JPWO2015041126A1 - CAPACITOR COMPONENT, CAPACITOR MODULE, POWER CONVERTER, AND METHOD FOR MANUFACTURING CAPACITOR COMPONENT - Google Patents

Abstract

A step (S12) of providing internal conductors (24B to 24D, 25A to 25C), a step of providing an opening (29) (S13), and an original fabric sheet (22A to 22D, 23A to 23C) The step (S14) of stacking sheets (22A to 22D, 23A to 23C) over a plurality of layers, the plurality of dielectric layers are overlapped, and the openings (19) are exposed at the edges of the respective dielectric layers, and the openings (29) A step (S15) of cutting out the dielectric portion (11) from which the surface of the inner conductor (24B to 24D, 25A to 25C) is exposed, and the opening portion (19) enters the end face of the dielectric portion (11). And a step (S16) of providing terminal conductors (16, 17).

Description

  The present invention relates to a method of manufacturing a capacitor component in which a plurality of internal conductors facing each other inside a dielectric portion are made conductive for each set by a terminal conductor provided on an end surface of the dielectric portion. The present invention also relates to a multilayer capacitor component in which a dielectric portion is configured by stacking flat film dielectrics, a capacitor module using the same, and a power converter.

  As capacitor parts, a film capacitor part in which a dielectric part is made of a resin film and a ceramic capacitor in which a dielectric part is made of ceramics are known. In these capacitor parts, the dielectric part is generally configured by winding a strip-shaped dielectric provided with an internal conductor, or by stacking flat film-like dielectrics provided with an internal conductor. It is.

  Here, the general manufacturing method of a film capacitor component is demonstrated.

  First, two belt-shaped resin films are prepared, and a conductor film is formed on each surface by a metal vapor deposition method or the like. Next, each conductor film is patterned by etching or the like to form an inner conductor of the capacitor component. At this time, the inner conductors of the two resin films are formed so that their positions are slightly shifted from each other in the width direction of the resin film. Next, a dielectric part is formed by winding up two resin films, and then winding up in roll shape. And the terminal conductor which makes a some internal conductor conduct | electrically_connects for every group is provided in the both ends of a dielectric material part.

  In the film capacitor component manufactured by the manufacturing method as described above, the edge of each internal conductor is exposed at both ends of the dielectric portion, and the terminal conductor contacts (line contact) there. For this reason, the contact area between the inner conductor and the terminal conductor is small, and the equivalent series resistance (ESR) of the film capacitor component may become excessive due to a shape error. In view of this, in a film capacitor component, a manufacturing method in which an internal conductor and a terminal conductor are in surface contact has been proposed (see, for example, Patent Documents 1 to 3).

  In the method for manufacturing a film capacitor component described in Patent Document 1, the two resin films are rolled up in a state in which the end portions of the resin film are slightly displaced, and the end surfaces of the dielectric portions are made uneven, The surface of the inner conductor is exposed from the end face of the dielectric part. And a terminal conductor is provided in the uneven | corrugated end surface of a dielectric material part, and an internal conductor and a terminal conductor are surface-contacted.

  In the method for manufacturing a film capacitor component described in Patent Document 2, the end surface of the dielectric portion is made uneven by thermally shrinking two resin films having different heat shrinkage amounts, and the surface of the internal conductor is made the end surface of the dielectric portion. To expose. And a terminal conductor is provided in the uneven | corrugated end surface of a dielectric material part, and an internal conductor and a terminal conductor are surface-contacted.

  In the method of manufacturing a film capacitor component described in Patent Document 3, the end surface of the dielectric portion is eroded by a gas that reacts with the dielectric portion, thereby making the end surface of the dielectric portion uneven, and the surface of the inner conductor is made of a dielectric. It is exposed from the end face of the part. And a terminal conductor is provided in the uneven | corrugated end surface of a dielectric material part, and an internal conductor and a terminal conductor are surface-contacted.

JP 2006-294789 A JP-A-8-102427 JP-A-1-248607

  In the method of manufacturing a film capacitor component described in Patent Document 1, when a plurality of dielectric portions are manufactured at once, it is necessary to divide the raw material of the resin film and wind up the individual dielectric portions. For this reason, it was necessary to wind up a plurality of resin films in parallel, and there was a problem that the manufacturing cost of the capacitor parts remained high.

  In addition, the film capacitor component manufacturing method described in Patent Document 2 requires the use of two resin films having greatly different heat shrinkage, and the material of the dielectric film is limited, so that it is optimal in terms of capacitor component characteristics. There is a problem that it is difficult to adopt the material and the material cost of the resin film is increased.

  Moreover, in the manufacturing method described in Patent Document 3, an unnecessary residual component may remain between the inner conductor and the terminal conductor because the chemical reaction of the dielectric portion is used. For this reason, the resin film is chemically reacted. A process and a process for removing residual components are required, and there is still a problem that the manufacturing cost of the capacitor component remains high. In addition, when the residual component is not sufficiently removed, the contact resistance between the internal conductor and the terminal conductor may increase, or the reliability of the capacitor component may decrease.

  Accordingly, an object of the first invention of the present application is a method for manufacturing a capacitor component in which an inner conductor and a terminal conductor are in surface contact, and provides a method for manufacturing a capacitor component that can be manufactured at a low cost with a simple manufacturing process. There is to do.

  A second object of the present invention is a multilayer capacitor part in which a plurality of flat film-like dielectric layers are stacked, and the material of the dielectric layer is limited, and the internal conductor and the terminal conductor face each other. It is an object of the present invention to provide a capacitor component, a capacitor module using the capacitor component, and a power conversion device in which unnecessary residual components do not occur at a contact position.

  The method of manufacturing a capacitor component according to the first invention of the present application includes an inner conductor forming step of providing a predetermined shape of an inner conductor on an original fabric made of a dielectric, and an opening forming step of providing an opening of a predetermined shape on the original And a multi-layered process in which the original fabric provided with the inner conductor and the opening is stacked over a plurality of layers, and a plurality of dielectric layers are overlapped from the original fabric stacked in the multi-layered process, and the opening A dielectric part forming step in which a dielectric part is exposed at an edge of each dielectric layer, and a surface of the inner conductor is exposed in the opening, and the dielectric cut out in the dielectric part forming step And a terminal conductor forming step of providing a terminal conductor entering the opening on the end face of the body.

