JPWO2016171054A1 - Copper alloy sheet and manufacturing method thereof - Google Patents

Abstract

The present invention provides a copper alloy sheet or the like that can stably obtain required characteristics such as spring characteristics regardless of the direction in which a sample (for example, a terminal material) having a predetermined shape is collected from the sheet. The copper alloy sheet of the present invention contains Sn, 0.8-3.0 mass%, Ni, 0.1-1.0 mass%, and P, 0.002-0.15 mass%, and the balance is Cu and inevitable impurities, and the rolling texture This rolling texture has an orientation density of α-fiber (φ1 = 0 ° to 45 °) obtained from the texture analysis by EBSD within the range of 3.0 to 25.0, and β-fiber (φ2 = The orientation density of 45 ° to 90 °) satisfies the range of 3.0 to 30.0.

Description

  The present invention relates to a copper alloy sheet and a method for producing the same, and particularly suitable for use in parts for electrical and electronic equipment and automobile parts such as connectors, lead frames, heat dissipation members, relays, switches, sockets, and the like. The present invention relates to a copper alloy sheet and a manufacturing method thereof.

  Properties required for copper alloy sheets used in parts for electrical and electronic equipment and automotive parts, such as connectors, lead frames, heat dissipation members, relays, switches, sockets, etc. include proof stress (yield stress), Examples include tensile strength, Young's modulus (longitudinal elastic modulus), bending workability, fatigue resistance, stress relaxation resistance, and conductivity. In recent years, electronic device parts and automobile parts have become increasingly necessary to improve the required characteristics as described above, along with downsizing, weight reduction, high-density mounting, and higher usage environment temperatures. Among these, it is required to develop a plate material with a higher Young's modulus.

  For example, a copper alloy plate material used for a component (for example, a terminal) of a connector for an electronic device has been studied to reduce the weight and reduce the amount of material used by reducing the thickness and width of the plate material. At this time, in order to secure the contact pressure of the leaf spring portion of the terminal, if it is attempted to increase the displacement of the terminal, it is impossible to achieve both reduction in size of the component. Therefore, in order to obtain a large stress with a small amount of displacement, a material having a high Young's modulus is required.

  In addition, in a battery portion of an electronic device, a high-current connector for an automobile, and the like, a thick material having a plate thickness of 0.5 mm or more is usually used because it is necessary to increase a cross-sectional area of a conduction portion. However, even if the thick material is subjected to a forming process and bent into a predetermined shape, there is a problem that spring back is likely to occur thereafter, and the shape as designed cannot be obtained. Therefore, in order to reduce the amount of springback after bending deformation, it is preferable to use a material having a high Young's modulus. In particular, the direction in which the terminals (contacts) constituting the connector are collected from the plate material by punching or the like is usually the plate width direction TD of 90 ° with respect to the rolling direction, but complicated deformation (bending) is caused. In the case of a connector to be added, there are cases in which contacts must be collected in directions other than 90 ° (for example, in the direction of 0 °). For this reason, the collected terminals were not only in the direction of 90 ° with respect to the rolling direction but also stressed in directions other than 90 °, and it was assumed that bending deformation was applied. It is preferable that the Young's modulus of the terminal is high in both directions of 0 ° and 90 ° with respect to the rolling direction at the time of rolling, and that the difference in Young's modulus (anisotropy of Young's modulus) is small. A complicated bending process is a design in which a plurality of bending processes of 0 ° and 90 ° are included in one connector, and all of them are spring-loaded. In addition, the bent portion includes a 180 ° U-shaped process and molding with a thin plate thickness, and there is a design that places a high load on the material. Including these, it is shown as a complicated bending process.

  Furthermore, in the case of a large current connector (the current value of a connector for electronic devices or the like is approximately 1 A or more in the case of EV or HEV), the material itself heats up to a high temperature due to Joule heat generated when a large current flows. As a result, stress relaxation occurs, and accompanying this, there is a problem that “sagging” (deterioration of spring characteristics) tends to occur in the terminal. Since the contact pressure tends to decrease due to this “sag” during use, the initial contact pressure cannot be maintained, so as a copper alloy plate material used for parts such as connector terminals, It is also required to have excellent stress relaxation resistance.

  Conventionally, copper alloy materials such as brass have been widely used as materials for electronic device parts in addition to iron-based materials. For copper alloy materials, it is common to use a method of improving strength by a combination of solid solution strengthening by adding a solid solution component such as Sn or Zn and work hardening by cold working such as rolling or wire drawing. However, a copper alloy material strengthened only by this method generally has a low electrical conductivity, and is not suitable for use as an electrical conductor (for example, a terminal) of parts for electric / electronic devices and parts for automobiles.

