JPWO2015053412A1 - Curable silicone composition and optical semiconductor device - Google Patents
Curable silicone composition and optical semiconductor device Download PDFInfo
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- JPWO2015053412A1 JPWO2015053412A1 JP2015541665A JP2015541665A JPWO2015053412A1 JP WO2015053412 A1 JPWO2015053412 A1 JP WO2015053412A1 JP 2015541665 A JP2015541665 A JP 2015541665A JP 2015541665 A JP2015541665 A JP 2015541665A JP WO2015053412 A1 JPWO2015053412 A1 JP WO2015053412A1
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- optical semiconductor
- curable silicone
- silicone composition
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- 239000000203 mixture Substances 0.000 title claims abstract description 84
- 230000003287 optical effect Effects 0.000 title claims abstract description 61
- 229920001296 polysiloxane Polymers 0.000 title claims abstract description 60
- 239000004065 semiconductor Substances 0.000 title claims abstract description 59
- 150000001875 compounds Chemical class 0.000 claims abstract description 27
- 125000003342 alkenyl group Chemical group 0.000 claims abstract description 25
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims abstract description 24
- 239000007809 chemical reaction catalyst Substances 0.000 claims abstract description 11
- 229910052751 metal Inorganic materials 0.000 claims abstract description 11
- 239000002184 metal Substances 0.000 claims abstract description 11
- 238000006459 hydrosilylation reaction Methods 0.000 claims abstract description 7
- 238000006482 condensation reaction Methods 0.000 claims abstract description 6
- 229920006136 organohydrogenpolysiloxane Polymers 0.000 claims abstract description 6
- 150000003852 triazoles Chemical class 0.000 claims abstract description 4
- -1 benzotriazole compound Chemical class 0.000 claims description 64
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 20
- 229910052710 silicon Inorganic materials 0.000 claims description 20
- 125000000217 alkyl group Chemical group 0.000 claims description 14
- 239000012964 benzotriazole Substances 0.000 claims description 14
- 239000010703 silicon Substances 0.000 claims description 13
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 claims description 11
- CMGDVUCDZOBDNL-UHFFFAOYSA-N 4-methyl-2h-benzotriazole Chemical compound CC1=CC=CC2=NNN=C12 CMGDVUCDZOBDNL-UHFFFAOYSA-N 0.000 claims description 8
- 229910004283 SiO 4 Inorganic materials 0.000 claims description 8
- KFJDQPJLANOOOB-UHFFFAOYSA-N 2h-benzotriazole-4-carboxylic acid Chemical compound OC(=O)C1=CC=CC2=NNN=C12 KFJDQPJLANOOOB-UHFFFAOYSA-N 0.000 claims description 5
- UTMDJGPRCLQPBT-UHFFFAOYSA-N 4-nitro-1h-1,2,3-benzotriazole Chemical compound [O-][N+](=O)C1=CC=CC2=NNN=C12 UTMDJGPRCLQPBT-UHFFFAOYSA-N 0.000 claims description 4
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 4
- 150000002902 organometallic compounds Chemical class 0.000 claims description 3
- GUOVBFFLXKJFEE-UHFFFAOYSA-N 2h-benzotriazole-5-carboxylic acid Chemical compound C1=C(C(=O)O)C=CC2=NNN=C21 GUOVBFFLXKJFEE-UHFFFAOYSA-N 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims description 2
- 239000000565 sealant Substances 0.000 claims description 2
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 1
- 239000000758 substrate Substances 0.000 abstract description 9
- 238000010521 absorption reaction Methods 0.000 abstract description 5
- 239000000047 product Substances 0.000 description 24
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 20
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 16
- 229910052782 aluminium Inorganic materials 0.000 description 15
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 14
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 10
- 239000007983 Tris buffer Substances 0.000 description 9
- 239000003054 catalyst Substances 0.000 description 9
- 125000003545 alkoxy group Chemical group 0.000 description 8
- 125000004432 carbon atom Chemical group C* 0.000 description 8
- 229920001577 copolymer Polymers 0.000 description 8
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 229910052697 platinum Inorganic materials 0.000 description 7
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 239000002253 acid Substances 0.000 description 6
- 150000002430 hydrocarbons Chemical group 0.000 description 6
- POILWHVDKZOXJZ-ARJAWSKDSA-M (z)-4-oxopent-2-en-2-olate Chemical compound C\C([O-])=C\C(C)=O POILWHVDKZOXJZ-ARJAWSKDSA-M 0.000 description 5
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 5
- 125000003710 aryl alkyl group Chemical group 0.000 description 5
- 125000003118 aryl group Chemical group 0.000 description 5
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 5
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- 229920001843 polymethylhydrosiloxane Chemical group 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229910052726 zirconium Inorganic materials 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical group [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 4
- 229910052693 Europium Inorganic materials 0.000 description 4
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 4
- 238000005481 NMR spectroscopy Methods 0.000 description 4
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 4
- 229910052801 chlorine Inorganic materials 0.000 description 4
- 125000001309 chloro group Chemical group Cl* 0.000 description 4
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 4
- 239000004205 dimethyl polysiloxane Substances 0.000 description 4
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 4
- BITPLIXHRASDQB-UHFFFAOYSA-N ethenyl-[ethenyl(dimethyl)silyl]oxy-dimethylsilane Chemical compound C=C[Si](C)(C)O[Si](C)(C)C=C BITPLIXHRASDQB-UHFFFAOYSA-N 0.000 description 4
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 4
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 4
- 229910052731 fluorine Inorganic materials 0.000 description 4
- 125000001153 fluoro group Chemical group F* 0.000 description 4
- 238000005227 gel permeation chromatography Methods 0.000 description 4
- 125000005843 halogen group Chemical group 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 4
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- IEKHISJGRIEHRE-UHFFFAOYSA-N 16-methylheptadecanoic acid;propan-2-ol;titanium Chemical compound [Ti].CC(C)O.CC(C)CCCCCCCCCCCCCCC(O)=O.CC(C)CCCCCCCCCCCCCCC(O)=O.CC(C)CCCCCCCCCCCCCCC(O)=O IEKHISJGRIEHRE-UHFFFAOYSA-N 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 229910052684 Cerium Inorganic materials 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- UMHKOAYRTRADAT-UHFFFAOYSA-N [hydroxy(octoxy)phosphoryl] octyl hydrogen phosphate Chemical compound CCCCCCCCOP(O)(=O)OP(O)(=O)OCCCCCCCC UMHKOAYRTRADAT-UHFFFAOYSA-N 0.000 description 3
- 239000002318 adhesion promoter Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 125000001931 aliphatic group Chemical group 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 3
- 125000005388 dimethylhydrogensiloxy group Chemical group 0.000 description 3
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 3
- YRMWCMBQRGFNIZ-UHFFFAOYSA-N ethyl 3-oxobutanoate;zirconium Chemical compound [Zr].CCOC(=O)CC(C)=O YRMWCMBQRGFNIZ-UHFFFAOYSA-N 0.000 description 3
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 238000003384 imaging method Methods 0.000 description 3
- 230000001771 impaired effect Effects 0.000 description 3
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 3
- 125000001971 neopentyl group Chemical group [H]C([*])([H])C(C([H])([H])[H])(C([H])([H])[H])C([H])([H])[H] 0.000 description 3
- 150000004767 nitrides Chemical class 0.000 description 3
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 150000003961 organosilicon compounds Chemical class 0.000 description 3
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 3
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- KWEKXPWNFQBJAY-UHFFFAOYSA-N (dimethyl-$l^{3}-silanyl)oxy-dimethylsilicon Chemical compound C[Si](C)O[Si](C)C KWEKXPWNFQBJAY-UHFFFAOYSA-N 0.000 description 2
- YOBOXHGSEJBUPB-MTOQALJVSA-N (z)-4-hydroxypent-3-en-2-one;zirconium Chemical compound [Zr].C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O YOBOXHGSEJBUPB-MTOQALJVSA-N 0.000 description 2
- QYLFHLNFIHBCPR-UHFFFAOYSA-N 1-ethynylcyclohexan-1-ol Chemical compound C#CC1(O)CCCCC1 QYLFHLNFIHBCPR-UHFFFAOYSA-N 0.000 description 2
- QWENRTYMTSOGBR-UHFFFAOYSA-N 1H-1,2,3-Triazole Chemical compound C=1C=NNN=1 QWENRTYMTSOGBR-UHFFFAOYSA-N 0.000 description 2
- SDTMFDGELKWGFT-UHFFFAOYSA-N 2-methylpropan-2-olate Chemical compound CC(C)(C)[O-] SDTMFDGELKWGFT-UHFFFAOYSA-N 0.000 description 2
- 125000000094 2-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 2
- NSPMIYGKQJPBQR-UHFFFAOYSA-N 4H-1,2,4-triazole Chemical compound C=1N=CNN=1 NSPMIYGKQJPBQR-UHFFFAOYSA-N 0.000 description 2
- KLSJWNVTNUYHDU-UHFFFAOYSA-N Amitrole Chemical compound NC1=NC=NN1 KLSJWNVTNUYHDU-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000005749 Copper compound Substances 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- WDJHALXBUFZDSR-UHFFFAOYSA-M acetoacetate Chemical compound CC(=O)CC([O-])=O WDJHALXBUFZDSR-UHFFFAOYSA-M 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 125000004429 atom Chemical group 0.000 description 2
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 2
- 150000001845 chromium compounds Chemical class 0.000 description 2
- 150000001869 cobalt compounds Chemical class 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 150000001880 copper compounds Chemical class 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- HTDKEJXHILZNPP-UHFFFAOYSA-N dioctyl hydrogen phosphate Chemical compound CCCCCCCCOP(O)(=O)OCCCCCCCC HTDKEJXHILZNPP-UHFFFAOYSA-N 0.000 description 2
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 2
- 239000002223 garnet Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 150000002363 hafnium compounds Chemical class 0.000 description 2
- HMKGKDSPHSNMTM-UHFFFAOYSA-N hafnium;propan-2-ol Chemical compound [Hf].CC(C)O.CC(C)O.CC(C)O.CC(C)O HMKGKDSPHSNMTM-UHFFFAOYSA-N 0.000 description 2
- 125000006038 hexenyl group Chemical group 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 150000002472 indium compounds Chemical class 0.000 description 2
- 150000002506 iron compounds Chemical class 0.000 description 2
- 150000002604 lanthanum compounds Chemical class 0.000 description 2
- QWDJLDTYWNBUKE-UHFFFAOYSA-L magnesium bicarbonate Chemical compound [Mg+2].OC([O-])=O.OC([O-])=O QWDJLDTYWNBUKE-UHFFFAOYSA-L 0.000 description 2
- 150000002681 magnesium compounds Chemical class 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 125000001624 naphthyl group Chemical group 0.000 description 2
- 150000002816 nickel compounds Chemical class 0.000 description 2
- WRKCIHRWQZQBOL-UHFFFAOYSA-N octyl dihydrogen phosphate Chemical compound CCCCCCCCOP(O)(O)=O WRKCIHRWQZQBOL-UHFFFAOYSA-N 0.000 description 2
- 125000000962 organic group Chemical group 0.000 description 2
- 125000004344 phenylpropyl group Chemical group 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 239000003223 protective agent Substances 0.000 description 2
- SMQUZDBALVYZAC-UHFFFAOYSA-N salicylaldehyde Chemical compound OC1=CC=CC=C1C=O SMQUZDBALVYZAC-UHFFFAOYSA-N 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 125000004469 siloxy group Chemical group [SiH3]O* 0.000 description 2
- XTQHKBHJIVJGKJ-UHFFFAOYSA-N sulfur monoxide Chemical compound S=O XTQHKBHJIVJGKJ-UHFFFAOYSA-N 0.000 description 2
- 150000003606 tin compounds Chemical class 0.000 description 2
- 150000003609 titanium compounds Chemical class 0.000 description 2