  In the capacitor component manufactured by this manufacturing method, the terminal conductor provided on the end face of the dielectric portion enters the opening and makes surface contact with the surface of the internal conductor exposed inside the opening. Accordingly, the ESR of the capacitor component becomes stable. Further, in this manufacturing method, since the raw material is divided into multiple layers and then divided, there is no need to perform a multi-layer process for each capacitor component, and capacitor components can be manufactured at low cost with a simple manufacturing process. Further, the material of the dielectric material is not limited, and an optimum material in terms of the characteristics of the capacitor component can be employed. Further, it is not necessary to make the end face of the dielectric portion uneven by a chemical reaction, and it is possible to prevent a residual component due to the chemical reaction between the internal conductor and the terminal conductor.

  The original fabric is preferably made of a resin film. Thereby, it is possible to realize a film capacitor component that can be easily increased in capacity.

  The original fabric is an uncured or semi-cured resin film mainly composed of a thermosetting material, and it is preferable to perform a step of thermosetting the resin film after the multilayering step. . Thereby, a highly heat-resistant capacitor component can be realized.

  In the multi-layering step, it is preferable to stack a plurality of flat film-like raw materials. Thereby, a multilayer capacitor component can be manufactured. Multilayer capacitor parts do not apply large tension to the original during the manufacturing process, and it is difficult to damage the original even if a weak original is used during manufacturing, such as a thermosetting material. Can be manufactured.

  The inner conductor and the opening are formed in a line-symmetric pattern with a cut line from which an end face of the dielectric part is cut out in the dielectric part forming step as a target axis, and are provided integrally on both sides of the target axis. It is preferred that Thereby, the formation size of the internal conductor and the opening provided integrally on the original fabric can be increased, and the number to be formed can be reduced. By these things, the formation precision of an internal conductor and an opening part is raised.

  A capacitor component according to a second invention of the present application includes a dielectric portion in which a plurality of flat dielectric first dielectric layers and a plurality of second dielectric layers are stacked, and along the first dielectric layer. A first inner conductor that extends along the second dielectric layer, a second inner conductor that extends along the second dielectric layer and faces the first inner conductor, and a plurality of second inner conductors provided on an end surface of the dielectric portion. A first terminal conductor that conducts to one internal conductor; and a second terminal conductor that is provided on an end face of the dielectric portion and conducts to the plurality of second inner conductors, and the first terminal At the position covered by the conductor, the second dielectric layer is recessed from the first dielectric layer, the surface of the first inner conductor is exposed, and is covered by the second terminal conductor. The first dielectric layer is recessed relative to the second dielectric layer and the surface of the second inner conductor is exposed. That.

  In actual manufacturing, a plurality of multilayer capacitor elements are manufactured at a time using a raw fabric. For this reason, the manufacturing method described in Patent Document 1 cannot be applied to the multilayer capacitor element. On the other hand, when the manufacturing method described in Patent Document 2 is applied to the multilayer capacitor element to bring the inner conductor and the terminal conductor into surface contact, the material of the dielectric portion is restricted. Further, when the manufacturing method described in Patent Document 3 is applied to the multilayer capacitor element to bring the inner conductor and the terminal conductor into surface contact, an unnecessary residual component is generated between the inner conductor and the terminal conductor. On the other hand, in the multilayer capacitor element of the second invention, even if the inner conductor and the terminal conductor are in surface contact, there is no restriction on the material of the dielectric portion, and there is no gap between the inner conductor and the terminal conductor. Unnecessary residual components are not generated.

  It is preferable that the first terminal conductor and the second terminal conductor are provided on the same end face of the dielectric portion. Thereby, a capacitor element having a low equivalent series inductance (ESL) can be configured.

  The dielectric layer is preferably made of a resin film. Thereby, it is possible to configure a film capacitor element that is easier to increase in size and capacity than a ceramic capacitor.

  The resin film is preferably made mainly of a thermosetting material that has been thermoset. Thereby, a highly heat-resistant capacitor element can be configured.

  The capacitor module of the present invention preferably includes a plurality of the capacitor elements, and is configured to electrically connect the plurality of multilayer capacitor elements and to be connected in a substantially rectangular parallelepiped shape as a whole. Thereby, in the capacitor module, the filling efficiency of the dielectric portion can be increased and the size can be reduced.

The power conversion device of the present invention includes the above-described capacitor module, and a power conversion unit that includes a power input terminal and a power output terminal, converts power input from the power input terminal, and outputs the power to the power output terminal. Prepared,
The capacitor module is preferably connected to a power input terminal or a power output terminal of the power converter. Thereby, it is possible to configure a power converter having a high output density using a small capacitor module corresponding to a large current.

  According to the first invention, the capacitor element in which the terminal conductor and the internal conductor are in surface contact can be manufactured by dividing the raw material into multiple layers, and there is no need to perform a multi-layer process for each capacitor element. Capacitor elements can be manufactured at low cost with a simple and manufacturing process.

  Further, according to the capacitor element of the second invention, in the multilayer capacitor element in which a plurality of flat film-like dielectric layers are stacked, even if the surface of the internal conductor and the terminal conductor are brought into surface contact, the dielectric part There is no restriction on the material, and unnecessary residual components are not generated between the inner conductor and the terminal conductor.

It is the perspective view and side sectional drawing of the capacitor | condenser element which concern on the 1st Embodiment of this invention. It is a figure which shows the manufacture flow of the capacitor | condenser element which concerns on the 1st Embodiment of this invention. It is side surface sectional drawing in the manufacture process of the capacitor | condenser element which concerns on the 1st Embodiment of this invention. It is a top view in the manufacture process of the capacitor | condenser element which concerns on the 1st Embodiment of this invention. It is a figure which shows the manufacture flow of the capacitor | condenser element which concerns on the 2nd Embodiment of this invention. It is side surface sectional drawing and top view of an original fabric which manufactures the capacitor | condenser element which concerns on the 3rd Embodiment of this invention. It is a perspective view of the capacitor | condenser element which concerns on the 4th Embodiment of this invention. It is a top view of the original fabric which manufactures the capacitor | condenser element which concerns on the 4th Embodiment of this invention. It is a top view of the original fabric which manufactures the capacitor | condenser element which concerns on the 5th Embodiment of this invention. It is a schematic diagram of the capacitor | condenser module and power converter device which concern on the 6th Embodiment of this invention.

