JPWO2016194702A1 - Electronic equipment - Google Patents

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JPWO2016194702A1
JPWO2016194702A1 JP2017521838A JP2017521838A JPWO2016194702A1 JP WO2016194702 A1 JPWO2016194702 A1 JP WO2016194702A1 JP 2017521838 A JP2017521838 A JP 2017521838A JP 2017521838 A JP2017521838 A JP 2017521838A JP WO2016194702 A1 JPWO2016194702 A1 JP WO2016194702A1
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case
circuit board
elastic member
electronic device
push button
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JP6475830B2 (en
Inventor
駿 宮▲崎▼
駿 宮▲崎▼
尚 佐々木
尚 佐々木
哲 沼田
哲 沼田
栄人 牛来
栄人 牛来
誠治 時田
誠治 時田
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Alps Alpine Co Ltd
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Alps Electric Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/08—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using ultrasonic vibrations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Casings For Electric Apparatus (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)

Abstract

電子部品８が実装された回路基板２０と、回路基板２０を内部に収容した状態で超音波溶着法により加工されるケース１０と、回路基板２０とケース１０との間に介在する弾性部材３０とを備えており、回路基板２０は弾性部材３０を介して間接的にケース１０に固定される。回路基板２０が弾性部材３０を介して間接的にケース１０に固定されるため、ケース１０が超音波溶着法によって加工される際、回路基板２０上の電子部品８へ超音波の振動が伝わり難くなる。A circuit board 20 on which the electronic component 8 is mounted, a case 10 processed by an ultrasonic welding method in a state in which the circuit board 20 is accommodated therein, and an elastic member 30 interposed between the circuit board 20 and the case 10 The circuit board 20 is indirectly fixed to the case 10 via the elastic member 30. Since the circuit board 20 is indirectly fixed to the case 10 via the elastic member 30, when the case 10 is processed by the ultrasonic welding method, it is difficult for ultrasonic vibration to be transmitted to the electronic component 8 on the circuit board 20. Become.

Description

本発明は、超音波溶着法によって加工されるケースの内部に電子部品が内蔵された電子装置に関するものである。   The present invention relates to an electronic device in which an electronic component is built in a case processed by an ultrasonic welding method.

超音波溶着法は、熱可塑性樹脂のパーツ同士を接触させて超音波の振動と圧力を加えることにより溶着させる技術であり、様々な産業分野で広く利用されている。   The ultrasonic welding method is a technique in which thermoplastic resin parts are brought into contact with each other and welded by applying ultrasonic vibration and pressure, and is widely used in various industrial fields.

電子部品が実装された回路基板を収容するケースに超音波溶着加工を施す場合、超音波の振動が回路基板に伝達し、電子部品が振動の影響を受ける場合がある。下記の特許文献１には、上下に分割された樹脂ケースの両端部をそれぞれ超音波溶着する際に、一端部に加える超音波振動と他端部に加える超音波振動とが１８０度の位相差を持つようにした超音波溶着法が記載されている。これにより、ケースの両端部から伝搬する振動がケースの中央部分で互いに打ち消し合うため、ケースの中央部分に配置された回路基板上の電子部品が振動の影響を受け難くなる。   When ultrasonic welding is performed on a case that accommodates a circuit board on which electronic components are mounted, ultrasonic vibrations may be transmitted to the circuit board and the electronic components may be affected by the vibrations. In Patent Document 1 below, when both ends of a resin case divided into upper and lower parts are ultrasonically welded, the ultrasonic vibration applied to one end and the ultrasonic vibration applied to the other end are 180 degrees in phase difference. An ultrasonic welding method is described which has As a result, vibrations propagating from both ends of the case cancel each other out at the central part of the case, so that the electronic components on the circuit board disposed in the central part of the case are not easily affected by the vibration.

特開２００４−１８１６５４号公報JP 2004-181654 A

しかしながら、上記特許文献に記載された超音波溶着法では、ケースの中央部分に電子部品を配置させる必要があるため、電子部品を自由な位置に配置できないという問題がある。また、ケースや回路基板の形状によっては、ケースの中央部分であっても適切に振動がキャンセルされない場合があり得るため、ケースや回路基板の形状が制約されるという問題もある。   However, in the ultrasonic welding method described in the above-mentioned patent document, there is a problem that the electronic component cannot be arranged at a free position because it is necessary to arrange the electronic component in the central portion of the case. Further, depending on the shape of the case or the circuit board, vibration may not be canceled appropriately even in the central portion of the case, so that there is a problem that the shape of the case or the circuit board is restricted.

本発明はかかる事情に鑑みてなされたものであり、その目的は、超音波溶着法によって加工されるケースの内部の電子部品へ超音波の振動を伝わり難くすることができるとともに、電子部品の配置やケースの形状の自由度を高めることができる電子装置を提供することにある。   The present invention has been made in view of such circumstances, and the object thereof is to make it difficult to transmit ultrasonic vibration to the electronic components inside the case processed by the ultrasonic welding method, and to arrange the electronic components. Another object of the present invention is to provide an electronic device that can increase the degree of freedom of the shape of the case.