  As a known technique for increasing the Young's modulus of a copper alloy sheet material used for parts for electrical and electronic equipment and automobile parts, the present applicant relates to the integration of atomic planes in the width direction TD of the rolled sheet in Patent Document 1, for example. The area ratio of the region having an atomic plane whose angle between the normal of the (111) plane and the sheet width direction TD is within 20 ° exceeds 50%, whereby the Young's modulus in the width direction TD of the rolled sheet A copper alloy sheet with excellent stress relaxation properties was proposed.

JP 2012-180593 A

  Patent Document 1 is a technique in which the Young's modulus in the plate width direction TD is controlled by setting the area ratio of crystal grains with the (111) plane facing the plate width direction TD to exceed 50%, but is parallel to the rolling direction. Since the control of the Young's modulus in a specific direction RD was not considered, when the direction in which the terminals (contacts) constituting the connector are sampled from the plate material is a direction other than 90 °, sufficient spring characteristics are obtained. Sometimes it was not possible.

  Therefore, an object of the present invention is to control the crystal orientation in the biaxial orthogonal direction (that is, the direction RD parallel to the rolling direction and the plate width direction TD) in the rolling surface of the plate material, and to achieve both the RD and TD Young's modulus. By increasing both while reducing the anisotropy as much as possible, the copper alloy can stably obtain the required characteristics such as spring characteristics regardless of the direction in which a sample of a predetermined shape (for example, a terminal material) is taken from the plate material. It is in providing a board | plate material and its manufacturing method.

  The present inventors have studied copper alloys suitable for parts for electric and electronic devices and automobile parts. In a Sn—Ni—P-based copper alloy sheet, α-fiber and β- It has been found that by properly controlling the fiber orientation density, both the RD and TD Young's moduli can be increased to a high level while minimizing the difference as compared with the conventional alloy sheet. Thereby, since it uses as a material of a connector and a lead frame, a predetermined | prescribed spring characteristic can be stably acquired irrespective of the direction which extract | collects material from a board | plate material. Moreover, the manufacturing method for implement | achieving the above rolling texture was also discovered. As a result of intensive studies based on these findings, the present invention has been achieved.

That is, the gist configuration of the present invention is as follows.
(1) It has an alloy composition containing 0.8 to 3.0 mass% of Sn, 0.1 to 1.0 mass% of Ni and 0.002 to 0.15 mass% of P, with the balance being Cu and inevitable impurities. A copper alloy sheet for electrical and electronic equipment having a rolling texture, wherein the rolling texture is an orientation density of α-fiber (φ ₁ = 0 ° to 45 °) obtained from a texture analysis by EBSD. However, the orientation density of β-fiber (φ ₂ = 45 ° to 90 °) is within the range of 3.0 to 30.0, within the range of 3.0 to 25.0. Copper alloy sheet.

(2) 0.8 to 3.0 mass% of Sn, 0.1 to 1.0 mass% of Ni and 0.002 to 0.15 mass% of P, and further 0.1 to 0.3 mass% of Zn , Fe is contained in an amount of 0.005 to 0.2 mass% and Pb is contained in an amount of 0.05 to 0.1 mass%, and Zn, Fe and Pb are contained in a total amount of 0.01 to 0.50 mass%, and the balance is Cu and inevitable. A copper alloy sheet for electrical and electronic equipment having an alloy composition composed of impurities and having a rolling texture, wherein the rolling texture is α-fiber (φ ₁ = 0 °) obtained from a texture analysis by EBSD. Azimuth density in the range of 3.0 to 25.0 and β-fiber (φ ₂ = 45 ° to 90 °) in the range of 3.0 to 30.0. A copper alloy sheet characterized by satisfying

(3) When rolling, the direction parallel to the rolling direction is RD, the sheet width direction is TD, the Young's modulus of the _RD is E _RD , and the Young's modulus of the _TD is E _TD , the E _RD and the E _TD is at any 120GPa or more and wherein the ratio of the _{E TD} of the _{E RD (E RD / E TD} ) is 0.85 or more, according to the above (1) or (2) Copper alloy sheet.

