JPWO2016056056A1 - Power converter - Google Patents

Abstract

Cooling efficiency is improved. A power conversion device includes a first substrate having a component surface on which a component is disposed, and a main heat dissipation surface Ra facing the component surface at a position spaced from the first substrate. And a regenerative resistor R that generates heat when energized. In addition, the power conversion device 1 is disposed between the first substrate 30 and the regenerative resistor R, and includes a heat sink 54 that cools the regenerative resistor R. The heat sink 54 is disposed along the first substrate 30 and is regenerated. A heat sink base 541 provided with the resistor R and a plurality of fins 542 protruding from the heat sink base 541 toward the first substrate 30 are provided.

Description

  The disclosed embodiment relates to a power conversion apparatus.

  Patent Document 1 describes a control unit in which a heat sink to which a semiconductor element is attached is attached to a bottom plate of a case, and cooling air is circulated through cooling fins of the heat sink for cooling.

Japanese Patent Laid-Open No. 10-150284

  In the above prior art, when the cooling efficiency is further improved, further optimization of the device configuration is desired.

  This invention is made | formed in view of such a problem, and it aims at providing the power converter device which can improve cooling efficiency.

  In order to solve the above-described problem, according to one aspect of the present invention, a power conversion device for converting power, the first substrate having a component surface on which components are arranged, and spaced apart from the first substrate A power converter having a first electronic component that generates heat when energized is disposed such that a main heat radiating surface faces the component surface at a position.

  According to another aspect of the present invention, there is applied a power conversion device that converts electric power, and includes a means for forming a wind tunnel using a substrate and an electronic component that generates heat when energized.

  According to the power converter of the present invention, the cooling efficiency can be improved.

It is a circuit block diagram showing an example of the circuit configuration of the power converter of one embodiment. It is a perspective view showing an example of the structure of a power converter. It is a top view showing an example of the structure of a power converter device. It is a front view showing an example of the structure of a power converter device. It is a front view showing an example of the structure of the power converter device in the 1st modification. It is a front view showing an example of the structure of the power converter device in a 2nd modification. It is a front view showing an example of the structure of the power converter device in a 3rd modification. It is a front view showing an example of the structure of the power converter device in a 4th modification. It is a front view showing an example of the structure of the power converter device in a 5th modification. It is a front view showing an example of the structure of the power converter device in a 6th modification. It is a front view showing an example of the structure of the power converter device in a 7th modification. It is a front view showing an example of the structure of the power converter device in an 8th modification. It is a front view showing an example of the structure of the power converter device in the 9th modification. It is a front view showing an example of the structure of the power converter device in a 10th modification. It is a front view showing an example of the structure of the power converter device in the 11th modification. It is a front view showing an example of the structure of the power converter device in the 12th modification. It is a front view showing an example of the structure of the power converter device in the 13th modification.

  Hereinafter, an embodiment will be described with reference to the drawings. In the present specification and drawings, components having substantially the same function are represented by the same reference numerals in principle, and repeated description of these components will be omitted as appropriate. The directions of “front”, “rear”, “left”, “right”, “upper”, and “lower” noted in the drawings are “front”, “rear”, “left”, “right”, “right”, Each corresponds to the direction described as “up” or “down”. However, the positional relationship of each component of the power conversion device is not limited to the concept of “front”, “rear”, “left”, “right”, “upper”, and “lower”.

<1. Example of circuit configuration of power conversion device>
First, an example of the circuit configuration of the power conversion device of the present embodiment will be described with reference to FIG.

  As illustrated in FIG. 1, the power conversion device 1 converts power input from an external power source into predetermined power and outputs the power to a load. Specifically, the power conversion device 1 converts the AC power input from the three-phase AC power source 100 into another AC power, and the eight three-phase AC motors M1, M2, M3, M4, M5, M6, M7. , M8 (hereinafter collectively referred to as “three-phase AC motor M”) to control the operation. That is, the power conversion device 1 is a motor control device capable of 8-axis control.

  Note that the number of controllable axes of the power conversion apparatus 1, that is, the number of motors (three-phase AC motor M in the above example) is not limited to eight, and may be other numbers. Further, the external power source is not limited to the three-phase AC power source, and may be another power source. Further, the load is not limited to the three-phase AC motor, and may be another load.

  The power converter 1 includes a diode module DM, four capacitors C1, C2, C3, C4 (hereinafter collectively referred to as “capacitor C”), eight power modules PM1, PM2, PM3, PM4, PM5, PM6, PM7, It has a plurality of electronic components including PM8 (hereinafter collectively referred to as “power module PM”), a regenerative resistor R which is an example of a resistor, and a switch Q.

  The diode module DM includes a diode, rectifies three-phase AC power input from the AC power supply 100, and outputs DC power to the DC buses P and N.

  The capacitors C1 to C4 are connected across the DC buses P and N, and smooth the DC voltage rectified by the diode module DM.

  Each of the power modules PM1 to PM8 includes a plurality of switching elements SW (only one is shown in FIG. 1) configured by semiconductor elements such as IGBTs. Each of the power modules PM1 to PM8 converts the DC power into predetermined three-phase AC power and outputs it to the three-phase AC motors M1 to M8.

  Note that when power conversion is performed by the power module PM as described above, since the DC voltage smoothing by the capacitor C or the like is essential, the capacitors C1 to C4 are electronic components attached to the power modules PM1 to PM8. It can be said.

  The diode of the diode module DM, the capacitors C1 to C4, and the switching element SW of the power modules PM1 to PM8 constitute a power conversion circuit 10.

  A series circuit of the regenerative resistor R and the switch Q is connected between the DC buses P and N. The switch Q includes a semiconductor element such as a MOSFET, for example, and is input to the DC buses P and N from the three-phase AC motor M by being turned on, for example, when the three-phase AC motor M is suddenly decelerated or stopped. The regenerative power is consumed by the regenerative resistor R. The regenerative resistor R consumes regenerative power when the switch Q is turned on.

  The circuit configuration of the power conversion device 1 described above is merely an example, and a circuit configuration other than the above may be used. For example, the resistor is not limited to the regenerative resistor R, and may be another resistor such as a dynamic brake. Further, the number of power modules PM is not limited to eight, and may be another number. In addition, the present invention is not limited to the case where two power modules PM are connected in parallel to one capacitor C. One power module PM is connected to one capacitor C, or three or more power modules PM are connected in parallel. May be connected. Further, the number of capacitors C is not limited to four, and may be other numbers. A reactor may be installed instead of the capacitor C.

<2. Example of magnitude relationship of calorific value>
Here, each of the plurality of electronic components generates heat when energized. Among a plurality of electronic components, the amount of heat generated when the capacitor C is energized is a small amount of heat that hardly affects other components, and the amount of heat generated when the power module PM or the regenerative resistor R is energized is The amount of heat generated is large enough to affect other parts. That is, the power module PM and the regenerative resistor R generate a larger amount of heat than the capacitor C. Further, the capacitor C is an electronic component that is weak against heat that should be suppressed from receiving heat from other components.

  Further, in the power conversion device 1, two heat sink bases 501 and 521 (see also FIG. 2 to be described later) are arranged to face each other (details will be described later). Among the power modules PM1 to PM8, the power modules PM1 to PM4 connected to the capacitors C1 to C4 are installed on the heat sink base 501. Further, power modules PM5 to PM8 connected in parallel to each of the power modules PM1 to PM4 to each of the capacitors C1 to C4 are installed on the heat sink base 521. The magnitude relationship between the total heat generation amount of the power modules PM1 to PM4 and the heat generation amount of the regenerative resistor R, and the magnitude relationship between the total heat generation amount of the power modules PM5 to PM8 and the heat generation amount of the regenerative resistor R are the power converters. It may change depending on the operating conditions of the 1 and 3-phase AC motors M1 to M8. However, in this embodiment, the case where the heat generation amount of the regenerative resistor R is larger than the total heat generation amount of the power modules PM1 to PM4 and the total heat generation amount of the power modules PM5 to PM8 will be described.

  Further, the heat generation amount of the power modules PM1 to PM4 varies among the power modules PM1 to PM4, and the heat generation amount of the power modules PM5 to PM8 varies among the power modules PM5 to PM8. The magnitude relationship between the heat generation amounts between the power modules PM1 to PM4 and the magnitude relationship between the heat generation amounts between the power modules PM5 to PM8 vary depending on the operating conditions of the power converter 1 and the three-phase AC motors M1 to M8. There is a case. However, in the present embodiment, between the power modules PM1 to PM4, the amount of heat generation increases in the order of the power module PM1, power module PM2, power module PM3, and power module PM4, and between the power modules PM5 to PM8, the power module PM5 and power A case where the heat generation amount is large in the order of the module PM6, the power module PM7, and the power module PM8 will be described.

  In addition, the magnitude relationship of the emitted-heat amount between several electronic components demonstrated above is an example to the last, and magnitude relationships other than the above may be sufficient.

<3. Example of structure of power conversion device>
Next, an example of the structure of the power conversion device 1 will be described with reference to FIGS. 2, 3, and 4. 2, the illustration of the upper plate portion and the front plate portion of the casing of the power conversion device 1 is omitted, the illustration of the upper plate portion is omitted in FIG. 3, and the front plate portion in FIG. Is omitted. Moreover, in FIGS. 2-4, illustration of structures other than the principal part of the power converter device 1 is abbreviate | omitted suitably.

  As shown in FIG. 2 to FIG. 4, the power conversion device 1 has a substantially rectangular parallelepiped casing 2 that forms the outline thereof, the plate portion 21 of the casing 2 being the upper side, the plate portion 22 being the lower side, The part 23 is installed on the front side, the plate part 24 on the rear side, the plate part 25 on the left side, and the plate part 26 on the right side. Hereinafter, the upper plate portion 21 of the housing 2 is the “upper plate portion 21”, the lower plate portion 22 is the “lower plate portion 22”, the front plate portion 23 is the “front plate portion 23”, and the rear plate portion 22 is the rear plate portion 22. The plate portion 24 is also referred to as “rear plate portion 24”, the left plate portion 25 is also referred to as “left plate portion 25”, and the right plate portion 26 is also referred to as “right plate portion 26”. Hereinafter, in the power conversion device 1, the left-right direction is also referred to as the “width direction”, the up-down direction is also referred to as the “height direction”, and the front-back direction is also referred to as the “depth direction”.

