JPWO2014098183A1 - Organic electroluminescence panel, manufacturing method and manufacturing apparatus thereof - Google Patents

Abstract

To suppress the generation of voids and sink marks, improve the luminous performance and appearance, suppress the occurrence of delamination, enable continuous production using long substrates, and improve productivity Provided are an organic electroluminescence panel, a method for manufacturing the same, and a manufacturing apparatus. Using a long element substrate with an organic electroluminescent element formed on the surface and a long sealing substrate with a sheet-like adhesive layer formed on the surface, the adhesive layer is heated in a reduced pressure environment below atmospheric pressure. And then fluidizing and bonding the element substrate and the sealing substrate to form a multilayer substrate, and non-fluidization by cooling the adhesive layer in a reduced pressure environment below atmospheric pressure to make it non-fluidized And a fluidizing step in which the adhesive layer is heated and fluidized under a pressure environment higher than the environmental pressure, and the sealing structure is formed in this order.

Description

  The present invention relates to a method and apparatus for manufacturing an organic electroluminescence panel (hereinafter also referred to as “organic EL panel”), and an organic EL panel manufactured by the manufacturing method and apparatus.

  When the material and the light emitting unit constituting the light emitting layer of the organic EL panel absorb moisture, the light emission luminance is significantly impaired. Therefore, it is necessary to keep the inside of the organic EL panel in a low-humidity environment, and a sealing structure is provided by providing means for shielding and protecting from the outside air.

As a manufacturing method of the organic EL panel, for example, an airtight space is created using a glass cap, a metal can, and an adhesive, and an organic electroluminescence element (hereinafter referred to as “organic EL element”) is also described therein. ) And a casing type method of sealing with a desiccant.
In recent years, a thin organic light emitting layer is formed on a plastic substrate or a glass substrate, and the surface is bonded with an adhesive using a flexible high barrier film or a metal foil, and sealed. An organic EL panel manufacturing method has been developed. This manufacturing method is being put to practical use as a method for manufacturing a thin and light organic EL panel having excellent moisture resistance.

  On the other hand, a method of manufacturing an organic EL panel by a roll-to-roll method using a flexible substrate such as a resin film has been actively studied. The roll-to-roll manufacturing method has the advantage of improving production efficiency because continuous production is possible. Moreover, in order to improve sealing performance, ie, bonding quality, various methods such as bonding under vacuum have been proposed for the sealing method of the surface bonding structure.

  Patent Document 1 discloses a manufacturing method in which vapor deposition is performed in a vacuum and substrates are bonded together in a vacuum. Patent Document 2 discloses that in a vacuum lamination of continuous base materials, efficient lamination is performed by providing storage means in the chamber. Patent Document 3 relates to a sealing device that attaches a half-cut sealing material to a continuous substrate in a high vacuum chamber. A chamber via a gate valve is provided before and after the chamber to maintain high vacuum. An apparatus for continuous processing is disclosed.

Special table 2010-525520 gazette JP 2002-52610 A JP 2010-182530 A

  In a manufacturing method of a solid-sealing type organic EL panel in which an element substrate having an organic EL element on the surface and a sealing substrate are sealed with an adhesive and sealed, performing bonding in a vacuum is a bubble It is possible to suppress the entrainment and the generation of wrinkles of the sealing substrate, and it is possible to improve the sealing performance. But still not enough. In particular, voids (vacuum cavities) and sink marks on the substrate surface are likely to occur, and in addition to the sealing performance, the appearance and the light emission performance are problematic. Further, when the continuous substrate bonding process is performed, there is a problem in that there is a limit in the processing length due to restrictions on the dimensions of the vacuum chamber, and there is a limit in improving productivity.

  In Patent Document 1, bonding is performed under vacuum, but the occurrence of voids and sink marks on the substrate surface is a problem. In Patent Document 2, it is possible to continuously process only the length stored in the storage means, and there is a limit to improvement in productivity. Moreover, it is necessary to open and close the chamber at any time, and it is inevitable that the environment deteriorates and the degree of vacuum decreases. Further, there is a concern that delamination occurs when the storage means or the like is bent after bonding, which causes a problem. In Patent Document 3, a chamber with a gate valve is installed before and after the vacuum chamber of the bonding part, and the structure can be continuously processed. However, the gate part is not a product but a loss, resulting in a product yield. There is a problem that decreases.

  The present invention has been made in view of such a situation. An object of the present invention is to provide an organic EL panel manufacturing method capable of suppressing the generation of voids and sink marks, and improving the sealing performance of the organic EL panel, light emission performance such as color unevenness, and appearance. It is to provide a manufacturing apparatus. Furthermore, it is to provide an organic EL panel manufacturing method and a manufacturing apparatus capable of suppressing delamination in a manufacturing process, enabling continuous production using a long base material, and improving productivity. .

  The inventors of the present invention have analyzed and studied the phenomenon of the generation of voids described above, and as a result, voids occur mainly during processing under vacuum, and foreign matter is bitten or stuck when bonded by a bonding roll. It has been found that it appears as a vacuum cavity due to uneven pressure of the combined roll and uneven coating of the adhesive layer. In addition, when the void is returned to atmospheric pressure, it remains in the layer as it is, or it is crushed and dents and sinks occur, reducing the sealing performance, light emission performance such as color unevenness and light emission defects I found out that it would lead to a decline.

Therefore, after intensively studying solutions to these problems, the multi-layered structure is stabilized by temporarily cooling the adhesive layer after being bonded using a bonding roll under vacuum, and then wound up. It became possible, and it discovered that continuous processing by a long base material was attained. Furthermore, after pasting the element substrate and the sealing substrate under vacuum, it is transferred to an atmospheric pressure environment, heated again to soften and fluidize the adhesive layer, thereby remaining vacuum cavities. We found a phenomenon in which voids disappear or surface sink marks are leveled and flattened. As a result, it has been found that the sealing performance is improved, and defects such as color unevenness and light emission defects are improved. The present invention has been achieved based on the above findings.
That is, the present invention has the following configuration.

  1. A long element substrate having an organic electroluminescence element having an organic functional layer including a first electrode, a light emitting layer, and a second electrode formed on the surface, and a long seal having a sheet-like adhesive layer formed on the surface A method for manufacturing an organic electroluminescence panel, in which a stop substrate is bonded to a surface of the element substrate on which the organic electroluminescence element is formed and a surface on which the adhesive layer of the sealing substrate is formed to form a sealing structure In a reduced pressure environment of less than atmospheric pressure, the bonding layer is heated and fluidized, the bonding step of bonding the element substrate and the sealing substrate to form a multilayer substrate, and less than atmospheric pressure In a reduced pressure environment, the non-fluidization step of cooling and defluidizing the adhesive layer, and the pressure layer higher than the environmental pressure of the bonding step and the non-fluidization step, the adhesive layer Heat to fluidize And a somehow method of manufacturing an organic electroluminescent panel and forming a sealing structure in this order.

  2. 2. The method for producing an organic electroluminescence panel according to 1 above, wherein the adhesive layer is made of a curable resin.

  3. 3. The method for producing an organic electroluminescence panel according to 2 above, further comprising a curing step of curing the adhesive layer after the fluidizing step.

  4). 4. The method for producing an organic electroluminescence panel according to 3 above, wherein the means for curing the adhesive layer in the curing step is heating or light irradiation.

  5. The method for producing an organic electroluminescence panel according to 3 or 4, wherein the curing step is performed under a pressure environment higher than the environmental pressure in the bonding step and the non-fluidization step.

