JPWO2014178132A1 - Film capacitor, film capacitor element, aging apparatus for film capacitor element, and aging method - Google Patents

Abstract

Provided is an apparatus and a method capable of performing a heat aging process on a film capacitor element in a shorter time and more reliably. A diaphragm 62 is provided in the accommodating chamber 46, and a vacuum chamber 66 and a pressurized air chamber 68 for accommodating the film capacitor element 10 are formed on both sides of the diaphragm 62, and the diaphragm 62 side of the film capacitor element 10 is further formed. In addition, a restricting means 70 for restricting the displacement of the vacuum chamber 66 is provided, while the vacuum chamber 66 is evacuated and compressed air is supplied to the compressed air chamber 68 to displace the diaphragm 62 to the vacuum chamber 66 side. Compressed air supply means 84 and 88 are provided, and further, deformation prevention for preventing bending deformation of a gap forming portion of the film capacitor element 10 between the film capacitor element 10 and the diaphragm 62 accommodated in the vacuum chamber 66. The means 90 is arranged to be displaceable.

Description

  The present invention relates to a film capacitor, a film capacitor element, an aging apparatus and an aging method for a film capacitor element, and a manufacturing apparatus and a manufacturing method for a film capacitor element. The present invention relates to a film capacitor element to be configured, an aging apparatus and an aging method of a film capacitor element capable of advantageously performing a heat aging treatment on the film capacitor element, and an apparatus and method capable of advantageously manufacturing a film capacitor element.

  Conventionally, as a film capacitor used in an electronic device, there are a laminated type and a wound type. For example, as disclosed in Japanese Patent Publication No. 5-63094 (Patent Document 1), Japanese Patent Publication No. 8-24096 (Patent Document 2), etc., both of these laminated type and wound type film capacitors are used. , Manufactured using one or more of the metallized films. As is well known, the metallized film is configured as a laminate in which a metal vapor deposition film is laminated on at least one surface of a resin film as a dielectric film.

  That is, in a laminated type film capacitor, for example, after laminating a plurality of metallized films so that resin films and metal vapor deposition films are alternately positioned to obtain an element constituent unit, the element constituent unit is laminated. By further laminating a protective film on both sides (lamination direction of the metallized film), the protective film is arranged so as to cover the surface in the laminating direction of the element constituent unit to produce a film capacitor element, and then It is manufactured by forming metallicon electrodes on two side surfaces corresponding to each other in the direction orthogonal to the stacking direction of the element constituent units in the film capacitor element. In addition, a winding type film capacitor is obtained by, for example, winding an elemental unit formed by laminating the metallized film and the resin film capacitor by winding the metallized film and the resin film. Thereafter, the film is formed so as to cover the surface of the element constituent unit in the stacking direction to produce a film capacitor element, and thereafter, metallicon electrodes are formed on two side surfaces of the film capacitor element.

  Further, in recent years, in order to meet the demand for a reduction in size and capacity of a film capacitor, for example, as disclosed in Japanese Patent Application Laid-Open No. 2011-181885 (Patent Document 3), a dielectric of a film capacitor element is used. It has also been proposed to use a vapor-deposited polymer film that can be formed with a nano-order film thickness.

  By the way, it was constructed using a laminate having a structure in which dielectric films made of resin films, vapor-deposited polymer films, etc. and metal vapor-deposited films were alternately laminated, and obtained by laminating or winding the laminate. In the case of a film capacitor element in which a protective film is packaged on the element constituent unit, between the laminated surfaces of the dielectric film and the metal vapor-deposited film layer, between the laminated surfaces of the laminated bodies laminated together, or the laminated body and the protection If moisture is present between the laminated surfaces of the film, non-conductive substances are generated by the reaction of such moisture with the constituent metal of the metal deposition film, thereby reducing the electrode area and the series equivalent resistance. As a result, there is a possibility that a problem such as a decrease in electrostatic capacity or a decrease in withstand voltage due to a decrease in insulation resistance may occur. Further, if air exists between the laminated surfaces of the dielectric film and the metal vapor deposited film layer or between the laminated surfaces of the laminated bodies laminated together, there is a possibility that a short circuit due to discharge may occur. Furthermore, in the film capacitor element, if the internal stress generated during the production of the film capacitor element remains in the dielectric film or the metal vapor deposition film, between the dielectric film and the metal vapor deposition film, or between the laminated bodies laminated with each other, There is a possibility that problems such as a marked decrease in the adhesion between the laminate and the protective film may occur.

  Therefore, when manufacturing a film capacitor using the film capacitor element having the structure as described above, generally, the film capacitor element before the metallicon electrode is formed is subjected to a heat aging treatment, whereby a film capacitor element is formed. Moisture, air, and residual stress are removed from the capacitor element.

  This thermal aging treatment is usually performed using a pressurizing apparatus and a heating furnace that pressurize the film capacitor element, as disclosed in, for example, Japanese Patent Application Laid-Open No. 2012-60032 (Patent Document 4). . The pressurizing apparatus has an apparatus main body composed of an upper plate and a lower plate arranged to face each other at a predetermined distance, and a plurality of connecting rods that connect the outer peripheral portions of the upper plate and the lower plate to each other. Yes. And between the opposing surfaces of the upper plate and the lower plate of the apparatus main body, a plurality of pressure plates are opposed to the upper plate and the lower plate in a state where the pressure plates are inserted into the plurality of connecting rods in the outer peripheral portion, and Displaceable in the direction. In addition, one or a plurality of tightening bolts are screwed into the upper plate of the apparatus main body, and the tip of the tightening bolt is fixed to the pressure plate positioned at the top of the plurality of pressure plates. Yes.

  And when performing the heat aging process with respect to a film capacitor element using such a pressurization apparatus, first, several film capacitor elements are laminated | stacked by the lamination direction of a dielectric film and a metal vapor deposition film | membrane of several pressurization plates. In a direction that coincides with the facing direction, the pressure plate is disposed between a plurality of pressure plates or between a pressure plate and a lower plate. Then, by tightening the tightening bolts, several film capacitor elements are attached to the pressure device in a state where they are pressurized with a plurality of pressure plates and lower plates. Thereafter, the film capacitor element attached to the pressurizing apparatus is put into a heating furnace together with the pressurizing apparatus and heated. Thus, the pressure between the dielectric film and the metal vapor deposition film is increased by heating in the heating furnace while improving the adhesion between the laminated bodies or between the laminated body and the protective film by pressurizing the film capacitor element. Moisture and air are removed between the laminated surfaces, between the laminated surfaces of the laminated bodies laminated with each other, or between the laminated surfaces of the laminated body and the protective film, and the residual stress of the dielectric film and the metal deposition film is removed. .

  However, the conventional thermal aging treatment using such a pressure device and a heating furnace has many problems as follows.

  That is, in the conventional heat aging treatment, the laminates laminated with each other or the laminate and the protective film are firmly pressed against each other by pressurizing the film capacitor element with a pressurizing device. For this reason, air is trapped between the laminated surfaces of the dielectric film and the metal vapor deposition film, between the laminated surfaces of the laminated bodies laminated with each other, or between the laminated surfaces of the laminated body and the protective film. There was a risk that it would be difficult to completely remove the air between the surfaces.

  As such, there is an air layer (air reservoir) between the laminated surfaces of the dielectric film and the metal vapor deposited film, between the laminated surfaces of the laminated bodies laminated with each other, or between the laminated surfaces of the laminated body and the protective film. If heat aging treatment is performed by firmly pressing the laminated bodies laminated together or the laminated body and the protective film and heating them, heat is hardly transmitted to the inside of the film capacitor element by the air layer. Therefore, the conventional heat aging treatment completely removes moisture existing between the laminated surfaces of the dielectric film and the metal vapor deposited film, between the laminated surfaces of the laminated bodies laminated between each other, or between the laminated surfaces of the laminated body and the protective film. In order to sufficiently remove the residual stress of the dielectric film and the metal deposited film, it is usually necessary to take an extremely long time of 10 hours or more.

  In addition, since the film capacitor element is pressurized by the tightening force of the tightening bolt of the pressurizing device, it cannot be said that the pressure balance between the pressure plate and the lower plate that pressurizes the film capacitor element is good. It was difficult to apply a load evenly over the entire pressed surface of the element. Therefore, the adhesion between the laminated surfaces of the dielectric film and the metal vapor deposited film, between the laminated surfaces of the adjacent laminated bodies, and between the laminated surfaces of the laminated body and the protective film is uniform over the entire laminated surface. It was difficult to increase it.

  In addition, the conventional heat aging treatment requires at least two devices, a pressurizing device and a heating furnace, and the heating furnace is large enough to allow several film capacitor elements to be charged together with the pressurizing device. Therefore, it is inevitable that the apparatus used for the heat aging process is expensive and large.

  Under such circumstances, Japanese Patent Application Laid-Open No. 2008-272899 (Patent Document 5) describes a method of laminating a base material layer having a conductive pattern formed on a surface thereof and an insulating film when the circuit board is manufactured. The resulting laminating device has been clarified.

  The laminating apparatus has a storage chamber composed of an upper member and a lower member, and the storage chamber can be opened and closed by a separation or approaching movement of the upper member and the lower member. And a laminated body of insulating films can be accommodated inside. Further, a vacuum pump is connected to the upper member of the accommodation chamber, and a compressor for supplying compressed air is connected to the lower member. Further, in the storage chamber, an upper heating plate and a lower heating plate for heating the laminated body housed in the inside are arranged to face each other in the vertical direction, and a diaphragm is formed on the lower heating plate. It is arranged.

  In order to bring the base material layer and the insulating film into close contact with each other using such a laminating apparatus, first, in a state where the laminate of the base material layer and the insulating film is accommodated and disposed in the vacuum chamber of the accommodating chamber. The laminate is heated by the upper and lower heating plates, and the vacuum chamber is evacuated by a vacuum pump. On the other hand, the compressed air supplied from the compressor into the compressed air chamber elastically deforms the diaphragm and pressurizes the lower surface of the laminated body, whereby the laminated body is made up of the elastically deformed diaphragm and the upper heating plate. The pressure is sandwiched in the vertical direction.

  Japanese Patent Application Laid-Open No. 2008-272899 discloses that a base material layer and an insulating film can be advantageously brought into close contact with each other by using a laminating apparatus having such a structure. It is described that it is possible to suppress the occurrence of air pockets between the two.

  Therefore, by using the base material layer and insulating film laminating device used in the manufacture of such a circuit board as an aging device for a film capacitor element, problems relating to the removal of air from the film capacitor element, dielectric It is conceivable to solve problems related to adhesion between the laminated surfaces of the body film and the metal vapor-deposited film, between the laminated surfaces of the adjacent laminated bodies, and between the laminated surfaces of the laminated body and the protective film.

  However, since the film capacitor element has a structure that is not provided on the circuit board, the conventional laminating apparatus cannot be used as it is as an aging apparatus for the film capacitor element.

  That is, in general, in a film capacitor element, by laminating a plurality of laminated bodies so as to be staggered in the width direction, or by winding in such a laminated state, both side surfaces of the film capacitor element In addition, a gap that allows the metallicon electrode to enter is provided in the lateral direction, and a portion of the metallicon electrode penetrates into the gap through the side opening, so that Although it is surely connected to the end in the width direction of the metal vapor deposited film of the laminated film, such a gap does not exist at all in the substrate circuit. Therefore, when such a substrate circuit base material layer and insulating film laminating apparatus is used as it is for an aging apparatus for a film capacitor element, the film capacitor element is sandwiched between the elastically deformed diaphragm and the regulating member. The gap provided on both side surfaces of the film capacitor element may be crushed. And if it becomes so, it will become impossible for a part of metallicon electrode to penetrate | invade in the clearance gap provided in the both sides | surfaces of a film capacitor element. As a result, the electrical connection of the capacitor becomes unstable, and the capacitor performance may deteriorate.