  In addition, the shape of the housing | casing 2 is not limited to a substantially rectangular parallelepiped shape, Other shapes may be sufficient. The power converter 1 is oriented such that the plate portion 21 of the housing 2 is on the upper side, the plate portion 22 is on the lower side, the plate portion 23 is on the front side, the plate portion 24 is on the rear side, the plate portion 25 is on the left side, and the plate portion 26 is on the left side. The direction is not limited to the right side, but may be another direction.

  The housing 2 includes a plurality of electrons including a first substrate 30, two second substrates 32 and 34, the diode module DM, capacitors C1 to C4, power modules PM1 to PM8, a regenerative resistor R, and a switch Q. Components, three heat sinks 50, 52, and 54 and a fan 60 are accommodated. In addition, two ventilation openings 4 and 6 are formed in the housing 2 (see FIG. 3).

(3-1. First substrate)
The first substrate 30 is a single-sided substrate in which components are arranged only on one side. That is, as for the 1st board | substrate 30, the surface of one side is the component surface 30a in which components are arrange | positioned, and the surface of the other side is the solder surface 30b in which soldering is performed. The first substrate 30 has a substantially rectangular shape, and the dimension in the plate surface direction is substantially equal to the inner dimension in the surface direction perpendicular to the height direction of the housing 2. The first substrate 30 is fixed to the housing 2 at the lower portion of the housing 2 such that the plate surface direction is perpendicular to the height direction, the component surface 30a is the upper surface, and the solder surface 30b is the lower surface. Yes.

  The orientation and position of the first substrate 30 are limited to the orientation in which the plate surface direction is perpendicular to the height direction, the component surface 30a is the upper surface, the solder surface 30b is the lower surface, and the lower portion in the housing 2. Other orientations and other positions may be used. Moreover, the shape of the 1st board | substrate 30 is not limited to a substantially rectangular shape, Other shapes may be sufficient. The first substrate 30 is not limited to a single substrate, and may be composed of a plurality of substrates. Further, the dimension in the plate surface direction of the first substrate 30 is not limited to the case where it is substantially equal to the inner dimension in the surface direction perpendicular to the height direction of the housing 2, and may be smaller than the inner dimension. . The first substrate 30 is not limited to a single-sided substrate, and may be a double-sided substrate in which components are arranged on both sides, a multilayer substrate in which a plurality of substrates are stacked, or the like.

(3-2. Example of second substrate)
The second substrates 32 and 34 are erected on the component surface 30 a of the first substrate 30. Specifically, each of the second substrates 32 and 34 has a substantially rectangular shape, and each dimension in the longitudinal direction is substantially equal to the inner dimension in the depth direction of the casing 2, and each dimension in the short side direction is the casing 2. Is slightly smaller than the inner dimension in the height direction. The second substrates 32 and 34 are arranged so that the longitudinal direction of each of the first substrates 30 is along the depth direction and the short side direction is along the height direction, and the second substrate 32 and 34 are spaced apart from each other with a predetermined gap in the width direction. In the vicinity of the central portion in the width direction, they are arranged to face each other in parallel. In other words, in the second substrates 32 and 34, the right surface 32a of the second substrate 32 and the left surface 34a of the second substrate 34 are disposed to face each other in the width direction. Note that the right surface 32a and the left surface 34a correspond to examples of facing surfaces, and the width direction is the facing direction of the facing surfaces. Hereinafter, the right surface 32a is also referred to as “opposing surface 32a”, and the left surface 34a is also referred to as “facing surface 34a”.

  Note that the orientation and position of the second substrates 32 and 34 are limited to a direction in which the longitudinal direction of each of the second substrates 32 and 34 is in the depth direction, a direction in which each of the short sides is along the height direction, and the vicinity of the central portion in the width direction of the first substrate 30. Other orientations and other positions may be used. Further, the second substrates 32 and 34 may not be erected in parallel. Further, the shape of the second substrates 32 and 34 is not limited to a substantially rectangular shape, and may be another shape. Moreover, the dimension of the longitudinal direction of the 2nd board | substrates 32 and 34 is not limited to the case where it is substantially equal to the internal dimension of the depth direction of the housing | casing 2, It may be smaller than the said internal dimension. Further, the dimension in the short direction of the second substrates 32 and 34 is not limited to the case where it is slightly smaller than the inner dimension in the height direction of the housing 2, and may be substantially equal to the inner dimension. The second substrates 32 and 34 are not limited to the case where the second substrates 32 and 34 are erected on the component surface 30 a of the first substrate 30, and may be erected on the solder surface 30 b of the first substrate 30. Further, the number of second substrates is not limited to two, and may be three or more. In addition, instead of one or both of the second substrates 32 and 34, members (wind guide plate, partition plate, etc.) constituting the wind tunnel may be installed.

(3-3. Examples of vents and fans)
The ventilation opening 4 is formed in the width direction center part vicinity of the front board part 23 so that it may be arrange | positioned between the 2nd board | substrates 32 and 34 in the width direction. The ventilation opening 6 is formed in the width direction center vicinity of the rear-plate part 24 so that it may be arrange | positioned between the 2nd board | substrates 32 and 34 in the width direction. That is, the ventilation openings 4 and 6 are disposed to face each other in the depth direction.

  The vent holes 4 and 6 are not limited to the case where each of the vent holes 4 and 6 is disposed between the second substrates 32 and 34, and a part of each may be disposed between the substrates 32 and 34. Moreover, the position of the vent hole 4 in the front plate part 23 is not limited to the vicinity of the center part in the width direction, and may be another position. The front plate portion 23 may be formed with a plurality of ventilation openings. Further, the position of the vent hole 6 in the rear plate portion 24 is not limited to the vicinity of the central portion in the width direction, and may be another position. In addition, a plurality of ventilation openings may be formed in the rear plate portion 24. Further, instead of or in addition to at least one of the front plate portion 23 and the rear plate portion 24, a vent hole may be formed in another plate portion of the housing 2.

  The fan 60 is disposed inside the ventilation hole 6 between the second substrates 32 and 34, and includes a wind channel 70 including the power modules PM1 to PM8, the capacitors C1 to C4, and the cooling flow path 75 for cooling the regenerative resistor R. (Details will be described later). The wind tunnel 70 and the cooling flow path 75 therein are formed to extend in the depth direction (details will be described later). The direction in which the cooling channel 75 extends, that is, the depth direction is referred to as a “channel direction”. In the following, for convenience of explanation, the flow path direction is sometimes used in other words as the depth direction.

  Specifically, the fan 60 is an exhaust fan, and uses the ventilation port 4 as an intake port and the ventilation port 6 as an exhaust port, and ventilates the air sucked from the ventilation port 4 into the wind tunnel 70 (inside the casing 2). 6 is exhausted outside the wind tunnel 70 (outside the casing 2). Therefore, when the fan 60 blows air to the wind tunnel 70, air mainly flows from the ventilation opening 4 toward the ventilation opening 6 in the wind tunnel 70. The direction from the vent 4 to the vent 6 where the fan 60 mainly flows air in the wind tunnel 70, that is, the direction from the front to the rear, which is one direction in the depth direction, is referred to as “ventilation direction”. I will decide. Further, the side of the wind tunnel 70, that is, the front side, is referred to as “upstream side in the ventilation direction”, and the side of the wind tunnel 70, that is, the rear side, is referred to as “downstream side in the ventilation direction”. Hereinafter, for convenience of explanation, the ventilation direction may be used in other words as the depth direction.

  The fan 60 is not limited to an exhaust fan, and may be an intake fan. Further, the fan 60 is not limited to being installed inside the ventilation opening 6, and may be installed inside the ventilation opening 4. Moreover, the fan 60 is not limited to the case where it is installed inside the ventilation hole, and may be installed outside the ventilation hole. Further, the number of fans installed at the ventilation opening is not limited to one and may be two or more. Further, for example, when it is not necessary to perform forced cooling using a fan because the amount of heat generated by the electronic component is not so large, the fan need not be installed. Further, the ventilation direction and the flow path direction are not limited to the depth direction, and may change according to the orientation of the second substrates 32 and 34 and the like.

(3-4. Examples of heat sink and wind tunnel)
The heat sinks 50 and 52 are heat sinks for cooling the power modules PM1 to PM8, and are disposed along the opposing surfaces 32a and 34a of the second substrates 32 and 34. Specifically, the heat sink 50 is disposed along the facing surface 32a of the second substrate 32, and includes a heat sink base 501 on which the power modules PM1 to PM4 are installed, and a plurality of fins 502. The heat sink 52 is disposed along the facing surface 34a of the second substrate 34, and includes a heat sink base 521 on which the power modules PM5 to PM8 are installed, and a plurality of fins 522.

  The heat sink base 501 has a substantially rectangular shape, the dimension in the longitudinal direction is smaller than the dimension in the depth direction of the second substrates 32 and 34, and the dimension in the short direction is the height direction of the second substrates 32 and 34. A little larger than half of the dimensions. The heat sink base 501 is arranged in parallel with the second substrates 32 and 34 along the facing surface 32a of the second substrate 32 so that the longitudinal direction thereof is along the depth direction and the short side direction is along the height direction. For example, it is fixed to the second substrate 32 via spacers SP1 arranged at the four corners. The heat sink base 521 has the same shape and dimensions as the heat sink base 501. The heat sink base 521 is disposed in parallel with the second substrates 32 and 34 along the facing surface 34a of the second substrate 34 so that the longitudinal direction thereof is along the depth direction and the short side direction is along the height direction. For example, it is fixed to the second substrate 34 via spacers SP2 arranged at the four corners.

  Specifically, the heat sink bases 501 and 521 are arranged so that their upper end positions substantially coincide with the upper end positions of the second substrates 32 and 34 in the height direction. Therefore, the lower end positions of the heat sink bases 501 and 521 are slightly lower than the center portions in the height direction of the second substrates 32 and 34. In other words, the heat sink bases 501 and 521 are disposed opposite to each other in the width direction between the second substrates 32 and 34 on the upper end side thereof. At this time, the arrangement interval S1 of the heat sink bases 501 and 521 is substantially equal to the diameter of the blower 60a formed of the fan 60, for example, an impeller. Specifically, the arrangement interval S1 is an arrangement interval between the left surface 501a of the heat sink base 501 and the right surface 521a of the heat sink base 521. The left surface 501a is a surface of the heat sink base 501 that does not face the heat sink base 521, and the right surface 521a is the surface of the heat sink base 521 that does not face the heat sink base 501.

