JPWO2016006084A1 - Component mounter - Google Patents

Abstract

In the component mounter (10) capable of installing a plurality of component supply devices (20) side by side on the upper surface of the support base (14), the case (21) of the component supply device (20) is formed of a material having high thermal conductivity, A heat radiating fin (62) is formed on a surface of the support base (14) which is the back side of the component supply device installation surface, and a cooling fan (64) for generating an air flow is provided on the heat radiating fin (62). Thus, the heat generated by the heat source (drive motor (26), control board (28), etc.) of the component supply device (20) is transmitted to the support base (14) via the case (21), and the support base (14 ) Can be dissipated. As a result, the component supply device (20) can be efficiently cooled.

Description

  The present invention relates to a component mounter that picks up a component and mounts it on a mounting target.

2. Description of the Related Art Conventionally, as this type of component mounting machine, there is known a component mounting device that includes a component supply device that supplies a component by pulling out a tape in which the component is stored at a predetermined interval from the reel. For example, in Patent Document 1, after pulling out an electronic component carrier composed of a carrier tape in which pockets for storing electronic components are formed at regular intervals and a top cover tape attached to the upper surface of the carrier tape from the reel, In the component supply apparatus that peels the top cover tape from the electronic component transport body and transports the electronic component transport body from which the top cover tape has been peeled, the electronic component transport body before the top cover tape is peeled includes ions. What blows air is disclosed.
JP 2011-54807 A

  In such a component supply apparatus, it is necessary to output a relatively large current to the motor in order to ensure motor torque necessary for component conveyance (tape feeding), and the motor and the control board tend to generate heat. On the other hand, in recent years, the thickness of component supply devices has been reduced, and it is common to arrange a large number of component supply devices side by side for one component mounter. For this reason, the component supply device has a small escape space for heat from a heat source such as a motor or a control board, which causes an increase in the temperature of the device.

  An object of the present invention is to efficiently cool a plurality of component supply devices that are arranged and held on a holding table of a component mounting machine.

  The present invention adopts the following means in order to achieve the main object described above.

The component mounter of the present invention is
A component mounter that picks up a component and mounts it on a mounting object.
A component supply device for supplying components;
A holding table for holding a plurality of the component supply devices side by side;
A heat transfer section for transferring heat generated by the component supply device to the holding table;
And a cooling device for cooling the holding table.

  The component mounter of the present invention includes a holding table that holds a plurality of component supply devices side by side. Heat generated by the component supply device is transmitted to the holding table by the heat transfer unit, and the holding table is cooled by the cooling device. . Thereby, the several component supply apparatus arrange | positioned along with the holding stand can be cooled efficiently, and the temperature of an apparatus can be managed appropriately.

  In such a component mounting machine according to the present invention, the cooling device generates an air flow on a surface of the holding table opposite to a surface that holds the component supply device, thereby exchanging heat with the air. The holding table can be cooled. In the component mounting machine of the present invention of this aspect, the holding table can be cooled by generating an air flow from the inside of the component mounting machine to the outside of the machine. In this way, it is possible to suppress heat from being accumulated in the mounting machine. In these cases, a fin for heat radiation can be provided on the surface (back side) opposite to the surface holding the component supply device of the holding table. In this way, the cooling of the holding table can be further promoted.

  Alternatively, in the component mounting machine of the present invention, the cooling device includes a circulation path for circulating the refrigerant in the holding table, and cools the holding table by heat exchange with the refrigerant circulating in the circulation path. You can also.

  In the component mounter of the present invention, the holding table may include a bottom surface support portion that supports the bottom surface of the component supply device, and the cooling device may cool the bottom surface support portion.

It is a block diagram which shows the outline of a structure of the component mounting machine 10 as one Example of this invention. It is a block diagram which shows the outline of a structure of the components supply apparatus 20 of an Example. It is a block diagram which shows the outline of a structure of the cooling device 60 of an Example. It is a block diagram which shows the outline of a structure of the cooling device 160 of a modification.

  The form for implementing this invention is demonstrated using an Example.

  FIG. 1 is a configuration diagram showing an outline of the configuration of a component mounter 10 as an embodiment of the present invention, and FIG. 2 is a configuration diagram showing an overview of the configuration of a component supply apparatus 20 of the embodiment. 3 is a configuration diagram illustrating an outline of the configuration of the cooling device 60 of the embodiment. 1 is the X-axis direction, the front (front) and rear (back) directions are the Y-axis directions, and the vertical direction is the Z-axis directions.