  6). 2. The method for producing an organic electroluminescence panel according to 1 above, wherein the adhesive layer is made of a thermoplastic resin.

  7). 7. The method for producing an organic electroluminescence panel according to 6 above, further comprising the step of cooling and non-fluidizing the adhesive layer after the fluidizing step.

  8). The fluidization of the adhesive layer in the bonding step is to set the viscosity of the resin constituting the adhesive layer to 10 Pa · s or more and less than 5000 Pa · s, and the fluidization of the adhesive layer in the fluidization step. Is that the viscosity of the resin constituting the adhesive layer is 10 Pa · s or more and less than 5000 Pa · s, and the non-fluidization of the adhesive layer in the non-fluidization step is the resin constituting the adhesive layer. 8. The method for producing an organic electroluminescence panel according to any one of 1 to 7 above, wherein the viscosity is 5000 Pa · s or more.

  9. The bonding step and the non-fluidization step are performed in a vacuum chamber connected spatially continuously, and the bonded multilayer substrate after the non-fluidization step is rolled in the vacuum chamber. The method for producing an organic electroluminescence panel according to any one of 1 to 8, wherein the organic electroluminescence panel is wound into a shape.

  10. The fluidizing step is performed after the roll of the laminated multilayer substrate wound in the decompression chamber is moved to a pressure environment higher than the environmental pressure of the pasting step and the non-fluidizing step. 10. The method for producing an organic electroluminescence panel as described in 9 above.

  11. The organic electroluminescent panel manufactured with the manufacturing method of any one of said 1-10.

  12 A vacuum chamber that is maintained in a vacuum environment less than atmospheric pressure, and an organic electroluminescence device having an organic functional layer including a first electrode, a light-emitting layer, and a second electrode in the vacuum chamber. A first feeding portion for feeding the element substrate from the roll of the element substrate; and for feeding the sealing substrate from a long roll of the sealing substrate having a sheet-like adhesive layer formed on the surface in the decompression chamber. Non-fluidization in which the adhesive layer is cooled and non-fluidized in the second feeding part, a laminating part for laminating the element substrate and the sealing substrate in the depressurizing chamber, and the depressurizing chamber. And a fluidizing part that heats and fluidizes the adhesive layer in a pressure environment higher than the environmental pressure of the bonding part and the non-fluidized part, in addition to the decompression chamber. Characteristic organic elect Apparatus for manufacturing a luminescence panel.

  13. Furthermore, the manufacturing apparatus of the said organic electroluminescent panel of Claim 12 provided with the hardening part which hardens the said contact bonding layer after the said fluidization part.

  14 14. The apparatus for manufacturing an organic electroluminescence panel according to 13, wherein the means for curing the adhesive layer in the curing unit is heating or light irradiation.

  15. In said decompression chamber, said 1st delivery part, said 2nd delivery part, said pasting part, and said non-fluidization part are connected spatially continuously, The above 12-14 The manufacturing apparatus of the organic electroluminescent panel of any one of Claims 1.

  16. Furthermore, after the non-fluidization part in the decompression chamber, a winding part for winding the laminated multilayer substrate in a roll shape is provided, and the multilayer is provided outside the decompression chamber and before the fluidization part. The apparatus for producing an organic electroluminescence panel according to any one of 12 to 15, further comprising a third feeding portion that feeds the multilayer substrate from a roll of the substrate.

  17. The organic electroluminescence panel according to 16 above, further comprising a return pressure unit capable of returning the roll of the laminated multilayer substrate wound up in the reduced pressure chamber to atmospheric pressure. manufacturing device.

  18. The organic electroluminescent panel manufactured with the manufacturing apparatus of any one of said 12-17.

According to the method for producing an organic EL panel of the present invention, generation of voids and sink marks can be suppressed, and the sealing performance of the organic EL panel, light emission performance such as color unevenness, and appearance can be improved. Moreover, generation | occurrence | production of the delamination in a manufacturing process is suppressed, continuous production using a elongate base material is attained, and improvement of productivity can be aimed at.
According to the organic EL panel manufacturing apparatus of the present invention, similar to the above-described organic EL panel manufacturing method, generation of voids and sink marks is suppressed, and the organic EL panel sealing performance, light emission performance such as color unevenness, and the appearance Can be improved. Further, delamination in the manufacturing process is suppressed, continuous production using a long base material is possible, and productivity can be improved.

It is a schematic diagram which shows the manufacturing process and manufacturing apparatus of the organic electroluminescent panel of this embodiment.

  DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Modes for carrying out the present invention will be described below, but the present invention is not limited to the embodiments described below, and the embodiments are arbitrarily changed within the scope of the present invention. Is possible.

(Method for manufacturing organic EL panel)
The manufacture of the organic EL panel of the present embodiment includes a long element substrate on which an organic EL element having an organic functional layer including a first electrode, a light emitting layer, and a second electrode is formed, and a sheet-like adhesive layer. Is bonded to the surface of the element substrate on which the organic EL element is formed and the surface on which the adhesive layer of the sealing substrate is formed, to form a sealing structure. It is carried out by a forming method (solid sealing method).

(Organic EL panel)
In the present embodiment, the organic EL panel includes an element substrate on which an organic EL element is formed on a surface and a sealing substrate on which an adhesive layer is formed on the surface, each of which the organic EL element of the element substrate is formed. And the surface of the sealing substrate on which the adhesive layer is formed have a multilayer structure formed by bonding.

  Here, the organic EL element includes at least a first electrode formed on the element substrate, an organic functional layer formed on the first electrode and including a light emitting layer, and a second electrode formed on the organic functional layer. It has a thin film shape. When a voltage is applied between both electrodes of the organic EL element, the light emitting layer emits light.

  In the organic EL panel of the present embodiment, in order to keep the organic EL element in the organic EL panel in a low-humidity environment and to shield and protect it from the external environment, the organic EL element includes an adhesive layer on the element substrate and the sealing substrate. It is sandwiched between and sealed and sealed.

  The element substrate and the sealing substrate of the present embodiment are both flexible and long sheets. In general, organic EL elements are intermittently present on the element substrate at intervals. The element substrate and the sealing substrate are continuously bonded through an adhesive layer to form a long multilayer substrate having a multilayer structure. Therefore, a large number of organic EL panels can be obtained by cutting the manufactured long multilayer substrate before and after the organic EL element.

(Element board)
Here, the element substrate of the present embodiment will be described.
The element substrate is a substrate serving as a base when forming an organic EL element. The element substrate is preferably flexible and has mechanical strength, heat resistance when an organic EL element is produced on the element substrate, gas barrier properties against water vapor and oxygen, and the like. The element substrate is preferably made of a transparent resin in order to transmit the emitted light.

  Examples of the material constituting the element substrate include polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), polyethylene, polypropylene, cellophane (registered trademark), cellulose diacetate, cellulose triacetate (TAC), and cellulose acetate butyrate. Rate, cellulose acetate propionate (CAP), cellulose acetates such as cellulose acetate phthalate, cellulose nitrate or derivatives thereof, polyvinylidene chloride, polyvinyl alcohol, polyethylene vinyl alcohol, syndiotactic polystyrene, polycarbonate, norbornene resin, poly Methyl pentene, polyether ketone, polyimide, polyether sulfone (PES), polyphenylene sulfi , Polysulfone, polyetherimide, polyetherketoneimide, polyamide, fluororesin, polymethylmethacrylate, polyacrylic ester, polyarylate, arton (registered trademark, manufactured by JSR) or appel (registered trademark, manufactured by Mitsui Chemicals) And cycloolefin-based resins. Moreover, when transmitting the emitted light from the sealing substrate, a material other than the transparent resin can be selected as the material constituting the element substrate. For example, copper, copper alloy, aluminum, aluminum alloy, gold, nickel , Metals such as titanium, stainless steel and tin. One of these may be used alone, or two or more of these may be mixed or multilayered.

