JPWO2014103756A1 - Gas barrier film - Google Patents

Abstract

A gas barrier film having low water vapor transmission rate and high impact resistance is provided. The gas barrier film includes a base material, a barrier layer containing silicon, oxygen and carbon formed on one surface of the base material, and an organic layer. The barrier layer has the following conditions: (i) the thickness of the barrier layer In the region of 90% or more, the order is (atomic ratio of oxygen), (atomic ratio of silicon), (atomic ratio of carbon) in descending order. (Ii) The carbon distribution curve has at least two extreme values. (Iii) The absolute value of the difference between the maximum value and the minimum value of the atomic ratio of carbon in the carbon distribution curve is 3 at% or more. A gas barrier film that meets all these requirements.

Description

  The present invention relates to a gas barrier film. More specifically, the present invention relates to a gas barrier film having a low water vapor transmission rate.

  Conventionally, various studies have been made on a film having a property of blocking permeation of water vapor and oxygen, that is, a gas barrier property. In such examination, in order to improve the gas barrier property of a film, the technique which forms an inorganic layer by methods, such as sputtering and a plasma CVD method, is proposed (Unexamined-Japanese-Patent No. 6-234186).

  In recent years, in addition to demands for weight reduction and size increase, long-term reliability, high degree of freedom in shape, and the ability to display curved surfaces have been added, resulting in a glass substrate that is heavy, easily broken, and difficult to increase in area. Instead, film base materials such as transparent plastics are beginning to be adopted.

  However, a film substrate such as a transparent plastic has a problem that the gas barrier property is inferior to glass. If a base material with inferior gas barrier properties is used, water vapor or air will permeate, and for example, the function in the electronic device will be degraded.

As gas barrier films used for packaging materials and liquid crystal display elements, those obtained by depositing silicon oxide or aluminum oxide on plastic films are known. However, in those techniques, only a water vapor barrier property of about 1 g / m ² / day is obtained. On the other hand, in recent years, the liquid crystal display has been increased in size, developed as a high-definition display, etc., and the gas barrier performance to the film substrate is about 0.1 g / m ² / day for water vapor permeability. ^The demand has risen to the order of ⁻⁵ to 10 ⁻⁶ g / m ² / day.

  In order to solve the above problem, Japanese Patent Application Laid-Open No. 2005-288851 describes a polymer multilayer (PML) technique. This technique applies a coating consisting of a polymer layer and an aluminum oxide layer to a flexible substrate and seals the substrate. Both deposition processes can be operated at very high speeds using web processing equipment. It has been disclosed that the resistance to water and oxygen permeability is improved by 3 to 4 orders of magnitude compared to uncoated PET membranes.

  In such polymer multilayer techniques, the polymer layer may work to mask any defects in adjacent ceramic layers and reduce the diffusion rate of oxygen and water vapor through the channels created by these defects in the barrier layer. Has been suggested. However, since the interface between the polymer layer and the aluminum oxide layer is generally weak due to the incompatibility of adjacent materials, there is a problem that it is easy to peel off and sufficient barrier ability cannot be obtained during long-term storage. It was.

  On the other hand, Japanese Patent Application Laid-Open No. 2012-84306 reports an organic EL device having a gas barrier layer containing silicon, oxygen, and carbon with a specific composition. It is disclosed that the gas barrier layer has a high gas barrier property, and the gas barrier property is hardly lowered even when the film is bent, and can be formed in a short time by a simple process.

  However, the gas barrier layer described in JP 2012-84306 A has strong performance such as bending, but it has been found that cracks are likely to occur when it hits other objects and is inferior in impact resistance. When the impact resistance is low, the handling property when assembling with the environmental device in the next step is poor. Therefore, there is still a need for a gas barrier film that has higher water vapor permeability, can suppress and prevent generation of cracks, and can maintain high gas barrier properties.

  Accordingly, the present invention has been made in view of the above circumstances, and an object thereof is to provide a gas barrier film having a low water vapor transmission rate and a high impact resistance.

  As a result of intensive studies to solve the above problems, the present inventors have found that the above problems can be solved by combining a barrier layer containing silicon, oxygen and carbon with a specific composition and an organic layer, The present invention has been completed.

That is, the above objects are a gas barrier film having a base material, a barrier layer containing silicon, oxygen, and carbon and an organic layer formed on at least one surface of the base material,
The barrier layer has the following conditions (i) to (iii):
(I) The distance (L) from the surface of the barrier layer in the thickness direction of the barrier layer and the ratio of the amount of silicon atoms to the total amount of silicon atoms, oxygen atoms, and carbon atoms (atom ratio of silicon) A silicon distribution curve showing a relationship, an oxygen distribution curve showing a relationship between the L and the ratio of the amount of oxygen atoms to the total amount of silicon atoms, oxygen atoms, and carbon atoms (atomic ratio of oxygen), and the L and silicon atoms In the carbon distribution curve showing the relationship between the ratio of the amount of carbon atoms to the total amount of oxygen atoms, and carbon atoms (the atomic ratio of carbon),
In the region of 90% or more of the film thickness of the barrier layer, the order is (atomic ratio of oxygen), (atomic ratio of silicon), (atomic ratio of carbon) from the largest.
(Ii) the carbon distribution curve has at least two extreme values;
(Iii) The absolute value of the difference between the maximum value and the minimum value of the atomic ratio of carbon in the carbon distribution curve is 3 at% or more.
It can be achieved by a gas barrier film that satisfies the above.

It is a schematic diagram which shows an example of the manufacturing apparatus which can be utilized suitably in order to manufacture the barrier layer which concerns on this invention, 1 is a gas-barrier film, 2 is a base material, 3 is a barrier layer Yes, 31 is a manufacturing apparatus, 32 is a delivery roller, 33, 34, 35 and 36 are transport rollers, 39 and 40 are film forming rollers, 41 is a gas supply pipe, 42 is A power source for generating plasma, 43 and 44 are magnetic field generators, and 45 is a winding roller. It is a typical perspective view which shows the principal part of the organic layer formation unit of the manufacturing apparatus used for manufacture of the gas barrier film which concerns on embodiment of this invention, 126 is a drum, 136 is a control part, 150 is an organic layer A raw material vapor deposition unit, 152 is a pipe, 154 is an organic layer raw material supply unit, 156 is a curing unit, 156a is UV light, 160 is a film forming electrode, 170 is a tank, 172 is a syringe pump, 174 is a pipe, 176 is a liquid injection unit, 178 is a gas supply unit, 176a is a droplet injection port, 178 is a gas supply unit, and 180 is a heating plate. Ω is the direction of rotation and Z is the substrate. 3 is a glass of a carbon distribution curve, an oxygen distribution curve, and a silicon distribution curve of the barrier layer of Example 1.

The present invention relates to a gas barrier film having a base material, a barrier layer containing silicon, oxygen and carbon (hereinafter also simply referred to as “barrier layer”) and an organic layer formed on at least one surface of the base material. It is. Here, the barrier layer satisfies all of the following conditions (i) to (iii):
(I) The distance (L) from the surface of the barrier layer in the thickness direction of the barrier layer and the ratio of the amount of silicon atoms to the total amount of silicon atoms, oxygen atoms, and carbon atoms (atom ratio of silicon) A silicon distribution curve showing a relationship, an oxygen distribution curve showing a relationship between the L and the ratio of the amount of oxygen atoms to the total amount of silicon atoms, oxygen atoms, and carbon atoms (atomic ratio of oxygen), and the L and silicon atoms In the carbon distribution curve showing the relationship between the ratio of the amount of carbon atoms to the total amount of oxygen atoms, and carbon atoms (the atomic ratio of carbon),
In the region of 90% or more of the film thickness of the barrier layer, the order is (oxygen atomic ratio), (silicon atomic ratio), (carbon atomic ratio) in descending order;
(Ii) the carbon distribution curve has at least two extreme values; and (iii) the absolute value of the difference between the maximum value and the minimum value of the atomic ratio of carbon in the carbon distribution curve is 3 at% or more.

  The present invention is characterized in that a specific barrier layer that satisfies all the above conditions (i) to (iii) is combined with an organic layer. The gas barrier film of the present invention having such a configuration has a low water vapor transmission rate and a high impact resistance.

  When the barrier layer according to the present invention is used alone, the impact resistance is low, and when it hits another object, a crack is generated and the gas barrier property is lowered. If the impact resistance is low, the handling property when assembling (assembling) the environmental device in the next process is poor. On the other hand, when the organic layer according to the present invention is combined with the barrier layer according to the present invention, surprisingly, the impact resistance is improved and the occurrence of cracks is suppressed even when hitting other objects.・ Can be prevented. Here, the mechanism for exerting the above-described effects by the configuration of the present invention is presumed as follows. The present invention is not limited to the following. That is, in the barrier layer according to the present invention, carbon atoms are present in addition to silicon atoms and oxygen atoms. Among these, gas barrier properties can be imparted by the presence of silicon atoms and oxygen atoms, and by the presence of carbon atoms. Flexibility can be imparted to the barrier layer. For this reason, the barrier layer according to the present invention has gas barrier properties and flexibility. However, in the barrier layer according to the present invention, the element ratio changes in the film thickness direction and the surface direction. Therefore, when the surface of the barrier layer is viewed microscopically, a hard part (for example, a part having a low carbon content) It seems that the soft part (for example, part with high carbon content) is scattered. Therefore, when stress is applied to the film, it is considered that the stress is not easily relieved in the hard part of the barrier layer, and cracks are likely to occur. That is, when the barrier layer according to the present invention is present alone, the impact resistance is low, cracks are generated, and the gas barrier property is lowered. On the other hand, although the organic layer according to the present invention has a low gas barrier property, it has a network structure, so it has high impact resistance, for example, even when an impact is given during device assembly or transportation, Cracks are less likely to occur. For this reason, the present invention has found that by making a film having a barrier layer and an organic layer, the organic layer can relieve stress, relieve impact on the barrier layer, and can be a film having high impact resistance. It is a thing. In addition, when the carbon portion existing in the barrier layer and the organic compound in the organic layer according to the present invention interact with each other, when the two are adjacent to each other, the barrier layer and the organic layer are firmly adhered, and these layers are laminated. Even in this case, gas (for example, water vapor or oxygen) does not enter between both layers. For this reason, the gas barrier film of the present invention can synergistically improve the gas barrier property (for example, low water vapor transmission rate) as compared with the case where the barrier layer and the organic layer are each used alone.

  As described above, the film according to the present invention has a low water vapor transmission rate and excellent impact resistance. Therefore, even when an impact is given, for example, during device assembly or transportation, Generation | occurrence | production is suppressed and prevented, and the gas barrier film of this invention can maintain the outstanding gas barrier property (for example, low water vapor permeability and oxygen permeability). For this reason, the gas barrier film of the present invention can be suitably applied to packages such as electronic devices that require high gas barrier properties, and electronic devices such as photoelectric conversion elements, organic electroluminescence (EL) elements, and liquid crystal display elements.

  Hereinafter, preferred embodiments of the present invention will be described. In addition, this invention is not limited only to the following embodiment. In addition, the dimensional ratios in the drawings are exaggerated for convenience of explanation, and may be different from the actual ratios.

  In the present specification, “X to Y” indicating a range means “X or more and Y or less”, and “weight” and “mass”, “wt%” and “mass%”, “part by weight” and “ “Part by mass” is treated as a synonym. Unless otherwise specified, measurement of operation and physical properties is performed under conditions of room temperature (20 to 25 ° C.) / Relative humidity 40 to 50%.

<Gas barrier film>
The gas barrier film of the present invention has a barrier layer and an organic layer on a substrate. Here, the stacking order of the barrier layer and the organic layer is not particularly limited, but the barrier layer and the organic layer are preferably stacked in this order on the substrate. With such a structure, the gas barrier property due to the barrier layer is more effectively exhibited, and the organic layer can relieve stress on the hard part of the barrier layer due to impact (for example, the part having a low carbon content), Generation of cracks can be more effectively suppressed / prevented.

  Moreover, although the gas barrier film of this invention has a base material, a barrier layer, and an organic layer essential, it may further contain another member. The gas barrier film of the present invention is, for example, between the substrate and the barrier layer or the organic layer; between the barrier layer and the organic layer; or on the other surface where the barrier layer or the organic layer is not formed. You may have another member. Here, the other members are not particularly limited, and members used for conventional gas barrier films can be used similarly or appropriately modified. Specifically, an inorganic layer such as silicon oxynitride, silicon dioxide, aluminum oxide, or aluminum silicon oxide, an underlayer, an anchor coat layer, a bleed-out prevention layer, and a functional layer of a protective layer, a moisture absorption layer, or an antistatic layer Etc.

  In the present invention, the barrier layer and the organic layer may each exist as a single layer or may have a laminated structure of two or more layers. In the latter case, one or a plurality of barrier layers or organic layers may exist as one unit, or two or more of the above units may be laminated.

  Furthermore, in this invention, the barrier layer and the organic layer should just be formed in the at least one surface of the base material. For this reason, the gas barrier film of the present invention includes both a form in which the barrier layer and the organic layer are formed on one surface of the substrate and a form in which the barrier layer and the organic layer are formed on both surfaces of the substrate.

[Base material]
In the gas barrier film according to the present invention, a plastic film or a sheet is usually used as a substrate, and a film or sheet made of a colorless and transparent resin is preferably used. The plastic film to be used is not particularly limited in material, thickness and the like as long as it can hold a barrier layer, a hard coat layer, and the like, and can be appropriately selected according to the purpose of use. Specific examples of the plastic film include polyester resin, methacrylic resin, methacrylic acid-maleic acid copolymer, polystyrene resin, transparent fluororesin, polyimide, fluorinated polyimide resin, polyamide resin, polyamideimide resin, and polyetherimide. Resin, Cellulose acylate resin, Polyurethane resin, Polyether ether ketone resin, Polycarbonate resin, Alicyclic polyolefin resin, Polyarylate resin, Polyether sulfone resin, Polysulfone resin, Cycloolefin copolymer, Fluorene ring modified polycarbonate resin, Alicyclic Examples thereof include thermoplastic resins such as modified polycarbonate resins, fluorene ring-modified polyester resins, and acryloyl compounds.

  When the gas barrier film according to the present invention is used as a substrate of an electronic device such as an organic EL element, the base material is preferably made of a material having heat resistance. Specifically, a resin base material having a linear expansion coefficient of 15 ppm / K or more and 100 ppm / K or less and a glass transition temperature (Tg) of 100 ° C. or more and 300 ° C. or less is used. The base material satisfies the requirements for use as a laminated film for electronic parts and displays. That is, when the gas barrier film of the present invention is used for these applications, the gas barrier film may be exposed to a process at 150 ° C. or higher. In this case, when the coefficient of linear expansion of the base material in the gas barrier film exceeds 100 ppm / K, the substrate dimensions are not stable when the gas barrier film is passed through the temperature process as described above, and thermal expansion and contraction occur. Inconvenience that the shut-off performance is deteriorated or a problem that the thermal process cannot withstand is likely to occur. If it is less than 15 ppm / K, the film may break like glass and the flexibility may deteriorate.

