JP2007067169A - Metalized film capacitor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a metalized film capacitor capable of obtaining good fuse performance, thereby having good security function with high safety. <P>SOLUTION: In a metalized film capacitor related with the degree of adhesion between a dielectric film 2 and a deposition electrode 3 in a metalized films 1, 1 which adjoins each other, the degree of adhesion in each of fuses 7a, 7b and its proximity is made to be lower than the degree of adhesion of a region K between the first fuse 7a and the second fuse 7b. In each of the fuses 7a, 7b resulting from the lowering of the degree of adhesion, the deposition electrode becomes easy to disperse at dielectric breakdown. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a metallized film capacitor using a metallized film provided with a vapor deposition electrode on a dielectric film and having a fuse portion formed on the vapor deposition electrode.

The structure of the metallized film 1 of the multilayer metallized film capacitor is shown in FIG. As shown in the figure, the metallized film 1 includes a dielectric film 2 and an electrode vapor-deposited film 3 obtained by metal vapor deposition, leaving an edge insulating band 4 at one end in the width direction of the surface of the dielectric film 2. It is composed of The metallized film 1 includes a metal so that the electrode deposition film 3 is divided into a plurality (two in the case of the figure) of electrode regions in a direction (longitudinal direction) perpendicular to the width direction of the metallized film 1. A first margin portion 5 (a portion without metal deposition) extending in the width direction of the chemical film 1 is formed. The first margin portion 5 may be one as shown in the figure, but a plurality of the first margin portions 5 may be formed. In addition, second margin portions 6 and 6 extending discontinuously in the longitudinal direction are formed at the other end portion in the width direction of the metallized film 1, and the gap between the second margin portions 6 and 6 is not formed. The continuous portion is configured to function as the fuse portion 7. At this time, the fuse portions 7 (portions having a smaller current capacity than the other portions) are formed in a plurality of electrode regions (two in the figure) divided by the margin portions 5 and 6, respectively. By configuring so that the short-circuit current at the time of dielectric breakdown can be cut off by the above fuse function, the electrode area of the dielectric breakdown portion can be separated, thereby losing the overall function as a capacitor. (See Patent Document 1).
Japanese Utility Model Publication No. 7-142284

  By the way, since the fuse part 7 is sandwiched between the dielectric films 2 and 2 of the metallized films 1 and 1 laminated in the vertical direction, it is difficult for the deposited electrode to scatter. As a result, the fuse portion 7 does not operate, and there is a problem that the safety operation cannot function sufficiently.

  The present invention has been made in order to solve the above-mentioned conventional drawbacks, and its object is to obtain a good fuse operation, and therefore a metallized film capacitor having a good safety function and high safety. Is to provide.

  Therefore, the metallized film capacitor of the present invention has a vapor deposition electrode 3 that is opposed to the dielectric film 2, metallized electrodes 11 and 12 are formed on the end face, and the vapor deposition electrode 3 is divided into a plurality of small electrodes. And a metallized film capacitor in which a first fuse portion 7a along one metallicon electrode 11 and a second fuse portion 7b along the other metallicon electrode 12 are formed. 1, the degree of adhesion between the fuse portions 7 a and 7 b and the vicinity thereof is determined in the region K between the first fuse portion 7 a and the second fuse portion 7 b. It is characterized by lower than the degree of adhesion.

  Further, in this metallized film capacitor, the region K between the first fuse portion 7a and the second fuse portion 7b is narrower than the distance between the first fuse portion 7a and the second fuse portion 7b. It is characterized in that the dielectric film 2 and the layer of the vapor deposition electrode 3 between the first fuse portion 7a and the second fuse portion 7b are brought into close contact with each other with a sheet 10 having a width.

  Further, in this metallized film capacitor, the region K between the first fuse portion 7a and the second fuse portion 7b is narrower than the distance between the first fuse portion 7a and the second fuse portion 7b. It is characterized in that the dielectric film 2 and the layer of the vapor deposition electrode 3 between the first fuse portion 7a and the second fuse portion 7b are brought into close contact with each other by pressing with a pressing plate 20 having a width.

  Further, the metallized film capacitor of the present invention is a metallized film capacitor having a vapor deposition electrode 3 opposed via a dielectric film 2 and having metallicon electrodes 11 and 12 formed on the end faces. The other dielectric film 2 which is divided into a plurality of small electrodes and has a fuse portion 7 formed along the metallicon electrodes 11 and 12 and overlaps the vapor deposition electrode 3 of one dielectric film 2 The film 2 is characterized by having a hole 30 or a recess in a region overlapping the fuse portion 7 of the film 2.