  The arrangement interval between the right surface of the heat sink base 501 and the left surface of the heat sink base 521 may be the arrangement interval S1 of the heat sink bases 501 and 521. Moreover, arrangement | positioning space | interval S1 of the heat sink bases 501 and 521 is not limited to the case where it is substantially equal to the diameter of the ventilation part 60a of the fan 60, You may be larger or smaller than the said diameter. Further, the lower end positions of the heat sink bases 501 and 521 are not limited to the case where they are slightly lower than the center portions in the height direction of the second substrates 32 and 34, and are near the lower end portions of the second substrates 32 and 34. It may be. The heat sink bases 501 and 521 are not limited to being fixed to the second substrates 32 and 34, and may be fixed to other members. For example, the heat sink bases 501 and 521 may be fixed to the first substrate 30, and the second substrates 32 and 34 may be fixed to the heat sink bases 501 and 521. Further, the heat sink bases 501 and 521 are not necessarily arranged parallel to the second substrates 32 and 34. Further, the shape and size of the heat sink bases 501 and 521 are not limited to the above shape and size, and may be other shapes and sizes.

  The plurality of fins 502 protrude from the heat sink base 501 along the width direction, that is, toward the right side, in a range slightly below the center in the height direction from the upper end of the heat sink base 501. Further, the plurality of fins 522 protrude from the heat sink base 521 along the width direction, that is, toward the left side, in a range slightly below the center in the height direction from the upper end of the heat sink base 521. That is, the fins 502 and 522 protrude from the heat sink bases 501 and 521 in a direction approaching each other. Specifically, the fins 502 and 522 protrude so that a predetermined gap is left between them.

  Note that the protruding direction of the fins 502 and 522 is not limited to the above direction, and may be another direction. Moreover, the range of the fins 502 and 522 in the heat sink bases 501 and 521 is not limited to the above range, and may be another range.

  On the other hand, the heat sink 54 is a heat sink that cools the regenerative resistor R. The heat sink 54 is disposed above the upper end portions 32 b and 34 b of the second substrates 32 and 34, and includes a heat sink base 541 on which the regenerative resistor R is installed, and a plurality of fins 542. The upper end portions 32b and 34b are tip ends in the standing direction of the second substrates 32 and 34, that is, in the height direction.

  The heat sink base 541 has a substantially rectangular shape, and its longitudinal dimension is slightly smaller than the depth dimension of the heat sink bases 501 and 521, and its lateral dimension is larger than the arrangement interval of the second substrates 32 and 34. Is also big. The heat sink base 541 is arranged in parallel with the first substrate 30 on the upper end portions 32b and 34b of the second substrates 32 and 34 so that the longitudinal direction thereof is along the depth direction and the short side direction is along the width direction. It is fixed to the upper plate part 24 via a member (not shown).

  That is, the heat sink base 541 is disposed to face the first substrate 30 in the height direction. At this time, the heat sink base 541 is disposed at the upper end position of the blower 60a of the fan 60, and the first substrate 30 is disposed below the lower end position of the blower 60a. Therefore, the arrangement interval between the first substrate 30 and the heat sink base 541 is larger than the diameter of the blower 60 a of the fan 60.

  In addition, the arrangement | positioning space | interval of the 1st board | substrate 30 and the heat sink base 541 is not limited to the case where it is larger than the diameter of the ventilation part 60a of the fan 60, may be substantially equal to the said diameter, and is smaller than the said diameter. May be. Further, the heat sink base 541 is not limited to being fixed to the upper plate portion 24, and may be fixed to other members. Further, the heat sink base 541 does not necessarily have to be arranged in parallel with the first substrate 30. Further, the shape and dimensions of the heat sink base 541 are not limited to the above shapes and dimensions, and may be other shapes and dimensions.

  The plurality of fins 542 protrude from the heat sink base 541 toward the first substrate 30 between the fins 502 and 522, that is, downward. Specifically, the fins 542 are upper ends of capacitors C1 to C4 installed on the component surface 30a of the first substrate 30 so as to protrude upward from the first substrate 30 as described later from the heat sink base 541. It protrudes (extends) to the vicinity.

  Note that the fin 542 protrudes to a position close to the upper ends of the capacitors C1 to C4, but may protrude to a position that contacts the upper ends of the capacitors C1 to C4. Further, the fin 542 does not necessarily protrude to the vicinity of the upper end portion of the capacitors C1 to C4. Further, the protruding direction of the fin 542 is not limited to the above direction, and may be another direction.

  Here, the protrusion length from the heat sink base 501 of the fin 502 in the heat sink 50 that cools the power modules PM1 to PM4 is L1. Further, the protrusion length of the fins 522 from the heat sink base 521 in the heat sink 52 for cooling the power modules PM4 to PM8 is L2. Further, the protrusion length of the fin 542 from the heat sink base 541 in the heat sink 54 that cools the regenerative resistor R is L3. In this case, the protrusion length L1 of the fin 502 and the protrusion length L2 of the fin 522 are equal. Further, the protrusion lengths L1 and L2 of the fins 502 and 522 and the protrusion length L3 of the fins 542 are longer when the heat generation amount of the corresponding electronic component is larger. That is, as described above, since the heat generation amount of the regenerative resistor R is larger than the total heat generation amount of the power modules PM1 to PM4 and the total heat generation amount of the power modules PM5 to PM8, the protrusion length L3 of the fin 542 is , 522 is longer than the projecting lengths L1, L2.

  The magnitude relationship between the projection length L1 of the fin 502, the projection length L2 of the fin 522, and the projection length L3 of the fin 542 is limited to the magnitude relationship according to the heat generation amount of the corresponding electronic component as described above. It may be other magnitude relations (for example, all have the same length). Further, the protruding length L1 of the fin 502 and the protruding length L2 of the fin 522 are not necessarily equal. In addition, the protruding lengths are not necessarily equal between the fins 502, between the fins 522, and between the fins 542.

  In the present embodiment, a space 71 (see FIG. 5) between the component surface 30a of the first substrate 30 and the heat sink base 541 is surrounded by the first substrate 30 and the second substrates 32 and 34 in the housing 2. A space surrounded by a one-dot chain line in FIG. That is, the wind tunnel 70 is formed using the first substrate 30, the second substrates 32 and 34, and the heat sink base 541 (regenerative resistor R). The fan 60 blows air into a space 71 formed as the wind tunnel 70.

(3-5. Examples of electronic components and cooling flow path)
The power modules PM1 to PM8 are disposed on the opposing surfaces 32a and 34a of the second substrates 32 and 34, and are installed on the left surface 501a and the right surface 521a of the heat sink bases 501 and 521, respectively. Thus, by arranging the power modules PM1 to PM8 on the opposing surfaces 32a and 34a of the second substrates 32 and 34, the power modules PM1 to PM8 can be arranged apart from the first substrate 30. At this time, heat pipes may be embedded in the heat sink bases 501 and 521. When the heat pipes are embedded in the heat sink bases 501 and 521, the temperatures of the heat sink bases 501 and 521 can be made closer to each other. Note that the power modules PM1 to PM8 are installed on the left surface 501a and the right surface 521a of the heat sink bases 501 and 521 as described above, in other words, the heat sinks 50 and 52 are opposed to the second substrates 32 and 34. It can be said that the power modules PM1 to PM8 are disposed between the surfaces 32a and 34a.

  Specifically, the power modules PM1 to PM4 connected to each of the capacitors C1 to C4 and the power modules PM5 to PM8 connected to each of the capacitors C1 to C4 are opposed to the second substrates 32 and 34. The surfaces 32a and 34a are opposed to each other in the width direction.

  More specifically, the power modules PM1 to PM4 are closer to the upper end portion 32ab than the lower end portion 32aa of the opposing surface 32a of the second substrate 32, along the plate surface direction of the first substrate 30, that is, along the depth direction. The heat sink base 501 is installed on the left surface 501a. And each power module PM1-PM4 is mechanically and electrically connected to the 2nd board | substrate 32 because each pin-shaped terminal t is attached to the 2nd board | substrate 32 (refer FIG. 4). The power modules PM5 to PM8 are arranged side by side along the plate surface direction of the first substrate 30, that is, along the depth direction, closer to the upper end portion 34ab than the lower end portion 34aa of the facing surface 34a of the second substrate 34. The heat sink base 521 is installed on the right surface 521a. The power modules PM5 to PM8 are mechanically and electrically connected to the second substrate 34 by attaching each of the pin-shaped terminals t to the second substrate 34 (see FIG. 4). The lower end 32aa is an end of the facing surface 32a on the first substrate 30 side, and the upper end 32ab is an end of the facing surface 32a opposite to the lower end 32aa. The lower end 34aa is the end of the facing surface 34a on the first substrate 30 side, and the upper end 34ab is the end of the facing surface 34a opposite to the lower end 34aa.

  At this time, the power modules PM1 to PM4 are arranged from the upstream side toward the downstream side in the ventilation direction in descending order of heat generation, that is, the power module PM1, the power module PM2, the power module PM3, and the power module PM4. . Further, the power modules PM5 to PM8 are arranged from the upstream side toward the downstream side in the ventilation direction in descending order of heat generation, that is, the power module PM5, power module PM6, power module PM7, and power module PM8. That is, the power modules PM1 and PM5 connected to the capacitor C1, the power modules PM2 and PM6 connected to the capacitor C2, the power modules PM3 and PM7 connected to the capacitor C3, and the power module connected to the capacitor C4. PM4 and PM8 are arranged to face each other in the width direction.

  In addition, arrangement | positioning of power module PM1-PM8 is not limited to the said arrangement | positioning, Other arrangement | positioning may be sufficient. For example, the power modules PM1 to PM4 are, for example, the power module PM1, the power module PM3, the power module PM2, and the power module so that the one having a large amount of heat generation and the one having a small amount of heat are alternately changed from the upstream side to the downstream side in the ventilation direction. You may arrange | position in order of PM4. Similarly, for the power modules PM5 to PM8, for example, the power module PM5, the power module PM7, the power module PM6, the power so that the one with a large amount of heat generation is alternately changed from the upstream side to the downstream side in the ventilation direction. The modules PM8 may be arranged in order. Further, the power modules PM1 to PM8 are not limited to the case where the power modules PM1 to PM8 are arranged closer to the upper end portions 32ab and 34ab than the lower end portions 32aa and 34aa of the opposing surfaces 32a and 34a, and the height direction of the opposing surfaces 32a and 34a. You may arrange | position near lower end part 32aa, 34aa rather than center part or upper end part 32ab, 34ab. Further, the power modules PM1 to PM8 are not necessarily arranged side by side along the depth direction. Further, the power module PM may not be disposed on each of the facing surfaces 32a and 34a, and may be disposed on only one of the facing surfaces 32a and 34a.