  The Tg and the linear expansion coefficient of the substrate can be adjusted with an additive or the like. More preferable specific examples of the thermoplastic resin that can be used as the substrate include, for example, polyethylene terephthalate (PET: 70 ° C.), polyethylene naphthalate (PEN: 120 ° C.), polycarbonate (PC: 140 ° C.), and alicyclic. Polyolefin (for example, ZEONOR (registered trademark) 1600: 160 ° C, manufactured by Nippon Zeon Co., Ltd.), polyarylate (PAr: 210 ° C), polyethersulfone (PES: 220 ° C), polysulfone (PSF: 190 ° C), cycloolefin copolymer (COC: Compound described in JP-A No. 2001-150584: 162 ° C.), polyimide (for example, Neoprim (registered trademark): 260 ° C. manufactured by Mitsubishi Gas Chemical Co., Ltd.), fluorene ring-modified polycarbonate (BCF-PC: JP In 2000-227603 Listed compound: 225 ° C.), alicyclic modified polycarbonate (IP-PC: compound described in JP 2000-227603 A: 205 ° C.), acryloyl compound (compound described in JP 2002-80616 A: 300 ° C.) And the like) (Tg is shown in parentheses).

  When the gas barrier film according to the present invention is used in combination with a polarizing plate, it is preferably arranged so that the barrier layer of the gas barrier film faces the inside of the cell. More preferably, the organic layer of the gas barrier film is disposed on the innermost side of the cell (adjacent to the element). At this time, since the gas barrier film is disposed inside the cell from the polarizing plate, the retardation value of the gas barrier film is important. The usage form of the gas barrier film in such an embodiment includes a gas barrier film using a base film having a retardation value of 10 nm or less and a circularly polarizing plate (¼ wavelength plate + (½ wavelength plate) + straight line. The polarizing plate is preferably used in combination with a linear polarizing plate in combination with a gas barrier film using a base film having a retardation value of 100 nm to 180 nm, which can be used as a quarter wavelength plate. .

  Examples of the substrate film having a retardation of 10 nm or less include, for example, cellulose triacetate (Fuji Film Co., Ltd .: Fujitac (registered trademark)), polycarbonate (Teijin Chemicals Co., Ltd .: Pure Ace (registered trademark), Kaneka Corporation): Elmec (registered trademark)), cycloolefin polymer (manufactured by JSR Corporation: Arton (registered trademark), Nippon Zeon Corporation: ZEONOR (registered trademark)), cycloolefin copolymer (manufactured by Mitsui Chemicals, Inc .: APPEL (registered trademark)) (Pellets), manufactured by Polyplastics Co., Ltd .: Topas (registered trademark) (pellets)), polyarylate (manufactured by Unitika Co., Ltd .: U100 (pellets)), transparent polyimide (manufactured by Mitsubishi Gas Chemical Co., Ltd .: Neoprim (registered trademark)) Etc.

  Moreover, as a quarter wavelength plate, the film adjusted to the desired retardation value by extending | stretching said film suitably can be used.

  Since the gas barrier film according to the present invention is used as an electronic device such as an organic EL element, the plastic film is preferably transparent. That is, the light transmittance is usually 80% or more, preferably 85% or more, and more preferably 90% or more. The light transmittance is calculated by measuring the total light transmittance and the amount of scattered light using the method described in JIS K7105: 1981, that is, using an integrating sphere light transmittance measuring device, and subtracting the diffuse transmittance from the total light transmittance. can do.

  However, even when the gas barrier film according to the present invention is used for display applications, transparency is not necessarily required when it is not installed on the observation side. Therefore, in such a case, an opaque material can be used as the plastic film. Examples of the opaque material include polyimide, polyacrylonitrile, and known liquid crystal polymers.

  The thickness of the plastic film used for the gas barrier film according to the present invention is not particularly limited because it is appropriately selected depending on the use, but is typically 1 to 800 μm, preferably 10 to 200 μm. These plastic films may have functional layers such as a transparent conductive layer and a primer layer. As the functional layer, in addition to those described above, those described in paragraph numbers “0036” to “0038” of JP-A-2006-289627 can be preferably employed.

  The substrate preferably has a high surface smoothness. As the surface smoothness, those having an average surface roughness (Ra) of 2 nm or less are preferable. Although there is no particular lower limit, it is practically 0.01 nm or more. If necessary, both surfaces of the substrate, at least the side on which the barrier layer is provided, may be polished to improve smoothness.

  In addition, the base material using the above-described resins or the like may be an unstretched film or a stretched film.

  The base material used in the present invention can be produced by a conventionally known general method. For example, an unstretched substrate that is substantially amorphous and not oriented can be produced by melting a resin as a material with an extruder, extruding it with an annular die or a T-die, and quenching. Further, the unstretched base material is subjected to a known method such as uniaxial stretching, tenter-type sequential biaxial stretching, tenter-type simultaneous biaxial stretching, tubular simultaneous biaxial stretching, etc. A stretched substrate can be produced by stretching in the direction perpendicular to the flow direction of the substrate (horizontal axis). The draw ratio in this case can be appropriately selected according to the resin as the raw material of the substrate, but is preferably 2 to 10 times in the vertical axis direction and the horizontal axis direction.

  At least on the side of the substrate on which the barrier layer according to the present invention is provided, various known treatments for improving adhesion, such as corona discharge treatment, flame treatment, oxidation treatment, or plasma treatment, and lamination of a primer layer described later Etc. are preferably performed, and it is more preferable to perform the above treatment in combination as necessary.

[Barrier layer]
The barrier layer according to the present invention is a layer formed on one surface of the substrate and is a layer containing silicon, oxygen, and carbon. The barrier layer satisfies the above conditions (i) to (iii).

  First, the barrier layer comprises (i) a distance (L) from the surface of the barrier layer in the film thickness direction of the barrier layer, and a ratio of the amount of silicon atoms to the total amount of silicon atoms, oxygen atoms, and carbon atoms (silicon An oxygen distribution curve indicating the relationship between the L and the ratio of the amount of oxygen atoms to the total amount of silicon atoms, oxygen atoms, and carbon atoms (atomic ratio of oxygen), And 90% or more of the thickness of the barrier layer in a carbon distribution curve showing a relationship between the L and the ratio of the amount of carbon atoms to the total amount of silicon atoms, oxygen atoms, and carbon atoms (carbon atomic ratio) ( In the range of (upper limit: 100%), (atomic ratio of oxygen), (atomic ratio of silicon), and (atomic ratio of carbon) increase in this order (atomic ratio is O> Si> C). When the above condition (i) is not satisfied, the gas barrier property and flexibility of the obtained gas barrier film are insufficient. Here, in the carbon distribution curve, the relationship of the above (atomic ratio of oxygen), (atomic ratio of silicon) and (atomic ratio of carbon) is at least 90% or more (upper limit: 100%) of the thickness of the barrier layer. ) And more preferably at least 93% or more (upper limit: 100%). Here, “at least 90% or more of the thickness of the barrier layer” does not need to be continuous in the barrier layer, and only needs to satisfy the above-described relationship at a portion of 90% or more.

  In the barrier layer, (ii) the carbon distribution curve has at least two extreme values. The barrier layer preferably has at least three extreme values in the carbon distribution curve, more preferably at least four extreme values, but may have five or more extreme values. When the extreme value of the carbon distribution curve is 1 or less, the gas barrier property when the obtained gas barrier film is bent is insufficient. The upper limit of the extreme value of the carbon distribution curve is not particularly limited, but is preferably 30 or less, more preferably 25 or less, for example. Since the number of extreme values is also caused by the film thickness of the barrier layer, it cannot be specified unconditionally.

  Here, in the case of having at least three extreme values, the distance from the surface of the barrier layer in the film thickness direction of the barrier layer at one extreme value of the carbon distribution curve and the extreme value adjacent to the extreme value. The absolute value of the difference of (L) (hereinafter, also simply referred to as “distance between extreme values”) is preferably 200 nm or less, more preferably 100 nm or less, and particularly preferably 75 nm or less. preferable. With such a distance between extreme values, there are portions having a large carbon atom ratio (maximum value) in the barrier layer at an appropriate period, so that appropriate flexibility is imparted to the barrier layer, and the gas barrier film Generation of cracks during bending can be more effectively suppressed / prevented. In this specification, the “extreme value” refers to the maximum value or the minimum value of the atomic ratio of the element to the distance (L) from the surface of the barrier layer in the film thickness direction of the barrier layer. Further, in this specification, the “maximum value” is a point where the value of the atomic ratio of an element (oxygen, silicon, or carbon) changes from an increase to a decrease when the distance from the surface of the barrier layer is changed, And the value of the atomic ratio of the element at the position where the distance from the surface of the barrier layer in the thickness direction of the barrier layer from the point is further changed within the range of 4 to 20 nm than the value of the atomic ratio of the element at that point. It means a point that decreases by 3 at% or more. That is, when changing in the range of 4 to 20 nm, the atomic ratio of the elements should be reduced by 3 at% or more in any range. Similarly, the “minimum value” in this specification is a point in which the value of the atomic ratio of an element (oxygen, silicon, or carbon) changes from decrease to increase when the distance from the surface of the barrier layer is changed. In addition, the atomic ratio value of the element at a position where the distance from the surface of the barrier layer in the thickness direction of the barrier layer from the point is further changed by 4 to 20 nm is 3 at%. This is the point that increases. That is, when changing in the range of 4 to 20 nm, the atomic ratio value of the element only needs to increase by 3 at% or more in any range. Here, the lower limit of the distance between the extreme values in the case of having at least three extreme values is particularly high because the smaller the distance between the extreme values, the higher the effect of suppressing / preventing crack generation when the gas barrier film is bent. Although not limited, in consideration of the flexibility of the barrier layer, the effect of suppressing / preventing cracks, thermal expansion, and the like, the thickness is preferably 10 nm or more, and more preferably 30 nm or more.

Further, the barrier layer has (iii) the absolute value of the difference between the maximum value and the minimum value of the atomic ratio of carbon in the carbon distribution curve (hereinafter, also simply referred to as “C _max −C _min difference”) of 3 at% or more. . When the absolute value is less than 3 at%, the gas barrier property is insufficient when the obtained gas barrier film is bent. The C _max -C _min difference is preferably 5 at% or more, more preferably 7 at% or more, and particularly preferably 10 at% or more. By setting the C _max −C _min difference, the gas barrier property can be further improved. In the present specification, the “maximum value” is the atomic ratio of each element that is maximum in the distribution curve of each element, and is the highest value among the maximum values. Similarly, in this specification, the “minimum value” is the atomic ratio of each element that is the minimum in the distribution curve of each element, and is the lowest value among the minimum values. Here, the upper limit of the C _max -C _min difference is not particularly limited, but it is preferably 50 at% or less, and 40 at% or less in consideration of the effect of suppressing / preventing crack generation when the gas barrier film is bent. It is more preferable that

  In the present invention, the oxygen distribution curve of the barrier layer preferably has at least one extreme value, more preferably has at least two extreme values, and more preferably has at least three extreme values. When the oxygen distribution curve has at least one extreme value, the gas barrier property when the obtained gas barrier film is bent is further improved. The upper limit of the extreme value of the oxygen distribution curve is not particularly limited, but is preferably 20 or less, more preferably 10 or less, for example. Even in the number of extreme values of the oxygen distribution curve, there is a portion caused by the thickness of the barrier layer, and it cannot be defined unconditionally. In the case of having at least three extreme values, a difference in distance from the surface of the barrier layer in the film thickness direction of the barrier layer at one extreme value of the oxygen distribution curve and an extreme value adjacent to the extreme value. Are preferably 200 nm or less, more preferably 100 nm or less. With such a distance between extreme values, the occurrence of cracks during bending of the gas barrier film can be more effectively suppressed / prevented. Here, the lower limit of the distance between the extreme values in the case of having at least three extreme values is not particularly limited, but considering the improvement effect of crack generation suppression / prevention when the gas barrier film is bent, the thermal expansion property, etc. The thickness is preferably 10 nm or more, and more preferably 30 nm or more.

In addition, in the present invention, the absolute value of the difference between the maximum value and the minimum value of the atomic ratio of oxygen in the oxygen distribution curve of the barrier layer (hereinafter also simply referred to as “O _max −O _min difference”) is 3 at% or more. Is preferably 5 at%, more preferably 6 at% or more, and particularly preferably 7 at% or more. When the absolute value is 3 at% or more, the gas barrier property when the obtained gas barrier film is bent is further improved. Here, the upper limit of the O _max -O _min difference is not particularly limited, but it is preferably 50 at% or less, and 40 at% or less in consideration of the effect of suppressing / preventing crack generation when the gas barrier film is bent. It is more preferable that

In the present invention, the absolute value of the difference between the maximum value and the minimum value of the atomic ratio of silicon in the silicon distribution curve of the barrier layer (hereinafter also simply referred to as “Si _max -Si _min difference”) is 10 at% or less. Is preferable, 7 at% or less is more preferable, and 3 at% or less is further preferable. When the absolute value is 10 at% or less, the gas barrier property of the obtained gas barrier film is further improved. The lower _limit of Si max _{-Si min difference,} because the effect of improving the crack generation suppression / prevention during bending of Si max _{-Si min} as gas barrier property difference is small film is high, is not particularly limited, and gas barrier property In consideration, it is preferably 1 at% or more, and more preferably 2 at% or more.

In the present invention, the total amount of carbon and oxygen atoms with respect to the thickness direction of the barrier layer is preferably substantially constant. Thereby, a barrier layer exhibits moderate flexibility, and the crack generation at the time of bending of a gas barrier film can be more effectively suppressed / prevented. More specifically, the ratio of the total amount of oxygen atoms and carbon atoms to the distance (L) from the surface of the barrier layer in the film thickness direction of the barrier layer and the total amount of silicon atoms, oxygen atoms, and carbon atoms ( In the oxygen-carbon distribution curve showing a relationship with the atomic ratio of oxygen and carbon, the absolute value of the difference between the maximum value and the minimum value of the atomic ratio of oxygen and carbon in the oxygen-carbon distribution curve (hereinafter simply referred to as “OC _max -OC _min difference ") is preferably less than 5 at%, more preferably less than 4 at%, and even more preferably less than 3 at%. When the absolute value is less than 5 at%, the gas barrier property of the obtained gas barrier film is further improved. _The lower limit of the OC max _{-OC min difference,} since preferably as OC max _{-OC min} difference is small, but is 0 atomic%, it is sufficient if more than 0.1 at%.