  In addition, such crushing of the gap when the film capacitor element is pinched reduces the size of the gap, specifically, the length of the gap in the opposing direction of both side surfaces where the gap is provided as much as possible. It is thought that it is suppressed to some extent. However, if the length of the gap is too short, the amount of penetration of the metallicon electrode that penetrates into the gap becomes too small, and as a result, the metal vapor deposition film of each stacked body exposed in the gap and the metallicon electrode The connection may become unstable and the capacitor performance may be reduced.

Japanese Patent Publication No. 5-63094 Japanese Patent Publication No. 8-24096 JP 2011-181885 A JP 2012-60032 A JP 2008-272899 A

  Here, the present invention has been made in the background of the above-described circumstances, and the problem to be solved is to provide the film capacitor element on two side surfaces without increasing the size of the film capacitor element. The air and moisture can be removed from the film capacitor element in a short time and reliably without crushing the gap that allows the metallicon electrode to enter, and between the laminated surfaces of the dielectric film and the metal deposition film, A compact and low-cost film capacitor element capable of uniformly increasing the adhesion between the laminated surfaces of the laminated bodies laminated together and between the laminated surfaces of the laminated body and the protective film over the entire surface of each laminated surface. It is to provide an aging device. Further, the present invention does not increase the size of the film capacitor element, and air or moisture from the film capacitor element is formed in each of the two side surfaces of the film capacitor element without crushing the gap that allows the metallicon electrode to enter. Can be removed in a short time, and the adhesion between the laminated surfaces of the dielectric film and the metal vapor deposited film, between the laminated surfaces of the laminated bodies laminated together, and between the laminated surfaces of the laminated body and the protective film It is also an object of the present invention to provide a method for aging a film capacitor element that can uniformly increase the thickness of each laminated surface. Furthermore, the present invention provides a film capacitor and a film capacitor element in which an electrical connection between the metal vapor deposition film of the laminated body exposed in the gap provided on the two side surfaces and the metallicon electrode can be stably secured. Is also a solution issue. Furthermore, another object of the present invention is to provide an apparatus and a method that can advantageously manufacture such a film capacitor element.

  In order to solve the above-described problem, the present invention provides (a) a laminate having a structure in which at least one dielectric film and at least one metal vapor deposition film are alternately laminated, and the laminate. A film capacitor element having a protective film arranged so as to cover the surface in the laminating direction, (b) two metallicon electrodes formed on corresponding side surfaces in a direction orthogonal to the laminating direction of the laminate, and (c) ) A metal deposition of the metallicon electrode and the laminated body is formed such that a part of the metallicon electrode penetrates into a gap provided to open outward in each of the two side surfaces of the laminated body. In the film capacitor configured to have a connection portion that connects the membrane, the length of the connection portion in the corresponding direction of the two side surfaces of the laminate is in the range of 0.1 to 5 mm The film capacitor, characterized in that there is a value, is to its gist.

  Further, the present invention provides a laminate having a structure in which at least one dielectric film and at least one metal vapor deposition film are alternately laminated, and a protective film disposed so as to cover the surface in the lamination direction of the laminate. And a gap that allows an intrusion of a part of the metallicon electrode in the direction perpendicular to the stacking direction of the laminate in which the metallicon electrode is to be formed, In the film capacitor elements respectively provided at the end portions of the laminated body where the side surfaces are located, the length of the gap in the corresponding direction of the two side surfaces of the laminated body is in the range of 0.1 to 5 mm. The gist of the present invention is also a film capacitor element.

  The present invention also includes a laminate having a structure in which at least one dielectric film and at least one metal vapor deposition film are alternately laminated, and a protective film disposed so as to cover the surface in the lamination direction of the laminate. And a gap that allows an intrusion of a part of the metallicon electrode in the direction perpendicular to the stacking direction of the laminate in which the metallicon electrode is to be formed, A film capacitor element aging device for performing a thermal aging process on a film capacitor element provided at each end of the laminated body positioned on a side surface, wherein (a) a container for accommodating the film capacitor element A chamber; (b) heating means for heating the film capacitor element housed in the housing chamber; and (c) before being housed in the housing chamber. In the lamination direction of the dielectric film and the metal vapor deposition film in the laminate constituting the film capacitor element, the accommodation chamber is divided into two fluid-tightly, and the film capacitor element is accommodated in the accommodation chamber. And a diaphragm defining a vacuum chamber in which the film capacitor element is not accommodated, and (d) a surface of the film capacitor element accommodated in the accommodating chamber that is in contact with the surface opposite to the diaphragm side A restricting means for restricting the displacement of the film capacitor element in the accommodating chamber to the opposite side of the diaphragm; and (e) discharging the air in the vacuum chamber of the accommodating chamber to (F) supplying compressed air to the compressed air chamber of the housing chamber, and the compressed air A compressed air supply means for displacing the diaphragm toward the vacuum chamber side to pressurize the diaphragm side surface of the film capacitor element housed in the housing chamber; and (g) the vacuum in the housing chamber. When the diaphragm-side surface of the film capacitor element in the vacuum chamber is pressurized by the diaphragm displaced by the compressed air, the film capacitor element is placed between the film capacitor element and the diaphragm. A film capacitor element aging device comprising a deformation preventing means for preventing bending deformation of the gap forming portion of the laminate constituting the film capacitor element, interposed between the aging device and the gist of the film capacitor element. It is what.

  According to one of the preferred embodiments of the present invention, the deformation preventing means is disposed displaceably between the film capacitor element housed in the vacuum chamber of the housing chamber and the diaphragm, and the film When the diaphragm side surface of the capacitor element is pressurized by the diaphragm, it contacts the diaphragm side surface of the film capacitor element and clamps the film capacitor element with the regulating means. Consists of a clamping plate.

  Further, according to one of the desirable embodiments of the present invention, although the clamping plate is elastically deformed following the elastic deformation of the diaphragm by the compressed air, the amount of elastic deformation at that time is the elasticity of the diaphragm. It has elasticity that is smaller than the amount of deformation.

  Furthermore, according to one of the advantageous aspects of the present invention, the pressing plate has an extending portion extending outward from each of two side surfaces of the laminate constituting the film capacitor element, The extending portion is configured to prevent bending deformation due to the applied pressure of the diaphragm at the gap forming portion of the laminated body.

  Furthermore, according to one of the preferred embodiments of the present invention, the deformation preventing means includes an end of the film capacitor element including the gap forming portion of the laminate between the film capacitor element and the diaphragm. It is arrange | positioned only between a part and this diaphragm.

  According to another desirable aspect of the present invention, the contact portion including the contact surface with the film capacitor element in the regulating means allows distortion generated in the film capacitor element due to the pressure applied by the diaphragm. It is comprised with the elastic body elastically deformed.

  In order to solve the above-described problems, the present invention provides a laminate having a structure in which at least one dielectric film and at least one metal vapor deposition film are alternately laminated, and the surface of the laminate in the stacking direction. And a protective film arranged to cover the metallicon electrode, and the metallicon electrode is opened to two side surfaces corresponding to each other in a direction orthogonal to the stacking direction of the laminate, and a part of the metallicon electrode is intruded. Is a film capacitor element aging method for performing a thermal aging process on the film capacitor elements respectively provided at the end portions of the laminated body where the two side surfaces are positioned, ) Housing the film capacitor element in a housing chamber; and (b) the dielectric film and the front of the film capacitor element housed in the housing chamber. By bringing the surface on one side in the stacking direction with the metal vapor deposition film into contact with a regulating member arranged in a fixed position in the housing chamber, the film capacitor element is placed on the one side in the stacking direction in the housing chamber. And (c) a first step of evacuating the atmosphere in the housing chamber to make a vacuum while heating the film capacitor element housed in the housing chamber. A thermal aging treatment step; and (d) displacing a diaphragm disposed in the storage chamber with compressed air supplied into the storage chamber, thereby bringing the diaphragm into contact with the regulating member in the storage chamber. The other surface of the film capacitor element accommodated in the stacking direction is pressurized with the diaphragm, and between the diaphragm and the film capacitor element. A second heat aging treatment step of heating while preventing the bending deformation of the laminate by interposing a deformation preventing means for preventing the bending deformation due to the applied pressure of the diaphragm at the gap forming portion of the laminate. The aging method of the film capacitor element characterized by including also makes the summary.

  In order to solve the above-described problems, the present invention provides a laminate having a structure in which at least one dielectric film and at least one metal vapor deposition film are alternately laminated, and a surface of the laminate in the stacking direction. And a protective film arranged to cover the metallicon electrode, and the metallicon electrode is opened to two side surfaces corresponding to each other in a direction orthogonal to the stacking direction of the laminate, and a part of the metallicon electrode is intruded Is a device for manufacturing a film capacitor element provided at each end of the laminated body where the two side surfaces are positioned, and (a) a long piece constituting a part of the protective film First supply means for continuously supplying the first belt-like body and continuously running in the longitudinal direction thereof; and (b) a plurality of the laminated bodies are laminated to each other or the laminated bodies are laminated by winding. Being configured A plurality of element constituent units are stacked such that one surface in the stacking direction of the element constituent units is overlaid on the first strip, and spaced apart from each other in the running direction of the first strip. And (c) a long second strip that constitutes the remaining portion of the protective film is continuously supplied so that the first strip is placed. By arranging the plurality of element constituent units on the plurality of element constituent units placed thereon, as a superposed product sandwiched between the first strip and the second strip, A second supply means for conveying the belt-like body in the traveling direction; and (d) in the middle of conveying the polymerized product conveyed by the second supply means, The thermal aging process is performed on the An aging device having characteristics, and (e) the element constituting unit of the polymerized product that is disposed downstream of the aging device in the transport direction of the polymerized product and is subjected to heat aging treatment in the aging device. A film comprising cutting means for cutting the first band and the second band located between adjacent ones and separating them as individual film capacitor elements. An apparatus for manufacturing a capacitor element is also the gist thereof.

  In order to solve the above-described problems, the present invention provides a laminate having a structure in which at least one dielectric film and at least one metal vapor deposition film are alternately laminated, and a surface of the laminate in the stacking direction. And a protective film arranged to cover the metallicon electrode, and the metallicon electrode is opened to two side surfaces corresponding to each other in a direction orthogonal to the stacking direction of the laminate, and a part of the metallicon electrode is intruded. Is a method of manufacturing a film capacitor element provided at each end of the laminated body where the two side surfaces are positioned, and (a) a long length constituting a part of the protective film A step of continuously supplying the first belt-like body and continuously running in the longitudinal direction thereof; and (b) a plurality of the laminated bodies are laminated to each other, or the laminated bodies are laminated by winding. Device made A plurality of forming units are arranged at a predetermined distance from each other in the running direction of the first strip so that one surface in the stacking direction of the element constituent units is overlaid on the first strip. A step of sequentially placing the first belt-like body on the first belt-like body, and (c) continuously supplying a long second belt-like body constituting the remaining portion of the protective film, By disposing on the plurality of element constituting units placed on the first belt-like body, a plurality of the element constituting units are sandwiched between the first belt-like body and the second belt-like body. A process of transporting these strips in the running direction as a combined product, and (d) a thermal aging treatment for the site of the element constituent unit in the polymerized product in the course of transporting the polymerized product. Implement by the method you have And (e) cutting the first strip and the second strip located between adjacent ones of the element constituent units of the superposed product subjected to the thermal aging treatment, A gist of a method for producing a film capacitor element, comprising a step of separating the film capacitor elements as individual film capacitor elements.

  That is, in the film capacitor according to the present invention, a part of the metallicon electrode penetrates into the gap provided on the two side surfaces corresponding to the direction perpendicular to the laminating direction of the laminate constituting the film capacitor element. The connected portion has a specific length along the directions corresponding to each other of the two side surfaces. Thereby, the electrical connection between the metal vapor deposition film of each laminate exposed in the gap and the metallicon electrode can be secured stably, and the enlargement of the entire film capacitor by forming the gap is advantageous. It can be prevented.

