US20180233290A1 - Structural capacitor and method for making the same - Google Patents
Structural capacitor and method for making the same Download PDFInfo
- Publication number
- US20180233290A1 US20180233290A1 US15/952,646 US201815952646A US2018233290A1 US 20180233290 A1 US20180233290 A1 US 20180233290A1 US 201815952646 A US201815952646 A US 201815952646A US 2018233290 A1 US2018233290 A1 US 2018233290A1
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- United States
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- electrodes
- positive
- alignment
- electrode
- dielectric layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/14—Organic dielectrics
- H01G4/16—Organic dielectrics of fibrous material, e.g. paper
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/14—Organic dielectrics
- H01G4/18—Organic dielectrics of synthetic material, e.g. derivatives of cellulose
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/20—Dielectrics using combinations of dielectrics from more than one of groups H01G4/02 - H01G4/06
- H01G4/203—Fibrous material or synthetic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
Definitions
- the present invention relates generally to capacitors and, more particularly, to a structural capacitor.
- pulsed power platforms that include components which carry structural loads.
- continuous fiber-reinforced, polymer-matrix composite materials have been used to create strong, stiff, and lightweight structures, such as vehicle frames and ballistic armor panels.
- Gains in overall platform efficiency are possible by creating a laminated composite material that can both carry mechanical loads as well as store and release electrical energy.
- the previously known designs include metallized polymer film electrodes that are interleaved between glass fiber-reinforced epoxy composite plies with the resulting stack of materials processed together to integrally bond the components together.
- the previously known methods include enveloping the materials in an evacuated bag so that the stack of laminated materials is subjected to atmospheric pressure.
- the bag with the contained stack is then placed in an autoclave, hot press, or convection oven to bond the layers together.
- Alignment is the key to both structural and electrical operation since the alignment and relative position of the layers determines both the laminate stiffness and strength as well as the energy density and capacitance of the capacitor. In some cases, the lateral shifting of the layers may result in misalignment of electrodes so that opposing electrodes are in direct contact with each other. This, in turn, shorts the capacitor rendering it inoperable.
- the present invention provides a structural capacitor and method for making the structural capacitor which overcomes the above mentioned disadvantages of the previously known devices and methods.
- the structural capacitor of the present invention includes a plurality of planar structural dielectric layers.
- Each layer has at least a first and a second spaced apart alignment hole which extends from a top and to a bottom of each layer.
- a plurality of planar positive electrodes and a plurality of planar negative electrodes are then provided.
- Each electrode furthermore, includes at least a first and second spaced apart alignment hole extending from a top and to a bottom of each electrode.
- the positive electrodes have an electrically conductive portion in electrical contact with the first hole but not the second hole while the negative electrodes have an electrically conductive portion in electrical contact with the second hole, but not the first hole.
- the electrodes consist of a thin metallization layer on the surface of a paper support layer. In another embodiment, the electrodes consist of a thin metallization layer on the surface of a polymer film.
- a positive alignment pin and a negative alignment pin are arranged in a spaced apart and parallel relationship so that the first alignment pin registers with the first holes in the dielectric layers and the electrodes while the negative alignment pin registers with the second holes in the dielectric layers and electrodes.
- the alignment pins maintain the alignment of the dielectric layers and electrodes relative to each other and enable the stacking of multiple layers for the capacitor while maintaining the alignment of the layers and electrodes relative to each other.
- the layers are sandwiched between a top plate and a bottom plate using conventional fasteners which engage the alignment pins.
- the resulting structure is then bonded together in any conventional fashion, such as a convection oven, hot press, and the like.
- FIG. 1 is a top plan view illustrating a preferred embodiment of the present invention
- FIG. 2 is an exploded sectional view taken substantially along line 2 - 2 in FIG. 1 and enlarged for clarity;
- FIG. 3 is a cross-sectional view of the structural capacitor during its assembly
- FIG. 4 is a view similar to FIG. 3 , but illustrating the completion of the stacking of the structural capacitor components sandwiched between top and bottom compression plates;
- FIG. 5 is a view similar to FIG. 4 , but illustrating the structural capacitor components enveloped in a vacuum bag;
- FIG. 6 is a view similar to FIG. 4 , but illustrating a modification thereof.