  The silicon distribution curve, the oxygen distribution curve, the carbon distribution curve, and the oxygen carbon distribution curve are obtained by using X-ray photoelectron spectroscopy (XPS) measurement and rare gas ion sputtering such as argon in combination. Thus, it can be created by so-called XPS depth profile measurement in which surface composition analysis is sequentially performed while exposing the inside of the sample. A distribution curve obtained by such XPS depth profile measurement can be created, for example, with the vertical axis as the atomic ratio (unit: at%) of each element and the horizontal axis as the etching time (sputtering time). In the element distribution curve with the horizontal axis as the etching time in this way, the etching time generally correlates with the distance (L) from the surface of the barrier layer in the film thickness direction of the barrier layer in the film thickness direction. Therefore, “Distance from the surface of the barrier layer in the film thickness direction of the barrier layer” is the distance from the surface of the barrier layer calculated from the relationship between the etching rate and the etching time adopted in the XPS depth profile measurement. can do. In the present invention, the silicon distribution curve, oxygen distribution curve, carbon distribution curve, and oxygen carbon distribution curve were prepared under the following measurement conditions.

(Measurement condition)
Etching ion species: Argon (Ar ⁺ );
Etching rate (converted to SiO ₂ thermal oxide film): 0.05 nm / sec;
Etching interval (SiO ₂ equivalent value): 10 nm;
X-ray photoelectron spectrometer: Model name "VG Theta Probe", manufactured by Thermo Fisher Scientific;
Irradiation X-ray: Single crystal spectroscopy AlKα
X-ray spot and its size: 800 × 400 μm oval.

  In the present invention, the thickness (dry film thickness) of the barrier layer is not particularly limited as long as the above (i) to (iii) are satisfied. The thickness of the barrier layer is preferably 20 to 3000 nm, more preferably 50 to 2500 nm, and particularly preferably 100 to 1000 nm. With such a thickness, the gas barrier film can exhibit excellent gas barrier properties and the effect of suppressing / preventing cracking during bending. In addition, when a barrier layer is comprised from 2 or more layers, it is preferable that each barrier layer has thickness as mentioned above. In addition, the thickness of the entire barrier layer when the barrier layer is composed of two or more layers is not particularly limited, but the thickness of the entire barrier layer (dry film thickness) is preferably about 1000 to 2000 nm. With such a thickness, the gas barrier film can exhibit excellent gas barrier properties and the effect of suppressing / preventing cracking during bending.

  In the present invention, the barrier layer is substantially uniform in the film surface direction (direction parallel to the surface of the barrier layer) from the viewpoint of forming a barrier layer having a uniform and excellent gas barrier property over the entire film surface. Preferably there is. Here, the barrier layer is substantially uniform in the film surface direction means that the oxygen distribution curve, the carbon distribution curve, and the oxygen carbon are measured at any two measurement points on the film surface of the barrier layer by XPS depth profile measurement. When a distribution curve is created, the number of extreme values of the carbon distribution curve obtained at any two measurement locations is the same, and the maximum and minimum values of the carbon atomic ratio in each carbon distribution curve The absolute values of the differences are the same as each other or within 5 at%.

  Furthermore, in the present invention, it is preferable that the carbon distribution curve is substantially continuous. Here, the carbon distribution curve is substantially continuous means that the carbon distribution curve does not include a portion where the atomic ratio of carbon changes discontinuously. Specifically, the carbon distribution curve is calculated from the etching rate and the etching time. In the relationship between the distance (x, unit: nm) from the surface of the barrier layer in the film thickness direction of at least one of the barrier layers, and the atomic ratio of carbon (C, unit: at%), It means satisfying the condition represented by the following formula (1).

  In the gas barrier film according to the present invention, the barrier layer satisfying all of the above conditions (i) to (iii) may include only one layer or may include two or more layers. Furthermore, when two or more such barrier layers are provided, the materials of the plurality of barrier layers may be the same or different.

  In the silicon distribution curve, the oxygen distribution curve, and the carbon distribution curve, the silicon atomic ratio, the oxygen atomic ratio, and the carbon atomic ratio are in the region of 90% or more of the thickness of the barrier layer (i ), The atomic ratio of the silicon atom content to the total amount of silicon atoms, oxygen atoms, and carbon atoms in the barrier layer is preferably 20 to 45 at%, More preferably, it is 25 to 40 at%. Further, the atomic ratio of the oxygen atom content to the total amount of silicon atoms, oxygen atoms, and carbon atoms in the barrier layer is preferably 45 to 75 at%, and more preferably 50 to 70 at%. . Furthermore, the atomic ratio of the carbon atom content to the total amount of silicon atoms, oxygen atoms, and carbon atoms in the barrier layer is preferably 0.5 to 25 at%, and preferably 1 to 20 at%. More preferred.

  In the present invention, the method for forming the barrier layer is not particularly limited, and the conventional method and the method can be applied in the same manner or appropriately modified. The barrier layer is preferably formed by a chemical vapor deposition (CVD) method, particularly a plasma chemical vapor deposition method (plasma CVD, PECVD (plasma-enhanced chemical vapor deposition), hereinafter, also simply referred to as “plasma CVD method”). It is more preferable that the substrate is formed by a plasma CVD method in which a base material is disposed on a pair of film forming rollers and a plasma is generated by discharging between the pair of film forming rollers.

  Although arrangement | positioning in particular of this barrier layer is not restrict | limited, What is necessary is just to arrange | position on a base material.

  Hereinafter, a method for forming a barrier layer using the plasma CVD method preferably used in the present invention will be described below.

[Method for forming barrier layer]
Next, a preferred method for forming the barrier layer according to the present invention will be described. The gas barrier film of the present invention can be produced by forming a barrier layer on at least one surface of the substrate and further forming an organic layer on the barrier layer. As a method for forming the barrier layer according to the present invention on the surface of the substrate, it is preferable to employ a plasma CVD method from the viewpoint of gas barrier properties. The plasma CVD method may be a Penning discharge plasma type plasma CVD method.

  Further, when plasma is generated in the plasma CVD method, it is preferable to generate plasma discharge in a space between a plurality of film forming rollers. A pair of film forming rollers is used, and each of the pair of film forming rollers is used. More preferably, the substrate is disposed and discharged between a pair of film forming rollers to generate plasma. In this way, by using a pair of film forming rollers, placing a base material on the pair of film forming rollers, and discharging between the pair of film forming rollers, one film forming roller It is possible not only to produce a thin film efficiently because it is possible to form a film on the surface part of the base material existing in the film while simultaneously forming a film on the surface part of the base material present on the other film forming roller. The film formation rate can be doubled compared to the plasma CVD method without using any roller, and a film having substantially the same structure can be formed, so that the extreme value in the carbon distribution curve can be at least doubled. It is possible to form a layer that satisfies all the above conditions (i) to (iii).

  Further, when discharging between the pair of film forming rollers in this way, it is preferable to reverse the polarities of the pair of film forming rollers alternately. Further, the film forming gas used in such a plasma CVD method preferably includes an organic silicon compound and oxygen, and the content of oxygen in the film forming gas is determined by the organosilicon compound in the film forming gas. It is preferable that the amount of oxygen be less than the theoretical oxygen amount necessary for complete oxidation. In the gas barrier film of the present invention, the barrier layer is preferably a layer formed by a continuous film forming process.

  Moreover, it is preferable that the gas barrier film which concerns on this invention forms the said barrier layer on the surface of the said base material by a roll-to-roll system from a viewpoint of productivity. Further, an apparatus that can be used when manufacturing the barrier layer by such a plasma CVD method is not particularly limited, and includes at least a pair of film forming rollers and a plasma power source, and the pair of film forming processes. It is preferable that the apparatus has a configuration capable of discharging between rollers. For example, when the manufacturing apparatus shown in FIG. 1 is used, the apparatus is manufactured by a roll-to-roll method using a plasma CVD method. It is also possible.

  Hereinafter, the method for forming a barrier layer according to the present invention will be described in more detail with reference to FIG. FIG. 1 is a schematic diagram showing an example of a manufacturing apparatus that can be suitably used for manufacturing the barrier layer according to the present invention. In the following description and drawings, the same or corresponding elements are denoted by the same reference numerals, and redundant description is omitted.

  1 includes a feed roller 32, transport rollers 33, 34, 35, and 36, film forming rollers 39 and 40, a gas supply pipe 41, a plasma generating power source 42, and a film forming roller 39. And magnetic field generators 43 and 44 installed inside 40 and a winding roller 45. In such a manufacturing apparatus, at least the film forming rollers 39 and 40, the gas supply pipe 41, the plasma generating power source 42, and the magnetic field generating apparatuses 43 and 44 are arranged in a vacuum chamber (not shown). ing. Further, in such a manufacturing apparatus 31, the vacuum chamber is connected to a vacuum pump (not shown), and the pressure in the vacuum chamber can be appropriately adjusted by the vacuum pump.

  In such a manufacturing apparatus, each film-forming roller has a power source for plasma generation so that the pair of film-forming rollers (the film-forming roller 39 and the film-forming roller 40) can function as a pair of counter electrodes. 42. Therefore, in such a manufacturing apparatus 31, it is possible to discharge into the space between the film forming roller 39 and the film forming roller 40 by supplying electric power from the plasma generating power source 42. Plasma can be generated in the space between the film roller 39 and the film formation roller 40. In this way, when the film forming roller 39 and the film forming roller 40 are also used as electrodes, the material and design thereof may be appropriately changed so that they can also be used as electrodes. Moreover, in such a manufacturing apparatus, it is preferable to arrange | position a pair of film-forming roller (film-forming rollers 39 and 40) so that the central axis may become substantially parallel on the same plane. Thus, by arranging a pair of film forming rollers (film forming rollers 39 and 40), the film forming rate can be doubled and a film having the same structure can be formed. Can be at least doubled. And according to such a manufacturing apparatus, it is possible to form the barrier layer 3 on the surface of the base material 2 by the CVD method, and the barrier layer component is formed on the surface of the base material 2 on the film forming roller 39. While depositing, the barrier layer component can also be deposited on the surface of the substrate 2 also on the film forming roller 40, so that the barrier layer can be efficiently formed on the surface of the substrate 2.

  Inside the film forming roller 39 and the film forming roller 40, magnetic field generators 43 and 44 fixed so as not to rotate even when the film forming roller rotates are provided, respectively.

  The magnetic field generators 43 and 44 provided on the film forming roller 39 and the film forming roller 40 are respectively a magnetic field generating device 43 provided on one film forming roller 39 and a magnetic field generating device provided on the other film forming roller 40. It is preferable to arrange the magnetic poles so that the magnetic field lines do not cross between them and the magnetic field generators 43 and 44 form a substantially closed magnetic circuit. By providing such magnetic field generators 43 and 44, it is possible to promote the formation of a magnetic field in which magnetic lines of force swell near the opposing surface of each film forming roller 39 and 40, and the plasma is converged on the bulging portion. Since it becomes easy, it is excellent at the point which can improve the film-forming efficiency.

  The magnetic field generators 43 and 44 provided on the film forming roller 39 and the film forming roller 40 respectively have racetrack-shaped magnetic poles that are long in the roller axis direction, and one magnetic field generator 43 and the other magnetic field generator. It is preferable to arrange the magnetic poles so that the magnetic poles facing to 44 have the same polarity. By providing such magnetic field generators 43 and 44, the opposing space along the length direction of the roller shaft without straddling the magnetic field generator on the roller side where the magnetic lines of force of each of the magnetic field generators 43 and 44 are opposed. A racetrack-like magnetic field can be easily formed in the vicinity of the roller surface facing the (discharge region), and the plasma can be focused on the magnetic field, so that a wide base wound around the roller width direction can be obtained. The material 2 is excellent in that the barrier layer 3 that is a deposited film can be efficiently formed.

  As the film forming roller 39 and the film forming roller 40, known rollers can be appropriately used. As such film forming rollers 39 and 40, those having the same diameter are preferably used from the viewpoint of forming a thin film more efficiently. Further, the diameters of the film forming rollers 39 and 40 are preferably in the range of 300 to 1000 mmφ, particularly in the range of 300 to 700 mmφ from the viewpoint of discharge conditions, chamber space, and the like. If the diameter of the film forming roller is 300 mmφ or more, the plasma discharge space will not be reduced, so that the productivity will not be deteriorated and it is possible to avoid applying the total amount of heat of the plasma discharge to the substrate 2 in a short time. It is preferable because damage to the material 2 can be reduced. On the other hand, if the diameter of the film forming roller is 1000 mmφ or less, it is preferable because practicality can be maintained in terms of apparatus design including uniformity of plasma discharge space.

  In such a manufacturing apparatus 31, the base material 2 is arrange | positioned on a pair of film-forming roller (The film-forming roller 39 and the film-forming roller 40) so that the surface of the base material 2 may respectively oppose. By disposing the base material 2 in this manner, when the plasma is generated by performing discharge in the facing space between the film formation roller 39 and the film formation roller 40, the base existing between the pair of film formation rollers is present. Each surface of the material 2 can be formed simultaneously. That is, according to such a manufacturing apparatus, a barrier layer component is deposited on the surface of the substrate 2 on the film forming roller 39 and further deposited on the film forming roller 40 by plasma CVD. Therefore, the barrier layer can be efficiently formed on the surface of the substrate 2.

  As the feed roller 32 and the transport rollers 33, 34, 35, and 36 used in such a manufacturing apparatus, known rollers can be appropriately used. The winding roller 45 is not particularly limited as long as it can wind the gas barrier film 1 having the barrier layer 3 formed on the substrate 2, and a known roller may be used as appropriate. it can.

  Further, as the gas supply pipe 41 and the vacuum pump, those capable of supplying or discharging the source gas or the like at a predetermined speed can be appropriately used.

  The gas supply pipe 41 as a gas supply means is preferably provided in one of the facing spaces (discharge region; film formation zone) between the film formation roller 39 and the film formation roller 40, and is a vacuum as a vacuum exhaust means. A pump (not shown) is preferably provided on the other side of the facing space. As described above, by providing the gas supply pipe 41 as the gas supply means and the vacuum pump as the vacuum exhaust means, the film formation gas is efficiently supplied to the facing space between the film formation roller 39 and the film formation roller 40. It is excellent in that the film formation efficiency can be improved.

  Furthermore, as the plasma generating power source 42, a known power source of a plasma generating apparatus can be used as appropriate. Such a plasma generating power supply 42 supplies power to the film forming roller 39 and the film forming roller 40 connected thereto, and makes it possible to use these as counter electrodes for discharge. Such a plasma generating power source 42 can perform plasma CVD more efficiently, and can alternately reverse the polarity of the pair of film forming rollers (AC power source or the like). Is preferably used. Moreover, as such a plasma generating power source 42, it becomes possible to perform plasma CVD more efficiently, so that the applied power can be set to 100 W to 10 kW, and the AC frequency is set to 50 Hz to 500 kHz. More preferably, it is possible to do this. As the magnetic field generators 43 and 44, known magnetic field generators can be used as appropriate. Furthermore, as the base material 2, in addition to the base material used in the present invention, a material in which the barrier layer 3 is previously formed can be used. As described above, the barrier layer 3 can be thickened by using the substrate 2 having the barrier layer 3 formed in advance.