  Further, in the film capacitor element according to the present invention, the length of the gap provided on the two side surfaces and allowing the metallicon electrode to enter is a value within a specific range. Thereby, the electrical connection between the metal vapor deposition film of each laminated body exposed in the gap and the metallicon electrode can be stably ensured, and the enlargement of the entire film capacitor element due to the formation of the gap can be achieved. It can be advantageously prevented.

  In the aging device according to the present invention, the diaphragm is elastically deformed (displaced) in a dome shape with compressed air in the vacuum chamber in a vacuum state. Therefore, when the diaphragm is elastically deformed, the diaphragm and the regulating member The center portion of the film capacitor element is sandwiched between the two. Next, the film capacitor element portion sandwiched between the diaphragm and the regulating member gradually spreads from the center portion of the film capacitor element toward the outer peripheral portion, and accordingly, the dielectric film in the film capacitor element From the center of the film capacitor element to the outer periphery, between the laminated surfaces of the metal vapor deposition film and between the laminated surfaces of the laminated bodies laminated together, or between the laminated surfaces of the laminated body and the protective film While moving, it can be sucked out with the air in the vacuum chamber. Moreover, in addition to the air being reliably removed from the film capacitor element as described above, when the film capacitor element is clamped between the elastically deformed diaphragm and the regulating means, the film capacitor element Extremely high pressure is not applied. For this reason, the heat generated by heating can be sufficiently transferred to the inside of the film capacitor element, whereby the moisture in the film capacitor element can be efficiently evaporated and the residual stress of the film capacitor element can be efficiently removed. be able to. Therefore, it is possible to reliably remove air and moisture from the film capacitor element and remove the residual stress of the film capacitor element in a short time. In addition, the adhesion between the laminated surfaces of the dielectric film and the metal vapor deposition film, between the laminated surfaces of the laminated bodies laminated together, and between the laminated surfaces of the laminated body and the protective film is uniform over the entire surface of each laminated surface. In addition, such an effect can be obtained in a short time.

  The aging apparatus according to the present invention is a conventional aging apparatus, that is, a pressurizing apparatus to which several film capacitor elements are attached, and a large-scale heating in which the several film capacitor elements are put together with the pressurizing apparatus. Unlike a conventional apparatus equipped with a furnace, since it does not have at least a large-sized heating furnace, it can be advantageously downsized as compared with a conventional aging apparatus, and cost reduction can be effectively achieved. Can be.

  Further, in the aging device according to the present invention, when the film capacitor element is clamped between the elastically deformed diaphragm and the regulating means, the lamination provided at the two ends of the film capacitor element by the deformation preventing means Bending deformation of the body gap formation site is prevented. As a result, the gap that is provided at each of the pair of end portions of the film capacitor element and allows the metallicon electrode to enter is crushed when the film capacitor element is pinched between the elastically deformed diaphragm and the regulating means. This can be effectively suppressed or eliminated.

  Therefore, when the film capacitor element aging apparatus according to the present invention is used, the film capacitor element can be increased in capacitance, reduced in series equivalent resistance, and withstand voltage by performing thermal aging treatment on the film capacitor element. Improvement, stable connection between the metallicon electrode and the metal deposition film, etc. can be realized advantageously, and the improvement of the capacitor performance can be effectively achieved. The heat aging treatment can be reliably performed in a compact space, at as low a cost as possible, and in a very short time.

  According to the aging method for a film capacitor element according to the invention, air or moisture is evacuated from the film capacitor element without crushing a gap provided at the two ends of the film capacitor element and allowing the metallicon electrode to enter. It can be removed in a short time and reliably, and adhesion between the laminated surfaces of the dielectric film and the metal vapor deposited film, between the laminated surfaces of the laminated bodies laminated together, and between the laminated surfaces of the laminated body and the protective film is improved. , It can be increased uniformly over the entire surface of each laminate. As a result, in the film capacitor element, an increase in capacitance, a reduction in series equivalent resistance, an improvement in withstand voltage, etc. can be realized with great advantage, and an improvement in capacitor performance can be effectively achieved. In addition, the thermal aging process for such a film capacitor element can be reliably performed in a compact space, at as low a cost as possible, and in an extremely short time. It is.

  Moreover, according to the film capacitor element manufacturing apparatus according to the present invention, the film capacitor element having the above-described characteristics can be manufactured extremely efficiently and rapidly.

  Furthermore, the film capacitor element having the above-described characteristics can be manufactured very efficiently and rapidly by the method for manufacturing the film capacitor element according to the present invention.

It is sectional explanatory drawing which shows an example of the film capacitor | condenser element age-treated using the aging apparatus which has a structure according to this invention. It is sectional explanatory drawing which shows an example of the film capacitor manufactured using the film capacitor | condenser element shown by FIG. It is a schematic explanatory drawing which shows one Embodiment of the aging apparatus which has a structure according to this invention. FIG. 4 is a cross-sectional explanatory view showing an example of an aging method performed using the aging apparatus shown in FIG. 3 according to the technique of the present invention. FIG. 5 is a partially enlarged explanatory view of FIG. FIG. 4 is an explanatory cross-sectional view illustrating a process example performed subsequent to the process illustrated in FIG. 3. FIG. 7 is an explanatory cross-sectional view illustrating a process example performed subsequent to the process illustrated in FIG. 6. It is AA cross-section explanatory drawing of FIG. FIG. 9 is an enlarged explanatory view of a portion B in FIG. 8. It is a figure corresponding to FIG. 9 which shows one process example of the aging method implemented using another embodiment of the aging apparatus which has a structure according to this invention. It is a figure corresponding to FIG. 6 which shows a part of another embodiment of the aging apparatus which has a structure according to this invention. FIG. 7 is a view corresponding to FIG. 6 showing a part of still another embodiment of an aging apparatus having a structure according to the present invention.

  Hereinafter, in order to clarify the present invention more specifically, embodiments of the present invention will be described in detail with reference to the drawings.

  First, in FIG. 1, an example of a film capacitor element to be aged using an aging apparatus having a structure according to the present invention is shown in a longitudinal sectional form. As apparent from FIG. 1, the film capacitor element 10 has a plurality (here, eight) of metallized films 12 as a laminate, and the element configuration in which the plurality of metallized films 12 are laminated to each other. A protective film 14a is laminated on one surface of the unit 13 in the laminating direction, and a protective film 14b is laminated on the other surface so as to cover both surfaces. In FIG. 1 and FIG. 2 to be described later, in order to facilitate understanding of the structure of the film capacitor element 10, the thickness of the metallized film 12 and the protective films 14a and 14b is set to their width, length, etc. It should be understood that it is exaggerated and shown in larger dimensions.

  More specifically, the metallized film 12 is formed by laminating a metal vapor deposition film 18 on one surface of a resin film 16 as a base. Further, a margin portion 20 in which the metal vapor deposition film 18 is not laminated on the resin film 16 is provided at one end portion in the width direction (the left-right direction in FIG. 1) of the metallized film 12.

  The resin film 16 constituting the metallized film 12 is constituted by a biaxially stretched film made of, for example, polypropylene or polyethylene terephthalate. The metal vapor deposition film 18 is made of, for example, aluminum or zinc and is laminated on the resin film 16 by performing a conventionally known vapor deposition method belonging to the category of PVD or CVD. Furthermore, the protective film 14 is made of, for example, the same polypropylene or polyethylene terephthalate as the resin film 16.

  A plurality of metallized films 12 are laminated on one protective film 14a, and the resin film 16 of each metallized film 12 and the metal are laminated under the laminated state of the plurality of metallized films 12. The vapor deposition films 18 are alternately arranged one by one, and the margin portions 20 of the respective metallized films 12 are arranged alternately in the width direction of the metallized film 12. Further, another protective film 14 b is further laminated on the metal vapor deposition film 18 of the metallized film 12 positioned at the uppermost layer among the plurality of metallized films 12. Thus, the film capacitor element 10 is constituted by a laminated structure of the element constituting unit 13 composed of the plurality of metallized films 12 and the two protective films 14a and 14b.

  Further, in the film capacitor element 10, the metallized films 12 adjacent to each other are arranged so that the end of one of the metallized films 12 extends laterally from the edge of the other metallized film 12 on the margin 20 side. In a state of projecting to each other, they are superimposed on each other. Thereby, in the side surfaces 21 and 21 on both sides in the width direction of the film capacitor element 10 between the width direction ends of the two metallized films 12 located on both sides of the one metallized film 12. Clearances 22 that open toward the sides are formed. Moreover, it arrange | positions so that the edge part of the metal vapor deposition film 18 of the metallized film 12 located in the lower side of the two metallized films 12 which form this clearance gap 22 may be exposed to this clearance gap 22. As is clear from these facts, in this embodiment, a gap forming portion is formed at the widthwise ends of the two metallized films 12 located on both sides of the metallized film 12 sandwiched therebetween. Has been.

  As shown in FIG. 2, the film capacitor element 10 having the above-described structure is formed by forming the metallicon electrode 24 on the side surfaces 21 and 21 on both sides in the width direction by spraying or the like. The capacitor 26 is configured. The two metallicon electrodes 24, 24 penetrate into the gap 22 that opens laterally on the side surfaces 21, 21 on both sides in the width direction of the film capacitor element 10, and are one end of the metal vapor deposition film 18 exposed in the gap 22. It is fixed to the part. As a result, in each of the gaps 22, a connection portion 23 is formed to connect each metallicon electrode 24 and one end of the metal vapor deposition film 18 exposed in the gap 22. 18 to be electrically connected to each other. It should be noted that the film capacitor 26 thus obtained is connected to terminals (not shown) or the like with respect to the two metallicon electrodes 24, 24 as necessary.

  In the film capacitor element 10, the length along the width direction of the film capacitor element 10 in the gap 22 provided on the two side surfaces 21 and 21 on which the metallicon electrodes 24 and 24 are to be formed, that is, one Positioned between the two metallized films 12, 12 from one end surface in the width direction of the two metallized films 12, 12 that are located on both sides of the metallized film 12 and that form a gap 22. The distance to the one end surface in the width direction of one metallized film 12 (the dimension indicated by D in FIG. 1) is a value in the range of 0.1 to 5 mm. In the film capacitor 26, the length along the width direction of the film capacitor 26 in the connecting portion 23 (the dimension indicated by D in FIG. 2) is set to a value in the range of 0.1 to 5 mm. ing.

  This is because when the length of the gap 22 or the connecting portion 23: D is shorter than 0.1 mm, the amount (length) of the metallicon electrode 24 portion that enters the gap 22 becomes too small. This is because the electrical connection between the metal vapor deposition film 18 exposed in the gap 22 and the metallicon electrode 24 becomes unstable and the performance of the film capacitor 26 is deteriorated. On the other hand, if the length of the gap 22 and the connecting portion 23: D is longer than 5 mm, the width dimensions of the film capacitor element 10 and the film capacitor 26 become unnecessarily large, and not only the size of the gap 22 increases, This is because it is difficult to reach the metallicon electrode 24 to the deepest portion (the end surface in the width direction of one metallized film 12 positioned between the two metallized films 12 and 12).

  By the way, in the film capacitor element 10 having the structure as shown in FIG. 1, the thermal aging treatment is performed before the metallicon electrode 24 is formed on the side surfaces 21 and 21 on both sides in the width direction. Thereby, between the resin film 16 and the metal vapor deposition film 18 of each metallized film 12, between the metallized films 12 adjacent to each other, the protective films 14a and 14b and the metallized films 12 and 12 laminated on them. Foreign matter such as air and moisture is removed from between the metal and the like, and the residual stress in the resin film 16 and the metal vapor deposition film 18 or the protective films 14a and 14b of each metallized film 12 is removed, and metallization is performed. The resin film 16 and the metal vapor deposition film 18 of the film 12, the metallized films 12 adjacent to each other, or the metallized film 12 and the protective films 14a and 14b are brought into close contact with each other.