  The capacitors C1 to C4 are arranged between the second substrates 32 and 34, closer to the first substrate 30 than the power modules PM1 to PM8, specifically, on the component surface 30a of the first substrate 30. . Note that the capacitors C1 to C4 are arranged between the second substrates 32 and 34 as described above, in other words, the first substrate so that the second substrates 32 and 34 sandwich the capacitors C1 to C4 therebetween. It can be said that it is erected on 30 component surfaces 30a. In addition, as described above, the capacitors C1 to C4 are arranged closer to the first substrate 30 than the power modules PM1 to PM8. In other words, the power modules PM1 to PM8 are more regenerative than the capacitors C1 to C4. It can be said that it is arranged on the resistance R side, that is, on the upper side.

  Specifically, the capacitors C1 to C4 have, for example, a substantially cylindrical shape, and are directed from the first substrate 30 toward the heat sink 54 between the heat sink bases 501 and 521 and below the fins 502 and 522 at the lowest position. That is, it is installed on the component surface 30a of the first substrate 30 so as to protrude upward. Therefore, both ends in the width direction of the capacitors C1 to C4 are disposed between the fins 502 and 522 of the heat sinks 50 and 52 and the first substrate 30, and the other portions of the capacitors C1 to C4 are fins of the heat sink 54. It is disposed between 542 and the first substrate 30.

  More specifically, the capacitors C1 to C4 are arranged side by side along the depth direction on the component surface 30a of the first substrate 30. More specifically, the capacitors C1 to C4 are arranged between two power modules PM connected to the capacitor C and arranged to face each other in the width direction. That is, the capacitor C1 is disposed between the power modules PM1 and PM5. The capacitor C2 is disposed between the power modules PM2 and PM6. The capacitor C3 is disposed between the power modules PM3 and PM7. The capacitor C4 is disposed between the power modules PM4 and PM8. Note that, as described above, the capacitors C1 to C4 are disposed between the two power modules PM facing each other. In other words, the power modules PM1 to PM8 and the capacitors C1 to C4 correspond in the depth direction. It can be said that it is arranged at a position where at least a part overlaps.

  The arrangement of the capacitors C1 to C4 is not limited to the above arrangement, and other arrangements may be used. For example, the capacitors C <b> 1 to C <b> 4 are not limited to the case where the capacitors C <b> 1 to C <b> 4 are disposed between the two power modules PM connected to the capacitor C that are opposed to each other in the width direction. The power module PM may not be disposed between the two power modules PM, or may be disposed between the two power modules PM disposed to face each other in the width direction. Further, the capacitors C1 to C4 are not necessarily arranged side by side along the depth direction. Further, the capacitors C1 to C4 do not necessarily have to be installed on the component surface 30a of the first substrate 30 so as to protrude from the first substrate 30 toward the heat sink 54. Further, the capacitors C <b> 1 to C <b> 4 are not necessarily installed on the component surface 30 a of the first substrate 30. The capacitors C1 to C4 are not limited to the case where the capacitors C1 to C4 are disposed closer to the first substrate 30 than the power modules PM1 to PM8, and the distance to the first substrate 30 is equal to that of the power modules PM1 to PM8. The position or the power module PM1 to PM8 may be disposed farther from the first substrate 30. Further, the capacitors C1 to C4 are not necessarily arranged between the second substrates 32 and 34.

  In addition, the regenerative resistor R is positioned away from the first substrate 30 in the height direction so that the main heat dissipation surface Ra faces the component surface 30a of the first substrate 30, that is, the lower surface, specifically Are disposed on the upper end portions 32b and 34b side of the second substrates 32 and 34, respectively, and the heat radiating surface Ra is placed in contact with the upper surface 541a of the heat sink base 541. The heat radiation surface Ra is a surface from which the heat generated by the regenerative resistor R is mainly radiated and is a surface that should be brought into contact with the heat sink base 541. Further, the upper surface 541a is a surface of the heat sink base 541 opposite to the first substrate 30. Further, as described above, the regenerative resistor R is disposed on the upper surface 541a of the heat sink base 541. In other words, it can be said that the heat sink 54 is disposed between the first substrate 30 and the regenerative resistor R.

  In addition, arrangement | positioning of the regenerative resistance R is not limited to the said arrangement | positioning, Other arrangement | positioning may be sufficient. For example, the regenerative resistor R is not necessarily arranged on the upper end portions 32b and 34b side of the second substrates 32 and 34, respectively.

  In this embodiment, the heat sink bases 501, 521, and 541 and the capacitor that surround the space 76 (the space surrounded by the two-dot chain line in FIG. 4) in which the fins 502, 522, and 542 are disposed in the housing 2. The upper end portions of C1 to C4 form the cooling flow path 75. That is, the upper ends of each of the heat sink bases 501, 521, 541 and the capacitors C 1 to C 4 form part of the cooling flow path 75. Each space between the fins 502 of the heat sink 50, between the fins 522 of the heat sink 52, and between the fins 542 of the heat sink 54 may be referred to as a cooling flow path.

  In the present embodiment, the regenerative resistor R corresponds to an example of the first electronic component and an electronic component that generates heat when energized, and the capacitors C1 to C4 correspond to an example of the second electronic component, and the power module PM1. To PM8 correspond to an example of a third electronic component. The first substrate 30 corresponds to an example of a substrate. Moreover, the 1st board | substrate 30 and the regenerative resistance R comprise an example of a means which forms a wind tunnel using a board | substrate and an electronic component.

  In the present embodiment, the heat sinks 50 and 52 correspond to an example of a second heat sink. Therefore, the heat sink bases 501 and 521 correspond to an example of a second heat sink base, and the fins 502 and 522 correspond to an example of a second fin. The heat sink 54 corresponds to an example of a first heat sink. Therefore, the heat sink base 541 corresponds to an example of a first heat sink base, and the fin 542 corresponds to an example of a first fin.

<4. Examples of effects according to this embodiment>
As described above, in the power conversion device 1 according to the present embodiment, the first heat dissipating surface Ra of the first electronic component (the regenerative resistor R in the above example) that generates heat when energized is separated from the first substrate 30. It arrange | positions so that the component surface 30a of the 1st board | substrate 30 may be opposed. Since the first substrate 30 and the regenerative resistor R are spaced apart from each other, the heat radiation surface of the component surface 30a of the first substrate 30 and the regenerative resistor R is reduced while reducing the influence of heat on the mounted components and the like of the first substrate 30. By using the space 71 between Ra as the wind tunnel 70 or the like, the regenerative resistance R can be efficiently cooled. In addition, when a component that generates heat is arranged on the component surface 30a of the first substrate 30, the component can be cooled at the same time. Therefore, the cooling efficiency can be improved, and the power converter 1 can be downsized by improving the cooling performance.

  In the present embodiment, in particular, the heat sink 54 that cools the regenerative resistor R is disposed between the first substrate 30 and the regenerative resistor R. Then, the heat sink base 541 of the heat sink 54 is disposed along the first substrate 30, and the plurality of fins 542 are projected from the heat sink base 541 toward the first substrate 30. Thereby, the regenerative resistor R can be efficiently cooled by sending air to the space 71 sandwiched between the first substrate 30 and the heat sink base 541.

  In the present embodiment, in particular, the fan 60 blows air to the space 71 between the component surface 30 a of the first substrate 30 and the heat sink base 541. Thereby, the space 71 sandwiched between the component surface 30a of the first substrate 30 and the heat sink base 541 can be used as the wind tunnel 70 to cool the regenerative resistor R and the capacitors C1 to C4 simultaneously and efficiently. In addition, since the wind tunnel 70 is formed using the first substrate 30 and the heat sink base 541 and the like, members (such as a wind guide plate and a partition plate) constituting the wind tunnel 70 become unnecessary. Therefore, the power converter device 1 can be reduced in size and the cost can be reduced.

  In the present embodiment, in particular, the second electronic components (capacitors C <b> 1 to C <b> 4 in the above example) constituting the power conversion circuit 10 are arranged so as to protrude from the first substrate 30 toward the heat sink 54. Thereby, the regenerative resistor R and the capacitors C <b> 1 to C <b> 4 can be simultaneously and efficiently cooled by blowing air to the space 71 sandwiched between the first substrate 30 and the heat sink base 541. Further, in the wind tunnel 70, the region where the heat sink (fins thereof) is not installed has less resistance than the region where the heat sink is installed, so that the wind easily flows through the region. If this wind increases, the cooling efficiency will decrease. In the present embodiment, the capacitors C1 to C4 are installed in an area where the heat sink 54 is not installed. Accordingly, the capacitors C1 to C4 can be cooled, and the resistance in the region can be increased to increase the wind in the region where the fins 542 of the heat sink 54 are installed, so that the ventilation of the fan 60 can be effectively utilized.

  In the present embodiment, in particular, the fins 542 of the heat sink 54 are projected from the heat sink base 541 to the vicinity of the upper ends of the capacitors C1 to C4. As a result, the gap in the wind tunnel 70 can be reduced as much as possible, and the air blown by the fan 60 can be used more effectively.

  In the present embodiment, in particular, the capacitors C <b> 1 to C <b> 4 are arranged on the first substrate 30 along the air blowing direction of the fan 60. Thus, the capacitors C1 to C4 can be simultaneously and efficiently cooled without increasing the number of fans 60. In addition, the number of capacitors C can be increased without increasing the size of the power converter 1 in the width direction.

  In the present embodiment, in particular, the regenerative resistor R generates a larger amount of heat than the capacitors C1 to C4. Capacitors C1 to C4 having a small amount of heat generation are arranged on the first substrate 30, and the regenerative resistor R having a large amount of heat generation is arranged away from the first substrate 30, whereby the arrangement configuration of a plurality of electronic components is generated. The plurality of electronic components can be efficiently cooled while reducing the influence of heat on the first substrate 30.

  In the present embodiment, in particular, the third electronic component (in the above example, the power modules PM1 to PM8) that constitutes the power conversion circuit 10 and generates heat when energized sandwiches the capacitors C1 to C4 between the first substrate 30. In this manner, the two second substrates 32, 34 that are erected in this manner are arranged on the opposing surfaces 32 a, 34 a on the regenerative resistance R side with respect to the capacitors C <b> 1 to C <b> 4. Thus, the space 71 surrounded by the first substrate 30, the heat sink base 541, and the second substrates 32, 34 is used as the wind tunnel 70, and the regenerative resistor R, the capacitors C1 to C4, and the power modules PM1 to PM8 are simultaneously and efficiently performed. The cooling efficiency can be further improved. In addition, since a plurality of electronic components can be centrally arranged and cooled, the number of fans 60 can be reduced as compared with a case where electronic components are distributed and arranged. Furthermore, since the wind tunnel 70 is formed using the second substrates 32, 34, etc., members (wind guide plates, partition plates, etc.) constituting the wind tunnel 70 become unnecessary, the power conversion device 1 can be reduced in size, and the cost can be reduced. it can.