  According to the metallized film capacitor of the present invention, regarding the degree of adhesion between the dielectric film 2 and the vapor deposition electrode 3 in the adjacent metallized films 1 and 1, the degree of adhesion of the fuse portions 7a and 7b and the vicinity thereof is Since the degree of adhesion of the region K between the first fuse portion 7a and the second fuse portion 7b is lowered, the deposited electrodes are likely to be scattered at the time of dielectric breakdown in each fuse portion 7a, 7b. It is possible to suppress the occurrence of a problem that the fuse portions 7a and 7b do not operate due to a short-circuit current at the time of dielectric breakdown and the safety operation cannot sufficiently function. Therefore, a good fuse operation can be obtained, and a highly safe metallized film capacitor having a good safety function can be provided.

  Further, by sandwiching the region K between the first fuse portion 7a and the second fuse portion 7b with the sheet 10 or pressing with the pressing plate 20, the first fuse portion 7a If the layer of the dielectric film 2 and the vapor deposition electrode 3 between the 2nd fuse part 7b is closely_contact | adhered, the implementation can be made easy and the effect of a security function improvement is acquired similarly to the above.

  Further, in the other dielectric film 2, even if a hole 30 or a recess is provided in a region overlapping with the fuse portion 7 of one dielectric film 2, the fuse portion 7 and the vicinity thereof are pressed from the other dielectric film 2. Therefore, it is possible to obtain a metallized film capacitor having a good safety function and a high safety, because the deposited electrode is easily scattered at the time of dielectric breakdown, and a good fuse operation can be obtained. Can do. Moreover, the implementation can be facilitated.

  Next, specific embodiments of the metallized film capacitor of the present invention will be described in detail with reference to the drawings. 1 and 2 show a first embodiment of the metallized film capacitor of the present invention. The metallized film 1 used in this embodiment is the same as that shown in FIG. That is, the width of the metallized film 1 shown in FIG. 6 is changed as shown in FIG. 5 by reversing the left and right sides (in FIG. 6) by the required number, that is, by alternately reversing the edge insulating bands 4. A laminate is formed by laminating while slightly shifting in the direction. In this case, the first margin portions 5 and 5 are preferably arranged so as to overlap in the vertical direction, but the arrangement is not limited to this. Further, the second margin portions 6 and 6 and the fuse portions 7 and 7 are arranged so as to overlap the respective edge insulating bands 4 of the other metallized film 1. Then, as will be described below, in a state where the laminate is sandwiched between a pair of sheets 10 and 10 from above and below, metallicon electrodes 11 and 12 are formed on each edge insulating band 4 side to form a laminated metallization. A film capacitor is constructed. For convenience, the fuse portion 7 along one metallicon electrode 11 is referred to as a first fuse portion 7a, and the fuse 7 along the other metallicon electrode 12 is referred to as a second fuse portion 7b.

  Then, in the state where the required number of metallized films 1 and 1 are laminated as described above, a region K (specifically, each edge) between the first fuse portion 7a and the second fuse portion 7b. Capacitance contribution regions, which are stacked on each other except for the insulating band 4, are sandwiched between a pair of upper and lower insulating sheets 10 having a width narrower than the distance between the first fuse portion 7a and the second fuse portion 7b. Specifically, pressing is performed with the laminate sandwiched between sheets, or heat aging is performed to embed the sheet in the laminate. Thereafter, metallicon electrodes 11 and 12 are formed. In addition, for example, a plastic film such as PET or PP is used for the dielectric film 2 in this embodiment, and the metal deposited on the dielectric film 1 is aluminum, zinc, or a mixed metal thereof. Is used.

  In the metallized film capacitor, regarding the degree of adhesion between the dielectric film 2 and the vapor deposition electrode 3 in the metallized films 1 and 1 adjacent to each other in the vertical direction (stacking direction), the fuse parts 7a and 7b and the adhesion in the vicinity thereof. The degree is lower than the adhesion degree of the region K between the first fuse part 7a and the second fuse part 7b. As a result, in each fuse part 7a, 7b, it becomes easy to disperse a vapor deposition electrode at the time of dielectric breakdown, fuse part 7a, 7b does not operate | move by the short circuit current at the time of dielectric breakdown, and it cannot say that safety | security operation cannot fully function. The occurrence of defects can be suppressed. Therefore, a good fuse operation can be obtained, and a highly safe metallized film capacitor having a good safety function can be provided. Moreover, its implementation is easy.