- FIG. 7 shows the final structural capacitor after removal from the compression plates and vacuum bag, and insertion of electrical pins.
- FIGS. 1 and 2 an exemplary structural capacitor 20 in accordance with the present invention is illustrated.
- the structural capacitor 20 is illustrated in FIG. 1 as being generally rectangular or square in shape.
- the structural capacitor 20 may be formed in any shape desired without deviation from the spirit or scope of the invention.
- the structural capacitor includes a plurality of dielectric layers 22 .
- These dielectric layers 22 are preferably formed from a polymer, such as an epoxy polymer.
- the dielectric layers 22 are preferably reinforced with fibers 24 such as glass fibers.
- the fibers 24 are preferably formed in an interwoven mesh as shown in FIG. 2 .
- a first alignment hole 26 and a spaced apart second alignment hole 28 are provided between a top surface 30 and a bottom surface 32 of each dielectric layer. These alignment holes 26 and 28 , furthermore, are at the same position for each of the dielectric layers 22 .
- the capacitor 20 comprises a plurality of positive electrodes 34 as well as a plurality of negative electrodes 36 .
- the positive electrodes 34 each have a pair of spaced apart alignment holes 38 and 40 , respectively, while, similarly, the negative electrodes 36 have a first and second alignment hole 42 and 44 , respectively.
- the first alignment holes 38 and 42 in the positive and negative electrodes 34 and 36 are aligned with the first alignment holes 26 in the dielectric layers 30 .
- the second alignment holes 40 and 44 in the positive and negative electrodes 34 and 36 are aligned with the second alignment holes 28 in the dielectric layers 22 .
- each electrode 34 and 36 includes a paper separator 46 having a conductive film 48 formed on at least a portion of one side of the paper separator 46 .
- the conductive film 48 on the positive electrodes 34 extends around and is in contact with the first alignment holes 38 in the positive electrode 34 , but not the second alignment hole 40 in the positive electrode 34 .
- the conductive film 48 on the negative electrode 36 extends around and is in contact with the second alignment hole 44 , but not the first alignment hole 42 .
- a positive alignment pin 50 and a negative alignment pin 52 are mounted to a bottom compression plate 54 so that the alignment pins 50 and 52 are spaced apart and parallel to each other.
- the dielectric layers 22 and alternating positive 34 and negative electrodes 36 are then sequentially stacked upon the alignment pins 50 and 52 with the alignment pin 52 extending through the first holes in the dielectric layers 22 and electrodes 34 and 36 , and the negative alignment pin 52 extending through the second holes in the dielectric layers 22 and positive and negative electrodes 34 and 36 .
- a top compression plate 56 is positioned over the upper ends of the alignment pins 50 and 52 thus sandwiching the layers and electrodes together as shown in FIG. 4 .
- a vacuum bag 58 preferably envelopes the dielectric capacitor 20 as well as the bottom plate 54 and top plate 56 .
- the vacuum bag 58 containing the dielectric capacitor is then placed in a convection oven, hot press, or the like in order to bond the dielectric layers 22 and electrodes 34 and 36 together.
- an elongated bus strip 60 extends around the first alignment pin 50 and is in electrical contact with the positive electrodes.
- a negative bus strip 62 is provided around the second alignment pin 52 and is in electrical contact with the negative electrodes.
- the bonded dielectric and electrode layers are removed from the compression plates and alignment pins and through the alignment holes are placed a positive electrode pin 70 and negative electrode pin 72 .
- a conductive fill material 64 may be inserted around the first electrode pin 70 to enhance the electrical contact between the first electrode pin 70 and the positive electrodes.
- fill material 64 is inserted around the second electrode pin 72 to enhance the electrical contact between the second electrode pin 72 and the negative electrodes.
- the fill material 64 may comprise metal solder, metal-laden polymer such as a conductive epoxy, a conductive paint such as silver paint, and/or the like.
- the electrode pins 70 and 72 protrude outwardly from one side, e.g. the top, of the structural capacitor 20 .