(4) A method for producing a copper alloy sheet for electrical and electronic equipment according to (1), (2) or (3) above, wherein a rolled material obtained by casting a copper alloy having the alloy composition is used. A homogenization heat treatment step for performing a homogenization heat treatment, a hot rolling step for performing hot rolling on the material to be rolled after the homogenization heat treatment step, and a cooling step for cooling after the hot rolling step. A chamfering process for chamfering both surfaces of the material to be rolled after the cooling process, a first cold rolling process for performing cold rolling with a total processing rate of 80% or more after the chamfering process, After the first cold rolling step, the heating rate is 10.0 to 60.0 ° C./min, the ultimate temperature is 200 to 400 ° C., the holding time is 1 to 12 hours, and the cooling rate is 1.0 to 10.0 ° C. 1st annealing process which heat-processes on the conditions of / min, and after this 1st annealing process, ultimate temperature is 800 degrees C or less and 1st annealing A second annealing step in which further heat treatment is performed under a temperature condition higher than the step, a second cold rolling step in which further cold rolling is performed after the second annealing step, and a final step after the second cold rolling step. A method for producing a copper alloy sheet comprising a temper annealing step for performing a heat treatment.

According to the present invention, an alloy containing 0.8 to 3.0 mass% of Sn, 0.1 to 1.0 mass% of Ni and 0.002 to 0.15 mass% of P, with the balance being Cu and inevitable impurities. A copper alloy sheet for electrical and electronic equipment having a composition and a rolled texture, wherein the rolled texture is obtained from a texture analysis by EBSD, α-fiber (φ ₁ = 0 ° to 45 °) Is in the range of 3.0 to 25.0, and the orientation density of β-fiber (φ ₂ = 45 ° to 90 °) is in the range of 3.0 to 30.0. It has become possible to provide a copper alloy sheet that can stably obtain required characteristics such as spring characteristics regardless of the direction in which a sample (eg, terminal material) having a predetermined shape is collected from the sheet. In particular, this copper alloy sheet is suitable for use in parts for electrical and electronic equipment and automobile parts, such as connectors, lead frames, heat radiating members, relays, switches, sockets and the like. Moreover, according to the manufacturing method of the copper alloy sheet according to the present invention, the copper alloy sheet can be preferably manufactured.

FIG. 1 is a typical crystal orientation distribution diagram of a copper alloy sheet measured by EBSD and obtained from an ODF (orientation distribution function) analysis, which is a biaxial orthogonal direction in a rolling plane, The Euler angles in the three directions of the parallel direction RD and the sheet width direction TD and the normal direction ND of the rolled surface are shown, that is, the RD axis orientation rotation is Φ, the ND axis orientation rotation is Φ ₁ , and the TD axis orientation shows the rotating [Phi _2. FIG. 2 is a crystal orientation distribution diagram of a rolled texture of a pure copper type β-fiber, and is a diagram showing the azimuth rotation Φ ₂ of the TD axis of the ODF divided at 5 ° intervals. FIG. 3 is a crystal orientation distribution diagram of the rolling texture of the alloy type α-fiber, and shows the ODF TD axis orientation rotation Φ ₂ divided at intervals of 5 °. FIG. 4 is a diagram showing the relationship between Φ ₁ and orientation density in α-fiber obtained by ODF analysis of the rolling texture of the copper alloy sheet material (Example 1) according to the present invention. FIG. 5 is a diagram showing the relationship between Φ ₂ and orientation density in β-fiber obtained by ODF analysis of the rolling texture of the copper alloy sheet material (Example 1) according to the present invention.

Hereinafter, preferred embodiments of the copper alloy sheet of the present invention will be described in detail.
The copper alloy sheet material according to the present invention contains Sn of 0.8 to 3.0 mass%, Ni of 0.1 to 1.0 mass% and P of 0.002 to 0.15 mass%, with the balance being Cu and inevitable impurities. A copper alloy sheet for electrical and electronic equipment having a rolled texture, wherein the rolled texture is α-fiber (φ ₁ = 0 ° to 45-45) obtained from a texture analysis by EBSD. ) Is 3.0 to 25.0 and β-fiber (φ ₂ = 45 ° to 90 °) has an azimuth density of 3.0 to 30.0.

  Here, “copper alloy material” means a copper alloy material (before processing and having a predetermined alloy composition) processed into a predetermined shape (for example, plate, strip, foil, bar, wire, etc.) Means. Among them, the plate material refers to a material having a specific thickness and being stable in shape and having a spread in the surface direction, and in a broad sense, includes a strip material. In the present invention, the thickness of the plate material is not particularly limited, but is preferably 0.05 to 1.0 mm, and more preferably 0.1 to 0.8 mm. In addition, although the copper alloy plate material of this invention prescribes | regulates the characteristic with the integration rate of the atomic surface in the predetermined direction of a rolled sheet, this should just have such a characteristic as a copper alloy plate material. Therefore, the shape of the copper alloy sheet is not limited to a sheet or strip. In the present invention, the pipe material can also be interpreted and handled as a plate material.