  FIG. 3 schematically shows an embodiment of an aging apparatus having a structure according to the present invention, which is used when performing a thermal aging process on such a film capacitor element 10. Hereinafter, the aging apparatus of this embodiment will be described.

  As is apparent from FIG. 3, the aging device 28 of the present embodiment is incorporated in a film capacitor element manufacturing apparatus including a transport device 30 that produces the film capacitor device 10 and transports the film capacitor device 10 in one direction. And this aging apparatus 28 has the heat aging processing machine 32 installed in the middle of the conveyance path of the film capacitor element 10 by the conveying apparatus 30, and is comprised.

  More specifically, the transport device 30 includes a first unwinding roller 38 (first supply means) on which a roll 36a formed by winding a belt-shaped protective film 14a is mounted. The first unwinding roller 38 is rotated in one direction around the rotation axis that extends horizontally (here, the counterclockwise direction indicated by an arrow in FIG. 3) by a rotation driving device such as an electric motor (not shown). The protective film 14a (first protective film) can be continuously unwound from the roll 36a attached to the first unwinding roller 38 by driving. Then, the protective film 14a unwound from the roll 36a by the first unwinding roller 38 travels in one horizontal direction (left direction in FIG. 3) while being guided by several guide rollers 40. It is supposed to be made.

  Moreover, in the conveying apparatus 30, the element structure unit 13 formed by laminating a plurality of metallized films 12 has a known structure on the protective film 14a that travels in one horizontal direction as described above. The robot arm 41 (mounting means) or the like that is supported by the robot arm is transferred from another place and is mounted one after another at regular time intervals. As a result, the plurality of element constituent units 13 overlap one surface of the two surfaces located on both sides in the stacking direction on the long band-shaped protective film 14a and keep a certain distance from each other. In this state, the protective film 14a is sequentially conveyed in the traveling direction.

  Although not clearly shown in FIG. 3, here, the plurality of element constituent units 13 are all in the direction in which the length direction is made to coincide with the traveling direction of the protective film 14a (the left-right direction in FIG. 3). Thus, it is automatically arranged on the protective film 14a. That is, the gaps 22 provided on both side surfaces 21 and 21 in the width direction of each element component unit 13 open in a direction perpendicular to the traveling direction of the protective film 14a (a direction perpendicular to the paper surface of FIG. 3). In other words, each element constituting unit 13 is arranged such that the width-direction side surfaces 21, 21 provided with the gap 22 are located on both sides in a direction perpendicular to the traveling direction of the protective film 14a. It is arrange | positioned on the protective film 14a.

  In addition, a second roll 36b formed by winding a belt-shaped protective film 14b is mounted on the upper side of the protective film 14a that is unwound from the roll 36a and traveled by the first unwinding roller 38. An unwinding roller 42 (second supply means) is provided. The second unwinding roller 42 is rotated in a direction opposite to the rotation direction of the first unwinding roller 38 (here, FIG. 3) around a rotation shaft extending horizontally by a rotation driving device such as an electric motor (not shown). The protective film 14b is continuously unwound from the roll 36b attached to the second unwinding roller 42 by being rotationally driven in the clockwise direction indicated by the arrow in FIG. The protective film 14b unwound from the roll 36b is unwound from the roll 36a attached to the first unwinding roller 38 by the second unwinding roller 42 and travels over the protective film 14a. And the protective film 14a unwound from the roll 36a by the first unwinding roller 38 while being superposed on the upper surface of the element constituting unit 13 placed on the upper surface of the element constituting unit 13, and is allowed to travel in one horizontal direction. Yes. In FIG. 3, 44 is a tension roller that changes the traveling direction of the protective film 14b unwound from the roller 36b by the second unwinding roller 42.

  Thus, in the transport device 30, the protective films 14 a and 14 b are unwound from the two rolls 36 a and 36 b by the first and second unwinding rollers 38 and 42, and the element configuration unit 13 is protected by the robot arm 41. By transporting onto the film 14a, a plurality of element constituent units 13 are sequentially transported in the transport direction of the protective films 14a and 14b as a superposed product 11 sandwiched between two long protective films 14a and 14b. It has come to be able to do.

  On the other hand, the heat aging processor 32 includes a storage chamber 46. The accommodation chamber 46 has a divided structure including an upper divided body 48 and a lower divided body 50. The upper divided body 48 is formed of a rectangular housing that opens downward, and integrally includes an upper bottom wall portion 52 and a peripheral wall portion 54. On the other hand, the lower divided body 50 is formed of a rectangular casing that opens upward, and integrally includes a lower bottom wall portion 56 and a peripheral wall portion 58. Here, the lower divided body 50 is movable in the vertical direction by a movable device (not shown). As such a movable device, for example, a known device such as a hydraulic cylinder or a device combining a gear mechanism having a pinion and a rack and an electric motor is appropriately employed.

  Then, the lower divided body 50 is moved upward by a movable device (not shown), and the end surfaces of the peripheral wall portions 54 and 58 of the lower divided body 50 and the upper divided body 48 are abutted with each other. As a result, the upper divided body 48 and the lower divided body 50 are assembled to each other so that a housing space 60 sealed from the outside is formed in the housing chamber 46. The accommodation space 60 has a size capable of accommodating the element constituting unit 13 (film capacitor element 10). On the other hand, when the lower divided body 50 is moved downward by the movable device from the assembled state of the upper divided body 48 and the lower divided body 50, the upper divided body 48 and the lower divided body 50 are assembled. The state is eliminated, and the storage space 60 of the storage chamber 46 is opened to the outside (see FIG. 4).

  Further, the upper divided body 48 and the lower divided body 50 of the storage chamber 46 are divided into an upper side and a lower side with two protective films 14a and 14b running in one horizontal direction between the upper and lower parts, respectively, by the transport device 30 described above. Are arranged respectively. Here, in the superposed product 11 transported by the transporting device 30, the portion where the element constituent unit 13 is sandwiched between the two protective films 14 a and 14 b, that is, the constituent constituent unit 13 in the superposed product 11. Is located between the upper divided body 48 and the lower divided body 50, the lower divided body 50 moves upward, and the upper divided body 48 and the lower divided body 50 are mutually connected. It can be assembled. As a result, the site where the element constituting unit 13 of the superposed product 11 conveyed by the conveying device 30 is automatically accommodated in the accommodating space 60 of the accommodating chamber 46. As will be described later, the portion where the element constituent unit 13 exists in the superposed product 11 is a portion that is formed as an individual film capacitor element 10 by cutting the protective films 14 a and 14 b by the cutting device 109. Therefore, hereinafter, the portion where the element constituent unit 13 in the superposed product 11 exists is referred to as a film capacitor element 10.

  In the aging device 28 of the present embodiment, when the film capacitor element 10 is accommodated in the accommodating space 60 by assembling the upper divided body 48 and the lower divided body 50 to each other, The conveyance of the combined article 11 is automatically stopped once, and the protective film 14a and 14b portions respectively positioned on the front side and the rear side in the conveyance direction of the film capacitor element 10 are the upper divided body 48 and the lower divided body 50. The film capacitor element 10 is supported by the protective films 14a and 14b located in the front and rear of the film capacitor element 10 while floating in the accommodation space 60. It is arranged in the state. Then, when a predetermined time has elapsed since the upper divided body 48 and the lower divided body 50 are assembled to each other, the lower divided body 50 moves downward, the accommodation space 60 is opened to the outside, and the conveyance is performed. The transportation of the polymerized product 11 by the apparatus 30 is resumed.

  A diaphragm 62 made of a rubber thin film is housed inside the lower divided body 50 of the housing chamber 46. The diaphragm 62 has an area larger than the area of the inner surface of the lower bottom wall portion 56 in the lower divided body 50, and in the intermediate portion in the height direction inside the lower divided body 50, Oppositely arranged with a predetermined distance from the inner surface. The outer peripheral portion of the diaphragm 62 enters the peripheral groove 64 formed on the inner surface of the peripheral wall portion 58 of the lower divided body 50 and is fixed to the inner surface of the peripheral groove 64 over the entire periphery. ing. As a result, the inner space of the lower divided body 50 is fluid-divided by the diaphragm 62 into two parts, that is, the lower bottom wall part 56 side and the upward opening part side.

  Thus, the housing space 60 formed in the housing chamber 46 by the mutual assembly of the upper divided body 48 and the lower divided body 50 is partitioned into two fluid-tightly in the vertical direction by the diaphragm 62. It has become. Thus, the vacuum chamber 66 surrounded by the upper bottom wall portion 52 and the peripheral wall portion 54 of the upper divided body 48, the peripheral wall portion 58 of the lower divided body 50, and the diaphragm 62 in the accommodating chamber 46, The lower bottom wall portion 56 and the peripheral wall portion 58 of the side divided body 50 and the compressed air chamber 68 surrounded by the diaphragm 62 are defined so as to be positioned vertically with the diaphragm 62 interposed therebetween. That is, the storage space 60 in the storage chamber 46 is composed of a vacuum chamber 66 located on the upper side and a compressed air chamber 68 located on the lower side with the diaphragm 62 interposed therebetween. The diaphragm 62 may be formed of a known elastomer or a thin film made of an elastically deformable resin, for example, instead of the rubber thin film.

  In the thermal aging processor 32 having the accommodation chamber 46, the film capacitor element 10 is accommodated and disposed in the vacuum chamber 66 of the accommodation space 60 during the conveyance by the conveyance device 30.

  An upper heating plate 70 is disposed in the vacuum chamber 66 so as to be positioned above the film capacitor element 10 accommodated in the vacuum chamber 66. The upper heating plate 70 is a rectangular flat plate incorporating a known heating device such as an electric heater, and is disposed horizontally in the vacuum chamber 66 with the thickness direction being the vertical direction. A rubber plate 72 as an elastic body is fixed to the lower surface of the upper heating plate 70. The rubber plate 72 is formed of a thin flat plate, and the lower surface opposite to the upper heating plate 70 side is a flat surface having a larger area than the upper surface of the film capacitor element 10. Instead of the rubber plate 72, for example, a plate-like elastic body made of a known elastomer or an elastically deformable resin part may be fixed to the lower surface of the upper heating plate 70.

  The upper heating plate 70 to which such a rubber plate 72 is fixed is fixed to the inner surface of the upper bottom wall portion 52 of the upper divided body 48 via fixing brackets 74 and 74. Under the fixed state, the flat lower surface of the rubber plate 72 of the upper heating plate 70 is the upper surface of the film capacitor element 10 accommodated in the vacuum chamber 66 (the protective film 14b portion laminated on the upper side of the element constituting unit 13). The upper surface is elastically contacted with the entire surface. As a result, the upward movement of the film capacitor element 10 accommodated in the vacuum chamber 66 in the vacuum chamber 66 is restricted or prevented. As is clear from this, in the present embodiment, the rubber plate 72 and the upper heating plate 70 fixed to the lower surface constitute a restricting means or a restricting member.

  On the other hand, a lower heating plate 76 is accommodated in the compressed air chamber 68. Similarly to the upper heating plate 70, the lower heating plate 76 is also a rectangular flat plate incorporating a known heating device such as an electric heater. The lower heating plate 76 accommodated in the compressed air chamber 68 is divided into the lower division in a state of being opposed to the upper heating plate 70 fixed in the vacuum chamber 66 with the diaphragm 62 interposed therebetween. It is fixed to the lower bottom wall portion 56 of the body 50 via fixing brackets 78 and 78.

  Thus, in the heat aging processor 32, the inside of the vacuum chamber 66 and the inside of the pressurized air chamber 68 are heated by the electric heaters built in the upper and lower heating plates 70 and 76, respectively. Thereby, the film capacitor element 10 accommodated in the vacuum chamber 66 is heated by the upper heating plate 70 and the lower heating plate 76 from both the upper and lower sides. As is clear from this, in the present embodiment, the upper heating plate 70 and the lower heating plate 76 constitute a heating means. Here, the heating temperature of the electric heater built in the upper and lower heating plates 70 and 76 is controlled by a controller (not shown).