  Further, in this embodiment, in particular, the two heat sinks 50 and 52 for cooling the power modules PM1 to PM8 are changed from the two heat sink bases 501 and 521 arranged along the second substrates 32 and 34 to the fins 502 and 522, respectively. The power modules PM1 to PM8 are disposed so as to be sandwiched between the opposing surfaces 32a and 34a of the second substrates 32 and 34 so that the fins 542 are sandwiched therebetween and project toward each other. As a result, the regenerative resistor R and the power modules PM1 to PM8 can be simultaneously and efficiently cooled by sending air to the cooling flow path 75 formed by the heat sink base 541 and the heat sink bases 501 and 521. Cooling efficiency can be improved. Further, since the fin 542 is disposed between the fins 502 and 522, the gap in the cooling flow path 75 can be reduced as much as possible, and the air blown by the fan 60 can be more effectively utilized.

  In the present embodiment, in particular, the protrusion length L3 of the fins 542 in the heat sink 54 and the protrusion lengths L1 and L2 of the fins 502 and 522 in the heat sinks 50 and 52 are set so that the heat generation amount of the corresponding electronic component is larger. Lengthen. As described above, by optimizing the length of the fins 502, 522, and 542 of the heat sinks 50, 52, and 54 in accordance with the heat generation amount of the corresponding electronic component, each electronic component can be efficiently cooled.

  In the present embodiment, in particular, the heat sink bases 501, 521, 541 and the capacitors C 1 to C 4 form a cooling channel 75 for cooling the power modules PM 1 to PM 8, the capacitors C 1 to C 4, and the regenerative resistor R. . This eliminates the need for a member (such as a wind guide plate or a partition plate) that constitutes the cooling flow path 75, reduces the size of the power converter 1, and reduces the cost.

  In this embodiment, when the heat sink 54 is arranged so that the arrangement interval R2 between the first substrate 30 and the heat sink base 541 is equal to the diameter of the fan 60, the fan 60 causes the first substrate 30 and the heat sink base 541 to be arranged. Therefore, the cooling efficiency can be further improved.

  In the present embodiment, in particular, the second electronic component is the capacitor C that constitutes the power conversion circuit 10, and the third electronic component is the power module PM that includes the switching element SW that constitutes the power conversion circuit 10. . The capacitor C that generates little heat is disposed on the first substrate 30 side, and the power module PM that generates a large amount of heat is disposed on both sides of the capacitor C at a distance from the first substrate 30 using the second substrates 32 and 34. Thus, the arrangement configuration of the plurality of electronic components can be optimized according to the amount of heat generated, and the plurality of electronic components can be efficiently cooled while reducing the influence of heat on the first substrate 30. Further, the operating temperature of the capacitor C can be kept low and the life can be extended.

  In the present embodiment, in particular, the first electronic component is the regenerative resistor R. When the power conversion device 1 is a motor control device as in this embodiment, the amount of heat generated by the regenerative resistor R increases. Therefore, the regenerative resistor R is arranged so as to be opposed to the first substrate 30 so as to optimize the arrangement configuration of the electronic components in accordance with the amount of heat generated and the like, while reducing the influence of heat on the first substrate 30. Can be cooled.

<5. Modified example>
In addition, embodiment is not limited to the said content, A various deformation | transformation is possible within the range which does not deviate from the meaning and technical idea. Hereinafter, such modifications will be sequentially described. In the following modifications and the like, portions different from the above embodiment will be mainly described. In addition, components having substantially the same functions as those of the above-described embodiment are represented by the same reference numerals in principle, and repeated description of these components will be omitted as appropriate.

(5-1. First Modification)
Hereinafter, with reference to FIG. 5, a difference from the above-described embodiment in the structure of the power conversion device of the present modification will be described.

  As shown in FIG. 5, in the power conversion device 1A of the present modification, the plurality of fins 542A of the heat sink 54A are directed downward from the heat sink base 541 between the heat sink bases 501 and 521 of the heat sinks 50A and 52A. , 521 protrudes slightly below the upper end portion.

  Further, the plurality of fins 502A of the heat sink 50A protrude from the heat sink base 501 to the right in a range slightly below the center of the heat sink base 501 in the height direction from the lower side of the fins 542A of the heat sink 54A. . The plurality of fins 522A of the heat sink 52A protrude from the heat sink base 521 toward the left in a range slightly below the center in the height direction of the heat sink base 521 from the lower side of the fins 542A of the heat sink 54A. . That is, the fins 502A and 522A protrude from the heat sink bases 501 and 521 in a direction approaching each other. Specifically, the fins 502A and 522A protrude so that there is almost no gap between them.

  In this modification, the heat sink bases 501, 521, 541 and the capacitor surrounding the space 76A (the space surrounded by the two-dot chain line in FIG. 5) in which the fins 502A, 522A, 542A are disposed in the housing 2 are disposed. The cooling channel 75 is formed by the upper ends of C1 to C4.

  Since the configuration other than the above can be configured in the same manner as the above embodiment, the description thereof is omitted.

  In the present modification, the heat sinks 50A and 52A correspond to an example of a second heat sink. Therefore, the heat sink bases 501 and 521 correspond to an example of a second heat sink base, and the fins 502A and 522A correspond to an example of a second fin. The heat sink 54A corresponds to an example of a first heat sink. Accordingly, the heat sink base 541 corresponds to an example of a first heat sink base, and the fin 542A corresponds to an example of a first fin.

  Also in this modification, the same effect as the above embodiment can be obtained.

(5-2. Second Modification)
Hereinafter, with reference to FIG. 6, differences and the like from the above embodiment in the structure of the power conversion device of the present modification will be described.

  As shown in FIG. 6, in the power conversion device 1B of the present modification, the plurality of fins 542B of the heat sink 54B are directed downward from the heat sink base 541 between the heat sink bases 501 and 521 of the heat sinks 50B and 52B. , 521 protrudes slightly below the upper end portion.

  In addition, the plurality of fins 502B of the heat sink 50B protrude rightward from the heat sink base 501 in the range from the lower side of the fins 542B of the heat sink 54B to the lower end portion of the heat sink base 501. Further, the plurality of fins 522B of the heat sink 52B protrude from the heat sink base 521 toward the left in the range from the lower side of the fins 542B of the heat sink 54B to the lower end portion of the heat sink base 521. That is, the fins 502B and 522B protrude from the heat sink bases 501 and 521 in a direction approaching each other. Specifically, the fins 502B and 522B protrude so that there is almost no gap between them.

  Further, in this modification, instead of the capacitors C1 to C4, four capacitors connected to each of the power modules PM1 to PM4 on the lower end portion 32aa side of the facing surface 32a of the second substrate 32 (in FIG. 6). Then, only the capacitor C1a connected to the power module PM1 is shown). Specifically, the four capacitors C1a and the like have, for example, a substantially cylindrical shape, are installed on the facing surface 32a of the second substrate 32 so as to protrude rightward from the second substrate 32, and extend along the depth direction. Are arranged side by side. Also, four capacitors (only the capacitor C1b connected to the power module PM5 is shown in FIG. 6) connected to each of the power modules PM5 to PM8 on the lower end 34aa side of the facing surface 34a of the second substrate 34. Has been placed. Specifically, the four capacitors C1b and the like have, for example, a substantially cylindrical shape, are installed on the facing surface 34a of the second substrate 34 so as to protrude leftward from the second substrate 34, and extend along the depth direction. Are arranged side by side.

  In addition, a spacer SP3 is disposed between the capacitors C1a and the like disposed opposite to each other in the width direction, and below the fins 502B and 522B at the lowest positions of the heat sinks 50B and 52B. It is installed on the component surface 30 a of the substrate 30.

  In this modification, the heat sink bases 501, 521, 541 and the spacer surrounding the space 76B (the space surrounded by the two-dot chain line in FIG. 6) in which the fins 502B, 522B, 542B are arranged in the housing 2 are disposed. The upper end portion of SP3 forms a cooling flow path 75B for cooling the power modules PM1 to PM8 and the regenerative resistor R.

  Since the configuration other than the above can be configured in the same manner as the above embodiment, the description thereof is omitted.

  In this modification, the capacitor C1a and the like and the capacitor C1b and the like correspond to an example of the second electronic component.

  In the present modification, the heat sinks 50B and 52B correspond to an example of a second heat sink. Therefore, the heat sink bases 501 and 521 correspond to an example of a second heat sink base, and the fins 502B and 522B correspond to an example of a second fin. The heat sink 54B corresponds to an example of a first heat sink. Therefore, the heat sink base 541 corresponds to an example of a first heat sink base, and the fin 542B corresponds to an example of a first fin.

  Also in this modification, the same effect as the above embodiment can be obtained.

(5-3. Third Modification)
Hereinafter, with reference to FIG. 7, differences and the like in the structure of the power conversion device of this modification will be described.

  As shown in FIG. 7, in the power conversion device 1 </ b> C of this modification, the plurality of fins 542 </ b> C of the heat sink 54 </ b> C are directed downward from the heat sink base 541 between heat sink bases 501 and 521 of the heat sink 56 described later. , 521 protrudes slightly below the upper end portion.

  In this modification, one heat sink 56 is provided in place of the two heat sinks 50 and 52. The heat sink 56 includes the heat sink bases 501 and 522 disposed on the opposing surfaces 32 a and 34 a of the second substrates 32 and 34, and a plurality of fins 562.

  The plurality of fins 562 are arranged in a width direction so as to pass between the heat sink bases 501 and 521 in a range slightly below the center in the height direction of the heat sink bases 501 and 521 from the lower side of the tip of the fins 542C of the heat sink 54C. Projecting along.

  In this modification, the heat sink bases 501, 521, 541 and the capacitors C1 to C1 surrounding the space 76C (the space surrounded by the two-dot chain line in FIG. 7) in which the fins 542C, 562 in the housing 2 are arranged. The cooling channel 75 is formed by the upper end of C4.

  Since the configuration other than the above can be configured in the same manner as the above embodiment, the description thereof is omitted.

  In the present modification, the heat sink 56 corresponds to an example of a second heat sink. Therefore, the heat sink bases 501 and 521 correspond to an example of a second heat sink base, and the fins 562 correspond to an example of a second fin. The heat sink 54C corresponds to an example of a first heat sink. Therefore, the heat sink base 541 corresponds to an example of a first heat sink base, and the fin 542C corresponds to an example of a first fin.