- These electrode pins 70 and 72 may be externally threaded for convenient connection to electrical cables.
- the threaded electrode pins 70 and 72 may be used in conjunction with mechanical fasteners, such as nuts, to mechanically integrate the structural capacitor 20 with its associated device.
- the present invention provides a simple yet effective structural capacitor which may contain many layers of dielectric material and electrodes without fear of misalignment of its layers.
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
Abstract
Description
- The invention described herein may be manufactured, used, and licensed by or for the United States Government.
- The present invention relates generally to capacitors and, more particularly, to a structural capacitor.
- In many situations it is desirable to create electrical capacitors that can not only store electrical energy, but also simultaneously carry mechanical loads. For example, in military applications, the storage and release of electrical pulsed power is useful in many different applications, such as electromagnetic rail guns, electromagnetic armor, short-pulse high-energy lasers, and the like. Cylindrically wound thin-film capacitors are one technology used to store and release electrical energy.
- There have been conventional pulsed power platforms that include components which carry structural loads. For example, continuous fiber-reinforced, polymer-matrix composite materials have been used to create strong, stiff, and lightweight structures, such as vehicle frames and ballistic armor panels.
- Gains in overall platform efficiency are possible by creating a laminated composite material that can both carry mechanical loads as well as store and release electrical energy. The previously known designs include metallized polymer film electrodes that are interleaved between glass fiber-reinforced epoxy composite plies with the resulting stack of materials processed together to integrally bond the components together.
- In order to form such laminated structural capacitors, the previously known methods include enveloping the materials in an evacuated bag so that the stack of laminated materials is subjected to atmospheric pressure. The bag with the contained stack is then placed in an autoclave, hot press, or convection oven to bond the layers together.
- These previously known methods, however, have only been effective to form structural laminated capacitors for a limited number of layers, e.g. no more than about five dielectric layers, since the layers are not laterally confined while being constructed or bonded together. Rather, under the compaction pressure, the layers of material move laterally and lose their relative alignment with each other.
- Alignment, however, is the key to both structural and electrical operation since the alignment and relative position of the layers determines both the laminate stiffness and strength as well as the energy density and capacitance of the capacitor. In some cases, the lateral shifting of the layers may result in misalignment of electrodes so that opposing electrodes are in direct contact with each other. This, in turn, shorts the capacitor rendering it inoperable.
- Other methods, such as closed molds and adhesive tape, have also been tried to limit lateral movement of the layers when constructing and bonding the layers of the structural capacitor together. These previously known attempts, however, have not proven successful except for only a limited number of layers of the capacitor. The limited number of capacitor layers, in turn, limits not only the structural strength of the capacitor, but also the capacitance and amount of energy which can be stored by the capacitor.
- The present invention provides a structural capacitor and method for making the structural capacitor which overcomes the above mentioned disadvantages of the previously known devices and methods.
- In brief, the structural capacitor of the present invention includes a plurality of planar structural dielectric layers. Each layer has at least a first and a second spaced apart alignment hole which extends from a top and to a bottom of each layer.
- A plurality of planar positive electrodes and a plurality of planar negative electrodes are then provided. Each electrode, furthermore, includes at least a first and second spaced apart alignment hole extending from a top and to a bottom of each electrode. The positive electrodes have an electrically conductive portion in electrical contact with the first hole but not the second hole while the negative electrodes have an electrically conductive portion in electrical contact with the second hole, but not the first hole. In one embodiment, the electrodes consist of a thin metallization layer on the surface of a paper support layer. In another embodiment, the electrodes consist of a thin metallization layer on the surface of a polymer film.
- In order to construct the structural capacitor, a positive alignment pin and a negative alignment pin are arranged in a spaced apart and parallel relationship so that the first alignment pin registers with the first holes in the dielectric layers and the electrodes while the negative alignment pin registers with the second holes in the dielectric layers and electrodes. The alignment pins maintain the alignment of the dielectric layers and electrodes relative to each other and enable the stacking of multiple layers for the capacitor while maintaining the alignment of the layers and electrodes relative to each other.