  Using such a manufacturing apparatus 31 shown in FIG. 1, for example, the type of source gas, the power of the electrode drum of the plasma generator, the pressure in the vacuum chamber, the diameter of the film forming roller, and the transport of the film (base material) The barrier layer according to the present invention can be produced by appropriately adjusting the speed. That is, using the manufacturing apparatus 31 shown in FIG. 1, a discharge is generated between a pair of film forming rollers (film forming rollers 39 and 40) while supplying a film forming gas (raw material gas, etc.) into the vacuum chamber. Thus, the film-forming gas (raw material gas or the like) is decomposed by plasma, and the barrier layer 3 is formed on the surface of the base material 2 on the film-forming roller 39 and the surface of the base material 2 on the film-forming roller 40 by plasma CVD. Formed by law. At this time, a racetrack-shaped magnetic field is formed in the vicinity of the roller surface facing the facing space (discharge region) along the length direction of the roller axes of the film forming rollers 39 and 40, and the plasma is converged on the magnetic field. For this reason, when the base material 2 passes A point of the film-forming roller 39 and B point of the film-forming roller 40 in FIG. 1, the maximum value of the carbon distribution curve is formed in the barrier layer. On the other hand, when the base material 2 passes through the points C1 and C2 of the film forming roller 39 and the points C3 and C4 of the film forming roller 40 in FIG. It is formed. For this reason, five extreme values are usually generated for two film forming rollers. Further, the distance between the extreme values of the barrier layer (the difference between the distance (L) from the surface of the barrier layer in the thickness direction of the barrier layer at one extreme value of the carbon distribution curve and the extreme value adjacent to the extreme value) (Absolute value) can be adjusted by the rotation speed of the film forming rollers 39 and 40 (base material transport speed). In such film formation, the substrate 2 is conveyed by the delivery roller 32, the film formation roller 39, and the like, respectively, so that the surface of the substrate 2 is formed by a roll-to-roll continuous film formation process. Thus, the barrier layer 3 is formed.

  As the film forming gas (such as source gas) supplied from the gas supply pipe 41 to the facing space, source gas, reaction gas, carrier gas, and discharge gas may be used alone or in combination of two or more. The source gas in the film-forming gas used for forming the barrier layer 3 can be appropriately selected and used according to the material of the barrier layer 3 to be formed. As such a source gas, for example, an organic silicon compound containing silicon or an organic compound gas containing carbon can be used. Examples of such organosilicon compounds include hexamethyldisiloxane (HMDSO), hexamethyldisilane (HMDS), 1,1,3,3-tetramethyldisiloxane, vinyltrimethylsilane, methyltrimethylsilane, and hexamethyldisilane. , Methylsilane, dimethylsilane, trimethylsilane, diethylsilane, propylsilane, phenylsilane, vinyltriethoxysilane, vinyltrimethoxysilane, tetramethoxysilane (TMOS), tetraethoxysilane (TEOS), phenyltrimethoxysilane, methyltriethoxy Examples include silane and octamethylcyclotetrasiloxane. Among these organosilicon compounds, hexamethyldisiloxane and 1,1,3,3-tetramethyldisiloxane are preferable from the viewpoints of characteristics such as handling of the compound and gas barrier properties of the resulting barrier layer. These organosilicon compounds can be used alone or in combination of two or more. Examples of the organic compound gas containing carbon include methane, ethane, ethylene, and acetylene. As these organosilicon compound gas and organic compound gas, an appropriate source gas is selected according to the type of the barrier layer 3.

  In addition to the source gas, a reactive gas may be used as the film forming gas. As such a reactive gas, a gas that reacts with the raw material gas to become an inorganic compound such as an oxide or a nitride can be appropriately selected and used. As a reaction gas for forming an oxide, for example, oxygen or ozone can be used. Moreover, as a reactive gas for forming nitride, nitrogen and ammonia can be used, for example. These reaction gases can be used singly or in combination of two or more. For example, when forming an oxynitride, a reaction gas for forming an oxide and a nitride are formed. It can be used in combination with a reaction gas.

  As the film forming gas, a carrier gas may be used as necessary to supply the source gas into the vacuum chamber. Further, as the film forming gas, a discharge gas may be used as necessary in order to generate plasma discharge. As such carrier gas and discharge gas, known ones can be used as appropriate, for example, rare gases such as helium, argon, neon, xenon; hydrogen can be used.

  When such a film-forming gas contains a source gas and a reactive gas, the ratio of the source gas and the reactive gas is the reaction gas that is theoretically necessary for completely reacting the source gas and the reactive gas. It is preferable not to make the ratio of the reaction gas excessive rather than the ratio of the amount. By not excessively increasing the ratio of the reactive gas, the barrier layer 3 formed is excellent in that excellent barrier properties and bending resistance can be obtained. Further, when the film forming gas contains the organosilicon compound and oxygen, the amount is less than the theoretical oxygen amount necessary for complete oxidation of the entire amount of the organosilicon compound in the film forming gas. It is preferable.

Hereinafter, as the film forming gas, hexamethyldisiloxane (organosilicon compound, HMDSO, (CH ₃ ) ₆ Si ₂ O) as a raw material gas and oxygen (O ₂ ) as a reactive gas are used. Taking a case of producing a silicon-oxygen-based thin film as an example, a suitable ratio of the raw material gas and the reactive gas in the film forming gas will be described in more detail.

A film-forming gas containing hexamethyldisiloxane (HMDSO, (CH ₃ ) ₆ Si ₂ O) as a source gas and oxygen (O ₂ ) as a reaction gas is reacted by plasma CVD to form a silicon-oxygen system When the thin film is produced, a reaction represented by the following reaction formula (1) occurs by the film forming gas, and silicon dioxide is generated.

  In such a reaction, the amount of oxygen required to completely oxidize 1 mol of hexamethyldisiloxane is 12 mol. Therefore, a uniform silicon dioxide film is formed when oxygen is contained in the film forming gas in an amount of 12 moles or more per mole of hexamethyldisiloxane and a uniform silicon dioxide film is formed (a carbon distribution curve exists). Therefore, it becomes impossible to form a barrier layer that satisfies all of the above conditions (i) to (iii). Therefore, in the present invention, when the barrier layer is formed, the stoichiometric ratio of oxygen amount to 1 mol of hexamethyldisiloxane is set so that the reaction of the reaction formula (1) does not proceed completely. The amount is preferably less than 12 moles. In the actual reaction in the plasma CVD chamber, the raw material hexamethyldisiloxane and the reaction gas oxygen are supplied from the gas supply unit to the film formation region to form a film, so the molar amount of oxygen in the reaction gas Even if the (flow rate) is 12 times the molar amount (flow rate) of the raw material hexamethyldisiloxane (flow rate), the reaction cannot actually proceed completely, and the oxygen content is reduced. It is considered that the reaction is completed only when a large excess is supplied compared to the stoichiometric ratio (for example, in order to obtain silicon oxide by complete oxidation by CVD, the molar amount (flow rate) of oxygen is changed to the hexamethyldioxide raw material. (It may be about 20 times or more the molar amount (flow rate) of siloxane). Therefore, the molar amount (flow rate) of oxygen with respect to the molar amount (flow rate) of the raw material hexamethyldisiloxane is preferably an amount of 12 times or less (more preferably 10 times or less) which is the stoichiometric ratio. . By containing hexamethyldisiloxane and oxygen at such a ratio, carbon atoms and hydrogen atoms in hexamethyldisiloxane that have not been completely oxidized are taken into the barrier layer, and the above conditions (i) to (iii) It is possible to form a barrier layer satisfying all of the above) and to exhibit excellent gas barrier properties and flex resistance in the obtained gas barrier film. From the viewpoint of use as a flexible substrate for devices that require transparency, such as organic EL elements and solar cells, the molar amount of oxygen relative to the molar amount (flow rate) of hexamethyldisiloxane in the deposition gas The lower limit of (flow rate) is preferably greater than 0.1 times the molar amount (flow rate) of hexamethyldisiloxane, more preferably greater than 0.5 times.

  Moreover, although the pressure (vacuum degree) in a vacuum chamber can be suitably adjusted according to the kind etc. of source gas, it is preferable to set it as the range of 0.5 Pa-50 Pa.

  In such a plasma CVD method, in order to discharge between the film forming roller 39 and the film forming roller 40, an electrode drum connected to the plasma generating power source 42 (in this embodiment, the film forming roller 39) is used. The electric power to be applied to the power source can be adjusted as appropriate according to the type of the raw material gas, the pressure in the vacuum chamber, etc. It is preferable to be in the range. If such an applied power is 100 W or more, the generation of particles can be sufficiently suppressed, and if it is 10 kW or less, the amount of heat generated during film formation can be suppressed, and the substrate during film formation can be suppressed. An increase in surface temperature can be suppressed. Therefore, it is excellent in that wrinkles can be prevented during film formation without causing the substrate to lose heat.

  Although the conveyance speed (line speed) of the base material 2 can be appropriately adjusted according to the type of raw material gas, the pressure in the vacuum chamber, and the like, it is preferably in the range of 0.25 to 100 m / min. More preferably, it is in the range of 5 to 20 m / min. If the line speed is 0.25 m / min or more, generation of wrinkles due to heat in the substrate can be effectively suppressed. On the other hand, if it is 100 m / min or less, it is excellent at the point which can ensure sufficient thickness as a barrier layer, without impairing productivity.

  As described above, as a more preferable aspect of the present embodiment, the barrier layer according to the present invention is formed by plasma CVD using the plasma CVD apparatus (roll-to-roll method) having the counter roll electrode shown in FIG. It is characterized by doing. This is excellent in flexibility (flexibility) and mechanical strength, especially when transported by roll-to-roll, when mass-produced using a plasma CVD apparatus (roll-to-roll method) having a counter roll electrode. This is because it is possible to efficiently produce a barrier layer having both the barrier performance and the barrier performance. Such a manufacturing apparatus is also excellent in that it can inexpensively and easily mass-produce gas barrier films that are required for durability against temperature changes used in solar cells and electronic components.

[Organic layer]
The gas barrier film of the present invention is formed by forming an organic layer on a substrate in addition to the barrier layer. Here, the stacking order of the barrier layer and the organic layer is not particularly limited, but the barrier layer and the organic layer are preferably stacked in this order on the substrate. With such a structure, the organic layer can relieve stress on the hard part of the barrier layer, improve the impact resistance, and more effectively suppress and prevent the generation of cracks.

  The organic layer in the present invention contains (or consists of) at least one organic material. In some embodiments of the present invention, the organic material is a polymerizable and / or crosslinkable monomer or monomer material (hereinafter, the polymerizable and / or crosslinkable monomer or monomer material is simply referred to as a “monomer compound”). In some cases). In the present invention, the organic layer is obtained by polymerizing a monomer compound.

  The term “monomer” as used herein generally refers to any monomer that can be deposited under vacuum conditions and subsequently crosslinked. Thus, the monomer may be monovalent or multivalent, and indeed may be an oligomer or a mixture of monomer and oligomer. Monomers may include different types having different functional groups that are cross-linked by different mechanisms, for example under the influence of UV (or other actinic radiation) and crosslinkers or radical initiators. Preferably, the organic layer comprises polymerizable unsaturated organic materials such as, for example, low molecular weight addition polymers, natural oils, silicones, condensation polymers, and other monomers and materials containing unsaturation that can be polymerized or crosslinked. Unsaturated materials have one or more double bonds, or in some cases triple bonds.

  In one embodiment of the present invention, the organic layer preferably contains a (meth) acrylic compound as the organic material. That is, the organic layer is preferably an acrylic resin or a methacrylic resin ((meth) acrylic compound) mainly composed of a polymer of acrylate and / or methacrylate monomers. The monomer compound of the organic material ((meth) acrylic compound) is more preferably a polyfunctional acrylate because of its reactivity, physical characteristics, and characteristics of the organic layer to be formed. Polyfunctional acrylates are particularly useful monomeric compounds. The polyfunctional acrylate is represented by the following general formula (1), (2) or (3).

In formula (1),
X are each independently a single bond, a substituted or unsubstituted alkylene group having 1 to 24 carbon _{^{atoms, - (CR 3 R 4)}} p - [O (CR 3 R 4) (CR 3 R 4)] t _{^{-, - (CR 3 R 4}} ) p -O- (CR 3 R 4) q -, - (CR 3 R 4) p -NHCOO- (CR 3 R 4) q -, or - ^{(CR 3 R} 4) ^{_{p -OC (= O) - (}} CR 3 R 4) q -, or _{-CH (OH) CH 2 - [} O-Ar-C (CH 3) 2 -Ar-O-CH 2 CH (OH) CH 2 ] t _- with a group represented, this time, R ³ and R ⁴ are each independently hydrogen atom or a substituted or unsubstituted alkyl group having 1 to 5 carbon atoms, Ar are each independently A substituted or unsubstituted aryl group having 6 to 24 carbon atoms, and p and q are respectively Independently an integer of 0, t are each independently an integer of 0,
R ¹ each independently represents an acrylic acid residue represented by —OC (═O) —CR ⁵ ═CH ₂ , wherein each R ⁵ independently represents a hydrogen atom or a substituted or non-substituted group. A substituted alkyl group having 1 to 5 carbon atoms,
Each R ² independently represents a hydrogen atom, a hydroxyl group, a substituted or unsubstituted alkyl group having 1 to 24 carbon atoms, a substituted or unsubstituted alkoxy group having 1 to 24 carbon atoms, or a substituted or unsubstituted carbon; An aryloxy group of 6 to 24, in which two or more R ² may be combined to form a ring;
m is an integer of 1-4.

In formula (2),
X, R ¹ and R ² are as defined above,
Y is a single bond, C (carbon atom), O (oxygen atom), or S (sulfur atom);
L ¹ and L ² are each independently a single bond or an alkylene group having 1 to 3 carbon atoms,
n and n ′ are integers of 1 to 3.

In formula (3),
X, R ¹ and R ² are as defined above,
n, n ′ and n ″ are integers of 1 to 3,
Each s is independently 1 or 0.

  In formula (3), when s is 0, it means that the N atom is unsubstituted (hydrogen).

  In the above formulas (1) and (2), examples of the alkylene group having 1 to 24 carbon atoms include a methylene group, a methylmethylene group, an ethylene group, a trimethylene group, a propylene group, a tetramethylene group, a pentamethylene group, and a hexamethylene group. A straight chain such as a group, heptamethylene group, octamethylene group, nonamethylene group, decamethylene group, undecamethylene group, tridecamethylene group, tetradecamethylene group, pentadecamethylene group, hexadecamethylene group, octadecamethylene group, etc. A branched alkylene group is mentioned.