- 125000003944 tolyl group Chemical group 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 229930195735 unsaturated hydrocarbon Natural products 0.000 description 2
- 125000005023 xylyl group Chemical group 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- 150000003752 zinc compounds Chemical class 0.000 description 2
- 150000003755 zirconium compounds Chemical class 0.000 description 2
- HMVBQEAJQVQOTI-SOFGYWHQSA-N (e)-3,5-dimethylhex-3-en-1-yne Chemical compound CC(C)\C=C(/C)C#C HMVBQEAJQVQOTI-SOFGYWHQSA-N 0.000 description 1
- GRGVQLWQXHFRHO-AATRIKPKSA-N (e)-3-methylpent-3-en-1-yne Chemical compound C\C=C(/C)C#C GRGVQLWQXHFRHO-AATRIKPKSA-N 0.000 description 1
- YFSYFAJGRGDWQT-KTKRTIGZSA-N (z)-1-(benzotriazol-1-yl)octadec-9-en-1-one Chemical compound C1=CC=C2N(C(=O)CCCCCCC\C=C/CCCCCCCC)N=NC2=C1 YFSYFAJGRGDWQT-KTKRTIGZSA-N 0.000 description 1
- SKWCWFYBFZIXHE-LNTINUHCSA-K (z)-4-bis[[(z)-4-oxopent-2-en-2-yl]oxy]indiganyloxypent-3-en-2-one Chemical compound [In+3].C\C([O-])=C\C(C)=O.C\C([O-])=C\C(C)=O.C\C([O-])=C\C(C)=O SKWCWFYBFZIXHE-LNTINUHCSA-K 0.000 description 1
- SHWZFQPXYGHRKT-FDGPNNRMSA-N (z)-4-hydroxypent-3-en-2-one;nickel Chemical compound [Ni].C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O SHWZFQPXYGHRKT-FDGPNNRMSA-N 0.000 description 1
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- MDTUWBLTRPRXBX-UHFFFAOYSA-N 1,2,4-triazol-3-one Chemical compound O=C1N=CN=N1 MDTUWBLTRPRXBX-UHFFFAOYSA-N 0.000 description 1
- FMCUPJKTGNBGEC-UHFFFAOYSA-N 1,2,4-triazol-4-amine Chemical compound NN1C=NN=C1 FMCUPJKTGNBGEC-UHFFFAOYSA-N 0.000 description 1
- ZEWJFUNFEABPGL-UHFFFAOYSA-N 1,2,4-triazole-3-carboxamide Chemical compound NC(=O)C=1N=CNN=1 ZEWJFUNFEABPGL-UHFFFAOYSA-N 0.000 description 1
- LZTSCEYDCZBRCJ-UHFFFAOYSA-N 1,2-dihydro-1,2,4-triazol-3-one Chemical compound OC=1N=CNN=1 LZTSCEYDCZBRCJ-UHFFFAOYSA-N 0.000 description 1
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical class C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 description 1
- AJARSKDYXXACJR-UHFFFAOYSA-N 1-[(dibutylamino)methyl]benzotriazole-4-carboxylic acid Chemical compound C1=CC=C2N(CN(CCCC)CCCC)N=NC2=C1C(O)=O AJARSKDYXXACJR-UHFFFAOYSA-N 0.000 description 1
- LQPDFQFGNCXQSL-UHFFFAOYSA-N 1-[(dioctylamino)methyl]benzotriazole-4-carboxylic acid Chemical compound C1=CC=C2N(CN(CCCCCCCC)CCCCCCCC)N=NC2=C1C(O)=O LQPDFQFGNCXQSL-UHFFFAOYSA-N 0.000 description 1
- KGEPBYXGRXRFGU-UHFFFAOYSA-N 1-[[bis(2-ethylhexyl)amino]methyl]benzotriazole-4-carboxylic acid Chemical compound C1=CC=C2N(CN(CC(CC)CCCC)CC(CC)CCCC)N=NC2=C1C(O)=O KGEPBYXGRXRFGU-UHFFFAOYSA-N 0.000 description 1
- OILIWDRDPKUVBC-UHFFFAOYSA-N 1-[[bis(2-hydroxyethyl)amino]methyl]benzotriazole-4-carboxylic acid Chemical compound C1=CC=C2N(CN(CCO)CCO)N=NC2=C1C(O)=O OILIWDRDPKUVBC-UHFFFAOYSA-N 0.000 description 1
- DYNVQVFAPOVHNT-UHFFFAOYSA-N 1-[[bis(2-hydroxypropyl)amino]methyl]benzotriazole-4-carboxylic acid Chemical compound C1=CC=C2N(CN(CC(C)O)CC(O)C)N=NC2=C1C(O)=O DYNVQVFAPOVHNT-UHFFFAOYSA-N 0.000 description 1
- HIQAWCBKWSQMRQ-UHFFFAOYSA-N 16-methylheptadecanoic acid;2-methylprop-2-enoic acid;propan-2-ol;titanium Chemical compound [Ti].CC(C)O.CC(=C)C(O)=O.CC(=C)C(O)=O.CC(C)CCCCCCCCCCCCCCC(O)=O HIQAWCBKWSQMRQ-UHFFFAOYSA-N 0.000 description 1
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- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- LYTNHSCLZRMKON-UHFFFAOYSA-L oxygen(2-);zirconium(4+);diacetate Chemical compound [O-2].[Zr+4].CC([O-])=O.CC([O-])=O LYTNHSCLZRMKON-UHFFFAOYSA-L 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 1
- 125000002255 pentenyl group Chemical group C(=CCCC)* 0.000 description 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 1
- PARWUHTVGZSQPD-UHFFFAOYSA-N phenylsilane Chemical compound [SiH3]C1=CC=CC=C1 PARWUHTVGZSQPD-UHFFFAOYSA-N 0.000 description 1
- 238000001782 photodegradation Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- PIZSEPSUZMIOQF-UHFFFAOYSA-N platinum;2,4,6,8-tetrakis(ethenyl)-2,4,6,8-tetramethyl-1,3,5,7,2,4,6,8-tetraoxatetrasilocane Chemical class [Pt].C=C[Si]1(C)O[Si](C)(C=C)O[Si](C)(C=C)O[Si](C)(C=C)O1 PIZSEPSUZMIOQF-UHFFFAOYSA-N 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920000193 polymethacrylate Polymers 0.000 description 1
- XPGAWFIWCWKDDL-UHFFFAOYSA-N propan-1-olate;zirconium(4+) Chemical compound [Zr+4].CCC[O-].CCC[O-].CCC[O-].CCC[O-] XPGAWFIWCWKDDL-UHFFFAOYSA-N 0.000 description 1
- ZGSOBQAJAUGRBK-UHFFFAOYSA-N propan-2-olate;zirconium(4+) Chemical compound [Zr+4].CC(C)[O-].CC(C)[O-].CC(C)[O-].CC(C)[O-] ZGSOBQAJAUGRBK-UHFFFAOYSA-N 0.000 description 1
- JTBKFHQUYVNHSR-UHFFFAOYSA-N propan-2-yloxyalumane Chemical compound CC(C)O[AlH2] JTBKFHQUYVNHSR-UHFFFAOYSA-N 0.000 description 1
- 125000002572 propoxy group Chemical group [*]OC([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 1
- 239000002683 reaction inhibitor Substances 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- GZCRRIHWUXGPOV-UHFFFAOYSA-N terbium atom Chemical compound [Tb] GZCRRIHWUXGPOV-UHFFFAOYSA-N 0.000 description 1
- UWHCKJMYHZGTIT-UHFFFAOYSA-N tetraethylene glycol Chemical compound OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- VXUYXOFXAQZZMF-UHFFFAOYSA-N titanium(IV) isopropoxide Chemical compound CC(C)O[Ti](OC(C)C)(OC(C)C)OC(C)C VXUYXOFXAQZZMF-UHFFFAOYSA-N 0.000 description 1
- MYWQGROTKMBNKN-UHFFFAOYSA-N tributoxyalumane Chemical compound [Al+3].CCCC[O-].CCCC[O-].CCCC[O-] MYWQGROTKMBNKN-UHFFFAOYSA-N 0.000 description 1
- UAEJRRZPRZCUBE-UHFFFAOYSA-N trimethoxyalumane Chemical compound [Al+3].[O-]C.[O-]C.[O-]C UAEJRRZPRZCUBE-UHFFFAOYSA-N 0.000 description 1
- MDDPTCUZZASZIQ-UHFFFAOYSA-N tris[(2-methylpropan-2-yl)oxy]alumane Chemical compound [Al+3].CC(C)(C)[O-].CC(C)(C)[O-].CC(C)(C)[O-] MDDPTCUZZASZIQ-UHFFFAOYSA-N 0.000 description 1
- 125000005065 undecenyl group Chemical group C(=CCCCCCCCCC)* 0.000 description 1
- 239000012463 white pigment Substances 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
- VNTDZUDTQCZFKN-UHFFFAOYSA-L zinc 2,2-dimethyloctanoate Chemical compound [Zn++].CCCCCCC(C)(C)C([O-])=O.CCCCCCC(C)(C)C([O-])=O VNTDZUDTQCZFKN-UHFFFAOYSA-L 0.000 description 1
- 239000004246 zinc acetate Substances 0.000 description 1
- NFTMJVYAFMEYLC-UHFFFAOYSA-L zinc;3-oxohexanoate Chemical compound [Zn+2].CCCC(=O)CC([O-])=O.CCCC(=O)CC([O-])=O NFTMJVYAFMEYLC-UHFFFAOYSA-L 0.000 description 1
- CHJMFFKHPHCQIJ-UHFFFAOYSA-L zinc;octanoate Chemical compound [Zn+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O CHJMFFKHPHCQIJ-UHFFFAOYSA-L 0.000 description 1
- NHXVNEDMKGDNPR-UHFFFAOYSA-N zinc;pentane-2,4-dione Chemical compound [Zn+2].CC(=O)[CH-]C(C)=O.CC(=O)[CH-]C(C)=O NHXVNEDMKGDNPR-UHFFFAOYSA-N 0.000 description 1
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Abstract
光半導体装置における光半導体素子、リードフレーム、基板、ボンディングワイヤ等に対して優れた接着性を有する、(A)一分子中に少なくとも2個のケイ素原子結合アルケニル基を有するオルガノポリシロキサン、(B)一分子中に少なくとも2個のケイ素原子結合水素原子を有するオルガノハイドロジェンポリシロキサン、(C)トリアゾール系化合物、(D)金属系縮合反応触媒、および(E)ヒドロシリル化反応用触媒から少なくともなる硬化性シリコーン組成物。また、光半導体素子が上記組成物の硬化物により封止または被覆されている、吸湿リフロー試験後の信頼性が優れる光半導体装置。(A) an organopolysiloxane having at least two silicon-bonded alkenyl groups in one molecule, having excellent adhesion to an optical semiconductor element, a lead frame, a substrate, a bonding wire, etc. in an optical semiconductor device; ) Comprising at least two organohydrogenpolysiloxanes having at least two silicon-bonded hydrogen atoms in one molecule, (C) a triazole-based compound, (D) a metal-based condensation reaction catalyst, and (E) a hydrosilylation reaction catalyst. Curable silicone composition. An optical semiconductor device having excellent reliability after a moisture absorption reflow test, wherein the optical semiconductor element is sealed or covered with a cured product of the above composition.
Description
本発明は、硬化性シリコーン組成物、および該組成物を用いた光半導体装置に関する。 The present invention relates to a curable silicone composition and an optical semiconductor device using the composition.
ヒドロシリル化反応硬化性シリコーン組成物は、耐候性、耐熱性等の特性に優れる硬化物を形成し、特に、加熱により速やかに硬化し、硬化の際に副生成物を生じないことから、フォトカプラー、発光ダイオード、固体撮像素子等の光半導体装置の封止剤、保護剤、あるいは接着剤として使用されている。
しかし、ヒドロシリル化反応硬化性シリコーン組成物は、接着性が乏しいため、例えば、特開2009−256603号公報には、分子鎖両末端にビニル基を有する直鎖状オルガノポリシロキサン、一分子中にケイ素原子結合水素原子を少なくとも2個有するオルガノハイドロジェンポリシロキサン、金属系縮合反応触媒、白金族金属系付加反応触媒、およびアルケニル基、アルコキシ基、およびエポキシ基から選ばれる官能性基を少なくとも2種含有するオルガノポリシロキサン接着付与成分からなる硬化性シリコーン組成物が提案され、また、特開2010−043136号公報には、ケイ素原子結合アルケニル基を少なくとも2個有するポリシロキサン、ケイ素原子結合水素原子を少なくとも2個有するポリシロキサン架橋剤と、炭素原子数3以上の有機基を有する有機ジルコニウム化合物、有機亜鉛化合物、有機マグネシウム化合物および有機カリウム化合物からなる群から選ばれる少なくとも1種の有機金属化合物とを含む硬化性シリコーン組成物が提案されている。
しかし、これらの硬化性シリコーン組成物といえども、光半導体装置における光半導体素子、リードフレーム、基板、ボンディングワイヤ等に対する接着性が十分ではなく、前記組成物を用いて得られる光半導体装置を吸湿リフロー試験すると、光半導体素子、リードフレーム、基板、あるいはボンディングワイヤと前記組成物の硬化物との間で剥離を生じるという課題がある。
一方、特開2009−215434号公報には、一分子中に少なくとも2個の脂肪族不飽和結合を有すると共に、芳香族炭化水素基を含有しないオルガノポリシロキサン、一分子中に少なくとも2個のケイ素原子結合水素原子を有するオルガノハイドロジェンポリシロキサン、白金族金属系触媒、およびベンゾトリアゾール系、トリアジン系、ベンゾフェノン系、ベンゾアート系、ヒンダードアミン系の光劣化防止剤を前記オルガノポリシロキサンと前記オルガノハイドロジェンポリシロキサンの合計100質量部に対して0.05〜5質量部含有する硬化性シリコーン組成物が提案されている。
しかし、この硬化性シリコーン組成物も、光半導体装置における光半導体素子、リードフレーム、基板、ボンディングワイヤ等に対する接着性が十分でないという課題がある。The hydrosilylation reaction curable silicone composition forms a cured product having excellent properties such as weather resistance and heat resistance, and is particularly cured rapidly by heating and does not produce a by-product upon curing. It is used as a sealant, protective agent, or adhesive for optical semiconductor devices such as light-emitting diodes and solid-state imaging devices.
However, since the hydrosilylation reaction-curable silicone composition has poor adhesion, for example, JP 2009-256603 A discloses a linear organopolysiloxane having vinyl groups at both ends of a molecular chain, in one molecule. Organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms, metal-based condensation reaction catalyst, platinum group metal-based addition reaction catalyst, and at least two functional groups selected from alkenyl groups, alkoxy groups, and epoxy groups A curable silicone composition comprising an organopolysiloxane adhesion-imparting component is proposed, and Japanese Patent Application Laid-Open No. 2010-043136 discloses a polysiloxane having at least two silicon-bonded alkenyl groups and a silicon-bonded hydrogen atom. At least two polysiloxane crosslinkers and carbon A curable silicone composition containing at least one organometallic compound selected from the group consisting of an organozirconium compound having an organic group of 3 or more, an organozinc compound, an organomagnesium compound, and an organopotassium compound has been proposed. .
However, even though these curable silicone compositions are not sufficiently adhesive to optical semiconductor elements, lead frames, substrates, bonding wires, etc. in optical semiconductor devices, the optical semiconductor devices obtained using the above compositions absorb moisture. When the reflow test is performed, there is a problem that peeling occurs between the optical semiconductor element, the lead frame, the substrate, or the bonding wire and the cured product of the composition.
On the other hand, JP 2009-215434 A discloses an organopolysiloxane having at least two aliphatic unsaturated bonds in one molecule and not containing an aromatic hydrocarbon group, and at least two silicons in one molecule. Organohydrogenpolysiloxane having atom-bonded hydrogen atoms, platinum group metal catalyst, and benzotriazole, triazine, benzophenone, benzoate, and hindered amine photodegradation inhibitors are used as the organopolysiloxane and the organohydrogen. A curable silicone composition containing 0.05 to 5 parts by mass with respect to a total of 100 parts by mass of polysiloxane has been proposed.