  First, a method for manufacturing a capacitor element according to the first embodiment of the present invention will be described.

  FIG. 1A is a perspective view of a capacitor element 10 manufactured by the capacitor element manufacturing method according to the first embodiment of the present invention. FIG. 1B is a side sectional view of the capacitor element 10. 1, the surface facing the upper side in FIG. 1 is the top surface 10A, the surface facing the lower side in FIG. 1 is the bottom surface 10B, the surface facing the left side in FIG. 1 is the left end surface 10C, and the surface facing the right side in FIG. Is referred to as a right end face 10D.

  The capacitor element 10 has a substantially rectangular parallelepiped shape as a whole, and includes the dielectric portion 11, the first inner conductors 14B, 14C, 14D, the second inner conductors 15A, 15B, 15C, the first terminal conductor 16, and the second terminal conductor 16. And a terminal conductor 17.

  The dielectric part 11 includes first dielectric layers 12A, 12B, 12C, and 12D, and second dielectric layers 13A, 13B, and 13C. The first dielectric layers 12A to 12D and the second dielectric layers 13A to 13C are in the form of a flat film extending in a plane parallel to the top surface 10A and the bottom surface 10B in the dielectric portion 11, respectively. The portions 11 are alternately stacked from the top surface 10A to the bottom surface 10B. The first dielectric layers 12A to 12D and the second dielectric layers 13A to 13C are made of a resin film whose main material is a thermosetting resin, and the thermosetting resin is in a state of being thermoset. The first dielectric layers 12A, 12B, 12C, and 12D have the same pattern shape as viewed from the top surface 10A side. Further, the second dielectric layers 13A, 13B, and 13C have a pattern shape corresponding to a mirror image relationship with the first dielectric layers 12A, 12B, 12C, and 12D when viewed from the top surface 10A side.

  The first inner conductors 14B to 14D are provided inside the dielectric portion 11 so as to extend along the surfaces of the first dielectric layers 12B to 12D. The second inner conductors 15A to 15C are provided inside the dielectric portion 11 so as to extend along the surfaces of the second dielectric layers 13A to 13C. The first inner conductors 14B to 14D and the second inner conductors 15A to 15C sandwich the first dielectric layers 12B and 12C or the second dielectric layers 13A to 13C inside the dielectric portion 11, respectively. Are facing each other.

  The first terminal conductor 16 is provided so as to cover the left end face 10C of the dielectric portion 11, and is electrically connected to the first inner conductors 14B to 14D. The second terminal conductor 17 is provided so as to cover the right end face 10D of the dielectric portion 11, and is electrically connected to the second inner conductors 15A to 15C.

  Here, the first dielectric layers 12 </ b> A to 12 </ b> D have the left end surface 10 </ b> C of the dielectric portion 11 based on the center in the left-right direction of the dielectric portion 11 (indicated by a one-dot chain line in FIG. 1B). The dielectric part 11 is laminated while being shifted to the side. The second dielectric layers 13A to 13C are shifted to the right end face 10D side of the dielectric part 11 with reference to the center in the left-right direction of the dielectric part 11 (indicated by a one-dot chain line in FIG. 1B). The dielectric part 11 is laminated. For this reason, on the left end face 10C of the dielectric part 11, the second dielectric layers 13A to 13C are recessed from the first dielectric layers 12A to 12D, and a plurality of openings 19 are formed. Further, on the right end surface 10D of the dielectric part 11, the first dielectric layers 12A to 12D are recessed from the second dielectric layers 13A to 13C, and a plurality of openings 19 are formed.

  The first inner conductors 14B to 14D have edges on the left end surface 10C side reaching the edges of the first dielectric layers 12B to 12D, and edges on the right end surface 10D side are edges of the first dielectric layers 12B to 12D. It is molded so as not to reach. Therefore, the first inner conductors 14B to 14D are embedded in the dielectric part 11 in the vicinity of the edge on the right end face 10D side, and the surface in the vicinity of the edge on the left end face 10C side is the opening 19 on the left end face 10C. Exposed.

  The second inner conductors 15A to 15C have edges on the right end face 10D side reaching the edges of the second dielectric layers 13A to 13C, and edges on the left end face 10C side are edges of the second dielectric layers 13A to 13C. It is molded so as not to reach. Therefore, the second inner conductors 15A to 15C are embedded in the dielectric portion 11 in the vicinity of the edge on the left end surface 10C side, and the surface in the vicinity of the edge on the right end surface 10D side is the opening 19 on the right end surface 10D. Exposed.

  The first terminal conductor 16 enters the opening 19 in which the second dielectric layers 13A to 13C are recessed at the left end face 10C of the dielectric part 11, and is in surface contact with the first inner conductors 14B to 14D. . Further, the second terminal conductor 17 enters the opening 19 in which the first dielectric layers 12A to 12D are recessed in the right end surface 10D of the dielectric portion 11, and is in surface contact with the second inner conductors 15A to 15C. . Therefore, the capacitor element 10 according to the present embodiment has a large contact area between the inner conductors 14B to 14D and 15A to 15C and the terminal conductors 16 and 17, and has a stable ESR.

  In this capacitor element 10, since the dielectric portion 11 is made of a resin film, it is easy to realize characteristics that are larger and have a larger capacity than a ceramic capacitor. In addition, since the dielectric portion 11 is mainly made of a thermosetting resin such as cured polyvinyl acetal, a higher heat resistance characteristic can be obtained than a film capacitor element made of a thermoplastic resin such as PET, PPE, or PBT. The capacitor element 10 can be used in a high temperature environment. However, when the capacitor element 10 is not intended for use in a high temperature environment, the dielectric part 11 may be made of a thermoplastic resin.