  Also in this modification, the same effect as the above embodiment can be obtained.

(5-4. Fourth Modification)
Hereinafter, with respect to the structure of the power conversion device of the present modification, differences from the above embodiment will be described with reference to FIG.

  As shown in FIG. 8, in the power conversion device 1 </ b> D of this modification, a heat sink 58 is newly provided in addition to the three heat sinks 50, 52, and 54. Further, instead of the capacitors C1 to C4, the power conversion circuit 10 is configured to provide four reactors (only one reactor LE1 is shown in FIG. 8) that generates heat when energized.

  The heat sink 58 is a heat sink that cools the four reactors LE1 and the like. The heat sink 58 is disposed at the lower end of the heat sink bases 501 and 521, and includes a heat sink base 581 on which the reactor LE1 and the like are installed, and a plurality of fins 582.

  The heat sink base 581 has a substantially rectangular shape, and its longitudinal dimension is substantially equal to the depth dimension of the heat sink bases 501 and 521, for example, and its short dimension is, for example, the interval between the second substrates 32 and 34. Is almost equal to The heat sink base 581 is arranged in parallel to the first substrate 30 at the lower ends of the heat sink bases 501 and 521 so that the longitudinal direction thereof is along the depth direction and the short side direction is along the width direction. , 34 are fixed to the opposing surfaces 32a, 34a.

  The plurality of fins 582 protrude upward from the heat sink base 581 between the heat sink bases 501 and 521 to the vicinity of the tip end portion of the fin 542.

  The reactor LE1 and the like are disposed between the second substrates 32 and 34, closer to the first substrate 30 than the power modules PM1 to PM8, specifically, on the lower surface of the heat sink base 581. Specifically, the reactor LE1 and the like are installed on the lower surface of the heat sink base 581 so as to protrude downward from the heat sink base 581 and are arranged side by side along the depth direction. Note that the lower end portion of the reactor LE1 or the like is separated from the component surface 30a of the first substrate 30.

  In this modification, the heat sink bases 501, 521, and 541 surrounding the space 76D (the space surrounded by the two-dot chain line in FIG. 8) in which the fins 502, 522, 542, and 582 are disposed in the housing 2. , 581 form a cooling flow path 75D for cooling the power modules PM1 to PM8, the reactor LE1, etc., and the regenerative resistor R.

  Since the configuration other than the above can be configured in the same manner as the above embodiment, the description thereof is omitted.

  In this modification, the reactor LE1 and the like correspond to an example of the second electronic component.

  Also in this modification, the same effect as the above embodiment can be obtained.

(5-5. Fifth Modification)
Hereinafter, with reference to FIG. 9, a difference from the above embodiment in the structure of the power conversion device of the present modification will be described.

  As shown in FIG. 9, in the power conversion device 1E of the present modification, the regenerative resistor R and the heat sink 54 are not arranged above the upper end portions 32b, 34b of the second substrates 32, 34.

  The plurality of fins 502E of the heat sink 50E protrude from the heat sink base 501 to the right in a range slightly below the center in the height direction from the upper end of the heat sink base 501. The plurality of fins 522E of the heat sink 52E protrude from the heat sink base 521 toward the left in a range slightly lower than the center portion in the height direction from the upper end portion of the heat sink base 521. That is, the fins 502E and 522E protrude from the heat sink bases 501 and 521 in a direction approaching each other. Specifically, the fins 502E and 522E protrude so that there is almost no gap between them.

  In this modification, the housing 2 is surrounded by the first substrate 30 and the second substrates 32 and 34, and the component surface 30a of the first substrate 30 and the upper end portions 32b of the second substrates 32 and 34, A space 71E (a space surrounded by an alternate long and short dash line in FIG. 9) between the members (not shown) disposed above 34b is formed as a wind tunnel 70E.

  Further, the heat sink bases 501 and 521 and the upper ends of the second substrates 32 and 34 that surround a space 76E (a space surrounded by a two-dot chain line in FIG. 9) in which the fins 502E and 522E are disposed in the housing 2. The members disposed above 32b and 34b and the upper ends of the capacitors C1 to C4 form a cooling flow path 75E for cooling the power modules PM1 to PM8 and the capacitors C1 to C4.

  Since the configuration other than the above can be configured in the same manner as the above embodiment, the description thereof is omitted.

  In the present modification, the heat sinks 50E and 52E correspond to an example of a second heat sink. Therefore, the heat sink bases 501 and 521 correspond to an example of a second heat sink base, and the fins 502E and 522E correspond to an example of a second fin.

  Also in this modification, the same effect as the above embodiment can be obtained.

(5-6. Sixth Modification)
Hereinafter, with respect to the structure of the power conversion device of the present modification, differences from the above embodiment will be described with reference to FIG.

  As shown in FIG. 10, in the power conversion device 1F of this modification, the regenerative resistor R and the heat sink 54 are not disposed above the upper ends 32b, 34b of the second substrates 32, 34.

  Each of the heat sink bases 501F and 521F of the heat sinks 50F and 52F has a height direction dimension substantially equal to the height direction dimension of the second substrates 32 and 34, and the respective lower end positions are the lower end positions of the second substrates 32 and 34. Is almost the same.

  The plurality of fins 502F of the heat sink 50F protrude rightward from the heat sink base 501F in the range from the upper end portion of the heat sink base 501F to the lower end portion thereof. The plurality of fins 522F of the heat sink 52F protrude from the heat sink base 521F toward the left in the range from the upper end of the heat sink base 521F to the lower end thereof. That is, the fins 502F and 522F protrude from the heat sink bases 501F and 521F in a direction approaching each other. Specifically, the fins 502F and 522F protrude so that there is almost no gap between them.

  Further, in this modification, instead of the capacitors C1 to C4, four capacitors connected to each of the power modules PM1 to PM4 (the power module in FIG. 10) are connected to the lower end portion of the left surface of the second substrate 32. A capacitor C1c connected to PM1 is shown). Specifically, the four capacitors C1c and the like have, for example, a substantially cylindrical shape, are installed on the left surface of the second substrate 32 so as to protrude leftward from the second substrate 32, and are arranged along the depth direction. Has been placed. Further, four capacitors (only the capacitor C1d connected to the power module PM5 is shown in FIG. 10) connected to each of the power modules PM5 to PM8 are arranged on the lower end side of the right surface of the second substrate 34. Yes. Specifically, the four capacitors C1d and the like have, for example, a substantially cylindrical shape, are installed on the right surface of the second substrate 34 so as to protrude rightward from the second substrate 34, and are arranged along the depth direction. Has been placed.

  In this modification, the housing 2 is surrounded by the first substrate 30 and the second substrates 32 and 34, and the component surface 30a of the first substrate 30 and the upper end portions 32b of the second substrates 32 and 34, A space 71F (a space surrounded by an alternate long and short dash line in FIG. 10) with a member (not shown) disposed above 34b is formed as a wind tunnel 70F.

  Further, the heat sink bases 501F and 521F and the upper ends of the second substrates 32 and 34 surrounding the space 76F (the space surrounded by the two-dot chain line in FIG. 10) in which the fins 502F and 522F in the housing 2 are arranged. The members disposed above 32b and 34b and the component surface 30a of the first substrate 30 form a cooling flow path 75F for cooling the power modules PM1 to PM8.

  Since the configuration other than the above can be configured in the same manner as the above embodiment, the description thereof is omitted.

  In this modification, the capacitor C1c and the like and the capacitor C1d and the like correspond to an example of the second electronic component.

  In the present modification, the heat sinks 50F and 52F correspond to an example of a second heat sink. Therefore, the heat sink bases 501F and 521F correspond to an example of a second heat sink base, and the fins 502F and 522F correspond to an example of a second fin.

(5-7. Seventh Modification)
Hereinafter, with reference to FIG. 11, differences and the like in the structure of the power conversion device of the present modification will be described.

  As shown in FIG. 11, in the power conversion device 1G of this modification, the heat sink bases 501G and 521G of the heat sinks 50G and 52G have the height direction dimensions of the second substrates 32 and 34, respectively. The lower end positions of the second substrates 32 and 34 are substantially coincident with each other.

  The plurality of fins 502G of the heat sink 50G protrude rightward from the heat sink base 501G in the range from the upper end portion of the heat sink base 501G to the lower end portion thereof. The plurality of fins 522G of the heat sink 52G protrude from the heat sink base 521G toward the left in the range from the upper end of the heat sink base 521G to the lower end thereof. That is, the fins 502G and 522G protrude from the heat sink bases 501G and 521G in a direction approaching each other. Specifically, the fins 502G and 522G protrude so that a predetermined gap is left between them.

  The plurality of fins 542G of the heat sink 54G protrude downward from the heat sink base 541 between the fins 502G and 522G. Specifically, the fins 542G protrude from the heat sink base 541 to the vicinity of the upper ends of the capacitors C1 to C4.

  Further, in the present modification, the capacitors C1 to C4 are arranged so as to protrude upward from the first substrate 30 between the fins 502G and 522G and below the tip of the fin 542G. It is installed on the component surface 30 a of the substrate 30.

  In this modification, the heat sink bases 501G, 521G, and 541 surrounding the space 76G (the space surrounded by the two-dot chain line in FIG. 11) in which the fins 502G, 522G, and 542G are disposed in the housing 2; The upper and lower left and right side surfaces of the capacitors C1 to C4 and the component surface 30a of the first substrate 30 have cooling channels 75G for cooling the power modules PM1 to PM8, the capacitors C1 to C4, and the regenerative resistor R. Forming.

  Since the configuration other than the above can be configured in the same manner as the above embodiment, the description thereof is omitted.

  In this modification, the heat sinks 50G and 52G correspond to an example of a second heat sink. Therefore, the heat sink bases 501G and 521G correspond to an example of the second heat sink base, and the fins 502G and 522G correspond to an example of the second fin. The heat sink 54G corresponds to an example of a first heat sink. Therefore, the heat sink base 541 corresponds to an example of a first heat sink base, and the fin 542G corresponds to an example of a first fin.

  Also in this modification, the same effect as the above embodiment can be obtained.

(5-8. Eighth Modification)
Hereinafter, with reference to FIG. 12, differences and the like in the structure of the power conversion device of the present modification from the above embodiment will be described.