- After the desired number of dielectric layers and electrodes are stacked upon the alignment pins, the layers are sandwiched between a top plate and a bottom plate using conventional fasteners which engage the alignment pins. The resulting structure is then bonded together in any conventional fashion, such as a convection oven, hot press, and the like.
- A better understanding of the present invention will be had upon reference to the following detailed description when read in conjunction with the accompanying drawing, wherein like reference characters refer to like parts throughout the several views, and in which:
-
FIG. 1 is a top plan view illustrating a preferred embodiment of the present invention; -
FIG. 2 is an exploded sectional view taken substantially along line 2-2 inFIG. 1 and enlarged for clarity; -
FIG. 3 is a cross-sectional view of the structural capacitor during its assembly; -
FIG. 4 is a view similar toFIG. 3 , but illustrating the completion of the stacking of the structural capacitor components sandwiched between top and bottom compression plates; -
FIG. 5 is a view similar toFIG. 4 , but illustrating the structural capacitor components enveloped in a vacuum bag; -
FIG. 6 is a view similar toFIG. 4 , but illustrating a modification thereof; and -
FIG. 7 shows the final structural capacitor after removal from the compression plates and vacuum bag, and insertion of electrical pins. - With reference first to
FIGS. 1 and 2 , an exemplarystructural capacitor 20 in accordance with the present invention is illustrated. Thestructural capacitor 20 is illustrated inFIG. 1 as being generally rectangular or square in shape. However, thestructural capacitor 20 may be formed in any shape desired without deviation from the spirit or scope of the invention. - Still referring to
FIGS. 1 and 2 , the structural capacitor includes a plurality ofdielectric layers 22. Thesedielectric layers 22 are preferably formed from a polymer, such as an epoxy polymer. In order to enhance the structural strength of thedielectric layers 22, thedielectric layers 22 are preferably reinforced withfibers 24 such as glass fibers. Thefibers 24 are preferably formed in an interwoven mesh as shown inFIG. 2 . - A
first alignment hole 26 and a spaced apartsecond alignment hole 28 are provided between atop surface 30 and abottom surface 32 of each dielectric layer. Thesealignment holes dielectric layers 22. - Referring now particularly to
FIG. 2 , thecapacitor 20 comprises a plurality ofpositive electrodes 34 as well as a plurality ofnegative electrodes 36. Thepositive electrodes 34 each have a pair of spacedapart alignment holes negative electrodes 36 have a first andsecond alignment hole first alignment holes negative electrodes first alignment holes 26 in thedielectric layers 30. Similarly, thesecond alignment holes negative electrodes second alignment holes 28 in thedielectric layers 22. - Although the electrodes may take many forms, in a preferred embodiment, each
electrode paper separator 46 having aconductive film 48 formed on at least a portion of one side of thepaper separator 46. - Still referring to
FIG. 2 , theconductive film 48 on thepositive electrodes 34 extends around and is in contact with thefirst alignment holes 38 in thepositive electrode 34, but not thesecond alignment hole 40 in thepositive electrode 34. Conversely, theconductive film 48 on thenegative electrode 36 extends around and is in contact with thesecond alignment hole 44, but not thefirst alignment hole 42. - With reference now to
FIGS. 2 and 3 , in order to construct thestructural capacitor 20, apositive alignment pin 50 and anegative alignment pin 52 are mounted to abottom compression plate 54 so that thealignment pins dielectric layers 22 and alternating positive 34 andnegative electrodes 36 are then sequentially stacked upon thealignment pins alignment pin 52 extending through the first holes in thedielectric layers 22 andelectrodes negative alignment pin 52 extending through the second holes in thedielectric layers 22 and positive andnegative electrodes dielectric layers 22 andelectrodes alignment pins top compression plate 56 is positioned over the upper ends of thealignment pins FIG. 4 . - With reference now to
FIG. 5 , in order to bond thedielectric layers 22 andelectrodes vacuum bag 58 preferably envelopes thedielectric capacitor 20 as well as thebottom plate 54 andtop plate 56. Thevacuum bag 58 containing the dielectric capacitor is then placed in a convection oven, hot press, or the like in order to bond thedielectric layers 22 andelectrodes - With reference now to