  Examples of the alkyl group having 1 to 24 carbon atoms include methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, sec-butyl group, tert-butyl group, n-pentyl group, and isopentyl group. Tert-pentyl group, neopentyl group, 1,2-dimethylpropyl group, n-hexyl group, isohexyl group, 1,3-dimethylbutyl group, 1-isopropylpropyl group, 1,2-dimethylbutyl group, n-heptyl Group, 1,4-dimethylpentyl group, 3-ethylpentyl group, 2-methyl-1-isopropylpropyl group, 1-ethyl-3-methylbutyl group, n-octyl group, 2-ethylhexyl group, 3-methyl-1 -Isopropylbutyl group, 2-methyl-1-isopropyl group, 1-t-butyl-2-methylpropyl group, n-nonyl group, 3, , 5-trimethylhexyl group, n-decyl group, isodecyl group, n-undecyl group, 1-methyldecyl group, n-dodecyl group, n-tridecyl group, n-tetradecyl group, n-pentadecyl group, n-hexadecyl group, Linear or branched alkyl groups such as n-heptadecyl group, n-octadecyl group, n-nonadecyl group, n-eicosyl group, n-heneicosyl group, n-docosyl group, n-tricosyl group, and n-tetracosyl group Is mentioned. Among these, a linear or branched alkyl group having 1 to 20 carbon atoms is preferable, a linear or branched alkyl group having 1 to 10 carbon atoms is more preferable, and a linear chain having 1 to 8 carbon atoms. Or a branched alkyl group is still more preferable, and a linear alkyl group having 1 to 3 carbon atoms is particularly preferable.

  Examples of the aryl group having 6 to 24 carbon atoms include phenyl group, naphthyl group, biphenyl group, fluorenyl group, anthryl group, pyrenyl group, azulenyl group, acenaphthylenyl group, terphenyl group, and phenanthryl group. Among these, a phenyl group, a naphthyl group, and a biphenyl group are preferable, and a phenyl group is more preferable.

  Examples of the alkoxy group having 1 to 24 carbon atoms include methoxy group, ethoxy group, n-propoxy group, isopropoxy group, n-butoxy group, sec-butoxy group, tert-butoxy group, isobutoxy group, and n-octyloxy. Group, n-decyloxy group, n-dodecyloxy group, n-hexadecyloxy group, 2-ethylhexyloxy group, 2-hexyldecyloxy group, 2-decyltetradecyloxy group and the like. Among these, a linear or branched alkoxy group having 1 to 20 carbon atoms is preferable, a linear or branched alkoxy group having 1 to 10 carbon atoms is more preferable, and a linear chain having 1 to 8 carbon atoms. Or a branched alkoxy group is still more preferable, and a C1-C4 linear alkoxy group is especially preferable.

  Examples of the aryloxy group having 6 to 24 carbon atoms include a phenoxy group and a naphthyloxy group.

In the formulas (1) and (2), R ² may be a group in which two or more R ² together form a ring. As an example of forming a ring, C (R ² ) ₃ ( In this case, m = 1) forms, for example, a cyclopentyl group, a cyclohexyl group, a norbornyl group, a bis (methyl) norbornyl group or the like.

  Since the alkyl group having 1 to 5 carbon atoms and the alkylene group having 1 to 3 carbon atoms in the formulas (1) and (2) are the same as those described above, the description thereof is omitted.

Examples of the substituent that the alkyl group may have include a halogen atom (for example, fluorine, chlorine, bromine, etc.), a hydroxyl group, a cyano group (—CN), a phosphate group (—O—P (═O) ( OH) ₂ ), an alkylsilyl group having 1 to 12 carbon atoms (for example, trimethylsilyl group, triethylsilyl group), an alkoxysilyl group having 1 to 12 carbon atoms (for example, trimethoxysilyl group, triethoxysilyl group), carbon number 1-12 linear or branched alkyl groups (for example, methyl, ethyl, t-butyl, isobutyl, dodecyl, octadecyl, 3-ethylpentyl), C3-C12 cycloalkyl Group (for example, cyclopropyl group, cyclopentyl group, cyclohexyl group), aryl group having 6 to 24 carbon atoms (for example, phenyl group, naphthyl group), carbon number -12 hydroxyalkyl group (for example, hydroxymethyl group, hydroxyethyl group), C1-C12 alkoxyalkyl group (for example, methoxyethyl group, etc.), C1-C12 alkoxy group (for example, methoxy group, Ethoxy group, ethoxy group, propoxy group, isopropoxy group, butoxy group, pentyloxy group, hexyloxy group, etc.), alkenyl group having 2 to 12 carbon atoms (for example, vinyl group, allyl group, etc.), amino group (for example, A dimethylamino group, a diethylamino group, a diphenylamino group), a heterocyclic group (for example, a morpholinyl group, a furanyl group, etc.).

  Preferred examples of the polyfunctional acrylate represented by the formula (1) or (2) are illustrated below. However, in the present invention, the acrylate and methacrylate monomers are not limited to these.

  Preferred examples of the polyfunctional acrylate represented by the formula (1) or (2) are illustrated below. However, in the present invention, the acrylate and methacrylate monomers are not limited to these.

  Commercial products of these acrylate and / or methacrylate monomers include light acrylate BEPG-A (Kyoeisha Chemical Co., Ltd., 2-butyl-2-ethylpropanediol diacrylate), light acrylate TMP-A (Kyoeisha Chemical Co., Ltd.), Trimethylolpropane triacrylate), Evecryl EB600 (Daicel UCB, bisphenol A type epoxy acrylate), Aronix M-350 (manufactured by Toa Gosei Co., Ltd., ethylene oxide-modified trimethylolpropane triacrylate), Aronix M315 (Toa Gosei Co., Ltd.) Product, isocyanuric acid EO-modified di and triacrylate), Aronix M-270 (manufactured by Toagosei Co., Ltd., polypropylene glycol diacrylate) and the like.

  In the present embodiment, the glass transition temperature of the organic layer is preferably 105 ° C. or higher. That is, the organic layer of the present invention is preferably composed of a (meth) acrylic compound having a glass transition temperature of 105 ° C. or higher. When the glass transition temperature of the organic layer is 105 ° C. or higher, surface smoothness, plasma resistance, and gas barrier properties are excellent. Further, in the organic layer, it is preferable that the glass transition temperature of the organic layer is 130 ° C. or higher because gas barrier properties and surface smoothness are further improved. Moreover, it is more preferable that the glass transition temperature is 190 ° C. or higher because the surface stability when exposed to plasma is further improved. The upper limit of the glass transition temperature is not particularly limited, but is 500 ° C. or lower, more preferably 300 ° C. or lower.

  Further, when the organic layer is formed on the barrier layer, the organic layer covers and smoothes the roughness of the surface of the barrier layer, and a high barrier property is obtained. Further, the barrier layer is formed on the organic layer. In the case of stacking, the surface is required to be stable even when exposed to plasma when forming a barrier layer. When the glass transition temperature of the organic layer is 105 ° C. or higher, the effects of the present invention are further exhibited in these configurations.

  There are physical properties that change abruptly at the glass transition point in addition to stiffness and viscosity. Basically, the glass transition point can be determined by measuring these changing physical properties and capturing changes due to temperature. In particular, DSC (Differential Scanning Calorimetry), which can be easily measured, is widely used for the determination because it often involves heat absorption and heat generation at the glass transition point. The melting point is one point on the temperature axis, and is determined as an accurate temperature at which the different phases of solid and liquid coexist and are in an equilibrium state, but the glass transition point is measured in a non-equilibrium state, not a point. It is in a certain temperature range and also changes with the temperature change rate. In other words, the glass state and the liquid state do not coexist at a constant temperature to achieve an equilibrium state. Practically, a certain point on the peak appearing in the temperature change graph of physical properties to be measured (for example, peak apex) is defined as a glass transition point. In the present invention, the temperature of the glass transition point is the glass transition temperature.

  In the present invention, the following three methods can be used for measuring the glass transition point. (1) Measuring changes in mechanical properties while slowly increasing or decreasing the temperature of the sample, (2) Measuring endotherm and exotherm while slowly increasing or decreasing the temperature of the sample, (3) Sample The response is measured while changing the frequency of the periodic force applied to. The above (2) is, for example, DSC, and (3) is, for example, dynamic viscoelasticity measurement. The glass transition temperatures of the following examples are measured using a DSC method.

  The organic layer preferably contains a (meth) acrylic compound having a C—C bond density in the monomer of 0.19 or more. In the organic layer, the plasma resistance is improved by including a (meth) acrylic compound having a C—C bond density of 0.19 or more in the monomer. In the organic layer, the C—C bond density in the monomer is preferably 0.21 or more, since the plasma resistance and the surface smoothness are further improved.

  In the present invention, the CC bond density is a parameter indicating plasma resistance as described above. This C—C bond density is determined using X-ray photoelectron spectroscopy (hereinafter referred to as XPS). By XPS, the C1s photoelectron peak is waveform-separated and the bond density of C—C, C—O, C—N, C—H, etc. is quantified. Using this quantified value, the C—C bond density is calculated. The C—C bond density can be calculated by the following Equation 1, where N is the total number of atoms, Nc is the number of C—C bonds, and No is the number of C—O bonds.

  In addition, the organic layer which concerns on this invention may contain other compounds other than a (meth) acryl compound.

  In the present invention, the thickness (dry film thickness) of the organic layer is preferably 40 to 550 nm, more preferably 45 to 500 nm, further preferably 50 nm to less than 500 nm, and more preferably 50 nm to less than 490 nm. It is particularly preferable that the thickness is 50 to 400 nm. With such a thickness, the organic layer can exhibit excellent gas barrier properties and excellent adhesion to the barrier layer, and impact resistance is improved. In addition, when an organic layer is comprised from 2 or more layers, it is preferable that an organic layer has thickness as mentioned above. In addition, the thickness of the entire barrier layer in the case where the organic layer is composed of two or more layers is not particularly limited, but the thickness of the entire organic layer (dry film thickness) is preferably about 50 to 500 nm. With such a thickness, the organic layer can exhibit gas barrier properties and excellent adhesion with the barrier layer.

  In the present invention, the ratio of the thickness (dry film thickness) between the barrier layer and the organic layer is not particularly limited. The film thickness ratio between the barrier layer and the organic layer (the thickness of the barrier layer (nm): the thickness of the organic layer (nm)) is preferably 1: 0.1 to 10, and is preferably 1: 0.12. It is more preferably ˜8, even more preferably 1: 0.15-5, and particularly preferably 1: 1-10. With such a ratio, the obtained gas barrier film can exhibit further excellent gas barrier properties, impact resistance (crack generation suppression / prevention effect during impact), and excellent adhesion to the barrier layer, Improves impact.

[Method for forming organic layer]
Next, a preferred method for forming the organic layer according to the present invention will be described.

  The organic layer of the present invention is polymerized by mixing the above-described monomer compound with a polymerization initiator, if necessary, and applying the mixture onto a substrate, a barrier layer, or another layer formed on the barrier layer. Is obtained. In addition, the mixing order of these components is not particularly limited.

  The polymerization initiator is not particularly limited, but a photopolymerization initiator is preferably used. For example, benzoin alkyl ether compounds, acetophenone compounds, benzophenone compounds, phenyl ketone compounds, thioxanthone compounds, triazine compounds, imidazoles And anthraquinone compounds. More specifically, acetophenone compounds such as Irgacure 369 and Irgacure 907 (both manufactured by Nippon Ciba Geigy Co., Ltd.) can be used.

  The addition amount of the photopolymerization initiator is not particularly limited, but for acetophenone compounds (Irgacure 369, Irgacure 907, etc.), the monomer compound (for example, dipentaerythritol hexaacrylate, etc.) is 100 parts by mass. When added, it is preferably added in a proportion of 0.01 to 30 parts by mass, more preferably 0.05 to 15 parts by mass.

  Here, you may add a solvent at the time of mixing of said each component. The solvent is not particularly limited as long as it can dissolve the components to be added, and can be appropriately selected depending on the type of the monomer compound. Specifically, alcohols such as methanol, ethanol, isopropyl alcohol (IPA), normal propyl alcohol, butanol, isobutanol, tertiary butanol, butanediol, ethylhexanol, benzyl alcohol; acetone, methyl ethyl ketone, methyl isobutyl ketone, diisobutyl ketone Ketone solvents such as cyclohexanone and diacetone alcohol; hydrocarbon solvents such as toluene, xylene, solvent naphtha, normal hexane, isohexane, cyclohexane, methylcyclohexane, normal heptane, isooctane and normal decane; ethyl acetate, methyl acetate, acetic acid Butyl, methoxybutyl acetate, cellosolve acetate, amyl acetate, normal propyl acetate, isopropyl acetate, methyl lactate, lactate ester And ester solvents such as butyl ether, isopropyl ether, methyl cellosolve, cellosolve, butyl cellosolve, dioxane, methyl tertiary butyl ether (MTBE), butyl carbitol and the like; N-methyl-2-pyrrolidone (NMP), Examples thereof include amine solvents such as dimethylformamide (DMF) and N, N-dimethylacetamide (DMAC), and water.

  The liquid for forming an organic layer prepared as described above was applied onto a predetermined layer (for example, a substrate, a barrier layer, or another layer formed on the barrier layer, preferably a barrier layer). Then, heat. Thereby, an organic layer is formed on a predetermined layer (for example, a substrate, a barrier layer, or other layers formed on the barrier layer, preferably a barrier layer). Here, the coating method is not particularly limited, and known methods such as a spray coating method, a spin coating method, a bar coating method, a doctor blade method, a squeegee method, and a screen printing method can be used. The heating conditions are not particularly limited as long as the organic layer is cured.

  In the present invention, the organic layer is preferably formed by flash vapor deposition. When the organic layer is formed by flash vapor deposition, the uniformity of the film is increased and the impact resistance is further improved.

  Hereinafter, a flash vapor deposition method which is a preferred embodiment of the present invention will be described.

  As an apparatus for flash vapor deposition for forming the organic layer of the present invention, the apparatus of FIG. 2 is exemplified. The flash vapor deposition method for forming the organic layer of the present invention is not limited to the following method.

  The apparatus of FIG. 2 will be described below.

  The organic layer forming unit includes an organic layer material vapor deposition unit 150 provided to face the surface 126a of the drum 126, a curing unit 156 provided on the downstream side in the transport direction D with respect to the organic layer material vapor deposition unit 150, And an organic layer material supply unit 54 connected to the organic layer material vapor deposition unit 150 via a pipe 152.

  The organic layer raw material vapor deposition unit 150, the organic layer raw material supply unit 154, and the curing unit 156 of the organic layer forming unit are connected to the control unit 136 (not shown). The control unit 136 controls the organic layer material vapor deposition unit 150, the organic layer material supply unit 154, and the curing unit 156.

  The organic layer material supply unit 154 evaporates a liquid monomer compound, which is a material for the organic layer to be formed, and supplies the vapor of the monomer compound to the organic layer material vapor deposition unit 150 through the pipe 152.