However, this curable silicone composition also has a problem that adhesion to an optical semiconductor element, a lead frame, a substrate, a bonding wire and the like in an optical semiconductor device is not sufficient.
本発明の目的は、光半導体装置における光半導体素子、リードフレーム、基板、ボンディングワイヤ等に対する接着性が良好である硬化性シリコーン組成物を提供することにあり、また、本発明の他の目的は、吸湿リフロー試験後の信頼性が優れる光半導体装置を提供することにある。 An object of the present invention is to provide a curable silicone composition having good adhesion to an optical semiconductor element, a lead frame, a substrate, a bonding wire and the like in an optical semiconductor device, and another object of the present invention is An object of the present invention is to provide an optical semiconductor device having excellent reliability after a moisture absorption reflow test.
本発明の硬化性シリコーン組成物は、
(A)一分子中に少なくとも2個のケイ素原子結合アルケニル基を有するオルガノポリシロキサン、
(B)一分子中に少なくとも2個のケイ素原子結合水素原子を有するオルガノハイドロジェンポリシロキサン{(A)成分中のケイ素原子結合アルケニル基1モルに対して、本成分中のケイ素原子結合水素原子が0.1〜10モルとなる量}、
(C)トリアゾール系化合物(本組成物に対して、質量単位で1ppm〜0.5%となる量)、
(D)金属系縮合反応触媒(本組成物に対して、質量単位で20ppm〜0.1%となる量)、および
(E)ヒドロシリル化反応用触媒(本組成物の硬化を促進する量)
から少なくともなることを特徴とする。
上記(A)成分は、(A−1)一般式:
R1 3SiO(R1 2SiO)mSiR1 3
(式中、R1は同じかまたは異なる一価炭化水素基、ただし、一分子中、少なくとも2個のR1はアルケニル基であり、mは5〜1,000の整数である。)
で表される直鎖状のオルガノポリシロキサンおよび/または(A−2)平均単位式:
(R1SiO3/2)a(R1 2SiO2/2)b(R1 3SiO1/2)c(SiO4/2)d(XO1/2)e
(式中、R1は前記と同じであり、ただし、R1の合計の0.01〜50モル%はアルケニル基であり、Xは水素原子またはアルキル基であり、a、b、c、d、およびeは、0≦a≦1.0、0≦b≦1.0、0≦c<0.9、0≦d<0.5、0≦e<0.4、かつa+b+c+d=1.0を満たす数である。)
で表される分岐鎖状のオルガノポリシロキサンであることが好ましい。
上記(C)成分は、ベンゾトリアゾール系化合物であり、特に、ベンゾトリアゾール、トリルトリアゾール、カルボキシベンゾトリアゾール、1H−ベンゾトリアゾール−5−カルボン酸メチル、およびニトロベンゾトリアゾールからなる群より選択される少なくとも1種のベンゾトリアゾール系化合物であることが好ましい。
上記(D)成分は、有機アルミニウム化合物、有機チタン化合物、有機ジルコニウム化合物、有機亜鉛化合物、および有機鉄化合物からなる群から選択される少なくとも1種の有機金属化合物であることが好ましい。
本発明の硬化性シリコーン組成物は、光半導体装置の封止剤または被覆剤であることが好ましい。
本発明の光半導体装置は、光半導体素子が上記の硬化性シリコーン組成物の硬化物により封止または被覆されていることを特徴とし、前記光半導体素子は発光ダイオードであることが好ましい。The curable silicone composition of the present invention is
(A) an organopolysiloxane having at least two silicon-bonded alkenyl groups in one molecule;
(B) Organohydrogenpolysiloxane having at least two silicon atom-bonded hydrogen atoms in one molecule {silicon atom-bonded hydrogen atom in this component with respect to 1 mol of silicon atom-bonded alkenyl group in component (A) In an amount of 0.1 to 10 mol},
(C) Triazole-based compound (amount of 1 ppm to 0.5% by mass unit with respect to the present composition),
(D) Metal-based condensation reaction catalyst (in an amount of 20 ppm to 0.1% in terms of mass unit with respect to the present composition), and (E) Hydrosilylation reaction catalyst (in an amount that promotes curing of the present composition)
It consists of at least.
The component (A) is represented by the general formula (A-1):
R 1 3 SiO (R 1 2 SiO) m SiR 1 3
(In the formula, R 1 is the same or different monovalent hydrocarbon group, provided that at least two R 1 are alkenyl groups in one molecule, and m is an integer of 5 to 1,000.)
A linear organopolysiloxane and / or (A-2) an average unit formula:
(R 1 SiO 3/2 ) a (R 1 2 SiO 2/2 ) b (R 1 3 SiO 1/2 ) c (SiO 4/2 ) d (XO 1/2 ) e
(In the formula, R 1 is the same as above, except that 0.01 to 50 mol% of the total of R 1 is an alkenyl group, X is a hydrogen atom or an alkyl group, and a, b, c, d) , And e are 0 ≦ a ≦ 1.0, 0 ≦ b ≦ 1.0, 0 ≦ c <0.9, 0 ≦ d <0.5, 0 ≦ e <0.4, and a + b + c + d = 1. It is a number that satisfies 0.)
It is preferable that it is a branched organopolysiloxane represented by these.
The component (C) is a benzotriazole compound, and in particular, at least one selected from the group consisting of benzotriazole, tolyltriazole, carboxybenzotriazole, 1H-benzotriazole-5-carboxylate, and nitrobenzotriazole. It is preferable that it is a kind of benzotriazole type compound.
The component (D) is preferably at least one organometallic compound selected from the group consisting of organoaluminum compounds, organotitanium compounds, organozirconium compounds, organozinc compounds, and organoiron compounds.
The curable silicone composition of the present invention is preferably a sealing agent or a coating agent for an optical semiconductor device.
The optical semiconductor device of the present invention is characterized in that an optical semiconductor element is sealed or covered with a cured product of the above curable silicone composition, and the optical semiconductor element is preferably a light emitting diode.
本発明の硬化性シリコーン組成物は、光半導体装置における光半導体素子、リードフレーム、基板、ボンディングワイヤ等に対して優れた接着性を有するという特徴がある。また、本発明の光半導体装置は、吸湿リフロー試験後の信頼性が優れるという特徴がある。 The curable silicone composition of the present invention is characterized by having excellent adhesion to an optical semiconductor element, a lead frame, a substrate, a bonding wire and the like in an optical semiconductor device. Further, the optical semiconductor device of the present invention is characterized by excellent reliability after the moisture absorption reflow test.
図1は、本発明の光半導体装置の一例であるLEDの断面図である。 FIG. 1 is a cross-sectional view of an LED which is an example of the optical semiconductor device of the present invention.
はじめに、本発明の硬化性シリコーン組成物について詳細に説明する。
(A)成分は本組成物の主剤である、一分子中に少なくとも2個のケイ素原子結合アルケニル基を有するオルガノポリシロキサンである。このアルケニル基としては、ビニル基、アリル基、ブテニル基、ペンテニル基、ヘキセニル基、ヘプテニル基、オクテニル基、ノネニル基、デセニル基、ウンデセニル基、ドデセニル基等の炭素数が2〜12個のアルケニル基が例示され、好ましくは、ビニル基である。また、(A)成分中のアルケニル基以外のケイ素原子に結合する基としては、メチル基、エチル基、プロピル基、イソプロピル基、ブチル基、イソブチル基、tert−ブチル基、ペンチル基、ネオペンチル基、ヘキシル基、シクロヘキシル基、ヘプチル基、オクチル基、ノニル基、デシル基、ウンデシル基、ドデシル基等の炭素数が1〜12個のアルキル基;フェニル基、トリル基、キシリル基、ナフチル基等の炭素数が6〜20個のアリール基;ベンジル基、フェネチル基、フェニルプロピル基等の炭素数が7〜20個のアラルキル基;これらの基の水素原子の一部または全部をフッ素原子、塩素原子、臭素原子等のハロゲン原子で置換した基が例示される。なお、(A)成分中のケイ素原子には、本発明の目的を損なわない範囲で、少量の水酸基やメトキシ基、エトキシ基等のアルコキシ基を有していてもよい。
(A)成分の分子構造としては、直鎖状、一部分岐を有する直鎖状、分岐鎖状、環状、および三次元網状構造が例示される。(A)成分は、これらの分子構造を有する1種のオルガノポリシロキサン、あるいはこれらの分子構造を有する2種以上のオルガノポリシロキサン混合物であってもよい。
このような(A)成分は、(A−1)一般式:
R1 3SiO(R1 2SiO)mSiR1 3
で表される直鎖状のオルガノポリシロキサンおよび/または(A−2)平均単位式:
(R1SiO3/2)a(R1 2SiO2/2)b(R1 3SiO1/2)c(SiO4/2)d(XO1/2)e
で表される分岐鎖状のオルガノポリシロキサンであることが好ましい。
(A−1)成分において、式中、R1は同じかまたは異なる一価炭化水素基であり、前記と同様のアルキル基、アルケニル基、アリール基、アラルキル基、およびこれらの基の水素原子の一部または全部をフッ素原子、塩素原子、臭素原子等のハロゲン原子で置換した基が例示される。ただし、一分子中、少なくとも2個のR1はアルケニル基である。また、式中、mは5〜1,000の整数であり、好ましくは、50〜1,000の整数あるいは100〜1,000の整数である。
このような(A−1)成分としては、分子鎖両末端ジメチルビニルシロキシ基封鎖ジメチルポリシロキサン、分子鎖両末端ジメチルビニルシロキシ基封鎖ジメチルシロキサン・メチルビニルシロキサン共重合体、分子鎖両末端ジメチルビニルシロキシ基封鎖ジメチルシロキサン・メチルフェニルシロキサン共重合体、分子鎖両末端ジメチルビニルシロキシ基封鎖メチルフェニルポリシロキサン、分子鎖両末端トリメチルシロキシ基封鎖ジメチルシロキサン・メチルビニルシロキサン共重合体、分子鎖両末端トリメチルシロキシ基封鎖ジメチルシロキサン・メチルビニルシロキサン・メチルフェニルシロキサン共重合体、およびこれらの2種以上の混合物が例示される。
また、(A−2)成分において、式中、R1は同じかまたは異なる一価炭化水素基であり、前記と同様のアルキル基、アルケニル基、アリール基、アラルキル基、およびこれらの基の水素原子の一部または全部をフッ素原子、塩素原子、臭素原子等のハロゲン原子で置換した基が例示される。ただし、R1の合計の0.01〜50モル%、0.05〜40モル%、あるいは0.09〜32モル%がアルケニル基であることが好ましい。これは、アルケニル基の割合が上記範囲の下限以上であると、得られる組成物の硬化性が良好であるからであり、一方、アルケニル基の割合が上記範囲の上限以下であると、得られる硬化物の機械的特性が良好であるからである。なお、アルケニル基の含有量は、例えば、フーリエ変換赤外分光光度計(FT−IR)、核磁気共鳴(NMR)、ゲル浸透クロマトグラフィー(GPC)等の分析によって求めることができる。
また、式中、Xは水素原子またはアルキル基である。このアルキル基としては、メチル基、エチル基、プロピル基、イソプロピル基、ブチル基、イソブチル基、tert−ブチル基、ペンチル基、ネオペンチル基、ヘキシル基、シクロヘキシル基、ヘプチル基、オクチル基、ノニル基、デシル基、ウンデシル基、ドデシル基等の炭素数が1〜12個のアルキル基が例示され、好ましくは、炭素数1〜3のアルキル基である。