[Ingredient composition]
It shows about a component composition and its effect | action of the copper alloy board | plate material of this invention.
(Essential additive element)
The copper alloy sheet of the present invention contains Sn in a range of 0.8 to 3.0 mass%, Ni in a range of 0.1 to 1.0 mass%, and P in a range of 0.002 to 0.15 mass%. By setting the contents of Sn, Ni, and P within the above ranges, Ni and P compounds can be precipitated to improve the strength and stress relaxation resistance of the copper alloy sheet. Further, the texture changes depending on the solid solution and precipitation state of Sn, Ni and P in the matrix, and by setting the above range, a texture in which α-fiber and β-fiber are mixed is obtained. High Young's modulus can be obtained. Moreover, a synergistic effect can be show | played about the improvement of a stress relaxation characteristic by containing Ni and P with Sn. Sn is 0.8 to 3.0 mass%, Ni is 0.1 to 1.0 mass%, P is 0.002 to 0.15 mass%, preferably, Sn is 0.85 to 2.7 mass% and Ni is 0. .15 to 0.95 mass%, P is contained in 0.03 to 0.09 mass%. This is because, when the content of at least one component among these elements is too much than the above range, the electrical conductivity is lowered, and when the content is too small, the above effects cannot be obtained sufficiently.

(Optional addition element)
In addition to the essential additive components of Sn, Ni, and P, the copper alloy sheet material of the present invention further includes, as optional additive elements, 0.1 to 0.3 mass% of Zn and 0.005 to 0.005 Fe. 2 mass% and 0.05 to 0.1 mass% of Pb can be contained.

(0.1 to 0.3 mass% Zn)
Zn is an element that has the effect of improving the stress relaxation resistance and remarkably improving the brittleness of the solder. However, when the Zn content is less than 0.1 mass%, such an effect cannot be exhibited sufficiently, and when it exceeds 0.3 mass%, there is a possibility that the conductivity deteriorates. For this reason, it is preferable that Zn content shall be 0.1-0.3 mass%.

(0.005-0.2 mass% Fe)
Fe precipitates finely as a compound or as a simple substance, and contributes to precipitation hardening. Moreover, it precipitates with the magnitude | size of 50-500 nm as a compound, and there exists an effect which makes a crystal grain size fine by suppressing grain growth, and makes bending workability favorable. For this reason, it is preferable that Fe content shall be 0.005-0.2 mass%. If the Fe content is less than 0.005 mass%, the above effect cannot be obtained. If the Fe content is more than 0.2 mass%, it dissolves in the matrix and deteriorates the conductivity.

(0.05 to 0.1 mass% Pb)
Pb alone disperses in the parent phase, thereby improving the machinability during press working and cutting. This is because the single Pb is lower in hardness than the parent phase, so that the cutting process is easy. For this reason, it is preferable that Pb content shall be 0.05-0.1 mass%. If the Pb content is less than 0.05 mass%, the above effect cannot be obtained. If the Pb content is more than 0.1 mass%, it dissolves in the matrix and deteriorates the conductivity.

(Zn, Fe and Pb are contained in a total of 0.01 to 0.50 mass%)
It is preferable to contain 0.01 to 0.50 mass% of Zn, Fe and Pb in total. By making content of these arbitrary addition components into the said range in total, the said effect can fully be exhibited, without reducing electroconductivity. The total content of Zn, Fe and Pb is more preferably 0.05 to 0.30 mass%.

[Rolling texture]
The copper alloy sheet material of the present invention has a rolled texture, and this rolled texture has an orientation density of α-fiber (φ ₁ = 0 ° to 45 °) obtained by texture analysis by EBSD of 3 The orientation density of β-fiber (φ ₂ = 45 ° to 90 °) is in the range of 3.0 to 30.0 in the range of 0.0 to 25.0. The “orientation density” here is also expressed as a crystal orientation distribution function (ODF), where the random crystal orientation distribution is set to 1, and the number of times of accumulation is greater than that. It is used to quantitatively analyze the abundance ratio of the crystal orientation of the texture and the dispersion state. The orientation density is based on the EBSD and X-ray diffraction measurement results, and the crystal orientation distribution analysis by the series expansion method is based on three or more kinds of positive point map measurement data such as (100), (110), (112) positive point map. Calculated by the method.

In order to increase the Young's modulus of both RD and TD of the copper alloy sheet material, the present inventors have intensively studied the relationship with the rolling texture. As a result, after limiting the alloy composition to the above range, the orientation density of α-fiber (φ ₁ = 0 ° to 45 ° range) and β-fiber (φ ₂ = 45 ° to 90 ° range) It has been found that the Young's modulus of both RD and TD is increased by controlling the orientation density within an appropriate range. That is, the orientation density of α-fiber (φ ₁ = 0 ° to 45 °) obtained from the texture analysis by EBSD is in the range of 3.0 to 25.0, and β-fiber (φ ₂ = 45 When the azimuth density of (° to 90 °) is in the range of 3.0 or more and 30.0 or less, the Young's modulus of both RD and TD is increased, and the difference between the Young's moduli (anisotropy) ) Also decreases, and in the present invention, the orientation density of α-fiber (φ ₁ = 0 ° to 45 °) and the orientation density of β-fiber (φ ₂ = 45 ° to 90 °) are limited to the above ranges, respectively. did.