  Further, through holes 80 are formed in the upper bottom wall portion 52 of the upper divided body 48 of the storage chamber 46 and the lower bottom wall portion 56 of the lower divided body 50, respectively. Further, an exhaust pipe 82 is connected to the through hole 80 provided in the upper bottom wall portion 52 of the upper divided body 48. On the other hand, an air supply pipe 84 is connected to the through hole 80 provided in the lower bottom wall portion 56 of the lower divided body 50. A vacuum pump 86 is installed in the middle of the exhaust pipe 82, and a compressor 88 is connected to the tip of the air supply pipe 84.

  Thus, the vacuum pump 86 is operated in a state where the upper divided body 48 and the lower divided body 50 are assembled with each other and the vacuum chamber 66 and the compressed air chamber 68 are defined in the storage chamber 46. The air in the vacuum chamber 66 is exhausted to the outside through the exhaust pipe 82 so that the vacuum chamber 66 is in a vacuum state. Further, by the operation of the compressor 88, compressed air is supplied into the compressed air chamber 68 through the air supply pipe 84, the inside of the compressed air chamber 68 is pressurized, and the diaphragm 62 is elastically deformed toward the vacuum chamber 66 side. It has become. Then, the entire lower surface of the film capacitor element 10 accommodated in the vacuum chamber 66 is uniformly pressurized by the elastically deformed diaphragm 62, and the entire lower surface of the film capacitor element 10 is A uniformly distributed load is applied. As is clear from this, in this embodiment, the exhaust pipe 82 and the vacuum pump 86 constitute exhaust means, while the air supply pipe 84 and compressor 88 constitute compressed air supply means. Has been.

  Further, as is apparent from FIGS. 3 to 5, in the heat aging processor 32, a pressing plate 90 as a deformation preventing means is placed on the diaphragm 62 and fixed to the diaphragm 62 and the upper heating plate 70. It is arranged between the rubber plate 72 made.

Here, the pinching flat plate 90 is made of a thin rectangular plate that can be elastically deformed, and its length (the dimension indicated by L ₁ in FIG. 7) is the length of the film capacitor element 10 (element constituent unit 13). While the dimension indicated by L ₂ in FIG. 7 is substantially the same dimension as the dimension along the conveying direction of the superposed product 11 by the conveying device 30, its width (dimension indicated by W ₁ in FIG. 8). Is larger than the width of the film capacitor element 10 (element constituent unit 13) (the dimension indicated by W ₂ in FIG. 8 and the dimension along the direction perpendicular to the conveying direction of the superposed product 11 by the conveying device 30). The size is increased by a predetermined dimension.

  Such a pressing plate 90 has both longitudinal edges corresponding to the longitudinal edges of the film capacitor element 10 accommodated in the vacuum chamber 66 in the vertical direction. In addition, both end portions in the width direction are disposed on the diaphragm 62 so as to be positioned so as to extend laterally from both end edges in the width direction of the film capacitor element 10 (see FIGS. 7 and 8). In addition, the clamping plate 90 is fixed to the central portion of the upper surface of the diaphragm 62 using, for example, an adhesive or the like under such an arrangement state.

  Thus, in the pinching flat plate 90, when the diaphragm 62 is elastically deformed toward the vacuum chamber 66 by supplying compressed air into the compressed air chamber 68, the film capacitor element 10 accommodated in the vacuum chamber 66 is obtained. When the diaphragm 62 pressurizes the entire lower surface of the film capacitor element 10, the diaphragm 62 comes into pressure contact with the entire lower surface of the film capacitor element 10. As a result, the pressing plate 90 presses the film capacitor element 10 with the rubber plate 72 of the upper heating plate 70 located in contact with the entire upper surface based on the pressing force of the diaphragm 62. It has become.

  Here, in particular, the clamping plate 90 is made elastically deformable following the elastically deformed diaphragm 62. As a result, the pressure applied by the elastically deformed diaphragm 62 is applied to the entire lower surface of the film capacitor element 10 even though the pinching plate 90 is interposed between the film capacitor element 10 and the diaphragm 62. It acts uniformly via the pinching plate 90, and is thus equally distributed from the rubber plate 72 of the upper heating plate 70 and the pinching plate 90 to the entire upper surface and lower surface of the film capacitor element 10. Each load is applied.

  As will be described later, the diaphragm 62 is first elastically deformed so as to swell in a dome shape by compressed air, pressurizing the center of the lower surface of the film capacitor element 10, and then further elastically deformed to form a film. The entire lower surface of the capacitor element 10 is pressurized. Therefore, the pinching plate 90 that elastically deforms following the diaphragm 62 is also firstly brought into contact with the upper heating plate 70 (rubber plate 72) based on the applied pressure of the elastically deformed diaphragm 62. The center portion of the film 10 is clamped, and then the entire film capacitor element 10 is clamped. As a result, as will be described in detail later, air and moisture present inside the film capacitor element 10 can be moved while being pushed out to the outer peripheral portion of the film capacitor element 10.

  And the amount of elastic deformation when the clamping flat plate 90 is elastically deformed following the diaphragm 62 elastically deformed by the pressure of compressed air (for example, about 0.05 to 3 MPa) is greater than the amount of elastic deformation of the diaphragm 62. Is also configured to have a small amount of elastic deformation. Therefore, when the diaphragm 62 elastically deformed by the pressure of the compressed air pressurizes the entire lower surface of the film capacitor element 10 via the pinching plate 90, both edges in the width direction of the film capacitor element 10 are added. The elastic deformation of the diaphragm 62 portion to be pressed is suppressed at both end portions in the width direction of the pressing plate 90 extending laterally from the both end edges in the width direction of the film capacitor element 10, and the film capacitor element 10 from the diaphragm 62 portion is suppressed. The pressure applied to both edges in the width direction is relieved.

  That is, the clamping plate 90 elastically deforms following the diaphragm 62 elastically deformed by the pressure of compressed air (for example, about 0.05 to 3 MPa), but the amount of elastic deformation at that time is the elastic deformation of the diaphragm 62. A material that is smaller than the amount, that is, a material that is harder to be elastically deformed than the diaphragm 62 and is hard to some extent is desirable. This is due to the following reason. That is, when the pressing plate 90 is made of a material whose elastic deformation amount is larger than that of the diaphragm when it is elastically deformed following the diaphragm 62 elastically deformed by the pressure of the compressed air, that is, the pressing plate. If 90 is made of a soft material that is more easily elastically deformed than the diaphragm 62, the elastic deformation of the diaphragm 62 portion that pressurizes the both edges in the width direction of the film capacitor element 10 at both ends in the width direction of the pressing plate 90. When the film capacitor element 10 is clamped between the pressing plate 90 and the diaphragm 62, the gap 22 provided at both ends in the width direction of the film capacitor element 10 becomes difficult. This is because it may be difficult to prevent crushing. Further, when the clamping plate 90 is made of a material that cannot be elastically deformed following the diaphragm 62 that is elastically deformed by the pressure of compressed air, the load is evenly distributed on the lower surface of the film capacitor element 10. This is because it may be difficult to move the air and moisture existing inside the film capacitor element 10 so as to push out to the outer peripheral portion of the film capacitor element 10.

  Thus, in the thermal aging processor 32, as described above, the length D along the width direction of the film capacitor element 10 in the gaps 22 provided on the side surfaces 21 and 21 on both sides in the width direction of the film capacitor element 10 is D. Although the size is 0.1 mm or more, when the film capacitor element 10 is clamped between the pressing plate 90 and the upper heating plate 70, the gap 22 of the film capacitor element 10 is formed. Therefore, it is possible to prevent, as much as possible, that both ends in the width direction (both ends in the width direction of each metallized film 12) whose deformation strength is smaller than the central portion are bent and deformed by the pressure force of the elastically deformed diaphragm 62. Is done. As a result, the gap 22 provided on both side surfaces 21 and 21 in the width direction of the film capacitor element 10 is prevented from being crushed.

  The amount of elastic deformation when elastically deforming following the diaphragm 62 elastically deformed by the pressure of compressed air (for example, about 0.05 to 3 MPa) is smaller than the amount of elastic deformation of the diaphragm 62. Examples of the material for forming the sandwiched flat plate 90 include metal materials such as iron, calcified carbon fiber reinforced resin, and glass fiber reinforced resin composite resin materials in addition to aluminum, and such metal materials and resin materials. It is desirable to have heat resistance.

  Thus, in the heat aging processor 32 having the above-described structure, the film capacitor element 10 housed in the vacuum chamber 66 of the housing chamber 46 is moved by the upper and lower heating plates 70 and 76. While heating to a predetermined temperature, the vacuum chamber 86 is evacuated by the vacuum pump 86 to obtain a predetermined vacuum state. On the other hand, the compressed air supplied from the compressor 88 to the compressed air chamber 68 is converted into the compressed air. On the basis of the pressure applied by the elastically deformed diaphragm 62, the pressure is sandwiched between the pressure plate 90 and the rubber plate 72 of the upper heating plate 70. As a result, air and moisture in the film capacitor element 10 are removed, and a thermal aging process is performed to remove the residual stress of the resin film 16 of the metallized film 12 and the metal vapor deposition film 18 and the protective film 14 constituting the film capacitor element 10. It is comprised so that it can implement.

  In the aging device 28 of the present embodiment, a cutting device 109 (cutting means) having known cutters 105 and 105 is installed on the front side of the heating press machine 34 in the transport direction of the superposed product 11 by the transport device 30. Has been. When the film capacitor element 10 subjected to the heat aging process by the heat aging processor 32 is conveyed to the installation position of the cutting device 109, the two protective films 14a that connect the film capacitor elements 10 positioned adjacent to each other. , 14b are cut by cutters 105, 105, respectively. Thus, individual film capacitor elements 10 having the structure shown in FIG. 1 are obtained one after another.

  By the way, when obtaining the film capacitor element 10 by performing the thermal aging process on the film capacitor element 10 using the apparatus for manufacturing the film capacitor element 10 provided with the aging device 28 of the present embodiment having such a structure. For example, the operation is performed as follows.

  That is, first, as shown in FIG. 4, the protective film 14a is unwound from the roll 36a attached to the first unwinding roller 38 of the conveying device 30, and the element constituent unit 13 is placed on the protective film 14a. The robot arm 41 sequentially places the robot arm 41 at a predetermined interval, while unwinding the protective film 14b from the roll 36b mounted on the second unwinding roller 42, and the element constituting unit 13 on the protective film 14a. To overlay. Thereby, the polymerized product 11 is produced, and it is continuously conveyed toward the heat aging processor 32.

  Although not explicitly shown in FIG. 4, when the plurality of element constituent units 13 are placed on the protective film 14 a, as described above, both side surfaces 21, 21 of the element constituent units 13 in the width direction. Each element constituting unit 13 is placed on the protective film 14a so that the gap 22 provided in the opening opens in a direction perpendicular to the conveying direction of the protective film 14a (a direction perpendicular to the paper surface of FIG. 4). Deploy.

  Then, the site where the element constituent unit 13 is present in the superposed product 11 conveyed by the conveying device 30, that is, one of the plurality of film capacitor elements 10 connected to each other by the protective films 14a and 14b is thermally aged. When the storage chamber 46 of the processing machine 32 reaches the space between the upper divided body 48 and the lower divided body 50 that are spaced apart from each other, the operation of the transfer device 30 is temporarily stopped.

