JPWO2016110941A1 - Mounting-related processing device, image processing method, and program thereof - Google Patents

Abstract

The mounting apparatus 11 captures an image related to the state of the component, extracts an external shape of the component existing in a predetermined detection area from the captured image, and based on the extracted information regarding the external shape of the component, the image of the component Is moved to a position where the image of the part enters, and the image data included in the capture area is output. In this mounting apparatus 11, for example, even if an image in which the position of a component is shifted is captured, the capture region is moved according to the extracted outer shape of the component, so that the capture region can be further reduced.

Description

  The present invention relates to a mounting-related processing device, an image processing method, and a program thereof, and more particularly to a mounting-related processing device, an image processing method, and a program thereof related to processing for mounting a component on a board.

  Conventionally, as a mounting apparatus, a plurality of areas of interest corresponding to each of a plurality of imaging objects (for example, sucked parts) in a stationary state are set in advance in an imaging area of an image sensor, and the area of interest is stationary. An image data acquisition condition is set in advance before imaging (see, for example, Patent Document 1).

Patent No. 5524495

  However, in the mounting apparatus described above, the target area is set in advance, but considering the positional deviation of the imaging target, the target area having a size obtained by adding a margin for safety to the maximum value of the component suction deviation amount It was necessary to set. In such an apparatus, the transfer amount of image data becomes large, and transfer may take time.

  The present invention has been made in view of such a problem, and a main object of the present invention is to provide a mounting related processing device, an image processing method, and a program thereof that can further reduce the transfer time of image data.

  The present invention adopts the following means in order to achieve the main object described above.

The mounting related processing device of the present invention
A mounting-related processing device that executes mounting-related processing related to processing for mounting a component on a board,
An imaging unit that captures an image relating to the state of the component;
In the captured image, the external shape of the part existing in the predetermined detection area is extracted, and the image of the part enters the predetermined capture area including the image of the part based on the extracted information regarding the external shape of the part. An area setting unit to be moved to the position;
An output unit for outputting image data included in the capture area;
It is equipped with.

  The apparatus captures an image related to the state of the component, extracts an external shape of the component existing in a predetermined detection area from the captured image, and extracts an image of the component based on the extracted information regarding the external shape of the component. A predetermined capture area including the image is moved to a position where an image of the part enters. This apparatus then outputs the image data included in the capture area. In this apparatus, for example, even if an image in which the position of a component is shifted is captured, the capture region is moved according to the extracted external shape of the component, so that the capture region can be further reduced. For this reason, the image data of the capture area to be output can be further reduced. Therefore, in this apparatus, the transfer time of image data can be further shortened. Here, the mounting-related processing device may be, for example, a mounting device that mounts components on a substrate, or may be an inspection device that inspects the state of components mounted on a substrate.

  In the mounting-related processing device of the present invention, the area setting unit may perform binarization processing on the detection area and extract the outer shape of the component. In this apparatus, the transfer time of image data can be further shortened by a relatively simple binarization process.

  In the mounting-related processing device of the present invention, the capture area may be a size smaller than the detection area. It is preferable from the viewpoint of transfer time that the capture area is closer to the component size and narrower. The detection area may be an area that can extract the outer shape of the component, and this is also preferably a narrower area from the viewpoint of the time of the outer shape extraction process.

  In the mounting-related processing device of the present invention, the area setting unit may change the size based on the extracted outer shape of the part and set the capture area. In this apparatus, the capture area can be further reduced, and the transfer time of image data can be further shortened. The initial value of the capture area can be a predetermined size based on the size of the part. Alternatively, in the mounting-related processing device of the present invention, the capture area may be set based on the size of the imaged component.

  In the mounting-related processing device of the present invention, the imaging unit includes an imaging element that generates charges by receiving light and outputs the generated charges, and an image processing unit that generates image data based on the output charges. The region setting unit may extract the external shape of the component when the charge is transferred from the image sensor and the image processing unit generates an image. In this apparatus, the external shape of the component can be extracted when the charge is transferred from the image sensor, so that the processing time from image capturing to image data output can be further shortened.

  The mounting-related processing device of the present invention includes a mounting unit that mounts a component on a board and a control unit that controls the mounting unit, and the output unit outputs the image data to the control unit. Good. By so doing, it is possible to further shorten the transfer time of the image data from the imaging unit to the control unit.

The image processing method of the present invention includes:
An image processing method in a mounting related process related to a process of mounting a component on a board,
(A) capturing an image relating to the state of the component;
(B) In the captured image, the outline of a part existing in a predetermined detection area is extracted, and a predetermined capture area including an image of the part is extracted based on the extracted information related to the outline of the part. Moving to the position where the image enters,
(C) outputting image data included in the capture area;
Is included.