  Although the thickness of the element substrate is not particularly limited, it is preferably 50 μm to 500 μm in consideration of molding processability, handleability, and the like. Note that the thickness of the element substrate can be measured using a micrometer.

The organic EL element is formed on the surface of the element substrate. The organic EL element only needs to be formed on the surface of at least one side of the element substrate. And an organic EL element can be sealed and sealed by bonding in the surface in which the organic EL element of the element substrate was formed, and the surface in which the contact bonding layer of the sealing substrate was formed. Alternatively, the organic EL element may be formed on both surfaces of the element substrate, and two sealing substrates may be bonded from both sides of the element substrate to seal and seal the organic EL elements on both surfaces. it can.
Details of the configuration of the organic EL element formed on the element substrate will be described later.

(Sealing substrate)
Next, the sealing substrate of this embodiment will be described.
The sealing substrate is for blocking and protecting the organic EL element and the like from the external environment. The sealing substrate is preferably flexible and has mechanical strength, gas barrier properties against water vapor and oxygen, and the like.

  Examples of the material constituting the sealing substrate include thermoplastics such as ethylene tetrafluoroethylene copolymer, polyethylene, polypropylene, polystyrene, polymethyl methacrylate, nylon, polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyimide, and polyethersulfone. Resin, urea resin, melamine resin, phenol resin, resorcinol resin, epoxy resin, unsaturated polyester resin, polyurethane resin, curable resin such as acrylic resin, copper, copper alloy, aluminum, aluminum alloy, gold, nickel, titanium, stainless steel And metals such as tin.

  One of these materials may be used alone, and if necessary, it can be used as a multilayer sheet in which a plurality of types of materials are mixed or combined by bonding, extrusion lamination, co-extrusion, etc. is there. Furthermore, in order to obtain desired physical properties, it is possible to produce various combinations of the thickness, density, molecular weight and the like of the sheet to be used.

  The thickness of the sealing substrate is not particularly limited, but is preferably 10 μm or more and 300 μm or less in consideration of molding processability, handleability, stress cracking resistance of the gas barrier layer, and the like. Note that the thickness of the sealing substrate can be measured using a micrometer.

When using the above thermoplastic resin or curable resin as the sealing substrate, it is preferable to form a gas barrier layer on the sealing substrate by vapor deposition or coating. Examples of the gas barrier layer include a metal vapor deposition film, an inorganic vapor deposition film, and a metal foil. As metal vapor deposition film and inorganic vapor deposition film, thin film handbook p879-p901 (Japan Society for the Promotion of Science), vacuum technology handbook p502-p509, p612, p810 (Nikkan Kogyo Shimbun), vacuum handbook revised edition p132-p134 (ULVAC Japan) Examples thereof include vapor-deposited films as described in Vacuum Technology KK). For example, metals such as In, Sn, Pb, Au, Cu, Ag, Al, Ti, Ni, W, MgO, SiO, SiO ₂ , Al ₂ O ₃ , GeO, NiO, CaO, BaO, Fe ₂ O ₃ , Metal oxides such as Y ₂ O ₃ , TiO ₂ , Cr ₂ O ₃ , Si _x O _y (x = 1, y = 1.5 to 2.0), Ta ₂ O ₃ , ZrN, SiC, TiC, PSG , Si ₃ N ₄ , SiN, single crystal Si, amorphous Si, and the like. Examples of the metal foil material include metal materials such as aluminum, copper, and nickel, and alloy materials such as stainless steel and aluminum alloy. Aluminum is preferable in terms of workability and cost. One of these may be used alone, or two or more may be used in any combination and ratio.

  The film thickness of the metal vapor-deposited film and the inorganic vapor-deposited film is usually 5 nm or more, preferably 10 nm or more, and usually 1000 nm or less, preferably 300 nm or less, from the viewpoint of easy formation of the vapor-deposited film. The film thickness of the metal foil is 1 to 100 μm, preferably 10 μm to 50 μm, from the viewpoint of handling at the time of manufacture and thinning of the panel. In order to facilitate handling during production, a resin film such as polyethylene terephthalate or nylon may be laminated in advance. Furthermore, a protective layer made of a thermoplastic resin may be provided on the gas barrier layer.

The water vapor permeability of the sealing substrate of the present embodiment is preferably 0.01 g / m ² · day or less in consideration of gas barrier properties and the like required for commercialization as an organic EL panel, and oxygen The permeability is preferably 0.1 ml / m ² · day · MPa or less. The moisture permeability is a value measured mainly by the MOCON method by a method based on the JIS K7129B method (1992), and the oxygen permeability is a value measured mainly by the MOCON method by a method based on the JIS K7126B method (1987). is there.

(Adhesive layer)
In the present embodiment, the adhesive layer is a layer that adheres and fixes the element substrate and the sealing substrate, isolates the organic EL element from the external environment, and seals and protects the organic EL element.
The adhesive layer has a sheet shape and is formed on the surface of the sealing substrate. The sheet-like adhesive layer may be formed on the surface of at least one side of the sealing substrate. And an organic EL element can be sealed and sealed by bonding in the surface in which the contact bonding layer of the sealing substrate was formed, and the surface in which the organic EL element of the element substrate was formed. In addition, a sheet-like adhesive layer is formed on both surfaces of the sealing substrate, two element substrates are bonded from both sides of the sealing substrate, and the organic EL elements on both surfaces are sealed and sealed. You can also

  As the resin constituting the sheet-like adhesive layer, any of a thermosetting resin, a photocurable resin, and a thermoplastic resin can be used. It is preferable to use a resin that is excellent in moisture resistance and water resistance, has less volatile components, and has less shrinkage during curing.

  As the thermosetting resin, for example, epoxy resin, acrylic resin, silicone resin, urea resin, melamine resin, phenol resin, resorcinol resin, unsaturated polyester resin, polyurethane resin, etc. Resin.

  Examples of the photocurable resin include radical curable resins such as ester acrylates, urethane acrylates, epoxy acrylates, melamine acrylates, acrylic resin acrylates, etc., or radical photocurable resins using resins such as urethane polyesters, epoxies, vinyl ethers, and the like. Examples thereof include a cationic photocurable resin using a resin.

  Examples of the thermoplastic resin include polyethylene, polypropylene, polyamide, polyethylene terephthalate (PET), polyvinyl alcohol (PVA), ethylene-vinyl acetate copolymer (EVA), ethylene-propylene copolymer, ethylene-acrylic acid copolymer. Polymers, ethylene-methacrylic acid copolymers, polyvinylidene chloride (PVDC), ionomers and the like can be used. Among them, acid modified products of polyolefins such as polyethylene, polypropylene, and ethylene-propylene copolymer, which have excellent adhesion to the substrate, acid modified products of ethylene / vinyl acetate copolymer, ethylene-acrylic acid copolymer, ethylene- A methacrylic acid copolymer is preferred. In particular, acid-modified products of polyethylene and polypropylene that have few outgas components that degrade the organic EL element are preferable.