  Next, a method for manufacturing the capacitor element 10 according to this embodiment will be described.

  FIG. 2 is a diagram showing a manufacturing flow of the capacitor element 10 according to the present embodiment. FIG. 3 is a side cross-sectional view showing the structure of the capacitor element 10 in the manufacturing process step by step. FIG. 4 is a plan view showing the structure of the capacitor element 10 in the manufacturing process. 3 shows the cut lines CL1 and CL2 from which the capacitor element 10 is cut out, and FIG. 4 shows the cut lines CL1, CL2 and CL3 from which the capacitor element 10 is cut out by broken lines. The cut lines CL1, CL2 and the cut line CL3 are provided perpendicular to each other. The cut lines CL1 and the cut lines CL2 are provided in parallel with each other and are alternately arranged.

  In the manufacturing process of the capacitor element 10, first, an original stamping process (FIG. 2: S11) is executed. In the original punching process, a raw sheet having a predetermined area is punched out by a roll-to-roll method from an original roll on which an uncured or semi-cured resin film is wound. The shape of the raw sheet is set so that a plurality of capacitor elements 10 can be formed side by side in the vertical and horizontal directions.

  Next, in the manufacturing process of the capacitor element 10, an internal conductor forming process (FIG. 2: S12) is performed. In the inner conductor forming step, as shown in FIG. 3 (S12), the raw sheets 22A, 23A, which will later become dielectric layers (12A, 13A, 12B, 13B, 12C, 13C, 12D) of the capacitor element (10). 22B, 23B, 22C, 23C, and 22D are prepared, and a metal such as Ni and Al is vapor-deposited in a predetermined pattern, so that the inner conductors (15A, 14B, 15B, 14C, 15C, and 14D) of the capacitor element (10) are later formed. The inner conductors 25A, 24B, 25B, 24C, 25C, and 24D are formed. At this time, the inner conductors 25A, 24B, 25B, 24C, 25C, and 24D are provided so that at least a part thereof overlaps the cut line CL1 or the cut line CL2 in the original fabric sheets 23A, 22B, 23B, 22C, 23C, and 22D. .

  Next, in the manufacturing process of the capacitor element 10, an opening forming process (FIG. 2: S13) is performed. In the opening forming step, as shown in FIG. 3 (S13), predetermined positions of the original fabric sheets 22A, 23A, 22B, 23B, 22C, 23C, and 22D are punched out, and the openings ( 19) is formed. At this time, the opening 29 is provided so that at least a part of the opening 29 overlaps the cut line CL1 or the cut line CL2 in the original fabric sheets 22A, 23A, 22B, 23B, 22C, 23C, and 22D.

  Here, the planar shape of the original fabric sheets 22A, 23A, 22B, 23B, 22C, 23C, and 22D after the opening forming step will be described. FIG. 4A is a plan view of the original fabric sheet 22A. FIG. 4B is a plan view of the original fabric sheet 23A. FIG. 4C is a plan view of the original fabric sheet 22B. The original fabric sheets 23B and 23C have the same shape as the original fabric sheet 23A. The original fabric sheets 22C and 22D have the same shape as the original fabric sheet 22B.

  4A and 4C, the opening 29 is formed along the cut line CL2 for each region to be the dielectric portion 11 of the original fabric sheets 22A and 22B (and the original fabric sheets 22C and 22D). , So as to protrude from both sides of the cut line CL2. Further, in FIG. 4B, the opening 29 is formed on both sides of the cut line CL1 along the cut line CL1 for each region to be the dielectric portion 11 of the original fabric sheet 23A (and the original fabric sheets 23B and 23C). It is provided to protrude to the side.

  Further, the first inner conductor 24B (and the first inner conductors 24C and 24D) shown in FIG. 4C straddle only the cut line CL1 in the original fabric sheet 22B (and the original fabric sheets 22C and 22D). It is formed in a rectangular shape extending to the regions to be the dielectric portions 11 on both sides of the cut line CL1, and ends in the regions to be the respective dielectric portions 11 in front of the opening 29 on the cut line CL2 (cut line CL1 side). Is formed to be positioned.

  The second inner conductor 25A (and the second inner conductors 25B and 25C) shown in FIG. 4B is a cut line straddling only the cut line CL2 in the original fabric sheet 23A (and the original fabric sheets 23B and 23C). It is formed in a rectangular shape extending to the regions to be the dielectric portions 11 on both sides of CL2, and the end portions are located in front of the opening 29 on the cut line CL1 (on the cut line CL2 side) in the regions to be the respective dielectric portions 11. It is formed to do.

  Thus, the inner conductors 24B and 25A (and the inner conductors 24C, 24D, 25B, and 25C) and the opening 29 are subjected to the inner conductor forming step (FIG. 2: S12) and the opening forming step (FIG. 2: S13). In this case, the line is symmetrical with respect to the cut line CL1 or the cut line CL2.

  In the present embodiment, the openings 29 are continuously formed over the entire width of the inner conductors 24B and 25A, but a plurality of openings 29 are arranged so as to be arranged at a predetermined interval along the width direction of the inner conductors 24B and 25A. You may form continuously.

  Next, in the manufacturing process of the capacitor element 10, a multilayering process (FIG. 2: S14) is performed. In the multilayering step, as shown in FIG. 3 (S14), the original fabric sheets 22A, 23A, 22B, 23B, 22C, 23C, and 22D are stacked. At this time, it is preferable that the original fabric sheets 22A, 23A, 22B, 23B, 22C, 23C, and 22D are pressed and brought into close contact with each other, and heated to cure the thermoplastic resin. In addition, as long as the process of hardening a thermoplastic resin by heating is after a multilayering process, you may perform it in what order.

  Next, in the manufacturing process of the capacitor element 10, a dielectric part forming step (FIG. 2: S15) is performed. In the dielectric part forming step, the original fabric sheets 22A, 23A, 22B, 23B, 22C, 23C, and 22D are divided along the cut lines CL1, CL2, and CL3, and the dielectric part 11 shown in FIG. Several are formed at a time. At this time, the opening 29 provided along the cut lines CL1, CL2 in the original fabric sheets 22A, 23A, 22B, 23B, 22C, 23C, 22D is divided, and the left end face 10C and the right end of each dielectric part 11 are divided. An opening 19 is formed in the surface 10D.