FIG. 1 is a typical crystal orientation distribution diagram of a copper alloy sheet measured by EBSD and obtained from an ODF (orientation distribution function) analysis, which is a biaxial orthogonal direction in a rolling plane, The Euler angles in the three directions of the parallel direction RD and the sheet width direction TD and the normal direction ND of the rolled surface are shown, that is, the RD axis orientation rotation is Φ, the ND axis orientation rotation is Φ ₁ , and the TD axis orientation shows the rotating [Phi _2. Here, α-fiber is accumulated in a range of φ ₁ = 0 ° to 45 °, and β-fiber is accumulated in a range of 45 ° to 90 ° of φ ₂ . 2 and 3 are diagrams in which the azimuth rotation Φ ₂ of the TD axis of the ODF is divided at intervals of 5 °, FIG. 2 shows a rolled texture of a pure copper type β-fiber, and FIG. 3 shows an alloy type α-fiber. Yes.

[EBSD method]
The EBSD method was used for the analysis of the rolling texture in the present invention. The EBSD method is an abbreviation for Electron BackScatter Diffraction, and is a crystal orientation analysis technique using reflected electron Kikuchi line diffraction that occurs when a sample is irradiated with an electron beam in a scanning electron microscope (SEM). In the EBSD measurement in the present invention, a sample area of 800 μm × 1600 μm containing 200 or more crystal grains was scanned and measured in 0.1 μm steps. The measurement area and the scanning step may be determined according to the size of crystal grains of the sample. Analysis software OIM Analysis (trade name) manufactured by TSL was used for analysis of crystal grains after measurement. Information obtained in the analysis of crystal grains by EBSD includes information up to a depth of several tens of nm at which the electron beam penetrates the sample. Further, the measurement location in the plate thickness direction is preferably near the position 1/8 to 1/2 times the plate thickness t from the sample surface.

In this specification, the crystal orientation display method includes a crystal plane index (h k l) perpendicular to the Z axis (parallel to the rolling plane (XY plane)) and a vertical axis (parallel to the YZ plane) to the X axis. Using the index [u v w] of the crystal direction, it is expressed in the form of (h k l) [u v w]. In addition, as for (1 3 2) [6 −4 3] and (2 3 1) [3 −4 6], the equivalent orientation under the symmetry of the copper alloy cubic crystal is the family ( A parenthesis representing the generic name is used, and {h k l} <u v w> is used. Typical crystal orientations include Brass orientation {011} <211>, S orientation {123} <634>, Copper orientation {112} <111>, Goss orientation {110} <001>, RDW orientation {012} <100. >, BR orientation {236} <385> and the like. Here, α-fiber is in the range of φ ₁ = 0 ° to 45 °, Goss orientation to Brass orientation, β-fiber is in the range of φ ₂ = 45 ° to 90 °, and Brass orientation to S orientation to Copper. It exists as a fiber texture that continuously changes in orientation. α-fiber is an alloy-type texture, β-fiber is a pure copper-type texture, and these two types of texture groups usually develop independently, but the alloy component of the copper alloy sheet material of the present invention is This is a mixed structure of pure copper type and alloy type, which is a structure obtained by controlling the additive elements Sn and Ni within a specified range. When both α-fiber and β-fiber are within the specified range, the Young's modulus of RD and TD is high, and the difference (anisotropy) between the RD and TD's Young's modulus is reduced.

[Young's modulus of RD and TD]
When the copper alloy sheet of the present invention is rolled, the direction parallel to the rolling direction is RD, the sheet width direction is TD, the Young's modulus of _RD is E _RD , and the Young's modulus of _TD is E _TD , E _RD and the _{E TD} is at any 120GPa or more and the ratio of the _{E TD} of the _{E RD (E RD / E TD} ) it is preferably 0.85 or more. Or Young's modulus _{E RD} and TD Young's modulus _{E TD} of the RD is at least 1-way is less than 120 GPa, or when the ratio _E RD _{/ E TD} for the _{E TD} of the _{E RD} is less than 0.85, copper This is because, depending on the direction in which a sample (for example, a terminal material) having a predetermined shape is taken from the alloy plate, required characteristics such as spring characteristics may not be satisfied.