  The thickness of the adhesive layer is preferably 1 μm to 100 μm from the viewpoint of sealing performance and panel thinning. The method for forming the adhesive layer on the sealing substrate includes gravure coating, roll coating, bar coating, die coating, knife coating, hot melt coating, dipping, spin coating, and spraying depending on the type of resin constituting the adhesive layer. Coating methods such as coating and printing methods such as screen printing can be used. Moreover, in order to remove moisture contained in the adhesive layer, a desiccant such as barium oxide or calcium oxide may be mixed.

  It is preferable to add a filler to the resin constituting the adhesive layer as necessary. The addition amount of the filler is preferably 5 to 70% by volume in consideration of adhesive strength. Moreover, the magnitude | size of the filler to add considers adhesive strength, the thickness of the contact bonding layer after bonding, etc., and 1 micrometer-100 micrometers are preferable. The kind of filler to be added is not particularly limited, and examples thereof include soda glass, non-alkali glass or silica, metal oxides such as antimony oxide, titania, alumina, zirconia, and tungsten oxide.

(Method for manufacturing organic EL panel)
The manufacturing method of the organic EL panel according to the present embodiment is performed when an organic EL panel is manufactured by bonding an element substrate having an organic EL element formed on the surface and a sealing substrate having an adhesive layer formed on the surface. A bonding step in which the adhesive layer is heated and fluidized under a reduced-pressure environment below atmospheric pressure, and a multilayer substrate is formed by bonding the element substrate and the sealing substrate; and under a reduced-pressure environment below atmospheric pressure In the non-fluidization process in which the adhesive layer is cooled and non-fluidized, and in the fluidizing environment in which the adhesive layer is fluidized by heating under a pressure environment higher than the environmental pressure in the bonding process and the non-fluidization process. And a process.

(Organic EL panel manufacturing equipment)
In addition, the organic EL panel manufacturing apparatus of the present embodiment includes a decompression chamber maintained in a decompressed environment less than atmospheric pressure, an organic functional layer including a first electrode and a light emitting layer, and a second electrode in the decompression chamber. A first feeding portion for feeding the element substrate from a roll of a long element substrate having the organic electroluminescence element formed on the surface, and a long seal having a sheet-like adhesive layer formed on the surface in the decompression chamber. The adhesive layer is cooled in the decompression chamber, the second feeding part for feeding the sealing substrate from the roll of the stop substrate, the laminating part for laminating the element substrate and the sealing substrate in the decompression chamber, A non-fluidized part for non-fluidization and a fluidized part for heating and fluidizing the adhesive layer in a pressure environment higher than the environmental pressure of the laminating part and the non-fluidized part outside the decompression chamber. It is characterized by providing.

Hereinafter, the manufacturing process and manufacturing apparatus of the organic EL panel of this embodiment will be described. Along with the manufacturing process, the drawing process, the bonding process, the non-fluidization process, the winding process, the fluidization process, the curing process, and other processes and equipment will be described with reference to the drawings.
FIG. 1 is a schematic diagram illustrating a manufacturing process and a manufacturing apparatus for an organic EL panel according to the present embodiment, and is represented as a cross-sectional view of the manufacturing apparatus for an organic EL panel according to the present embodiment.

(Decompression chamber 2, rear chamber 3)
The organic EL panel manufacturing apparatus 1 according to the present embodiment includes a decompression chamber 2 that is managed so as to maintain a reduced pressure environment that is less than atmospheric pressure, and a pressure environment that is higher than the internal pressure of the reduced pressure chamber 2. And a rear chamber 3 which is managed to keep. The internal pressure of the decompression chamber 2 is not particularly limited, but is usually 1 × 10 ⁻⁴ to 1 × 10 from the viewpoint of shielding and protecting from an external environment such as oxygen and moisture during the sealing operation of the organic EL element. It is preferably in the range of ³ Pa, and more preferably in the range of 1 × 10 ⁻¹ to 1 × 10 ² Pa.

(Feeding process)
The payout process is a process of paying out the element substrate from a roll wound with a long element substrate and feeding the sealing substrate from a roll wound with a long sealing substrate under a reduced pressure environment below atmospheric pressure. .

  1 is provided with a roll 4 around which a long element substrate on which an organic EL element is formed is wound, and a guide roll 5 for guiding the element substrate 6 fed out from the roll 4. A first feeding unit 7 is installed. The element substrate 6 is unwound from the roll 4 through the guide roll 5. At this time, the organic EL element is formed on the lower surface of the element substrate 6.

  Similarly, in the decompression chamber 2 of FIG. 1, in order to guide a roll 8 around which a long sealing substrate having a sheet-like adhesive layer formed on one side is wound and a sealing substrate 10 fed out from the roll 8. A second feeding portion 11 having a guide roll 9 is installed. The sealing substrate 10 is fed out from the roll 8 through the guide roll 9. At this time, the adhesive layer is formed on the upper surface of the sealing substrate 10.

(Bonding process)
In the bonding step, the adhesive layer is heated and fluidized under a reduced pressure environment less than atmospheric pressure, and the element substrate and the sealing substrate are bonded to the surface of the element substrate on which the organic EL element is formed and the sealing. This is a step of forming a multilayer substrate by bonding on the surface of the substrate where the adhesive layer is formed. The method of bonding is a thermocompression bonding method using a bonding roll, but the means for bonding is not particularly limited. Various means such as roll lamination, flat plate bonding, and diaphragm bonding can be used. In this embodiment, the bonding roll is used as a typical bonding means.

  In FIG. 1, the element substrate 6 drawn out from the roll 4 and the sealing substrate 10 drawn out from the roll 8 are bonded in the decompression chamber 2 after leaving the supply portion, respectively. Be transported. The bonding part 14 is installed in the decompression chamber 2 and is used to heat the sealing substrate 10 before being bonded to the bonding roll 13 for bonding the element substrate 6 and the sealing substrate 10 as necessary. The heater 12 is provided.

  The adhesive layer formed on one surface of the sealing substrate 10 is bonded by the bonding roll 13 in a fluidized state. At this time, the bonding layer 13 itself may be heated and fluidized by the heat, or may be fluidized by being heated by the heater 12 installed in front of the bonding roll 13. Good. When the bonding roll 13 itself is fluidized by being heated, the heater 12 becomes unnecessary.

  The heater 12 installed in front of the bonding roll 13 is not limited to the illustrated indirect heating method, and various methods such as a heat roll, a plate heater, an infrared heater, and a hot air heater can be used. it can.

  Here, the fluidization of the adhesive layer means that the viscosity of the resin constituting the adhesive layer is 10 Pa · s or more and less than 5000 Pa · s. By setting the resin constituting the adhesive layer to a viscosity within this range, the adhesive layer is appropriately fluidized, and the element substrate 6 and the sealing substrate 10 are bonded via the adhesive layer by bonding with the bonding roll 13. The organic EL element can be sealed inside by closely adhering without a gap. The viscosity of the resin constituting the adhesive layer when fluidized is preferably 50 to 200 Pa · s.

  If the viscosity of the resin constituting the adhesive layer is 10 Pa · s or more and less than 5000 Pa · s immediately before the bonding roll 13 without heating, heating the bonding roll 13 itself is also heated by the heater 12. Is also unnecessary. However, when the resin constituting the adhesive layer is a thermosetting resin, care should be taken so that the heating temperature does not exceed the curing start temperature.