  As shown in FIG. 12, in the power conversion device 1H of the present modification, the power modules PM1 to PM8 and the heat sinks 50 and 52 are not disposed on the opposing surfaces 32a and 34a of the second substrates 32 and 34. Further, the regenerative resistor R is not disposed on the upper surface 541a of the heat sink base 541 of the heat sink 54H, and the power modules PM1 to PM8 are disposed.

  In this modification, the arrangement interval of the second substrates 32 and 34 is smaller than that in the above embodiment. For example, the arrangement interval of the second substrates 32 and 34 is substantially equal to the diameter of the blower 60 a of the fan 60.

  In the present modification, the heat sink 54H is a heat sink that cools the power modules PM1 to PM8. The plurality of fins 542H of the heat sink 54H protrude downward from the heat sink base 541 between the second substrates 32 and 34 to the vicinity of the upper ends of the capacitors C1 to C4.

  The power modules PM1 to PM8 are installed on the upper surface 541a of the heat sink base 541. Specifically, the power modules PM1 to PM4 and the power modules PM5 to PM8 are arranged to face each other in the width direction on the upper surface 541a of the heat sink base 541. More specifically, the power modules PM <b> 1 to PM <b> 4 are arranged side by side along the depth direction, and are installed on the left side of the upper surface 541 a of the heat sink base 541. The power modules PM5 to PM8 are arranged side by side along the depth direction, and are installed on the right side of the upper surface 541a of the heat sink base 541.

  Further, in the present modification, the capacitors C1 to C4 are directed upward from the first substrate 30 between the opposing surfaces 32a and 34a of the second substrates 32 and 34 and below the tip of the fin 542H. It is installed on the component surface 30a of the first substrate 30 so as to protrude.

  In this modification, a space 71H (see FIG. 5) between the component surface 30a of the first substrate 30 and the heat sink base 541 is surrounded by the first substrate 30 and the second substrates 32 and 34 in the housing 2. 12 is defined as a wind tunnel 70H.

  Further, the opposing surfaces 32a and 34a of the second substrates 32 and 34 surrounding the space 76H (the space surrounded by the two-dot chain line in FIG. 12) in which the fins 542H are disposed in the housing 2, and the heat sink base 541 The upper ends of the capacitors C1 to C4 form a cooling channel 75H for cooling the power modules PM1 to PM8 and the capacitors C1 to C4.

  Since the configuration other than the above can be configured in the same manner as the above embodiment, the description thereof is omitted.

  In this modification, the heat sink 54H corresponds to an example of a second heat sink. Therefore, the heat sink base 541 corresponds to an example of a second heat sink base, and the fin 542H corresponds to an example of a second fin.

  Also in this modification, the same effect as the above embodiment can be obtained.

(5-9. Ninth Modification)
Hereinafter, with reference to FIG. 13, differences and the like in the structure of the power conversion device of the present modification will be described.

  As shown in FIG. 13, in the power conversion device 1 </ b> I of the present modification, the power modules PM <b> 1 to PM <b> 8 and the heat sinks 50 and 52 are not disposed on the opposing surfaces 32 a and 34 a of the second substrates 32 and 34. Further, the regenerative resistor R is not disposed on the upper surface 541a of the heat sink base 541 of the heat sink 54I, and the power modules PM1 to PM8 are disposed.

  In this modification, the arrangement interval of the second substrates 32 and 34 is smaller than that in the above embodiment. For example, the arrangement interval of the second substrates 32 and 34 is substantially equal to the diameter of the blower 60 a of the fan 60.

  In the present modification, the heat sink 54I is a heat sink that cools the power modules PM1 to PM8. The plurality of fins 542I of the heat sink 54I project downward from the heat sink base 541 between the second substrates 32 and 34 to the vicinity of the component surface 30a of the first substrate 30.

  The power modules PM1 to PM8 are installed on the upper surface 541a of the heat sink base 541. Specifically, the power modules PM1 to PM4 and the power modules PM5 to PM8 are arranged to face each other in the width direction on the upper surface 541a of the heat sink base 541. More specifically, the power modules PM <b> 1 to PM <b> 4 are arranged side by side along the depth direction, and are installed on the left side of the upper surface 541 a of the heat sink base 541. The power modules PM5 to PM8 are arranged side by side along the depth direction, and are installed on the right side of the upper surface 541a of the heat sink base 541.

  Further, in this modification, instead of the capacitors C1 to C4, four capacitors connected to each of the power modules PM1 to PM4 (the power module in FIG. 13) are connected to the lower end portion of the left surface of the second substrate 32. Only a capacitor C1e connected to PM1 is shown). Specifically, the four capacitors C1e and the like have, for example, a substantially cylindrical shape, are installed on the left surface of the second substrate 32 so as to protrude leftward from the second substrate 32, and are arranged along the depth direction. Has been placed. Further, four capacitors (only the capacitor C1f connected to the power module PM5 in FIG. 13) connected to each of the power modules PM5 to PM8 are arranged on the lower end side of the right surface of the second substrate 34. Yes. Specifically, the four capacitors C1f and the like have, for example, a substantially cylindrical shape, are installed on the right surface of the second substrate 34 so as to protrude rightward from the second substrate 34, and are arranged along the depth direction. Has been placed.

  In the present modification, a space 71I (see FIG. 5) between the component surface 30a of the first substrate 30 and the heat sink base 541 is surrounded by the first substrate 30 and the second substrates 32 and 34 in the housing 2. 13 is defined as a wind tunnel 70I.

  Further, the opposing surfaces 32a and 34a of the second substrates 32 and 34, the heat sink base 541, and the component surface 30a of the first substrate 30 surrounding the space 71I in which the fins 542I are disposed include the power modules PM1 to PM8. The cooling flow path 75I for cooling the is formed.

  Since the configuration other than the above can be configured in the same manner as the above embodiment, the description thereof is omitted.

  In the present modification, the heat sink 54I corresponds to an example of a second heat sink. Accordingly, the heat sink base 541 corresponds to an example of a second heat sink base, and the fin 542I corresponds to an example of a second fin.

  Also in this modification, the same effect as the above embodiment can be obtained.

(5-10. Tenth Modification)
Hereinafter, with reference to FIG. 14, differences and the like in the structure of the power conversion device of this modification will be described.

  As shown in FIG. 14, in the power conversion device 1 </ b> J of the present modification, the power modules PM <b> 5 to PM <b> 8 and the heat sink 52 are not disposed on the facing surface 34 a of the second substrate 34. That is, in this modification, only each of the power modules PM1 to PM4 is connected to each of the capacitors C1 to C4.

  In the present modification, the second substrate 34 is arranged on the left side of the component surface 30a of the first substrate 30 with respect to the above embodiment, and the arrangement interval between the second substrates 32 and 34 is smaller than that in the above embodiment. .

  The plurality of fins 542J of the heat sink 54J protrude downward from the heat sink base 541 between the fins 502 of the heat sink 50 and the second substrate 34 to the vicinity of the upper ends of the capacitors C1 to C4.

  In the present modification, a space 71J (see FIG. 5) between the component surface 30a of the first substrate 30 and the heat sink base 541 is enclosed by the first substrate 30 and the second substrates 32 and 34 in the housing 2. 14) is formed as a wind tunnel 70 </ b> J.

  Further, the heat sink bases 501 and 541, the opposing surface 34 a of the second substrate 34, and the first substrate 30 surrounding the space 76 J (the space surrounded by a two-dot chain line in FIG. 14) in which the fins 502 and 542 J are arranged. The component surface 30a forms a cooling flow path 75J for cooling the power modules PM1 to PM4, the capacitors C1 to C4, and the regenerative resistor R.

  Since the configuration other than the above can be configured in the same manner as the above embodiment, the description thereof is omitted.

  In this modification, the heat sink 54J corresponds to an example of a first heat sink. Therefore, the heat sink base 541 corresponds to an example of a first heat sink base, and the fin 542J corresponds to an example of a first fin.

  Also in this modification, the same effect as the above embodiment can be obtained.

(5-11. Eleventh Modification)
Hereinafter, with reference to FIG. 15, the difference from the above embodiment in the structure of the power conversion device of the present modification will be described.

  As shown in FIG. 15, in the power conversion device 1 </ b> K of the present modification, the power modules PM <b> 5 to PM <b> 8 and the heat sink 52 are not disposed on the facing surface 34 a of the second substrate 34. That is, in this modification, only each of the power modules PM1 to PM4 is connected to each of the capacitors C1 to C4.

  In the present modification, the second substrate 34 is arranged on the left side of the component surface 30a of the first substrate 30 with respect to the above embodiment, and the arrangement interval between the second substrates 32 and 34 is smaller than that in the above embodiment. .

  The heat sink base 501K of the heat sink 50K has a height direction dimension substantially equal to the height direction dimension of the second substrates 32 and 34, and a lower end position thereof substantially coincides with a lower end position of the second substrates 32 and 34. The plurality of fins 502K of the heat sink 50K protrude from the heat sink base 501K toward the right in the range from the upper end of the heat sink base 501K to the lower end thereof.

  The plurality of fins 542K of the heat sink 54K project downward from the heat sink base 541 between the fins 502K of the heat sink 50K and the second substrate 34 to the vicinity of the upper ends of the capacitors C1 to C4.

  In the present modification, the space 71K (see FIG. 5) between the component surface 30a of the first substrate 30 and the heat sink base 541 is surrounded by the first substrate 30 and the second substrates 32 and 34 in the housing 2. 15) is formed as a wind tunnel 70K.

  Further, the heat sink bases 501K and 541, the facing surface 34a of the second substrate 34, and the capacitors C1 to C4 surrounding the space 76K (the space surrounded by a two-dot chain line in FIG. 15) in which the fins 502K and 542K are arranged. And the component surface 30a of the first substrate 30 form a cooling channel 75K for cooling the power modules PM1 to PM4, the capacitors C1 to C4, and the regenerative resistor R.

  Since the configuration other than the above can be configured in the same manner as the above embodiment, the description thereof is omitted.

  In this modification, the heat sink 50K corresponds to an example of a second heat sink. Therefore, the heat sink base 501K corresponds to an example of a second heat sink base, and the fin 502K corresponds to an example of a second fin. The heat sink 54K corresponds to an example of a first heat sink. Therefore, the heat sink base 541 corresponds to an example of a first heat sink base, and the fin 542K corresponds to an example of a first fin.

  Also in this modification, the same effect as the above embodiment can be obtained.

(5-12. Twelfth Modification)
Hereinafter, with reference to FIG. 16, differences and the like in the structure of the power conversion device of the present modification from the above embodiment will be described.