  As shown in FIG. 1, the component mounter 10 includes a base 11 and a main body frame 12 supported by the base 11. As shown in FIG. 1, the component mounter 10 is a component that is detachably installed on a support base 14 provided at a lower stage portion of the main body frame 12, a board transport device 30 that transports a board, and the support base 14. The component supply device 20 for supplying the components, the head 50 for adsorbing the components supplied by the component supply device 20 to the suction nozzle 52 and mounting them on the substrate conveyed by the substrate conveyance device 30, and moving the head 50 in the XY direction An XY robot 40 for cooling, a cooling device 60 (see FIG. 3) for cooling the component supply device 20, and a control device (not shown) for controlling the entire mounting machine. In addition to the above, the component mounter 10 takes an image of a picking posture of a component that is picked up by a mark camera 46 for picking up a board positioning reference mark provided on the board provided on the head 50 and the picking nozzle 52. A parts camera 48 is also provided.

  As shown in FIG. 1, the substrate transfer device 30 is configured as a dual-lane transfer device provided with two substrate transfer paths in this embodiment, and is a front-rear direction (Y-axis direction) of the support base 14. It is installed in the center. The substrate transport device 30 includes a belt conveyor device 32, and transports the substrate from the left to the right (substrate transport direction) in FIG. 1 by driving the belt conveyor device 32. Further, a backup plate 34 that can be moved up and down by a lifting device (not shown) is provided in the center of the substrate transport direction (X-axis direction) of the substrate transport device 30, and the substrate is placed above the backup plate 34 by the substrate transport device 30. When transported, the substrate is backed up from the back side by raising the backup plate 34.

  As shown in FIG. 1, the XY robot 40 includes a pair of left and right Y-axis guide rails 43 provided on the upper portion of the main body frame 12 along the front-rear direction (Y-axis direction), and a pair of left and right Y-axis guide rails 43. A long Y-axis slider 44 that can move along the Y-axis guide rail 43 in a state of being stretched over the X-axis, and an X provided on the lower surface of the Y-axis slider 44 along the left-right direction (X-axis direction) An axis guide rail 41 and an X axis slider 42 that can move along the X axis guide rail 41 are provided. A head 50 is attached to the X-axis slider 42, and the control device can move the head 50 to an arbitrary position on the XY plane by driving and controlling the XY robot 40.

  The component supply device 20 is positioned on the support base 14 by inserting the pins 23 into pin holes (not shown) formed in the support base 14, and a plurality of parts supply devices 20 are arranged and aligned on the support base 14 in the left-right direction (X-axis direction). The The component supply device 20 is a tape feeder that sends out a carrier tape containing components at a predetermined pitch to a component supply position where the head 50 (suction nozzle 52) can pick up. The carrier tape includes a bottom tape in which cavities (recesses) are formed at a predetermined pitch in the longitudinal direction, and a top film attached to the upper surface of the bottom tape in a state where components are accommodated in the respective cavities. Thus, sprocket holes (not shown) with which sprocket teeth 25a described later are engaged are formed at the side edges at a predetermined pitch.

  Further, as shown in FIG. 2, the component supply device 20 includes a substantially rectangular case 21, a tape reel 22 around which a carrier tape is wound, and a component that is accommodated in the case 21 and is pulled out from the tape reel 22. A tape feeding mechanism 24 that feeds to the supply position, a peeling unit (not shown) that is provided in front of the component supply position and peels the top film from the bottom tape to expose the component (a component can be picked up), and a case 21 And a control board 28 for controlling the entire apparatus. The top film peeled off by the peeling portion is guided downward by a guide groove (not shown) formed on the outer periphery of the case 21 and collected in the dust box 72 installed on the base 11. The bottom tape fed out by the tape feeding mechanism 24 and taken out at the parts supply position is guided to the tape cutting mechanism 70 and cut finely, and then collected in the dust box 72 below.

  The tape feed mechanism 24 is provided on a sprocket 25 having sprocket teeth formed on the outer periphery, a drive motor 26 (for example, a stepping motor), a gear 24 a provided on the rotation shaft of the sprocket 25, and a rotation shaft of the drive motor 26. And a transmission gear 24c for connecting the gear 24b. The tape feeding mechanism 24 pitches the carrier tape by engaging the sprocket teeth in the sprocket holes formed in the carrier tape and intermittently rotating the sprocket 25 by driving the drive motor 26.