  The viscosity of the resin constituting the adhesive layer can be measured with an ordinary polymer viscometer. For example, it can be measured using a rheometer DAR-100 manufactured by REOLOGICA. By using the same resin sample as the resin constituting the adhesive layer to be measured and measuring the viscosity when placed at the temperature at the time of bonding, it can be recognized as the viscosity at the time of bonding.

  Moreover, the curing start temperature of the thermosetting resin is the rise of the exothermic peak due to curing when the thermosetting resin is heated at a heating rate of 5 ° C./min in a nitrogen atmosphere using DSC. Defined with temperature.

  The bonding roll 13 is a so-called nip roll composed of a pair of upper and lower rolls. The element substrate 6 and the sealing substrate 10 are bonded, and the multilayer substrate 18 in which the organic EL element is sealed and sealed with the fluidized adhesive layer is formed. The number of rolls may be two in a pair, or may be further increased to four in two pairs as necessary. Further, the nip pressure and the rotation speed of the roll are appropriately set to such a condition that the element substrate 6 and the sealing substrate 10 can be bonded and the organic EL element is not damaged.

(Non-fluidization process)
The non-fluidization process is a process of cooling and non-fluidizing the adhesive layer in the multilayer substrate in a reduced pressure environment below atmospheric pressure.

In FIG. 1, the multilayer substrate 18 formed in the bonding part 14 is conveyed to the non-fluidization part 17 in the decompression chamber 2 in order to cool and non-fluidize the adhesive layer.
The non-fluidizing unit 17 is installed in the decompression chamber 2 and includes cooling rolls 15 and 16. Since the multilayer substrate 18 bonded in the bonding unit 14 is in a state where the adhesive layer is heated, the adhesive layer is cooled and made non-fluidized by contacting the cooling rolls 15 and 16. Even in the case of a resin in which the adhesive layer is not heated, it is made non-fluidized by cooling.
Here, the non-fluidization of the adhesive layer means that the viscosity of the resin constituting the adhesive layer is 5000 Pa · s or more. The viscosity at the time of non-fluidization of the resin constituting the adhesive layer is preferably 10,000 Pa · s or more.

  When the adhesive layer is cooled and non-fluidized, the bonding state between the element substrate 6 and the sealing substrate 10 is fixed while the adhesive layer is in an uncured state, and passes through the subsequent manufacturing process. , It is possible to prevent the two substrates from deviating or delamination due to the curvature of the roll. As a result, the form of the multilayer substrate 18 is stabilized, and can be wound into a roll or moved from the decompression chamber 2 to the outside with a high environmental pressure.

  The cooling means in the non-fluidizing section 17 is not limited to the cooling roll, and various means such as a cooling belt and a cooling plate can be used, but a method of nipping with the cooling roll is preferable. Even when the cooling rolls 15 and 16 are used, the number of pairs may be two, or may be increased to three pairs of six or the like as necessary. Moreover, about cooling temperature and a conveyance speed, it sets suitably on the conditions which can cool an adhesive layer. When the cooling rolls 15 and 16 are used, the nip pressure is set so as not to damage the organic EL element.

  It is preferable from the viewpoints of productivity and equipment structure that the bonding step and the non-fluidization step are performed in a decompression chamber connected spatially continuously. Furthermore, the first feeding part, the second feeding part, the bonding part, the non-fluidization part, and the following winding part are installed in the same decompression chamber connected spatially continuously. It is preferable from the viewpoint of productivity and equipment structure.

(Winding process)
The winding process is a process of winding the multilayer substrate, in which the adhesive layer is cooled in the non-fluidization process, in a roll shape in a reduced pressure environment below atmospheric pressure.

  In FIG. 1, the winding unit 21 is installed after the non-fluidizing unit 17 in the decompression chamber 2 and includes a guide roll 19 and a winding roll 20. The multilayer substrate 18 in which the adhesive layer is made non-fluidized in the winding unit 21 is wound around the winding roll 20 in the decompression chamber 2.

(Return pressure part)
The return pressure unit is a device that can convert the environment of the take-up roll from a reduced pressure environment below atmospheric pressure to a higher pressure environment (not shown).
In the organic EL panel manufacturing apparatus 1 of the present embodiment, by providing the pressure-reducing unit, the winding roll 20 of the multi-layer substrate wound in the decompression chamber 2 can be used from a reduced pressure environment less than atmospheric pressure. The pressure is restored to a high pressure environment. In particular, the return pressure section is preferably set to a condition for returning the pressure from the internal pressure of the decompression chamber 2 to the internal pressure of the rear chamber 3 described later. As a result, the rewinded take-up roll 20a can move to the rear chamber 3 under a pressure environment higher than the environmental pressure of the decompression chamber 2. As a pressure higher than the environmental pressure of the decompression chamber 2, for example, the pressure can be restored to atmospheric pressure.

(Rear chamber 3)
In FIG. 1, the organic EL panel manufacturing apparatus 1 according to this embodiment is installed behind a decompression chamber 2 and is managed so that the interior is maintained in a pressure environment higher than the internal pressure of the decompression chamber 2. 3 is provided.

The roll 20 around which the multilayer substrate manufactured in the decompression chamber 2 is wound is moved from the decompression chamber 2 to the rear chamber 3. The roll 20 moved to the rear chamber 3 becomes a roll 20a.
In this way, by moving the multilayer substrate manufactured under a reduced pressure environment below atmospheric pressure to a pressure environment higher than the reduced pressure environment below atmospheric pressure, the inside involved in the bonding step is in a reduced pressure state. It is possible to eliminate bubbles and wrinkles between layers whose inside is in a reduced pressure state.
In addition, since the roll 20 around which the multilayer substrate is wound is tightened in the direction of the core by external pressure, the dents and wrinkles on the surface of the multilayer substrate in the inner layer of the roll are corrected.

The internal pressure of the rear chamber 3 is usually preferably in the range of 1 × 10 ³ to 1 × 10 ⁶ Pa from the viewpoint of suppressing bubble entrainment and wrinkling of the sealing substrate. A range of ⁴ to 1 × 10 ⁵ Pa is more preferable. For example, it can be atmospheric pressure.

(Third feeding portion 22)
In FIG. 1, the third feeding unit 22 is an apparatus that is outside the decompression chamber 2 and in front of the fluidizing unit 24, and can feed the multilayer substrate 18 from the winding roll 20 a of the multilayer substrate. It is installed in the rear chamber 3 and includes a winding roll 20 a and a guide roll 21. The multilayer substrate 18 is unwound from the take-up roll 20 a through the guide roll 21 and conveyed to the next fluidizing unit 24.

(Fluidization process)
The fluidizing step is a step of heating and fluidizing the adhesive layer in a pressure environment higher than the environmental pressure in the bonding step and the non-fluidizing step. Here, the fluidization of the adhesive layer means that the viscosity of the resin constituting the adhesive layer is 10 Pa · s or more and less than 5000 Pa · s. The viscosity of the resin constituting the adhesive layer when fluidized is preferably 50 to 200 Pa · s.

  Under a pressure environment higher than the environmental pressure in the bonding step and the non-fluidization step, the adhesive layer is heated again and fluidized within the above viscosity range, whereby the resin constituting the adhesive layer flows and adheres. Voids which are vacuum cavities remaining in the layer can be eliminated, or the surface of the adhesive layer can be flattened to improve the appearance. As a result, the sealing performance of the organic EL element is improved, and problems such as color unevenness and light emission defects can be solved, and the light emitting performance as the organic EL panel can be improved. Furthermore, since the strain generated in the bonding process, non-fluidization process, winding process, etc. can be released by heating and fluidizing the adhesive layer again, the multilayer substrate is then curled or peeled off. Can be prevented.