  As shown in FIG. 2, the organic layer raw material supply unit 154 stores a liquid monomer compound and maintains the pressure at a predetermined reduced pressure, and exhaust means and agitation means for reducing the inside to a predetermined pressure. , A syringe pump 172 connected to the tank 170, and a liquid ejecting unit 176 connected to the tank 170 via a pipe 174. In the organic layer raw material supply unit 154, a gas supply unit 178 is further connected to the liquid injection unit 176 via a pipe 174.

  The liquid monomer compound in the tank 170 is stirred by a stirring means under reduced pressure and degassed to remove excess gas. The monomer compound is pumped from the tank 170 to the liquid ejecting unit 176 by the syringe pump 172. The pressure pumping by the syringe pump 172 preferably has a syringe pump pressure of 50 to 500 PSI and a liquid feed amount of 0.1 to 50 ml / min. The syringe pump pressure and the liquid feeding amount are appropriately set depending on the thickness of the layer to be formed.

  The liquid ejecting unit 176 has a hollow configuration, and a heating plate 180 is provided inside. An exhaust unit that evacuates the liquid ejecting unit 176 and a heating unit that heats the heating plate 180 are provided (not shown). In addition, the liquid ejecting unit 176 is provided with a droplet ejecting port 176 a at a connection part with the pipe 174. Although not shown, the droplet ejection port 176a is provided with ultrasonic application means and cooling means.

  In the liquid ejecting unit 176, the liquid monomer compound pumped by the syringe pump 172 in a vacuum state is made into a minute droplet state at the droplet ejecting port 176a to which the ultrasonic wave is applied, and the heating plate It is injected toward 180. When the monomer compound in a fine droplet state comes into contact with the heating plate 180, it evaporates to obtain an evaporated body. The monomer compound that has become the vaporized substance passes through the pipe 152 and is supplied to the organic layer raw material vapor deposition section 150.

  In addition, the evaporation efficiency of a monomer compound can be improved by applying an ultrasonic wave and atomizing a liquid monomer compound. Further, in order to prevent thermosetting of the monomer compound due to a rapid temperature rise due to application of ultrasonic waves to the injection port 176a, it is preferable to set the injection port 176a to a temperature of 5 to 50 ° C., for example, with a cooling means. The heating plate 180 is preferably set to a temperature of 150 to 300 ° C. in consideration of evaporation efficiency.

The gas supply unit 178 of the organic layer raw material supply unit 154 pushes the residual monomer inside the pipe 174 through which the monomer compound passes to the liquid injection unit 76. The gas supply unit 178 includes various gas cylinders in which an inert gas such as Ar gas, He gas, and N ₂ gas is stored, a valve that adjusts the flow rate of the supplied inert gas, and the like.

  The gas supply unit 178 pushes out the residual monomer inside the pipe 174 during maintenance. For this reason, the gas supply unit 178 is not used during normal film formation.

  The organic layer raw material vapor deposition unit 150 is a surface layer Zf of the substrate Z wound around the drum 126 or a desired layer formed on the substrate, which is a monomer vapor body that is an organic layer supplied from the organic layer raw material supply unit 154. (For example, a barrier layer or another layer formed on the barrier layer, preferably a barrier layer) It is supplied and aggregated on Zf ′.

  Although not shown, the organic layer raw material vapor deposition unit 150 includes a heating control unit, and includes a heating nozzle 150a that is heated to a temperature that is higher than the aggregation temperature and lower than the evaporation temperature.

  The monomer vapor supplied from the organic layer raw material supply unit 154 passes through the heating nozzle 150 a and is agglomerated by a certain amount on the substrate Z. In this case, the temperature of the heating nozzle 150a is preferably maintained at 150 to 300 ° C.

  In order to improve the aggregation efficiency, it is preferable to cool the drum 26 and hold the substrate Z at, for example, −15 to 25 ° C.

The curing unit 156 cures the monomer compound that becomes an organic layer aggregated on the substrate Z to form an organic layer. For example, a UV irradiation unit that irradiates UV light 156a (see FIG. 2) is used as the curing unit 156. In this UV irradiation means, the UV illuminance is preferably 10 to 100 mW / cm ² .

  Note that as the curing unit 156, an electron beam irradiation unit that irradiates an electron beam or a microwave irradiation unit that irradiates a microwave may be used.

  The thickness (dry film thickness) of the organic layer obtained by these methods is not particularly limited, but the organic layer has a thickness as described above, more preferably a thickness as described above, and a barrier layer as described above. It is preferable to form it on a predetermined layer (for example, a base material, a barrier layer, or other layer formed on the barrier layer, preferably a barrier layer) at a thickness ratio of

[Underlayer (smooth layer, primer layer)]
The gas barrier film of the present invention may have a base layer (smooth layer, primer layer) between the surface of the substrate having the barrier layer, preferably between the substrate and the barrier layer. The underlayer is provided in order to flatten the rough surface of the substrate on which the protrusions and the like exist, or to fill the unevenness and pinholes generated in the barrier layer with the protrusions existing on the substrate and to flatten the surface. Such an underlayer may be formed of any material, but preferably includes a carbon-containing polymer, and more preferably includes a carbon-containing polymer. That is, it is preferable that the gas barrier film of the present invention further has an underlayer containing a carbon-containing polymer between the base material and the barrier layer.

  The underlayer also contains a carbon-containing polymer, preferably a curable resin. The curable resin is not particularly limited, and the active energy ray curable resin or the thermosetting material obtained by irradiating the active energy ray curable material or the like with an active energy ray such as an ultraviolet ray to be cured is heated. And thermosetting resins obtained by curing. These curable resins may be used alone or in combination of two or more.

  Examples of the active energy ray-curable material used for forming the underlayer include a composition containing an acrylate compound, a composition containing an acrylate compound and a mercapto compound containing a thiol group, epoxy acrylate, urethane acrylate, and polyester. Examples include compositions containing polyfunctional acrylate monomers such as acrylates, polyether acrylates, polyethylene glycol acrylates, and glycerol methacrylates. Specifically, it is possible to use a UV curable organic / inorganic hybrid hard coating material OPSTAR (registered trademark) series (compound obtained by bonding an organic compound having a polymerizable unsaturated group to silica fine particles) manufactured by JSR Corporation. it can. It is also possible to use any mixture of the above-mentioned compositions, and an active energy ray-curable material containing a reactive monomer having at least one photopolymerizable unsaturated bond in the molecule. If there is no restriction in particular.

  Examples of reactive monomers having at least one photopolymerizable unsaturated bond in the molecule include methyl acrylate, ethyl acrylate, n-propyl acrylate, isopropyl acrylate, n-butyl acrylate, isobutyl acrylate, tert-butyl acrylate, and n-pentyl. Acrylate, n-hexyl acrylate, 2-ethylhexyl acrylate, n-octyl acrylate, n-decyl acrylate, hydroxyethyl acrylate, hydroxypropyl acrylate, allyl acrylate, benzyl acrylate, butoxyethyl acrylate, butoxyethylene glycol acrylate, cyclohexyl acrylate, dicyclo Pentanyl acrylate, 2-ethylhexyl acrylate, glycerol acrylate, glycy Acrylate, 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, isobornyl acrylate, isodexyl acrylate, isooctyl acrylate, lauryl acrylate, 2-methoxyethyl acrylate, methoxyethylene glycol acrylate, phenoxyethyl acrylate, stearyl acrylate, Ethylene glycol diacrylate, diethylene glycol diacrylate, 1,4-butanediol diacrylate, 1,5-pentanediol diacrylate, 1,6-hexadiol diacrylate, 1,3-propanediol acrylate, 1,4-cyclohexanediol Diacrylate, 2,2-dimethylolpropane diacrylate, glycerol diacrylate, tripropylene Glycol diacrylate, glycerol triacrylate, trimethylolpropane triacrylate, polyoxyethyltrimethylolpropane triacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, ethylene oxide modified pentaerythritol triacrylate, ethylene oxide modified pentaerythritol tetraacrylate, propylene Oxide modified pentaerythritol triacrylate, propylene oxide modified pentaerythritol tetraacrylate, triethylene glycol diacrylate, polyoxypropyltrimethylolpropane triacrylate, butylene glycol diacrylate, 1,2,4-butanediol triacrylate, 2,2, 4-to Limethyl-1,3-pentadiol diacrylate, diallyl fumarate, 1,10-decanediol dimethyl acrylate, pentaerythritol hexaacrylate, and acrylate replaced with methacrylate, γ-methacryloxypropyltrimethoxysilane, Examples thereof include 1-vinyl-2-pyrrolidone and the like. Said reactive monomer can be used as a 1 type, 2 or more types of mixture, or a mixture with another compound.

  It is preferable that the composition containing an active energy ray-curable material contains a photopolymerization initiator.

  Examples of the photopolymerization initiator include benzophenone, methyl o-benzoylbenzoate, 4,4-bis (dimethylamine) benzophenone, 4,4-bis (diethylamine) benzophenone, α-amino acetophenone, 4,4-dichloro. Benzophenone, 4-benzoyl-4-methyldiphenyl ketone, dibenzyl ketone, fluorenone, 2,2-diethoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2-hydroxy-2-methylpropiophenone, p- tert-butyldichloroacetophenone, thioxanthone, 2-methylthioxanthone, 2-chlorothioxanthone, 2-isopropylthioxanthone, diethylthioxanthone, benzyldimethyl ketal, benzylmethoxyethyl acetal, benzoy Methyl ether, benzoin butyl ether, anthraquinone, 2-tert-butylanthraquinone, 2-amylanthraquinone, β-chloroanthraquinone, anthrone, benzanthrone, dibenzsuberone, methyleneanthrone, 4-azidobenzylacetophenone, 2,6-bis (p-azide Benzylidene) cyclohexane, 2,6-bis (p-azidobenzylidene) -4-methylcyclohexanone, 2-phenyl-1,2-butadion-2- (o-methoxycarbonyl) oxime, 1-phenyl-propanedione-2- (O-ethoxycarbonyl) oxime, 1,3-diphenyl-propanetrione-2- (o-ethoxycarbonyl) oxime, 1-phenyl-3-ethoxy-propanetrione-2- (o-benzoyl) oxy , Michler's ketone, 2-methyl [4- (methylthio) phenyl] -2-monoforino-1-propane, 2-benzyl-2-dimethylamino-1- (4-monoforinophenyl) -butanone-1, naphthalenesulfonyl chloride Quinolinesulfonyl chloride, n-phenylthioacridone, 4,4-azobisisobutyronitrile, diphenyl disulfide, benzthiazole disulfide, triphenylphosphine, camphorquinone, carbon tetrabromide, tribromophenyl sulfone, benzoin peroxide And combinations of photoreducing dyes such as eosin and methylene blue and reducing agents such as ascorbic acid and triethanolamine. These photopolymerization initiators can be used alone or in combination of two or more. .

  Specific examples of thermosetting materials include TutProm Series (Organic Polysilazane) manufactured by Clariant, SP COAT heat-resistant clear paint manufactured by Ceramic Coat, Nanohybrid Silicone manufactured by Adeka, Unicom manufactured by DIC, Inc. Dick (registered trademark) V-8000 series, EPICLON (registered trademark) EXA-4710 (ultra-high heat resistant epoxy resin), silicon resin X-12-2400 (trade name) manufactured by Shin-Etsu Chemical Co., Ltd., Nitto Boseki Co., Ltd. Inorganic / organic nanocomposite material SSG coating, thermosetting urethane resin consisting of acrylic polyol and isocyanate prepolymer, phenol resin, urea melamine resin, epoxy resin, unsaturated polyester resin, silicon resin, polyamidoamine-epichlorohydrin resin And the like.

  The formation method of the underlayer is not particularly limited, but a coating solution containing a curable material is applied to a dry coating method such as a spin coating method, a spray method, a blade coating method, a dipping method, a gravure printing method, or a vapor deposition method. After applying the coating method to form a coating film, irradiation with active energy rays such as visible light, infrared rays, ultraviolet rays, X-rays, α rays, β rays, γ rays, electron beams, and / or heating, the coating films are formed. A method of forming by curing is preferred. As a method of irradiating active energy rays, for example, an ultra-high pressure mercury lamp, a high-pressure mercury lamp, a low-pressure mercury lamp, a carbon arc, a metal halide lamp or the like is preferably used to irradiate ultraviolet rays in a wavelength region of 100 to 400 nm, more preferably 200 to 400 nm Alternatively, a method of irradiating an electron beam having a wavelength region of 100 nm or less emitted from a scanning or curtain type electron beam accelerator can be used.

  Solvents used when forming the underlayer using a coating solution in which a curable material is dissolved or dispersed in a solvent include alcohols such as methanol, ethanol, n-propyl alcohol, isopropyl alcohol, ethylene glycol, and propylene glycol Terpenes such as α- or β-terpineol, etc., ketones such as acetone, methyl ethyl ketone, cyclohexanone, N-methyl-2-pyrrolidone, diethyl ketone, 2-heptanone, 4-heptanone, toluene, xylene, tetramethylbenzene, etc. Aromatic hydrocarbons, cellosolve, methyl cellosolve, ethyl cellosolve, carbitol, methyl carbitol, ethyl carbitol, butyl carbitol, propylene glycol monomethyl ether, propylene glycol monoethyl ether , Glycol ethers such as dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, triethylene glycol monomethyl ether, triethylene glycol monoethyl ether, ethyl acetate, butyl acetate, cellosolve acetate, ethyl cellosolve acetate, butyl cellosolve acetate, carb Acetic esters such as tall acetate, ethyl carbitol acetate, butyl carbitol acetate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, 2-methoxyethyl acetate, cyclohexyl acetate, 2-ethoxyethyl acetate, 3-methoxybutyl acetate , Diethylene glycol dialkyl ether, dipropylene Glycol dialkyl ethers, ethyl 3-ethoxypropionate, methyl benzoate, N, N- dimethylacetamide, N, may be mentioned N- dimethylformamide.

  The underlayer can contain additives such as a thermoplastic resin, an antioxidant, an ultraviolet absorber, and a plasticizer, if necessary, in addition to the above-described materials. In addition, an appropriate resin or additive may be used for improving the film formability and preventing the occurrence of pinholes in the film. Examples of the thermoplastic resin include cellulose derivatives such as acetylcellulose, nitrocellulose, acetylbutylcellulose, ethylcellulose and methylcellulose, vinyl acetate and copolymers thereof, vinyl chloride and copolymers thereof, vinylidene chloride and copolymers thereof and the like. Examples include resins, acetal resins such as polyvinyl formal and polyvinyl butyral, acrylic resins and copolymers thereof, acrylic resins such as methacrylic resins and copolymers thereof, polystyrene resins, polyamide resins, linear polyester resins, and polycarbonate resins.

  The smoothness of the underlayer is a value expressed by the surface roughness specified in JIS B 0601: 2001, and the maximum cross-sectional height Rt (p) is preferably 10 nm or more and 30 nm or less.