本発明に係る電子装置は、電子部品が実装された回路基板と、前記回路基板を内部に収容した状態で超音波溶着法により加工されるケースと、前記回路基板と前記ケースとの間に介在する弾性部材とを備え、前記回路基板は、前記弾性部材を介して間接的に前記ケースに固定される。
上記の構成によれば、前記回路基板が前記弾性部材を介して間接的に前記ケースに固定されるため、前記ケースが超音波溶着法によって加工される際、前記回路基板上の前記電子部品へ超音波の振動が伝わり難くなる。また、前記電子部品の配置や前記ケースの形状に応じて前記電子部品への振動の伝搬が大きく変化しないため、前記電子部品の配置や前記ケースの形状の自由度が向上する。An electronic device according to the present invention includes a circuit board on which electronic components are mounted, a case processed by an ultrasonic welding method in a state where the circuit board is accommodated therein, and an intervening between the circuit board and the case. And the circuit board is indirectly fixed to the case via the elastic member.
According to said structure, since the said circuit board is indirectly fixed to the said case via the said elastic member, when the said case is processed by the ultrasonic welding method, to the said electronic component on the said circuit board It is difficult to transmit ultrasonic vibration. Further, since the propagation of vibration to the electronic component does not change greatly depending on the arrangement of the electronic component and the shape of the case, the degree of freedom in the arrangement of the electronic component and the shape of the case is improved.

好適に、前記弾性部材は、前記回路基板の一方の面と前記ケースとの間に挟まれた第１弾性部材と、前記回路基板の他方の面と前記ケースとの間に挟まれた第２弾性部材とを含んでよい。
上記の構成によれば、前記回路基板が両面から前記第１弾性部材及び前記第２弾性部材によって挟まれるため、前記ケースの内部で前記回路基板が安定に固定される。Preferably, the elastic member includes a first elastic member sandwiched between one surface of the circuit board and the case, and a second sandwiched between the other surface of the circuit board and the case. And an elastic member.
According to said structure, since the said circuit board is pinched | interposed by the said 1st elastic member and the said 2nd elastic member from both surfaces, the said circuit board is stably fixed inside the said case.

好適に、前記ケースは、超音波溶着法によって溶着される第１ケース部材及び第２ケース部材を有してよい。前記第１弾性部材は、前記回路基板の一方の面と前記第１ケース部材との間に挟まれてよい。前記第２弾性部材は、前記回路基板の他方の面と前記第２ケース部材との間に挟まれてよい。前記回路基板は、前記超音波溶着法による溶着の際、前記第１ケース部材及び前記第２ケース部材に加えられる圧力の方向と前記一方の面及び前記他方の面とが垂直になる姿勢で前記ケースの内部に収容されてよい。
上記の構成によれば、前記超音波溶着法による溶着の際、前記第１ケース部材及び前記第２ケース部材に加えられる圧力の方向と、前記回路基板の前記一方の面及び前記他方の面とが垂直になるため、前記第１弾性部材及び前記第２弾性部材を前記圧力によって圧縮させつつ、前記第１ケース部材及び前記第２ケース部材を超音波溶着させることが可能になる。これにより、前記ケースの内部で前記回路基板がより安定に固定される。Preferably, the case may include a first case member and a second case member that are welded by an ultrasonic welding method. The first elastic member may be sandwiched between one surface of the circuit board and the first case member. The second elastic member may be sandwiched between the other surface of the circuit board and the second case member. When the circuit board is welded by the ultrasonic welding method, the pressure direction applied to the first case member and the second case member and the one surface and the other surface are perpendicular to each other. It may be housed inside the case.
According to the above configuration, the direction of pressure applied to the first case member and the second case member during the welding by the ultrasonic welding method, the one surface and the other surface of the circuit board, Therefore, it is possible to ultrasonically weld the first case member and the second case member while compressing the first elastic member and the second elastic member by the pressure. Thereby, the circuit board is more stably fixed inside the case.

好適に、前記第１ケース部材及び前記第２ケース部材の一方は、前記回路基板及び前記弾性部材を収容する空間を有してよい。前記第１ケース部材及び前記第２ケース部材の他方は、前記空間の開口部を塞ぐ板状の部材でよい。   Preferably, one of the first case member and the second case member may have a space for accommodating the circuit board and the elastic member. The other of the first case member and the second case member may be a plate-like member that closes the opening of the space.

好適に、前記回路基板の一方の面に当接する前記第１弾性部材の当接面の少なくとも一部と、前記回路基板の他方の面に当接する前記第２弾性部材の当接面の少なくとも一部とが、前記回路基板を間に挟んで対向してよい。
上記の構成によれば、前記第１弾性部材の当接面と前記第２弾性部材の当接面とが対向して前記回路基板を間に挟んだ場所において、前記回路基板の位置が安定的に定まり易くなるため、前記ケースの内部で前記回路基板が安定に固定される。Preferably, at least one of the contact surfaces of the first elastic member that contacts one surface of the circuit board and at least one of the contact surfaces of the second elastic member that contacts the other surface of the circuit board. May be opposed to each other with the circuit board interposed therebetween.
According to said structure, the position of the said circuit board is stable in the place which the contact surface of the said 1st elastic member and the contact surface of the said 2nd elastic member oppose, and pinched | interposed the said circuit board between them Therefore, the circuit board is stably fixed inside the case.

好適に、前記第１弾性部材及び前記第２弾性部材の少なくとも一方は、前記回路基板の縁部の全周に当接してよい。
上記の構成によれば、前記回路基板が厚み方向と垂直な方向へずれ難くなるため、前記ケースの内部で前記回路基板が安定に固定される。Preferably, at least one of the first elastic member and the second elastic member may contact the entire periphery of the edge portion of the circuit board.
According to said structure, since the said circuit board becomes difficult to shift | deviate to the direction perpendicular | vertical to the thickness direction, the said circuit board is stably fixed inside the said case.