  As shown in FIG. 16, in the power conversion device 1 </ b> L according to this modification, the power modules PM <b> 5 to PM <b> 8 and the heat sink 52 are not disposed on the facing surface 34 a of the second substrate 34. That is, in this modification, only each of the power modules PM1 to PM4 is connected to each of the capacitors C1 to C4. Further, the regenerative resistor R and the heat sink 54 are not disposed above the upper end portions 32b, 34b of the second substrates 32, 34.

  In the present modification, the second substrate 34 is arranged on the left side of the component surface 30a of the first substrate 30 with respect to the above embodiment, and the arrangement interval between the second substrates 32 and 34 is smaller than that in the above embodiment. .

  The heat sink base 501L of the heat sink 50L has a height direction dimension substantially equal to the height direction dimension of the second substrates 32 and 34, and a lower end position thereof substantially coincides with a lower end position of the second substrates 32 and 34. The plurality of fins 502L of the heat sink 50L protrude from the heat sink base 501L to the right in the range from the upper end of the heat sink base 501L to the lower end thereof. Specifically, among the plurality of fins 502L, the fin 502L corresponding to the upper side of the capacitors C1 to C4 in the height direction protrudes from the heat sink base 501L to the vicinity of the facing surface 34a of the second substrate 34. Among the plurality of fins 502L, the fins 502L corresponding to the capacitors C1 to C4 in the height direction protrude from the heat sink base 501L to the vicinity of the left side surface of the capacitors C1 to C4.

  In this modification, the housing 2 is surrounded by the first substrate 30 and the second substrates 32 and 34, and the component surface 30a of the first substrate 30 and the upper end portions 32b of the second substrates 32 and 34, A space 71L (a space surrounded by an alternate long and short dash line in FIG. 16) between the members (not shown) disposed above 34b is formed as a wind tunnel 70L.

  Further, the heat sink base 501L, the opposing surface 34a of the second substrate 34, and the second substrate surrounding the space 76L (the space surrounded by the two-dot chain line in FIG. 16) in which the fins 502L in the housing 2 are disposed. The members disposed above the upper end portions 32b, 34b of the 32, 34, the upper end portions and the left side surfaces of the capacitors C1 to C4, and the component surface 30a of the first substrate 30 are the power modules PM1 to PM4 and the capacitor C1. A cooling flow path 75L for cooling ~ C4 is formed.

  Since the configuration other than the above can be configured in the same manner as the above embodiment, the description thereof is omitted.

  In this modification, the heat sink 50L corresponds to an example of a second heat sink. Therefore, the heat sink base 501L corresponds to an example of a second heat sink base, and the fin 502L corresponds to an example of a second fin.

  Also in this modification, the same effect as the above embodiment can be obtained.

(5-13. Thirteenth Modification)
Hereinafter, with reference to FIG. 17, the difference from the above embodiment in the structure of the power conversion device of the present modification will be described.

  As shown in FIG. 17, in the power conversion device 1M of the present modification, the second substrate 34 is disposed on the left side of the above-described embodiment on the component surface 30a of the first substrate 30, and the second substrates 32 and 34 are disposed. The space | interval is smaller than the said embodiment.

  The heat sink 52M is disposed on the right surface of the second substrate 34. The heat sink base 521 of the heat sink 52M is disposed on the right surface of the second substrate 34 in parallel with the second substrates 32 and 34, and is fixed to the second substrate 34 via spacers SP2 disposed at the four corners, for example. The plurality of fins 522 of the heat sink 52M protrude from the heat sink base 521 along the width direction, that is, toward the right side, in a range slightly below the center in the height direction from the upper end of the heat sink base 521. .

  The plurality of fins 542M of the heat sink 54M protrude downward from the heat sink base 541 between the fins 502 of the heat sink 50 and the second substrate 34 to the vicinity of the upper ends of the capacitors C1 to C4.

  The power modules PM5 to PM8 are installed on the left surface of the heat sink base 521, and are arranged side by side along the depth direction.

  In the present modification, a space 71M (see FIG. 5) between the component surface 30a of the first substrate 30 and the heat sink base 541 is enclosed by the first substrate 30 and the second substrates 32 and 34 in the housing 2. A space surrounded by an alternate long and short dash line in FIG. 17 is formed as a wind tunnel 70M.

  Further, the heat sink bases 501 and 541 surrounding the space 76M (the space surrounded by the two-dot chain line in FIG. 17) in which the fins 502 and 542M are disposed in the housing 2, and the opposing surface 34a of the second substrate 34, The upper ends of the capacitors C1 to C4 form a cooling channel 75M for cooling the power modules PM1 to PM4, the capacitors C1 to C4, and the regenerative resistor R. The power modules PM5 to PM8 and the heat sink 52 arranged on the right surface of the second substrate 34 are arranged in a wind tunnel (not shown) different from the wind tunnel 70M.

  Since the configuration other than the above can be configured in the same manner as the above embodiment, the description thereof is omitted.

  In the present modification, the heat sink 54M corresponds to an example of a first heat sink. Therefore, the heat sink base 541 corresponds to an example of a first heat sink base, and the fin 542M corresponds to an example of a first fin.

  Also in this modification, the same effect as the above embodiment can be obtained. Moreover, in this modification, the structure of the 2nd board | substrates 32 and 34 can be made shared, and cost can be reduced.

  In the above description, when there are descriptions such as “vertical”, “parallel”, and “center”, the descriptions are not strict. That is, the terms “vertical”, “parallel”, “center”, etc., allow tolerances and errors in design and mean “substantially vertical”, “substantially parallel”, “substantially center”, etc. It is.

  In addition, in the above description, when there are descriptions such as “same”, “equal”, “different”, etc., in terms of external dimensions and sizes, the descriptions are not strict. That is, the terms “same”, “equal”, “different”, etc. mean that “tolerance and error in design and manufacturing are allowed”, “substantially the same”, “substantially equal”, “substantially different”, etc. It is.

  In addition to those already described above, the methods according to the above-described embodiments and modifications may be used in appropriate combination.

  In addition, although not illustrated one by one, the above-mentioned embodiment and each modification are implemented with various modifications within a range not departing from the gist thereof.

DESCRIPTION OF SYMBOLS 1 Power converter 1A-M Power converter 10 Power converter circuit 30 1st board | substrate 30a Component surface 32 2nd board | substrate 32a Opposing surface 32b Upper end part (An example of the front-end | tip part of the standing direction of a 2nd board | substrate)
32aa Lower end (an example of an end on the first substrate side)
32ab upper end (an example of an end opposite to the end on the first substrate side)
34 2nd board | substrate 34a Opposing surface 34b Upper end part (An example of the front-end | tip part of the standing direction of a 2nd board | substrate)
34aa Lower end (an example of an end on the first substrate side)
34ab upper end (an example of an end opposite to the end on the first substrate side)
50 heat sink 50A, B, E to G, K, L heat sink 52 heat sink 52A, B, E to G, M heat sink 54 heat sink 54A to C, G to K, M heat sink 58 heat sink 60 fan 501 heat sink base 501F, G, K , L heat sink base 502 fin 502A, B, E to G, K, L heat sink base 521 heat sink base 521F, G heat sink base 522 fin 522A, B, E to G fin 541 heat sink base 542 fin 542A to C, G to K, M Fin 581 Heat sink base 582 Fin 70 Wind tunnel 70E, F, H to M Wind tunnel 75 Cooling channel 75B, D to M Cooling channel C1 to 4 Capacitor C1a, b Capacitor C1c, d Capacitor C1e, f Capacitor L1 projecting length L2 protruding length L3 protruding length LE1 reactor PM1~8 power module R regenerative resistor (one example of a resistor)
Ra heat dissipation surface S1 arrangement interval

Claims (14)

A power conversion device for converting power,
A first substrate having a component surface on which components are arranged;
A first electronic component that generates heat when energized, disposed so that a main heat dissipating surface faces the component surface at a position spaced from the first substrate;
The power converter characterized by having. A first heat sink disposed between the first substrate and the first electronic component for cooling the first electronic component;
The first heat sink is
A first heat sink base disposed along the first substrate and provided with the first electronic component;
The power converter according to claim 1, further comprising: a plurality of first fins protruding from the first heat sink base toward the first substrate. The power conversion device according to claim 2, further comprising a fan for sending air to a space between the component surface of the first substrate and the first heat sink base. 4. The power conversion device according to claim 2, further comprising a second electronic component that is disposed so as to protrude from the first substrate toward the first heat sink and constitutes the power conversion circuit. 5. The first fin is
The power conversion device according to claim 4, wherein the power conversion device extends from the first heat sink base to the vicinity of the second electronic component. The second electronic component is
6. The power conversion device according to claim 4, wherein the number is at least two, and are arranged on the first substrate along a blowing direction of a fan. The first electronic component is
The power converter according to any one of claims 4 to 6, wherein the calorific value is larger than that of the second electronic component. Two second substrates erected so as to sandwich the second electronic component between the first substrate;
And a third electronic component disposed on the opposing surface of the two second substrates, closer to the first electronic component than the second electronic component, and constituting the power conversion circuit and generating heat when energized. The power conversion device according to claim 4, wherein the power conversion device is a power conversion device. The third electronic component is
At least two, disposed on each of the opposing surfaces of the two second substrates,
Two second heat sinks for cooling the third electronic component;
The second heat sink is
A second heat sink base disposed along the second substrate and provided with the third electronic component;
A plurality of second fins projecting from the second heat sink base along the facing direction of the facing surface;
The second fins protrude from the two second heat sink bases arranged opposite to each other on the opposing surfaces of the two second substrates so that the second fins protrude in a direction approaching each other with the first fin interposed therebetween. The power conversion device according to claim 8, wherein the power conversion device is disposed so as to sandwich an electronic component therebetween. The first electronic component and the third electronic component have different heating values,
The protruding length of the first fin from the first heat sink base and the protruding length of the second fin from the second heat sink base are:
The power converter according to claim 9, wherein the heat generation amount of the corresponding electronic component is longer. The first heat sink base, the two second heat sink bases, and the second electronic component have cooling channels for cooling the first electronic component, the second electronic component, and the third electronic component. It forms, The power converter device of Claim 9 or 10 characterized by the above-mentioned. The first heat sink is
12. The power conversion device according to claim 3, wherein an arrangement interval between the first substrate and the first heat sink base is equal to a diameter of the fan. The second electronic component is
A capacitor constituting the power conversion circuit;
The third electronic component is
The power conversion device according to any one of claims 8 to 12, wherein the power conversion device is a power module including a switching element constituting the power conversion circuit. The first electronic component is
It is a resistor, The power converter device of any one of Claims 1 thru | or 13 characterized by the above-mentioned.

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