  In this image processing method, as in the above-described mounting-related processing device, even if an image in which the position of the component is shifted is captured, the capture region is moved according to the extracted external shape of the component. It can be made smaller. For this reason, the image data of the capture area to be output can be further reduced. Therefore, in this apparatus, the transfer time of image data can be further shortened. In this image processing method, various aspects of the above-described mounting related processing device may be adopted, and steps for realizing each function of the above mounting related processing device may be added.

  The program of the present invention is one in which one or more computers execute the steps of the above-described image processing method. This program may be recorded on a computer-readable recording medium (for example, hard disk, ROM, FD, CD, DVD, etc.), or from a computer via a transmission medium (communication network such as the Internet or LAN). It may be distributed to another computer, or may be exchanged in any other form. If this program is executed by a single computer or if each step is shared and executed by a plurality of computers, each step of the above-described image processing method is executed, so that the same effect as this method can be obtained. .

1 is a schematic explanatory diagram illustrating an example of a mounting system 10. FIG. The block diagram showing the structure of the mounting apparatus. Explanatory drawing of components P1-P4 extract | collected by the mounting head 22. FIG. 6 is a flowchart illustrating an example of an image data output processing routine. Explanatory drawing of the detection area | region 61 and the capture | acquisition area | region 62 of the captured image 60. FIG.

  Preferred embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic explanatory diagram illustrating an example of the mounting system 10. FIG. 2 is a block diagram illustrating the configuration of the mounting apparatus 11. The mounting system 10 is a system that executes a mounting related process related to a process of mounting the component P on the board S. The mounting system 10 includes a mounting device 11 and a management computer 50. The mounting related processing includes, for example, mounting processing for placing the component P on the substrate S, inspection processing for inspecting the state of the component P placed on the substrate S, and the like. In the mounting system 10, a plurality of mounting apparatuses 11 that perform a mounting process for mounting a component P on a substrate S and an inspection device (not shown) that inspects the substrate S on which the component P is disposed are disposed from upstream to downstream. . In FIG. 1, only one mounting apparatus 11 is shown for convenience of explanation. In the present embodiment, the left-right direction (X-axis), the front-rear direction (Y-axis), and the up-down direction (Z-axis) are as shown in FIG.

  As illustrated in FIGS. 1 and 2, the mounting apparatus 11 includes a substrate transport unit 12, a mounting unit 13, a component supply unit 14, an imaging unit 30, and a control device 40. The substrate transport unit 12 is a unit that carries in, transports, fixes and unloads the substrate S at the mounting position. The substrate transport unit 12 has a pair of conveyor belts provided at intervals in the front-rear direction of FIG. 1 and spanned in the left-right direction. The board | substrate S is conveyed by this conveyor belt.

  The mounting unit 13 collects the component P from the component supply unit 14 and arranges it on the substrate S fixed to the substrate transport unit 12. The mounting unit 13 includes a head moving unit 20, a mounting head 22, and a suction nozzle 24. The head moving unit 20 includes a slider that is guided by the guide rail and moves in the XY directions, and a motor that drives the slider. The mounting head 22 is detachably mounted on the slider and is moved in the XY direction by the head moving unit 20. One or more suction nozzles 24 are detachably mounted on the lower surface of the mounting head 22. The mounting head 22 incorporates a Z-axis motor, and the height of the suction nozzle 24 is adjusted along the Z-axis by the Z-axis motor. The suction nozzle 24 collects the component P, and a negative pressure is supplied by a decompression pump (not shown), and the component P is sucked and held by this negative pressure.

  The component supply unit 14 includes a plurality of reels and is detachably attached to the front side of the mounting apparatus 11. A tape is wound around each reel, and a part P is held along the longitudinal direction on the surface of the tape. This tape is unwound from the reel toward the rear, and is sent out by the feeder unit to a sampling position where the tape is sucked by the suction nozzle 24 with the components exposed.