FIG. 6 , in order to ensure a sound electrical contact between the alignment pins 50 and 52 and their associatedelectrodes elongated bus strip 60 extends around thefirst alignment pin 50 and is in electrical contact with the positive electrodes. Similarly, anegative bus strip 62 is provided around thesecond alignment pin 52 and is in electrical contact with the negative electrodes. - With reference now to
FIG. 7 , to complete the structural capacitor, the bonded dielectric and electrode layers are removed from the compression plates and alignment pins and through the alignment holes are placed apositive electrode pin 70 andnegative electrode pin 72. Aconductive fill material 64 may be inserted around thefirst electrode pin 70 to enhance the electrical contact between thefirst electrode pin 70 and the positive electrodes. Similarly, fillmaterial 64 is inserted around thesecond electrode pin 72 to enhance the electrical contact between thesecond electrode pin 72 and the negative electrodes. Thefill material 64 may comprise metal solder, metal-laden polymer such as a conductive epoxy, a conductive paint such as silver paint, and/or the like. - As shown in
FIG. 7 , the electrode pins 70 and 72 protrude outwardly from one side, e.g. the top, of thestructural capacitor 20. These electrode pins 70 and 72 may be externally threaded for convenient connection to electrical cables. Alternatively, the threaded electrode pins 70 and 72 may be used in conjunction with mechanical fasteners, such as nuts, to mechanically integrate thestructural capacitor 20 with its associated device. - From the foregoing, it can be seen that the present invention provides a simple yet effective structural capacitor which may contain many layers of dielectric material and electrodes without fear of misalignment of its layers. Having described our invention, however, many modifications thereto will become apparent to those skilled in the art to which it pertains without deviation from the spirit of the invention as defined by the scope of the appended claims.
Claims (20)
Priority Applications (1)
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US15/952,646 US20180233290A1 (en) | 2015-02-27 | 2018-04-13 | Structural capacitor and method for making the same |
Applications Claiming Priority (2)
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US14/633,616 US9959974B2 (en) | 2015-02-27 | 2015-02-27 | Method for making a structural capacitor |
US15/952,646 US20180233290A1 (en) | 2015-02-27 | 2018-04-13 | Structural capacitor and method for making the same |
Related Parent Applications (1)
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US14/633,616 Division US9959974B2 (en) | 2015-02-27 | 2015-02-27 | Method for making a structural capacitor |
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US20180233290A1 true US20180233290A1 (en) | 2018-08-16 |
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US14/633,616 Active 2035-11-27 US9959974B2 (en) | 2015-02-27 | 2015-02-27 | Method for making a structural capacitor |
US15/952,646 Abandoned US20180233290A1 (en) | 2015-02-27 | 2018-04-13 | Structural capacitor and method for making the same |
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US14/633,616 Active 2035-11-27 US9959974B2 (en) | 2015-02-27 | 2015-02-27 | Method for making a structural capacitor |
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Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
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EP2983185A1 (en) * | 2014-08-07 | 2016-02-10 | Siemens Aktiengesellschaft | Pressure tolerant multilayer power capacitor assembly and assembly method |
US9959974B2 (en) * | 2015-02-27 | 2018-05-01 | The United States Of America As Represented By The Secretary Of The Army | Method for making a structural capacitor |
US10186384B2 (en) * | 2015-12-31 | 2019-01-22 | Honeywell Federal Manufacturing & Technologies, Llc | Carbon fiber and parylene structural capacitor |
GB2574653B (en) * | 2018-06-14 | 2020-09-09 | Knowles (Uk) Ltd | Capacitor having an electrical termination |
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- 2015-02-27 US US14/633,616 patent/US9959974B2/en active Active
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US3278815A (en) * | 1961-01-11 | 1966-10-11 | Mallory & Co Inc P R | Electrical capacitor with a boron nitride dielectric |
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US20160254093A1 (en) | 2016-09-01 |
US9959974B2 (en) | 2018-05-01 |
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