  The surface roughness is calculated from an uneven cross-sectional curve continuously measured by an AFM (Atomic Force Microscope) with a detector having a stylus having a minimum tip radius, and the measurement direction is several tens by the stylus having a minimum tip radius. It is the roughness related to the amplitude of fine irregularities measured in a section of μm many times.

  Although it does not restrict | limit especially as thickness of a base layer, The range of 0.1-10 micrometers is preferable.

[Anchor coat layer]
On the surface of the base material according to the present invention, an anchor coat layer may be formed as an easy adhesion layer for the purpose of improving adhesiveness (adhesion). Examples of the anchor coating agent used in this anchor coat layer include polyester resin, isocyanate resin, urethane resin, acrylic resin, ethylene vinyl alcohol resin, vinyl modified resin, epoxy resin, modified styrene resin, modified silicon resin, and alkyl titanate. One type or two or more types can be used in combination. A commercially available product may be used as the anchor coating agent. Specifically, a siloxane-based UV curable polymer solution (manufactured by Shin-Etsu Chemical Co., Ltd., 3% isopropyl alcohol solution of “X-12-2400”) can be used.

Conventionally known additives can be added to these anchor coating agents. The above-mentioned anchor coating agent is coated on a substrate by a known method such as roll coating, gravure coating, knife coating, dip coating, spray coating, and the like, and is coated by drying and removing the solvent, diluent, etc. Can do. The application amount of the anchor coating agent is preferably about 0.1 to 5 g / m ² (dry state). A commercially available base material with an easy-adhesion layer may be used.

  Alternatively, the anchor coat layer can be formed by a vapor phase method such as physical vapor deposition or chemical vapor deposition. For example, as described in JP-A-2008-142941, an inorganic film mainly composed of silicon oxide can be formed for the purpose of improving adhesion and the like.

  The thickness of the anchor coat layer is not particularly limited, but is preferably about 0.5 to 10.0 μm.

[Bleed-out prevention layer]
The gas barrier film of the present invention can further have a bleed-out preventing layer. The bleed-out prevention layer is a smooth layer for the purpose of suppressing the phenomenon that unreacted oligomers migrate from the film base material to the surface when the film having the base layer is heated and contaminate the contact surface. It is provided on the opposite surface of the substrate. The bleed-out prevention layer may basically have the same configuration as the smooth layer as long as it has this function.

  Compounds that can be included in the bleed-out prevention layer include polyunsaturated organic compounds having two or more polymerizable unsaturated groups in the molecule, or one polymerizable unsaturated group in the molecule. Hard coat agents such as unitary unsaturated organic compounds can be mentioned.

  Here, as the polyunsaturated organic compound, for example, ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, glycerol di (meth) acrylate, glycerol tri (meth) acrylate, 1,4-butanediol di (Meth) acrylate, 1,6-hexanediol di (meth) acrylate, neopentyl glycol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, dicyclopentanyl di (meth) acrylate, pentaerythritol tri (meta ) Acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol hexa (meth) acrylate, dipentaerythritol monohydroxypenta (meth) acrylate, ditrimethylolpropane Tiger (meth) acrylate, diethylene glycol di (meth) acrylate, polyethylene glycol di (meth) acrylate, tripropylene glycol di (meth) acrylate, polypropylene glycol di (meth) acrylate.

  Examples of unit unsaturated organic compounds include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, isodecyl (meth) acrylate, and lauryl. (Meth) acrylate, stearyl (meth) acrylate, allyl (meth) acrylate, cyclohexyl (meth) acrylate, methylcyclohexyl (meth) acrylate, isobornyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl ( (Meth) acrylate, glycerol (meth) acrylate, glycidyl (meth) acrylate, benzyl (meth) acrylate, 2-ethoxyethyl (meth) acrylate, 2- (2-eth Ciethoxy) ethyl (meth) acrylate, butoxyethyl (meth) acrylate, 2-methoxyethyl (meth) acrylate, methoxydiethylene glycol (meth) acrylate, methoxytriethylene glycol (meth) acrylate, methoxypolyethylene glycol (meth) acrylate, 2- Examples include methoxypropyl (meth) acrylate, methoxydipropylene glycol (meth) acrylate, methoxytripropylene glycol (meth) acrylate, methoxypolypropylene glycol (meth) acrylate, polyethylene glycol (meth) acrylate, and polypropylene glycol (meth) acrylate. .

  As other additives, a matting agent may be contained. As the matting agent, inorganic particles having an average particle diameter of about 0.1 to 5 μm are preferable.

  As such inorganic particles, one or more of silica, alumina, talc, clay, calcium carbonate, magnesium carbonate, barium sulfate, aluminum hydroxide, titanium dioxide, zirconium oxide and the like can be used in combination. .

  Here, the matting agent composed of inorganic particles is 2 parts by weight or more, preferably 4 parts by weight or more, more preferably 6 parts by weight or more and 20 parts by weight or less, preferably 100 parts by weight of the solid content of the hard coating agent. It is desirable that they are mixed in a proportion of 18 parts by weight or less, more preferably 16 parts by weight or less.

  In addition, the bleed-out prevention layer may contain a thermoplastic resin, a thermosetting resin, an ionizing radiation curable resin, a photopolymerization initiator, and the like as other components of the hard coat agent and the mat agent.

  Examples of such thermoplastic resins include cellulose derivatives such as acetylcellulose, nitrocellulose, acetylbutylcellulose, ethylcellulose, methylcellulose, vinyl acetate and copolymers thereof, vinyl chloride and copolymers thereof, vinylidene chloride and copolymers thereof. Vinyl resins such as polyvinyl formal, acetal resins such as polyvinyl formal and polyvinyl butyral, acrylic resins and copolymers thereof, acrylic resins such as methacrylic resins and copolymers thereof, polystyrene resins, polyamide resins, linear polyester resins, polycarbonates Examples thereof include resins.

  Moreover, as a thermosetting resin, the thermosetting urethane resin which consists of an acrylic polyol and an isocyanate prepolymer, a phenol resin, a urea melamine resin, an epoxy resin, an unsaturated polyester resin, a silicon resin etc. are mentioned.

  In addition, as an ionizing radiation curable resin, an ionizing radiation (ultraviolet ray or electron beam) is irradiated to an ionizing radiation curable coating material in which one or more of a photopolymerizable prepolymer or a photopolymerizable monomer is mixed. Those that cure can be used. Here, as the photopolymerizable prepolymer, an acrylic prepolymer having two or more acryloyl groups in one molecule and having a three-dimensional network structure by crosslinking and curing is particularly preferably used. As this acrylic prepolymer, urethane acrylate, polyester acrylate, epoxy acrylate, melamine acrylate and the like can be used. Further, as the photopolymerizable monomer, the polyunsaturated organic compounds described above can be used.

  Examples of the photopolymerization initiator include acetophenone, benzophenone, Michler's ketone, benzoin, benzylmethyl ketal, benzoin benzoate, hydroxycyclohexyl phenyl ketone, 2-methyl-1- (4- (methylthio) phenyl) -2- (4-morpholinyl). ) -1-propane, α-acyloxime ester, thioxanthone and the like.

  The bleed-out prevention layer as described above is prepared as a coating solution by blending a hard coat agent and other components as necessary, and appropriately using a diluting solvent as necessary. After coating by a conventionally known coating method, it can be formed by irradiating with ionizing radiation and curing. As a method of irradiating with ionizing radiation, ultraviolet rays having a wavelength range of 100 to 400 nm, preferably 200 to 400 nm, emitted from an ultra-high pressure mercury lamp, a high-pressure mercury lamp, a low-pressure mercury lamp, a carbon arc, a metal halide lamp or the like are irradiated or scanned. The irradiation can be performed by irradiating an electron beam having a wavelength region of 100 nm or less emitted from a type or curtain type electron beam accelerator.

  The thickness of the bleed-out prevention layer is 1 to 10 μm, preferably 2 to 7 μm. By making it 1 μm or more, it becomes easy to make the heat resistance as a film sufficient, and by making it 10 μm or less, it becomes easy to adjust the balance of the optical properties of the smooth film, and the smooth layer is one of the transparent polymer films. When it is provided on this surface, curling of the barrier film can be easily suppressed.

  As the gas barrier film of the present invention, those described in paragraphs “0036” to “0038” of JP-A No. 2006-289627 can be preferably employed in addition to the above-mentioned ones.

<Electronic device>
The gas barrier film of the present invention can be preferably used for a device whose performance is deteriorated by chemical components (oxygen, water, nitrogen oxide, sulfur oxide, ozone, etc.) in the air. Examples of the device include electronic devices such as an organic EL element, a liquid crystal display element (LCD), a thin film transistor, a touch panel, electronic paper, and a solar cell (PV). From the viewpoint that the effect of the present invention can be obtained more efficiently, it is preferably used for an organic EL device or a solar cell, and particularly preferably used for an organic EL device.

  The gas barrier film of the present invention can also be used for device film sealing. That is, it is a method of providing the gas barrier film of the present invention on the surface of the device itself as a support. The device may be covered with a protective layer before providing the gas barrier film.

  The gas barrier film of the present invention can also be used as a device substrate or a film for sealing by a solid sealing method. The solid sealing method is a method in which after a protective layer is formed on a device, an adhesive layer and a gas barrier film are stacked and cured. Although there is no restriction | limiting in particular in an adhesive agent, A thermosetting epoxy resin, a photocurable acrylate resin, etc. are illustrated.

(Organic EL device)
An example of an organic EL element using a gas barrier film is described in detail in Japanese Patent Application Laid-Open No. 2007-30387.

(Liquid crystal display element)
The reflective liquid crystal display device has a configuration including a lower substrate, a reflective electrode, a lower alignment film, a liquid crystal layer, an upper alignment film, a transparent electrode, an upper substrate, a λ / 4 plate, and a polarizing film in order from the bottom. The gas barrier film in the present invention can be used as the transparent electrode substrate and the upper substrate. In the case of color display, it is preferable to further provide a color filter layer between the reflective electrode and the lower alignment film, or between the upper alignment film and the transparent electrode. The transmissive liquid crystal display device includes, in order from the bottom, a backlight, a polarizing plate, a λ / 4 plate, a lower transparent electrode, a lower alignment film, a liquid crystal layer, an upper alignment film, an upper transparent electrode, an upper substrate, a λ / 4 plate, and a polarization It has the structure which consists of a film | membrane. In the case of color display, it is preferable to further provide a color filter layer between the lower transparent electrode and the lower alignment film, or between the upper alignment film and the transparent electrode. The type of the liquid crystal cell is not particularly limited, but more preferably a TN type (Twisted Nematic), an STN type (Super Twisted Nematic), a HAN type (Hybrid Aligned Nematic), a VA type (Vertical Alignment), an EC type, a B type. OCB type (Optically Compensated Bend), IPS type (In-Plane Switching), and CPA type (Continuous Pinwheel Alignment) are preferable.

(Solar cell)
The gas barrier film of the present invention can also be used as a sealing film for solar cell elements. Here, the gas barrier film of the present invention is preferably sealed so that the barrier layer is closer to the solar cell element. The solar cell element in which the gas barrier film of the present invention is preferably used is not particularly limited. Amorphous silicon-based solar cell elements, III-V compound semiconductor solar cell elements such as gallium arsenide (GaAs) and indium phosphorus (InP), II-VI compound semiconductor solar cell elements such as cadmium tellurium (CdTe), I / III- such as copper / indium / selenium system (so-called CIS system), copper / indium / gallium / selenium system (so-called CIGS system), copper / indium / gallium / selenium / sulfur system (so-called CIGS system) Group VI compound semiconductor solar cell element, dye-sensitized solar cell element, organic solar cell element, etc. And the like. In particular, in the present invention, the solar cell element is a copper / indium / selenium system (so-called CIS system), a copper / indium / gallium / selenium system (so-called CIGS system), copper / indium / gallium / selenium / sulfur. It is preferable that it is an I-III-VI group compound semiconductor solar cell element, such as a system (so-called CIGSS system).

(Other)
As other application examples, the thin film transistor described in JP-A-10-512104, the touch panel described in JP-A-5-127822, JP-A-2002-48913, etc., described in JP-A-2000-98326. Electronic paper and the like.

<Optical member>
The gas barrier film of the present invention can also be used as an optical member. Examples of the optical member include a circularly polarizing plate.

(Circularly polarizing plate)
A circularly polarizing plate can be produced by laminating a λ / 4 plate and a polarizing plate using the gas barrier film in the present invention as a substrate. In this case, the lamination is performed so that the angle formed by the slow axis of the λ / 4 plate and the absorption axis of the polarizing plate is 45 °. As such a polarizing plate, one that is stretched in a direction of 45 ° with respect to the longitudinal direction (MD) is preferably used. For example, the one described in JP-A-2002-86554 can be suitably used. .

  The effects of the present invention will be described using the following examples and comparative examples. However, the technical scope of the present invention is not limited only to the following examples. Further, in the examples, the display of “part” or “%” is used, but “part by weight” or “% by weight” is expressed unless otherwise specified. Moreover, in the following operation, unless otherwise specified, the measurement of the operation and physical properties is performed under conditions of room temperature (20 to 25 ° C.) / Relative humidity 40 to 50%.

  Each characteristic value of the gas barrier film is measured according to the following method.

[Evaluation method of water vapor barrier properties]
On the barrier layer surface of each gas barrier film sample, using a vacuum vapor deposition device (JEOL-made vacuum vapor deposition device JEE-400), mask the gas barrier film sample except for the portion to be vapor deposited (12 mm × 12 mm 9 locations), and metal Calcium was deposited. Thereafter, the mask is removed in a vacuum state, and aluminum is vapor deposited from another metal vapor deposition source on the entire surface of one side of the sheet. After aluminum sealing, the vacuum state is released, and immediately facing the aluminum sealing side through a UV-curable resin for sealing (made by Nagase ChemteX) on quartz glass with a thickness of 0.2 mm in a dry nitrogen gas atmosphere Then, a water vapor barrier property evaluation cell was produced by irradiating with ultraviolet rays.

  The obtained sample with both sides sealed is stored under high temperature and high humidity of 60 ° C. and 90% RH, and permeated into the cell from the corrosion amount of metallic calcium based on the method described in JP-A-2005-283561. The amount of water was calculated.

  In addition, in order to confirm that there is no permeation of water vapor from other than the gas barrier film surface, a sample obtained by depositing metallic calcium using a quartz glass plate having a thickness of 0.2 mm instead of the gas barrier film sample as a comparative sample Was stored under the same high temperature and high humidity conditions of 60 ° C. and 90% RH, and it was confirmed that no corrosion of metallic calcium occurred even after 1000 hours.

  The permeated water amount of each gas barrier film measured as described above was evaluated.