好適に、上記電子装置は、押しボタンと、前記回路基板の前記一方の面に実装されたスイッチとを備えてよい。前記ケースは、前記押しボタンが貫通する孔と、前記孔の周り囲んで立設され、前記第１弾性部材に向かって突出し、前記押しボタンによって押下される前記第１弾性部材の押下領域の周りを囲むように前記第１弾性部材と当接する立設部とを有してよい。前記スイッチは、前記押しボタンの押下によって変形した前記第１弾性部材と当接する位置に実装されてよい。
上記の構成によれば、前記立設部が前記孔の周りを囲んで立設されており、また、前記押しボタンによって押下される前記第１弾性部材の押下領域の周りを囲むように前記第１弾性部材と前記立設部とが当接する。そのため、前記押しボタンと前記孔との隙間から前記ケースの内部に侵入した水は、前記立設部と前記第１弾性部材とによって仕切られた空間内に留まり、前記ケースの更に内部へ侵入し難くなる。Preferably, the electronic device may include a push button and a switch mounted on the one surface of the circuit board. The case is provided with a hole through which the push button passes, and a surrounding area around the hole, protrudes toward the first elastic member, and surrounds a pressing region of the first elastic member that is pressed by the push button. And a standing portion that comes into contact with the first elastic member. The switch may be mounted at a position in contact with the first elastic member deformed by pressing the push button.
According to the above configuration, the standing portion is erected around the hole, and the first elastic member is pressed by the push button so as to surround the pressing region of the first elastic member. 1 Elastic member and the said standing part contact | abut. Therefore, the water that has entered the case through the gap between the push button and the hole remains in the space partitioned by the standing portion and the first elastic member, and further enters the case. It becomes difficult.

好適に、上記電子装置は、前記ケースに固定されるコネクタと、前記コネクタが実装されたコネクタ用基板と、前記コネクタ用基板と前記回路基板とを接続する可撓性ケーブルとを備えてよい。
上記の構成によれば、前記ケースへの超音波溶着加工によって前記コネクタ用基板に超音波の振動が伝搬しても、前記コネクタ用基板と前記回路基板とが前記可撓性ケーブルによって接続されるため、前記コネクタ用基板から前記回路基板へ振動が伝わり難くなる。Preferably, the electronic device may include a connector fixed to the case, a connector board on which the connector is mounted, and a flexible cable that connects the connector board and the circuit board.
According to the above configuration, even when ultrasonic vibration propagates to the connector substrate by ultrasonic welding to the case, the connector substrate and the circuit substrate are connected by the flexible cable. For this reason, vibration is hardly transmitted from the connector board to the circuit board.

本発明によれば、回路基板が弾性部材を介して間接的にケースに固定されるため、超音波溶着法によって加工されるケースの内部の電子部品へ超音波の振動を伝わり難くすることができるとともに、電子部品の配置やケースの形状の自由度を高めることができる。   According to the present invention, since the circuit board is indirectly fixed to the case via the elastic member, it is possible to make it difficult for ultrasonic vibrations to be transmitted to the electronic components inside the case processed by the ultrasonic welding method. At the same time, the degree of freedom of the arrangement of electronic components and the shape of the case can be increased.

本発明の実施形態に係る電子装置の一例を示す第１の図である。図１Ａは、押しボタンが配置される面からみた電子装置の斜視図である。図１Ｂは、図１Ａに示す電子装置の分解斜視図である。It is a 1st figure which shows an example of the electronic device which concerns on embodiment of this invention. FIG. 1A is a perspective view of an electronic device as seen from a surface on which a push button is arranged. 1B is an exploded perspective view of the electronic device shown in FIG. 1A. 本発明の実施形態に係る電子装置の一例を示す第２の図である。図２Ａは、押しボタンが配置される面の反対側の面からみた電子装置の斜視図である。図２Ｂは、図２Ａに示す電子装置の分解斜視図である。It is a 2nd figure which shows an example of the electronic device which concerns on embodiment of this invention. FIG. 2A is a perspective view of the electronic device as seen from the surface opposite to the surface on which the push button is disposed. 2B is an exploded perspective view of the electronic device shown in FIG. 2A. 本発明の実施形態に係る電子装置のＡ−Ａ線断面図である。It is an AA line sectional view of an electronic device concerning an embodiment of the present invention.

以下、図１〜図３を参照して、本発明の実施形態に係る電子装置１を説明する。
図１Ａ及び図２Ａは、本実施形態に係る電子装置１の斜視図であり、押しボタン５を有する正面側から見た図と、その反対側の面から見た図をそれぞれ示す。図１Ｂ及び図２Ｂは、図１Ａ及び図２Ａに対応する分解斜視図を示す。図３は、本実施形態に係る電子装置１のＡ−Ａ線断面図である。Hereinafter, an electronic apparatus 1 according to an embodiment of the present invention will be described with reference to FIGS.
FIG. 1A and FIG. 2A are perspective views of the electronic device 1 according to this embodiment, and show a view from the front side having the push button 5 and a view from the opposite side. 1B and 2B show exploded perspective views corresponding to FIGS. 1A and 2A. FIG. 3 is a cross-sectional view of the electronic device 1 according to the present embodiment, taken along line AA.