  The imaging unit 30 is a unit that images the component P adsorbed by the mounting head 22, and is disposed between the substrate transport unit 12 and the component supply unit 14. The imaging range of the imaging unit 30 is above the imaging unit 30. The imaging unit 30 includes an imaging device 31, a region setting unit 32, an image processing unit 33, and an output unit 34. The image sensor 31 generates charges by receiving light and outputs the generated charges. The image pickup device 31 may be a CCD image sensor provided with a photodiode or a CMOS image sensor. The area setting unit 32 performs a process of setting an image data capturing area based on the charge input from the image sensor 31 to the image processing unit 33. The region setting unit 32 is configured as a circuit that performs binarization processing and outline extraction processing in parallel with charge transfer. The region setting unit 32 performs binarization processing based on the charge of pixels included in a predetermined detection region and a predetermined threshold value. This threshold value is empirically determined as a value that can determine whether the pixel is a part region or a region other than a part. The size and position of the detection area are predetermined according to the position of each suction nozzle 24 of the mounting head 22 and the type of part to be sucked. Further, the region setting unit 32 performs an outline extraction process of the component P based on the result of the binarization process. The area setting unit 32 extracts the outline of a part existing in the detection area from the captured image, and sets a predetermined capture area including an image of the part based on the extracted information on the outline of the part. The process of moving to the position where the next image enters is performed. The image processing unit 33 generates image data based on the input charges. For example, the image processing unit 33 performs processing such as dark current correction, interpolation calculation, color space conversion, and gamma correction, and generates image data. The output unit 34 outputs a part or all of the generated image data to the control device 40. The imaging unit 30 images the component P sucked by the suction nozzle 24 when the suction nozzle 24 that sucked the component P passes over the imaging unit 30, and outputs the imaging result to the control device 40.

  As shown in FIG. 2, the control device 40 is configured as a microprocessor centered on a CPU 41, and includes a ROM 42 that stores a processing program, an HDD 43 that stores various data, a RAM 44 used as a work area, an external device and an electrical device. An input / output interface 45 for exchanging signals is provided, and these are connected via a bus 46. The control device 40 outputs a control signal to the substrate transport unit 12, the mounting unit 13, and the component supply unit 14 and inputs an image signal from the imaging unit 30.

  The management computer 50 is a computer that manages information of each device of the mounting system 10. The management computer 50 includes an input device 52 such as a keyboard and a mouse for an operator to input various commands, and a display 54 for displaying various information. The management computer 50 stores mounting condition information in a storage unit. The mounting condition information includes information such as the shape and size of the component P and the suction nozzle 24 used for suction.

  Next, the operation of the mounting system 10 of the present embodiment configured as described above, first, the mounting process of the mounting apparatus 11 will be described. When the mounting process is started, the CPU 41 of the control device 40 controls the mounting unit 13 so that the suction nozzle 24 corresponding to the component P to be collected is mounted on the mounting head 22 and the component P is collected from the component supply unit 14. FIG. 3 is an explanatory diagram of the components P <b> 1 to P <b> 4 collected by the mounting head 22. Here, a case where the mounting head 22 has four suction nozzles 24 will be described as a specific example. The parts P1 to P4 are collectively referred to as a part P. Next, the CPU 41 controls the head moving unit 20 so that the mounting head 22 passes over the image pickup unit 30, and causes the image pickup unit 30 to pick up an image of the component P sucked and held by the mount head 22. Subsequently, the CPU 41 adjusts the position and rotation angle of the component P based on the imaging result of the imaging unit 30 and arranges the component P on the substrate S. At this time, if there is an abnormality such as deformation in the component P, the CPU 41 causes the mounting unit 13 to perform a process of discarding the component P without using it for mounting. The CPU 41 repeats such processing until all the placement of the components P on the board S is completed.

  Next, image data output processing in the imaging unit 30 will be described. FIG. 4 is a flowchart illustrating an example of an image data output processing routine executed by the imaging unit 30. This routine is executed by each configuration (circuit) of the imaging unit 30 every time an imaging command is received from the control device 40. When this routine is started, the imaging unit 30 performs an imaging process with the imaging device 31 (step S100), and transfers charges from the imaging device 31 to the image processing unit 33 via the region setting unit 32 (step S110). Next, the region setting unit 32 executes binarization processing and contour extraction processing based on the charge in a predetermined detection region (step S120), and sets a capture region (step S130).

  FIG. 5 is an explanatory diagram of detection areas 61A to 61D and capture areas 62A to 62D of the captured image 60 captured by the imaging unit 30, and FIG. 5 (a) is an explanatory diagram at the time of binarization processing. FIG. 5B is an explanatory diagram in which the capture area 62 is set. Here, the detection areas 61A to 61D are collectively referred to as the detection area 61, and the capture areas 62A to 62D are collectively referred to as the capture area 62. In steps S110 to S130, the charge constituting each pixel is transferred, and the image data as shown in FIG. 5 is an image. The image sensor 31 transfers the charges for forming the image of FIG. 5 to the region setting unit 32 in a predetermined order, for example, from the upper left pixel to the right. When the pixels of the predetermined detection region 61 are transferred, the region setting unit 32 that has received the pixel performs binarization processing based on whether or not this charge is larger than a predetermined threshold, The result is output as a signal. This output result directly indicates whether the pixel is a part area or other area. Based on the output result, the contour of the part, that is, the contour extraction can be performed. Here, the predetermined threshold value is empirically determined as a value that can distinguish the background region and the component region in accordance with the color of the component. When the outline of the part is extracted, the area setting unit 32 sets the position of the capture area 62 so that the outline of the part enters. When the part P is within the detection area 61, the area setting unit 32 sets the same position as the detection area 61 in the capture area 62 (see parts P1 and P2 in FIG. 5). In addition, when the part P protrudes from the detection area 61, the area setting unit 32 sets an area including all the parts in the capture area 62 (see parts P3 and P4 in FIG. 5).