また、式中、aは、式:R1SiO3/2で表されるシロキサン単位の割合を示す、0≦a≦1.0を満たす数であり、bは、式:R1 2SiO2/2で表されるシロキサン単位の割合を示す、0≦b≦1.0を満たす数であり、cは、式:R1 3SiO1/2で表されるシロキサン単位の割合を示す、0≦c<0.9を満たす数であり、dは、式:SiO4/2で表されるシロキサン単位の割合を示す、0≦d<0.5を満たす数である。ただし、式中、a+b+c+d=1.0である。また、eはケイ素原子に結合する水酸基またはアルコキシ基を示す、0≦e<0.4を満たす数である。
(A)成分として、(A−1)成分、(A−2)成分、あるいは(A−1)成分と(A−2)成分の混合物を用いることができる。(A−1)成分と(A−2)成分の混合物を用いる場合、得られる組成物の取扱性が良好であることから、(A−2)成分の含有量は、(A−1)成分と(A−2)成分の合計量の90質量%以下あるいは60質量%以下であることが好ましい。また、得られる硬化物の機械的特性が良好であることから、(A−2)成分の含有量は、(A−1)成分と(A−2)成分の合計量の少なくとも10質量%であることが好ましい。
(A)成分は25℃で液状または固体状である。(A)成分が25℃で液状である場合、その25℃の粘度は1〜1,000,000mPa・sの範囲内あるいは10〜1,000,000mPa・sの範囲内であることが好ましい。なお、この粘度は、例えば、JIS K7117−1に準拠したB型粘度計を用いた測定により求めることができる。
(B)成分は本組成物の架橋剤である、一分子中に少なくとも2個のケイ素原子結合水素原子を有するオルガノハイドロジェンポリシロキサンである。(B)成分中の水素原子以外のケイ素原子に結合する基としては、メチル基、エチル基、プロピル基、イソプロピル基、ブチル基、イソブチル基、tert−ブチル基、ペンチル基、ネオペンチル基、ヘキシル基、シクロヘキシル基、ヘプチル基、オクチル基、ノニル基、デシル基、ウンデシル基、ドデシル基等の炭素数が1〜12個のアルキル基;フェニル基、トリル基、キシリル基、ナフチル基等の炭素数が6〜20個のアリール基;ベンジル基、フェネチル基、フェニルプロピル基等の炭素数が7〜20個のアラルキル基;これらの基の水素原子の一部または全部をフッ素原子、塩素原子、臭素原子等のハロゲン原子で置換した基が例示される。なお、(B)成分中のケイ素原子には、本発明の目的を損なわない範囲で、少量の水酸基やメトキシ基、エトキシ基等のアルコキシ基を有していてもよい。
(B)成分の分子構造としては、直鎖状、一部分岐を有する直鎖状、分岐鎖状、環状、および三次元網状構造が例示され、好ましくは、一部分岐を有する直鎖状、分岐鎖状、または三次元網状構造である。
(B)成分は25℃で固体状または液状である。(B)成分が25℃で液状である場合は、その25℃の粘度は10,000mPa・s以下、0.1〜5,000mPa・sの範囲内、あるいは0.5〜1,000mPa・sの範囲内であることが好ましい。なお、この粘度は、例えば、JIS K7117−1に準拠したB型粘度計を用いた測定により求めることができる。
このような(B)成分としては、1,1,3,3−テトラメチルジシロキサン、1,3,5,7−テトラメチルシクロテトラシロキサン、トリス(ジメチルハイドロジェンシロキシ)メチルシラン、トリス(ジメチルハイドロジェンシロキシ)フェニルシラン、1−グリシドキシプロピル−1,3,5,7−テトラメチルシクロテトラシロキサン、1,5−グリシドキシプロピル−1,3,5,7−テトラメチルシクロテトラシロキサン、1−グリシドキシプロピル−5−トリメトキシシリルエチル−1,3,5,7−テトラメチルシクロテトラシロキサン、分子鎖両末端トリメチルシロキシ基封鎖メチルハイドロジェンポリシロキサン、分子鎖両末端トリメチルシロキシ基封鎖ジメチルシロキサン・メチルハイドロジェンシロキサン共重合体、分子鎖両末端ジメチルハイドロジェンシロキシ基封鎖ジメチルポリシロキサン、分子鎖両末端ジメチルハイドロジェンシロキシ基封鎖ジメチルシロキサン・メチルハイドロジェンシロキサン共重合体、分子鎖両末端トリメチルシロキシ基封鎖メチルハイドロジェンシロキサン・ジフェニルシロキサン共重合体、分子鎖両末端トリメチルシロキシ基封鎖メチルハイドロジェンシロキサン・ジフェニルシロキサン・ジメチルシロキサン共重合体、(CH3)2HSiO1/2単位とSiO4/2単位とからなる共重合体、(CH3)2HSiO1/2単位とSiO4/2単位と(C6H5)SiO3/2単位とからなる共重合体、およびこれらの2種以上の混合物が例示される。
(B)成分の含有量は、(A)成分中のケイ素原子結合アルケニル基1モルに対して、本成分中のケイ素原子結合水素原子が0.1〜10モルとなる量であり、好ましくは、0.5〜5モルとなる量である。これは、(B)成分の含有量が上記範囲の上限以下であると、得られる硬化物の機械的特性が良好であり、一方、上記範囲の下限以上であると、得られる組成物の硬化性が良好であるからである。なお、(B)成分中のケイ素原子結合水素原子の含有量は、例えば、フーリエ変換赤外分光光度計(FT−IR)、核磁気共鳴(NMR)、ゲル浸透クロマトグラフィー(GPC)等の分析によって求めることができる。
(C)成分は本組成物の硬化物に耐剥離性を付与するトリアゾール系化合物である。(C)成分としては、1H−1,2,3−トリアゾール、2H−1,2,3−トリアゾール、1H−1,2,4−トリアゾール、4H−1,2,4−トリアゾール、2−(2’−ヒドロキシ−5’−メチルフェニル)ベンゾトリアゾール、ベンゾトリアゾール、トリルトリアゾール、カルボキシベンゾトリアゾール、1H−ベンゾトリアゾール−5−カルボン酸メチル、3−アミノ−1,2,4−トリアゾール、4−アミノ−1,2,4−トリアゾール、5−アミノ−1,2,4−トリアゾール、3−メルカプト−1,2,4−トリアゾール、クロロベンゾトリアゾール、ニトロベンゾトリアゾール、アミノベンゾトリアゾール、シクロヘキサノ[1,2−d]トリアゾール、4,5,6,7−テトラヒドロキシトリルトリアゾール、1−ヒドロキシベンゾトリアゾール、エチルベンゾトリアゾール、ナフトトリアゾール、1−N,N−ビス(2−エチルヘキシル)−[(1,2,4−トリアゾール−1−イル)メチル]アミン、1−[N,N−ビス(2−エチルヘキシル)アミノメチル]ベンゾトリアゾール、1−[N,N−ビス(2−エチルヘキシル)アミノメチル]トリルトリアゾール、1−[N,N−ビス(2−エチルヘキシル)アミノメチル]カルボキシベンゾトリアゾール、1−[N,N−ビス(2−ヒドロキシエチル)−アミノメチル]ベンゾトリアゾール、1−[N,N−ビス(2−ヒドロキシエチル)−アミノメチル]トリルトリアゾール、1−[N,N−ビス(2−ヒドロキシエチル)−アミノメチル]カルボキシベンゾトリアゾール、1−[N,N−ビス(2−ヒドロキシプロピル)アミノメチル]カルボキシベンゾトリアゾール、1−[N,N−ビス(1−ブチル)アミノメチル]カルボキシベンゾトリアゾール、1−[N,N−ビス(1−オクチル)アミノメチル]カルボキシベンゾトリアゾール、1−(2’,3’−ジ−ヒドロキシプロピル)ベンゾトリアゾール、1−(2’,3’−ジ−カルボキシエチル)ベンゾトリアゾール、2−(2’−ヒドロキシ−3’,5’−ジ−tert−ブチルフェニル)ベンゾトリアゾール、2−(2’−ヒドロキシ−3’,5’−アミルフェニル)ベンゾトリアゾール、2−(2’−ヒドロキシ−4’−オクトキシフェニル)ベンゾトリアゾール、2−(2’−ヒドロキシ−5’−tert−ブチルフェニル)ベンゾトリアゾール、1−ヒドロキシベンゾトリアゾール−6−カルボン酸、1−オレオイルベンゾトリアゾール、1,2,4−トリアゾール−3−オール、5−アミノ−3−メルカプト−1,2,4−トリアゾール、5−アミノ−1,2,4−トリアゾール−3−カルボン酸、1,2,4−トリアゾール−3−カルボキシアミド、4−アミノウラゾール、1,2,4−トリアゾール−5−オン、およびこれらの2種以上の混合物が例示される。特に、(C)成分は、ベンゾトリアゾール、またはアルキル、カルボキシもしくはニトロ置換ベンゾトリアゾール等のベンゾトリアゾール系化合物であることが好ましく、さらには、ベンゾトリアゾール、トリルトリアゾール、カルボキシベンゾトリアゾール、ニトロベンゾトリアゾール、および1H−ベンゾトリアゾール−5−カルボン酸メチルからなる群より選択される少なくとも1種のベンゾトリアゾール系化合物であることが好ましい。
(C)成分の含有量は、本組成物に対して、質量単位で1ppm〜0.5%の範囲内となる量であり、好ましくは、5ppm〜0.3%の範囲内あるいは10ppm〜0.1%の範囲内となる量である。これは、(C)成分の含有量が上記範囲の下限以上であると、吸湿リフローに対する剥離を十分に抑制できるからであり、一方、上記範囲の上限以下であると、得られる硬化物の機械的特性が良好となるからである。
(D)成分は本組成物の硬化物に耐剥離性を付与する金属系縮合反応触媒である。(D)成分としては、有機アルミニウム化合物、有機チタン化合物、有機ジルコニウム化合物、有機マグネシウム化合物、有機亜鉛化合物、有機銅化合物、有機ニッケル化合物、有機クロム化合物、有機コバルト化合物、有機鉄化合物、有機インジウム化合物、有機ランタン化合物、有機錫化合物、有機ハフニウム化合物、およびこれらの2種以上の混合物が例示される。有機アルミニウム化合物としては、トリメトキシアルミニウム、トリエトキシアルミニウム、イソプロポキシアルミニウム、イソプロポキシジエトキシアルミニウム、トリブトキシアルミニウム等のアルコキシ化合物;トリアセトキシアルミニウム、トリステアラートアルミニウム、トリブチラートアルミニウム等のアシロオキシ化合物;アルミニウムイソプロピレート、アルミニウムsec−ブチレート、アルミニウムtert−ブチレート、アルミニウムトリス(エチルアセトアセテート)、トリス(ヘキサフルオロアセチルアセトナート)アルミニウム、トリスエチルアセトアセテートアルミニウム、トリス(n−プロピルアセトアセテート)アルミニウム、トリス(iso−プロピルアセトアセテート)アルミニウム、トリス(n−ブチルアセトアセテート)アルミニウム、トリスサリチルアルデヒドアルミニウム、トリス(2−エトキシカルボニルフェノラート)アルミニウム、トリス(アセチルアセトナート)アルミニウム等のキレート化合物が例示される。有機チタン化合物としては、テトラエトキシチタン、テトライソプロポキシチタン、テトラブチロキシチタン等のテトラアルコキシチタン;チタン酸テトラエチレングリコール、チタン酸ジ−n−ブチルビス(トリエタノールアミン)、ビス(アセチルアセトン)酸ジ−イソプロポキシチタン、オクタン酸イソプロポキシチタン、トリメタクリル酸イソプロピルチタン、トリアクリル酸イソプロピルチタン、イソプロピルトリイソステアロイルチタネート、イソプロピルトリデシルベンゼンスルホニルチタネート、イソプロピルトリ(ブチル、メチルピロホスフェート)チタネート、テトライソプロピルジ(ジラウリルホスファイト)チタネート、ジメタクリルオキシアセテートチタネート、ジアクリルオキシアセテートチタネート、ジ(ジオクチルホスフェート)エチレンチタネート、トリ(ジオクチルリン酸)イソプロポキシチタン、イソプロピルトリス(ジオクチルピロホスフェート)チタネート、テトライソプロピルビス(ジオクチルホスファイト)チタネート、テトラオクチルビス(ジトリデシルホスファイト)チタネート、テトラ(2,2−ジアリルオキシメチル−1−ブチル)ビス(ジ−トリデシル)ホスファイトチタネート、ビス(ジオクチルピロホスフェート)オキシアセテートチタネート、トリス(ジオクチルピロホスフェート)エチレンチタネート、イソプロピルトリ−n−ドデシルベンゼンスルホニルチタネート、イソプロピルトリオクタノイルチタネート、イソプロピルジメタクリロイルイソステアロイルチタネート、イソプロピルイソステアロイルジアクリルチタネート、イソプロピルトリ(ジオクチルホスフェート)チタネート、イソプロピルトリクミルフェニルチタネート、イソプロピルトリ(N−アミノエチル−アミノエチル)チタネートが例示される。有機ジルコニウム化合物としては、ジルコニウムn−プロポキシド、ジルコニウムn−ブトキシド、ジルコニウムt−ブトキシド、ジルコニウムイソプロポキシド、ジルコニウムエトキシド、ジルコニルアセテート、ジルコニウムアセチルアセトナート、ジルコニウムブトキシアセチルアセトナート、ジルコニウムビスアセチルアセトナート、ジルコニウムエチルアセトアセテート、ジルコニウムアセチルアセトナートビスエチルアセトアセテート、ジルコニウムヘキサフルオロアセチルアセトナート、ジルコニウムトリフルオロアセチルアセトナートが例示される。有機マグネシウム化合物としては、エチルアセトアセテートマグネシウムモノイソプロピレート、マグネシウムビス(エチルアセトアセテート)、アルキルアセトアセテートマグネシウムモノイソプロピレート、マグネシウムビス(アセチルアセトナート)が例示される。有機亜鉛化合物としては、亜鉛ビス(エチルアセトアセテート)、亜鉛アセチルアセトナート、亜鉛ビス2−エチルヘキサノアート、亜鉛(メタ)アクリレート、亜鉛ネオデカノエート、亜鉛アセテート、亜鉛オクトエート、亜鉛サリチレートが例示される。有機銅化合物としては、銅ビス(エチルアセトアセテート)、銅ビス(アセチルアセトナート)が例示される。有機ニッケル化合物としては、ニッケルビス(エチルアセトアセテート)、ニッケルビス(アセチルアセトナート)が例示される。有機クロム化合物としては、クロムトリス(エチルアセトアセテート)、クロムトリス(アセチルアセトナート)が例示される。有機コバルト化合物としては、コバルトトリス(エチルアセトアセテート)、コバルトトリス(アセチルアセトナート)が例示される。有機鉄化合物としては、鉄トリス(エチルアセトアセテート)、鉄トリス(アセチルアセトナート)が例示される。有機インジウム化合物としては、インジウムトリス(エチルアセトアセテート)、インジウムトリス(アセチルアセトナート)が例示される。有機ランタン化合物としては、ランタントリス(エチルアセトアセテート)、ランタントリス(アセチルアセトナート)が例示される。有機錫化合物としては、錫テトラキス(エチルアセトアセテート)、錫テトラキス(アセチルアセトナート)が例示される。有機ハフニウム化合物としては、ハフニウムn−ブトキシド、ハフニウムt−ブトキシド、ハフニウムエトキシド、ハフニウムイソプロポキシド、ハフニウムイソプロポキシドモノイソプロピレート、ハフニウムアセチルアセナート、テトラキス(ジメチルアミノ)ハフニウムが例示される。特に、(D)成分は、有機アルミニウム化合物、有機チタン化合物、有機ジルコニウム化合物、有機亜鉛化合物、および有機鉄化合物からなる群から選択される少なくとも1種の金属系縮合反応触媒であることが好ましい。
(D)成分の含有量は、本組成物に対して、質量単位で20ppm〜0.1%の範囲内となる量であり、好ましくは、30ppm〜0.05%の範囲内あるいは50ppm〜0.03%の範囲内となる量である。これは、(D)成分の含有量が上記範囲の下限以上であると、吸湿リフローに対する剥離を十分に抑制できるからであり、一方、上記範囲の上限以下であると、得られる組成物の保存安定性が向上できるからである。
(E)成分は本組成物の硬化を促進するためのヒドロシリル化反応用触媒である。(E)成分としては、白金族元素触媒、白金族元素化合物触媒が例示され、具体的には、白金系触媒、ロジウム系触媒、パラジウム系触媒、およびこれらの少なくとも2種の組み合わせが例示され、特に、本組成物の硬化を著しく促進できることから、白金系触媒であることが好ましい。この白金系触媒としては、白金微粉末、白金黒、塩化白金酸、塩化白金酸のアルコール変性物、塩化白金酸とジオレフィンの錯体、白金−オレフィン錯体、白金ビス(アセトアセテート)、白金ビス(アセチルアセトネート)等の白金−カルボニル錯体、塩化白金酸−ジビニルテトラメチルジシロキサン錯体、塩化白金酸−テトラビニルテトラメチルシクロテトラシロキサン錯体等の塩化白金酸−アルケニルシロキサン錯体、白金−ジビニルテトラメチルジシロキサン錯体、白金−テトラビニルテトラメチルシクロテトラシロキサン錯体等の白金−アルケニルシロキサン錯体、塩化白金酸とアセチレンアルコール類との錯体、およびこれらの2種以上の混合物が例示され、特に、本組成物の硬化を促進できることから、白金−アルケニルシロキサン錯体であることが好ましい。