  At this time, as shown in FIG. 5, the upper surface of the protective film 14 b portion where the film capacitor element 10 disposed between the upper divided body 48 and the lower divided body 50 is superimposed on the upper surface of the element constituting unit 13. Is positioned so as to be in contact with the rubber plate 72 fixed to the lower surface of the upper heating plate 70 fixed inside the upper divided body 48. Thereby, the upward displacement of the film capacitor element 10 disposed between the upper divided body 48 and the lower divided body 50 is disabled. At the same time, the film capacitor element 10 is disposed in the longitudinal direction of the clamping plate 90 on the vertical side of the clamping plate 90 placed on the diaphragm 62 fixed inside the lower divided body 50 (see FIG. 5 in the width direction of the film capacitor element 10 and the width direction of the clamping plate 90 (direction perpendicular to the paper surface in FIG. 5). Are arranged so as to protrude laterally from both end edges in the width direction of the film capacitor element 10 (direction perpendicular to the paper surface of FIG. 5) (see FIG. 8).

  Next, as shown in FIG. 6, the lower divided body 50 is moved upward by a movable device (not shown) while the conveying device 30 is temporarily stopped, and the upper divided body 48 and the lower side are moved. The divided body 50 is assembled to each other to form a storage chamber 46 composed of these assembled bodies. As a result, a storage space 60 is formed in the storage chamber 46, and a vacuum chamber 66 and a compressed air chamber 68 are placed in such a storage space 60 on the upper side and the lower side with the diaphragm 62 interposed therebetween. Each is defined. At this time, two protective films 14a positioned on the front side and the rear side with the film capacitor element 10 (element configuration unit 13) interposed therebetween in the transport direction of the superposed product 11 (left and right direction in FIG. 6). , 14b is sandwiched between the upper end surface of the peripheral wall portion 58 of the lower divided body 50 and the lower end surface of the peripheral wall portion 54 of the upper divided body 48. Thus, the film capacitor element 10 is supported in the vacuum chamber 66 in a state of being floated.

  Then, after assembling the upper divided body 48 and the lower divided body 50 to each other, or before assembling them, the upper heating plate 70 and the lower heating plate 76 are incorporated into the heating. Heat with equipment. Thereby, the inside of the accommodation space 60 is heated, and the film capacitor element 10 accommodated in the vacuum chamber 66 is heated to a predetermined temperature.

  Although the temperature of the film capacitor element 10 heated by the upper and lower heating plates 70 and 76 is not particularly limited, it is desirable that the temperature be in the range of about 90 to 105 ° C. This is because when the temperature of the film capacitor element 10 in the vacuum chamber 66 is lower than 90 ° C., the operation of evaporating the water present in the film capacitor element 10 or the resin film 16 and the metal of the metallized film 12 is performed. This is because it may be difficult to sufficiently perform a heat aging process described later including an operation for removing the residual stress of the deposited film 18. Further, if the temperature of the film capacitor element 10 in the vacuum chamber 66 is higher than 105 ° C., the resin film 16 constituting the film capacitor element 10 may be heated and melted.

  Thereafter, as shown in FIG. 7, the vacuum pump 86 is operated to discharge the air in the vacuum chamber 66 to the outside, thereby bringing the vacuum chamber 66 into a vacuum state. At the same time when the vacuum pump 86 is operated or before or after the operation of the vacuum pump, the compressor 88 is operated to supply compressed air into the compressed air chamber 68. Thus, the inside of the compressed air chamber 68 is in a pressurized state, the diaphragm 62 is elastically deformed toward the vacuum chamber 66 side, and the film capacitor element 10 accommodated in the vacuum chamber 66 is elastically deformed with the diaphragm 62 and the upper heating plate. Clamping with 70

  In this step, since the vacuum chamber 66 in which the film capacitor element 10 is accommodated is placed in a vacuum state, the resin film 16 of the metallized film 12 constituting the film capacitor element 10 accommodated in the vacuum chamber 66 and Between the laminated surfaces with the metal vapor deposition film 18, between the laminated surfaces of the metallized films 12 adjacent to each other, and between the laminated surfaces of the protective films 14a and 14b and the metallized film 12 laminated thereon, respectively. Air and moisture are forcibly sucked from between the stacked surfaces by evacuation by the vacuum pump 86. In addition, although the pressure in the vacuum chamber 66 when it is set as a vacuum state is not specifically limited, Generally it is set as the pressure of about 20-100 Pa.

  Further, in this step, when compressed air is supplied into the compressed air chamber 68, the diaphragm 62 first swells in a dome shape having the largest bulge at the center as shown by a two-dot chain line in FIG. Thus, the central portion of the lower surface of the film capacitor element 10 housed in the vacuum chamber 66 is pressurized at the central portion of the diaphragm 62 in such an elastically deformed state. Thereafter, as the amount of compressed air supplied into the compressed air chamber 68 increases, the outer peripheral portion of the diaphragm 62 also bulges toward the vacuum chamber 66, so that the diaphragm 62 on the lower surface of the film capacitor element 10 is expanded. The portion to be pressurized gradually expands from the center toward the outer peripheral edge. Then, as shown by a solid line in FIG. 7, the diaphragm 62 has a shape of the lower surface of the film capacitor element 10 and a rubber plate of the upper heating plate 70 by further increasing the amount of compressed air supplied into the compressed air chamber 68. The entire lower surface of the film capacitor element 10 is pressurized by the elastically deformed diaphragm 62 by elastically deforming into a shape corresponding to the shape of the portion located outside the film capacitor element 10 in the lower surface of 72. become. At this time, the pressing plate 90 disposed between the diaphragm 62 and the film capacitor element 10 follows the elastic deformation of the diaphragm 62 and presses and contacts the lower surface of the film capacitor element 10 while elastically deforming.

  Thus, in this step, the film capacitor element 10 is first clamped between the pressing plate 90 and the upper heating plate 70 based on the applied pressure of the elastically deformed diaphragm 62, and then covered. The sandwiched portion spreads toward the outer peripheral edge, and eventually the entire film capacitor element 10 is sandwiched between the sandwiched flat plate 90 and the upper heating plate 70.

  At this time, as the sandwiched portion of the film capacitor element 10 spreads from the center of the film capacitor element 10 toward the outer peripheral edge, the resin film 16 and the metal vapor deposition film of each metallized film 12 constituting the film capacitor element 10 18 or between the laminated surfaces of the metallized films 12 adjacent to each other, or between the laminated surfaces of the protective films 14a, 14b and the metalized film 12 laminated thereon, respectively, The film capacitor element 10 moves so as to be pushed to the outer peripheral edge side. Further, at this time, the pressing plate 90 is elastically deformed following the diaphragm 62, so that the movement of the movement of air and moisture in the film capacitor element 10 toward the outer peripheral side is inhibited by the pressing plate 90. It will not be done. The air and moisture moved to the outer peripheral side of the film capacitor element 10 between the respective laminated surfaces of the film capacitor element 10 are more quickly and reliably from between the laminated surfaces by evacuation by the vacuum pump 86. It will be sucked up. Further, by heating the film capacitor element 10 by the upper and lower heating plates 70 and 76, moisture is evaporated from between the respective laminated surfaces of the film capacitor element 10. Note that the pressure in the pressurized air chamber 68 when being pressurized is not limited at all, but is preferably about 0.05 to 3.0 MPa.

  Further, in this step, the film capacitor element 10 is simply clamped between the pressing plate 90 and the upper heating plate 70 based on the pressure of the compressed air (pressurizing force of the diaphragm 62). Thus, for example, unlike the case of using a conventional aging treatment apparatus in which the film capacitor element 10 is clamped based on a tightening force of a tightening bolt larger than the pressure of compressed air, the film capacitor element 10 The metal film 12 and the metal vapor deposition film 18 of the metallized film 12 constituting the metallized film 12, the metallized films 12 laminated to each other, the protective films 14a and 14b, and the metallized film 12 laminated on them. However, they are not pressed together more firmly than necessary. Therefore, due to the clamping pressure between the clamping plate 90 and the upper heating plate 70, the air and moisture in the film capacitor element 10 are changed between the resin film 16 of the metallized film 12 and the laminated surface of the metal vapor deposition film 18. In addition, it is not confined between the laminated surfaces of the metallized films 12 laminated together or between the laminated surfaces of the protective films 14a and 14b and the metallized film 12. Moreover, since the air reservoir that hinders heat conduction is completely lost in the film capacitor element 10 as described above, the heat due to heating is more quickly transferred to the inside of the film capacitor element 10. Thereby, evaporation of moisture in the film capacitor element 10 is advantageously promoted.

  Further, in this step, the pressing plate 90 and the upper heating plate are heated based on the pressure of the diaphragm 62 elastically deformed by compressed air while the film capacitor element 10 is heated at a temperature in the range of about 90 to 105 ° C. 70 is sandwiched between the two. Thereby, the residual stress of the resin film 16 and the metal vapor deposition film 18 of each metallized film 12 and the protective films 14a and 14b constituting the film capacitor element 10 is removed. Further, since the air reservoir in the film capacitor element 10 is completely eliminated, the heat conduction into the film capacitor element 10 is effectively enhanced. Therefore, the resin film 16, the metal vapor deposition film 18, and the protective films 14a and 14b The residual stress is removed more efficiently and reliably. And as a result, between the lamination surfaces of the resin film 16 and the metal vapor deposition film 18 of each metallized film 12, between the lamination surfaces of the metallized films 12 laminated | stacked mutually, Furthermore, protective film 14a, 14b and these The adhesion between the laminated surfaces with the metallized film 12 laminated on each other is effectively enhanced.

  In addition, in this step, when the film capacitor element 10 is clamped between the pressing plate 90 and the upper heating plate 70, the pressing plate 90 and the upper and lower surfaces of the film capacitor element 10 are An equally distributed load is applied from the rubber plate 72 of the upper heating plate 70. For this reason, each above-mentioned lamination surface of film capacitor element 10 is stuck more uniformly in those whole surfaces. Further, as described above, since the respective laminated surfaces are not pressed firmly more than necessary, heat from the heating of the upper and lower heating plates 70 and 76 can be sufficiently transmitted to the inside of the film capacitor element 10. Residual stress of the resin film 16 and the metal vapor deposition film 18 and the protective films 14a and 14b of each metallized film 12 constituting the film capacitor element 10 can be removed in a shorter time.

  Further, in this step, the upper surface and the entire lower surface of the film capacitor element 10, while pressed against the clamping applanation plate 90 and the rubber plate 72 made of an elastic body, the film capacitor element 10, pressure of the diaphragm 62 is elastically deformed based on, pinched between the clamping applanation plate 90 and the upper heating plate 70. Therefore, the nip pressure time of the film capacitor element 10, the rubber plate 72 of the clamping applanation plate 90 and the upper heating plate 70, the clamping force between those clamping applanation plate 90 and the upper heating plate 70 to the film capacitor element 10 permit resulting deformation or is elastically deformed to absorb.

  Further, as shown in FIG. 7, in this step, the lengthwise side end faces (side surfaces) of the heated film capacitor element 10 and the length of the pressing plate 90 having substantially the same length as the film capacitor element 10 are obtained. The elastically deformed diaphragms 62 are pressed against and contacted with both end surfaces (side surfaces) in the direction so as to cover these end surfaces from the outside. For this reason, the two protective films 14 a and 14 b are in close contact with both end surfaces (side surfaces) in the length direction of the element constituent unit 13 of the film capacitor element 10, thereby forming both end surfaces in the length direction of the film capacitor element 10. Protection comes to be achieved.