  Here, the detection area 61 and the capture area 62 will be described. In general, the detection region for determining where the component P is approximately is relatively large with respect to the size of the component P in consideration of the adsorption displacement and rotation displacement of the component P to the adsorption nozzle 24. The size is set with a margin. On the other hand, in the imaging unit 30, the detection area 61 is an area with a smaller margin because the capture area 62, which is an area of image data to be transferred to the control device 40, is slightly moved according to the position of the component P. It can be. For example, even if the image of the part P protrudes from the detection area 61 (see the parts P3 and P4 in FIG. 5), the position of the part P is grasped by the part (outer shape and outline of the part) included in the detection area 61. can do. Here, the detection area 61 is set as an area where the outer shape of the component P can be extracted, and the detection area 61 and the capture area 62 are areas of the same size, and only the part P enters. Size (see FIG. 5).

  Subsequently, based on the transferred charges, the image processing unit 33 generates image data (step S140). The image data may be, for example, bitmap data or JPEG data. Then, the output unit 34 outputs the set image data included in the capture area 62 and the movement amount of the capture area 62 to the control device 40 (step S150), and ends this routine. The movement amount of the capture region 62 may be a relative movement amount with respect to the detection region 61 or may be a movement amount from the reference position of the captured image 60 (for example, the upper left corner of the image). The control device 40 that has acquired the movement amount of the capture area 62 and the image data obtains the suction displacement amount of the component P from the movement amount and the position of the component P in the image data. Further, the control device 40 performs matching between the reference image data of the component P and the acquired image data, and determines the presence or absence of a rotation angle of the component P or a shape abnormality. Then, the control device 40 causes the mounting head 22 to perform correction of the rotation angle, fine adjustment of the arrangement position, and the like so that the components P1 to P4 sucked by the mounting head 22 are appropriately arranged on the substrate S.

  Here, the correspondence between the components of the present embodiment and the components of the present invention will be clarified. The imaging element 31 and the image processing unit 33 of the present embodiment correspond to the imaging unit of the present invention, the region setting unit 32 corresponds to the region setting unit, the output unit 34 corresponds to the output unit, and the mounting unit 13 is the mounting unit. The control device 40 corresponds to a control unit. In the present embodiment, an example of the image processing method of the present invention is also clarified by describing the operation of the mounting apparatus 11.

  According to the imaging unit 30 of the mounting apparatus 11 of the embodiment described above, an image relating to the state of the component is captured, and the outer shape of the component P existing in the detection region 61 is extracted from the captured image, and this extraction is performed. Based on the outer shape of the component P, the capture area 62 including the image of the component P is moved to a position where the image of the component P enters. Then, the imaging unit 30 outputs the image data included in the capture area 62 to the control device 40. In this imaging unit 30, for example, even if an image in which the position of the component P is shifted is captured, the capture region 62 is moved according to the extracted external shape of the component, so that the capture region 62 can be made smaller. it can. For this reason, the image data of the capture area 62 output to the control device 40 can be further reduced. Therefore, in the imaging unit 30, the transfer time of image data can be further shortened.

  Further, since the area setting unit 32 performs binarization processing within the range included in the detection area 61 and extracts the outer shape of the component P, the transfer time of image data can be further shortened by relatively simple binarization processing. Can do. Furthermore, since the capture area 62 is the same size as the detection area 61 closer to the component size, it is preferable from the viewpoint of transfer time. Furthermore, the region setting unit 32 transfers charges from the image sensor 31 and extracts the outer shape of the component P when the image processing unit 33 generates an image. Therefore, the processing time from image capturing to image data output is determined. Can be further shortened. Moreover, since the output unit 34 outputs the image data to the control device 40, the transfer time of the image data from the imaging unit 30 to the control device 40 can be further shortened.

  It should be noted that the present invention is not limited to the above-described embodiment, and it goes without saying that the present invention can be implemented in various modes as long as it belongs to the technical scope of the present invention.