  Next, in the manufacturing process of the capacitor element 10, a terminal conductor forming process (FIG. 2: S16) is executed. In the terminal conductor forming step, as shown in FIG. 3 (S16), the left end face 10C and the right end face 10D of each dielectric part 11 are metallized (metal sprayed) with a metal material. Terminal conductors 16 and 17 are formed to cover the left end surface 10C and the right end surface 10D. In the present embodiment, since the dielectric portion 11 is made of a resin film, the terminal conductors 16 and 17 are formed of a metallicon. However, the dielectric portion 11 is made of a material such as ceramics other than the resin film. In this case, the terminal conductors 16 and 17 may be formed by using a dip method or a printing method.

  At this time, the terminal conductors 16 and 17 provided on the left end surface 10C and the right end surface 10D of the dielectric portion 11 enter the opening 19 and are exposed to the inner conductor (15A, 14B, 15B, 14C, 15C, 14D). Surface contact.

  Through the above steps, the capacitor element 10 according to this embodiment is manufactured. In this manufacturing method, since the dielectric part forming step (FIG. 2: S15) is performed after the multilayering process (FIG. 2: S14), the multilayering for each part is performed after the formation of the dielectric part 11 as in the conventional method. There is no need to carry out in parallel, and a simple and inexpensive manufacturing process can be realized. Further, even when the brittle original sheets 22A, 23A, 22B, 23B, 22C, 23C, 22D made of the thermosetting material before curing are used, the original sheets 22A, 23A, 22B, 23B, 22C, Excessive tension is not applied to 23C and 22D, and the original fabric sheets 22A, 23A, 22B, 23B, 22C, 23C, and 22D are less likely to be damaged. Therefore, the capacitor element 10 can be efficiently manufactured. As the original fabric sheets 22A, 23A, 22B, 23B, 22C, 23C, and 22D, those having a uniform heat shrinkage amount can be used, so that an optimum material in terms of the characteristics of the capacitor element 10 can be adopted. Moreover, the opening part 19 can be provided in the end surface of the dielectric part 11 by providing the opening part 29 in the raw fabric sheets 22A, 23A, 22B, 23B, 22C, 23C, and 22D and cutting it. It is not necessary to make the end face of the dielectric portion 11 uneven by utilizing the reaction, and this can also realize a simple and inexpensive manufacturing process. In addition, the internal conductors 15A, 14B, 15B, 14C, 15C, 14D And unnecessary components can be prevented from remaining between the terminal conductors 16 and 17.

  The present invention can be realized by the capacitor element manufacturing method according to the first embodiment described above. Note that the present invention is not limited to the method of manufacturing a multilayer capacitor element, and can be realized in a method of manufacturing a wound capacitor element. In that case, it is preferable that the dielectric portion is made of a resin film mainly composed of a thermoplastic resin.

  Moreover, although this embodiment demonstrated the case where all the cut lines CL1, CL2, CL3 were cut | disconnected by a dielectric material part formation process, all the cut lines CL1, CL2, CL3 were not necessarily cut | disconnected by a dielectric material part formation process. There is no need. For example, in the multi-layering step prior to the dielectric portion forming step, each raw fabric sheet is divided into strips along the cut line CL1 and the cut line CL2 before stacking the raw fabric sheets. After the original sheets are stacked, the original sheets may be finally cut along the cut line CL3. In this way, the shape of the left end face 10C and the right end face 10D of each dielectric part formed by cutting the cut lines CL1, CL2 can be made high in shape accuracy. And even when cutting the cut lines CL1 and CL2 prior to the multi-layering step, each original sheet is supported by a carrier film, and the cut lines CL1 and CL2 of each original sheet are cut on the carrier film. By doing so, a plurality of strip-shaped original fabric sheets supported by the carrier film can be laminated at a time, and it is not necessary to execute the multi-layering process in parallel for each of the strip-shaped original fabric sheets. In this manner, the shape accuracy of the left end surface 10C and the right end surface 10D of each dielectric part can be increased while preventing a significant increase in the number of steps.

  In this embodiment, the internal conductor forming process and the opening forming process are executed after the raw stamping process. However, the original stamping process is performed after the internal conductor forming process and the opening forming process. May be executed. An example in which the raw stamping process is executed in a process after the internal conductor forming process or the opening forming process will be described later in the second embodiment.

  In the present embodiment, the inner conductors and the openings are provided in line-symmetric shapes in the regions that are adjacent dielectric portions of the original sheet, but in the regions that are the respective dielectric portions of the original sheet, Each internal conductor and opening may be provided in a congruent shape. An example in which the inner conductors and the openings are provided in a congruent shape in the regions to be the dielectric portions of the raw sheet will be described later in the third and fourth embodiments.

  In the present embodiment, the two terminal conductors are disposed on the opposing end surfaces of the dielectric portion, but a plurality of terminal conductors may be disposed on the same end surface of the dielectric portion. An example in which a plurality of terminal conductors are arranged on the same end face of the dielectric portion will be described later in the fourth and fifth embodiments.

  Next, a method for manufacturing a capacitor according to the second embodiment of the present invention will be described.

  In the present embodiment, the order of the manufacturing process is different from that of the first embodiment, and the raw stamping process is executed after the internal conductor forming process and the opening forming process.

  FIG. 5 is a diagram showing a manufacturing flow of the capacitor element according to the present embodiment.

  In the manufacturing process of the capacitor element 10 according to the present embodiment, first, an internal conductor forming process (FIG. 5: S21) is performed. In the inner conductor forming step, a metal such as Ni, Al, etc. is vapor-deposited in a predetermined pattern by a roll-to-roll method with respect to the original roll on which the resin film is wound, and later becomes the inner conductor of the capacitor element. An electrode pattern is formed.

  Next, in the manufacturing process of the capacitor element 10, an opening forming process (FIG. 5: S22) is performed. In the opening forming step, the resin film on which the electrode pattern is formed is punched or the like by a roll-to-roll method to punch out a predetermined position to form the opening.