  As described above, since the elastic deformation amount of the pressing plate 90 when elastically deforming following the diaphragm 62 elastically deformed by the compressed air is smaller than the elastic deformation amount of the diaphragm 62, FIG. As shown in FIG. 9 and FIG. 9, in this step, the film capacitor element 10 is clamped between the pressing plate 90 and the upper heating plate 70 based on the applied pressure of the diaphragm 62 elastically deformed by compressed air. , Both ends in the width direction of the pressing plate 90 in which the elastic deformation of the diaphragm 62 portions that pressurize both ends in the width direction as the gap forming portions of the film capacitor element 10 extend laterally from both ends in the width direction of the film capacitor element 10. It is restrained by the extending portions 108 and 108, and extends from the diaphragm 62 portion to both end portions in the width direction of the film capacitor element 10. Pressure that is relaxed. As a result, when the film capacitor element 10 is clamped between the pressing plate 90 and the upper heating plate 70, both ends in the width direction of the plurality of metallized films 12 constituting the film capacitor element 10 are bent and deformed. Be blocked. As a result, the plurality of gaps 22 opened laterally on the side surfaces 21 on both sides in the width direction of the film capacitor element 10 are prevented as much as possible from being deformed by the applied pressure of the elastically deformed diaphragm 62, and the gaps therebetween. 22 is prevented from being crushed.

  Further, in this step, the extending portions 108 and 108 are provided on the pinching flat plate 90, so that the protective film 14 a has the side surfaces 21 and 21 on both sides in the width direction of the film capacitor element 10. Close contact with the gaps 22 provided in 21 and 21 is blocked. Thereby, for example, before the metallicon electrodes 24 and 24 are formed on the both side surfaces 21 and 21 in the width direction of the film capacitor element 10, an extra film for removing the protective film 14 a adhered to the both side surfaces 21 and 21 in the width direction is removed. There is no need to do work.

  Thus, in this step, while the film capacitor element 10 accommodated and disposed in the vacuum chamber 66 is heated to about 90 to 105 ° C., the inside of the vacuum chamber 66 of the accommodation chamber 46 is decompressed to about 20 to 100 Pa, The inside of the compressed air chamber 68 is pressurized to about 0.05 to 3.0 MPa, and the film capacitor element 10 is connected to the sandwiched flat plate 90 based on the applied pressure of the diaphragm 62 elastically deformed by the pressurization in the compressed air chamber 68. By performing a heat aging process consisting of a series of operations for pinching with the upper heating plate 70, air and moisture in the film capacitor element 10 are removed and residual stress in the film capacitor element 10 is removed. is there.

  Note that the decompression in the vacuum chamber 66 and the pressurization in the pressure chamber 68 are completed instantaneously. Therefore, the thermal aging process of this step for the film capacitor element 10 using the thermal aging processor 32 is specifically performed by heating the film capacitor element 10 heated to a temperature of about 90 to 105 ° C. in the accommodation chamber 46. It is carried out by pressing between the pressing plate 90 and the upper heating plate 70 for about 30 to 120 seconds.

  When the thermal aging process for the film capacitor element 10 is completed, as shown in FIG. 4, the lower divided body 50 of the storage chamber 46 of the thermal aging processor 32 is moved downward to perform the thermal aging process. After the film capacitor element 10 having been completed is removed from the accommodation space 60 of the accommodation chamber 46, the film capacitor element 10 is conveyed to the installation position of the cutting device 109 by conveying the superposed product 11 by the conveying device 30. . Thereafter, the protective films 14a and 14b extending in the length direction from the film capacitor element 10 are cut off by the cutters 105 and 105 of the cutting device 109, respectively. Thus, an independent film capacitor element 10 having the structure shown in FIG. 1 is obtained. Further, the metallicon electrodes 24 are formed on both side surfaces in the width direction of the film capacitor element 10 to obtain the film capacitor 26 having the structure as shown in FIG.

  As is apparent from the above description, in the aging device 28 of the present embodiment, the thermal aging process for the film capacitor element 10 can be performed in a very short time and efficiently. And by such a heat aging process, without crushing the gap | interval 22 which can be penetrated by the metallicon electrode 24 each provided in the side surfaces 21 and 21 of the width direction both sides of the film capacitor element 10 from inside the film capacitor element 10 Air and moisture can be reliably removed in a short time, and between the laminated surfaces of the resin film 16 and the metal vapor deposition film 18 of the metallized film 12 constituting the film capacitor element 10 or between the metallized films 12 laminated on each other. Adhesion between the laminated surfaces and between the laminated surfaces of the protective films 14a and 14b and the metallized film 12 laminated thereon can be uniformly increased over the entire surface of each laminated surface.

  Moreover, when the heat aging treatment is performed, the film capacitor element 10 is heated by the upper and lower heating plates 70 and 76 disposed in the heat aging treatment machine 32, so that a large heating furnace is provided from the aging device 28. Thus, the aging device 28 can be advantageously reduced in size and cost.

  Therefore, when the aging device 28 of the present embodiment is used, the film capacitor element 10 is increased in capacitance, reduced in series equivalent resistance, improved in withstand voltage, increased in metallicon by performing the thermal aging process on the film capacitor element 10. A stable connection or the like between the electrode 24 and the metal vapor deposition film 18 can be advantageously achieved, and the capacitor performance can be effectively improved. In addition, such a heat aging process for the film capacitor element 10 can be reliably performed in a compact space, at as low a cost as possible, and in an extremely short time.

  In the aging device 28 of the present embodiment, when the thermal aging process for the film capacitor element 10 is performed by the thermal aging processor 32, the clamping pressure between the clamping plate 90 and the upper heating plate 70 is The deformation generated in the film capacitor element 10 is allowed or absorbed by the elastic deformation of the pressing plate 90 and the rubber plate 72 of the upper heating plate 70. As a result, the upper surface and the lower surface of the film capacitor element 10 are wrinkled or damaged due to the sandwiching pressure of the film capacitor element 10 between the pressing plate 90 and the upper heating plate 70. This can be advantageously prevented.

  In addition, if the apparatus for producing the film capacitor element 10 having the aging device 28 of the present embodiment is used, a plurality of the film capacitor elements 10 having the above-mentioned many excellent features can be efficiently obtained in a very short time. In addition, it is possible to reliably and reliably manufacture.

  The specific configuration of the present invention has been described in detail above. However, this is merely an example, and the present invention is not limited by the above description.

  For example, in the above-described embodiment, the thermal aging process is performed on the film capacitor element 10 in which the protective films 14a and 14b are laminated on both sides of the element constituent unit 13 in which the plurality of metallized films 12 are laminated. The film capacitor element 10 is configured using a laminate having a structure in which at least one dielectric film and at least one metal vapor deposition film are alternately laminated, and a protective film. However, what is necessary is just to have the structure formed so that the surface of the lamination direction of a laminated body may be covered.

  Therefore, the film capacitor element, for example, by winding the metallized film 12 as a laminate, the protective film 14 is further wound with respect to the element (unit constituting unit) formed by laminating the metallized film 12. It may have a so-called winding type structure, or a laminated body having a structure in which a dielectric film made of a vapor-deposited polymer film and a metal vapor-deposited film are alternately laminated is laminated or wound. It may have a structure in which the protective film is disposed on the obtained element constituent unit so as to cover the surface in the stacking direction of the element constituent unit.

  In addition, the metallized film 12 may have a structure in which the metal vapor deposition film 18 is laminated on both surfaces of the resin film 16. When using the metallized film 12 having such a structure, for example, using a laminate having a structure in which the metallized film 12 and the resin film 16 in which the metal vapor deposition film 18 is not laminated at all are laminated, A film capacitor element 10 is formed.

  Furthermore, for example, a plurality of metallized films 12 may be laminated to form a laminate. And it is also possible to comprise the film capacitor | condenser element 10 using the element structure unit obtained by further laminating | stacking or winding such a laminated body. Moreover, in the film capacitor element 10 formed in this way, one of the laminates composed of the plurality of metallized films 12 is sandwiched between the two end portions in the width direction of the two laminates located on both sides thereof. A gap 22 is formed between the side surfaces 21 and 21 on both sides in the width direction of the film capacitor element 10.

  Moreover, in the said embodiment, by laminating | stacking the some metallized film 12 shifting alternately in the width direction, it sandwiches one metallized film 12 in between, and the two metallized films 12 located on both sides thereof , 12 is formed with a gap 22 between the end portions in the width direction. However, for example, by laminating the wide metallized film 12 (laminate) and the narrow metallized film 12 (laminate) alternately, between the adjacent wide metallized films 12, It is also possible to form the gap 22.

  Furthermore, in the aging device 28 of the above embodiment, the polymerized product 11 having the plurality of film capacitor elements 10 connected to each other by the two protective films 14a and 14b is continuously formed by the two protective films 14a and 14b. It had the conveyance apparatus 30 conveyed to. Then, while the plurality of film capacitor elements 10 are being transported by the transport device 30, the film capacitor elements 10 are successively put into the heat aging processor 32 during the transport, thereby the plurality of film capacitor elements 10. The thermal aging treatment for was continuously carried out. However, the conveying device 30 is omitted from the aging device 28, and each of the film capacitor elements 10 that are independent from each other is discontinuously charged into the thermal aging processor 32. It is also possible to perform a thermal aging process on the element 10.

  Furthermore, a restricting means for restricting displacement of the film capacitor element 10 accommodated in the accommodating chamber 46 of the thermal aging processor 32 in the pressurizing direction (upward direction in FIG. 3) by the diaphragm 62, and the film capacitor element 10. The heating means that heats can also be configured by a separate member or apparatus.

  The pinching flat plate 90 has a shape corresponding to the contact surface of the film capacitor element 10 with the pinching flat plate 90 and a size capable of contacting the entire contact surface of the film capacitor element 10. It is desirable to integrally include extending portions 108 and 108 extending laterally from both side surfaces 21 and 21 where the gap 22 of the film capacitor element 10 is provided when contacting the capacitor element. The structure of 90 is not limited to this at all. That is, the shape of the pressing plate 90 may be different from the contact surface of the film capacitor element 10 with the pressing plate 90. Further, the size of the pressing plate 90 may be slightly smaller than the contact surface of the film capacitor element 10 with the pressing plate 90. Further, the extending portions 108, 108 extending laterally from the side surfaces 21, 21 where the gap 22 of the film capacitor element 10 is provided may be omitted from the pressing plate 90. However, even when the extending portions 108 are omitted, as shown in FIG. 10, the end portions 111 on both sides of the pressing plate 90 (only one end portion 111 is shown in FIG. 10). In the laminating direction of the metallized film 12 (laminated body), it is necessary to be positioned corresponding to the gap 22 provided on both side surfaces 21 of the film capacitor element 10 (only one side surface 21 is shown in FIG. 10).

  Further, the deformation preventing means is not limited to the illustrated clamping plate 90, and a gap formed between both ends in the width direction of the metallized film 12 by the pressure of the diaphragm 62 elastically deformed by compressed air. Various structures may be adopted as long as the structure has a structure that can prevent the deformation of the formation site.

  For example, as shown in FIG. 11, the deformation preventing means may be configured by flat plate-shaped deformation preventing plates 110 and 110 formed of a material having rigidity such as metal. These deformation prevention plates 110 and 110 are bonded to, for example, the diaphragm 62, and when the diaphragm 62 is elastically deformed by compressed air, the end portions on both sides in the width direction of the film capacitor element 10 and the diaphragm 62 are connected. By being interposed, the bending deformation of the gap forming portion of each metallized film 12 located at both ends in the width direction of the film capacitor element 10 is prevented, and the crushing deformation of the gap 22 is prevented. Is done. According to such a configuration, the film capacitor element 10 is more favorably pressed by the elastically deformed diaphragm 62 without being obstructed by the deformation preventing plates 110 and 110, and thus the inside of the film capacitor element 10. The removal of air and moisture from the water can be performed more reliably and efficiently.