Further, after fluidizing the adhesive layer, the multilayer substrate may be crimped by a crimping roll. This is effective for planarizing the surface of the multilayer substrate.
In addition, when resin which comprises an contact bonding layer is a thermosetting resin, you may perform fluidization and subsequent thermosetting simultaneously in this fluidization process.

  In FIG. 1, the fluidizing unit 24 is provided in the rear chamber 3 and includes a heater 23 for heating the multilayer substrate 18. The adhesive layer in the multilayer substrate 18 can be heated and fluidized under a pressure environment higher than the environmental pressure of the decompression chamber 2.

  The heater 23 is not limited to the illustrated indirect heating method, and various methods such as a heat roll, a plate heater, an infrared heater, and a hot air heater can be used.

(Curing process)
The curing step is a step of curing the adhesive layer after the fluidizing step.
When the resin constituting the adhesive layer is a thermosetting resin or a photocurable resin, after the fluidization step, the adhesive layer is cured to fix and stabilize the form of the organic EL panel. is necessary. By curing the adhesive layer, the element substrate and the sealing substrate are firmly bonded by the adhesive layer, and the organic EL element is hermetically sealed between both substrates to form an organic EL panel having excellent durability. Can do.

  When the resin constituting the adhesive layer is a thermosetting resin, it is preferable that the means for curing the adhesive layer in the curing step is heating. When the resin constituting the adhesive layer is a photocurable resin, it is preferable that the means for curing the adhesive layer in the curing step is light irradiation.

  In FIG. 1, the multilayer substrate 18 having the adhesive layer fluidized in the fluidizing unit 24 is conveyed to the curing unit 27 through the guide roll 25. The curing unit 27 is installed in the rear chamber 3 and includes a heater 26 for curing the adhesive layer. When the resin constituting the adhesive layer is a thermosetting resin, the adhesive layer is cured by being heated by the heater 26.

  When the resin constituting the adhesive layer is a photocurable resin, a light irradiation device (not shown) is installed in the curing unit 27 instead of the heater 26. The adhesive layer is cured by light irradiation by the light irradiation device. As the heater or the light irradiation device, an appropriate one can be selected and used from various known types of devices.

It is preferable from the viewpoint of the facility structure that both the fluidizing step and the curing step are performed under the same pressure environment, which is higher than the environmental pressure in the bonding step and the non-fluidizing step.
In addition, the third feeding part, the fluidizing part, the curing part, or the cooling part for making the following adhesive layer non-fluidized are installed in the same spatially connected chamber. Is preferable from the viewpoints of productivity and equipment structure.

(Defluidization process)
When the resin constituting the adhesive layer is a thermoplastic resin, unlike the curable resin, no curing step is required. However, since the adhesive layer is softened by being heated in the fluidizing step, it is preferable to have a step of cooling the adhesive layer to make it non-fluidized after the fluidizing step. Here, the non-fluidization of the adhesive layer means that the viscosity of the resin constituting the adhesive layer is 5000 Pa · s or more, as in the non-fluidization in the above-described non-fluidization step.

If the thermoplastic resin that constitutes the adhesive layer is heated in the fluidization step and is immediately wound up into a roll, there is a concern that both substrates constituting the multilayer substrate may be displaced or the multilayer substrate may cause delamination. Therefore, it is preferable to provide a step of cooling the multilayer substrate to make the adhesive layer non-fluid.
For example, in FIG. 1, a cooling unit (not shown) provided with a cooling roll or the like can be installed behind the fluidizing unit 24 instead of the curing unit 27. However, if the multilayer substrate is naturally cooled and the adhesive layer is non-fluidized after the fluidizing section 24 until the next winding or cutting operation as an organic EL panel, etc. It is not necessary to provide a cooling part.

  The multilayer substrate 18 that has undergone the above-described curing process or non-fluidizing process is unloaded from the organic EL panel manufacturing apparatus 1 of the present embodiment as a long organic EL panel via a guide roll 28. Then, it can be wound up in a roll shape or cut into a predetermined size to obtain a large number of organic EL panels.

[Second Embodiment]
A second embodiment of the present invention different from the embodiment of the present invention described above will be described below.
In the second embodiment of the present invention, the decompression chamber is managed so as to keep the inside of the decompressed environment below atmospheric pressure, and the inside is managed so as to keep the inside of the pressure environment higher than the internal pressure of the decompressing chamber. In addition, the present invention relates to a manufacturing method and a manufacturing apparatus that can manufacture an organic EL panel without winding up a multilayer substrate by providing a differential pressure adjusting chamber between the rear chamber and the rear chamber.

  As a mechanism for eliminating the difference in internal pressure between the decompression chamber and the rear chamber, a differential pressure adjustment chamber is provided. One inlet of the differential pressure regulation chamber is connected to the decompression chamber, and the other outlet is connected to the rear chamber. By adopting a gate valve system or a narrow gap system for the inlet and the outlet, the difference in internal pressure can be eliminated. The multilayer substrate can be moved continuously from the decompression chamber to the rear chamber by passing through the differential pressure adjusting chamber intermittently or continuously. Therefore, the non-fluidization process and the fluidization process are directly connected via the differential pressure adjustment chamber.

  Referring to FIG. 1, the winding unit 21, the pressure-reducing unit (not shown), and the third feeding unit 22 are not required, and a differential pressure adjusting chamber (not shown) is provided between the decompression chamber 2 and the rear chamber 3. Is installed. The multilayer substrate 18 is directly transferred from the non-fluidizing unit 17 to the fluidizing unit 24 via a differential pressure adjusting chamber (not shown).

  In the second embodiment of the present invention, the manufacturing process and manufacturing apparatus other than those described above are the same as those already described above. By not going through the winding process, delamination due to bending is less likely to occur, and an organic EL panel with excellent sealing performance can be manufactured. In addition, it is possible to continuously manufacture from an element substrate and a sealing substrate to a continuous sheet of an organic EL panel by a roll-to-roll method, and it is possible to improve productivity.

  As described above, according to the manufacturing method of the organic EL panel of the present embodiment, the generation of voids and sink marks is suppressed, the sealing performance of the organic EL panel, the light emission performance such as color unevenness, and the appearance appearance. Can be improved. Moreover, generation | occurrence | production of the delamination in a manufacturing process is suppressed, continuous production using a elongate base material is attained, and improvement of productivity can be aimed at.

  Further, according to the organic EL panel manufacturing apparatus of the present embodiment, the generation of voids and sink marks is suppressed, and the organic EL panel sealing performance, light emission performance such as color unevenness, etc., as in the above-described organic EL panel manufacturing method The appearance can be improved. Further, delamination in the manufacturing process is suppressed, continuous production using a long base material is possible, and productivity can be improved.

[Structure of organic EL element]
Below, the structure of the organic EL element of this embodiment is demonstrated in detail (not shown).

  As an organic functional layer of the organic EL element, in addition to a basic organic functional layer directly related to light emission called a light emitting layer, for example, various functions such as a carrier (hole and electron) injection layer, a blocking layer, and a transport layer. You may provide the organic functional layer which has. And an organic EL element is normally comprised by laminating | stacking these various organic functional layers etc. in addition to an element substrate, an electrode, and a light emitting layer.