  FIG. 3 shows a second embodiment. This is because, in the stacked state as described above, the region K between the first fuse portion 7a and the second fuse portion 7b is made larger than the interval between the first fuse portion 7a and the second fuse portion 7b. The dielectric film 2 and the vapor deposition electrode 3 between the first fuse portion 7a and the second fuse portion 7b are brought into close contact with each other by pressing with a narrow pressing plate 20. That is, a pair of pressing plates 20 and 20 are arranged on the upper and lower sides of the laminate, and are pressed by the press main bodies P and P from the upper and lower sides. In addition, you may comprise the press plates 20 and 20 as a thing integrated with a press main body. Thereafter, metallicon electrodes 11 and 12 are formed on both sides of the laminate.

  FIG. 4 shows a third embodiment. In the other dielectric film 2 that overlaps the vapor deposition electrode 3 of one dielectric film 2, a hole 30 is provided in a region that overlaps the fuse portions 7 a and 7 b of the one dielectric film 2. That is, in the fuse parts 7a and 7b, the pressing action of the fuse parts 7a and 7b by the other dielectric film 2 is removed by providing the hole 30 in the other dielectric film 2 overlapping the part. Instead of forming the hole 30, a recess may be formed in that portion.

  According to the metallized film capacitor of each of the above embodiments, as in the first embodiment, the implementation can be facilitated, and the effect of improving the security function can be obtained.

  Although the specific embodiment of the metallized film capacitor of the present invention has been described above, the present invention is not limited to the above embodiment, and various modifications can be made within the scope of the present invention. Is possible. That is, in the said embodiment, although the laminated type metallized film capacitor was shown, it can implement similarly to the above also in the metallized film capacitor which has a winding type flat capacitor element.

It is a schematic sectional drawing of the metallized film capacitor which is 1st Embodiment of this invention. It is a plane large figure which shows the lamination | stacking state of the metallized film in the said embodiment. It is a schematic front view which shows the manufacturing process of the metallized film capacitor of 2nd Embodiment. It is a plane large figure showing the lamination state of the metallized film in the metallized film capacitor of a 3rd embodiment. It is a schematic plan view which shows the lamination | stacking state of the metallized film in each said embodiment. It is a schematic plan view which shows the metallized film in each said embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Metallized film 2 Dielectric film 3 Evaporation electrode 7a 1st fuse part 7b 2nd fuse part 10 Sheet | seat 11 Metallicon electrode 12 Metallicon electrode 20 Pressing plate 30 Hole

Claims (4)

  It has a vapor deposition electrode (3) that is opposed via a dielectric film (2), metallized electrodes (11) and (12) are formed on the end face, and the vapor deposition electrode (3) is divided into a plurality of small electrodes. A metallized film capacitor in which a first fuse part (7a) along one metallicon electrode (11) and a second fuse part (7b) along the other metallicon electrode (12) are formed. Regarding the degree of adhesion between the dielectric film (2) and the vapor deposition electrode (3) in the adjacent metallized film (1, 1), the degree of adhesion between the fuse portions (7a) and (7b) and the vicinity thereof is designated as the first fuse. A metallized film capacitor characterized in that it is lower than the adhesion degree of the region (K) between the portion (7a) and the second fuse portion (7b).   The region (K) between the first fuse portion (7a) and the second fuse portion (7b) is made larger than the distance between the first fuse portion (7a) and the second fuse portion (7b). The dielectric film (2) between the first fuse part (7a) and the second fuse part (7b) and the layer of the vapor deposition electrode (3) were brought into close contact with each other with the narrow sheet (10) sandwiched between them. The metallized film capacitor according to claim 1.   The region (K) between the first fuse portion (7a) and the second fuse portion (7b) is made larger than the distance between the first fuse portion (7a) and the second fuse portion (7b). Pressing with a narrow-width pressing plate (20), the layers of the dielectric film (2) and the vapor deposition electrode (3) between the first fuse part (7a) and the second fuse part (7b) are brought into close contact with each other. The metallized film capacitor according to claim 1.   A metallized film capacitor having a vapor deposition electrode (3) opposed via a dielectric film (2) and having a metallicon electrode (11) (12) formed on an end face, wherein the vapor deposition electrode (3) includes a plurality of vapor deposition electrodes (3). The other dielectric film is divided into small electrodes and has a fuse part (7) formed along the metallicon electrodes (11) and (12), and overlaps the vapor deposition electrode (3) of the one dielectric film (2). (2) is a metallized film capacitor having a hole (30) or a recess in a region overlapping with the fuse portion (7) of one of the dielectric films (2).