be cut in a short irradiation time. Therefore, in the cutting using the continuous wave laser beam CW, the thick active material layer A can be cut even if the transport speed and the cutting speed are set to high speeds. By increasing the transport speed and the cutting speed, the production amount of the electrode E per unit time increases, and the production efficiency becomes high.

In the scanner 12, the angle of each mirror is changed by each drive device in synchronization with the transfer of the strip-shaped electrode ZE. Then, in the scanner 12, the input pulse wave laser light PW is sequentially reflected by the two mirrors to change the irradiation direction, and the pulse wave laser light PW is focused by the condenser lens and becomes the band-shaped electrode ZE. Irradiate toward. The portion irradiated with the pulse wave laser beam PW moves on the cutting line CL (particularly, the portion of the metal foil M only) of the strip-shaped electrode ZE being conveyed. The location where the pulse wave laser beam PW is irradiated is downstream from the location where the continuous wave laser beam CW is irradiated. Therefore, when the pulse wave laser beam PW is irradiated, the portion of the band-shaped electrode ZE on which the active material layer A is formed has already been cut.

A very high energy with energy concentrated in a short pulse width is instantaneously given to a portion of the band-shaped electrode ZE irradiated with the pulse wave laser beam PW, and multiphoton excitation occurs. As a result, the portion irradiated with the pulse wave laser beam PW is cut by breaking the bond between the metal molecules forming the metal foil M. Therefore, in the cutting using the pulse wave laser beam PW, the cutting due to melting is suppressed, so that the molten material is also suppressed from solidifying and adhering to the cut surface. Even if deposits are formed on the cut surface, the size of the deposits is small, so it is very unlikely that the deposits will damage the separator and short-circuit the positive electrode and the negative electrode. Therefore, the portion of the strip electrode ZE with only the metal leaf M is very thin, but the cutting quality of the portion of the strip electrode ZE with only the metal foil M is sufficiently satisfied. Further, in the case of cutting using the pulse wave laser beam PW, since the metal foil M is thin, the metal foil M can be cut in a short irradiation time. Therefore, in the cutting using the pulse wave laser light PW, the transport speed and the cutting speed can be set to a high speed as in the cutting using the continuous wave laser light CW.

According to this cutting device 1, the portion of the strip electrode ZE consisting only of the metal foil M is cut by the pulse wave laser light PW, and the portion consisting of the metal foil M and the active material layer A is cut with a continuous wave laser. By cutting with optical CW, it is possible to cut to satisfy the cutting quality of each of these two parts. Further, according to this cutting device 1, since the transport speed and the cutting speed of the strip-shaped electrode ZE can be set to a high speed, the production efficiency of the electrode E can be improved. When the electrode E (positive electrode, negative electrode) is cut by the cutting device 1 and used in the battery, a short circuit caused by deposits on the cut surface of the electrode E can be suppressed in the battery.

Although the embodiment of one aspect of the present invention has been described above, the embodiment is not limited to the above embodiment and may be implemented in various forms.

For example, in the above embodiment, the portion of the strip electrode made of only the metal foil is cut with a pulse wave laser beam, and the portion made of the metal foil and the active material layer is cut with a continuous wave laser beam. The first portion to be cut by the continuous wave laser beam and the second portion to be cut by the continuous wave laser beam can be applied to other parts, for example, a protective layer for protecting the active material layer (for example, a protective layer using ceramic). In the case of an electrode having the electrode, the portion of the band-shaped electrode consisting of the metal foil and the protective layer and the portion consisting of only the metal foil are cut with a pulse wave laser beam, and the portion consisting of the metal foil, the active material layer and the protective layer is cut with continuous wave laser light. It is configured to be cut with.

Further, in the above embodiment, it is applied to a double-rowed strip-shaped electrode in which two electrodes are arranged in the width direction, but it can also be applied to a single-rowed strip-shaped electrode in which one electrode is arranged in the width direction. is there. Further, in the above embodiment, the active material layer is formed on the strip-shaped metal foil by continuous coating, but the active material layer is formed at predetermined intervals by the intermittent coating of the strip-shaped metal foil. It can also be applied to strip-shaped electrodes.

Further, in the above embodiment, since the work (belt-shaped electrode) side during transportation cannot be freely moved, it is applied to a cutting device capable of irradiating while moving the laser beam along the cutting line of the work with a scanner. If it is possible to move the work, it can also be applied to a cutting device that irradiates a certain place with a laser beam by moving the work according to the cutting line.