  Further, when the deformation preventing means is constituted by such deformation preventing plates 110, 110, for example, as shown in FIG. 12, the deformation preventing plates 110, 110 are arranged so as to be slidable in the vertical direction. May be. That is, the groove portions 112 are respectively provided in portions of the peripheral wall portion 58 of the lower divided body 50 facing each other in the direction corresponding to the width direction of the film capacitor element 10 accommodated in the accommodating chamber 46, and each of the groove portions is provided. Each of the guide shafts 114 extending in the vertical direction is formed in 124. Then, one end of each deformation preventing plate 110 is inserted into each groove 112, and the guide shaft 114 is slidably inserted into the one end. As a result, each deformation prevention plate 110 can be slid in the vertical direction while being guided by the guide groove 114. According to such a structure, the deformation prevention plate 110 is interposed at a specific position between the both ends in the width direction of the film capacitor element 10 and the diaphragm 62 regardless of the bulging form of the diaphragm 62 when elastically deformed. Be made. As a result, the crushing deformation of the gap 22 provided on both side surfaces 21 and 21 in the width direction of the film capacitor element 10 can be prevented more effectively and reliably.

  In addition, when employ | adopting a structure as shown by FIG.11 and FIG.12, you may comprise the deformation | transformation prevention board 110 with a rectangular frame shape. In this case, the film capacitor in which the gap 22 is provided in the portion located on either side of either the length direction or the width direction of the frame body based on the pressure force of the elastically deformed diaphragm 62. While the diaphragm 62 is elastically deformed while being in contact with the two end portions of the element 10, the portions located on both sides in the other direction are arranged so as not to contact the film capacitor element 10. Will be allowed to.

  Further, the deformation preventing means does not necessarily need to be displaceable between the diaphragm 62 in the vacuum chamber 66 of the storage chamber 46 and the upper heating plate 70 as the regulating member, and the position is fixed in the vacuum chamber 66. May be arranged. However, even in that case, when the film capacitor element 10 is accommodated in the accommodating chamber 46, the film capacitor element 10 is positioned between the two ends where the gap 22 is formed and the diaphragm 62. Need to be arranged.

  Furthermore, as described above, the deformation preventing means may have elasticity or may not have elasticity. However, when the deformation preventing means has elasticity, it is elastically deformed following the elastic deformation of the diaphragm 62 by the compressed air, but the elastic deformation amount at that time is elastic so that it is smaller than the elastic deformation amount of the diaphragm 62. This is desirable. Accordingly, the material constituting the deformation preventing means is not particularly limited, but materials having elasticity and rigidity as described above are appropriately employed. Further, the shape of the deformation preventing means can be appropriately changed according to the size and shape of the film capacitor element 10.

  In addition, although not enumerated one by one, the present invention can be carried out in a mode to which various changes, modifications, improvements, etc. are added based on the knowledge of those skilled in the art. It goes without saying that all are included in the scope of the present invention without departing from the spirit of the present invention.

DESCRIPTION OF SYMBOLS 10 Film capacitor element 11 Polymerized substance 12 Metallized film 14a, 14b Protective film 16 Resin film 18 Metal vapor deposition film 21 Side surface 22 Crevice 23 Connection part 26 Film capacitor 28 Aging apparatus 32 Thermal aging processing machine 34 Heating press machine 46,92 accommodation Chamber 62 Diaphragm 66 Vacuum chamber 68 Pressure chamber 70 Upper heating plate 72 Rubber plate 76 Lower heating plate 82 Exhaust pipe 84 Air supply pipe 86 Vacuum pump 88 Compressor 90 Clamping plate

Claims (10)

(A) a laminate having a structure in which at least one dielectric film and at least one metal vapor-deposited film are alternately laminated, and a protective film disposed so as to cover the surface of the laminate in the stacking direction. A film capacitor element; (b) two metallicon electrodes respectively formed on corresponding side surfaces in a direction orthogonal to the stacking direction of the laminate; and (c) outward on each of the two side surfaces of the stack. A part of the metallicon electrode is formed so as to penetrate into a gap provided in an opening, and the metallicon electrode is configured to have a connection part that connects the metal vapor deposition film of the laminate. In film capacitors,
The film capacitor, wherein a length of the connecting portion in a direction corresponding to the two side surfaces of the laminated body is set to a value within a range of 0.1 to 5 mm. A laminated body having a structure in which at least one dielectric film and at least one metal vapor deposition film are alternately laminated, and a protective film disposed so as to cover the surface in the laminating direction of the laminated body; The laminate in which openings are formed on two corresponding side surfaces in a direction perpendicular to the stacking direction of the laminate in which an electrode is to be formed, and a gap allowing a part of the metallicon electrode to enter is located on the two side surfaces. In the film capacitor element provided at each end of the body,
The film capacitor element, wherein a length of the gap in a direction corresponding to the two side surfaces of the laminate is set to a value in a range of 0.1 to 5 mm. A laminated body having a structure in which at least one dielectric film and at least one metal vapor deposition film are alternately laminated, and a protective film disposed so as to cover the surface in the laminating direction of the laminated body; The laminate in which openings are formed on two corresponding side surfaces in a direction perpendicular to the stacking direction of the laminate in which an electrode is to be formed, and a gap allowing a part of the metallicon electrode to enter is located on the two side surfaces. A film capacitor element aging device for performing a thermal aging process on a film capacitor element provided at each end of the body,
A storage chamber for storing the film capacitor element;
Heating means for heating the film capacitor element housed in the housing chamber;
In the stacking direction of the dielectric film and the metal vapor deposition film in the stacked body constituting the film capacitor element stored in the storage chamber, the storage chamber is divided into two fluid-tightly, and the storage chamber A diaphragm defining a vacuum chamber in which the film capacitor element is accommodated and a compressed air chamber in which the film capacitor element is not accommodated;
The film capacitor element accommodated in the accommodating chamber is in contact with the surface opposite to the diaphragm side of the film capacitor element, and the displacement of the film capacitor element in the accommodating chamber to the opposite side of the diaphragm side is regulated. Regulatory means to
Exhaust means for discharging the air in the vacuum chamber of the storage chamber to bring the vacuum chamber into a vacuum state;
Compressed air is supplied into the compressed air chamber of the storage chamber, the diaphragm is displaced toward the vacuum chamber by the compressed air, and the diaphragm side of the film capacitor element stored in the storage chamber Compressed air supply means for pressurizing the surface of
The film capacitor element is disposed in the vacuum chamber of the storage chamber, and the surface of the film capacitor element in the vacuum chamber is pressurized by the diaphragm displaced by the compressed air. And a deformation preventing means interposed between the diaphragm and the diaphragm to prevent bending deformation of the gap forming portion of the laminate constituting the film capacitor element,
A device for aging a film capacitor element, comprising:   The deformation preventing means is disposed so as to be displaceable between the film capacitor element housed in the vacuum chamber of the housing chamber and the diaphragm, and a surface of the film capacitor element on the diaphragm side is formed by the diaphragm. The pressure-sensitive flat plate comprises a pressing plate that contacts the diaphragm side surface of the film capacitor element when pressed and presses the film capacitor element with the regulating means. Aging device for film capacitor elements.   The pinching flat plate has an extending portion extending outward from each of two side surfaces of the laminated body constituting the film capacitor element, and the gap forming portion of the laminated body at the extending portion. 5. The film capacitor element aging device according to claim 4, wherein bending deformation due to the applied pressure of the diaphragm is prevented.   4. The deformation preventing means is disposed between the film capacitor element and the diaphragm only between the end portion of the film capacitor element including the gap forming portion of the laminate and the diaphragm. The aging device for a film capacitor element according to any one of claims 5 to 5.   4. A contact portion including a contact surface with the film capacitor element in the regulating means is formed of an elastic body that is elastically deformed so as to allow distortion generated in the film capacitor element due to the pressure applied by the diaphragm. The aging device for a film capacitor element according to any one of claims 6 to 6. A laminated body having a structure in which at least one dielectric film and at least one metal vapor deposition film are alternately laminated, and a protective film disposed so as to cover the surface in the laminating direction of the laminated body; The laminate in which openings are formed on two corresponding side surfaces in a direction perpendicular to the stacking direction of the laminate in which an electrode is to be formed, and a gap allowing a part of the metallicon electrode to enter is located on the two side surfaces. A film capacitor element aging method for performing a thermal aging treatment on a film capacitor element provided at each end of the body,
Storing the film capacitor element in a storage chamber;
A surface on one side in the stacking direction of the dielectric film and the metal vapor deposition film in the film capacitor element housed in the housing chamber is brought into contact with a regulating member disposed in a fixed position in the housing chamber. The step of disposing the film capacitor element so that displacement to one side in the stacking direction in the accommodation chamber is regulated,
A first heat aging treatment step of evacuating the atmosphere in the accommodation chamber while heating the film capacitor element accommodated in the accommodation chamber;
The diaphragm disposed in the storage chamber is displaced by compressed air supplied into the storage chamber, so that the film capacitor element stored in the storage chamber is in contact with the regulating member. Deformation that pressurizes the other surface in the laminating direction with the diaphragm and prevents bending deformation due to the applied pressure of the diaphragm at the gap forming portion of the laminated body between the diaphragm and the film capacitor element. A second heat aging treatment step of heating while preventing the bending deformation of the laminate through intervening prevention means;
A method for aging a film capacitor element, comprising: A laminated body having a structure in which at least one dielectric film and at least one metal vapor deposition film are alternately laminated, and a protective film disposed so as to cover the surface in the laminating direction of the laminated body; The laminate in which openings are formed on two corresponding side surfaces in a direction perpendicular to the stacking direction of the laminate in which an electrode is to be formed, and a gap allowing a part of the metallicon electrode to enter is located on the two side surfaces. An apparatus for manufacturing a film capacitor element provided at each end of the body,
A first supply means for continuously supplying a long first belt-like body constituting a part of the protective film and continuously running in the longitudinal direction;
A plurality of element configuration units formed by stacking a plurality of the stacked bodies or by stacking the stacked bodies by winding, one surface in the stacking direction of the element configuration units being the first A placing means that is placed on the belt and sequentially placed so as to be positioned at a predetermined interval in the traveling direction of the first belt;
By continuously supplying a long second band-shaped body constituting the remaining part of the protective film and disposing it on the plurality of element constituting units placed on the first band-shaped body A second supply means for transporting a plurality of the element constituent units as a superposed product sandwiched between the first strip and the second strip in the traveling direction of the strips;
The heat aging treatment is performed on the site where the element constituent unit is present in the polymerized product in the middle of transporting the polymerized product conveyed by the second supply means. The aging device according to any one of the above;
The first located in the downstream of the aging device in the transport direction of the polymerized product and positioned between adjacent ones of the element constituent units of the polymerized product that has been heat-aged by the aging device. Cutting means for cutting the strip and the second strip and separating them as individual film capacitor elements,
An apparatus for manufacturing a film capacitor element, comprising: A laminated body having a structure in which at least one dielectric film and at least one metal vapor deposition film are alternately laminated, and a protective film disposed so as to cover the surface in the laminating direction of the laminated body; The laminate in which openings are formed on two corresponding side surfaces in a direction perpendicular to the stacking direction of the laminate in which an electrode is to be formed, and a gap allowing a part of the metallicon electrode to enter is located on the two side surfaces. A method of manufacturing a film capacitor element provided at each end of the body,
A step of continuously supplying a long first belt-like body constituting a part of the protective film and continuously running in the longitudinal direction;
A plurality of element configuration units formed by stacking a plurality of the stacked bodies or by stacking the stacked bodies by winding, one surface in the stacking direction of the element configuration units being the first A step of sequentially placing the first belt-like body on the first belt-like body so as to be overlaid on the belt-like body and at a predetermined interval in the traveling direction of the first belt-like body;
By continuously supplying a long second band-shaped body constituting the remaining part of the protective film and disposing it on the plurality of element constituting units placed on the first band-shaped body A step of transporting a plurality of the element constituting units as a superposed product sandwiched between the first strip and the second strip in the running direction of the strips;
In the course of transporting the polymerized product, a step of performing heat aging treatment on the site of the element constituent unit in the polymerized product by the method according to claim 8;
By cutting the first strip and the second strip located between adjacent ones of the element constituent units of the polymerized product subjected to the heat aging treatment, individual film capacitor elements are obtained. A process of separating,
A method for producing a film capacitor element, comprising:

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