  Next, in the manufacturing process of the capacitor element 10, an original fabric punching process (FIG. 5: S23) is executed. In the original punching process, an original sheet having a predetermined area is punched out by a roll-to-roll method on a resin film in which an electrode pattern and an opening are formed.

  Thereafter, similarly to the first embodiment, a multi-layering step (FIG. 5: S24), a dielectric portion forming step (FIG. 5: S25), and a terminal conductor forming step (FIG. 5: S26) are performed. The capacitor element 10 is manufactured.

  As in the manufacturing method of this embodiment, the raw stamping process (FIG. 5: S23) may be performed after the internal conductor forming process (FIG. 5: S21) and the opening forming process (FIG. 5: S22). Moreover, you may perform an original fabric stamping process (FIG. 5: S23) between an internal conductor formation process (FIG. 5: S21) and an opening part formation process (FIG. 5: S22). In any case, a simple and inexpensive manufacturing process can be realized by performing the dielectric part forming process (FIG. 2: S25) after the multilayering process (FIG. 5: S24).

  Next, a method for manufacturing a capacitor element according to the third embodiment of the present invention will be described.

  In this embodiment, the pattern of the internal conductor and the pattern of the opening formed on each original fabric are different from those of the first embodiment, and both are congruent patterns for each region to be a dielectric portion.

  FIG. 6A is a side cross-sectional view of the capacitor element according to the present embodiment in a state where the original sheets are stacked. 6B and 6C are plan views of the raw sheet of the capacitor element 30. FIG. In FIG. 6, the cut lines CL1 and CL2 from which the capacitor element 10 is cut out are indicated by broken lines. The cut line CL1 and the cut line CL2 are provided perpendicular to each other.

  In the present embodiment, the dielectric portion 31 is formed by stacking and dividing the original fabric sheets 32A, 33A, 32B, 33B, 32C, 33C, and 32D. In the original fabric sheets 33A, 32B, 33B, 32C, 33C, and 32D, internal conductors 35A, 34B, 35B, 34C, 35C, and 34D are formed on one surface on the top surface side, respectively. Further, an opening 39A is formed in the original fabric sheets 32A, 32B, 32C, and 32D, and an opening 39B is formed in the original fabric sheets 33A, 33B, and 33C.

  Here, the planar shape of the original fabric sheets 32A, 33A, 32B, 33B, 32C, 33C, and 32D will be described. FIG. 6B is a plan view of the original fabric sheet 33A. FIG. 6C is a plan view of the original fabric sheet 32B. The original fabric sheets 33B and 33C have the same shape as the original fabric sheet 33A. The original fabric sheets 32C and 32D have the same shape as the original fabric sheet 32B.

  The opening 39A has one of the cut lines CL1 on both sides (the right cut line CL1 in FIG. 6) for each region that becomes the dielectric portion 31 in the raw fabric sheet 32B (and the raw fabric sheets 32A, 32C, and 32D). ).

  The opening 39B is formed on the other one of the cut lines CL1 on the both sides (the cut line CL1 on the left side in FIG. 6) for each region to be the dielectric portion 31 in the original fabric sheet 33A (and the original fabric sheets 33B and 33C). It is provided along.

  In addition, the first inner conductor 34B (and the first inner conductors 34C and 34D) are cut lines CL1 on both sides for each region to be the dielectric portion 31 in the raw sheet 32B (and the raw sheets 32C and 32D). Is provided so as to be in contact with only the other one (the cut line CL1 on the left side in FIG. 6) and away from the opening 39A.

  The second inner conductor 35A (and the second inner conductors 35B and 35C) are included in the cut lines CL1 on both sides for each region that becomes the dielectric portion 31 in the original sheet 33A (and the original sheets 33B and 33C). Is provided so as to be in contact with only one of them (the cut line CL1 on the right side in FIG. 6) and away from the opening 39B.

  Thus, the inner conductors 34B and 35A (and the inner conductors 34C, 34D, 35B, and 35C) and the openings 39A and 39B are formed in a congruent pattern for each region that becomes the dielectric portion 31.

  These raw fabric sheets 32A, 33A, 32B, 33B, 32C, 33C, and 32D are stacked along the cut lines CL1 and CL2, and a plurality of dielectric portions 31 are formed. Thereby, in each dielectric part 31, the opening part 39B is exposed to the left end face, and the opening part 39A is exposed to the right end face. And the terminal conductor which covers the left end surface and right end surface of each dielectric material part 31 is formed, respectively. As a result, the terminal conductor enters the openings 39A and 39B of the respective dielectric portions 31, and the inner conductors 35A, 34B, 35B, 34C, 35C, and 34D and the terminal conductor are in surface contact.

  Next, a method for manufacturing the capacitor element 40 according to the fourth embodiment of the present invention will be described.

  This embodiment is different from the first embodiment in that two terminal conductors are arranged on the same end face of the dielectric portion. FIG. 7A is a perspective view of a multilayer capacitor element 40 manufactured by the method for manufacturing a capacitor element according to this embodiment.

  The multilayer capacitor element 40 has a substantially rectangular parallelepiped shape as a whole, and includes a dielectric portion 41, a first inner conductor 44, a second inner conductor 45, a first terminal conductor 46, and a second terminal conductor 47. I have. The dielectric portion 41 has a configuration in which flat film-like dielectric layers extending in a plane parallel to the top surface and the bottom surface are stacked. The first inner conductor 44 and the second inner conductor 45 are alternately provided so as to extend along the surface of each dielectric layer inside the dielectric portion 41. The first inner conductor 44 and the second inner conductor 45 are opposed to each other inside the dielectric portion 41 with the dielectric layer interposed therebetween. The first terminal conductor 46 and the second terminal conductor 47 are provided on the same end face of the dielectric portion 41. The first terminal conductor 46 extends in the stacking direction of the dielectric layers in the dielectric portion 41 and is electrically connected to the first inner conductor 44. The second terminal conductor 47 extends in the stacking direction of the dielectric layers in the dielectric portion 41 and is electrically connected to the second inner conductor 45.