In the organic EL element, preferred examples of the organic functional layer are as follows. In the following (1) to (6), the layer described above is usually provided on the first electrode (anode) side, and the second electrode (cathode) side is reached in the order described below. Is laminated.
(1) Light emitting layer / electron transport layer (2) Hole transport layer / light emitting layer / electron transport layer (3) Hole transport layer / light emitting layer / hole blocking layer / electron transport layer (4) Hole transport layer / Light emitting layer / hole blocking layer / electron transport layer / electron injection layer (cathode buffer layer)
(5) Hole injection layer (anode buffer layer) / hole transport layer / light emitting layer / hole blocking layer / electron transport layer / electron injection layer (6) Hole injection layer / hole transport layer / light emitting layer / electron Transport layer / electron injection layer

  Hereinafter, each part which comprises an organic EL element is demonstrated. However, the configuration of the organic EL element is not limited to the following contents.

  As described above, the element substrate is preferably composed of a flexible base material such as a resin. In addition, when using resin as an element substrate, it is preferable that the gas barrier layer described below is formed on the surface of the resin sheet.

(Gas barrier layer)
It is preferable that one or more gas barrier layers are formed between the element substrate and the organic functional layer from the viewpoint of moisture resistance.

  The material for forming the gas barrier layer is not particularly limited, and examples thereof include an inorganic film, an organic film, or a hybrid film of both. A material having a function of suppressing entry of an element that causes deterioration of the element such as moisture or oxygen is preferable. For example, a metal oxide such as silicon oxide or silicon dioxide, a metal nitride such as silicon nitride, or the like can be used. Furthermore, in order to further improve the strength of the gas barrier layer, it is preferable to have a layered structure of an inorganic layer and an organic layer. The order in which the inorganic layer and the organic layer are stacked is not particularly limited, but it is preferable to stack the layers alternately a plurality of times.

(First electrode)
The first electrode (anode) is an electrode film that supplies (injects) holes to the organic functional layer (specifically, the light emitting layer). The material type and physical properties of the first electrode are not particularly limited and can be set arbitrarily. For example, the first electrode can be formed of a material having a high work function (4 eV or more), for example, an electrode material such as a metal, an alloy, an electrically conductive compound, and a mixture thereof. The first electrode may be made of a light-transmitting material (transparent electrode) such as indium tin oxide (ITO) or indium zinc oxide.

  The sheet resistance as the first electrode (anode) is preferably several hundred Ω / □ or less. Further, although the film thickness depends on the material, it is usually selected in the range of 10 to 1000 nm, preferably 10 to 200 nm.

(Organic functional layer)
Various organic functional layers constituting the organic functional layer will be described below, but since specific materials of each organic functional layer of these organic functional layers can be applied with known materials, the description Is omitted. In addition, since a known method such as a vapor deposition method or a coating method can be applied to the method for forming the organic functional layer, the description thereof is omitted.

<Light emitting layer>
The light emitting layer is directly injected from the first electrode or from the first electrode through the hole transport layer and the like, and directly from the second electrode (cathode) or from the second electrode through the electron transport layer or the like. This is a layer that emits light by recombination with the injected electrons. Note that the portion that emits light may be inside the light emitting layer, or may be an interface between the light emitting layer and a layer adjacent thereto.

  The light emitting layer is preferably formed of an organic light emitting material including a host compound (host material) and a light emitting material (light emitting dopant compound). When the light emitting layer is configured in this way, an arbitrary emission color can be obtained by appropriately adjusting the emission wavelength of the light emitting material, the type of the light emitting material to be contained, and the like. In addition, by configuring the light emitting layer in this way, light can be emitted from the light emitting material in the light emitting layer.

  The total thickness of the light emitting layers can be set as appropriate according to desired light emission characteristics and the like. For example, the total thickness of the light emitting layer is 1 nm or more and 200 nm or less from the viewpoints of uniformity of the light emitting layer, prevention of unnecessary application of a high voltage during light emission, and improvement of stability of light emission color with respect to driving current. It is preferable to do. In particular, from the viewpoint of a low driving voltage, the total thickness of the light emitting layers is preferably 30 nm or less.

  The host compound contained in the light emitting layer is preferably a compound having a phosphorescence quantum yield of phosphorescence emission at room temperature (25 ° C.) of 0.1 or less, and more preferably 0.01 or less. The volume ratio of the host compound in the light emitting layer is preferably 50% or more of various compounds contained in the light emitting layer.

  As the light-emitting material contained in the light-emitting layer, for example, a phosphorescent light-emitting material (phosphorescent compound or phosphorescent compound), a fluorescent light-emitting material, or the like can be used. Note that one light emitting layer may contain one kind of light emitting material, or may contain a plurality of kinds of light emitting materials having different light emission maximum wavelengths. By using a plurality of types of light emitting materials, a plurality of lights having different emission wavelengths can be mixed to emit light, whereby light of any emission color can be obtained. Specifically, for example, white light can be obtained by including a blue light emitting material, a green light emitting material, and a red light emitting material (three kinds of light emitting materials) in the light emitting layer.

<< Injection layer (hole injection layer, electron injection layer) >>
The injection layer is a layer for reducing the drive voltage and improving the light emission luminance. The injection layer is usually provided between the electrode and the light emitting layer. The injection layer is generally roughly divided into two. That is, the injection layer is roughly classified into a hole injection layer that injects holes (carriers) and an electron injection layer that injects electrons (carriers). The hole injection layer (anode buffer layer) is provided between the first electrode and the light emitting layer or the hole transport layer. The electron injection layer (cathode buffer layer) is provided between the second electrode and the light emitting layer or the electron transport layer.

《Blocking layer (hole blocking layer, electron blocking layer)》
The blocking layer is a layer for blocking the transport of carriers (holes, electrons). The blocking layer is generally roughly divided into two. That is, the blocking layer is broadly classified into a hole blocking layer that blocks hole (carrier) transport and an electron blocking layer that blocks electron (carrier) transport.

  The hole blocking layer is a layer having the function of an electron transport layer (electron transport function) described later in a broad sense. The hole blocking layer is formed of a material having an electron transport function and a small hole transport capability. By providing such a hole blocking layer, the injection balance between holes and electrons in the light emitting layer can be made suitable. Thereby, the recombination probability of electrons and holes can be improved.

  In addition, as a hole-blocking layer, the structure of the electron carrying layer mentioned later is applicable similarly as needed. Further, when a hole blocking layer is provided, the hole blocking layer is preferably provided adjacent to the light emitting layer.

  On the other hand, the electron blocking layer is a layer having a function of a hole transport layer (hole transport function) described later in a broad sense. The electron blocking layer is formed of a material having a hole transport function and a small electron transport capability. By providing such an electron blocking layer, the injection balance between holes and electrons in the light emitting layer can be made favorable. Thereby, the recombination probability of electrons and holes can be improved. In addition, as an electron blocking layer, the structure of the positive hole transport layer mentioned later is similarly applicable as needed.

  The thickness of the blocking layer is not particularly limited, but is preferably 3 nm or more, more preferably 5 nm or more, and preferably 100 nm or less, more preferably 30 nm or less.

<< transport layer (hole transport layer, electron transport layer) >>
The transport layer is a layer that transports carriers (holes and electrons). The transport layer is generally roughly divided into two. That is, the transport layer is roughly classified into a hole transport layer that transports holes (carriers) and an electron transport layer that transports electrons (carriers).