(Devices and materials used)
Vapor deposition device: JE-400, a vacuum vapor deposition device manufactured by JEOL Ltd.
Constant temperature and humidity oven: Yamato Humidic Chamber IG47M
Metal that reacts with water and corrodes: Calcium (granular)
Water vapor-impermeable metal: Aluminum (φ3 to 5 mm, granular).

[Flexibility: Evaluation of water vapor permeability after bending test]
Each gas barrier laminate film was bent 100 times at an angle of 180 degrees so that the radius of curvature was 10 mm, and then the amount of permeated water was measured by the same method as above, and the permeation before and after the bending treatment. From the change in water content, the degree of deterioration resistance was measured according to the following formula, and the bending resistance was evaluated according to the following criteria.

Deterioration resistance = (water permeation before bending test / water permeation after bending test) × 100 (%)
5: Deterioration resistance is 90% or more 4: Deterioration resistance is 80% or more and less than 90% 3: Deterioration resistance is 60% or more and less than 80% 2: Deterioration resistance is 30% or more and less than 60% 1: Deterioration resistance is less than 30%.

[Impact resistance: Evaluation of water vapor permeability after drop weight impact test]
The test of allowing a 10 g weight (R = 2.5 mm) from an arbitrary height to freely drop vertically from the height of 10 cm onto the surface of the gas barrier laminate film was performed five times or more, and the water vapor transmission rate of the film was measured.

Example 1 (films 111-132)
1. Base material A biaxially stretched polyethylene naphthalate film (PEN film, thickness: 100 μm, width: 350 mm, manufactured by Teijin DuPont Films, trade name “Teonex Q65FA”) was used as the base material.

2. Formation of Underlayer (1) Organic Underlayer On the easy-adhesion surface of the above base material, 198 g of trimethylolpropane triacrylate (Light Acrylate Series TMP-A, manufactured by Kyoeisha Chemical Co., Ltd.), UV polymerization initiator (Ciba Specialty Chemicals) Using a mixed solution of 2 g of Ciba Irgacure 907 (trade name), manufactured by the company, flash vapor deposition was performed to form an organic underlayer having a thickness of 500 nm.

  In addition, the flash vapor deposition is performed by attaching the above mixed solution to the surface of the barrier layer on the substrate under the following conditions so that an underlayer is formed on the substrate. Aggregation was performed, and the monomer compound in the mixed solution was cured under the following conditions to form an underlayer having a thickness of 4 μm (dry film thickness). The trimethylolpropane triacrylate used here is a compound described as “F” in Table 1.

(2) Organic / inorganic hybrid undercoat layer UV-curable organic / inorganic hybrid hard coat material OPSTAR (registered trademark) Z7501 manufactured by JSR Corporation on the easy-adhesion surface of the above base material so that the film thickness after drying becomes 4 μm. After coating with a wire bar, it was dried at 80 ° C. for 3 minutes, and then cured in an air atmosphere using a high-pressure mercury lamp, curing conditions: 1.0 J / cm ² to form an underlayer. The maximum cross-sectional height Rt (p) representing the surface roughness at this time was 16 nm. The surface roughness is calculated from an uneven sectional curve continuously measured with a detector having a stylus having a minimum tip radius using an AFM (Atomic Force Microscope AFM: manufactured by Digital Instruments), and the minimum tip radius is calculated. Was measured many times in the section having a measurement direction of 30 μm with the stylus of No. 1 and obtained from the average roughness with respect to the amplitude of fine irregularities.

3. Formation of Barrier Layer (1) Silicon Nitride Film Using a CVD apparatus (PD220NA manufactured by Samco), a silicon nitride film having a thickness of 100 nm was formed on the surface of the substrate to produce a gas barrier film.

  As the substrate, a PET film having a thickness of 100 μm (Cosmo Shine A4300 manufactured by Toyobo Co., Ltd.) was used. The substrate Z was placed at a predetermined position of the substrate holder, and the vacuum chamber was closed. The substrate holder is made of aluminum and incorporates a refrigerant circulation system as temperature adjusting means. The temperature adjusting means built in the substrate holder was driven so that the temperature of the substrate was 70 ° C. The temperature adjusting means measured the temperature of the substrate holder, and controlled the temperature of the substrate by performing feedback control so that the temperature became constant at 70 ° C. The substrate holder is made of aluminum having a high thermal conductivity, and the thickness of the substrate is as thin as 100 μm. Therefore, the temperature of the substrate holder is almost equal to the temperature of the substrate.

  After the time necessary for the temperature stabilization of the substrate (substrate holder) has elapsed, the vacuum evacuation means is driven to evacuate the vacuum chamber, and when the pressure in the vacuum chamber reaches 0.01 Pa, the gas supply means Silane gas, ammonia gas, and nitrogen gas were supplied to the shower electrode as source gases. The silane gas flow rate was 50 sccm, the ammonia gas flow rate was 50 sccm, and the nitrogen gas flow rate was 400 sccm.

  Next, the exhaust by the vacuum exhaust means was adjusted so that the pressure in the vacuum chamber (film formation pressure) was 40 Pa.

  After the pressure in the vacuum chamber is stabilized, a high-frequency power source is driven to supply 1000 W of power with a frequency of 13.56 MHz to the shower electrode as the main power for plasma generation. When driven, a bias potential with a frequency of 100 kHz was applied to the substrate holder to start the formation of a silicon nitride film on the surface of the substrate. Note that the output of the bias power source (power supplied to the substrate holder) was adjusted so that the potential of the substrate holder was -100V.

  That is, in this example, power supplied to the shower electrode / silane gas flow rate = P / Q = 1000 W / 50 sccm = 20 W / sccm.

(2) Carbon silicon oxide film The base material with the base layer formed on the surface is mounted on a Kobelco plasma CVD roll coater W35 series apparatus so that the base layer is on top, and hexamethyldisiloxane (HMDSO) is used. Then, a film was formed under the following film forming conditions (plasma CVD conditions), and a barrier layer was formed on the base layer with a thickness of 300 nm. Moreover, when not forming a base layer, the barrier layer was directly formed on the base material on the same film forming conditions.

  The obtained sample was subjected to XPS depth profile measurement under the following conditions to obtain silicon element distribution, oxygen difference element distribution, and carbon element distribution. The result of the carbon silicon oxide film is shown in FIG. 3 (the result of the silicon nitride film is not shown).

  The carbon distribution curve obtained by the XPS depth profile measurement of the silicon nitride film did not have an extreme value.

  Further, the carbon distribution curve obtained by the XPS depth profile measurement of the carbon silicon oxide film has a plurality of (5) distinct extreme values as is apparent from FIG. The absolute value of the difference between the maximum value and the minimum value of the carbon atomic ratio is 3 at% or more (the absolute value of the difference between the maximum value and the minimum value of the carbon atomic ratio of the films 113 to 125: 14.02%). In addition, in the region where the atomic ratio of silicon, the atomic ratio of oxygen and the atomic ratio of carbon is 90% or more of the film thickness of the barrier layer, the largest (oxygen atomic ratio), (silicon atomic ratio), (carbon It was confirmed that the atomic ratio was in order.

4). Formation of organic layer 3. The substrate on which the barrier layer obtained in (1) was formed was mounted on the apparatus shown in FIG. 2 so that the organic layer was formed on the barrier layer.

  As the organic layer forming material, a mixed solution of 198 g of a monomer compound shown in the following Table 1 and 2 g of an ultraviolet polymerization initiator (Ciba Irgacure 907 (trade name) manufactured by Ciba Specialty Chemicals) was used. The organic layer forming material is supplied to the surface of the barrier layer on the substrate and aggregated under the following conditions, and the monomer compound in the organic layer forming material is cured and dried in various thicknesses under the following conditions. (Thickness) organic layer was formed. In addition, each thickness of the organic layer was adjusted by adjusting conveyance conditions. Table 1 also shows the monomer compounds used, the glass transition temperature of the organic layer obtained using each monomer compound, and the C—C bond density of each monomer compound.

  The glass transition temperature of the organic layer was measured using TMA 8310 manufactured by Rigaku Corporation. Moreover, XPS analysis of each monomer compound was performed, and CC bond density was calculated | required. The XPS analysis of the monomer compound was performed under the following conditions.

  The gas barrier films 111 to 132 produced in Example 1 were evaluated for water vapor transmission rate, flexibility and impact resistance, and the results are shown in Table 2 below.

  From the above Table 2, it is shown that the gas barrier film (films 114 to 132) of the present invention exhibits excellent water vapor barrier properties, flexibility and impact resistance.

Example 2 (films 211 to 215)
(1) Film 211, 212, 214
In Example 1, the transport speed of the barrier layer deposition conditions was changed from 0.5 m / min to 0.43 m / min, and the thicknesses of the barrier layer and the organic layer (film thickness after drying) were as follows: Gas barrier films 211, 212, and 214 were produced in the same manner as in Example 1 except that the changes were made as shown in Table 3. In addition, the thickness of the organic layer was 250 nm by adjusting the conveyance speed.

  About the barrier layer formed in the formation process of each barrier layer, XPS depth profile measurement was performed in the same manner as in Example 1 to obtain silicon element distribution, oxygen difference element distribution, carbon element distribution, and oxygen carbon distribution. The silicon atomic ratio, the oxygen atomic ratio, and the carbon atomic ratio in all the barrier layers are 90% or more of the thickness of the barrier layer (the atomic ratio of oxygen). ), (Atomic ratio of carbon).

(2) Films 213 and 215
As the organic layer forming material, a mixed solution of 198 g of the monomer compound shown in Table 2 and 2 g of an ultraviolet polymerization initiator (Ciba Irgacure 907 (trade name) manufactured by Ciba Specialty Chemicals) was used.

  Next, in Example 1, 3. The organic layer forming material prepared above is applied by the bar coating method on the barrier layer of the substrate on which the barrier layer obtained in the same manner is formed, and heated at 85 ° C. for 30 minutes, By heat curing, gas barrier films 213 and 215 having an organic layer (film thickness after drying: 0.25 μm) formed on the barrier layer were produced.

  The gas barrier films 211 to 215 produced in Example 2 were evaluated for water vapor transmission rate, flexibility and impact resistance, and the results are shown in Table 3 below.

  From the above Table 3, it is shown that the gas barrier film of the present invention exhibits excellent water vapor barrier properties, flexibility and impact resistance as compared with the comparative gas barrier film.

Example 3 (films 311 to 315)
In Example 1, gas barrier films 311 to 315 were produced in the same manner as in Example 1 except that the thicknesses of the barrier layer and the organic layer were changed as shown in Table 4 below. In addition, the thickness of the organic layer was 250 nm by adjusting the conveyance speed.

  About the barrier layer formed in the formation process of each barrier layer, XPS depth profile measurement was performed in the same manner as in Example 1 to obtain silicon element distribution, oxygen difference element distribution, carbon element distribution, and oxygen carbon distribution. The silicon atomic ratio, the oxygen atomic ratio, and the carbon atomic ratio in all the barrier layers are 90% or more of the thickness of the barrier layer (the atomic ratio of oxygen). ), (Atomic ratio of carbon).

  The gas barrier films 311 to 315 produced in Example 3 were evaluated for water vapor transmission rate, flexibility and impact resistance, and the results are shown in Table 4 below.

  From Table 4 above, it is shown that the gas barrier film of the present invention exhibits excellent water vapor barrier properties, flexibility and impact resistance.

Example 4 (Films 411 to 419)
(1) Films 411-414
In Example 1, gas barrier films 411 to 414 were produced in the same manner as in Example 1 except that the thickness (dry film thickness) of the organic layer was changed as shown in Table 5 below. In addition, each thickness of the organic layer was adjusted by adjusting the conveyance speed.

(2) Film 415
In Example 1, a gas barrier film 415 was produced in the same manner as in Example 1 except that the film formation condition was changed from 0.5 m / min to 0.85 m / min. In addition, the thickness of the organic layer was 250 nm by adjusting the conveyance speed.

(3) Films 416-419
In Example 1, the layer having a thickness of 300 nm as the barrier layer was repeated 2 to 4 times, and the gas barrier was changed in the same manner as in Example 1 except that the thickness (dry film thickness) of the barrier layer was changed to 600 to 1200 nm. Films 416 to 419 were prepared.

  About the barrier layer formed in the formation process of each barrier layer, XPS depth profile measurement was performed in the same manner as in Example 1 to obtain silicon element distribution, oxygen difference element distribution, carbon element distribution, and oxygen carbon distribution. The silicon atomic ratio, the oxygen atomic ratio, and the carbon atomic ratio in all the barrier layers are 90% or more of the thickness of the barrier layer (the atomic ratio of oxygen). ), (Atomic ratio of carbon).

  The gas barrier films 411 to 419 produced in Example 4 were evaluated for water vapor permeability, flexibility and impact resistance, and the results are shown in Table 5 below.

  From Table 5 above, it is shown that the gas barrier film of the present invention exhibits excellent water vapor barrier properties, flexibility and impact resistance.

  This application is based on Japanese Patent Application No. 2012-281700 filed on December 25, 2012, and Japanese Patent Application No. 2013-26854 filed on February 14, 2013, The disclosure is incorporated by reference in its entirety.

Claims (5)

A gas barrier film comprising a substrate, a barrier layer containing silicon, oxygen and carbon, and an organic layer formed on at least one surface of the substrate,
The barrier layer has the following conditions (i) to (iii):
(I) The distance (L) from the surface of the barrier layer in the thickness direction of the barrier layer and the ratio of the amount of silicon atoms to the total amount of silicon atoms, oxygen atoms, and carbon atoms (atom ratio of silicon) A silicon distribution curve showing a relationship, an oxygen distribution curve showing a relationship between the L and the ratio of the amount of oxygen atoms to the total amount of silicon atoms, oxygen atoms, and carbon atoms (atomic ratio of oxygen), and the L and silicon atoms In the carbon distribution curve showing the relationship between the ratio of the amount of carbon atoms to the total amount of oxygen atoms, and carbon atoms (the atomic ratio of carbon),
In the region of 90% or more of the film thickness of the barrier layer, the order is (atomic ratio of oxygen), (atomic ratio of silicon), (atomic ratio of carbon) from the largest.
(Ii) the carbon distribution curve has at least two extreme values;
(Iii) The absolute value of the difference between the maximum value and the minimum value of the atomic ratio of carbon in the carbon distribution curve is 3 at% or more.
Gas barrier film that meets all requirements.   The gas barrier film according to claim 1, wherein the organic layer is composed of a (meth) acrylic compound having a glass transition temperature of 105 ° C. or higher and a thickness of 50 nm or more and less than 500 nm.   The film thickness ratio between the barrier layer and the organic layer (the thickness of the barrier layer (nm): the thickness of the organic layer (nm)) is 1: 0.1 to 10. Gas barrier film.   The gas barrier film according to any one of claims 1 to 3, further comprising an underlayer containing a carbon-containing polymer between the substrate and the barrier layer.   The gas barrier film according to any one of claims 1 to 4, wherein the organic layer is formed by a flash vapor deposition method.