  The control board 28 is configured as a microprocessor including a CPU, ROM, RAM, and the like, and receives a detection signal from an optical sensor 27 that detects the rotational position of the sprocket 25 and is driven by a built-in motor driver (drive circuit). A signal is generated and output to the drive motor 26. The control board 28 is communicably connected to the control device of the component mounter 10 via the connector 29, and exchanges control signals and data with each other. The connector 29 is configured as a power supply connector that receives power from the component mounting machine 10 and supplies the power to each part such as the tape feeding mechanism 24 (drive motor 26) and the control board 28.

  In this embodiment, the case 21 is formed of a material having high thermal conductivity such as aluminum or aluminum alloy, and transfers heat generated by a heat source such as the drive motor 26 or the control board 28 (motor driver) to the support base 14. It functions as a heat transfer member.

  Devices such as the drive motor 26 and the control board 28 of the component supply device 20 serve as heat sources that generate heat when driven. These heat sources are arranged at positions closer to the surface (bottom surface) that comes into contact with the feeder installation surface of the support base 14 as the heat generation amount increases. In the present embodiment, the control board 28 with a built-in motor driver generates more heat than the drive motor 26, and therefore is disposed at a position closer to the bottom surface of the case 21 than the drive motor 26, as shown in FIG. 2. Thereby, the heat generated in the control board 28 can be efficiently released to the support base 14. Of course, when the drive motor 26 generates more heat than the control board 28, the drive motor 26 may be disposed closer to the bottom surface of the case 21 than the control board 28.

  The cooling device 60 includes a plurality of radiating fins 62 formed on a surface on the back side of the feeder installation surface of the support base 14, and a cooling fan 64 that generates an air flow around the radiating fins 62. The cooling fan 64 is installed such that the air flow direction (air blowing direction) is directed from the inside of the component mounting machine 10 to the outside of the machine. For this reason, the air warmed by the heat exchange by the heat radiating fins 62 is discharged outside the apparatus.

  Here, the component supply device 20 needs to apply a relatively large current to the drive motor 26 in order to ensure the torque necessary for tape feeding. For this reason, the drive motor 26 and the control board 28 (motor driver) which controls this serve as a heat source. On the other hand, as shown in FIG. 1, since a plurality of component supply devices 20 are usually installed in a state of being aligned with the support table 14, when the component supply device 20 generates heat, there is less heat escape space and temperature. It is likely to cause a rise. For this reason, for example, the drive of the drive motor 26 is limited, and there are cases where components cannot be supplied normally. In addition, for example, static temperature is generated in the carrier tape by causing the temperature around the support base 14 to increase and lowering the ambient humidity, and the component sticks to the bottom tape due to static electricity or the component jumps with the peeling operation of the top tape. In other words, the suction nozzle 52 may not be able to take out the component normally (suction displacement or suction error occurs). Therefore, in the present embodiment, heat from the heat source of the component supply device 20 is transmitted to the support base 14 via the case 21, and an air flow is generated in the support base 14 to cool the support base 14 by heat exchange with air. By doing so, the component supply device 20 is cooled to suppress the occurrence of the above-described problems.

  According to the component mounter 10 of the embodiment described above, the case 21 of the component supply device 20 is formed of a material having a high thermal conductivity in the case where a plurality of component supply devices 20 can be installed on the upper surface of the support base 14. A cooling fan 62 for generating an air flow is provided on the back surface of the support base 14 on the feeder installation surface. Thereby, the heat generated by the heat source (such as the drive motor 26 and the control board 28) of the component supply device 20 can be transmitted to the support base 14 through the case 21 and efficiently radiated from the support base 14. As a result, the component supply device 20 can be efficiently cooled.

  Moreover, according to the component mounting machine 10 of the present embodiment, since the heat radiation fins 62 are formed on the surface on the back side of the feeder installation surface of the support base 14, the heat dissipation from the support base 14 can be promoted, and the cooling performance Can be further enhanced.

  Furthermore, according to the component mounting machine 10 of the embodiment, since the cooling fan 64 is installed so that the air flow direction (air blowing direction) is directed from the inside of the machine to the outside of the machine, the heat with the support base 14 (radiation fins 62). The air warmed by the exchange can be discharged outside the apparatus, and the temperature rise in the apparatus can be suppressed.

