JPWO2014033961A1 - 部品実装装置 - Google Patents
部品実装装置 Download PDFInfo
- Publication number
- JPWO2014033961A1 JPWO2014033961A1 JP2014532721A JP2014532721A JPWO2014033961A1 JP WO2014033961 A1 JPWO2014033961 A1 JP WO2014033961A1 JP 2014532721 A JP2014532721 A JP 2014532721A JP 2014532721 A JP2014532721 A JP 2014532721A JP WO2014033961 A1 JPWO2014033961 A1 JP WO2014033961A1
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- Prior art keywords
- wafer
- center position
- nozzle
- component
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000000758 substrate Substances 0.000 claims abstract description 44
- 238000001179 sorption measurement Methods 0.000 claims description 9
- 238000003384 imaging method Methods 0.000 claims description 2
- 238000006073 displacement reaction Methods 0.000 claims 2
- 210000000078 claw Anatomy 0.000 description 15
- 238000000034 method Methods 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 230000002093 peripheral effect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000005070 sampling Methods 0.000 description 2
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7565—Means for transporting the components to be connected
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/759—Means for monitoring the connection process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
Claims (5)
- 複数のウエハカット部品にカットされたウエハをウエハ形状を保持した状態で供給するウエハ供給装置と、
前記ウエハ供給装置により供給された前記ウエハカット部品を吸着ノズルで吸着し、部品装着位置に搬送された基板上に装着する部品採取ヘッドと、
上端面を有するピン部材を昇降装置で昇降させて、前記ウエハカット部品を前記吸着ノズルが吸着するときに前記ピン部材の上端部で下方から突上げる部品突上げ装置と、
前記部品採取ヘッドと共に移動可能に取付けられ、前記部品装着位置に搬送された前記基板、前記ウエハ供給装置により供給された前記ウエハカット部品および前記ピン部材を上方から所定領域を撮像可能なカメラと、を備えた部品実装装置であって、
前記吸着ノズルで吸着可能で当該吸着ノズルの中心位置を測定するための治具と、
前記カメラで撮像した前記治具の画像に基づいて、前記吸着ノズルの中心位置と前記カメラの中心位置とのノズルずれ量を演算するノズルずれ量演算手段と、
前記カメラで撮像した前記ピン部材の画像に基づいて、前記ピン部材の中心位置と前記カメラの中心位置とのピンずれ量を演算するピンずれ量演算手段と、
前記カメラで撮像した前記ウエハカット部品の画像に基づいて、前記ウエハカット部品の保持位置のずれ量を求め、前記ノズルずれ量、前記ピンずれ量および前記ウエハカット部品の保持位置のずれ量に基づいて、前記吸着ノズルの中心位置および前記ピン部材の中心位置を前記ウエハカット部品の中心位置に位置決めする位置決め手段と、を備える部品実装装置。 - 前記部品実装装置は、前記ウエハ供給装置により供給された前記ウエハにおける所定の複数の位置において前記ピン部材の画像を前記カメラでそれぞれ取得するピン画像取得手段を備え、
前記ピンずれ量演算手段は、前記複数のピン部材の画像に基づいて、前記ピン部材の中心位置と前記カメラの中心位置とのピンずれ量をそれぞれ演算し、前記複数のピンずれ量に基づいて補間演算を行い、複数の前記ウエハカット部品に対する前記ピンずれ量をそれぞれ求める請求項1の部品実装装置。 - 前記治具の中心部には、前記吸着ノズルでの吸着時にノズル先端が倣ってノズル中心が治具中心と一致可能なように円錐台形状の凹部が形成されている請求項1又は2の部品実装装置。
- 前記部品実装装置は、前記吸着ノズルのノズル先端が前記治具の凹部の底部に達したときに吸着を開始する治具吸着手段を備える請求項3の部品実装装置。
- 前記吸着ノズルは、所定の円周上を等角度間隔で配置された複数本のノズル群で構成され、
前記ノズルずれ量演算手段は、前記複数本のノズル群の各中心位置に基づいて前記吸着ノズルの中心位置を求め、当該吸着ノズルの中心位置と前記カメラの中心位置とのノズルずれ量を演算する請求項1〜4の何れか一項の部品実装装置。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2012/072386 WO2014033961A1 (ja) | 2012-09-03 | 2012-09-03 | 部品実装装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2014033961A1 true JPWO2014033961A1 (ja) | 2016-08-08 |
JP6049734B2 JP6049734B2 (ja) | 2016-12-21 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014532721A Active JP6049734B2 (ja) | 2012-09-03 | 2012-09-03 | 部品実装装置 |
Country Status (2)
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JP (1) | JP6049734B2 (ja) |
WO (1) | WO2014033961A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109048925B (zh) * | 2018-10-23 | 2023-06-16 | 西安中科光电精密工程有限公司 | 一种柔性装配机器人及其磁力模板装配方法 |
CN114654113B (zh) * | 2022-05-23 | 2022-08-30 | 苏州译品芯半导体有限公司 | 一种基于芯片加工的晶圆激光切割装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004259726A (ja) * | 2003-02-24 | 2004-09-16 | Yamagata Casio Co Ltd | 電子部品搭載装置 |
JP2006339392A (ja) * | 2005-06-02 | 2006-12-14 | Juki Corp | 部品実装装置 |
JP2009044044A (ja) * | 2007-08-10 | 2009-02-26 | Juki Corp | 電子部品実装方法及び装置 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP4855347B2 (ja) * | 2007-06-28 | 2012-01-18 | ヤマハ発動機株式会社 | 部品移載装置 |
JP5596929B2 (ja) * | 2009-02-12 | 2014-09-24 | 富士機械製造株式会社 | 突き上げピンの位置決め方法およびその方法を用いた電子部品供給装置 |
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2012
- 2012-09-03 JP JP2014532721A patent/JP6049734B2/ja active Active
- 2012-09-03 WO PCT/JP2012/072386 patent/WO2014033961A1/ja active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004259726A (ja) * | 2003-02-24 | 2004-09-16 | Yamagata Casio Co Ltd | 電子部品搭載装置 |
JP2006339392A (ja) * | 2005-06-02 | 2006-12-14 | Juki Corp | 部品実装装置 |
JP2009044044A (ja) * | 2007-08-10 | 2009-02-26 | Juki Corp | 電子部品実装方法及び装置 |
Also Published As
Publication number | Publication date |
---|---|
WO2014033961A1 (ja) | 2014-03-06 |
JP6049734B2 (ja) | 2016-12-21 |
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