白金−アルケニルシロキサン錯体に用いられるアルケニルシロキサンとしては、1,3−ジビニル−1,1,3,3−テトラメチルジシロキサン、1,3,5,7−テトラメチル−1,3,5,7−テトラビニルシクロテトラシロキサン、これらのアルケニルシロキサンのメチル基の一部をエチル基、フェニル基等で置換したアルケニルシロキサンオリゴマー、およびこれらのアルケニルシロキサンのビニル基をアリル基、ヘキセニル基等で置換したアルケニルシロキサンオリゴマーが例示され、特に、生成する白金−アルケニルシロキサン錯体の安定性が良好であることから、1,3−ジビニル−1,1,3,3−テトラメチルジシロキサンであることが好ましい。
また、白金−アルケニルシロキサン錯体の安定性を向上させるため、これらの白金−アルケニルシロキサン錯体を、1,3−ジビニル−1,1,3,3−テトラメチルジシロキサン、1,3−ジアリル−1,1,3,3−テトラメチルジシロキサン、1,3−ジビニル−1,3−ジメチル−1,3−ジフェニルジシロキサン、1,3−ジビニル−1,1,3,3−テトラフェニルジシロキサン、および1,3,5,7−テトラメチル−1,3,5,7−テトラビニルシクロテトラシロキサン等のアルケニルシロキサンオリゴマーやジメチルシロキサンオリゴマー等のオルガノシロキサンオリゴマーに溶解していることが好ましく、特に、アルケニルシロキサンオリゴマーに溶解していることが好ましい。
(E)成分の含有量は本組成物の硬化を促進する量であり、具体的には、本組成物に対して、(E)成分中の触媒金属原子が質量単位で0.01〜500ppmの範囲内となる量、0.01〜100ppmの範囲内となる量、あるいは0.1〜50ppmの範囲内となる量であることが好ましい。これは、(E)成分の含有量が上記範囲の下限以上であると、得られる組成物の硬化性が良好であり、一方、上記範囲の上限以下であると、得られる硬化物の着色が抑えられるからである。
本組成物には、常温での可使時間を延長し、保存安定性を向上させるため(F)ヒドロシリル化反応抑制剤を含有してもよい。(F)成分としては、1−エチニルシクロヘキサン−1−オール、2−メチル−3−ブチン−2−オール、3,5−ジメチル−1−ヘキシン−3−オール、および2−フェニル−3−ブチン−2−オール等のアルキンアルコール;3−メチル−3−ペンテン−1−イン、および3,5−ジメチル−3−ヘキセン−1−イン等のエンイン化合物;1,3,5,7−テトラメチル−1,3,5,7−テトラビニルシクロテトラシロキサン、および1,3,5,7−テトラメチル−1,3,5,7−テトラヘキセニルシクロテトラシロキサン等のメチルアルケニルシロキサンオリゴマー;ジメチルビス(3−メチル−1−ブチン−3−オキシ)シラン、およびメチルビニルビス(3−メチル−1−ブチン−3−オキシ)シラン等のアルキンオキシシラン;およびトリアリルイソシアヌレート系化合物が例示される。
(F)成分の含有量は限定されないが、本組成物100質量部に対して0.0001〜5質量部の範囲内あるいは0.01〜3質量部の範囲内であることが好ましい。
また、本組成物には、硬化中に接触している基材への接着性を更に向上させるために、接着促進剤を含有してもよい。この接着促進剤としては、ケイ素原子に結合したアルコキシ基を一分子中に1個以上有する有機ケイ素化合物が好ましい。このアルコキシ基としては、メトキシ基、エトキシ基、プロポキシ基、ブトキシ基、およびメトキシエトキシ基が例示され、特に、メトキシ基またはエトキシ基が好ましい。また、この有機ケイ素化合物のケイ素原子に結合するアルコキシ基以外の基としては、アルキル基、アルケニル基、アリール基、アラルキル基、およびハロゲン化アルキル基等の前記と同様のハロゲン置換もしくは非置換の一価炭化水素基;3−グリシドキシプロピル基、および4−グリシドキシブチル基等のグリシドキシアルキル基;2−(3,4−エポキシシクロヘキシル)エチル基、および3−(3,4−エポキシシクロヘキシル)プロピル基等のエポキシシクロヘキシルアルキル基;4−オキシラニルブチル基、および8−オキシラニルオクチル基等のオキシラニルアルキル基;3−メタクリロキシプロピル基等のアクリル基含有一価有機基;イソシアネート基;イソシアヌレート基;並びに水素原子が例示される。この有機ケイ素化合物は本組成物中の脂肪族不飽和炭化水素基又はケイ素原子結合水素原子と反応し得る基を有することが好ましく、具体的には、ケイ素原子結合脂肪族不飽和炭化水素基またはケイ素原子結合水素原子を有することが好ましい。
接着促進剤の含有量は限定されないが、本組成物100質量部に対して0.01〜10質量部の範囲内あるいは0.1〜3質量部の範囲内であることが好ましい。
また、本組成物には、その他任意の成分として、蛍光体を含有してもよい。この蛍光体としては、発光ダイオード(LED)に広く利用されている、酸化物系蛍光体、酸窒化物系蛍光体、窒化物系蛍光体、硫化物系蛍光体、酸硫化物系蛍光体等からなる黄色、赤色、緑色、青色発光蛍光体、およびこれらの少なくとも2種の混合物が例示される。酸化物系蛍光体としては、セリウムイオンを包含するイットリウム、アルミニウム、ガーネット系のYAG系緑色〜黄色発光蛍光体、セリウムイオンを包含するテルビウム、アルミニウム、ガーネット系のTAG系黄色発光蛍光体、および、セリウムやユーロピウムイオンを包含するシリケート系緑色〜黄色発光蛍光体が例示される。酸窒化物系蛍光体としては、ユーロピウムイオンを包含するケイ素、アルミニウム、酸素、窒素系のサイアロン系赤色〜緑色発光蛍光体が例示される。窒化物系蛍光体としては、ユーロピウムイオンを包含するカルシウム、ストロンチウム、アルミニウム、ケイ素、窒素系のカズン系赤色発光蛍光体が例示される。硫化物系蛍光体としては、銅イオンやアルミニウムイオンを包含するZnS系緑色発色蛍光体が例示される。酸硫化物系蛍光体としては、ユーロピウムイオンを包含するY2O2S系赤色発光蛍光体が例示される。
この蛍光体の含有量は特に限定されないが、本組成物中、0.1〜70質量%の範囲内あるいは1〜20質量%の範囲内であることが好ましい。
また、本組成物には、本発明の目的を損なわない限り、その他の任意の成分として、シリカ、ガラス、およびアルミナ等から選択される1種以上の無機質充填剤;シリコーンゴム粉末;シリコーン樹脂、およびポリメタクリレート樹脂等の樹脂粉末;耐熱剤、染料、顔料、難燃性付与剤、界面活性剤、溶剤等から選択される1種以上の成分を含有してもよい。
本組成物は、室温放置や、加熱により硬化が進行するが、迅速に硬化させるためには加熱することが好ましい。加熱温度は、50〜200℃の範囲内であることが好ましい。
本組成物は、硬化して、JIS K 6253に規定されるタイプAデュロメータ硬さが15〜99あるいは30〜95である硬化物を形成することが好ましい。これは、硬化性シリコーン組成物の硬化物の硬さが上記範囲の下限以上であると、強度を有し、これを光半導体素子の封止材または被覆材として用いた場合の保護性が優れるからであり、一方、上記範囲の上限以下であると、硬化物が柔軟となり、耐久性が優れるからである。
次に、本発明の光半導体装置を詳細に説明する。
本発明の光半導体装置は、光半導体素子が上記組成物の硬化物により封止、被覆、あるいは接着されていることを特徴とする。この光半導体素子としては、発光ダイオード(LED)、半導体レーザ、フォトダイオード、フォトトランジスタ、固体撮像、フォトカプラー用発光体と受光体が例示され、特に、発光ダイオード(LED)であることが好ましい。
発光ダイオード(LED)は、光半導体素子の上下左右から発光が起きるので、発光ダイオード(LED)を構成する部品は、光を吸収するものは好ましくなく、光透過率が高いか、反射率の高い材料が好ましい。そのため、光半導体素子が搭載される基板も、光透過率が高いか、反射率の高い材料が好ましい。こうした光半導体素子が搭載される基板としては、例えば、銀、金、および銅等の導電性金属;アルミニウム、およびニッケル等の非導電性の金属;PPA、およびLCP等の白色顔料を混合した熱可塑性樹脂;エポキシ樹脂、BT樹脂、ポリイミド樹脂、およびシリコーン樹脂等の白色顔料を含有する熱硬化性樹脂;アルミナ、および窒化アルミナ等のセラミックスが例示される。硬化性シリコーン組成物の硬化物は、光半導体素子および基板に対して耐熱衝撃性が良好であるので、得られる光半導体装置は、良好な信頼性を示すことができる。
本発明の光半導体装置の一例である表面実装型LEDの断面図を図1に示した。図1で示されるLEDは、光半導体素子1がリードフレーム2上にダイボンドされ、この光半導体素子1とリードフレーム3とがボンディングワイヤ4によりワイヤボンディングされている。この光半導体素子1の周囲には、光反射材5が形成され、この光反射材5の内側の光半導体素子1は上記の硬化性シリコーン組成物の硬化物6により封止されている。
図1で示される表面実装型LEDを製造する方法としては、光反射材5の内側のリードフレーム2上に光半導体素子1をダイボンドし、この光半導体素子1とリードフレーム3とを金製のボンディングワイヤ4によりワイヤボンドし、次いで、光半導体素子1を、上記の硬化性シリコーン組成物で樹脂封止する方法が例示される。First, the curable silicone composition of the present invention will be described in detail.
Component (A) is an organopolysiloxane having at least two silicon-bonded alkenyl groups in one molecule, which is the main component of the present composition. Examples of the alkenyl group include alkenyl groups having 2 to 12 carbon atoms such as vinyl group, allyl group, butenyl group, pentenyl group, hexenyl group, heptenyl group, octenyl group, nonenyl group, decenyl group, undecenyl group, dodecenyl group, etc. And is preferably a vinyl group. In addition, as the group bonded to the silicon atom other than the alkenyl group in the component (A), a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, an isobutyl group, a tert-butyl group, a pentyl group, a neopentyl group, Alkyl groups having 1 to 12 carbon atoms such as hexyl group, cyclohexyl group, heptyl group, octyl group, nonyl group, decyl group, undecyl group, dodecyl group; carbon such as phenyl group, tolyl group, xylyl group, naphthyl group An aryl group having 6 to 20 carbon atoms; an aralkyl group having 7 to 20 carbon atoms such as a benzyl group, a phenethyl group, and a phenylpropyl group; a part or all of hydrogen atoms of these groups may be a fluorine atom, a chlorine atom, Examples thereof include a group substituted with a halogen atom such as a bromine atom. In addition, the silicon atom in the component (A) may have a small amount of a hydroxyl group, an alkoxy group such as a methoxy group, an ethoxy group or the like as long as the object of the present invention is not impaired.
Examples of the molecular structure of the component (A) include linear, partially branched linear, branched, cyclic, and three-dimensional network structures. The component (A) may be one kind of organopolysiloxane having these molecular structures, or a mixture of two or more kinds of organopolysiloxanes having these molecular structures.
Such (A) component is (A-1) General formula:
R 1 3 SiO (R 1 2 SiO) m SiR 1 3
A linear organopolysiloxane and / or (A-2) an average unit formula:
(R 1 SiO 3/2 ) a (R 1 2 SiO 2/2 ) b (R 1 3 SiO 1/2 ) c (SiO 4/2 ) d (XO 1/2 ) e
It is preferable that it is a branched organopolysiloxane represented by these.
In the component (A-1), in the formula, R 1 is the same or different monovalent hydrocarbon group, and the same alkyl group, alkenyl group, aryl group, aralkyl group as those described above, and the hydrogen atom of these groups Examples thereof include a group in which part or all of them are substituted with a halogen atom such as a fluorine atom, a chlorine atom or a bromine atom. However, at least 2 R 1 in one molecule is an alkenyl group. In the formula, m is an integer of 5 to 1,000, preferably an integer of 50 to 1,000 or an integer of 100 to 1,000.