本実施形態に係る電子装置１は、超音波溶着法によって加工されるケース１０の内部に、振動の影響を受け易い電子部品が実装された回路基板２０を収容したものである。この電子部品は、例えば、ＭＥＭＳ（ｍｉｃｒｏ ｅｌｅｃｔｒｏ ｍｅｃｈａｎｉｃａｌ ｓｙｓｔｅｍｓ）を備えたセンサ（加速度センサ，角速度センサ等）である。電子装置１は、ケース１０と回路基板２０との間に介在した弾性部材３０を有しており、弾性部材３０を回路基板２０とともにケース１０の内部に収容する。回路基板２０は、この弾性部材３０を介して間接的にケース１０に固定される。従って、ケース１０に超音波溶着の振動が加わっても、弾性部材３０によって振動が減衰するため、回路基板２０の電子部品にはケース１０からの振動が伝わり難くい。   The electronic device 1 according to the present embodiment accommodates a circuit board 20 on which electronic components that are easily affected by vibration are mounted in a case 10 processed by an ultrasonic welding method. This electronic component is, for example, a sensor (acceleration sensor, angular velocity sensor, or the like) provided with MEMS (micro electro mechanical systems). The electronic device 1 has an elastic member 30 interposed between the case 10 and the circuit board 20, and accommodates the elastic member 30 together with the circuit board 20 in the case 10. The circuit board 20 is indirectly fixed to the case 10 via the elastic member 30. Accordingly, even when ultrasonic welding vibration is applied to the case 10, the vibration is attenuated by the elastic member 30, and therefore vibration from the case 10 is not easily transmitted to the electronic components of the circuit board 20.

ケース１０は、角に丸みを帯びた直方体状の形状に形成されており、超音波溶着法により溶着加工される第１ケース部材１１と第２ケース部材１２を有する。第１ケース部材１１は、回路基板２０や弾性部材３０を収容するための空間１１ｅを有する。第２ケース部材１２は、この空間１１ｅの開口部を塞ぐ板状の部材である。空間１１ｅの開口部に面する第１ケース部材１１の内縁部１１ｓには、第２ケース部材１２の縁１２ｃに当接する当接面１１ｃと、第２ケース部材１２の内面１２ａに当接する当接面１１ｂとが設けられている。第２ケース部材１２は、この内縁部１１ｓの段差において第１ケース部材１１と超音波溶着される。超音波溶着の際、第２ケース部材１２は、図の矢印Ｐの方向（開口部からみた空間１１ｅの奥行き方向）に向かって圧力を加えられる。   The case 10 is formed in a rectangular parallelepiped shape with rounded corners, and includes a first case member 11 and a second case member 12 that are welded by an ultrasonic welding method. The first case member 11 has a space 11 e for accommodating the circuit board 20 and the elastic member 30. The second case member 12 is a plate-like member that closes the opening of the space 11e. The inner edge portion 11s of the first case member 11 facing the opening of the space 11e has a contact surface 11c that contacts the edge 12c of the second case member 12 and a contact surface that contacts the inner surface 12a of the second case member 12. A surface 11b is provided. The second case member 12 is ultrasonically welded to the first case member 11 at the step of the inner edge portion 11s. During ultrasonic welding, pressure is applied to the second case member 12 in the direction of the arrow P in the figure (the depth direction of the space 11e as viewed from the opening).

回路基板２０は、四隅が面取りされた矩形の形状を持ち、部品の実装面（２１，２２）が矢印Ｐ（超音波溶着時の圧力方向）に対して垂直となる姿勢でケース１０の内部に収容される。回路基板２０の第１ケース部材１１側の面２１（一方の面）には、後述する押しボタン５によって作動するスイッチ７（例えばメンブレンスイッチなど）が実装される。回路基板２０の第２ケース部材１２側の面２２（他方の面）には、ＭＥＭＳを備えたセンサ８（加速度センサ，角速度センサなど）が実装される。その他、回路基板２０には種々の電子部品が実装される。   The circuit board 20 has a rectangular shape with four corners chamfered, and the mounting surface (21, 22) of the component is in the case 10 with a posture perpendicular to the arrow P (pressure direction during ultrasonic welding). Be contained. On the surface 21 (one surface) of the circuit board 20 on the first case member 11 side, a switch 7 (for example, a membrane switch) that is operated by a push button 5 described later is mounted. A sensor 8 (acceleration sensor, angular velocity sensor, etc.) equipped with MEMS is mounted on the surface 22 (the other surface) of the circuit board 20 on the second case member 12 side. In addition, various electronic components are mounted on the circuit board 20.

本実施形態に係る電子装置１は、外部の機器との間で信号をやり取りするためのケーブル等が接続されるコネクタ２と、コネクタ２が実装されたコネクタ用基板４０を有する。第１ケース部材１１は、コネクタ２を貫通して固定するための孔１１ｄを有する。孔１１ｄは、コネクタ２の未使用時に防水用のキャップ３で塞ぐことができる。   The electronic device 1 according to the present embodiment includes a connector 2 to which a cable or the like for exchanging signals with an external device is connected, and a connector substrate 40 on which the connector 2 is mounted. The first case member 11 has a hole 11 d for penetrating and fixing the connector 2. The hole 11d can be closed with a waterproof cap 3 when the connector 2 is not used.

コネクタ用基板４０は、ケース１０の内部に収容されており、第１ケース部材１１に立設された２本の支柱１１ｋによって一方の面が支えられるとともに、第２ケース部材１２の内面１２ａに立設された２本の支柱１２ｂによって他方の面が支えられる。支柱１１ｋは円柱状のボスを備えており、このボスの側面がコネクタ用基板４０の側縁の溝部に係合することで、コネクタ用基板４０の面と平行な方向の位置が固定される。図の例において、コネクタ用基板４０の横にはバッテリ４が配置される。   The connector substrate 40 is accommodated in the case 10, and one surface thereof is supported by the two columns 11 k erected on the first case member 11, and stands on the inner surface 12 a of the second case member 12. The other surface is supported by the two supporting columns 12b. The column 11k is provided with a cylindrical boss, and the position in the direction parallel to the surface of the connector substrate 40 is fixed by engaging the side surface of the boss with the groove on the side edge of the connector substrate 40. In the illustrated example, the battery 4 is disposed beside the connector board 40.