  FIG. 7B is a plan view showing the first dielectric layer 41A on which the first inner conductor 44 is provided. The first dielectric layer 41A has a first inner conductor 44 and an opening 49A. The first inner conductor 44 extends so as to cover the dielectric layer 41A except for the vicinity of the edge of the dielectric layer 41A, and extends to a position where it is electrically connected to the terminal conductor 46 in a part of the vicinity of the edge of the dielectric layer 41A. Yes. The opening 49A is provided in the vicinity of the position in contact with the terminal conductor 47 at a part near the edge of the dielectric layer 41A, and is formed so as to be separated from the first inner conductor 44.

  FIG. 7C is a plan view showing the second dielectric layer 41B on which the second inner conductor 45 is provided. In the second dielectric layer 41B, a second inner conductor 45 and an opening 49B are formed. The second inner conductor 45 extends so as to cover the dielectric layer 41B except for the vicinity of the edge of the dielectric layer 41B, and extends to a position where it is electrically connected to the terminal conductor 47 at a part of the vicinity of the edge of the dielectric layer 41B. Yes. The opening 49B is provided in the vicinity of the position in contact with the terminal conductor 46 at a part near the edge of the dielectric layer 41B, and is formed so as to be separated from the second inner conductor 45.

  The portion of the first inner conductor 44 that is electrically connected to the terminal conductor 46 and the opening 49B of the second inner conductor 45 are disposed so as to overlap each other, and the terminal conductor is connected to the opening 49B of the second inner conductor 45. As 46 enters, the first inner conductor 44 and the terminal conductor 46 come into surface contact.

  Similarly, the portion of the second inner conductor 45 that is electrically connected to the terminal conductor 47 and the opening 49A of the first inner conductor 44 are disposed so as to overlap each other, and the opening 49A of the first inner conductor 44 is disposed. When the terminal conductor 47 enters, the second inner conductor 45 and the terminal conductor 47 are in surface contact.

The capacitor element 40 has a characteristic that the ESL is lower than that of the configuration described in the first to third embodiments. This is because the current I ₁ flowing between the inner conductor 44 and the terminal conductor 46 and the inner conductor as shown by arrows in FIGS. 7B and 7C when a current flows through the capacitor element 40. by 45 the direction of the current I ₂ flowing between the terminal conductors 47 are opposite, because where the magnetic field by the magnetic field and the current I ₁ by a current I ₁ cancel. The ESL of the capacitor element 40 is lower as the position where the current I ₁ flows, that is, the position where the terminal conductor 46 is provided, and the position where the current I ₂ flows, ie, the position where the terminal conductor 47 is provided, is lower. become. In the case of a conventional winding type capacitor element, it is difficult to arrange a pair of terminal conductors on the same end face or to bring the distance close to each other. However, in the multilayer capacitor element as shown in this embodiment, It is easy to arrange the paired terminal conductors on the same end face or to make the distance closer.

  Here, the planar shape of the original fabric sheet 51 from which the dielectric layer 41A is cut out and the original fabric sheet 52 from which the dielectric layer 41B is cut will be described. FIG. 8A is a plan view of the original fabric sheet 51. FIG. 8B is a plan view of the original fabric sheet 52. In FIG. 8, cut lines CL1 and CL2 from which the capacitor element 40 is cut out are indicated by broken lines. The cut line CL1 and the cut line CL2 are provided perpendicular to each other.

  The opening 49A is brought close to one side of the cut lines CL1 on both sides (the right cut line CL1 in FIG. 8) for each region to be the dielectric portion 41 in the raw sheet 51, and the cut lines on both sides. It is provided in contact with one side (lower side in FIG. 8) of CL2.

  The opening 49B is brought close to the other side of the cut lines CL1 on both sides (the left cut line CL1 in FIG. 8) for each region to be the dielectric portion 41 in the raw sheet 52, and the cut lines on the both sides. It is provided in contact with one side (lower side in FIG. 8) of CL2.

  Further, the first inner conductor 44 is located near the other side of the cut lines CL1 on both sides (the left cut line CL1 in FIG. 8) for each region to be the dielectric portion 41 in the raw fabric sheet 51. Therefore, it is provided so as to be in contact with one side (the lower side in FIG. 8) of the cut lines CL2 on both sides.

  Further, the second inner conductor 45 is located close to one side (cut line CL1 on the right side in FIG. 8) side of the cut lines CL1 on both sides for each region to be the dielectric portion 41 in the raw sheet 52. Therefore, it is provided so as to be in contact with one side (the lower side in FIG. 8) of the cut lines CL2 on both sides.

  Thereby, the internal conductors 44 and 45 and the openings 49A and 49B are formed in a congruent pattern for each region to be the dielectric portion 41.

  Next, a method for manufacturing a capacitor element according to the fifth embodiment of the present invention will be described.

  This embodiment is different from the fourth embodiment in that the pattern of the inner conductor and the opening in the original fabric sheet is line symmetric.

  FIG. 9A is a plan view of the original fabric sheet 51. FIG. 9B is a plan view of the original fabric sheet 52. In FIG. 9, the cut lines CL1 and CL2 from which the capacitor elements are cut out are indicated by broken lines. The cut line CL1 and the cut line CL2 are provided perpendicular to each other.

  The original fabric sheets 61 and 62 include inner conductors 64 and 65 and openings 69A and 69B. The original sheet 61, 62 is a direction along the cut line C1 in one of the two regions (lower side in FIG. 9) separated from the original sheet in the above-described fourth embodiment by the cut line C2. The shape is inverted. Therefore, the openings 69A and 69B extend so as to extend to both regions across the central cut line C2 for each of the two regions arranged along the cut line C1 and separated by the cut line C2 in the original fabric sheets 61 and 62. Is provided. The inner conductors 64 and 65 have a shape in which rectangular portions provided at the center of each of the two regions separated by the cut line C2 are connected by a line-shaped portion extending in parallel with the cut line C2. As described above, the inner conductors 64 and 65 and the openings 69A and 69B may be formed in a line-symmetric pattern with the cut line C2 as the target axis for each region to be a dielectric part.