Examples of such component (A-1) include dimethylpolysiloxane blocked with dimethylvinylsiloxy group at both ends of molecular chain, dimethylsiloxane / methylvinylsiloxane copolymer blocked with dimethylvinylsiloxy group at both ends of molecular chain, and dimethylvinyl at both ends of molecular chain. Siloxy group-blocked dimethylsiloxane / methylphenylsiloxane copolymer, molecular chain both ends dimethylvinylsiloxy group-blocked methylphenylpolysiloxane, molecular chain both ends trimethylsiloxy-blocked dimethylsiloxane / methylvinylsiloxane copolymer, molecular chain both ends trimethyl Illustrative examples include siloxy group-blocked dimethylsiloxane / methylvinylsiloxane / methylphenylsiloxane copolymer, and mixtures of two or more thereof.
In the component (A-2), R 1 is the same or different monovalent hydrocarbon group, and the same alkyl group, alkenyl group, aryl group, aralkyl group as described above, and hydrogen of these groups Examples thereof include a group in which part or all of the atoms are substituted with a halogen atom such as a fluorine atom, a chlorine atom or a bromine atom. However, it is preferable that 0.01 to 50 mol%, 0.05 to 40 mol%, or 0.09 to 32 mol% of the total R 1 is an alkenyl group. This is because if the proportion of the alkenyl group is not less than the lower limit of the above range, the resulting composition has good curability, while the proportion of the alkenyl group is not more than the upper limit of the above range. This is because the mechanical properties of the cured product are good. In addition, content of an alkenyl group can be calculated | required by analysis, such as a Fourier-transform infrared spectrophotometer (FT-IR), nuclear magnetic resonance (NMR), gel permeation chromatography (GPC), for example.
In the formula, X is a hydrogen atom or an alkyl group. As this alkyl group, methyl group, ethyl group, propyl group, isopropyl group, butyl group, isobutyl group, tert-butyl group, pentyl group, neopentyl group, hexyl group, cyclohexyl group, heptyl group, octyl group, nonyl group, Examples thereof include alkyl groups having 1 to 12 carbon atoms such as a decyl group, an undecyl group, and a dodecyl group, and an alkyl group having 1 to 3 carbon atoms is preferable.
In the formula, a is a number satisfying 0 ≦ a ≦ 1.0 indicating the ratio of siloxane units represented by the formula: R 1 SiO 3/2 , and b is a formula: R 1 2 SiO 2. The number of siloxane units represented by / 2 is a number satisfying 0 ≦ b ≦ 1.0, and c represents the proportion of siloxane units represented by the formula: R 1 3 SiO 1/2 ≦ c <0.9 is satisfied, and d is a number satisfying 0 ≦ d <0.5 indicating the ratio of siloxane units represented by the formula: SiO 4/2 . However, in the formula, a + b + c + d = 1.0. E represents a hydroxyl group or an alkoxy group bonded to a silicon atom, and is a number satisfying 0 ≦ e <0.4.
As the component (A), the component (A-1), the component (A-2), or a mixture of the component (A-1) and the component (A-2) can be used. When a mixture of the component (A-1) and the component (A-2) is used, since the handleability of the resulting composition is good, the content of the component (A-2) is the component (A-1) And it is preferable that it is 90 mass% or less or 60 mass% or less of the total amount of (A-2) component. Moreover, since the mechanical properties of the obtained cured product are good, the content of the component (A-2) is at least 10% by mass of the total amount of the components (A-1) and (A-2). Preferably there is.
The component (A) is liquid or solid at 25 ° C. When the component (A) is liquid at 25 ° C., the viscosity at 25 ° C. is preferably in the range of 1 to 1,000,000 mPa · s or in the range of 10 to 1,000,000 mPa · s. In addition, this viscosity can be calculated | required by the measurement using the B-type viscosity meter based on JISK7117-1, for example.
Component (B) is an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms in one molecule, which is a cross-linking agent for the present composition. (B) As a group couple | bonded with silicon atoms other than a hydrogen atom in a component, a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, an isobutyl group, a tert-butyl group, a pentyl group, a neopentyl group, a hexyl group Alkyl groups having 1 to 12 carbon atoms such as cyclohexyl group, heptyl group, octyl group, nonyl group, decyl group, undecyl group, dodecyl group, etc .; carbon numbers such as phenyl group, tolyl group, xylyl group, naphthyl group, etc. 6 to 20 aryl groups; aralkyl groups having 7 to 20 carbon atoms such as benzyl group, phenethyl group and phenylpropyl group; some or all of hydrogen atoms of these groups are fluorine atom, chlorine atom, bromine atom And a group substituted with a halogen atom such as In addition, the silicon atom in the component (B) may have a small amount of a hydroxyl group, an alkoxy group such as a methoxy group, an ethoxy group or the like as long as the object of the present invention is not impaired.
Examples of the molecular structure of the component (B) include linear, partially branched linear, branched, cyclic, and three-dimensional network structures, preferably partially branched linear, branched Or a three-dimensional network structure.
Component (B) is solid or liquid at 25 ° C. When the component (B) is liquid at 25 ° C., the viscosity at 25 ° C. is 10,000 mPa · s or less, within the range of 0.1 to 5,000 mPa · s, or 0.5 to 1,000 mPa · s. It is preferable to be within the range. In addition, this viscosity can be calculated | required by the measurement using the B-type viscosity meter based on JISK7117-1, for example.
Examples of such component (B) include 1,1,3,3-tetramethyldisiloxane, 1,3,5,7-tetramethylcyclotetrasiloxane, tris (dimethylhydrogensiloxy) methylsilane, tris (dimethylhydro Gensyloxy) phenylsilane, 1-glycidoxypropyl-1,3,5,7-tetramethylcyclotetrasiloxane, 1,5-glycidoxypropyl-1,3,5,7-tetramethylcyclotetrasiloxane, 1-glycidoxypropyl-5-trimethoxysilylethyl-1,3,5,7-tetramethylcyclotetrasiloxane, molecular chain both ends trimethylsiloxy group blocked methylhydrogenpolysiloxane, molecular chain both ends trimethylsiloxy group blocked Copolymerization of dimethylsiloxane and methylhydrogensiloxane , Dimethylhydrogensiloxy group-blocked dimethylpolysiloxane with molecular chain terminals, dimethylhydrogensiloxy group-blocked dimethylsiloxane / methylhydrogensiloxane copolymer with both molecular chains, trimethylsiloxy group-blocked methylhydrogensiloxane / diphenyl with molecular chain terminals A siloxane copolymer, a trimethylsiloxy group-blocked methylhydrogensiloxane / diphenylsiloxane / dimethylsiloxane copolymer with both ends of the molecular chain, a copolymer comprising (CH 3 ) 2 HSiO 1/2 units and SiO 4/2 units, Examples thereof include copolymers composed of (CH 3 ) 2 HSiO 1/2 units, SiO 4/2 units, and (C 6 H 5 ) SiO 3/2 units, and mixtures of two or more thereof.
The content of the component (B) is such that the silicon atom-bonded hydrogen atom in this component is 0.1 to 10 mol per 1 mol of the silicon atom-bonded alkenyl group in the component (A), preferably , 0.5 to 5 mol. When the content of the component (B) is not more than the upper limit of the above range, the resulting cured product has good mechanical properties, and on the other hand, if it is not less than the lower limit of the above range, the resulting composition is cured. This is because the property is good. In addition, content of the silicon atom bond hydrogen atom in (B) component is analysis, such as a Fourier-transform infrared spectrophotometer (FT-IR), nuclear magnetic resonance (NMR), gel permeation chromatography (GPC) etc., for example. Can be obtained.
Component (C) is a triazole compound that imparts peel resistance to the cured product of the composition. As the component (C), 1H-1,2,3-triazole, 2H-1,2,3-triazole, 1H-1,2,4-triazole, 4H-1,2,4-triazole, 2- ( 2'-hydroxy-5'-methylphenyl) benzotriazole, benzotriazole, tolyltriazole, carboxybenzotriazole, 1H-benzotriazole-5-carboxylate methyl, 3-amino-1,2,4-triazole, 4-amino -1,2,4-triazole, 5-amino-1,2,4-triazole, 3-mercapto-1,2,4-triazole, chlorobenzotriazole, nitrobenzotriazole, aminobenzotriazole, cyclohexano [1, 2-d] triazole, 4,5,6,7-tetrahydroxytolyltriazole, 1-hydride Xylbenzotriazole, ethylbenzotriazole, naphthotriazole, 1-N, N-bis (2-ethylhexyl)-[(1,2,4-triazol-1-yl) methyl] amine, 1- [N, N-bis (2-ethylhexyl) aminomethyl] benzotriazole, 1- [N, N-bis (2-ethylhexyl) aminomethyl] tolyltriazole, 1- [N, N-bis (2-ethylhexyl) aminomethyl] carboxybenzotriazole, 1- [N, N-bis (2-hydroxyethyl) -aminomethyl] benzotriazole, 1- [N, N-bis (2-hydroxyethyl) -aminomethyl] tolyltriazole, 1- [N, N-bis (2-hydroxyethyl) -aminomethyl] carboxybenzotriazole, 1- [N, N-bis (2- Hydroxypropyl) aminomethyl] carboxybenzotriazole, 1- [N, N-bis (1-butyl) aminomethyl] carboxybenzotriazole, 1- [N, N-bis (1-octyl) aminomethyl] carboxybenzotriazole, 1- (2 ′, 3′-di-hydroxypropyl) benzotriazole, 1- (2 ′, 3′-di-carboxyethyl) benzotriazole, 2- (2′-hydroxy-3 ′, 5′-di- tert-butylphenyl) benzotriazole, 2- (2′-hydroxy-3 ′, 5′-amylphenyl) benzotriazole, 2- (2′-hydroxy-4′-octoxyphenyl) benzotriazole, 2- (2 '-Hydroxy-5'-tert-butylphenyl) benzotriazole, 1-hydroxybenzotriazole-6-carboxy Boric acid, 1-oleoylbenzotriazole, 1,2,4-triazol-3-ol, 5-amino-3-mercapto-1,2,4-triazole, 5-amino-1,2,4-triazole- Examples include 3-carboxylic acid, 1,2,4-triazole-3-carboxamide, 4-aminourazole, 1,2,4-triazol-5-one, and mixtures of two or more thereof. In particular, the component (C) is preferably benzotriazole or a benzotriazole-based compound such as alkyl, carboxy or nitro-substituted benzotriazole, and further, benzotriazole, tolyltriazole, carboxybenzotriazole, nitrobenzotriazole, and It is preferably at least one benzotriazole compound selected from the group consisting of methyl 1H-benzotriazole-5-carboxylate.
The content of the component (C) is an amount within the range of 1 ppm to 0.5% by mass unit with respect to the present composition, and preferably within the range of 5 ppm to 0.3% or 10 ppm to 0. The amount is within the range of 1%. This is because if the content of the component (C) is equal to or higher than the lower limit of the above range, peeling against moisture reflow can be sufficiently suppressed, while if it is equal to or lower than the upper limit of the above range, the resulting cured product machine This is because the mechanical characteristics are improved.
Component (D) is a metal condensation reaction catalyst that imparts peel resistance to the cured product of the present composition. As component (D), organic aluminum compounds, organic titanium compounds, organic zirconium compounds, organic magnesium compounds, organic zinc compounds, organic copper compounds, organic nickel compounds, organic chromium compounds, organic cobalt compounds, organic iron compounds, organic indium compounds And organic lanthanum compounds, organic tin compounds, organic hafnium compounds, and mixtures of two or more thereof. Examples of organoaluminum compounds include alkoxy compounds such as trimethoxyaluminum, triethoxyaluminum, isopropoxyaluminum, isopropoxydiethoxyaluminum, and tributoxyaluminum; acyloxy compounds such as triacetoxyaluminum, tristearate aluminum, and tributyrate aluminum; aluminum Isopropylate, aluminum sec-butyrate, aluminum tert-butylate, aluminum tris (ethyl acetoacetate), tris (hexafluoroacetylacetonate) aluminum, trisethylacetoacetate aluminum, tris (n-propylacetoacetate) aluminum, tris (iso) -Propylacetoacetate) aluminum, tris (n- Chill acetoacetate) aluminum, tris salicylaldehyde aluminum, tris (2-ethoxycarbonyl phenolate) aluminum, tris (acetylacetonate) chelate compounds such as aluminum can be exemplified. Examples of organic titanium compounds include tetraalkoxytitanium such as tetraethoxytitanium, tetraisopropoxytitanium, and tetrabutyoxytitanium; tetraethylene glycol titanate, di-n-butylbis (triethanolamine) titanate, di (bis (acetylacetone) acid) -Isopropoxy titanium, isopropoxy titanium octanoate, isopropyl titanium trimethacrylate, isopropyl titanium triacrylate, isopropyl triisostearoyl titanate, isopropyl tridecylbenzenesulfonyl titanate, isopropyl tri (butyl, methyl pyrophosphate) titanate, tetraisopropyl di (Dilauryl phosphite) titanate, dimethacryloxyacetate titanate, diacryloxyacetate titanate, di (di Octyl phosphate) ethylene titanate, tri (dioctyl phosphate) isopropoxy titanium, isopropyl tris (dioctyl pyrophosphate) titanate, tetraisopropyl bis (dioctyl phosphite) titanate, tetraoctyl bis (ditridecyl phosphite) titanate, tetra (2, 2-diallyloxymethyl-1-butyl) bis (di-tridecyl) phosphite titanate, bis (dioctylpyrophosphate) oxyacetate titanate, tris (dioctylpyrophosphate) ethylene titanate, isopropyltri-n-dodecylbenzenesulfonyl titanate, isopropyl Trioctanoyl titanate, isopropyl dimethacryloyl isostearoyl titanate, isopropyl isostearoyl di Kuriruchitaneto, isopropyl tri (dioctyl phosphate) titanate, isopropyl tricumylphenyl titanate, isopropyl tri (N- aminoethyl - aminoethyl) titanate and the like. Examples of organic zirconium compounds include zirconium n-propoxide, zirconium n-butoxide, zirconium t-butoxide, zirconium isopropoxide, zirconium ethoxide, zirconyl acetate, zirconium acetylacetonate, zirconium butoxyacetylacetonate, zirconium bisacetylacetonate. Zirconium ethylacetoacetate, zirconium acetylacetonate bisethylacetoacetate, zirconium hexafluoroacetylacetonate, and zirconium trifluoroacetylacetonate are exemplified. Examples of the organic magnesium compound include ethyl acetoacetate magnesium monoisopropylate, magnesium bis (ethylacetoacetate), alkyl acetoacetate magnesium monoisopropylate, and magnesium bis (acetylacetonate). Examples of the organic zinc compound include zinc bis (ethyl acetoacetate), zinc acetylacetonate, zinc bis-2-ethylhexanoate, zinc (meth) acrylate, zinc neodecanoate, zinc acetate, zinc octoate, and zinc salicylate. Examples of the organic copper compound include copper bis (ethyl acetoacetate) and copper bis (acetylacetonate). Examples of the organic nickel compound include nickel bis (ethyl acetoacetate) and nickel bis (acetylacetonate). Examples of the organic chromium compound include chromium tris (ethyl acetoacetate) and chromium tris (acetylacetonate). Examples of the organic cobalt compound include cobalt tris (ethyl acetoacetate) and cobalt tris (acetylacetonate). Examples of the organic iron compound include iron tris (ethyl acetoacetate) and iron tris (acetylacetonate). Examples of the organic indium compound include indium tris (ethyl acetoacetate) and indium tris (acetylacetonate). Examples of the organic lanthanum compound include lanthanum tris (ethyl acetoacetate) and lanthanum tris (acetylacetonate). Examples of the organic tin compound include tin tetrakis (ethyl acetoacetate) and tin tetrakis (acetylacetonate). Examples of organic hafnium compounds include hafnium n-butoxide, hafnium t-butoxide, hafnium ethoxide, hafnium isopropoxide, hafnium isopropoxide monoisopropylate, hafnium acetylacetonate, and tetrakis (dimethylamino) hafnium. In particular, the component (D) is preferably at least one metal-based condensation reaction catalyst selected from the group consisting of organoaluminum compounds, organotitanium compounds, organozirconium compounds, organozinc compounds, and organoiron compounds.