[Method for producing copper alloy sheet of the present invention]
Next, an example of the method for producing a copper alloy sheet according to the present invention will be described below.
In the method for producing a copper alloy sheet according to the present invention, a homogenized heat treatment (at a holding temperature of 800 ° C. or higher and a holding time of 1 minute to 10 hours) is performed on an ingot obtained by melting and casting a copper alloy material (step 1). Step 2) is performed, and then hot rolling (Step 3) is performed with the total processing rate of 50% or more and a rolling temperature of 500 ° C. or more and the number of rolling is twice or more, followed by water cooling (Step 4). Thereafter, in order to remove the oxide film on the surface, both the front and back surfaces of the rolled material are each subjected to chamfering of 0.6 mm or more (step 5). Then, after performing 1st cold rolling (process 6) so that it may become 80% or more of a total processing rate, temperature rising rate 10.0-60.0 degree-C / min, ultimate temperature 200-400 degreeC, holding time 1 hour The first annealing (step 7) is performed at a cooling rate of 1.0 to 10.0 ° C./min for ˜12 hours, and then the temperature condition is 800 ° C. or lower and higher than the first annealing step, ie, The second annealing (step 8) is performed at an ultimate temperature of 400 to 800 ° C. and a holding time of 1 second to 10 minutes. Next, after performing the second cold rolling (step 9) at a rolling processing rate of 20% or more and the number of rolling times of 2 or more, temper annealing at an ultimate temperature of 350 to 600 ° C. and a holding time of 1 second to 2 hours ( Step 10) is performed. In this way, the copper alloy sheet material of the present invention is produced.

  The copper alloy material contains 0.8 to 3.0 mass% of Sn, 0.1 to 1.0 mass% of Ni, and 0.002 to 0.15 mass% of P. 1 to 0.3 mass%, Fe 0.005 to 0.2 mass% and Pb 0.05 to 0.1 mass%, and Zn, Fe and Pb in total 0.01 to 0.50 mass% The balance has an alloy composition composed of Cu and inevitable impurities.

The “rolling ratio” here is a value expressed as a percentage by dividing the value obtained by subtracting the cross-sectional area after rolling from the cross-sectional area before rolling by the cross-sectional area before rolling and multiplying by 100. That is, it is represented by the following formula.
[Rolling ratio] = {([Cross sectional area before rolling] − [Cross sectional area after rolling]) / [Cross sectional area before rolling]} × 100 (%)

  In the present invention, it is particularly important to control the first cold rolling step (step 6) and the first annealing step (step 7) in the above manufacturing method. That is, the first cold rolling (step 6) needs to be rolled so that the total processing rate is 80% or more in order to obtain the structure of the present invention. Further, in order to sufficiently develop the rolling texture and control the orientation density of α-fiber and β-fiber within an appropriate range, the first annealing step (step 7) has a temperature increase rate of 10.0 to 60. It is necessary to perform heat treatment under the conditions of 0 ° C./min, ultimate temperature of 200 to 400 ° C., holding time of 1 to 12 hours, and cooling rate of 1.0 to 10.0 ° C./min. Here, when the total processing rate of the first cold rolling 1 (step 6) is too low as less than 80%, the orientation is randomized by texture control in the first annealing step (step 7), and α-fiber and There is a tendency that the orientation density of β-fiber is below the specified range. Moreover, even if the total processing rate of the first cold rolling step (step 6) is 80% or more, at least the heating rate, the reached temperature, the holding time, and the cooling rate of the first annealing step (step 7). Similarly, when one is outside the proper range, the orientation is randomized by texture control, and the orientation density of α-fiber and β-fiber tends to fall below the specified range. Therefore, in this invention, the target structure | tissue and characteristic are obtained by adjusting and manufacturing the conditions of a 1st cold rolling process (process 6) and a 1st annealing process (process 7) appropriately.

  Hereinafter, the present invention will be described in more detail based on examples, but the present invention is not limited thereto.