  FIG. 10A is a schematic diagram of a power conversion device 72 according to the embodiment of the present invention. FIG. 10B is a perspective view of the capacitor module 70 according to the embodiment of the present invention. FIG. 10C is an equivalent circuit diagram of the power conversion device 72 according to the embodiment of the present invention.

  The power conversion device 72 includes a capacitor module 70 and an inverter 71.

  The inverter 71 includes DC connection terminals DC1 and DC2 and AC connection terminals AC1, AC2 and AC3, and converts DC power applied between the DC connection terminals DC1 and DC2 which are power input terminals into three-phase AC power. And output from the AC connection terminals AC1, AC2 and AC3 which are power output terminals. The capacitor module 70 is connected as a shunt to the DC connection terminals DC1 and DC2 of the inverter 71 and is used as a smoothing capacitor.

  The capacitor module 70 includes a plurality of capacitor elements 75 and a case 76. The capacitor element 75 is the same as the capacitor element 40 described above. That is, the capacitor element 75 has a configuration in which two terminal conductors 78 and 79 that are in surface contact with the inner conductor of the dielectric part 77 are provided on the same end face of the dielectric part 77, and has a very low ESR and stable characteristics. doing. The case 76 has a substantially rectangular parallelepiped shape, and is configured such that the plurality of capacitor elements 75 are aligned and housed inside with the terminal conductors 78 and 79 of the plurality of capacitor elements 75 oriented in the same direction. Since this capacitor module 70 has a higher filling efficiency of the capacitor element than a wound film capacitor, it can have a large capacity even if it is small.

  Here, the terminal conductors 78 and 79 of the plurality of capacitor elements 75 are each configured to be externally connected individually. However, two connection terminals are provided, and one terminal conductor 78 of each capacitor element 75 is provided. Alternatively, the other terminal conductors 79 may be connected to each other.

  Since the power conversion device 72 including such a capacitor module 70 and the inverter 71 is a small capacitor capacitor 70 having a large capacity and a low ESR as a smoothing capacitor, a high output density can be obtained even if it is small.

  A power converter may be configured by providing a converter instead of the inverter. Further, instead of the capacitor module 70, a single capacitor element 75 may be directly connected. Further, the capacitor module 70 may be connected to a power output terminal instead of the power input terminal. The capacitor module 70 may be used as an AC filter instead of a smoothing one.

10, 30, 40, 75 ... capacitor elements 11, 31, 41, 77 ... dielectric parts 12A, 12B, 12C, 12D, 41A ... first dielectric layers 13A, 13B, 13C, 41B ... second dielectrics Layers 14B, 14C, 14D, 24B, 24C, 24D, 34B, 34C, 34D, 44, 64 ... first inner conductors 15A, 15B, 15C, 25A, 25B, 25C, 35A, 35B, 35C, 45, 65 ... Second inner conductors 16, 46, 78 ... first terminal conductors 17, 47, 79 ... second terminal conductors 19, 29, 39A, 39B, 49A, 49B, 69A, 69B ... openings 22A, 23A, 22B , 23B, 22C, 23C, 22D, 32A, 33A, 32B, 33B, 32C, 33C, 32D, 51, 52, 61, 62 ... Original sheet 70 ... Capacitor module 71 ... Inverter 72 ... power conversion unit 76 ... Case

Claims (11)

An inner conductor forming step of providing an inner conductor of a predetermined shape on the raw material made of dielectric;
An opening forming step of providing an opening of a predetermined shape in the original fabric;
A multi-layering step of stacking the raw material provided with the inner conductor and the opening over a plurality of layers;
Dielectrics in which a plurality of dielectric layers are overlapped from the original fabric stacked in the multilayering step, the openings are exposed at the edges of the dielectric layers, and the surfaces of the internal conductors are exposed inside the openings. A dielectric part forming step of cutting out the body part;
A terminal conductor forming step of providing a terminal conductor that enters the opening on the end face of the dielectric portion cut out in the dielectric portion forming step;
A method for manufacturing a capacitor element comprising:   The method of manufacturing a capacitor element according to claim 1, wherein the raw fabric is made of a resin film. The raw fabric is a resin film in an uncured state or a semi-cured state mainly composed of a thermosetting material,
After the multi-layering step, the step of thermosetting the resin film,
A method for manufacturing a capacitor element according to claim 2.   The said multilayering process is a manufacturing method of the capacitor | condenser element in any one of Claims 1-3 which piles up the said several raw materials of flat film shape.   The inner conductor and the opening are formed in a line-symmetric pattern with a cut line from which an end face of the dielectric part is cut out in the dielectric part forming step as a target axis, and are provided integrally on both sides of the target axis. The manufacturing method of the capacitor | condenser element in any one of Claims 1-4. A dielectric portion in which a plurality of flat dielectric film-like first dielectric layers and a plurality of second dielectric layers are stacked;
A first inner conductor extending along the first dielectric layer;
A second inner conductor extending along the second dielectric layer and facing the first inner conductor;
A first terminal conductor provided on an end face of the dielectric portion and conducting to the plurality of first inner conductors;
A second terminal conductor provided on an end surface of the dielectric portion and conducting to the plurality of second inner conductors;
With
The second dielectric layer is recessed from the first dielectric layer at a position covered by the first terminal conductor, and the surface of the first inner conductor is exposed;
In the position covered by the second terminal conductor, the first dielectric layer is recessed from the second dielectric layer, and the surface of the second inner conductor is exposed.
Capacitor element.   The capacitor element according to claim 6, wherein the first terminal conductor and the second terminal conductor are provided on the same end face of the dielectric portion.   The capacitor element according to claim 6, wherein the dielectric layer is made of a resin film.   The capacitor element according to claim 8, wherein the resin film is mainly a thermosetting material that is thermoset.   A capacitor module comprising a plurality of capacitor elements according to any one of claims 6 to 9, wherein the plurality of multilayer capacitor elements are electrically connected to each other, and are connected in a generally rectangular parallelepiped shape as a whole. . A capacitor module according to claim 10;
A power conversion unit that includes a power input terminal and a power output terminal, converts power input from the power input terminal and outputs the converted power to the power output terminal, and
The capacitor module is a power converter connected to a power input terminal or a power output terminal of the power converter.

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