The content of the component (D) is an amount that falls within a range of 20 ppm to 0.1% by mass unit with respect to the present composition, and preferably within a range of 30 ppm to 0.05% or 50 ppm to 0%. The amount is within the range of 0.03%. This is because if the content of the component (D) is not less than the lower limit of the above range, peeling against moisture reflow can be sufficiently suppressed, while if it is not more than the upper limit of the above range, the resulting composition can be preserved. This is because stability can be improved.
Component (E) is a hydrosilylation reaction catalyst for accelerating the curing of the composition. Examples of the component (E) include platinum group element catalysts and platinum group element compound catalysts. Specifically, platinum-based catalysts, rhodium-based catalysts, palladium-based catalysts, and combinations of at least two of these are exemplified. In particular, a platinum-based catalyst is preferable because curing of the composition can be remarkably accelerated. The platinum catalyst includes platinum fine powder, platinum black, chloroplatinic acid, alcohol-modified chloroplatinic acid, chloroplatinic acid and diolefin complex, platinum-olefin complex, platinum bis (acetoacetate), platinum bis ( Platinum-carbonyl complexes such as acetylacetonate), chloroplatinic acid-divinyltetramethyldisiloxane complexes, chloroplatinic acid-alkenylsiloxane complexes such as chloroplatinic acid-tetravinyltetramethylcyclotetrasiloxane complexes, platinum-divinyltetramethyldi Examples include siloxane complexes, platinum-alkenylsiloxane complexes such as platinum-tetravinyltetramethylcyclotetrasiloxane complexes, complexes of chloroplatinic acid and acetylene alcohols, and mixtures of two or more thereof. Because it can accelerate curing, platinum-alkenyl silo It is preferable that the acid complex.
Examples of the alkenylsiloxane used in the platinum-alkenylsiloxane complex include 1,3-divinyl-1,1,3,3-tetramethyldisiloxane, 1,3,5,7-tetramethyl-1,3,5,7. -Tetravinylcyclotetrasiloxane, alkenylsiloxane oligomers in which some of the methyl groups of these alkenylsiloxanes are substituted with ethyl groups, phenyl groups, etc., and alkenyls in which the vinyl groups of these alkenylsiloxanes are substituted with allyl groups, hexenyl groups, etc. Examples of the siloxane oligomer include 1,3-divinyl-1,1,3,3-tetramethyldisiloxane because the platinum-alkenylsiloxane complex to be formed is particularly stable.
In order to improve the stability of the platinum-alkenylsiloxane complex, these platinum-alkenylsiloxane complexes may be converted to 1,3-divinyl-1,1,3,3-tetramethyldisiloxane, 1,3-diallyl-1 1,3,3-tetramethyldisiloxane, 1,3-divinyl-1,3-dimethyl-1,3-diphenyldisiloxane, 1,3-divinyl-1,1,3,3-tetraphenyldisiloxane , And 1,3,5,7-tetramethyl-1,3,5,7-tetravinylcyclotetrasiloxane and other alkenylsiloxane oligomers and dimethylsiloxane oligomers and other organosiloxane oligomers, The alkenylsiloxane oligomer is preferably dissolved in the alkenylsiloxane oligomer.
The content of the component (E) is an amount that promotes the curing of the composition. Specifically, the catalyst metal atom in the component (E) is 0.01 to 500 ppm by mass with respect to the composition. It is preferable that the amount is in the range of 0.01 to 100 ppm, or the amount is in the range of 0.1 to 50 ppm. When the content of the component (E) is equal to or higher than the lower limit of the above range, the resulting composition has good curability. On the other hand, when the content is equal to or lower than the upper limit of the above range, the resulting cured product is colored. It is because it can be suppressed.
The composition may contain (F) a hydrosilylation reaction inhibitor in order to extend the pot life at room temperature and improve the storage stability. As component (F), 1-ethynylcyclohexane-1-ol, 2-methyl-3-butyn-2-ol, 3,5-dimethyl-1-hexyn-3-ol, and 2-phenyl-3-butyne Alkyne alcohols such as 2-ol; enyne compounds such as 3-methyl-3-penten-1-yne and 3,5-dimethyl-3-hexen-1-yne; 1,3,5,7-tetramethyl Methyl alkenyl siloxane oligomers such as -1,3,5,7-tetravinylcyclotetrasiloxane and 1,3,5,7-tetramethyl-1,3,5,7-tetrahexenylcyclotetrasiloxane; Alkyneoxy compounds such as 3-methyl-1-butyne-3-oxy) silane and methylvinylbis (3-methyl-1-butyne-3-oxy) silane Down; and triallyl isocyanurate compounds.
Although content of (F) component is not limited, It is preferable to exist in the range of 0.0001-5 mass parts or the range of 0.01-3 mass parts with respect to 100 mass parts of this composition.
Moreover, in order to further improve the adhesiveness to the base material which is contacting during hardening, this composition may contain an adhesion promoter. As this adhesion promoter, an organosilicon compound having at least one alkoxy group bonded to a silicon atom in one molecule is preferable. Examples of the alkoxy group include a methoxy group, an ethoxy group, a propoxy group, a butoxy group, and a methoxyethoxy group, and a methoxy group or an ethoxy group is particularly preferable. In addition, examples of the group other than the alkoxy group bonded to the silicon atom of the organosilicon compound include halogen-substituted or unsubstituted groups similar to those described above, such as an alkyl group, an alkenyl group, an aryl group, an aralkyl group, and a halogenated alkyl group. Valent hydrocarbon group; glycidoxyalkyl group such as 3-glycidoxypropyl group and 4-glycidoxybutyl group; 2- (3,4-epoxycyclohexyl) ethyl group, and 3- (3,4- Epoxycyclohexyl) propyl group such as cyclohexyl alkyl group; 4-oxiranylbutyl group and oxiranylalkyl group such as 8-oxiranyloctyl group; acrylic group-containing monovalent organic group such as 3-methacryloxypropyl group Examples are a group; an isocyanate group; an isocyanurate group; and a hydrogen atom. This organosilicon compound preferably has an aliphatic unsaturated hydrocarbon group or a group capable of reacting with a silicon atom-bonded hydrogen atom in the present composition, specifically, a silicon atom-bonded aliphatic unsaturated hydrocarbon group or It preferably has a silicon atom-bonded hydrogen atom.
Although content of an adhesion promoter is not limited, It is preferable to exist in the range of 0.01-10 mass parts or the range of 0.1-3 mass parts with respect to 100 mass parts of this composition.
In addition, the present composition may contain a phosphor as another optional component. As this phosphor, oxide phosphors, oxynitride phosphors, nitride phosphors, sulfide phosphors, oxysulfide phosphors and the like widely used in light emitting diodes (LEDs) And yellow, red, green and blue light emitting phosphors, and a mixture of at least two of them. Examples of oxide phosphors include yttrium, aluminum, and garnet-based YAG green to yellow light-emitting phosphors containing cerium ions, terbium, aluminum, garnet-based TAG yellow light-emitting phosphors containing cerium ions, and Examples include silicate green to yellow light emitting phosphors containing cerium and europium ions. Examples of the oxynitride phosphor include silicon, aluminum, oxygen, and nitrogen-based sialon-based red to green light-emitting phosphors containing europium ions. Examples of nitride-based phosphors include calcium, strontium, aluminum, silicon, and nitrogen-based casoon-based red light-emitting phosphors containing europium ions. Examples of sulfide-based phosphors include ZnS-based green coloring phosphors containing copper ions and aluminum ions. Examples of oxysulfide phosphors include Y 2 O 2 S red light-emitting phosphors containing europium ions.
Although content of this fluorescent substance is not specifically limited, In this composition, it is preferable to exist in the range of 0.1-70 mass% or the range of 1-20 mass%.
In addition, in the present composition, as long as the object of the present invention is not impaired, as other optional components, one or more inorganic fillers selected from silica, glass, alumina and the like; silicone rubber powder; silicone resin, And resin powder such as polymethacrylate resin; one or more components selected from heat-resistant agents, dyes, pigments, flame retardants, surfactants, solvents and the like may be contained.
The composition is cured at room temperature or by heating, but is preferably heated in order to cure rapidly. The heating temperature is preferably in the range of 50 to 200 ° C.
The composition is preferably cured to form a cured product having a type A durometer hardness of 15 to 99 or 30 to 95 as defined in JIS K 6253. This has strength when the hardness of the cured product of the curable silicone composition is not less than the lower limit of the above range, and is excellent in protection when used as a sealing material or a covering material for an optical semiconductor element. On the other hand, when the amount is not more than the upper limit of the above range, the cured product becomes flexible and has excellent durability.
Next, the optical semiconductor device of the present invention will be described in detail.
The optical semiconductor device of the present invention is characterized in that the optical semiconductor element is sealed, covered, or bonded with a cured product of the above composition. Examples of the optical semiconductor element include a light emitting diode (LED), a semiconductor laser, a photodiode, a phototransistor, a solid-state imaging, a photocoupler light emitter and a light receiver, and a light emitting diode (LED) is particularly preferable.
The light emitting diode (LED) emits light from the top, bottom, left and right of the optical semiconductor element. Therefore, it is not preferable that the components constituting the light emitting diode (LED) absorb light, and the light transmittance is high or the reflectance is high. Material is preferred. Therefore, the substrate on which the optical semiconductor element is mounted is also preferably made of a material having high light transmittance or high reflectance. As a substrate on which such an optical semiconductor element is mounted, for example, a conductive metal such as silver, gold, and copper; a nonconductive metal such as aluminum and nickel; and a heat mixed with a white pigment such as PPA and LCP Examples include plastic resins; thermosetting resins containing white pigments such as epoxy resins, BT resins, polyimide resins, and silicone resins; ceramics such as alumina and alumina nitride. Since the cured product of the curable silicone composition has good thermal shock resistance to the optical semiconductor element and the substrate, the obtained optical semiconductor device can exhibit good reliability.
A cross-sectional view of a surface-mounted LED as an example of the optical semiconductor device of the present invention is shown in FIG. In the LED shown in FIG. 1, the optical semiconductor element 1 is die-bonded on a lead frame 2, and the optical semiconductor element 1 and the lead frame 3 are wire-bonded by bonding wires 4. A light reflecting material 5 is formed around the optical semiconductor element 1, and the optical semiconductor element 1 inside the light reflecting material 5 is sealed with a cured product 6 of the curable silicone composition.
As a method of manufacturing the surface mount type LED shown in FIG. 1, an optical semiconductor element 1 is die-bonded on a lead frame 2 inside a light reflecting material 5, and the optical semiconductor element 1 and the lead frame 3 are made of gold. An example is a method in which wire bonding is performed with the bonding wire 4 and then the optical semiconductor element 1 is resin-sealed with the curable silicone composition.