Here, as described above, in the cutting device 1, the control device 14 controls the pulse wave laser light oscillator 10 and the continuous wave laser light oscillator 11 to generate the pulse wave laser light PW and the continuous wave laser light CW. Oscillate. Further, the control device 14 controls the scanner 12 to move the spot of the pulse wave laser beam PW relative to the strip electrode ZE along the cutting line CL. Further, the control device 14 controls the scanner 13 to move the spot of the continuous wave laser beam CW relative to the strip electrode ZE along the cutting line CL. As a result, the cutting device 1 cuts the strip-shaped electrode ZE.

In other words, the cutting device 1 cuts the spot of the pulse wave laser light PW so as to cut the first portion of the work (belt-shaped electrode ZE) made of the first material (metal foil M) with the pulse wave laser light PW. While moving relatively, the second part composed of the first material of the work and the second material (active material layer A) different from the first material is continuously cut by the continuous wave laser beam CW. A control device 14 for relatively moving the spot of the wave laser beam CW is provided. In particular, the control device 14 relatively moves the spot of the pulse wave laser beam PW under the control of the scanner 12, and relatively moves the spot of the continuous wave laser beam CW under the control of the scanner 13.

Subsequently, an example of the control performed by the control device 14 will be described. 4 and 5 correspond to the enlarged view of FIG. 2A. Here, as shown in FIG. 4A, irradiation (relative movement of spots, scanning) of continuous wave laser light CW along the cutting line CL of the second portion is performed on at least a part of the band-shaped electrode ZE. It has been. Therefore, in the second portion of the strip-shaped electrode ZE, a region where cutting is completed (hereinafter, referred to as a second cutting completed region CLA) is formed along the cutting line CL.

At this time, the spot of the continuous wave laser beam CW is prevented from reaching the boundary BL between the first portion and the second portion. This is because the spot of the continuous wave laser light CW crosses the boundary BL, and when the continuous wave laser light CW having a relatively large output is irradiated to the first portion, a large dross of the metal foil M may occur. Because there is. Therefore, here, the second cut complete region CLA does not reach the boundary BL between the first portion and the second portion. In other words, the unirradiated region AR of the continuous wave laser beam CW is generated along the cutting line CL from the boundary BL between the first portion and the second portion to the second portion side. The unirradiated region AR is a part on the boundary BL side in the second portion, and is, for example, about 1 mm.

In such a state, as shown in FIG. 4B, irradiation of the pulse wave laser beam PW (relative movement of spots, scanning) is performed. That is, the spot of the pulse wave laser light PW is relatively moved along the cutting line CL, and the spot of the pulse wave laser light PW is made to reach the boundary BL from the first partial side. As a result, in the first portion of the strip-shaped electrode ZE, a region where cutting is completed (hereinafter, referred to as a first cutting completed region CLM) is formed along the cutting line CL.

As shown in FIG. 5, the spot of the pulse wave laser light PW is relatively moved along the cutting line CL across the boundary BL so that the pulse wave laser light PW is irradiated to the unirradiated region AR as it is. Then, when the pulse wave laser light PW is irradiated to the unirradiated region AR, the amount of heat input to the band-shaped electrode ZE by the pulse wave laser light PW is larger than that when the pulse wave laser light PW is irradiated to the first portion. To do.

In order to increase the amount of heat input to the band-shaped electrode ZE, the irradiation conditions of the pulse wave laser beam PW are controlled. As an example of control, it is conceivable to increase the repetition frequency, decrease the spot diameter by using, for example, a 3D scanner, decrease the relative movement speed of the spot, or repeatedly irradiate the spot a plurality of times. Alternatively, these plurality of conditions may be combined. In this way, even a pulse wave laser beam PW having a relatively small output can be cut by melting the second portion with a sufficient amount of heat input. As a result, the first cutting completion region CLM and the second cutting completion region CLA are connected, and the cutting is completed.

In the cutting device 1, after irradiating the pulse wave laser beam PW, the continuous wave laser beam CW may be irradiated. That is, first, the spot of the pulse wave laser light PW is relatively moved along the cutting line CL, and the spot of the pulse wave laser light PW is made to reach the boundary BL from the first partial side. Subsequently, the spot of the pulse wave laser light PW is relatively moved along the cutting line CL across the boundary BL so that the pulse wave laser light PW is irradiated to the unirradiated region AR. As a result, first, the first cutting complete region CLM is formed.

After that, the spot of the continuous wave laser light CW is cut so that the second cut complete region CLA by the continuous wave laser light CW is connected to the first cut complete region CLM already formed beyond the boundary BL. Relative movement is performed along the line CL. As described above, the above operation of the cutting device 1 is realized by the control of the control device 14.