(Examples 1-8 and Comparative Examples 1-7)
Examples 1 to 8 and Comparative Examples 1 to 7 of the present invention contain Sn, Ni, and P, and optional addition components that are added as necessary, so that the compositions shown in Table 1 are obtained, with the balance being Cu. A copper alloy material composed of unavoidable impurities was melted in a high-frequency melting furnace and cast (step 1) to obtain an ingot. The ingot is subjected to a homogenization heat treatment (step 2) with a holding temperature of 800 ° C. or more and a holding time of 1 minute to 10 hours, and then the number of rolling is over 2 times at a total processing rate of 50% or more and a rolling temperature of 500 ° C. or more. After performing the hot rolling (step 3), quenching by water cooling (step 4) is performed. Thereafter, in order to remove the oxide film on the surface, both the front and back surfaces of the rolled material are each subjected to chamfering of 0.6 mm or more (step 5). Then, after performing 1st cold rolling (process 6) with the total processing rate shown in Table 1, the 1st annealing (process 7) is performed on the heat processing conditions shown in Table 1, and the ultimate temperature 400-800 after that. The second annealing (step 8) is performed at a temperature of 1 ° C. for 10 seconds. Next, after performing the second cold rolling (step 9) at a rolling rate of 20% or more and a rolling number of times of 2 or more, temper annealing at an ultimate temperature of 350 to 600 ° C. and a holding time of 1 second to 2 hours [ Step 10] is performed. Thus, the copper alloy sheet material of the present invention was produced. Table 2 shows the production conditions in each Example and Comparative Example and the characteristics of the obtained specimens.

  The following characteristics were investigated for these test materials.

[Azimuth density of α-fiber and β-fiber by EBSD measurement]
The orientation density of α-fiber and β-fiber was measured by the EBSD method under the conditions of a measurement area of 128 × 10 ⁴ μm ² (800 μm × 1600 μm) and a scan step of 0.1 μm. The scan step was performed in 0.1 μm steps to measure fine crystal grains. In the analysis, ODF (azimuth distribution function), α-fiber, and β-fiber were confirmed from the EBSD measurement result of 128 × 10 ⁴ μm ^{2 in} the analysis. The electron beam uses thermoelectrons from a W filament of a scanning electron microscope as a generation source, and the probe diameter at the time of measurement is about 0.015 μm. Moreover, OIM5.0 (trade name) manufactured by TSL Solutions Co., Ltd. was used as a measuring device for the EBSD method. In addition, the measurement location was performed in the area | region which processed the plane part of the board | plate material by mechanical polishing and electrolytic polishing. Furthermore, the measurement location was made into five or more places along the plate | board thickness direction of a board | plate material, and the average orientation density was computed.

[Measurement of Young's modulus]
The test pieces are strip-shaped test pieces each having a width of 20 mm and a length of 200 mm in each of the test materials in a direction RD parallel to the rolling direction and a plate width direction TD (direction orthogonal to the rolling direction RD). The sample was collected, stress was applied in the length direction of the test piece with a tensile tester, and a proportional constant between strain and stress was calculated. The strain amount of 80% of the strain amount when yielding was set as the maximum displacement amount, the displacement up to the displacement amount was given by 10 divisions, and the proportional constant of strain and stress was obtained as Young's modulus from the measured values at the 10 points. .

[Conductivity (EC)]
The electrical conductivity of each test material was calculated from the numerical value of the specific resistance measured by the four-terminal method in a thermostat kept at 20 ° C. (± 0.5 ° C.). In addition, the distance between terminals was 100 mm. A case where the electrical conductivity of the plate material is 25% IACS or higher is judged as good, and a case where it is lower than 25% IACS is judged as bad.

From the results shown in Table 2, each of Examples 1 to 8 has an alloy composition, α-fiber (φ ₁ = 0 ° to 45 °) and β-fiber (φ ₂ = 45 ° to 90 °) orientation density. Since all are within the scope of the present invention, the Young's modulus E _{RD of RD} is 125 to 151 GPa, the Young's modulus E _{TD of TD} is 129 to 158 GPa, which is as high as 120 GPa or more, and the E _RD / E _TD ratio is It was 0.85-0.99 and 0.85 or more, and the anisotropy of Young's modulus E _{RD and} E _TD was small. On the other hand, in Comparative Examples 1 to 7, the lower limit values of the numerical ranges of the alloy composition, the α-fiber (φ ₁ = 0 ° to 45 °) and the β-fiber (φ ₂ = 45 ° to 90 °) orientation density And at least one of the upper limit values is outside the proper range of the present invention. In particular, in each of Comparative Examples 1, 2, 5, and 7, the Young's modulus E _{RD of RD} is smaller than 120 GPa. In all cases, the E _RD / E _TD ratio was smaller than 0.85.

FIG. 4 is a diagram showing a change in orientation density with respect to Φ ₁ (0 to 50 °) in α-fiber with respect to Example 1 and Comparative Example 1. FIG. 5 is related to Example 1 and Comparative Example 1. It is the figure which showed the change of the orientation density with respect to (PHI) ₂ (45-90 degrees) in (beta) -fiber. From these figures, in Example 1, the orientation density of α-fiber (φ ₁ = 0 ° to 45 °) and β-fiber (φ ₂ = 45 ° to 90 °) are both within the scope of the present invention. On the other hand, in Comparative Example 1, the numerical ranges of the orientation density of α-fiber (φ ₁ = 0 ° to 45 °) and β-fiber (φ ₂ = 45 ° to 90 °) are both in the present invention. You can see that it is out of range.