  The hole transport layer is a layer that transports (injects) holes supplied from the first electrode to the light emitting layer. The hole transport layer is provided between the first electrode or the hole injection layer and the light emitting layer. The hole transport layer also acts as a barrier that prevents the inflow of electrons from the second electrode side. Therefore, the term hole transport layer may be used in a broad sense to include a hole injection layer and / or an electron blocking layer. Note that only one hole transport layer may be provided or a plurality of layers may be provided.

  The electron transport layer is a layer that transports (injects) electrons supplied from the second electrode to the light emitting layer. The electron transport layer is provided between the second electrode or electron injection layer and the light emitting layer. The electron transport layer also acts as a barrier that prevents the inflow of holes from the first electrode side. Therefore, the term electron transport layer may be used in a broad sense to include an electron injection layer and / or a hole blocking layer. Note that only one electron transport layer or a plurality of electron transport layers may be provided.

  Electron transport material (hole blocking) used in the electron transport layer (when the electron transport layer has a single layer structure, the electron transport layer, and when multiple electron transport layers are provided, the electron transport layer located closest to the light emitting layer) There are no particular restrictions on the material that may also serve as a material. However, as the electronic material used for the electron transport layer, a material having a function of transmitting (transporting) electrons injected from the second electrode to the light emitting layer is usually applicable.

(Second electrode)
The second electrode (cathode) is an electrode film that supplies (injects) electrons to the light emitting layer. The material constituting the second electrode is not particularly limited, but is usually an electrode such as a material having a small work function (4 eV or less), for example, a metal (electron injecting metal), an alloy, an electrically conductive compound, and a mixture thereof. Formed of material.

  In the organic EL element, when light is extracted from the second electrode side, the second electrode can be formed of a light-transmitting electrode material, like the first electrode. In this case, for example, after forming a metal film made of an electrode material for forming a cathode so as to have a film thickness of 1 nm or more and 20 nm or less, a film made of a conductive transparent material described in the first electrode is formed on this metal film. Thus, a transparent or translucent second electrode can be formed.

DESCRIPTION OF SYMBOLS 1 Organic EL panel manufacturing apparatus 2 Decompression chamber 3 Rear chamber 4, 8 Roll 5, 9, 19, 21, 25, 28 Guide roll 6 Element substrate 7 First feeding portion 10 Sealing substrate 11 Second feeding portion 12, 23 , 26 Heater 13 Bonding roll 14 Bonding part 15, 16 Cooling roll 17 Non-fluidizing part 18 Multilayer substrate 20 Winding roll 21 Winding part 22 Third feeding part 24 Fluidizing part 27 Curing part

Claims (18)

A long element substrate having an organic electroluminescence element having an organic functional layer including a first electrode, a light emitting layer, and a second electrode formed on the surface, and a long seal having a sheet-like adhesive layer formed on the surface A method for manufacturing an organic electroluminescence panel, in which a stop substrate is bonded to a surface of the element substrate on which the organic electroluminescence element is formed and a surface on which the adhesive layer of the sealing substrate is formed to form a sealing structure In
Under a reduced pressure environment less than atmospheric pressure, the bonding layer is heated and fluidized, and a bonding step of bonding the element substrate and the sealing substrate to form a multilayer substrate;
A non-fluidization step in which the adhesive layer is cooled and non-fluidized under a reduced pressure environment below atmospheric pressure;
A fluidizing step of heating and fluidizing the adhesive layer under a pressure environment higher than the environmental pressure of the laminating step and the non-fluidizing step;
A manufacturing method of an organic electroluminescence panel, wherein sealing structures are formed in this order.   The method for manufacturing an organic electroluminescence panel according to claim 1, wherein the adhesive layer is made of a curable resin.   The method for producing an organic electroluminescence panel according to claim 2, further comprising a curing step of curing the adhesive layer after the fluidizing step.   The method for producing an organic electroluminescence panel according to claim 3, wherein the curing means of the adhesive layer in the curing step is heating or light irradiation.   The said hardening process is performed in the pressure environment higher than the environmental pressure of the said bonding process and the said non-fluidization process, The manufacturing method of the organic electroluminescent panel of Claim 3 or Claim 4 characterized by the above-mentioned.   The method for manufacturing an organic electroluminescence panel according to claim 1, wherein the adhesive layer is made of a thermoplastic resin.   The method of manufacturing an organic electroluminescence panel according to claim 6, further comprising a step of cooling and non-fluidizing the adhesive layer after the fluidizing step.   The fluidization of the adhesive layer in the bonding step is to set the viscosity of the resin constituting the adhesive layer to 10 Pa · s or more and less than 5000 Pa · s, and the fluidization of the adhesive layer in the fluidization step. Is that the viscosity of the resin constituting the adhesive layer is 10 Pa · s or more and less than 5000 Pa · s, and the non-fluidization of the adhesive layer in the non-fluidization step is the resin constituting the adhesive layer. The method for producing an organic electroluminescence panel according to claim 1, wherein the viscosity is 5000 Pa · s or more.   The bonding step and the non-fluidization step are performed in a vacuum chamber connected spatially continuously, and the bonded multilayer substrate after the non-fluidization step is rolled in the vacuum chamber. The method for producing an organic electroluminescence panel according to any one of claims 1 to 8, wherein the organic electroluminescence panel is wound into a shape.   The fluidizing step is performed after the roll of the laminated multilayer substrate wound in the decompression chamber is moved to a pressure environment higher than the environmental pressure of the pasting step and the non-fluidizing step. The manufacturing method of the organic electroluminescent panel of Claim 9 characterized by the above-mentioned.   The organic electroluminescent panel manufactured with the manufacturing method of any one of Claims 1-10. A decompression chamber that maintains a decompressed environment below atmospheric pressure;
A first substrate for feeding out an element substrate from a roll of a long element substrate having an organic electroluminescent element having an organic functional layer including a first electrode, a light emitting layer, and a second electrode in the decompression chamber. A feeding section;
A second feeding portion for feeding the sealing substrate from a long roll of the sealing substrate having a sheet-like adhesive layer formed on the surface thereof in the decompression chamber;
In the decompression chamber, a bonding part for bonding the element substrate and the sealing substrate;
A non-fluidized portion for cooling and defluidizing the adhesive layer in the vacuum chamber;
In addition to the decompression chamber, a fluidizing part that heats and fluidizes the adhesive layer under a pressure environment higher than the environmental pressure of the bonding part and the non-fluidized part is provided. Organic electroluminescence panel manufacturing equipment.   Furthermore, the manufacturing apparatus of the organic electroluminescent panel of Claim 12 provided with the hardening part which hardens the said contact bonding layer after the said fluidization part.   The organic electroluminescence panel manufacturing apparatus according to claim 13, wherein the means for curing the adhesive layer in the curing unit is heating or light irradiation.   In the said decompression chamber, the said 1st delivery part, the said 2nd delivery part, the said bonding part, and the said non-fluidization part are connected continuously spatially. The manufacturing apparatus of the organic electroluminescent panel of any one of these.   Furthermore, after the non-fluidization part in the decompression chamber, a winding part for winding the laminated multilayer substrate in a roll shape is provided, and the multilayer is provided outside the decompression chamber and before the fluidization part. The apparatus for manufacturing an organic electroluminescence panel according to any one of claims 12 to 15, further comprising a third feeding unit that feeds the multilayer substrate from a roll of the substrate.   The organic electroluminescence panel according to claim 16, further comprising a return pressure unit capable of returning the roll of the laminated multilayer substrate wound up in the reduced pressure chamber to atmospheric pressure. Manufacturing equipment.   The organic electroluminescent panel manufactured with the manufacturing apparatus of any one of Claims 12-17.

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