第１ケース部材１１と第２ケース部材１２が超音波溶着される際、振動がコネクタ２とコネクタ用基板４０に伝わる。本実施形態では、この振動が回路基板２０へ伝わり難くなるようにするため、回路基板２０とコネクタ用基板４０とが可撓性ケーブル６によって接続される。可撓性ケーブル６の一方の端子部６ａが回路基板２０に接続され、他方の端子部６ｂがコネクタ用基板４０に接続される。   When the first case member 11 and the second case member 12 are ultrasonically welded, vibration is transmitted to the connector 2 and the connector substrate 40. In the present embodiment, the circuit board 20 and the connector board 40 are connected by the flexible cable 6 so that the vibration is not easily transmitted to the circuit board 20. One terminal portion 6 a of the flexible cable 6 is connected to the circuit board 20, and the other terminal portion 6 b is connected to the connector substrate 40.

弾性部材３０は、回路基板２０を間に挟み込んだ２つの部材（第１弾性部材３１，第２弾性部材３２）を有する。第１弾性部材３１は回路基板２０の一方の面２１と第１ケース部材１１の内面１１ｆとの間に挟まれ、第２弾性部材３２は回路基板２０の他方の面２２と第２ケース部材１２の内面１２ａとの間に挟まれる。   The elastic member 30 includes two members (a first elastic member 31 and a second elastic member 32) that sandwich the circuit board 20 therebetween. The first elastic member 31 is sandwiched between one surface 21 of the circuit board 20 and the inner surface 11 f of the first case member 11, and the second elastic member 32 is the other surface 22 of the circuit board 20 and the second case member 12. Between the inner surface 12a and the inner surface 12a.

第１弾性部材３１は、１つの面に開口部が設けられた略箱型の容器の形状を持つ。第１弾性部材３１の開口部に面した内縁部３１ｓには、回路基板２０の縁２３に当接する当接面３１ｃと、回路基板２０の一方の面２１に当接する当接面３１ｂとが設けられている。回路基板２０は、この内縁部３１ｓの段差において第１弾性部材３１と嵌合する。回路基板２０の縁２３の全周が内縁部３１ｓの当接面３１ｃに当接しているため、回路基板２０は厚み方向と垂直な方向（面２１，２２と平行な方向）へずれを生じ難い。第１弾性部材３１の開口部と反対側の面３１ａは、第１ケース部材１１の内面１１ｆに当接する。   The first elastic member 31 has a substantially box-shaped container shape having an opening on one surface. The inner edge portion 31 s facing the opening of the first elastic member 31 is provided with a contact surface 31 c that contacts the edge 23 of the circuit board 20 and a contact surface 31 b that contacts one surface 21 of the circuit board 20. It has been. The circuit board 20 is fitted to the first elastic member 31 at the step of the inner edge portion 31s. Since the entire circumference of the edge 23 of the circuit board 20 is in contact with the contact surface 31c of the inner edge portion 31s, the circuit board 20 is unlikely to be displaced in a direction perpendicular to the thickness direction (a direction parallel to the surfaces 21 and 22). . A surface 31 a opposite to the opening of the first elastic member 31 contacts the inner surface 11 f of the first case member 11.

第２弾性部材３２は、略直方体状の形状を持ち、対向する２つの面（３２ａ，３２ｂ）を空洞部３２ｄが貫通している。第２弾性部材３２の面３２ａは、第２ケース部材１２の内面１２ａに当接する。第２弾性部材３２の面３２ｂは、回路基板２０の面２２に当接するととともに第１弾性部材３１の額縁部３１ｇに当接する。第２弾性部材３２の側面には、回路基板２０の面２２に配置された可撓性ケーブル６の端子部６ａを避けるように切り欠き部３２ｃが形成される。   The second elastic member 32 has a substantially rectangular parallelepiped shape, and the cavity portion 32d penetrates two opposing surfaces (32a, 32b). The surface 32 a of the second elastic member 32 is in contact with the inner surface 12 a of the second case member 12. The surface 32 b of the second elastic member 32 contacts the surface 22 of the circuit board 20 and contacts the frame portion 31 g of the first elastic member 31. A cutout portion 32 c is formed on the side surface of the second elastic member 32 so as to avoid the terminal portion 6 a of the flexible cable 6 disposed on the surface 22 of the circuit board 20.

なお、空洞部３２ｄは、回路基板２０の面２２に実装される部品を避けるためのものであるため、部品の高さが低い場合には、面３２ａにおける空洞部３２ｄの開口部を塞いで、第１弾性部材３１と同様な箱型容器の形状としてもよい。   Since the cavity 32d is for avoiding components mounted on the surface 22 of the circuit board 20, when the height of the component is low, the opening of the cavity 32d on the surface 32a is blocked, It is good also as the shape of the box-shaped container similar to the 1st elastic member 31.

本実施形態に係る電子装置１は、回路基板２０に実装されたスイッチ７を作動させるための押しボタン５を備える。押しボタン５は略円筒状の形状を持ち、丸みを帯びた一方の端部が第１ケース部材１１の孔１１ａを貫通する。押しボタン５の他方の端部は、抜け止め用のフランジ部５ａを有する。   The electronic device 1 according to the present embodiment includes a push button 5 for operating the switch 7 mounted on the circuit board 20. The push button 5 has a substantially cylindrical shape, and one rounded end passes through the hole 11 a of the first case member 11. The other end portion of the push button 5 has a flange portion 5a for retaining.

押しボタン５は、第１弾性部材３１の面３１ａに設けられた押下領域３１ｅに当接する。押しボタン５が押下されると、押下領域３１ｅを中心として第１弾性部材３１が変形し、押下領域３１ｅの反対側の面に設けられた突起３１ｆがスイッチ７と当接することにより、スイッチ７が作動する。   The push button 5 abuts on a push area 31 e provided on the surface 31 a of the first elastic member 31. When the push button 5 is pressed, the first elastic member 31 is deformed around the pressing area 31e, and the protrusion 31f provided on the opposite surface of the pressing area 31e contacts the switch 7, whereby the switch 7 is Operate.