That is, in the cutting device 1, the control device 14 uses the continuous wave laser so that the unirradiated region AR of the continuous wave laser light CW is generated from the boundary BL between the first portion and the second portion to the second portion side. The spot of the light CW is relatively moved, and the spot of the pulse wave laser light PW is relatively moved so that the pulse wave laser light PW is irradiated to the unirradiated region AR. In particular, when the control device 14 irradiates the unirradiated region AR with the pulse wave laser light PW, the control device 14 reaches the band-shaped electrode ZE by the pulse wave laser light PW as compared with the case where the pulse wave laser light PW irradiates the first portion. The pulse wave laser optical oscillator 10 is controlled so that the amount of heat input is large.

In the cutting device 1, the strip-shaped electrode ZE can be cut while suppressing the occurrence of dross of the metal foil M in the vicinity of the boundary BL between the first portion and the second portion by the above configuration. It will be possible.

The above aspects will be added below.

(Appendix 1)
A cutting device that cuts a workpiece with laser light.
A pulse wave laser optical oscillator that oscillates a pulse wave laser beam,
A continuous wave laser optical oscillator that oscillates a continuous wave laser beam,
With
The first portion of the work made of the first material is cut by the laser beam of the pulse wave, and the second portion of the work made of a second material different from the first material of the continuous wave is cut. A cutting device that cuts with laser light.

(Appendix 2)
The continuous wave laser beam is irradiated so that an unirradiated region of the continuous wave laser beam is generated on the side of the second portion from the boundary between the first portion and the second portion, and the pulse is generated. Irradiate the unirradiated area with a wave laser beam.
The cutting device according to Appendix 1.

(Appendix 3)
When the unirradiated region is irradiated with the laser beam of the pulse wave, the amount of heat input to the work by the laser beam of the pulse wave is larger than that when the laser beam of the pulse wave is irradiated to the first portion. Make it bigger,
The cutting device according to Appendix 2.

It is possible to cut a plurality of parts of the work to satisfy the cutting quality.

1 ... cutting device, 10 ... pulse wave laser optical oscillator, 11 ... continuous wave laser optical oscillator, 12, 13 ... scanner, 14 ... control device.

Claims (6)

A cutting device that cuts a workpiece with laser light.
A pulse wave laser optical oscillator that oscillates a pulse wave laser beam,
A continuous wave laser optical oscillator that oscillates a continuous wave laser beam,
With
The first portion of the work made of the first material is cut by the laser beam of the pulse wave, and the second portion of the work made of a second material different from the first material of the continuous wave is cut. Cut with laser light ,
The thickness of the first portion is thinner than the thickness of the second portion.
The work is a strip-shaped electrode in which an active material layer is formed on a predetermined portion of a strip-shaped metal foil.
The first portion is a portion of the strip-shaped electrode made of only the metal foil.
The second portion is a portion in which the active material layer is formed on the metal foil of the strip-shaped electrode.
Cutting device. A first scanner that changes the irradiation direction of the laser beam of the pulse wave oscillated by the pulse wave laser optical oscillator along the cut portion in the first portion of the work.
A second scanner that changes the irradiation direction of the continuous wave laser beam oscillated by the continuous wave laser optical oscillator along the cutting portion in the second portion of the work.
The cutting device according to claim 1. A cutting device that cuts a workpiece with laser light.
A pulse wave laser optical oscillator that oscillates a pulse wave laser beam,
A continuous wave laser optical oscillator that oscillates a continuous wave laser beam,
The spot of the laser beam of the pulse wave is relatively moved so as to cut the first portion made of the first material of the work by the laser beam of the pulse wave, and the spot of the laser beam of the pulse wave is relatively moved with the first material of the work. Is a control device that relatively moves the spot of the continuous wave laser beam so as to cut the second portion made of a different second material by the continuous wave laser beam.
Bei to give a,
The thickness of the first portion is thinner than the thickness of the second portion.
The work is a strip-shaped electrode in which an active material layer is formed on a predetermined portion of a strip-shaped metal foil.
The first portion is a portion of the strip-shaped electrode made of only the metal foil.
The second portion, Ru Oh in the portion where the active material layer is formed on the metal foil of the strip electrodes, the cutting device. Equipped with a first scanner and a second scanner
The control device relatively moves the spot of the laser beam of the pulse wave under the control of the first scanner, and relatively moves the spot of the laser beam of the continuous wave under the control of the second scanner.
The cutting device according to claim 3 . The control device spots the continuous wave laser beam so that an unirradiated region of the continuous wave laser beam is generated on the side of the second portion from the boundary between the first portion and the second portion. Along with the relative movement, the spot of the laser light of the pulse wave is relatively moved so that the laser light of the pulse wave is irradiated to the unirradiated region.
The cutting device according to claim 3 or 4 . When the control device irradiates the unirradiated region with the laser beam of the pulse wave, the work by the laser beam of the pulse wave is compared with the case of irradiating the first portion with the laser beam of the pulse wave. The pulse wave laser optical oscillator is controlled so that the amount of heat input to the device is large.
The cutting device according to claim 5 .