本発明の硬化性シリコーン組成物および光半導体装置を実施例および比較例により詳細に説明する。なお、硬化性シリコーン組成物の硬化物の硬さ、硬化性シリコーン組成物の硬化物の初期剥離率、および硬化物の吸湿リフロー後の剥離率を次のようにして測定した。
[硬さ]
硬化性シリコーン組成物を150℃で1時間、5MPaの圧力でプレス成形することによりシート状の硬化物を作製した。このシート状の硬化物の硬さをJIS K 6253に規定されるタイプAデュロメータにより測定した。
また、硬化性シリコーン組成物を用いて、150℃で1時間加熱することにより、図1で示される光半導体装置を作製した。この光半導体装置に対する硬化性シリコーン組成物の耐剥離性を、次のようにして測定した。
[初期剥離率]
光半導体装置20個について、リードフレームおよびワイヤボンディングと硬化物との間の剥離状態を光学顕微鏡で観察し、剥離した割合(剥離した個数/20個)を剥離率とした。
[吸湿リフロー後の剥離率]
上記の光半導体装置20個を85C/85%RHオーブンに168時間保管し、280℃のオーブン内に30秒間置いた後、室温(25℃)下に戻して、リードフレームおよびボンディングワイヤと硬化物との間の剥離状態を光学顕微鏡で観察し、剥離した割合(剥離した個数/20個)を剥離率とした。
[実施例1〜6、比較例1〜8]
次の成分を表1および表2に示す組成(質量部)で均一に混合して実施例1〜6および比較例1〜8の硬化性シリコーン組成物を調製した。なお、式中、Viはビニル基を表し、Meはメチル基を示す。また、表1および表2において、SiH/Viは、硬化性シリコーン組成物において、(A)成分中のビニル基の合計1モルに対する(B)成分中のケイ素原子結合水素原子の合計モル数を示す。
(A)成分として、次の成分を用いた。なお、粘度は25℃における値であり、JIS K7117−1に準拠したB型粘度計を用いて測定した。
(a−1−1)成分:粘度300mPa・sであり、平均式:
Me2ViSiO(Me2SiO)150SiMe2Vi
で表される分子鎖両末端ジメチルビニルシロキシ基封鎖ジメチルポリシロキサン(ビニル基の含有量=0.48質量%)
(a−1−2)成分:粘度10,000mPa・sであり、平均式:
Me2ViSiO(Me2SiO)500SiMe2Vi
で表される分子鎖両末端ジメチルビニルシロキシ基封鎖ジメチルポリシロキサン(ビニル基の含有量=0.15質量%)
(a−2−1)成分:25℃において白色固体状で、トルエン可溶性である、平均単位式:
(Me2ViSiO1/2)0.15(Me3SiO1/2)0.38(SiO4/2)0.47(HO1/2)0.01
で表される、一分子中に2個以上のビニル基を有するオルガノポリシロキサン(ビニル基の含有量=4.2質量%)
(a−2−2)成分:25℃において白色固体状で、トルエン可溶性である、平均単位式:
(Me2ViSiO1/2)0.13(Me3SiO1/2)0.45(SiO4/2)0.42(HO1/2)0.01
で表される、一分子中に2個以上のビニル基を有するオルガノポリシロキサン(ビニル基の含有量=3.4質量%)
(B)成分として、次の成分を用いた。なお、粘度は、25℃における値であり、JIS K7117−1に準拠したB型粘度計を用いて測定した。
(b−1)成分:平均式:
Me3SiO(MeHSiO)55SiMe3
で表される、粘度20mPa・sの分子鎖両末端トリメチルシロキシ基封鎖メチルハイドロジェンポリシロキサン(ケイ素原子結合水素原子の含有量=1.6質量%)
(b−2)成分:平均式:
Me3SiO(MeHSiO)15SiMe3
で表される、粘度5mPa・sの分子鎖両末端トリメチルシロキシ基封鎖ジメチルシロキサン・メチルハイドロジェンシロキサン共重合体(ケイ素原子結合水素原子の含有量=1.42質量%)
(C)成分として、次の成分を用いた。
(c−1)成分:ベンゾトリアゾール
(c−2)成分:トリルトリアゾール
(c−3)成分:カルボキシベンゾトリアゾール
(D)成分として、次の成分を用いた。
(d−1)成分:ジルコニウムエチルアセトアセテート
(d−2)成分:イソプロピルトリイソステアロイルチタネート
(d−3)成分:アセトアルコキシアルミニウムジイソプロピレート
(E)成分として、白金の1,3−ジビニルテトラメチルジシロキサン錯体の1,3−ジビニルテトラメチルジシロキサン溶液(白金金属の含有量=約6000ppm)を用いた。
(F)成分として、1−エチニルシクロヘキサン−1−オールを用いた。
[Hardness]
The curable silicone composition was press-molded at 150 ° C. for 1 hour at a pressure of 5 MPa to prepare a sheet-like cured product. The hardness of the sheet-like cured product was measured with a type A durometer specified in JIS K 6253.
Moreover, the optical semiconductor device shown by FIG. 1 was produced by heating at 150 degreeC for 1 hour using a curable silicone composition. The peel resistance of the curable silicone composition for this optical semiconductor device was measured as follows.
[Initial peeling rate]
For 20 optical semiconductor devices, the peeled state between the lead frame and wire bonding and the cured product was observed with an optical microscope, and the peeled ratio (number of peeled / 20) was defined as the peel rate.
[Peeling rate after moisture absorption reflow]
Twenty optical semiconductor devices described above were stored in an 85C / 85% RH oven for 168 hours, placed in an oven at 280 ° C. for 30 seconds, and then returned to room temperature (25 ° C.) to lead frame, bonding wire, and cured product The peeled state was observed with an optical microscope, and the peeled ratio (number of peeled / 20 pieces) was defined as the peel rate.
[Examples 1-6, Comparative Examples 1-8]
The following components were uniformly mixed in the compositions (parts by mass) shown in Tables 1 and 2 to prepare curable silicone compositions of Examples 1 to 6 and Comparative Examples 1 to 8. In the formula, Vi represents a vinyl group, and Me represents a methyl group. In Tables 1 and 2, SiH / Vi is the total number of moles of silicon-bonded hydrogen atoms in component (B) relative to the total of 1 mole of vinyl groups in component (A) in the curable silicone composition. Show.
The following components were used as the component (A). In addition, a viscosity is a value in 25 degreeC and measured using the B-type viscometer based on JISK7117-1.
(A-1-1) component: viscosity is 300 mPa · s, average formula:
Me 2 ViSiO (Me 2 SiO) 150 SiMe 2 Vi
Dimethylpolysiloxane blocked with dimethylvinylsiloxy group at both ends of the molecular chain represented by
(A-1-2) component: viscosity is 10,000 mPa · s, average formula:
Me 2 ViSiO (Me 2 SiO) 500 SiMe 2 Vi
Dimethylpolysiloxane blocked with dimethylvinylsiloxy group at both ends of the molecular chain represented by
(A-2-1) Component: White solid at 25 ° C. and soluble in toluene, average unit formula:
(Me 2 ViSiO 1/2 ) 0.15 (Me 3 SiO 1/2 ) 0.38 (SiO 4/2 ) 0.47 (HO 1/2 ) 0.01
An organopolysiloxane having two or more vinyl groups in one molecule (vinyl group content = 4.2 mass%)
(A-2-2) Component: A white solid at 25 ° C. and soluble in toluene. Average unit formula:
(Me 2 ViSiO 1/2 ) 0.13 (Me 3 SiO 1/2 ) 0.45 (SiO 4/2 ) 0.42 (HO 1/2 ) 0.01
An organopolysiloxane having two or more vinyl groups in one molecule (vinyl group content = 3.4% by mass)
As the component (B), the following components were used. In addition, a viscosity is a value in 25 degreeC and was measured using the B-type viscosity meter based on JISK7117-1.
(B-1) Component: Average formula:
Me 3 SiO (MeHSiO) 55 SiMe 3
The molecular chain both ends trimethylsiloxy group-blocked methyl hydrogen polysiloxane with a viscosity of 20 mPa · s (content of silicon-bonded hydrogen atoms = 1.6 mass%)
(B-2) Component: Average formula:
Me 3 SiO (MeHSiO) 15 SiMe 3
A dimethylsiloxane / methylhydrogensiloxane copolymer blocked with trimethylsiloxy groups at both ends of a molecular chain having a viscosity of 5 mPa · s (content of silicon-bonded hydrogen atoms = 1.42% by mass)
As the component (C), the following components were used.
(C-1) Component: Benzotriazole (c-2) Component: Tolyltriazole (c-3) Component: Carboxybenzotriazole The following components were used as component (D).
(D-1) component: zirconium ethyl acetoacetate (d-2) component: isopropyl triisostearoyl titanate (d-3) component: acetoalkoxyaluminum diisopropylate As component (E), platinum 1,3-divinyltetra A 1,3-divinyltetramethyldisiloxane solution of a methyldisiloxane complex (platinum metal content = about 6000 ppm) was used.
As component (F), 1-ethynylcyclohexane-1-ol was used.
本発明の硬化性シリコーン組成物は、発光ダイオード(LED)、半導体レーザ、フォトダイオード、フォトトランジスタ、固体撮像、フォトカプラー用発光体と受光体等の光半導体装置の封止剤、保護剤、あるいは接着剤として有用である。また、本発明の光半導体装置は、光学装置、光学機器、照明機器、照明装置等の光半導体装置として有用である。 The curable silicone composition of the present invention is a light-emitting diode (LED), a semiconductor laser, a photodiode, a phototransistor, a solid-state imaging, a sealing agent, a protective agent for an optical semiconductor device such as a light-emitting body and a light-receiving body for a photocoupler, or Useful as an adhesive. The optical semiconductor device of the present invention is useful as an optical semiconductor device such as an optical device, an optical device, a lighting device, and a lighting device.
1 光半導体素子
2 リードフレーム
3 リードフレーム
4 ボンディングワイヤ
5 反射材
6 硬化性シリコーン組成物の硬化物DESCRIPTION OF SYMBOLS 1 Optical semiconductor element 2 Lead frame 3 Lead frame 4 Bonding wire 5 Reflector 6 Hardened | cured material of curable silicone composition
Claims (8)
(B)一分子中に少なくとも2個のケイ素原子結合水素原子を有するオルガノハイドロジェンポリシロキサン{(A)成分中のケイ素原子結合アルケニル基1モルに対して、本成分中のケイ素原子結合水素原子が0.1〜10モルとなる量}、
(C)トリアゾール系化合物(本組成物に対して、質量単位で1ppm〜0.5%となる量)、
(D)金属系縮合反応触媒(本組成物に対して、質量単位で20ppm〜0.1%となる量)、および
(E)ヒドロシリル化反応用触媒(本組成物の硬化を促進する量)
から少なくともなる硬化性シリコーン組成物。(A) an organopolysiloxane having at least two silicon-bonded alkenyl groups in one molecule;
(B) Organohydrogenpolysiloxane having at least two silicon atom-bonded hydrogen atoms in one molecule {silicon atom-bonded hydrogen atom in this component with respect to 1 mol of silicon atom-bonded alkenyl group in component (A) In an amount of 0.1 to 10 mol},
(C) Triazole-based compound (amount of 1 ppm to 0.5% by mass unit with respect to the present composition),
(D) Metal-based condensation reaction catalyst (in an amount of 20 ppm to 0.1% in terms of mass unit with respect to the present composition), and (E) Hydrosilylation reaction catalyst (in an amount that promotes curing of the present composition)
A curable silicone composition comprising at least
R1 3SiO(R1 2SiO)mSiR1 3
(式中、R1は同じかまたは異なる一価炭化水素基、ただし、一分子中、少なくとも2個のR1はアルケニル基であり、mは5〜1,000の整数である。)
で表される直鎖状のオルガノポリシロキサンおよび/または(A−2)平均単位式:
(R1SiO3/2)a(R1 2SiO2/2)b(R1 3SiO1/2)c(SiO4/2)d(XO1/2)e
(式中、R1は前記と同じであり、ただし、R1の合計の0.01〜50モル%はアルケニル基であり、Xは水素原子またはアルキル基であり、a、b、c、d、およびeは、0≦a≦1.0、0≦b≦1.0、0≦c<0.9、0≦d<0.5、0≦e<0.4、かつa+b+c+d=1.0を満たす数である。)
で表される分岐鎖状のオルガノポリシロキサンである、請求項1に記載の硬化性シリコーン組成物。(A) component is (A-1) general formula:
R 1 3 SiO (R 1 2 SiO) m SiR 1 3
(In the formula, R 1 is the same or different monovalent hydrocarbon group, provided that at least two R 1 are alkenyl groups in one molecule, and m is an integer of 5 to 1,000.)
A linear organopolysiloxane and / or (A-2) an average unit formula:
(R 1 SiO 3/2 ) a (R 1 2 SiO 2/2 ) b (R 1 3 SiO 1/2 ) c (SiO 4/2 ) d (XO 1/2 ) e
(In the formula, R 1 is the same as above, except that 0.01 to 50 mol% of the total of R 1 is an alkenyl group, X is a hydrogen atom or an alkyl group, and a, b, c, d) , And e are 0 ≦ a ≦ 1.0, 0 ≦ b ≦ 1.0, 0 ≦ c <0.9, 0 ≦ d <0.5, 0 ≦ e <0.4, and a + b + c + d = 1. It is a number that satisfies 0.)
The curable silicone composition according to claim 1, which is a branched organopolysiloxane represented by the formula:
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003113324A (en) * | 2001-07-31 | 2003-04-18 | Kanegafuchi Chem Ind Co Ltd | Curable composition |
JP2007284687A (en) * | 2007-06-08 | 2007-11-01 | Shin Etsu Chem Co Ltd | Room temperature curable organopolysiloxane composition and part using the same as adhesive |
JP2009185236A (en) * | 2008-02-08 | 2009-08-20 | Shin Etsu Chem Co Ltd | Thermosetting type silicone rubber composition |
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JP4687074B2 (en) * | 2004-11-02 | 2011-05-25 | 住友ベークライト株式会社 | Epoxy resin composition and semiconductor device |
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JP2009215434A (en) | 2008-03-11 | 2009-09-24 | Shin Etsu Chem Co Ltd | Silicone resin composition and light-emitting semiconductor device |
JP5136963B2 (en) | 2008-03-24 | 2013-02-06 | 信越化学工業株式会社 | Curable silicone rubber composition and semiconductor device |
JP5555989B2 (en) * | 2008-08-08 | 2014-07-23 | 横浜ゴム株式会社 | Silicone resin composition, silicone resin using the same, and sealed optical semiconductor element |
US20130221400A1 (en) * | 2010-10-19 | 2013-08-29 | Mitsuru Tanikawa | Encapsulating agent for optical semiconductor devices, and optical semiconductor device using same |
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