押しボタン５が貫通する第１ケース部材１１の孔１１ａの周囲には、第１弾性部材３１に向かって突出した立設部１１ｇが立設される。この立設部１１ｇは、押下領域３１ｅの周りを囲むように第１弾性部材３１と当接する。押下領域３１ｅの周りにはリング状の凹部３１ｄが形成されており、立設部１１ｇのリング状の先端部が凹部３１ｄの底面に当接する。孔１１ａと押しボタン５の隙間から侵入した水は、立設部１１ｇと第１弾性部材３１とによって仕切られた空間内に留まる。   Around the hole 11a of the first case member 11 through which the push button 5 passes, an upright portion 11g protruding toward the first elastic member 31 is erected. The standing portion 11g abuts on the first elastic member 31 so as to surround the pressing region 31e. A ring-shaped recess 31d is formed around the pressing area 31e, and the ring-shaped tip of the standing portion 11g contacts the bottom surface of the recess 31d. The water that has entered through the gap between the hole 11a and the push button 5 remains in the space partitioned by the standing portion 11g and the first elastic member 31.

第１弾性部材３１の面３１ａが当接する第１弾性部材３１の内面１１ｆには、第１弾性部材３１及び第２弾性部材３２の位置を所定の場所に合わせるためのリブ１１ｒが形成される。リブ１１ｒは、回路基板２０を挟み込んだ状態の第１弾性部材３１及び第２弾性部材３２の側面部を囲むように形成される。   On the inner surface 11f of the first elastic member 31 with which the surface 31a of the first elastic member 31 abuts, a rib 11r for adjusting the positions of the first elastic member 31 and the second elastic member 32 to a predetermined place is formed. The rib 11r is formed so as to surround the side portions of the first elastic member 31 and the second elastic member 32 in a state where the circuit board 20 is sandwiched therebetween.

上述した構成を有する本実施形態に係る電子装置１によれば、次のような効果が得られる。   According to the electronic apparatus 1 according to the present embodiment having the above-described configuration, the following effects can be obtained.

（１）回路基板２０が弾性部材３０を介して間接的にケース１０に固定されることにより、ケース１０が超音波溶着法によって加工される際、回路基板２０上の電子部品へ超音波の振動が伝わり難くなるため、電子部品への振動の影響を低減できる。また、回路基板２０における電子部品の配置や、ケース１０の形状、回路基板２０の形状などに応じて電子部品への振動の伝搬が大きく変化しないため、前記電子部品への振動の伝搬を抑制しつつ、電子部品の配置やケース１０等の形状の自由度を向上できる。 (1) When the circuit board 20 is indirectly fixed to the case 10 via the elastic member 30, when the case 10 is processed by the ultrasonic welding method, ultrasonic vibration is applied to the electronic components on the circuit board 20. Since it becomes difficult to transmit, the influence of vibration on the electronic component can be reduced. Further, since the propagation of vibration to the electronic component does not change greatly depending on the arrangement of the electronic component on the circuit board 20, the shape of the case 10, the shape of the circuit board 20, etc., the propagation of vibration to the electronic component is suppressed. However, the degree of freedom of the arrangement of the electronic components and the shape of the case 10 can be improved.

（２）回路基板２０が両面から第１弾性部材３１及び第２弾性部材３２によって挟まれるため、ケース１０の内部において回路基板２０を安定に固定することができる。 (2) Since the circuit board 20 is sandwiched between the first elastic member 31 and the second elastic member 32 from both sides, the circuit board 20 can be stably fixed inside the case 10.

（３）超音波溶着法による溶着の際、第１ケース部材１１及び第２ケース部材１２に加えられる圧力の方向（矢印Ｐ）と、回路基板２０の部品の実装面（２１，２２）とが垂直になる姿勢で、回路基板２０がケース１０の内部に収容される。第２ケース部材１２から第１ケース部材１１へ矢印Ｐの方向に圧力が加わると、第１ケース部材１１と回路基板２０との間に挟まれた第１弾性部材３１が圧縮されるとともに、第２ケース部材１２と回路基板２０との間に挟まれた第２弾性部材３２が圧縮される。第１弾性部材３１の圧縮により生じた弾性力は回路基板２０の面２１と垂直な方向に作用し、第２弾性部材３２の圧縮により生じた弾性力は回路基板２０の面２２と垂直な方向に作用する。そのため、超音波溶着の際、面２１，２２と平行な方向へ回路基板２０が位置ずれを生じ難くなる。また、超音波溶着法による溶着が完了した後も、ケース１０の内部で第１弾性部材３１及び第２弾性部材３２の圧縮状態が維持されるため、回路基板２０のガタつきを抑制し、ケース１０内で回路基板２０を安定した位置に固定できる。 (3) At the time of welding by the ultrasonic welding method, the direction of the pressure (arrow P) applied to the first case member 11 and the second case member 12 and the component mounting surfaces (21, 22) of the circuit board 20 are The circuit board 20 is accommodated in the case 10 in a vertical posture. When pressure is applied from the second case member 12 to the first case member 11 in the direction of arrow P, the first elastic member 31 sandwiched between the first case member 11 and the circuit board 20 is compressed, and the first The second elastic member 32 sandwiched between the two case member 12 and the circuit board 20 is compressed. The elastic force generated by the compression of the first elastic member 31 acts in a direction perpendicular to the surface 21 of the circuit board 20, and the elastic force generated by the compression of the second elastic member 32 is a direction perpendicular to the surface 22 of the circuit board 20. Act on. Therefore, during ultrasonic welding, the circuit board 20 is less likely to be displaced in a direction parallel to the surfaces 21 and 22. In addition, since the compressed state of the first elastic member 31 and the second elastic member 32 is maintained inside the case 10 even after the welding by the ultrasonic welding method is completed, the play of the circuit board 20 is suppressed, and the case The circuit board 20 can be fixed in a stable position within the circuit 10.