  For example, in the above-described embodiment, the binarization process is performed on the detection area 61. However, the present invention is not particularly limited to this, and the entire captured image 60 may be binarized. Even in this case, since the imaging unit 30 transfers the image data of the smaller capture area 62, the transfer time of the image data can be further shortened.

  In the embodiment described above, the capture area 62 is the same as the size of the detection area 61, but is not limited thereto, and may be, for example, the size of the detection area 61 or smaller. The take-in area 62 is closer to the component size and is preferably a narrow area for shortening the transfer time.

  In the above-described embodiment, the capturing area 62 has been described as being preset based on the size of the part P to be imaged. However, the present invention is not limited to this, and the area setting unit 32 may extract the extracted part. The capture area 62 may be set by changing the size based on the external shape. In this area setting unit 32, the capture area 62 can be further reduced, and the transfer time of image data can be further shortened. Note that the initial value of the capture area 62 can be a predetermined size (for example, the size of the detection area 61) based on the size of the component.

  In the above-described embodiment, the external shape of the component is extracted when the charge is transferred from the image pickup device 31 and the image processing unit 33 generates an image. However, the present invention is not limited to this, and the image processing unit 33 captures the image. It is good also as what extracts the external shape of components, after producing | generating. Further, the area setting unit 32 has been described as being configured as hardware as an electronic circuit, but may be configured as software. In this case, a controller included in the imaging unit 30 may execute the software. Even in this apparatus, the transfer time of image data can be further shortened.

  In the embodiment described above, the mounting head 22 has been described as mounting the four suction nozzles 24, but is not particularly limited thereto. For example, the mounting head 22 may be provided with one or more suction nozzles 24.

  In the above-described embodiment, the mounting apparatus 11 has been described as the mounting-related processing apparatus of the present invention. However, the present invention is not particularly limited as long as the position and shape of the component P are determined. The inspection device for inspecting the position and shape of the component P may be used as the mounting related processing device of the present invention. In the above-described embodiment, the present invention has been described as the mounting apparatus 11. However, an image processing method may be used, or a program executed by a computer may be performed for this step.

  The present invention can be used for an apparatus for performing a mounting related process for arranging components on a substrate.

DESCRIPTION OF SYMBOLS 10 mounting system, 11 mounting apparatus, 12 board | substrate conveyance unit, 13 mounting unit, 14 component supply unit, 20 head moving part, 22 mounting head, 24 suction nozzle, 30 imaging unit, 31 imaging element, 32 area | region setting part, 33 image Processing unit, 34 output unit, 40 control device, 41 CPU, 42 ROM, 43 HDD, 44 RAM, 45 input / output interface, 46 bus, 50 management computer, 52 input device, 54 display, 60 captured image, 61, 61A- 61D detection area, 62, 62A to 62D capture area, P, P1 to P4 parts, S substrate.

Claims (9)

A mounting-related processing device that executes mounting-related processing related to processing for mounting a component on a board,
An imaging unit that captures an image relating to the state of the component;
In the captured image, the external shape of the part existing in the predetermined detection area is extracted, and the image of the part enters the predetermined capture area including the image of the part based on the extracted information regarding the external shape of the part. An area setting unit to be moved to the position;
An output unit for outputting image data included in the capture area;
A mounting-related processing device.   The mounting related processing device according to claim 1, wherein the area setting unit performs binarization processing on the detection area and extracts an outer shape of the component.   The mounting related processing device according to claim 1, wherein the capture area has a size smaller than or equal to the detection area.   The mounting related processing device according to claim 1, wherein the area setting unit changes the size based on an outline of the extracted component and sets the capture area.   The mounting-related processing device according to claim 1, wherein the capture area is set based on a size of the imaged component. The imaging unit includes an imaging device that generates charges by receiving light and outputs the generated charges, and an image processing unit that generates image data based on the output charges,
The mounting-related processing device according to claim 1, wherein the region setting unit extracts an external shape of the component when the charge is transferred from the imaging element and the image processing unit generates an image. . It is the mounting related processing apparatus of any one of Claims 1-6,
A mounting part for mounting components on a board;
A control unit for controlling the mounting unit,
The output unit is a mounting-related processing device that outputs the image data to the control unit. An image processing method in a mounting related process related to a process of mounting a component on a board,
(A) capturing an image relating to the state of the component;
(B) In the captured image, the outline of a part existing in a predetermined detection area is extracted, and a predetermined capture area including an image of the part is extracted based on the extracted information related to the outline of the part. Moving to the position where the image enters,
(C) outputting image data included in the capture area;
An image processing method including:   A program in which one or more computers execute the steps of the image processing method according to claim 8.

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