  Further, according to the component mounting machine 10 of the embodiment, the heat source (the drive motor 26, the control board 28, etc.) of the component supply device 20 that generates a large amount of heat (the control board 28) is replaced with the feeder installation surface of the support base 14. Therefore, the heat from the heat source can be efficiently radiated to the support base 14.

  In this embodiment, the radiating fins 62 are formed on the back surface of the support base 14. However, the present invention is not limited to this, and the radiating fins 62 may not be formed.

  In the present embodiment, the cooling device 60 is configured using the cooling fan 64, but is not limited thereto. The support table 14 may be cooled by circulating cooling water (refrigerant) through the support table 14. FIG. 4 shows a modified cooling device 160. The cooling device 160 according to the modification includes a circulation path 162 provided on the support base 14, a pump 164 that circulates cooling water (refrigerant) in the circulation path 162, and heat of the cooling water (refrigerant) that circulates in the circulation path 162. And a radiator 166 for radiating heat. Thereby, the component supply apparatus 20 can be effectively cooled by cooling the support base 14.

  In the present embodiment, the case 21 is made to function as a heat transfer member that transmits heat from the heat source to the support base 14, but is not limited thereto, and is made of a material having high thermal conductivity (such as copper or copper alloy). It is good also as what arranges the formed heat-transfer member, heat-transfer gel, etc. in a heat source separately.

  In the present embodiment, the present invention is applied to the cooling of the component supply device 20 as a tape feeder disposed on the support base 14. However, the present invention is not limited to this. For example, a plurality of electronic components are separated. As long as it is a component supply device equipped with a heat source (motor, solenoid, control board, etc.) such as a bulk feeder that accommodates the electronic components in a row and supplies them in a row, it may be applied to any device. . In addition, when a unit other than a feeder (for example, a flux application unit that applies flux to components or a nozzle cleaning unit that cleans the suction nozzle 52) is installed on the support base 14, the present invention is applied to cooling these units. It is also possible.

  Here, the correspondence between the main elements of the present embodiment and the main elements of the invention described in the column of means for solving the problems will be described. That is, the component supply device 20 (tape feeder) corresponds to a “component supply device”, the support base 14 corresponds to a “holding base”, the case 21 corresponds to a “heat transfer section”, and the cooling devices 60 and 160 correspond to each other. Corresponds to “cooling device”.

  In addition, this invention is not limited to the Example mentioned above at all, and as long as it belongs to the technical scope of this invention, it cannot be overemphasized that it can implement with a various aspect.

  The present invention can be used in the manufacturing industry of component mounters.

  DESCRIPTION OF SYMBOLS 10 Component mounting machine, 11 base, 12 body frame, 14 support stand, 20 component supply apparatus, 21 case, 22 tape reel, 23 pin, 24 tape feed mechanism, 24a, 24b gear, 24c transmission gear, 25 sprocket, 26 Drive motor, 27 Optical sensor, 28 Control board, 29 Connector, 30 Board transfer device, 32 Belt conveyor device, 34 Backup plate, 40 XY robot, 41 X axis guide rail, 42 X axis slider, 43 Y axis guide rail, 44 Y axis slider, 46 mark camera, 48 parts camera, 50 head, 51 suction nozzle, 60, 162 cooling device, 62 heat radiation fin, 64 cooling fan, 70 tape cutting mechanism, 72 dust box, 162 circulation path, 164 pump, 166 radiator .

Claims (5)

A component mounter that picks up a component and mounts it on a mounting object.
A component supply device for supplying components;
A holding table for holding a plurality of the component supply devices side by side;
A heat transfer section for transferring heat generated by the component supply device to the holding table;
A component mounter comprising: a cooling device that cools the holding table. The component mounting machine according to claim 1,
The cooling device cools the holding table by heat exchange with the air by generating an air flow on a surface of the holding table opposite to a surface holding the component supply device. Component mounting machine. The component mounting machine according to claim 2,
The cooling device cools the holding table by generating an air flow from the inside of the component mounting machine to the outside of the machine. The component mounting machine according to claim 1,
The cooling apparatus includes a circulation path that circulates a refrigerant in the holding table, and cools the holding table by heat exchange with a refrigerant that circulates in the circulation path. The component mounting machine according to any one of claims 1 to 4,
The holding table has a bottom surface support portion that supports the bottom surface of the component supply device,
The component mounting machine, wherein the cooling device cools the bottom surface support portion.

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