  ADVANTAGE OF THE INVENTION According to this invention, it becomes possible to provide the copper alloy board | plate material which can obtain stably required characteristics, such as a spring characteristic, irrespective of the direction which extract | collects the sample (for example, terminal material) of a predetermined shape from a board | plate material. It was. In particular, this copper alloy sheet material is applied to parts for electric / electronic devices and automobile parts, such as connectors, lead frames, heat dissipation members, relays, switches, sockets and the like.

(2) 0.8 to 3.0 mass% of Sn, 0.1 to 1.0 mass% of Ni and 0.002 to 0.15 mass% of P, and further 0.1 to 0.3 mass% of Zn , Fe is contained in an amount of 0.005 to 0.2 mass% and Pb is contained in an amount of 0.01 to 0.1 mass%, and Zn, Fe and Pb are contained in a total of 0.01 to 0.50 mass%, and the balance is Cu and inevitable. A copper alloy sheet for electrical and electronic equipment having an alloy composition composed of impurities and having a rolling texture, wherein the rolling texture is α-fiber (φ ₁ = 0 °) obtained from a texture analysis by EBSD. Azimuth density in the range of 3.0 to 25.0 and β-fiber (φ ₂ = 45 ° to 90 °) in the range of 3.0 to 30.0. A copper alloy sheet characterized by satisfying

Claims (4)

It has an alloy composition containing 0.8 to 3.0 mass% Sn, 0.1 to 1.0 mass% Ni and 0.002 to 0.15 mass% P, and the balance of Cu and inevitable impurities. A copper alloy sheet for electrical and electronic equipment having a texture,
In the rolled texture, the orientation density of α-fiber (φ ₁ = 0 ° to 45 °) obtained from the texture analysis by EBSD is in the range of 3.0 or more and 25.0 or less, and β-fiber ( A copper alloy sheet characterized by having an orientation density of φ ₂ = 45 ° to 90 °) satisfying a range of 3.0 to 30.0. It contains 0.8 to 3.0 mass% of Sn, 0.1 to 1.0 mass% of Ni, and 0.002 to 0.15 mass% of P, and further contains 0.1 to 0.3 mass% of Zn and Fe. 0.005 to 0.2 mass% and 0.05 to 0.1 mass% of Pb, and 0.01 to 0.50 mass% of Zn, Fe, and Pb in total, with the balance being Cu and inevitable impurities A copper alloy sheet for electrical and electronic equipment having an alloy composition and having a rolling texture,
In the rolled texture, the orientation density of α-fiber (φ ₁ = 0 ° to 45 °) obtained from the texture analysis by EBSD is in the range of 3.0 or more and 25.0 or less, and β-fiber ( A copper alloy sheet characterized by having an orientation density of φ ₂ = 45 ° to 90 °) satisfying a range of 3.0 to 30.0. When rolling, the direction parallel to the rolling direction is RD, the sheet width direction is TD, the Young's modulus of the _RD is E _RD , and the Young's modulus of the _TD is E _TD ,
Wherein said _{E RD} and the _{E TD} is not less both 120GPa or more and the ratio of the _{E TD} of the _{E RD (E RD / E TD} ) is 0.85 or more, according to claim 1 or 2 The copper alloy sheet material described in 1. A method for producing a copper alloy sheet for electrical and electronic equipment according to claim 1, 2 or 3,
A homogenization heat treatment step of performing a homogenization heat treatment on the material to be rolled obtained by casting the copper alloy having the alloy composition;
After the homogenization heat treatment step, a hot rolling step of performing hot rolling on the material to be rolled,
A cooling step for cooling after the hot rolling step;
After the cooling step, a chamfering step for chamfering both surfaces of the material to be rolled,
A first cold rolling step of performing cold rolling with a total processing rate of 80% or more after the chamfering step;
After the first cold rolling step, the temperature rising rate is 10.0 to 60.0 ° C / min, the ultimate temperature is 200 to 400 ° C, the holding time is 1 to 12 hours, and the cooling rate is 1.0 to 10.0. A first annealing step in which heat treatment is performed under the conditions of ° C / min;
A second annealing step in which after the first annealing step, the final temperature is 800 ° C. or lower and a further heat treatment is performed under a temperature condition higher than the first annealing step;
A second cold rolling step for performing further cold rolling after the second annealing step;
A method for producing a copper alloy sheet material comprising a temper annealing step of performing a final heat treatment after the second cold rolling step.