（４）第１弾性部材３１の当接面３１ｂと第２弾性部材３２の当接面３２ｂとが対向して回路基板２０を両面から挟んだ場所において、回路基板２０の位置が安定的に定まり易くなるため、ケース１０の内部において回路基板２０を安定に固定できる。 (4) The position of the circuit board 20 is stably determined where the contact surface 31b of the first elastic member 31 and the contact surface 32b of the second elastic member 32 face each other and sandwich the circuit board 20 from both surfaces. Therefore, the circuit board 20 can be stably fixed inside the case 10.

（５）回路基板２０の縁２３の全周が第１弾性部材３１の内縁部３１ｓに当接しているため、回路基板２０が厚み方向と垂直な方向（面２１，２２と平行な方向）へずれを生じ難くすることができる。これにより、ケース１０の内部において回路基板２０を安定に固定できる。 (5) Since the entire circumference of the edge 23 of the circuit board 20 is in contact with the inner edge 31s of the first elastic member 31, the circuit board 20 is in a direction perpendicular to the thickness direction (a direction parallel to the surfaces 21 and 22). Deviation can be made difficult to occur. Thereby, the circuit board 20 can be stably fixed inside the case 10.

（６）立設部１１ｇが押しボタン５の孔１１ａの周りを囲んで立設されており、押しボタン５によって押下される第１弾性部材３１の押下領域３１ｅの周りを囲むように第１弾性部材３１と立設部１１ｇとが当接している。これにより、押しボタン５と孔１１ａとの隙間からケース１０の内部に水が侵入しても、侵入した水は立設部１１ｇと第１弾性部材３１とによって仕切られた空間内に留まる。従って、ケース１０の外側に突出した押しボタン５を設けた場合でも、ケース１０の内部へ水を侵入し難くすることが可能となり、高い防水性能を得ることができる。 (6) The first elastic portion 11g is erected so as to surround the hole 11a of the push button 5 and surrounds the pressing region 31e of the first elastic member 31 pressed by the push button 5. The member 31 and the standing portion 11g are in contact with each other. Thus, even if water enters the case 10 through the gap between the push button 5 and the hole 11a, the water that has entered stays in the space partitioned by the standing portion 11g and the first elastic member 31. Therefore, even when the push button 5 protruding outside the case 10 is provided, it is possible to make it difficult for water to enter the inside of the case 10, and high waterproof performance can be obtained.

（７）ケース１０に固定されたコネクタ２が実装されるコネクタ用基板４０と回路基板２０とを可撓性ケーブル６によって接続しているため、ケース１０への超音波溶着加工によってコネクタ用基板４０に超音波の振動が伝搬しても、コネクタ用基板４０から回路基板２０へ振動を伝わり難くすることができる。 (7) Since the connector board 40 on which the connector 2 fixed to the case 10 is mounted and the circuit board 20 are connected by the flexible cable 6, the connector board 40 is formed by ultrasonic welding to the case 10. Even if ultrasonic vibration propagates to the circuit board 20, it is difficult to transmit the vibration from the connector board 40 to the circuit board 20.

本発明は上述した実施形態には限定されない。
すなわち、当業者は、本発明の技術的範囲またはその均等の範囲内において、上述した実施形態の構成要素に関し、様々な変更、コンビネーション、サブコンビネーション、並びに代替を行ってもよい。The present invention is not limited to the embodiment described above.
That is, those skilled in the art may make various modifications, combinations, subcombinations, and alternatives regarding the components of the above-described embodiments within the technical scope of the present invention or an equivalent scope thereof.

上述した実施形態におけるケースの形状や回路基板の形状、電子部品の配置などは一例であり、本発明はこの例に限定されない。   The shape of the case, the shape of the circuit board, the arrangement of the electronic components, and the like in the embodiment described above are examples, and the present invention is not limited to this example.

上述した実施形態では弾性部材が２つの部材（第１弾性部材３１，第２弾性部材３２）によって構成されているが、本発明はこの例に限定されない。本発明の他の実施形態では、例えば、１枚の弾性部材を折ってその間に挟み込むように回路基板を配置させてもよい。   In the embodiment described above, the elastic member is constituted by two members (the first elastic member 31 and the second elastic member 32), but the present invention is not limited to this example. In another embodiment of the present invention, for example, the circuit board may be arranged so that one elastic member is folded and sandwiched therebetween.

上述した実施形態では、振動の影響を受け易い電子部品の例としてＭＥＭＳを含んだ加速度センサ等のＩＣを挙げたが、本発明の他の実施形態では、水晶振動子を備えたＩＣや、セラミック・ガラスなどを用いた部品などを電子部品として回路基板に実装してもよい。   In the above-described embodiment, an IC such as an acceleration sensor including a MEMS is cited as an example of an electronic component that is easily affected by vibration. However, in another embodiment of the present invention, an IC including a crystal resonator, a ceramic, -A component using glass or the like may be mounted on the circuit board as an electronic component.

１…電子装置、２…コネクタ、３…キャップ、４…バッテリ、５…押しボタン、６…可撓性ケーブル、７…スイッチ、８…センサ、１０…ケース１、１１…第１ケース部材、１１ａ…孔、１１ｅ…空間、１１ｇ…立設部、１２…第２ケース部材、２０…回路基板、３０…弾性部材、３１…第１弾性部材、３１ｅ…押下領域、３２…第２弾性部材、４０…コネクタ用基板。
DESCRIPTION OF SYMBOLS 1 ... Electronic device, 2 ... Connector, 3 ... Cap, 4 ... Battery, 5 ... Push button, 6 ... Flexible cable, 7 ... Switch, 8 ... Sensor, 10 ... Case 1, 11 ... 1st case member, 11a DESCRIPTION OF SYMBOLS ... Hole, 11e ... Space, 11g ... Standing part, 12 ... Second case member, 20 ... Circuit board, 30 ... Elastic member, 31 ... First elastic member, 31e ... Push-down area, 32 ... Second elastic member, 40 ... Board for connectors.

Claims (8)

電子部品が実装された回路基板と、
前記回路基板を内部に収容した状態で超音波溶着法により加工されるケースと、
前記回路基板と前記ケースとの間に介在する弾性部材とを備え、
前記回路基板は、前記弾性部材を介して間接的に前記ケースに固定される
ことを特徴とする電子装置。A circuit board on which electronic components are mounted;
A case processed by an ultrasonic welding method in a state in which the circuit board is housed inside;
An elastic member interposed between the circuit board and the case;
The circuit board is fixed to the case indirectly through the elastic member. 前記弾性部材は、
前記回路基板の一方の面と前記ケースとの間に挟まれた第１弾性部材と、
前記回路基板の他方の面と前記ケースとの間に挟まれた第２弾性部材とを含む
ことを特徴とする請求項１に記載の電子装置。The elastic member is
A first elastic member sandwiched between one surface of the circuit board and the case;
The electronic apparatus according to claim 1, further comprising a second elastic member sandwiched between the other surface of the circuit board and the case. 前記ケースは、超音波溶着法によって溶着される第１ケース部材及び第２ケース部材を有し、
前記第１弾性部材は、前記回路基板の一方の面と前記第１ケース部材との間に挟まれ、
前記第２弾性部材は、前記回路基板の他方の面と前記第２ケース部材との間に挟まれ、
前記回路基板は、前記超音波溶着法による溶着の際、前記第１ケース部材及び前記第２ケース部材に加えられる圧力の方向と前記一方の面及び前記他方の面とが垂直になる姿勢で前記ケースの内部に収容される
ことを特徴とする請求項２に記載の電子装置。The case has a first case member and a second case member that are welded by an ultrasonic welding method,
The first elastic member is sandwiched between one surface of the circuit board and the first case member,
The second elastic member is sandwiched between the other surface of the circuit board and the second case member,
When the circuit board is welded by the ultrasonic welding method, the pressure direction applied to the first case member and the second case member and the one surface and the other surface are perpendicular to each other. The electronic device according to claim 2, wherein the electronic device is housed in a case. 前記第１ケース部材及び前記第２ケース部材の一方が、前記回路基板及び前記弾性部材を収容する空間を有し、
前記第１ケース部材及び前記第２ケース部材の他方が、前記空間の開口部を塞ぐ板状の部材である
ことを特徴とする請求項３に記載の電子装置。One of the first case member and the second case member has a space for accommodating the circuit board and the elastic member,
The electronic device according to claim 3, wherein the other of the first case member and the second case member is a plate-like member that closes the opening of the space. 前記回路基板の一方の面に当接する前記第１弾性部材の当接面の少なくとも一部と、前記回路基板の他方の面に当接する前記第２弾性部材の当接面の少なくとも一部とが、前記回路基板を間に挟んで対向する
ことを特徴とする請求項２乃至４の何れか一項に記載の電子装置。At least a part of the contact surface of the first elastic member that contacts one surface of the circuit board and at least a part of the contact surface of the second elastic member that contacts the other surface of the circuit board. The electronic device according to claim 2, wherein the electronic device faces each other with the circuit board interposed therebetween. 前記第１弾性部材及び前記第２弾性部材の少なくとも一方が、前記回路基板の縁部の全周に当接する
ことを特徴とする請求項５に記載の電子装置。6. The electronic device according to claim 5, wherein at least one of the first elastic member and the second elastic member is in contact with an entire circumference of an edge portion of the circuit board. 押しボタンと、
前記回路基板の前記一方の面に実装されたスイッチとを備え、
前記ケースは、
前記押しボタンが貫通する孔と、
前記孔の周りを囲んで立設され、前記第１弾性部材に向かって突出し、前記押しボタンによって押下される前記第１弾性部材の押下領域の周りを囲むように前記第１弾性部材と当接する立設部と
を有し、
前記スイッチは、前記押しボタンの押下によって変形した前記第１弾性部材と当接する位置に実装される
ことを特徴とする請求項２乃至６の何れか一項に記載の電子装置。A push button,
A switch mounted on the one surface of the circuit board,
The case is
A hole through which the push button passes,
It stands up around the hole, protrudes toward the first elastic member, and abuts on the first elastic member so as to surround the pressing area of the first elastic member pressed by the push button. And a standing part,
The electronic device according to any one of claims 2 to 6, wherein the switch is mounted at a position in contact with the first elastic member deformed by pressing the push button. 前記ケースに固定されるコネクタと、
前記コネクタが実装されたコネクタ用基板と、
前記コネクタ用基板と前記回路基板とを接続する可撓性ケーブルと
を備えることを特徴とする請求項２乃至７の何れか一項に記載の電子装置。
A connector fixed to the case;
A connector substrate on which the connector is mounted;
The electronic device according to claim 2, further comprising: a flexible cable that connects the connector board and the circuit board.
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